CN111148293B - Heating assembly, heat dissipation device and processing method thereof - Google Patents
Heating assembly, heat dissipation device and processing method thereof Download PDFInfo
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- CN111148293B CN111148293B CN202010005896.8A CN202010005896A CN111148293B CN 111148293 B CN111148293 B CN 111148293B CN 202010005896 A CN202010005896 A CN 202010005896A CN 111148293 B CN111148293 B CN 111148293B
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- thick film
- film heating
- heating element
- heat exchange
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/20—Heating elements having extended surface area substantially in a two-dimensional plane, e.g. plate-heater
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/10—Heater elements characterised by the composition or nature of the materials or by the arrangement of the conductor
Abstract
A heating component, a heat dissipation device and a processing method thereof relate to the technical field of electric heating. The heating component and the processing method thereof comprise a thick film heating element and a temperature control switch arranged on the surface of the thick film heating element; the temperature control switch is electrically connected with the thick film heating element and is used for monitoring the temperature of the thick film heating element so as to correspondingly disconnect the circuit of the thick film heating element when the temperature of the thick film heating element is higher than the preset temperature. The heat dissipation device and the processing method thereof comprise a plurality of heating components which are arranged at intervals in sequence and a plurality of heat exchange components which are arranged at intervals in sequence; and a heating component is connected between two adjacent heat exchange components. The invention aims to provide a heating assembly, a heat dissipation device and a processing method thereof, which solve the technical problems that the cost is higher due to the fact that more PTC heating elements are required to be added for ensuring the power at high temperature and the power regulation precision is poor due to the fact that a PTC material does not follow the ohm law in the prior art to a certain extent.
Description
Technical Field
The invention relates to the technical field of electric heating, in particular to a heating assembly, a heat dissipation device and a processing method thereof.
Background
The new energy automobile loses a heat source for warming the passenger compartment in winter due to the fact that an engine is omitted. In addition, in order to ensure that the battery works normally in a low-temperature environment, the environment in which the battery is located needs to be heated. Thus, the new energy automobile requires an additional heat source.
At present, an additional heat source of a new energy automobile which is more mainstream is an electric heater. Among them, the electric heater of PTC (Positive Temperature Coefficient) material is the most mainstream heating technology route at present. The PTC material is a material whose resistance increases with an increase in temperature, and thus, the PTC material can effectively prevent the heater from being dried, thereby preventing damage. However, since the power of the PTC heater is reduced as the temperature increases due to the PTC effect, more PTC heating elements are required to ensure the power at a high temperature, which additionally increases the cost.
In addition, the resistance of the PTC material does not follow ohm's law, so that the PTC heater is difficult to obtain higher power regulation precision and cannot well adapt to the higher and higher precision regulation requirements of the whole vehicle.
Disclosure of Invention
The invention aims to provide a heating assembly, a heat dissipation device and a processing method thereof, which solve the technical problems that the cost is higher due to the fact that more PTC heating elements are required to be added for ensuring the power at high temperature, and the power regulation precision is poor due to the fact that a PTC material does not follow ohm's law in the prior art to a certain extent.
In order to achieve the purpose, the invention provides the following technical scheme:
a heating assembly comprises a thick film heating element and a temperature control switch arranged on the surface of the thick film heating element;
temperature detect switch with thick film heating element electricity is connected, just temperature detect switch is used for the control thick film heating element's temperature, so that thick film heating element corresponds the disconnection when being higher than preset temperature thick film heating element's circuit.
In any of the above technical solutions, optionally, the number of the thick film heating elements is two, and the two thick film heating elements are arranged at intervals;
the temperature control switch is arranged between the two thick film heating elements;
the temperature control switch is used for monitoring the temperatures of the two thick film heating elements simultaneously so as to correspondingly disconnect the circuits of the two thick film heating elements when one of the thick film heating elements is higher than the preset temperature.
In any of the above technical solutions, optionally, a filler is filled between the two thick film heating elements, and the filler is made of an insulating material;
and/or, further comprising at least one pair of electrodes; each of the electrodes is connected to two of the thick film heating elements simultaneously.
In any of the above technical solutions, optionally, the filler is silica gel, epoxy glue or hard plastic;
the electrodes are zigzag conducting strips.
In any of the above technical solutions, optionally, the thick film heating element includes a heating substrate and thick film heating paste disposed on the heating substrate according to a certain shape;
the heating substrate is an alumina substrate, a stainless steel substrate or an aluminum substrate.
A heat dissipation device comprises a plurality of heating components arranged at intervals in sequence and a plurality of heat exchange components arranged at intervals in sequence;
and the heating component is connected between two adjacent heat exchange components.
In any of the above technical solutions, optionally, the heat exchange assembly has a heat exchange chamber; radiating fins are arranged in the heat exchange cavity; the heat exchange assembly comprises a liquid inlet pipe and a liquid outlet pipe; the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the plurality of heat exchange chambers in sequence;
and/or at least one pair of electrodes is connected with the thick film heating element of the heating component; the electrode and the heat exchange assembly have a gap.
A processing method of a heating assembly comprises the following steps:
printing thick-film heating paste with a certain shape on a heating substrate, and sintering and curing the thick-film heating paste on the heating substrate to form a thick-film heating element;
welding a temperature control switch and a pair of electrodes on the thick film heating element to enable the thick film heating element and the pair of electrodes to form a conductive path;
filling and packaging the two thick film heating elements with fillers to form a heating assembly; wherein, the filler adopts insulating material.
In any of the above technical solutions, optionally, the electrode is a zigzag conductive sheet; the two thick film heating elements are respectively welded with different positions of the zigzag conductive sheet;
and/or the filler is silica gel, epoxy glue or hard plastic.
A processing method of a heat dissipating double-fuselage, adopt the processing method of the heating element to process the heating element;
the processing method of the heat dissipation device comprises the following steps,
the two corresponding surfaces of the heating component are coated with glue by screen printing and are assembled between two adjacent heat exchange components;
clamping two adjacent heat exchange assemblies so that the heating assemblies are in full contact with the heat exchange assemblies;
and heating the heating component and the heat exchange component to solidify the glue to form the heat dissipation device.
The invention has the following beneficial effects:
according to the heating assembly, the heat dissipation device and the processing method thereof, the thick film heating element and the temperature control switch arranged on the surface of the thick film heating element are used, so that the temperature of the thick film heating element can be automatically controlled, the surface temperature of the thick film heating element is prevented from being rapidly increased due to dry burning, the safety performance of the heating assembly is improved, the probability of burning out of the heating assembly is also reduced, and the heating assembly can have the advantage that the PTC material can be effectively prevented from being dried; the heating component adopts the thick film heating element as the heater, and as the resistance of the thick film heating element follows ohm's law, the heating power of the thick film heating element is not reduced along with the rise of the temperature, so that more thick film heating elements are not required to be added in order to ensure the power at high temperature, and the cost is saved; because the resistance of the thick film heating element follows ohm's law, the high-precision control of the output power of the heating component can be realized by utilizing a Pulse Width Modulation (PWM) control technology.
In order to make the aforementioned and other objects, features and advantages of the present application more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.
Fig. 1 is a schematic structural diagram of a heat generating component according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a thick film heating element of a heating assembly according to an embodiment of the present invention;
fig. 3 is a front view of a heat dissipation device according to an embodiment of the present invention;
FIG. 4 is a top view of the heat dissipation device shown in FIG. 3;
FIG. 5 is a left side view of the heat sink shown in FIG. 3;
FIG. 6 is an enlarged view of a portion of the heat sink shown in FIG. 5;
fig. 7 is an exploded view of a heat dissipation device according to an embodiment of the present invention.
Icon: 100-a heat generating component; 110-thick film heating element; 111-a heat generating substrate; 112-thick film heat generating paste; 120-temperature controlled switch; 130-an electrode; 200-a heat exchange assembly; 210-heat dissipation fins; 220-liquid inlet pipe; 230-a liquid outlet pipe; 240 — first chip; 250-second chip.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. The components of embodiments of the present invention generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present invention, presented in the figures, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
Furthermore, the terms "horizontal", "vertical", "overhang" and the like do not imply that the components are required to be absolutely horizontal or overhang, but may be slightly inclined. For example, "horizontal" merely means that the direction is more horizontal than "vertical" and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The embodiments described below and the features of the embodiments can be combined with each other without conflict.
Examples
Referring to fig. 1 to 7, the present embodiment provides a heat generating assembly, a heat dissipating device and a method for manufacturing the same; fig. 1 and 2 are schematic views of a heat generating component, and fig. 3 to 7 are schematic views of a heat dissipating device. Fig. 1 is a schematic structural diagram of a heating element provided in this embodiment, and fig. 2 is a front view of a thick film heating element; fig. 3 is a front view of the heat dissipating device according to the present embodiment, fig. 4 is a top view of the heat dissipating device shown in fig. 3, fig. 5 is a left side view of the heat dissipating device shown in fig. 3, and fig. 6 is a partially enlarged view of two heat exchanging elements and two heat generating elements of the heat dissipating device shown in fig. 5; fig. 7 is an exploded view of the heat dissipation device according to the present embodiment.
The heating assembly provided by the embodiment is used for parts and products which need high-power precision control, and is particularly used for new energy automobiles.
Referring to fig. 1 and 2, the heating assembly includes a thick film heating element 110 and a temperature controlled switch 120 disposed on a surface of the thick film heating element 110. Alternatively, the temperature controlled switch 120 is fixedly disposed on the surface of the thick film heating element 110.
The temperature control switch 120 is electrically connected to the thick film heating element 110, and the temperature control switch 120 is used for monitoring the temperature of the thick film heating element 110, so as to correspondingly disconnect the circuit of the thick film heating element 110 when the temperature of the thick film heating element 110 is higher than a preset temperature.
Optionally, the thick film heating element 110 is connected to the circuit of the thick film heating element 110 when the temperature of the thick film heating element 110 is lower than the preset temperature. The thick film heating element 110 is prevented from being burnt dry by arranging the temperature control switch 120 on the surface of the thick film heating element 110. When the thick film heating element 110 is dry-fired, the surface temperature of the thick film heating element 110 rises rapidly, the temperature control switch 120 can be turned off rapidly, and the circuit of the thick film heating element 110 is turned off, so that the heating of the thick film heating element 110 is stopped. When the dry-burning fault is eliminated, the temperature control switch 120 can recover automatically, and the thick film heating element 110 is heated again. When the thick film heating element 110 is not provided with the integrated temperature control switch 120, when a dry-fire fault occurs, the operating temperature of the thick film heating element 110 may rapidly rise, for example, to 600 ℃ or even 800 ℃, which may easily damage the thick film heating element 110, even easily burn out a circuit, damage a heating component, and may cause an electrical safety accident.
In the heating assembly of this embodiment, the thick film heating element 110 can automatically control the temperature through the thick film heating element 110 and the temperature control switch 120 disposed on the surface of the thick film heating element 110, so as to prevent the surface temperature of the thick film heating element 110 from rapidly rising due to dry burning, improve the safety performance of the heating assembly, and also reduce the probability of burning out of the heating assembly, so that the heating assembly can have the advantage that the PTC material can effectively prevent dry burning; the heating component adopts the thick film heating element 110 as a heater, and as the resistance of the thick film heating element 110 follows ohm's law, the heating power of the thick film heating element does not decrease with the increase of the temperature, so that more thick film heating elements 110 do not need to be added in order to ensure the power at high temperature, thereby saving the cost; since the resistance of the thick film heating element 110 follows ohm's law, high precision control of the heating element output power can be achieved using Pulse Width Modulation (PWM) control techniques.
In the alternative of this embodiment, the number of the thick film heating elements 110 may be one or two; alternatively, referring to fig. 1 and 2, the number of the thick film heating elements 110 is two, and the two thick film heating elements 110 are disposed at intervals. By arranging two thick film heating elements 110, the heating value of the heating component is improved. Compared with the arrangement of one thick film heating element 110, the arrangement of two thick film heating elements 110 can adopt lower heat generation amount generated by temperature, and the heat generation amount generated by adopting higher temperature of one thick film heating element 110 is the same, so that the power of a single thick film heating element 110 generating unit heat generation amount is reduced, the temperature of the thick film heating element 110 generating unit heat generation amount is reduced, and the service life of the thick film heating element 110 is prolonged to a certain extent.
A temperature control switch 120 is arranged between the two thick film heating elements 110; optionally, the temperature controlled switches 120 are each fixedly connected to two thick film heating elements 110.
The temperature control switch 120 is used for monitoring the temperatures of the two thick film heating elements 110 at the same time, so that the circuits of the two thick film heating elements 110 are correspondingly disconnected when one of the thick film heating elements 110 is higher than a preset temperature. The temperature of the two thick film heating elements 110 is monitored by one temperature control switch 120 at the same time, so that the safety performance of the heating assembly is improved, and the dry burning phenomenon of any thick film heating element 110 can be effectively prevented.
In an alternative of this embodiment, a filler is filled between the two thick film heating elements 110, and the filler is made of an insulating material; the safety performance of the heating assembly is improved by filling the filler made of the insulating material between the two thick film heating elements 110.
Optionally, the filler is silicone, epoxy, or rigid plastic, or other material.
Referring to fig. 1 and 2, in an alternative to the present embodiment, the thick film heating element 110 includes at least one pair of electrodes 130, i.e., a positive electrode and a negative electrode. The electrodes 130 are connected by a power source to energize the thick film heating element 110.
Alternatively, each electrode 130 connects two thick film heating elements 110 simultaneously, so that two thick film heating elements 110 share one electrode 130, to make the heating assembly more compact.
Alternatively, the electrodes 130 take on an anisotropic shape; optionally, the electrode 130 is a dog-leg shaped conductive strip to facilitate simultaneous connection of the electrode 130 to two thick film heating elements 110.
Referring to fig. 2, in an alternative of the present embodiment, the thick film heating element 110 includes a heat generating substrate 111 and a thick film heat generating paste 112 disposed on the heat generating substrate 111 in a certain shape; the thick film heat generating paste 112 is disposed in a zigzag shape, a curved shape, or other shapes. Alternatively, the shape of the thick film heat generating paste 112 may be determined depending on the application environment of the thick film heat generating element 110, the heating temperature, and the like.
Alternatively, the thick film heat generating paste 112 is printed on the heat generating substrate 111.
Alternatively, the heat generating substrate 111 is an alumina substrate, a stainless steel substrate, or an aluminum substrate, or other substrates.
Referring to fig. 3 to 7 in conjunction with fig. 1 and fig. 2, the present embodiment further provides a heat dissipation apparatus including a plurality of heat generating assemblies 100 arranged in sequence at intervals and a plurality of heat exchanging assemblies 200 arranged in sequence at intervals;
the heating assembly 100 is connected between two adjacent heat exchange assemblies 200; that is, the heat exchange assemblies 200 and the heat generating assemblies 100 are alternately arranged in sequence. The heat dissipation device is characterized in that the thick film heating element 110 of the heating component 100 and the temperature control switch 120 arranged on the surface of the thick film heating element 110 are used for automatically controlling the temperature of the thick film heating element 110, so that the surface temperature of the heating component 100 caused by dry burning due to the fact that no cooling liquid exists in the heat exchange component 200 or the cooling liquid does not flow is prevented from being rapidly increased, the safety performance of the heating component 100 and the heat dissipation device is improved, the probability of burning out of the heating component 100 is also reduced, and the heating component 100 can have the advantage that the PTC material can be effectively prevented from being burned; since the resistance of the thick film heating element 110 follows ohm's law, the heating power of the thick film heating element does not decrease with the increase of the temperature, so that more heating components 100 do not need to be added to ensure the power at the high temperature, thereby saving the cost; since the resistance of the thick film heating element 110 follows ohm's law, high precision control of the output power of the heating assembly 100 can be achieved using Pulse Width Modulation (PWM) control techniques.
Referring to fig. 6, in an alternative of the present embodiment, the heat exchange assembly 200 has a heat exchange chamber; heat radiating fins 210 are arranged in the heat exchange cavity; through the heat dissipation fins 210, the heat exchange capability of the heat exchange assembly 200 can be improved to a certain extent, so that the heat dissipation of the heating assembly 100 is more uniform, that is, the heat dissipation capability of the thick film heating element 110 can be improved to a certain extent, so that the heat dissipation of the thick film heating element 110 is more uniform, and the influence on the service life of the thick film heating element 110 due to local overheating of the thick film heating element 110 is avoided. In addition, the heat dissipation fins 210 can increase the heat exchange area of the heat exchange assembly 200, and also can provide certain turbulence in the heat exchange cavity, so that the heat exchange capability of the heat exchange assembly 200 is stronger, the heat of the thick film heating element 110 can be taken away more quickly, and the working temperature on the surface of the thick film heating element 110 can be reduced better.
Optionally, heat exchange assembly 200 comprises liquid inlet tube 220 and liquid outlet tube 230; the liquid inlet pipe 220 and the liquid outlet pipe 230 are respectively communicated with the plurality of heat exchange chambers in sequence.
Optionally, the heat exchanging assembly 200 comprises a first chip 240 and a second chip 250, the first chip 240 and the second chip 250 forming a heat exchanging chamber.
Referring to fig. 1-4, in an alternative embodiment of the present embodiment, at least one pair of electrodes 130 is attached to the thick film heating element 110 of the heating assembly 100; the electrode 130 has a gap with the heat exchange assembly 200 to ensure a creepage distance and an electrical gap between the electrode 130 and the heat exchange assembly 200, so as to improve the safety performance of the heat dissipation device. Specifically, one side of the heating assembly 100, which is provided with the electrode 130, protrudes out of the heat exchange assembly 200, so that the creepage distance and the electrical gap between the electrode 130 and the heat exchange assembly 200 are ensured, and the safety performance of the heat dissipation device is further improved.
The heat dissipation device provided by the present embodiment includes the heat generating component 100, the technical features of the heat generating component 100 disclosed above are also applicable to the heat dissipation device, and the technical features of the heat generating component 100 disclosed above are not described repeatedly. The heat dissipation device in this embodiment has the advantages of the heat generating component 100, and the advantages of the heat generating component 100 disclosed above will not be described repeatedly.
The embodiment provides a processing method of a heating assembly, which comprises the following steps:
printing thick-film heating paste 112 with a certain shape on a heating substrate 111, and then sintering and curing the thick-film heating paste 112 on the heating substrate 111 to form a thick-film heating element 110;
welding a temperature control switch 120 and a pair of electrodes 130 on the thick film heating element 110 to enable the thick film heating element 110 and the pair of electrodes 130 to form a conductive path; the thick film heating element 110 is provided with a function of generating heat by energization.
Filling and packaging the two thick film heating elements 110 by using fillers to form an independent heating component 100; wherein, the filler adopts insulating material. The filler is, for example, silicone, epoxy, or rigid plastic, or other material.
Optionally, the electrode 130 is a zigzag-shaped conductive sheet; the two thick film heating elements 110 are respectively welded with different positions of the zigzag-shaped conducting strips; the pair of electrodes 130 is shared by the two thick film heating elements 110 to make the structure of the heating element assembly 100 more compact.
The method for processing the heat generating component provided in this embodiment is used to process the heat generating component 100, the technical features of the heat generating component 100 disclosed above are also applicable to the method for processing the heat generating component, and the technical features of the heat generating component 100 disclosed above are not described repeatedly. The method for manufacturing the heat generating component in this embodiment has the advantages of the heat generating component 100, and the advantages of the heat generating component 100 disclosed above will not be described repeatedly.
The present embodiment provides a method for processing a heat dissipation device, and the heating element 100 is processed by the above method for processing a heating element.
The processing method of the heat dissipation device comprises the following steps,
two corresponding surfaces of the heating assembly 100 are coated with glue by screen printing and are assembled between two adjacent heat exchange assemblies 200;
clamping two adjacent heat exchange assemblies 200 to ensure that the heating assembly 100 is fully contacted with the heat exchange assemblies 200;
the heating element 100 and the heat exchanging element 200 are heated to cure the glue, so as to form the heat dissipation device.
The method for processing a heat dissipation device provided in this embodiment is used to process the heat dissipation device, and the technical features of the disclosed heat dissipation device are also applicable to the heat dissipation device, and the technical features of the disclosed heat dissipation device are not described repeatedly. The heat dissipation device in the present embodiment has the advantages of the heat dissipation device, and the advantages of the heat dissipation device disclosed above are not described repeatedly herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (6)
1. A heating component is used for a heat dissipation device and is characterized by comprising a thick film heating element and a temperature control switch arranged on the surface of the thick film heating element;
the temperature control switch is electrically connected with the thick film heating element and is used for monitoring the temperature of the thick film heating element so as to correspondingly disconnect the circuit of the thick film heating element when the temperature of the thick film heating element is higher than a preset temperature;
the number of the thick film heating elements is two, and the two thick film heating elements are arranged at intervals;
the temperature control switch is arranged between the two thick film heating elements;
the temperature control switch is used for monitoring the temperatures of the two thick film heating elements simultaneously so as to correspondingly disconnect the circuits of the two thick film heating elements when one of the thick film heating elements is higher than a preset temperature;
a filler is filled between the two thick film heating elements, and the filler is made of an insulating material;
the heating assembly further comprises at least one pair of electrodes; each electrode is simultaneously connected with two thick film heating elements;
the electrode is a zigzag conductive sheet;
the filler is silica gel, epoxy glue or hard plastic;
the thick film heating element comprises a heating substrate and thick film heating slurry arranged on the heating substrate according to a certain shape.
2. The heat generating component of claim 1, wherein the heat generating substrate is an alumina substrate, a stainless steel substrate, or an aluminum substrate.
3. A heat dissipating device comprising a plurality of heat generating components as claimed in claim 1 or 2 arranged in sequence at intervals and a plurality of heat exchanging components arranged in sequence at intervals;
and the heating component is connected between two adjacent heat exchange components.
4. The heat dissipation device of claim 3, wherein the heat exchange assembly has a heat exchange chamber; radiating fins are arranged in the heat exchange cavity; the heat exchange assembly comprises a liquid inlet pipe and a liquid outlet pipe; the liquid inlet pipe and the liquid outlet pipe are respectively communicated with the plurality of heat exchange chambers in sequence;
and/or at least one pair of electrodes is connected with the thick film heating element of the heating component; the electrode and the heat exchange assembly have a gap.
5. The processing method of the heating assembly is characterized by comprising the following steps of:
printing thick-film heating paste with a certain shape on a heating substrate, and sintering and curing the thick-film heating paste on the heating substrate to form a thick-film heating element;
welding a temperature control switch and a pair of electrodes on the thick film heating element to enable the thick film heating element and the pair of electrodes to form a conductive path;
filling and packaging the two thick-film heating elements with fillers to form a heating assembly; wherein, the filler is made of an insulating material; the temperature control switch is arranged between the two thick film heating elements; the temperature control switch is used for monitoring the temperatures of the two thick film heating elements simultaneously so as to correspondingly disconnect the circuits of the two thick film heating elements when one of the thick film heating elements is higher than a preset temperature;
the electrode is a zigzag conducting strip; the two thick film heating elements are respectively welded with different positions of the zigzag conductive sheet;
the filler is silica gel, epoxy glue or hard plastic.
6. A method for manufacturing a heat dissipating device, characterized in that the heating element is manufactured by the method for manufacturing a heating element according to claim 5;
the processing method of the heat dissipation device comprises the following steps,
the two corresponding surfaces of the heating component are coated with glue by screen printing and are assembled between two adjacent heat exchange components;
clamping two adjacent heat exchange assemblies so that the heating assemblies are in full contact with the heat exchange assemblies;
and heating the heating component and the heat exchange component to solidify the glue to form the heat dissipation device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010005896.8A CN111148293B (en) | 2020-01-03 | 2020-01-03 | Heating assembly, heat dissipation device and processing method thereof |
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| CN202010005896.8A CN111148293B (en) | 2020-01-03 | 2020-01-03 | Heating assembly, heat dissipation device and processing method thereof |
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| CN111148293A CN111148293A (en) | 2020-05-12 |
| CN111148293B true CN111148293B (en) | 2022-08-02 |
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| CN103415092B (en) * | 2013-07-11 | 2015-09-16 | 九阳股份有限公司 | A kind of processing method of thick film heating device, thick-film heating container and equipment |
| KR101913121B1 (en) * | 2016-01-28 | 2018-10-31 | 자화전자(주) | Ptc heater and apparatus for heater using the same |
| CN206100487U (en) * | 2016-10-08 | 2017-04-12 | 广东恒美电热科技股份有限公司 | Thick film heating protection device |
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