CN111141164B

CN111141164B - Main board of intercooler, intercooler and manufacturing method of intercooler

Info

Publication number: CN111141164B
Application number: CN201911412865.8A
Authority: CN
Inventors: 李天�; 汤平强; 谢建; 刘伟锋; 谢先龙; 姚斌; 闵富海; 陈宇涛
Original assignee: Zhejiang Yinlun Machinery Co Ltd
Current assignee: Zhejiang Yinlun Machinery Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2024-06-25
Anticipated expiration: 2039-12-31
Also published as: CN111141164A; WO2021136017A1

Abstract

The present disclosure relates to the field of heat exchange devices, and in particular, to a motherboard of an intercooler, and a method for manufacturing an intercooler, where the motherboard is used for connecting a core and a chamber of the intercooler, and a through channel is formed on the motherboard, through which the core penetrates the motherboard to extend into the chamber. The invention aims to solve the problem that the heat exchange performance of an intercooler is difficult to ensure while the size of an external installation space is adapted to the existing intercooler, and provides a main board of the intercooler, the intercooler and a manufacturing method of the intercooler.

Description

Main board of intercooler, intercooler and manufacturing method of intercooler

Technical Field

The disclosure relates to the technical field of heat exchange equipment, in particular to a main board of an intercooler, the intercooler and a manufacturing method of the intercooler.

Background

At present, functions of mechanical equipment are more and more diversified, functional elements in the mechanical equipment are more and more, installation space available for corresponding parts is smaller and smaller, in order to adapt to the installation space, an intercooler adopted in the mechanical equipment is often required to be subjected to miniaturization design, at present, miniaturization of the intercooler generally means that a heat exchange core body is required to be reduced, heat exchange performance of the intercooler is further sacrificed, and therefore the intercooler is difficult to guarantee heat exchange performance while adapting to the size of an external installation space.

Disclosure of Invention

The invention aims to solve the problem that the heat exchange performance of an intercooler is difficult to ensure while the size of an external installation space is adapted to the existing intercooler, and provides a main board of the intercooler, the intercooler and a manufacturing method of the intercooler.

In order to achieve the above object, the present disclosure adopts the following technical solutions:

one aspect of the present disclosure provides a main board of an intercooler, the main board is used for connecting a core and a chamber of the intercooler, and a through channel for the core to penetrate through the main board to extend into the chamber is formed on the main board.

Optionally, the inner wall of the through channel is a plane for fitting with and sealing connection with the outer wall of the core.

The beneficial effect of this technical scheme lies in: the core body is generally of a cuboid or square structure, the through channel is correspondingly provided with four inner walls, and the four inner walls are attached to the core body; through making the inner wall of link up the passageway be the plane then can increase the area that the mainboard covered on the core, and then increase the joint strength between mainboard and the core and the bulk strength of core self, simultaneously, at the in-process that the core runs through the passageway, the inner wall of link up the passageway can also play the effect of leading to the relative motion of core and mainboard.

Another aspect of the present disclosure provides an intercooler including the motherboard provided by the present disclosure.

Optionally, the device comprises a core body and a chamber body which are connected through the main board, wherein the core body penetrates through the main board through the through channel and stretches into the chamber body.

The beneficial effect of this technical scheme lies in: the core body penetrates through the through channel and stretches into the chamber body, so that space in the chamber body can be fully utilized, and compared with an intercooler with the same volume and the core body and the chamber body in the prior art, the intercooler provided by the embodiment of the disclosure has the core body with larger volume and better heat exchange performance.

Optionally, the core body penetrates through the main board in a first direction, a connecting hole for connecting with an external pipeline is formed in the core body, and the connecting hole is far away from two side edges of the core body in the first direction.

The beneficial effect of this technical scheme lies in: that is, the position of the connecting hole in the first direction is located in the middle of the core or near the middle of the core, and because the connecting hole is to be connected with the pipes for conveying the medium, when the main board is installed on the core, the positions of the pipes limit the range of the installation positions of the main board on the core, and when the connecting hole is far away from the two side edges of the core in the first direction as far as possible, the installation positions of the main board can have a wider range of choice, so that the position relationship among the core, the main board and the chamber body can be flexibly selected according to the size of the external installation space of the intercooler.

Optionally, the core penetrates through the main board in a first direction, the core comprises a shell with a first shell and a second shell, a seam extending in the first direction is formed at the joint of the first shell and the second shell, a gas blocking part penetrating through the seam is formed on the first shell, a groove part for accommodating the gas blocking part is formed on the second shell, and the main board covers the gas blocking part.

The beneficial effect of this technical scheme lies in: when the shell is in a gas leakage problem at the joint, the gas blocking part can block the leaked gas flow in the first direction due to the fact that the gas blocking part penetrates through the joint, and when the leaked gas flow flows into a gap between the gas blocking part and the groove part, the main board covers the gap due to the fact that the main board covers the gas blocking part, so that the gas flow is difficult to leak from the gap.

Optionally, the core includes a seal located inside the housing, the seal covering the seam and the air barrier, and the seal being sealingly connected to the housing at the seam.

The beneficial effect of this technical scheme lies in: the sealing piece is used for enabling the air flow to be difficult to leak at the joint, particularly in the position where the air blocking part is matched with the groove part, the gap between the air blocking part and the groove part is sealed through the main plate and the sealing piece, the possibility that the air flow leaks in the direction perpendicular to the joint is reduced, and when the air flow flows along the joint, the air flow is blocked by the protruding part and the groove part, so that the possibility of air leakage is reduced.

Optionally, the core body has a chip located at the inner side of the housing, the sealing member is the chip, the chip has a flange, and the flange is in sealing connection with the housing at the joint.

The beneficial effect of this technical scheme lies in: in the core body, the chip is an indispensable component, and by using the chip as a sealing element, the cost caused by using other components as sealing elements can be avoided; specifically, the flange can be welded with the first shell, the second shell and the air blocking part to realize sealing.

Optionally, the core has a side plate located inside the housing, and the seal is the side plate.

The beneficial effect of this technical scheme lies in: when the above-mentioned chip is adopted as the sealing member, although the cost can be reduced, the flanging of chip needs to be guaranteed to have certain size in the third direction to guarantee that the flanging can cover seam and gas baffle portion, this increases the size of chip in the third direction, after a plurality of chips are piled up into the core body, also increased the size of core body in the third direction to a certain extent, and through making above-mentioned curb plate be the sealing member, then need not the flanging to cover seam and gas baffle portion, the size in the third direction of the flanging of reduction that can be appropriate, and then reduce the size of core body in the third direction, be favorable to the miniaturization of intercooler.

Optionally, the core includes a housing, and an outer wall of the housing is a plane.

The beneficial effect of this technical scheme lies in: can make the core be cuboid or square structure, the shell correspondingly has four outer walls, and the outer wall is the plane then can increase shell and mainboard area of contact, and then increases the joint strength between mainboard and the core, simultaneously, at the in-process that the core runs through the through-channel, the outer wall of shell can also play the effect of leading the relative motion of core and mainboard.

Yet another aspect of the present disclosure provides a method of manufacturing an intercooler including a core and a main plate on which a through passage is formed, the through passage penetrating the main plate, the method comprising:

The main board is sleeved on the core body through the through channel, and the core body penetrates through the main board through the through channel.

Optionally, the core has a housing including a first case and a second case, and a plurality of chip assemblies mounted inside the housing;

Before the main board is sleeved on the core body through the through channel, and the core body penetrates through the main board through the through channel, the method comprises the following steps:

Stacking each of the chip assemblies within the first housing;

the first shell and the second shell are butted to form the shell.

The beneficial effect of this technical scheme lies in: this enables the chip components and the housing to be first formed as a whole, and the assembly is facilitated by the whole being assembled with the motherboard.

Optionally, the first housing has a first edge, the second housing has a second edge, the first housing and the second housing are butted through the first edge and the second edge, a gas blocking part is formed on one of the first edge and the second edge, and a groove part is formed on the other;

The interfacing the first housing with the second housing to form the enclosure includes:

And positioning and matching the air blocking part and the groove part so that the first shell and the second shell are in butt joint to form the shell.

The beneficial effect of this technical scheme lies in: when the first shell is in butt joint with the second shell, the air blocking part and the groove part are matched and positioned, so that the assembly precision and the assembly efficiency of the intercooler are improved; moreover, because the first edge and the second edge form the seam after the butt joint between the first edge and the second edge, the gas blocking portion penetrates through the seam to be matched with the groove portion, when gas leakage occurs at the seam, the gas blocking portion and the groove portion can form blocking on the air flow in the extending direction of the seam, and further the degree of the gas leakage is relieved.

Optionally, the intercooler includes a seal located on an inner side of the outer shell, the first shell and the second shell, when docked, form a seam between the first edge and the second edge;

After said interfacing said first housing with said second housing to form said enclosure, further comprising:

the housing is sealingly connected to the seal at the seam.

The beneficial effect of this technical scheme lies in: this reduces the likelihood of air leakage at the seams after the intercooler is assembled.

Optionally, the sealing member is one of the chip assemblies.

The beneficial effect of this technical scheme lies in: this reduces the likelihood of air leakage at the seams after the intercooler is assembled, and because the chip assembly is an essential component in the core, the cost of sealing the seams is lower than sealing the seams by sealing the shell to the chip assembly at the seams, as opposed to sealing the seams exclusively with other components.

Optionally, the seal is a side plate;

before said stacking each of said chip assemblies within said first housing, further comprising:

mounting a side plate within the first housing;

And sealing and connecting the shell and the side plate at the joint.

The beneficial effect of this technical scheme lies in: when the chip assembly is used as the sealing joint, although the cost can be reduced, the flanging of the chip is required to be ensured to have a certain width so as to ensure that the flanging can cover the joint, the size of the chip is increased, the size of the core is also increased to a certain extent after a plurality of chips are stacked into the core, and the size of the flanging can be properly reduced by adopting the side plates to seal the joint, so that the size of the core is reduced, and the miniaturization of the intercooler is facilitated.

Optionally, after the main board is sleeved on the core body through the through channel, and the core body penetrates through the main board through the through channel, the method further includes:

and covering the main board on the air blocking part and the groove part.

The beneficial effect of this technical scheme lies in: when the mainboard covers the gas portion from the outside of shell, make first casing, second casing and gas portion and recess portion can be inseparable connect as a whole, make first casing and second casing be difficult to produce relative motion, and then make seam part be difficult for appearing leading to the gap that gas leaked, reduced intercooler gas leakage's possibility.

Optionally, the chip assembly includes a first chip and a second chip, the first chip has a first board and a first flange formed on the first board, and the second chip has a fourth board and a second flange formed on the fourth board;

The first plate surface and the fourth plate surface are oppositely arranged, and the first flanging is overlapped with the second flanging, so that the extending direction of the first flanging and the extending direction of the second flanging are the flowing direction of the cooled medium flowing through the first chip.

The beneficial effect of this technical scheme lies in: through first turn-ups and second turn-ups overlap joint, not only can realize being connected between first chip and the second chip, moreover, can also fix a position the relative position between first chip and the second chip at the in-process that first chip and second chip are connected, improve assembly precision and assembly efficiency.

Optionally, the first shell and the second shell form a seam after being butted;

And the shell is in sealing connection with the first flanging or the second flanging at the joint.

The beneficial effect of this technical scheme lies in: by sealing the seam with the first flange or the second flange, the chip assembly itself is utilized at a lower cost than sealing the seam with other components in addition.

Optionally, a protruding part is formed on the first board, an in-group positioning part is formed at the protruding part, the second chip is provided with a fourth board, and an in-group positioning protrusion is formed on the fourth board;

And arranging the first plate surface and the fourth plate surface oppositely, and matching the group positioning protrusions with the group positioning parts for positioning.

The beneficial effect of this technical scheme lies in: when the chip assembly is assembled, the positioning part in the group is matched with the positioning protrusion in the group for positioning, so that the assembly accuracy and the assembly efficiency are improved.

Optionally, before the first panel and the fourth panel are oppositely arranged to overlap the first flange and the second flange, the method further includes:

And forming a blocking part on the first flanging so that the blocking part extends to the middle part of the first plate surface in the direction perpendicular to the first flanging.

The beneficial effect of this technical scheme lies in: when the intercooler after assembly is used, as the two sides of the chip are mostly provided with the cooling medium inlet and outlet, the cooled medium and the cooling medium are mainly concentrated in the middle of the chip, but when the cooled medium flows through the core, part of the cooled medium flows through the position between the cooling medium inlet and outlet and the first flanging, so that the cooled medium cannot exchange heat, the heat exchange performance of the intercooler is reduced, the blocking part is formed on the first flanging, the formed blocking part can block the cooled medium to a certain extent, the amount of the cooled medium flowing into the position between the cooling medium inlet and outlet and the first flanging is reduced, and the heat exchange performance of the intercooler is further improved.

Optionally, the first chip has a third flange formed on the first board and extending perpendicular to the first flange, and the second chip has a fourth flange formed on the fourth board and extending perpendicular to the second flange;

And overlapping the third flanging with the fourth flanging.

The beneficial effect of this technical scheme lies in: through the lap joint between the third flanging and the fourth flanging, the connection between the first chip and the second chip is facilitated, the positioning effect on the first chip and the second chip can be achieved during assembly, and the assembly efficiency and the assembly precision are improved; and the third flange and the fourth flange can also form certain blocking for the cooled medium which flows into the first flange and the cooling medium inlet and outlet, so that the heat exchange performance of the intercooler is improved.

Optionally, the chip assembly includes a first chip and a second chip stacked, the first chip having a second plate surface disposed away from the second chip, the second chip having a third plate surface disposed away from the first chip, a first inter-group positioning portion being formed on the second plate surface, and a second inter-group positioning portion being formed on the third plate surface;

The stacking each of the chip assemblies within the first housing includes:

And matching and positioning two adjacent chip assemblies through the first group positioning parts on one chip assembly and the second group positioning parts on the other chip assembly so as to stack each chip assembly in the first shell.

The beneficial effect of this technical scheme lies in: the stacking between the chip components is positioned by matching the first group positioning parts and the second group positioning parts, so that the assembly efficiency and the assembly precision are improved.

Optionally, the first inter-group positioning portion is an inter-group positioning protrusion.

Optionally, the chip assembly includes a first chip and a second chip stacked, the first chip having a second plate surface disposed away from the second chip, the second chip having a third plate surface disposed away from the first chip, a first high-temperature coolant flow channel and a first low-temperature coolant flow channel recessed into the second plate surface being formed on the second plate surface, and a second high-temperature coolant flow channel and a second low-temperature coolant flow channel recessed into the third plate surface being formed on the third plate surface;

The stacking each of the chip assemblies within the first housing includes:

Overlapping the first high-temperature cooling liquid flow channel on one chip assembly with the second high-temperature cooling liquid flow channel on the other chip assembly between two adjacent chip assemblies, and overlapping the first low-temperature cooling liquid flow channel on one chip assembly with the second low-temperature cooling liquid flow channel on the other chip assembly.

The beneficial effect of this technical scheme lies in: this causes the first high temperature coolant flow passage and the second high temperature coolant flow passage to form a closed high temperature coolant flow passage, and the first low temperature coolant flow passage and the second low temperature coolant flow passage to form a closed low temperature coolant flow passage therebetween.

Optionally, the width dimensions of the first high-temperature cooling liquid flow channel, the first low-temperature cooling liquid flow channel, the second high-temperature cooling liquid flow channel and the second low-temperature cooling liquid flow channel are the same.

The beneficial effect of this technical scheme lies in: in the embodiment of the disclosure, the width dimensions of the first high-temperature cooling liquid flow channel, the first low-temperature cooling liquid flow channel, the second high-temperature cooling liquid flow channel and the second low-temperature cooling liquid flow channel are the same, and the heat load of the low-temperature radiator and the resistance to cooling liquid in the high-temperature cooling liquid flow channel are limited at a lower level while the dimensions of the high-temperature cooling liquid flow channel and the low-temperature cooling liquid flow channel meet certain heat exchange requirements.

Optionally, a first heat insulation hole is formed between the first high-temperature cooling liquid flow channel and the first low-temperature cooling liquid flow channel on the first chip, and a second heat insulation hole is formed between the second high-temperature cooling liquid flow channel and the second low-temperature cooling liquid flow channel on the second chip;

the stacking each of the chip assemblies within the first housing further includes:

Overlapping the first heat insulation hole on one of the chip assemblies with the second heat insulation hole on the other chip assembly between two adjacent chip assemblies.

The beneficial effect of this technical scheme lies in: the first heat insulation hole and the second heat insulation hole are uncovered, so that the problem that the heat insulation effect is reduced due to the fact that the heat insulation hole is used for connecting the high-temperature cooling liquid flow channel and the low-temperature cooling liquid flow channel on one chip component, and the heat insulation effect of the heat insulation hole on the low-temperature cooling liquid flow channel and the high-temperature cooling liquid flow channel is guaranteed to a certain extent.

Optionally, the core includes a first cover plate and a second cover plate;

mounting the first cover plate in the first housing;

After said stacking each of said chip assemblies within said first housing, further comprising:

after stacking each chip assembly on the first cover plate, stacking the second cover plate on the chip assembly so that each chip assembly is located between the first cover plate and the second cover plate.

The beneficial effect of this technical scheme lies in: this achieves that when each chip component is mounted between the first cover plate and the second cover plate and each chip component is mounted between the first cover plate and the second cover plate, the first heat insulating hole and the second heat insulating hole can be covered by the first cover plate and the second cover plate, and the possibility of leakage of air flow through the first heat insulating hole and the second heat insulating hole is reduced.

The technical scheme provided by the disclosure can achieve the following beneficial effects:

According to the main board of the intercooler, the intercooler and the manufacturing method of the intercooler, when the intercooler is assembled, as the main board is not provided with the fillets, the core body can penetrate through the main board and extend into the chamber body through the through channels on the main board, so that the space in the chamber body is effectively utilized, the installation position of the main board on the core body can be properly determined according to the size of the external installation space during assembly, and the size of the external installation space can be adapted to the size of the external installation space after the core body, the main board and the chamber body are assembled into the intercooler, and meanwhile, the volume of the core body does not need to be changed when the whole volume of the intercooler is reduced, so that the heat exchange performance is ensured; moreover, also because the core body can penetrate through the main board and extend into the chamber body, when the intercooler is assembled, the core body with larger length can be adopted, and the heat exchange performance of the intercooler is improved under the condition that the whole volume of the intercooler is unchanged.

Additional features of the present disclosure and advantages thereof will be set forth in the description which follows, or may be learned by the practice of the disclosure.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings that are required to be used in the description of the embodiments will be briefly described below. It will be apparent to those of ordinary skill in the art that the drawings in the following description are of some embodiments of the present disclosure and that other drawings may be derived from these drawings without undue effort.

FIG. 1 is a schematic partial perspective view of one implementation of an intercooler provided by an embodiment of the present disclosure;

fig. 2 is a schematic perspective view of an implementation of a motherboard according to an embodiment of the disclosure;

FIG. 3 is a schematic perspective view of one implementation of a housing provided by an embodiment of the present disclosure;

FIG. 4 is a schematic side view of one implementation of a housing provided by an embodiment of the present disclosure;

FIG. 5 is an enlarged partial schematic view of FIG. 4 at A;

FIG. 6 is a schematic view of an embodiment of a gas barrier portion and a groove portion according to an embodiment of the present disclosure;

FIG. 7 is a schematic view of another embodiment of a gas barrier portion mated with a groove portion provided in an embodiment of the present disclosure;

FIG. 8 is a partial schematic front view of an intercooler according to an embodiment of the present disclosure;

FIG. 9 is an enlarged partial schematic view at B in FIG. 8;

FIG. 10 is a schematic partial front view of another implementation of an intercooler provided by an embodiment of the disclosure;

FIG. 11 is an enlarged partial schematic view of FIG. 10 at C;

FIG. 12 is a partial perspective view of one embodiment of a core provided by an example of the present disclosure;

FIG. 13 is a schematic perspective view of a chip assembly according to an embodiment of the disclosure;

FIG. 14 is a schematic view of another angle of FIG. 13;

FIG. 15 is a schematic top view of FIG. 14;

FIG. 16 is a cross-sectional view taken at D-D of FIG. 15;

FIG. 17 is a schematic structural view of an implementation of a first chip of one of two adjacent chip assemblies mated with a second chip of the other chip assembly according to an embodiment of the present disclosure;

FIG. 18 is an enlarged partial cross-sectional view at E in FIG. 17;

FIG. 19 is a schematic diagram showing a perspective structure of a first chip according to an embodiment of the disclosure;

FIG. 20 is a schematic top view of a first chip according to an embodiment of the disclosure;

FIG. 21 is a schematic top view of another embodiment of a first chip provided in an example of the disclosure;

FIG. 22 is a schematic view of another angle of the perspective view of FIG. 19;

FIG. 23 is a schematic perspective view of a second chip according to an embodiment of the disclosure;

fig. 24 to 29 are schematic partial structures of six implementations of a chip assembly provided by an embodiment of the disclosure;

fig. 30 to 34 are schematic flow diagrams of an implementation of a method for manufacturing an intercooler according to an embodiment of the disclosure.

Reference numerals:

100-a main board;

110-a through channel;

111-inner wall;

200-core;

210-a housing;

211-a first housing;

212-a second housing;

213-seams;

214-a gas barrier;

214 a-edges;

214 b-an arcuate guide surface;

215-gap;

216-slit;

220-chip assembly;

221-a first chip;

221 a-a second panel;

221 b-inter-group positioning projections;

221 c-a first high temperature coolant flow passage;

221ca—a first end;

221 d-a first cryogenic coolant flow channel;

221 da-a second end;

221 e-a boss;

221 f-a barrier;

221 g-a first cuff;

221 h-a third flanging;

221i—a group positioning portion;

221 j-a first panel;

221 k-first heat insulating holes;

221 l-through hole;

222-a second chip;

222 a-fourth turn-ups;

222 b-a second flange;

222 c-a third panel;

222 d-second inter-group positioning portions;

222 e-a second high temperature coolant flow passage;

222 f-a second cryogenic coolant flow channel;

222 g-fourth panel;

222 h-positioning the protrusions in the group;

222 i-a support;

222 j-second heat insulating holes;

222 k-bump structure;

230-a first cover plate;

240-a gas flow channel;

250-connecting holes;

260-side plates;

300-a first water chamber;

400-a first liquid inlet connection pipe;

500-a second outlet connection pipe;

600-second liquid inlet pipe.

Detailed Description

The following description of the embodiments of the present disclosure will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all, of the embodiments of the present disclosure. Based on the embodiments in this disclosure, all other embodiments that a person of ordinary skill in the art would obtain without making any inventive effort are within the scope of protection of this disclosure.

In the description of the present disclosure, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present disclosure. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present disclosure, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the terms in this disclosure will be understood by those of ordinary skill in the art in the specific context.

As shown in fig. 1 to 29, the present disclosure provides an intercooler having a main plate 100, as shown in fig. 1 and 2, the main plate 100 being used to connect a core 200 and a chamber of the intercooler, and a through passage 110 being formed on the main plate 100 for the core 200 to penetrate the main plate 100 to extend into the chamber.

The main board 100 adopted by the intercooler at present is generally provided with fillets, the fillets are positioned between the chamber body and the core body 200 after the intercooler is assembled, the effect of inserting and fixing the cooling pipes or increasing the integral strength of the core body 200 after the main board 100 is installed is achieved, but the fillets also limit the relative positions among the main board 100, the chamber body and the core body 200 while playing the role, so that the intercooler is suitable for an external smaller installation space by improving the intercooler at present, the volume of the core body 200 is generally reduced to sacrifice heat exchange performance, when the heat exchange performance of the intercooler needs to be increased, the volume of the intercooler needs to be correspondingly increased while the volume of the core body 200 is increased, and the intercooler with the increased volume is difficult to install on an original installation position.

When the main board 100 of the intercooler provided by the embodiment of the disclosure is assembled, since the main board 100 does not have fillets, the core 200 can penetrate through the main board 100 through the through channel 110 on the main board 100 and extend into the chamber body, so that the space in the chamber body is effectively utilized, the installation position of the main board 100 on the core 200 can be properly determined according to the size of the external installation space during assembly, and the size of the external installation space can be adapted to the intercooler after the core 200, the main board 100 and the chamber body are assembled into the intercooler, and meanwhile, the volume of the core 200 does not need to be changed when the whole volume of the intercooler is reduced, so that the heat exchange performance is ensured; moreover, also because the core 200 can penetrate through the main board 100 and extend into the chamber, when the intercooler is assembled, the core 200 with a larger length can be adopted, so that the heat exchange performance of the intercooler is improved under the condition that the volume of the whole intercooler is unchanged. After the relative positions of the main board 100, the core 200 and the chamber are determined, the intercooler provided in the embodiment of the disclosure may be integrally connected by adopting a brazing process or the like.

Optionally, the inner wall 111 of the through-channel 110 is a flat surface for fitting and sealing connection with the outer wall of the core 200. The core 200 is generally in a cuboid or square structure, the through channel 110 is correspondingly provided with four inner walls 111, and the four inner walls 111 are attached to the core 200; the inner wall 111 of the through channel 110 is made to be a plane, so that the area covered by the main board 100 on the core 200 can be increased, the connection strength between the main board 100 and the core 200 and the overall strength of the core 200 can be further increased, and simultaneously, the inner wall 111 of the through channel 110 can also play a role in guiding the relative movement between the core 200 and the main board 100 in the process that the core 200 penetrates through the through channel 110.

According to the intercooler provided by the embodiment of the disclosure, when the main board 100 of the intercooler provided by the embodiment of the disclosure is adopted, the core 200 can penetrate through the main board 100 and extend into the chamber body during the assembly of the intercooler, so that the space of the chamber body is effectively utilized, the installation position of the main board 100 on the core 200 can be properly determined according to the size of the external installation space during the assembly, and further, after the core 200, the main board 100 and the chamber body are assembled into the intercooler, the intercooler can adapt to the size of the external installation space, and meanwhile, the volume of the core 200 is not required to be changed during the reduction of the whole volume of the intercooler, so that the heat exchange performance is ensured; moreover, also because the core 200 can penetrate through the main board 100 and extend into the chamber, when the intercooler is assembled, the core 200 with a larger length can be adopted, so that the heat exchange performance of the intercooler is improved under the condition that the volume of the whole intercooler is unchanged.

Optionally, the intercooler provided in the embodiment of the present disclosure includes a core 200 and a chamber body connected by the main board 100, where the core 200 penetrates the main board 100 through the through channel 110 and extends into the chamber body. The core 200 penetrates through the through channel 110 and extends into the chamber body, so that the space in the chamber body can be fully utilized, and compared with an intercooler with the same volume and the core 200 and the chamber body in the prior art, the intercooler provided by the embodiment of the disclosure has the core 200 with larger volume and better heat exchange performance. Of course, although the core 200 can penetrate the main board 100, when the intercooler is assembled, the position of the main board 100 sleeved on the core 200 may be appropriately selected according to the external installation space or other reasons, for example, the core 200 may be fixedly connected only with the main board 100, not penetrating the main board 100.

As shown in fig. 12, alternatively, the core 200 penetrates the main board 100 in a first direction, a connection hole 250 for connection with an external pipe is formed on the core 200, and the connection hole 250 is disposed away from both side edges of the core 200 in the first direction. That is, the connection hole 250 is located in the middle of the core 200 or near the middle of the core 200 in the first direction, and because the connection hole 250 is to be connected with pipes for conveying medium, when the main board 100 is installed on the core 200, the positions of the pipes limit the range of installation positions of the main board 100 on the core 200, and when the connection hole 250 is located as far from two side edges of the core 200 in the first direction as possible, the installation positions of the main board 100 can have a larger range of choice, and further, the positional relationship among the core 200, the main board 100 and the chamber can be selected more flexibly according to the size of the installation space outside the intercooler.

As shown in fig. 1 and 3 to 9, alternatively, the core 200 penetrates the main board 100 in a first direction, the core 200 includes a case 210 having a first case 211 and a second case 212, a seam 213 extending in the first direction is formed at a junction of the first case 211 and the second case 212, a gas barrier portion 214 penetrating the seam 213 is formed on the first case 211, a groove portion for accommodating the gas barrier portion 214 is formed on the second case 212, and the main board 100 covers the gas barrier portion 214. When the air leakage problem occurs in the case 210 at the joint 213, the air blocking portion 214 penetrates the joint 213, so that the air blocking portion 214 can block the leaked air flow in the first direction, and when the leaked air flow flows into the gap 215 between the air blocking portion 214 and the groove portion, the main board 100 covers the gap 215 because the main board 100 covers the air blocking portion 214, so that the air flow is difficult to leak from the gap 215.

Alternatively, the first housing 211, the seam 213, and the second housing 212 are sequentially arranged in the third direction; the air blocking portion 214 extends in the third direction, or the extending direction of the air blocking portion 214 is inclined with respect to the third direction. On the housing 210, a seam 213 formed by mutually abutting the first housing 211 and the second housing 212 is a seam 213 with a larger length on the housing 210, the risk of leakage of the seam 213 is relatively larger, and the air blocking part 214 is arranged at the seam 213 formed by mutually abutting the first housing 211 and the second housing 212, so that the air blocking effect can be better exerted, and the effect of relieving the air leakage is more obvious; optionally, the third direction is perpendicular to the first direction; of course, other possible structures for the seam 213 on the housing 210 are possible.

Optionally, there are at least two air blocking portions 214, and each air blocking portion 214 is distributed in the first direction. When gas leaks from the joint 213, the gas blocking portion 214 can effectively block the leaked gas flow in the first direction or in the direction perpendicular to the first direction, and at least two gas blocking portions 214 have better blocking effect on the gas flow. The number of the air blocking parts 214 can be 2 to 5, for example, 2 or 3; of course, the air blocking portion 214 may be one.

Alternatively, the air blocking portion 214 is integrally formed with the first housing 211. When the gas blocking portion 214 is integrally formed with the first housing 211, a connection trace can be formed at a position where the gas blocking portion 214 is connected with the first housing 211, so that the possibility that gas may leak from the connection trace is avoided; the integral molding makes the strength of the gas barrier 214 formed at the position of the first housing 211 larger, and reduces the risk that the gas barrier 214 may break at the forming position; in addition, the integral molding reduces the steps of installing the air blocking part 214, simplifies the production process and improves the production efficiency. The air blocking portion 214 may be a protrusion structure 222k formed on the first housing 211, and the protrusion structure 222k may be a sheet-like, plate-like or block-like structure. Of course, the gas barrier 214, the first housing 211 and the second housing 212 may be formed separately and then connected, for example, the separately produced gas barrier 214 may be welded to the corresponding first housing 211 and second housing 212 at the joint 213, or the gas barrier 214 may be fixed to the corresponding first housing 211 and second housing 212 at the joint 213 by screwing.

Alternatively, both side edges of the air blocking portion 214 in the first direction are attached to the inner wall 111 of the groove portion. This makes it difficult for air flow (particularly air flow flowing along the length direction of the joint 213) to leak from between the air blocking portion 214 and the groove portion after the first housing 211 and the second housing 212 are spliced, thereby reducing the risk of air leakage in the intercooler; naturally, the edges of the air blocking portion 214 on both sides in the first direction may not be bonded to the inner wall 111 of the groove portion, so that a gap 215 is left between the air blocking portion 214 and the inner wall 111 of the groove portion, and the gap 215 may be sealed by solder or other sealing structures.

Alternatively, both side edges of the air blocking portion 214 extend straight in the third direction. When the seam 213 between the first housing 211 and the second housing 212 has a gap 216 that may cause gas leakage, it is indicated that the first housing 211 and the second housing 212 have a relative movement in the third direction, and since the two side edges 214a of the gas barrier 214 are attached to the inner wall 111 of the groove portion in the first direction and the two side edges 214a of the gas barrier 214 linearly extend in the third direction, when the first housing 211 and the second housing 212 have a relative movement in the third direction, the two side edges 214a of the gas barrier 214 are always attached to the inner wall 111 of the groove portion in the first direction, which makes it difficult for gas flow (especially, gas flow flowing along the length direction of the seam 213) to leak from between the gas barrier 214 and the groove portion, thereby improving the barrier effect on the leaked gas. Of course, the air blocking portion 214 may be provided with opposite side edges 214a in the first direction.

Alternatively, an end surface of the air blocking portion 214, which is far from the first housing 211 in the third direction, is an arc-shaped guide surface 214b. When the air blocking portion 214 is inserted into the groove portion, the air blocking portion 214 can be guided by the arc-shaped guiding surface 214b, so as to improve the assembly efficiency, and in order to achieve the guiding effect of the arc-shaped guiding surface 214b, the arc-shaped guiding surface 214b protrudes in the third direction away from the first housing 211; of course, the curved guide surface 214b may be formed by a slope provided obliquely to the third direction.

Optionally, the core 200 includes a seal located inside the housing 210, the seal covering the seam 213 and the air barrier 214, and the seal being sealingly connected to the housing 210 at the seam 213. By means of the sealing member, the air flow is difficult to leak at the joint 213, particularly, in the position where the air blocking portion 214 is matched with the groove portion, and the gap 215 between the air blocking portion 214 and the groove portion is sealed by the main board 100 and the sealing member at the same time, so that the possibility of leakage of the air flow in the direction perpendicular to the joint 213 is reduced, and when the air flow flows along the joint 213, the air flow is blocked by the protruding portion and the groove portion, and the possibility of leakage of the air is further reduced.

Optionally, the core 200 has a chip located inside the housing 210, the seal is the chip, and the chip has a flange, and the flange is connected with the housing 210 in a sealing manner at the seam 213. In the core 200, the chip is an indispensable component, and by making the chip a sealing member, the cost caused by providing another component as the sealing member can be avoided; specifically, the flange may be welded with the first housing 211 and the second housing 212 and the air blocking portion 214 to realize sealing; the cuff may be a first cuff 221g or a second cuff 222b provided by the present disclosure.

Optionally, the core 200 has a side plate located inside the housing 210, and the seal is the side plate 260. When the above chips are used as the sealing member, although the cost can be reduced, it is necessary to ensure that the flange of the chip has a certain size in the third direction to ensure that the flange can cover the joint 213 and the air blocking portion 214, which increases the size of the chip in the third direction, and also increases the size of the core 200 in the third direction to a certain extent after a plurality of chips are stacked into the core 200, and by making the above-mentioned side plate 260 a sealing member, the flange does not need to cover the joint 213 and the air blocking portion 214, which can appropriately reduce the size of the flange in the third direction, thereby reducing the size of the core 200 in the third direction, which is advantageous for the miniaturization of the intercooler.

Optionally, the core 200 includes a housing 210, and an outer wall of the housing 210 is a plane. The core 200 may be in a cuboid or square structure, the housing 210 has four outer walls, and the outer walls are planes, so that the contact area between the housing 210 and the motherboard 100 can be increased, and the connection strength between the motherboard 100 and the core 200 can be increased, and meanwhile, in the process that the core 200 penetrates through the through channel 110, the outer walls of the housing 210 can also play a role in guiding the relative movement between the core 200 and the motherboard 100.

In the intercooler provided in the embodiment of the disclosure, the main board 100 is sleeved on the core 200 through the through channel 110, the chamber body is connected with the core 200 through the main board 100, in order to avoid leakage of air flow from the main board 100 to the core 200, the main board 100 needs to be sealed with the shell 210 of the core 200, when the air blocking part 214 is covered on the main board 100 from the outer side of the shell 210, the first shell 211, the second shell 212 and the air blocking part 214 can be tightly connected into a whole, so that relative movement of the first shell 211 and the second shell 212 is difficult to generate, and a gap 216 which causes air leakage is difficult to occur at the joint 213, thereby reducing the possibility of air leakage of the intercooler; when the core 200 provided in the embodiment of the disclosure adopts the sealing member, that is, the sealing member covers the air blocking portion 214 from the inner side of the casing 210, and the main board 100 covers the air blocking portion 214 from the outer side of the casing 210, if the first housing 211 and the second housing 212 generate relative movement and the seam 213 generates the gap 216, the air is blocked by the sealing member, the main board 100 and the air blocking portion 214 in the direction perpendicular to the seam 213, so that the air cannot flow in the direction, and the air flowing along the seam 213 is blocked by the air blocking portion 214, so that the air in the intercooler is blocked by the structure formed by the main board 100, the sealing member and the air blocking portion 214 when the seam 213 generates the gap 216, so that the air is difficult to leak from the intercooler; when the above-mentioned sealing member is used together and the groove portions are formed in the case 210, if the slit 216 is formed at the joint 213 and the gap 215 is formed between the gas blocking portion 214 and the groove portions, the flow velocity of the gas flow flowing in the slit 216 and the gap 215 gradually decreases due to the blocking of the gas blocking portion 214 and the groove portions, and eventually it is difficult to leak from the gap 215, particularly when at least two gas blocking portions 214 and groove portions are provided, each of the gaps 215 communicates through the slit 216, a fine passage is formed between the main plate 100 and the sealing member, in which the gas flow needs to flow a long distance to flow out of the intercooler, and the flow velocity gradually decreases due to the blocking of each of the gas blocking portion 214 and the groove portions during the flow of the gas flow, and eventually it is difficult to flow out of the intercooler, and if the both side edges 214a of the gas blocking portion 214 in the first direction are made to adhere to the inner wall 111 of the groove portions, the possibility that the gap 215 is formed between the gas blocking portion 214 and the groove portions is more difficult to leak from the joint 213, and the sealing effect of the gas leakage from the joint 213 is achieved.

As shown in fig. 17 to 19 and 22 to 29, in one embodiment of the present disclosure, the chip has a first flange 221g and a first plate surface 221j for contacting a cooled medium, the first flange 221g being formed on the first plate surface 221j and extending in a first direction;

A boss 221e and a cooling target medium flow path are formed on the first plate surface 221j, the boss 221e is located between the first flange 221g and the cooling target medium flow path in the second direction, and a blocking portion 221f for blocking the cooling target medium is formed between the first flange 221g and the boss 221 e;

The first direction is an extending direction of the cooled medium flow channel, and the second direction is parallel to the first plate surface 221j and perpendicular to the first direction.

The cooling medium and the cooled medium in the embodiments of the present disclosure may be liquid or gas; the protruding portion 221e may be used for fixedly connecting with the protruding portion 221e on an adjacent chip, or may be used for matching with an intra-group positioning portion on an adjacent chip; the chip may be formed with the protruding portions 221e at both ends in the second direction, and a cooled medium flow passage is formed between the two protruding portions 221e arranged in the second direction, and the cooled medium is typically a high-temperature gas, and therefore the cooled medium flow passage is typically the gas flow passage 240.

According to the chip provided by the embodiment of the disclosure, the blocking part 221f is formed between the first flanging 221g and the protruding part 221e, so that the cooled medium which deviates from the cooled medium flow channel and winds between the first flanging 221g and the protruding part 221e is blocked, the proportion of the cooled medium which deviates from the cooled medium flow channel and flows is reduced, the cooled medium and the cooled medium can exchange heat more fully, and the heat exchange performance of the intercooler is improved.

Alternatively, one end of the blocking portion 221f is connected to the first burring 221g and the other end is connected to the boss 221e in the second direction. This can block most of the medium to be cooled flowing between the first flange 221g and the boss 221e by the blocking portion 221f, further reducing the proportion of the medium to be cooled that deviates from the flow of the medium to be cooled.

Optionally, the blocking portion 221f is formed on the first flange 221g. This makes the blocking portion 221f and the first flange 221g an integral structure, avoids occurrence of a connection trace between the blocking portion 221f and the first flange 221g, and further avoids influence of the connection trace on connection strength, and reduces possibility of occurrence of breakage between the blocking portion 221f and the first flange 221g under impact of the cooled medium.

Alternatively, the blocking portion 221f may be a bar-like structure perpendicular to the first plate surface 221j, or the blocking portion 221f may be a bar-like structure disposed obliquely with respect to the first plate surface 221 j. During processing, the contour of the strip-shaped structure can be cut out on the first flanging 221g, and then the strip-shaped structure is bent between the first flanging 221g and the protruding portion 221e after stamping, so that the processing difficulty is relatively low.

Alternatively, the blocking portion 221f is a groove body, a notch of the groove body is formed on the first flange 221g, and a groove bottom of the groove body extends to the protruding portion 221e. The tank body can be formed by punching on the first flanging 221g, and the flow of the cooled medium is blocked by the outer wall of the tank body; the groove body can be in multipoint contact with the first flanging 221g at the notch, so that the connection strength between the blocking part 221f and the first flanging 221g is high, the groove body is not easy to deform under the impact of a cooled medium, the blocking capacity of the blocking part 221f on the cooled medium is improved, and the proportion of the cooled medium flowing away from a cooled medium runner is further reduced; and the groove body can be formed by stamping, and the manufacturing process is relatively simple.

Optionally, the groove body is a V-shaped groove body or a U-shaped groove body.

Alternatively, there are at least two blocking portions 221f, and each blocking portion 221f is distributed in the first direction. This can form a multistage barrier to the cooling medium flowing between the convex portion 221e and the first flange 221g, effectively reducing the proportion of the cooling medium flowing away from the cooling medium flow passage, and when a plurality of barrier portions 221f are arranged in the first direction, at least one barrier portion 221f can be made to correspond to each convex portion 221 e.

Optionally, the chip has a third flange 221h extending in the second direction, the third flange 221h is formed on the first plate surface 221j, and the third flange 221h is located between the first flange 221g and the cooled medium flow channel in the first direction. By the third flange 221h, before the cooled medium flows into the core 200, the cooled medium flowing between the protruding portion 221e and the first flange 221g is blocked, so that the proportion of the cooled medium flowing between the protruding portion 221e and the first flange 221g is reduced, and the proportion of the cooled medium flowing deviating from the flow path of the cooled medium is correspondingly reduced; the third flange 221h provided in the embodiment of the present disclosure may further overlap the third flange 221h of the first chip with the third flange 221h of the other chip when the core 200 is mounted, so as to position the assembly between the chips.

Alternatively, the projection of the third flange 221h in the first direction covers the boss 221e and the stopper 221f. This greatly increases the area of the third flange 221h, further increases the obstruction to the cooled medium flowing between the boss 221e and the first flange 221g, and reduces the proportion of the cooled medium flowing away from the cooled medium flow passage.

Optionally, the third flange 221h is in sealing connection with the first flange 221 g. This makes it difficult for the cooled medium to flow between the boss 221e and the first flange 221g from between the first flange 221g and the third flange 221h, thereby reducing the proportion of the cooled medium that deviates from the flow of the cooled medium flow passage.

Optionally, the intercooler has a chip assembly 220, the chip assembly 220 includes a first chip 221 and a second chip 222 stacked on each other, the first chip 221 is the above-mentioned chip, and the first chip 221 and the second chip 222 are overlapped by the first flange 221 g.

The chip assembly 220 provided by the embodiment of the present disclosure, with the chip provided by the embodiment of the present disclosure, forms a blocking portion 221f between the first flange 221g and the boss 221e, and blocks the cooled medium that deviates from the cooled medium flow path and winds between the first flange 221g and the boss 221e, thereby reducing the proportion of the cooled medium that deviates from the cooled medium flow path, enabling the cooled medium and the cooled medium to exchange heat more sufficiently, and improving the heat exchange performance of the intercooler.

As shown in fig. 25 and 28, alternatively, the second chip 222 has a second flange 222b overlapping the first flange 221g, the second flange 222b being located on a side of the first flange 221g facing the boss 221e in the second direction, and a through hole 221l through which the blocking portion 221f passes is formed in the second flange 222 b. This allows the boss 221e not only to function as a barrier to the cooled medium, but also to position the relative position between the first chip 221 and the second chip 222 when the chip assembly 220 is assembled, improving the accuracy of assembly and the assembly efficiency.

Optionally, the second chip 222 has a second flange 222b overlapping the first flange 221g, and the second flange 222b is located on a side of the first flange 221g facing away from the boss 221e in the second direction. This makes it possible for the boss 221e not only to function as a barrier to the cooled medium, but also to eliminate the need to form a through hole 221l in the second flange 222b through which the barrier 221f penetrates, simplifying the process steps of processing the through hole 221l, and improving the production efficiency.

Alternatively, the blocking portion 221f is a groove body, a notch of the groove body is formed in the first flange 221g, a groove bottom of the groove body extends to the protruding portion 221e, and a supporting portion 222i extending into the groove body is formed on the second flange 222 b. This makes the blocking portion 221f capable of being strongly supported by the supporting portion 222i when being impacted by the cooling medium, reduces the degree of deformation of the blocking portion 221f under impact, and further can better block the cooling medium flowing between the protruding portion 221e and the first flange 221g, and reduces the proportion of the cooling medium flowing away from the cooling medium flow passage.

Optionally, the first chip 221 has a third flange 221h extending in the second direction, the third flange 221h is formed on the first board 221j, and a fourth flange 222a overlapping the third flange 221h is formed on the second chip 222. The fourth flange 222a is connected with the third flange 221h, so that the bearing capacity of the third flange 221h under the impact of the cooling medium can be increased, and the deformation probability of the third flange 221h under the impact is reduced; moreover, by overlapping the fourth flange 222a and the third flange 221h, the relative positions of the first chip 221 and the second chip 222 can be positioned when the chip assembly 220 is assembled, and the assembly accuracy and efficiency can be improved.

Optionally, the first chip 221 has a second plate 221a disposed away from the second chip 222, and the first chip 221 has a first group of positioning portions formed on the second plate 221 a.

Alternatively, the first inter-group positioning portion is an inter-group positioning protrusion 221b protruding from the second plate surface 221 a. When the core 200 is assembled, the inter-group positioning protrusions 221b on the chip assembly 220 can be matched with the adjacent chip assembly 220 for positioning, so as to improve the assembly efficiency and assembly accuracy of the core 200.

Optionally, the second chip 222 has a third plate surface 222c disposed away from the first chip 221, and a second inter-group positioning portion 222d for mating with the inter-group positioning protrusion 221b of the adjacent chip assembly 220 is formed on the third plate surface 222 c. The second inter-group positioning portions 222d further improve the assembly efficiency and the assembly accuracy of the core 200. Of course, as shown in fig. 18, the second inter-group positioning portion 222d may also be a bump structure 222k, and the first inter-group positioning portion is a through hole structure, so that the bump structure 222k cooperates with the through hole structure to perform positioning between two adjacent chip assemblies 220.

Alternatively, the inter-group positioning projections 221b are formed on the projections 221e. This improves the utilization of the position occupied by the boss 221e, providing more space for other structures to be disposed on the first chip 221.

Alternatively, the inter-group positioning projections 221b have ports provided facing the second chip 222, the ports forming an intra-group positioning portion 221i, and on the second chip 222, group positioning projections 222h are formed to be mated with the intra-group positioning portion 221 i. By the engagement of the in-set positioning portion 221i with the in-set positioning protrusion 222h, the assembly efficiency of the chip assembly 220 can be improved. The inter-group positioning projections 221b can be made to be groove bodies with notches on the projections 221e, and the intra-group positioning portions 221i are formed at the notches, so that the inter-group positioning projections 221b can be processed while the intra-group positioning portions 221i are formed, and the production efficiency is improved.

In one embodiment of the present disclosure, the chip has first and second flow channels distributed in a first direction and extending in a second direction;

a heat insulating portion for thermally insulating the first flow passage and the second flow passage is formed between the first flow passage and the second flow passage in the first direction, the first direction being perpendicular to the second direction. The insulating portion is a first insulating hole 221k when the insulating portion is on the first chip, and a second insulating hole 222j when the insulating portion is on the second chip.

Specifically, the first flow channel and the second flow channel may extend linearly or may extend in a meandering manner; the chip provided by the embodiment of the disclosure is a plate, and the first direction and the second direction are two extending directions perpendicular to each other; when the chip is the first chip 221, the first flow channel may be a first high-temperature coolant flow channel 221c, the second flow channel may be a first low-temperature coolant flow channel 221d, and when the chip is the second chip 222, the first flow channel may be a second high-temperature coolant flow channel 222e, the second flow channel may be a second low-temperature coolant flow channel 222f, and it may be preferable that heat insulation portions are formed on both the first chip 221 and the second chip 222. The low temperature in the low temperature coolant flow passage is relative to the high temperature in the high temperature coolant flow passage, and likewise the high temperature in the high temperature coolant flow passage is relative to the low temperature in the low temperature coolant flow passage.

According to the chip provided by the disclosure, the heat insulation part is arranged between the first flow channel and the second flow channel, so that the first flow channel and the second flow channel can be effectively thermally isolated, the degree of heat exchange between cooling liquid in different flow channels is further reduced, and the problem that the cooling liquid in each cooling liquid flow channel in the multistage intercooler is easy to generate strong heat exchange is solved; in addition, the front-end heat dissipation module of the current engine generally comprises a low-temperature radiator, a high-temperature radiator and a condenser, and because the low-temperature radiator has a larger volume, the low-temperature radiator, the high-temperature radiator and the condenser have to be arranged in a lamination manner in the direction of the flow of ambient air to dissipate heat so as to adapt to the installation space, thereby increasing the wind resistance of the front-end module and affecting the heat exchange capacity of the front-end module; after the multistage intercooler adopts the chip that this disclosed embodiment provided, owing to reduced the heat transfer degree between the coolant liquid in the different runners, make low temperature radiator's heat load reduce, and then effectively reduced low temperature radiator's volume, make in the certain installation space low temperature radiator and condenser can set up side by side, again with high temperature radiator in the direction of ambient air flow the stromatolite setting, change original front end module three-layer arrangement structure into two-layer arrangement structure, effectively reduce the windage to the heat transfer ability of front end module has been improved. The multi-stage intercooler described in embodiments of the present disclosure includes a two-stage intercooler, a three-stage intercooler, or even more stages of intercoolers.

Optionally, the heat insulation part is a through hole. The first flow channel and the second flow channel are separated through the through holes, so that heat exchange between the first flow channel and the second flow channel through the material of the chip is reduced as much as possible, and the heat exchange degree is further reduced. Of course, besides the heat insulation part is made of a through hole, the heat insulation part can be made of a material with poor heat conduction performance, and particularly, compared with the material used for manufacturing the chip, the heat conduction performance is poorer, and the heat exchange degree between cooling liquid in different flow channels can be reduced.

Optionally, the heat insulation part is a strip-shaped hole extending in the second direction. This can reduce the size of the heat insulating portion in the first direction as much as possible, and on the premise that the heat insulating portion has a good heat insulating effect, the increase in the chip width due to the heat insulating portion is reduced, and thus the chip and the core 200 formed of the chip can be kept small in size. Of course, the insulating portion may be square, circular or other shapes.

Optionally, there are at least two heat insulation parts, and each heat insulation part is distributed in the second direction. Therefore, partial chip self materials can be reserved between two adjacent heat insulation parts, the chips can still keep good integrity and strength after the heat insulation parts are additionally arranged, and the problem that the chips are easy to break and the strength of the chips is reduced due to the fact that the heat insulation parts are additionally arranged is avoided as much as possible.

Optionally, a first liquid inlet and a first liquid outlet are formed at one end of the chip in the second direction, and the first flow channel is a U-shaped flow channel to communicate the first liquid inlet and the first liquid outlet. The first flow channel is made to be a U-shaped flow channel, so that the space on the chip can be fully utilized, the length of the first flow channel is increased, the flowing time of the cooling liquid is further increased, the cooling liquid can fully absorb heat, and the heat exchange efficiency is improved.

Optionally, a second liquid inlet and a second liquid outlet are formed at the other end of the chip in the second direction, and the second flow channel is a U-shaped flow channel to communicate the second liquid inlet and the second liquid outlet. On the basis of enabling the first flow channel to be a U-shaped flow channel, enabling the second flow channel to be a U-shaped flow channel, enabling the space on the chip to be more fully utilized, increasing the length of the second flow channel, further increasing the flowing time of cooling liquid in the second flow channel, enabling the cooling liquid to fully absorb heat, and further improving heat exchange efficiency.

Optionally, one end of the first flow channel away from the first liquid inlet in the second direction is a first end 221ca, and a position of the first end 221ca corresponds to a position of the second liquid inlet and/or the second liquid outlet. The length of the first flow channel is further prolonged, the flowing time of the cooling liquid in the first flow channel is prolonged, the cooling liquid absorbs more heat, and the heat exchange efficiency is further improved; and the first flow channel extends to a position corresponding to the second liquid inlet and/or the second liquid outlet in the second direction, so that the chip is covered by the flow channel as much as possible and exchanges heat with the cooling liquid, and the possibility of the problem of high material thermal stress of the chip due to high local temperature is reduced.

Optionally, the end of the second flow channel away from the second liquid inlet in the second direction is a second end 221da, and the position of the second end 221da corresponds to the position of the first liquid inlet and/or the first liquid outlet. The length of the second flow channel is prolonged, the flowing time of the cooling liquid in the second flow channel is prolonged, and the heat exchange efficiency is further improved; meanwhile, the chip can be covered by the flow channel as much as possible, and the possibility that the thermal stress of the material is large due to the fact that the local temperature of the chip is high is further reduced.

Optionally, at the connection of the first flow channel and the first liquid inlet, the dimension of the first flow channel in the first direction is equal to the dimension of the first liquid inlet in the first direction;

and/or at the connection part of the second flow channel and the second liquid inlet, the size of the second flow channel in the first direction is equal to the size of the second liquid inlet in the first direction.

If the dimension of the first flow channel in the first direction is smaller than the dimension of the first liquid inlet in the first direction at the joint of the first flow channel and the first liquid inlet, when the cooling liquid flows into the first flow channel from the first liquid inlet, uneven flow field distribution can occur, so that vortex is generated in the first flow channel, unstable pressure difference is generated inside and outside the vortex, pressure pulse is continuously generated when the vortex acts on a chip, and further the problem of chip erosion failure can be caused; and the size of the first flow channel in the first direction is equal to the size of the first liquid inlet in the first direction at the joint of the first flow channel and the first liquid inlet, so that the possibility of uneven flow field distribution when the cooling liquid flows into the first flow channel from the first liquid inlet can be reduced as much as possible, and the risk of chip erosion failure is further reduced. The size of the second flow channel in the first direction is equal to that of the second liquid inlet at the joint of the second flow channel and the second liquid inlet, so that the risk of chip erosion failure can be reduced. Of course, the dimension of the first flow channel in the first direction may be larger or smaller than the dimension of the first liquid inlet in the first direction at the connection between the first flow channel and the first liquid inlet, and/or the dimension of the second flow channel in the first direction may be larger or smaller than the dimension of the second liquid inlet in the first direction at the connection between the second flow channel and the second liquid inlet.

Optionally, the first flow channel has the same size as the second flow channel in the first direction. In the multistage intercooler, the low-temperature radiator is sensitive to heat load, the width of the low-temperature cooling liquid flow channel is increased, the low-temperature radiator is required to be larger in heat load, if the volume of the low-temperature radiator exceeds a certain limit, front-end module arrangement is difficult, meanwhile, the high-temperature radiator is sensitive to resistance of cooling liquid, the width of the high-temperature cooling liquid flow channel is required to be increased as much as possible to reduce the resistance of the high-temperature cooling liquid flow channel to the cooling liquid, but in theory, the high-temperature cooling liquid flow channel cannot be widened to any extent, in the embodiment of the present disclosure, the size of the first flow channel is the same as the size of the second flow channel in the first direction, and the heat load of the low-temperature radiator and the resistance of the high-temperature cooling liquid flow channel to the cooling liquid are limited to a lower level while the sizes of the first flow channel and the second flow channel meet certain heat exchange requirements. One of the first runner and the second runner is a high-temperature cooling liquid runner, and the other runner is a low-temperature cooling liquid runner.

Alternatively, the core 200 includes a chip unit including at least two chip assemblies 220 stacked in a third direction in which one end of the chip unit is mounted with the first cover 230 and the other end is mounted with the second cover to cover and seal the heat insulation part, the first cover 230 and the second cover. In the core 200, a gas flow channel 240 is formed between two adjacent chip assemblies 220, that is, a gas flow channel 240 and a cooling liquid flow channel are formed on two sides of the same chip in the third direction, so that heat exchange between gas and cooling liquid in the core 200 is realized. The sealing element may preferably be a plate, but may also be a strip or a block.

The present disclosure provides a manufacturing method of an intercooler including a core 200 and a main plate 100, on which a through passage 110 is formed on the main plate 100, the through passage 110 penetrating the main plate 100, as shown in fig. 30 to 34, the method including:

The main board 100 is sleeved on the core 200 through the through channel 110, and the core 200 penetrates through the main board 100 through the through channel 110.

According to the manufacturing method of the intercooler provided by the disclosure, when the intercooler is manufactured, the core 200 penetrates through the main board 100 through the penetrating channel, so that the core 200 can penetrate through the main board 100 and extend into the chamber body, the space of the chamber body is effectively utilized, the installation position of the main board 100 on the core 200 can be properly determined according to the size of the external installation space during assembly, and then after the core 200, the main board 100 and the chamber body are assembled into the intercooler, the intercooler can adapt to the size of the external installation space, and meanwhile, the volume of the core 200 is not required to be changed while the whole volume of the intercooler is reduced, so that the heat exchange performance is ensured; moreover, also because the core 200 penetrates the main board 100 and extends into the chamber body, when the intercooler is assembled, the core 200 with a larger length can be adopted by utilizing the space in the chamber body, and the heat exchange performance of the intercooler is improved under the condition that the whole volume of the intercooler is unchanged.

Alternatively, the core 200 has a housing 210 and a plurality of chip assemblies 220 mounted inside the housing 210, the housing 210 including a first housing 211 and a second housing 212;

Before the main board 100 is sleeved on the core 200 through the through channel 110, and the core 200 penetrates through the main board 100 through the through channel 110, the method comprises the following steps:

Stacking each of the chip assemblies 220 within the first housing 211;

the first housing 211 is mated with the second housing 212 to form the enclosure 210.

This enables each of the chip assemblies 220 and the housing 210 to be first formed as a single unit, and to be assembled with the motherboard 100 through the single unit, thereby facilitating assembly. Wherein the plurality of chip assemblies 220 may be at least two chip assemblies 220, such as two chip assemblies 220, three chip assemblies 220, four chip assemblies 220, and so on. The first housing 211 and the second housing 212 provided in the embodiments of the present disclosure are U-shaped housings, and the first housing 211 and the second housing 212 form a housing 210 with a rectangular cylinder or square cylinder structure after being abutted.

Alternatively, the first housing 211 has a first edge, the second housing 212 has a second edge, the first housing 211 and the second housing 212 are abutted by the first edge and the second edge, a gas blocking portion 214 is formed on one of the first edge and the second edge, and a groove portion is formed on the other;

The interfacing the first housing 211 with the second housing 212 forms the housing 210, comprising:

the air blocking portion 214 is matched with the groove portion in a positioning manner, so that the first shell 211 is abutted with the second shell 212 to form the shell 210.

When the first shell 211 is in butt joint with the second shell 212, the air blocking part 214 is matched with the groove part for positioning, so that the assembly precision and the assembly efficiency of the intercooler are improved; moreover, since the seam 213 is formed between the first edge and the second edge after the first edge is abutted with the second edge, the gas blocking portion 214 penetrates through the seam 213 to be matched with the groove portion, when gas leakage occurs at the seam 213, the gas blocking portion 214 and the groove portion can block the gas flow in the extending direction of the seam 213, and further the degree of the gas leakage is relieved.

Optionally, the intercooler includes a seal located on the inside of the outer shell 210, the first housing 211 and the second housing 212, when docked, form a seam 213 between the first edge and the second edge;

After the first housing 211 and the second housing 212 are abutted to form the housing 210, the method further includes:

the housing 210 is sealingly connected to the seal at the seam 213.

This reduces the likelihood of air leakage at the seam 213 after the intercooler is assembled.

Optionally, the sealing element is one of each of the chip assemblies 220.

This reduces the likelihood of air leakage at seam 213 after intercooler assembly, and, because chip assembly 220 is an essential component in core 200, it is less costly to seal seam 213 in a manner that seals housing 210 to chip assembly 220 at seam 213 than if other components were specifically provided to seal seam 213.

Optionally, the seal is a side plate 260;

Before the stacking of each of the chip assemblies 220 in the first housing 211, it further includes:

Mounting a side plate 260 within the first housing 211;

The housing 210 is sealingly connected to the side panel 260 at the seam 213.

When the chip assembly 220 is used as the sealing joint 213, although the cost can be reduced, it is necessary to ensure that the flange of the chip has a certain width so as to ensure that the flange can cover the joint 213, which increases the size of the chip, and when a plurality of chips are stacked into the core 200, the size of the core 200 is also increased to some extent, and by using the side plates 260, the sealing joint 213, the size of the flange can be properly reduced, thereby reducing the size of the core 200, which is advantageous for miniaturization of the intercooler.

Optionally, after the main board 100 is sleeved on the core 200 through the through channel 110, and the core 200 penetrates through the main board 100 through the through channel 110, the method further includes:

the main board 100 is covered on the air blocking portion 214 and the groove portion.

When the main board 100 covers the air blocking portion 214 from the outside of the casing 210, the first housing 211, the second housing 212, the air blocking portion 214 and the groove portion can be tightly connected into a whole, so that the first housing 211 and the second housing 212 are difficult to generate relative movement, and further, a gap 216 which causes air leakage is difficult to occur at the joint 213, thereby reducing the possibility of air leakage of the intercooler; when the core 200 provided in the embodiment of the disclosure seals the seam 213 with the chip assembly 220 or the side plate 260, that is, the sealing member covers the air blocking portion 214 from the inner side of the housing 210, and the main board 100 covers the air blocking portion 214 from the outer side of the housing 210, if the first housing 211 and the second housing 212 move relatively and a gap 216 is generated at the seam 213, in the direction perpendicular to the seam 213, the air is blocked by the sealing member, the main board 100 and the air blocking portion 214, so that the air cannot flow in the direction, and the air flowing along the seam 213 is blocked by the air blocking portion 214 and the groove portion, so that the air in the intercooler is blocked when the gap 216 appears at the seam 213, so that the air is difficult to leak from the intercooler; when the sealing member is used together and the groove portion is formed in the case 210, if the slit 216 is formed at the joint 213 and the gap 215 is formed between the air blocking portion 214 and the groove portion, the flow velocity of the air flow flowing in the slit 216 and the gap 215 is gradually reduced due to the blocking of the air blocking portion 214 and the groove portion, and is eventually difficult to leak from the gap 215, particularly when at least two air blocking portions 214 and groove portions are provided, the respective gaps 215 communicate through the slit 216, a fine passage is formed between the main plate 100 and the sealing member, in which the air flow needs to flow a long distance to flow out of the intercooler, and the flow velocity is gradually reduced due to the blocking of the respective air blocking portion 214 and groove portion during the flow of the air flow, and is finally difficult to flow out of the intercooler.

Optionally, the chip assembly 220 includes a first chip 221 and a second chip 222, where the first chip 221 has a first plate 221j and a first flange 221g formed on the first plate 221j, and the second chip 222 has a fourth plate 222g and a second flange 222b formed on the fourth plate 222 g;

The first plate surface 221j and the fourth plate surface 222g are disposed opposite to each other, and the first flange 221g is overlapped with the second flange 222b such that the extending direction of the first flange 221g and the extending direction of the second flange 222b are the flow directions of the medium to be cooled flowing through the first chip 221.

Through the overlap joint of the first flanging 221g and the second flanging 222b, not only can the connection between the first chip 221 and the second chip 222 be realized, but also the relative position between the first chip 221 and the second chip 222 can be positioned in the process of connecting the first chip 221 and the second chip 222, and the assembly precision and the assembly efficiency are improved.

Optionally, the first housing 211 and the second housing 212 form a seam 213 after being butted;

the housing 210 is sealingly connected to the first flange 221g or the second flange 222b at the seam 213.

By sealing the seam 213 with either the first flange 221g or the second flange 222b, the chip assembly 220 itself is less expensive to construct than if the seam 213 were otherwise sealed with other components.

Alternatively, a boss 221e is formed on the first plate surface 221j, an intra-group positioning portion 221i is formed at the boss 221e, the second chip 222 has a fourth plate surface 222g, and a group positioning boss 222h is formed on the fourth plate surface 222 g;

The first plate surface 221j and the fourth plate surface 222g are disposed opposite to each other, and the positioning protrusion 222h in the group is positioned in cooperation with the positioning portion 221i in the group.

When the chip assembly 220 is assembled, the in-group positioning portion 221i is matched with the in-group positioning protrusion 222h for positioning, so that the assembly accuracy and the assembly efficiency are improved.

Optionally, before the first plate surface 221j and the fourth plate surface 222g are disposed opposite to each other, the first flange 221g overlaps the second flange 222b, the method further includes:

A blocking portion 221f is formed on the first flange 221g such that the blocking portion 221f protrudes toward the middle of the first plate surface 221j in a direction perpendicular to the first flange 221 g.

When the intercooler after assembly is used, as the two sides of the chip are mostly provided with the cooling medium inlet and outlet, the cooled medium and the cooling medium are mainly concentrated in the middle of the chip, but when the cooled medium flows through the core 200, part of the cooled medium flows through the position between the cooling medium inlet and outlet and the first flanging 221g, so that the part of the cooled medium cannot exchange heat, the heat exchange performance of the intercooler is reduced, the blocking part 221f is formed on the first flanging 221g, the formed blocking part 221f can block the cooled medium to a certain extent, the amount of the cooled medium flowing into the position between the cooling medium inlet and outlet and the first flanging 221g is reduced, and the heat exchange performance of the intercooler is further improved.

Optionally, the first chip 221 has a third flange 221h formed on the first board 221j and extending perpendicular to the first flange 221g, and the second chip 222 has a fourth flange 222a formed on the fourth board 222g and extending perpendicular to the second flange 222 b;

the third flange 221h is overlapped with the fourth flange 222 a.

Through the lap joint between the third flanging 221h and the fourth flanging 222a, the connection between the first chip 221 and the second chip 222 is facilitated, the positioning effect of the first chip 221 and the second chip 222 can be achieved during assembly, and the assembly efficiency and the assembly precision are improved; and the third flange 221h and the fourth flange 222a can also form a certain barrier for the cooled medium to flow into the first flange 221g and the cooling medium inlet and outlet, so as to further improve the heat exchange performance of the intercooler.

Optionally, the chip assembly 220 includes a first chip 221 and a second chip 222 stacked, where the first chip 221 has a second plate surface 221a disposed away from the second chip 222, the second chip 222 has a third plate surface 222c disposed away from the first chip 221, a first group of positioning portions are formed on the second plate surface 221a, and a second group of positioning portions 222d are formed on the third plate surface 222 c;

The stacking each of the chip assemblies 220 in the first housing 211 includes:

The two adjacent chip assemblies 220 are positioned by matching the first inter-group positioning portion on one chip assembly 220 with the second inter-group positioning portion 222d on the other chip assembly 220, so as to stack each chip assembly 220 in the first housing 211.

By mating the first inter-group locating portions with the second inter-group locating portions 222d to locate the stack between the chip assemblies 220, assembly efficiency and accuracy are improved.

Alternatively, the first inter-group positioning portion is an inter-group positioning protrusion 221b. Of course, as shown in fig. 23, the second inter-group positioning portion 222d may also be a bump structure 222k, and the first inter-group positioning portion is a through hole structure, so that the bump structure 222k cooperates with the through hole structure to perform positioning between two adjacent chip assemblies 220.

Optionally, the chip assembly 220 includes a first chip 221 and a second chip 222 stacked, the first chip 221 having a second plate surface 221a disposed away from the second chip 222, the second chip 222 having a third plate surface 222c disposed away from the first chip 221, a first high-temperature coolant flow channel 221c and a first low-temperature coolant flow channel 221d recessed into the second plate surface 221a being formed on the second plate surface 221a, and a second high-temperature coolant flow channel 222e and a second low-temperature coolant flow channel 222f recessed into the third plate surface 222c being formed on the third plate surface 222 c;

The stacking each of the chip assemblies 220 in the first housing 211 includes:

The first high-temperature coolant flow channel 221c on one of the chip assemblies 220 overlaps the second high-temperature coolant flow channel 222e on the other of the chip assemblies 220 between the adjacent two chip assemblies 220, and the first low-temperature coolant flow channel 221d on one of the chip assemblies 220 overlaps the second low-temperature coolant flow channel 222f on the other of the chip assemblies 220.

This causes the first high-temperature coolant flow passage 221c and the second high-temperature coolant flow passage 222e to form a closed high-temperature coolant flow passage, and the first low-temperature coolant flow passage 221d and the second low-temperature coolant flow passage 222f to form a closed low-temperature coolant flow passage therebetween. The low temperature in the low temperature coolant flow passage is relative to the high temperature in the high temperature coolant flow passage, and likewise the high temperature in the high temperature coolant flow passage is relative to the low temperature in the low temperature coolant flow passage.

Alternatively, the first high-temperature coolant flow passage 221c, the first low-temperature coolant flow passage 221d, the second high-temperature coolant flow passage 222e, and the second low-temperature coolant flow passage 222f have the same width dimension.

In the multi-stage intercooler, the low-temperature radiator is sensitive to the heat load, the width of the low-temperature cooling liquid flow passage is increased, so that the low-temperature radiator with larger volume is needed, if the volume of the low-temperature radiator exceeds a certain limit, the front-end module is difficult to arrange, meanwhile, the high-temperature radiator is sensitive to the resistance of the cooling liquid, the width of the high-temperature cooling liquid flow passage is required to be increased as much as possible to reduce the resistance to the cooling liquid in the high-temperature cooling liquid flow passage, but theoretically, the width of the high-temperature cooling liquid flow passage cannot be widened in a limited way, in the embodiment of the disclosure, the width of the first high-temperature cooling liquid flow passage 221c, the width of the first low-temperature cooling liquid flow passage 221d, the width of the second high-temperature cooling liquid flow passage 222e and the width of the second low-temperature cooling liquid flow passage 222f are the same, and the heat load of the low-temperature cooling liquid flow passage and the resistance to the cooling liquid in the high-temperature cooling liquid flow passage are limited to a lower level while the sizes of the high-temperature cooling liquid flow passage meet certain heat exchange requirements.

Alternatively, a first heat insulating hole is formed between the first high-temperature coolant flow channel 221c and the first low-temperature coolant flow channel 221d on the first chip 221, and a second heat insulating hole 222j is formed between the second high-temperature coolant flow channel 222e and the second low-temperature coolant flow channel 222f on the second chip 222;

The stacking each of the chip assemblies 220 in the first housing 211 further includes:

the first heat insulating hole of one of the chip assemblies 220 overlaps the second heat insulating hole 222j of the other chip assembly 220 between the adjacent two chip assemblies 220.

This allows the first heat insulating hole and the second heat insulating hole 222j to be uncovered, so that the problem that the heat insulating effect is reduced due to the connection of the other chip assembly 220 although the high-temperature cooling liquid flow channel and the low-temperature cooling liquid flow channel are thermally isolated through the heat insulating hole on the one chip assembly 220 is avoided, and the heat insulating effect of the heat insulating hole on the low-temperature cooling liquid flow channel and the high-temperature cooling liquid flow channel is ensured to a certain extent.

Optionally, the core 200 includes a first cover 230 and a second cover;

mounting the first cover 230 within the first housing;

after the stacking of each of the chip assemblies 220 in the first housing 211, it further includes:

After stacking each of the chip assemblies 220 on the first cover plate 230, the second cover plate is stacked on the chip assemblies 220, so that each of the chip assemblies 220 is located between the first cover plate 230 and the second cover plate.

This achieves that when each chip assembly 220 is mounted between the first cover plate 230 and the second cover plate and each chip assembly 220 is mounted between the first cover plate 230 and the second cover plate, the first heat insulation holes and the second heat insulation holes 222j can be covered by the first cover plate 230 and the second cover plate, and the possibility of leakage of air flow through the first heat insulation holes and the second heat insulation holes 222j can be reduced.

Optionally, the intercooler includes:

The first liquid inlet connecting pipe 400, the second liquid inlet connecting pipe 600, the first liquid outlet connecting pipe, the second liquid outlet connecting pipe 500, the first water chamber 300 and the second water chamber, wherein a first liquid inlet pipe mounting hole and a first liquid outlet pipe mounting hole are formed on the first shell 211, a second liquid inlet pipe mounting hole and a second liquid outlet pipe mounting hole are formed on the second shell 212, and the first liquid inlet mounting hole and the second liquid inlet mounting hole are both arranged on a plane parallel to the first cover plate 230 of the shell 210;

the method for manufacturing the intercooler, before stacking each of the chip assemblies 220 in the first housing 211, further includes:

Connecting the first liquid inlet connection pipe 400 with the first water chamber 300, installing the first water chamber 300 at the first liquid inlet pipe installation hole, and forming an L-shaped cavity in the first water chamber 300, so that the extending direction of the first liquid inlet connection pipe 400 is parallel to the first cover plate 230;

Connecting the second liquid inlet connecting pipe 600 with a second water chamber, installing the second water chamber at the second liquid inlet pipe installation hole, and forming an L-shaped cavity in the second water chamber, so that the extending direction of the second liquid inlet connecting pipe 600 is parallel to the first cover plate 230;

the first liquid outlet connecting pipe is connected with the first liquid outlet pipe mounting hole, and the second liquid outlet pipe is connected with the second liquid outlet pipe mounting hole.

In order to further describe the scheme of the manufacturing method of the intercooler in detail, the present disclosure also provides a specific application example of the manufacturing method of the intercooler, which specifically includes the following steps:

housing assembly

In the process of assembling the shell, the liquid inlet pipe and the corresponding water chamber are required to be assembled, and the liquid outlet connecting pipe and the corresponding liquid outlet pipe mounting hole are connected, so that the method can be divided into the following three steps of S11 to S13:

S11: the first liquid inlet connection pipe 400 is connected with the first water chamber 300, the first water chamber 300 is installed at the first liquid inlet pipe installation hole, and an L-shaped cavity is formed in the first water chamber 300, so that the extending direction of the first liquid inlet connection pipe 400 is parallel to the first cover plate 230.

S12: the second liquid inlet connection pipe 600 is connected with the second water chamber, the second water chamber is installed at the second liquid inlet pipe installation hole, and an L-shaped cavity is formed in the second water chamber, so that the extending direction of the second liquid inlet connection pipe 600 is parallel to the first cover plate 230.

S13: the first liquid outlet connecting pipe is connected with the first liquid outlet pipe mounting hole, and the second liquid outlet pipe is connected with the second liquid outlet pipe mounting hole.

It will be appreciated that the execution sequence of S11 to S13 is merely an example, and the execution sequence between the three steps may be arbitrary according to the actual application, which is not limited in this disclosure.

Based on the above description, after S13, the housing assembly process may further include S14, where the content of S14 may be omitted, and whether S14 is executed or not may depend on whether S342 is executed subsequently, and the specific content of S14 may be:

s14: a side plate 260 is installed in the first housing 211.

(II) chip Assembly 220 Assembly

In order to ensure smooth assembly of the core 200, it is also necessary to assemble the chip assembly 220 in advance after assembling the housing, and the assembly process of the chip assembly 220 may be specifically divided into the following five steps S21 to S25:

s21: a blocking portion 221f is formed on the first flange 221g such that the blocking portion 221f protrudes toward the middle of the first plate surface 221j in a direction perpendicular to the first flange 221 g.

S22: the first plate surface 221j and the fourth plate surface 222g are arranged opposite to each other, and the positioning protrusion 222h in the group is matched with the positioning part 221i in the group to be positioned;

And S23, overlapping the first flanging 221g and the second flanging 222b so that the extending direction of the first flanging 221g and the extending direction of the second flanging 222b are the flowing direction of the cooled medium flowing through the first chip 221.

S24: the third flange 221h is overlapped with the fourth flange 222 a.

S25: the first cover 230 is installed in the first housing 211.

(III) core 200 Assembly

The process of assembling the core 200 may be specifically divided into four steps S31 to S34 as follows:

s31: each of the chip assemblies 220 is stacked within the first housing 211.

Based on the above description, S31 can be specifically realized by the following three subdivision steps S311 to S313:

S311: the adjacent two chip assemblies 220 are positioned by matching the inter-group positioning protrusion 221b on one chip assembly 220 with the second inter-group positioning portion 222d on the other chip assembly 220, so as to stack each chip assembly 220 in the first housing 211.

S312: the first high-temperature coolant flow channel 221c on one of the chip assemblies 220 overlaps the second high-temperature coolant flow channel 222e on the other of the chip assemblies 220 between the adjacent two chip assemblies 220, and the first low-temperature coolant flow channel 221d on one of the chip assemblies 220 overlaps the second low-temperature coolant flow channel 222f on the other of the chip assemblies 220.

S313: the first heat insulating hole of one of the chip assemblies 220 overlaps the second heat insulating hole 222j of the other chip assembly 220 between the adjacent two chip assemblies 220.

S32: after stacking each of the chip assemblies 220 on the first cover plate 230, the second cover plate is stacked on the chip assemblies 220, so that each of the chip assemblies 220 is located between the first cover plate 230 and the second cover plate.

S33: the first housing 211 is mated with the second housing 212 to form the enclosure 210.

Specifically, the specific implementation manner of step 33 may be: the air blocking portion 214 is matched with the groove portion in a positioning manner, so that the first shell 211 is abutted with the second shell 212 to form the shell 210.

S34: the housing 210 is sealingly connected to a seal at the seam 213.

In S34, a sealing member is located on the inner side of the housing 210, and if the sealing member is any one of the chip assemblies 220, the specific implementation procedure of S34 is as follows: s341: the housing 210 is sealingly connected to the first flange 221g or the second flange 222b at the seam 213.

And, if the sealing member is the side plate 260, the specific implementation process of S34 is as follows: s342: the housing 210 is sealingly connected to the side panel 260 at the seam 213. Namely: if the sealing member is a side plate 260, S14 is required to be performed during the assembly process of the housing, so as to ensure that the housing 210 and the side plate 260 can be smoothly connected in a sealing manner.

(IV) motherboard 100 and Chamber mounting

After the core 200 is assembled, the main board 100 needs to be sleeved on the core 200, and the chamber body is connected to the main board 100, so that the intercooler is finally manufactured, and the main board 100 and the chamber body can be assembled by the following steps:

s41: the main board 100 is sleeved on the core 200 through the through channel 110, and the core 200 penetrates through the main board 100 through the through channel 110.

S42: the main board 100 is covered on the air blocking portion 214 and the groove portion.

S43: the chamber body is mounted on the main board 100.

Finally, it should be noted that: the above embodiments are only for illustrating the technical solution of the present disclosure, and not for limiting the same; although the present disclosure has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some or all of the technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the present disclosure.

Furthermore, those skilled in the art will appreciate that while some of the embodiments described above include some features but not others included in other embodiments, combinations of features of different embodiments are meant to be within the scope of the present disclosure and form different embodiments. For example, in the claims below, any of the claimed embodiments may be used in any combination. Furthermore, the information disclosed in this background section is only for enhancement of understanding of the general background of the disclosure and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Claims

1. The intercooler is characterized by comprising a main board, wherein the main board is used for connecting a core body and a chamber body of the intercooler, and a through channel for the core body to penetrate through the main board so as to extend into the chamber body is formed on the main board;

the intercooler comprises a core body and a chamber body which are connected through the main board, and the core body penetrates through the main board through the through channel and stretches into the chamber body;

The core body penetrates through the main board in a first direction, the core body comprises a shell with a first shell and a second shell, a seam extending in the first direction is formed at the joint of the first shell and the second shell, a gas blocking part penetrating through the seam is formed on the first shell, a groove part for accommodating the gas blocking part is formed on the second shell, and the main board covers the gas blocking part;

The core includes a seal located inside the housing, the seal covering the seam and the air dam, and the seal being sealingly connected to the housing at the seam.

2. The intercooler of claim 1, wherein the inner wall of the through passage is a flat surface for conforming and sealing connection with the outer wall of the core.

3. The intercooler according to claim 1, wherein the core penetrates the main plate in a first direction, a connection hole for connection with an external pipe is formed in the core, and the connection hole is provided away from both side edges of the core in the first direction.

4. The intercooler of claim 1, wherein the core has a die located inside the housing, the seal is the die, the die has a flange, and the flange is sealingly connected to the housing at the seam.

5. The intercooler of claim 1, wherein the core has a side plate located inside the housing, the seal being the side plate.

6. The intercooler of any of claims 1-5, wherein the core comprises an outer shell, an outer wall of the outer shell being planar.

7. A method of manufacturing an intercooler according to any one of claims 1 to 6, the intercooler including a core and a main plate, characterized in that a through passage is formed in the main plate, the through passage penetrating the main plate, the method comprising:

8. The method of manufacturing an intercooler according to claim 7, wherein the core has a housing including a first case and a second case, and a plurality of chip assemblies mounted on an inner side of the housing;

Stacking each of the chip assemblies within the first housing;

the first shell and the second shell are butted to form the shell.

9. The method of manufacturing an intercooler according to claim 8, wherein the first housing has a first edge, the second housing has a second edge, the first housing and the second housing are butted by the first edge and the second edge, a gas blocking portion is formed on one of the first edge and the second edge, and a groove portion is formed on the other;

10. The method of manufacturing an intercooler according to claim 9, wherein the intercooler includes a seal located on an inner side of the outer shell, the first shell and the second shell form a seam between the first edge and the second edge after being butted;

the housing is sealingly connected to the seal at the seam.

11. The method of manufacturing an intercooler according to claim 10, wherein the seal is one of the chip assemblies.

12. The method of manufacturing an intercooler according to claim 10, wherein the seal is a side plate;

mounting a side plate within the first housing;

And sealing and connecting the shell and the side plate at the joint.

13. The method for manufacturing an intercooler according to claim 9, wherein,

After the main board is sleeved on the core body through the through channel, and the core body penetrates through the main board through the through channel, the method further comprises the following steps:

and covering the main board on the air blocking part and the groove part.

14. The method of manufacturing an intercooler according to claim 8, wherein the chip assembly includes a first chip having a first plate surface and a first flange formed on the first plate surface, and a second chip having a fourth plate surface and a second flange formed on the fourth plate surface;

15. The method of manufacturing an intercooler according to claim 14, wherein the first housing and the second housing are butted to form a seam;

16. The method of manufacturing an intercooler according to claim 14, wherein a boss is formed on the first plate surface, an intra-group positioning portion is formed at the boss, the second chip has a fourth plate surface, and an intra-group positioning boss is formed on the fourth plate surface;

17. The method of manufacturing an intercooler according to claim 14, wherein before the disposing the first plate surface and the fourth plate surface opposite to each other and overlapping the first flange and the second flange, further comprising:

18. The method of manufacturing an intercooler according to claim 14, wherein the first chip has a third turn-up formed on the first plate surface and extending perpendicularly to the first turn-up, and the second chip has a fourth turn-up formed on the fourth plate surface and extending perpendicularly to the second turn-up;

And overlapping the third flanging with the fourth flanging.

19. The method of manufacturing an intercooler according to claim 8, wherein the chip assembly includes a stacked first chip and second chip, the first chip having a second plate surface disposed away from the second chip, the second chip having a third plate surface disposed away from the first chip, a first set of inter-positioning portions being formed on the second plate surface, and a second set of inter-positioning portions being formed on the third plate surface;

The stacking each of the chip assemblies within the first housing includes:

20. The method of manufacturing an intercooler according to claim 19, wherein the first inter-group positioning portions are inter-group positioning projections.

21. The method of manufacturing an intercooler according to any one of claims 8 to 20, wherein the chip assembly includes a stacked first chip and second chip, the first chip having a second plate surface disposed away from the second chip, the second chip having a third plate surface disposed away from the first chip, a first high temperature coolant flow passage and a first low temperature coolant flow passage recessed into the second plate surface being formed on the second plate surface, a second high temperature coolant flow passage and a second low temperature coolant flow passage recessed into the third plate surface being formed on the third plate surface;

The stacking each of the chip assemblies within the first housing includes:

22. The method of manufacturing an intercooler according to claim 21, wherein the first high temperature coolant flow passage, the first low temperature coolant flow passage, the second high temperature coolant flow passage, and the second low temperature coolant flow passage are the same in width dimension.

23. The method of manufacturing an intercooler according to claim 21, wherein a first heat insulating hole is formed between the first high-temperature coolant flow passage and the first low-temperature coolant flow passage on the first chip, and a second heat insulating hole is formed between the second high-temperature coolant flow passage and the second low-temperature coolant flow passage on the second chip;

24. The method of manufacturing an intercooler according to claim 23, wherein the core includes a first cover plate and a second cover plate;

mounting the first cover plate in the first housing;