CN111137628B - Rotary placing platform mechanism - Google Patents
Rotary placing platform mechanism Download PDFInfo
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- CN111137628B CN111137628B CN202010003625.9A CN202010003625A CN111137628B CN 111137628 B CN111137628 B CN 111137628B CN 202010003625 A CN202010003625 A CN 202010003625A CN 111137628 B CN111137628 B CN 111137628B
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- rotary
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
- B65G29/00—Rotary conveyors, e.g. rotating discs, arms, star-wheels or cones
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Abstract
The invention discloses a rotary placing platform mechanism for wafer testing, which comprises a fixed base, a rotary placing platform, a rotary table and a rotary table, wherein the fixed base is provided with a plurality of positioning holes; the rotary base is rotatably arranged on the fixed base and at least comprises a vertical state used for testing; one end of the rotating base is provided with a holding mechanism for holding the tested piece; the rotary base is rotatably provided with a rotation platform A and a rotation platform B which is rotatably arranged on the rotation platform A, and the rotation platform B is provided with a lifting adsorption device for being matched with the holding mechanism to fix or release the tested piece. The invention has the advantages that: even can make the piece of being surveyed also can realize autogiration under vertical state through lift adsorption equipment, need not the manual work and rotate the piece of being surveyed, cause the error to influence the test result to the lift sucking disc rises when the piece of being surveyed need turn to and catches the rotation of the piece of being surveyed, reduces the height when the test, does not hinder the piece of being surveyed and tests, has increased the flexibility of rotatory platform mechanism of placing.
Description
Technical Field
The invention relates to the field of optical or semiconductor testing instruments, in particular to a rotary placing platform mechanism.
Background
In the manufacturing of integrated circuits, large-size silicon wafers are more and more widely applied in order to increase productivity and reduce cost; meanwhile, in order to improve the sheet performance and the packaging density, the large-size silicon wafer is required to be thinned by developing a three-dimensional packaging technology. Residual stress generated in the thinning process causes the silicon wafer to generate warping deformation, and the fragment rate of the silicon wafer in transmission and subsequent processing can be increased. The warping deformation of the silicon wafer is an important technical index for evaluating the processing quality of the silicon wafer, and is also an important basis for analyzing the processing residual stress of the silicon wafer and optimizing the thinning process. In most quartz wafer applications, the wafer is processed in a flat manner, and the data plane measurement data, particularly the WARP value and the BOW value, after eliminating the influence of gravity deformation is urgently needed. The invention discloses a full-automatic wafer test method and equipment for realizing the test method, wherein the equipment for realizing the test method comprises a wafer placing device and a wafer counting device which are arranged on a rack, a wafer transmission device is arranged on the rack on one side of the wafer placing device and the wafer counting device, a wafer test platform device matched with the wafer transmission device is arranged on one side of the wafer transmission device, a wafer box placing rack is arranged on the rack, a wafer box and a wafer detection sensor are arranged on the wafer box placing rack, an optical sensor mounting disc is arranged on the rack close to the wafer test platform device, and an optical sensor can be mounted in the optical sensor mounting disc. The problem of gravity deformation can be solved to the mode that adopts vertical measurement, but need solve the autogiration scheduling problem among the mode of placing and the measurement process, still need solve the problem of clamping position and holding dynamics.
Disclosure of Invention
The invention aims to provide a rotary placing platform mechanism, which can effectively solve the problem that the clamping position of a measured piece needs to be changed inconveniently in a vertical state by rotating the measured piece in the vertical state through a lifting adsorption device.
In order to solve the technical problems, the invention is realized by the following technical scheme:
a rotary platform mechanism for wafer test comprises a fixed base; the rotary base is rotatably arranged on the fixed base and at least comprises a vertical state used for testing; one end of the rotating base is provided with a holding mechanism for holding the tested piece; rotating on the rotating base and being equipped with rotation platform A and rotating the rotation platform B of installing on rotation platform A, be equipped with lift adsorption equipment on the rotation platform B for the cooperation is held the mechanism and is fixed or release the piece under test, when the piece under test is tested, turn to for vertical state after holding through holding the mechanism, can eliminate the piece under the state of keeping flat because the gravity deformation that thickness too thin produced, when the angle of the piece under test needs to be adjusted, lift adsorption equipment rises and holds the piece under test, hold the mechanism and relieve and both can rotate angle regulation through rotation platform, the flexibility of the piece under test has been increased, also can improve the accuracy through many times of tests.
Preferably, the adsorption device comprises a lifting cylinder fixed on the rotation platform B, the lifting cylinder is connected with a lifting sucker in a sliding mode and used for sucking the tested piece, the lifting sucker is lifted to suck the tested piece to rotate when the tested piece needs to turn, the height is reduced when the tested piece is tested, the tested piece is not hindered to be tested, and the flexibility of the rotary placement platform mechanism is improved.
Furthermore, the number of the adsorption devices is four, the adsorption devices are uniformly distributed at the edge of the rotation platform B, and the adsorption devices are distributed at the edge of the rotation platform B, so that the wafers with smaller thickness can be better adsorbed, damage to the tested wafer is avoided, and the stability during testing is improved.
Preferably, hold the mechanism and include the fixing base, the fixing base has through slide bar slidable mounting and holds the tong, the rear end of holding the tong is connected with a drive arrangement for the elasticity action of control holding the tong, the tong can adjust the position of centre gripping on the piece under test through the slide bar, and the use is simple nimble, and the piece under test of equidimension also can be through the position of the sliding fit of tong on rotatory place the platform.
Furthermore, the holding clamp comprises a pair of clamping jaws and force sensors respectively arranged on the two clamping jaws, the two clamping jaws are required to act together for clamping the wafer, the force sensors are required to be arranged, the same holding force at the two ends of the wafer is ensured, and the precision of the measuring instrument is further improved.
Preferably, the rotation platform A is fixedly provided with a support column A used for supporting a tested wafer along the edge, a circle of recess is formed in the outer wall of the support column A and used for clamping the tested wafer, the recess can be used for clamping the edge of the wafer, the wafer is further fixed, and the test stability and accuracy are improved.
Preferably, a first rotary driving part is fixedly mounted at the bottom of the rotary base, the first rotary driving part is rotatably connected with a hollow rotary shaft, the other end of the hollow rotary shaft is rotatably mounted at the bottom of the self-rotation platform A, the self-rotation platform A and the self-rotation platform B can separately rotate, the influence of a supporting point and a holding position on a measured sheet can be eliminated through the rotation of the self-rotation platform A, and the accuracy is improved.
Furthermore, the hollow rotating shaft is connected with the rotation platform B through a connecting bearing, the connecting bearing is connected with a second rotary driving part installed at the bottom of the rotation platform A through a belt, the rotation platform B rotates for a certain angle to complete measurement of the measured sheet at different angles, and the second rotary driving part drives the rotation to achieve the purpose of automatic measurement.
Preferably, the number of the adsorption devices is at least one, the position of the adsorption device can be arranged at the center of the rotation platform B, and also can be arranged at the edge of the rotation platform B, and the number of the adsorption devices can be adjusted according to the needs of personnel.
Preferably, the rotation axis is installed along the axis symmetry on the rotating base lateral wall, fixed mounting has the second drive arrangement on the unable adjustment base, the second drive arrangement passes through the one end and the rotating base of rotation axis and is connected for drive rotating base rotates along the rotation axis, and rotating base can rotate to vertical state along the rotation axis from the state of keeping flat, reduces the influence of gravity to test wafer performance, improves measuring precision.
Further, the first driving device, the first rotation driving part and the second rotation driving part are rotation cylinders; alternatively, the first driving device, the second driving device, the first rotary driving member and the second rotary driving member are rotating motors, and the first driving device, the second driving device, the first rotary driving member and the second rotary driving member may be driven in other manners, such as a belt mechanism, a worm gear mechanism, and the like.
Compared with the prior art, the invention has the advantages that:
even can make the piece of being surveyed also can realize autogiration under vertical state through lift adsorption equipment, need not the manual work and rotate the piece of being surveyed, cause the error to influence the test result to the lift sucking disc rises when the piece of being surveyed need turn to and catches the rotation of the piece of being surveyed, reduces the height when the test, does not hinder the piece of being surveyed and tests, has increased the flexibility of rotatory platform mechanism of placing.
Drawings
FIG. 1 is a schematic view of the main structure of the present invention;
FIG. 2 is an exploded view of the main structure of the present invention;
FIG. 3 is a schematic structural diagram of a main body of the clasping mechanism of the present invention;
FIG. 4 is a schematic view of the main structure of a support column A of the present invention;
in the figure:
10. a fixed base; 11. rotating the base; 12. a clasping mechanism; 13. a rotation platform A; 14. a rotation platform B; 15. lifting the adsorption device; 16. a lifting cylinder; 17. lifting the sucker; 18. a fixed seat; 19. a slide bar; 20. holding the clamping hands; 21. a first driving device; 22. a clamping jaw; 23. a force sensor; 24. a support pillar A; 25. recessing; 26. a first rotation driving member; 27. a hollow rotating shaft; 28. connecting a bearing; 29. a belt; 30. a second rotation driving member; 31. a rotating shaft; 32. a second driving device.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are illustrative and intended to be illustrative of the invention and are not to be construed as limiting the invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience of description and for simplicity of description, and do not indicate or imply that the device or element so referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1-2, an embodiment of a rotary stage mechanism for wafer testing according to the present invention is shown, which comprises a fixed base 10; the fixed base 10 is rotatably provided with a rotating base 11, and the rotating base 11 at least comprises a vertical state used for testing, a flat state used for placing a tested piece, a vertical state with improved accuracy during testing and the like; the rotating base 11 is rotatably provided with a rotating platform A13, the rotating platform A13 is rotatably connected with a rotating platform B14, the rotating platform A13 and the rotating platform B14 can respectively rotate, and the rotating platform A13 and the rotating platform B14 can be used for eliminating the influence of a supporting point and a holding position when a person selects the rotating platform A13 to rotate 180 degrees; or the rotation platform B14 is selected to rotate a certain angle to measure the state of the measured piece under different angles. One end of the rotating base is provided with a holding mechanism 12, and when a tested wafer is tested in a vertical state, the tested wafer is held by the holding mechanism mainly, so that the test is carried out in the vertical state, the deformation caused by the influence of gravity on the wafer is eliminated, and the measurement precision is improved. When the wafer needs to be tested at a rotation angle, the wafer can be fixed or released by matching with the holding mechanism through the lifting adsorption device 15 fixed on the rotation platform B14 without manual turning and adjustment, so that the measurement efficiency is improved, and the diversity of the test method is increased. Referring to fig. 1-3, the lifting adsorption device 15 includes a lifting cylinder 16 fixed on the rotation platform B14, the lifting cylinder 16 is connected with a lifting suction cup 17, after the initial position test of the lifting cylinder 16 is completed, the tested piece needs to be steered, the lifting suction cup 17 is lifted, after the lifting suction cup 17 sucks the tested piece, the holding mechanism 12 is released, the rotation platform a 13 rotates 180 degrees, the holding mechanism 12 holds the tested piece, the lifting cylinder 16 lowers the lifting suction cup 17, the test is not hindered, the influence of the supporting point and the holding position can be eliminated by adding the results of the two measurements, and the purpose of accurate measurement is achieved. If the states of the tested pieces at different angles need to be measured, the steps are repeated, and the rotation platform B14 rotates for a certain angle to perform the test. The number of the lifting adsorption devices 15 can be adjusted as required, for example, one is disposed at the center of the rotation platform B14, or four are uniformly distributed at the edge of the rotation platform B14, and the like, so that the stability of adsorbing the wafer can be improved, and the practicability of the rotary placing platform is improved.
Referring to fig. 1-3, the clasping mechanism 12 is disposed at one end of the rotating base 11, and includes a fixed seat 18, a sliding rod 19 is disposed on the fixed seat 18, a clasping gripper 20 is mounted on the sliding rod 19, a first driving device 21 is connected to a rear end of the clasping gripper 20, and the first driving device 21 is activated to control the tightness of the gripper. The holding gripper 20 can adjust the position on the fixed seat 18 through the slide rod 19, so as to be convenient for holding wafers with different sizes, the two clamping jaws 22 of the holding gripper 20 are respectively provided with the force sensors 23, the clamping force of the clamping jaws 22 is adjusted through the numerical values of the force sensors 23, the numerical values of the two force sensors 23 are equal, and the measured wafer is in a vertical state; or the values of the two force sensors 23 are not equal, the error is compensated through compensation calculation, the chuck of the clamping jaw 22 is generally a spherical chuck, the wafer can be stably held without scratching the surface of the wafer, and the practicability and the accuracy of the rotary placing platform mechanism are improved.
Referring to fig. 1-3, a first rotation driving part 26 is fixedly mounted at the bottom of the rotating base 11, the first rotation driving part 26 is rotatably connected to the bottom of the rotation platform a 13 through a hollow rotation shaft 27, the first rotation driving part 26 is started to drive the rotation platform a 13 to rotate, the hollow rotation shaft 27 is further rotatably connected with a connecting bearing 28, the connecting bearing 28 is connected with a belt mechanism 29, the belt mechanism 29 is connected to a second rotation driving part 30 fixed at the bottom of the rotation platform a 13, the connecting bearing 28 is driven to rotate through the belt mechanism 29, the connecting bearing 28 drives the rotation platform B14 to rotate, and the functions of separating respective rotations of the rotation platform a 13 and the rotation platform B14 can be realized through the arrangement. The rotating shafts 31 are symmetrically arranged on the side walls of the two ends of the rotating base 11 along the axis, the second driving device 32 is fixedly arranged on the fixed base 10, the second driving device 32 is connected with the rotating base 11 through one end of the rotating shaft 31, the second driving device 32 is started, the rotating shaft 31 rotates the angle of the rotating base 11 to the vertical state, and the wafer is tested.
Referring to fig. 1 and 4, the rotation platform a 13 is further fixedly provided with a support column a 24 for supporting a wafer to be tested along the edge by threaded connection, a circle of recess 25 is provided on the outer wall of the support column a 24, the recess 25 can clamp the edge of the wafer for further fixing, and the stability and accuracy of the test are improved. The supporting columns are arranged on two sides of the edge of the rotation platform A13, and each side can be one or two in number capable of playing a supporting role.
Referring to fig. 1-2, an embodiment of a rotary stage mechanism for wafer testing according to the present invention is shown, which comprises a fixed base 10; the fixed base 10 is rotatably provided with a rotating base 11, and the rotating base 11 at least comprises a vertical state used for testing, a flat state used for placing a tested piece, a vertical state with improved accuracy during testing and the like; the rotating base 11 is rotatably provided with an autorotation platform A13, the autorotation platform A13 is rotatably connected with an autorotation platform B14, the autorotation platform A13 and the autorotation platform B14 can respectively autorotate and can be used for eliminating the influence of a supporting point and a holding position when a person selects the autorotation platform A13 to rotate 180 degrees; or the rotation platform B14 is selected to rotate a certain angle, and the state of the measured piece under different angles is measured. One end of the rotating base is provided with a holding mechanism 12, and when a tested wafer is tested in a vertical state, the tested wafer is held by the holding mechanism mainly, so that the test is carried out in the vertical state, the deformation caused by the influence of gravity on the wafer is eliminated, and the measurement precision is improved. When the wafer needs to be tested at a rotation angle, the wafer can be fixed or released by matching with the holding mechanism through the lifting adsorption device 15 fixed on the rotation platform B14 without manual turning and adjustment, so that the measurement efficiency is improved, and the diversity of the test method is increased. Referring to fig. 1-3, the lifting adsorption device 15 includes a lifting cylinder 16 fixed on the rotation platform B14, a lifting suction cup 17 is connected to the lifting cylinder 16, after the initial position test of the lifting cylinder 16 is completed, the measured sheet needs to be steered to raise the lifting suction cup 17, after the measured sheet is sucked by the lifting suction cup 17, the holding mechanism 12 is released, the rotation platform a 13 rotates 180 degrees again, the holding mechanism 12 holds the measured sheet, the lifting cylinder 16 lowers the lifting suction cup 17, the test is not hindered, the influence of the supporting point and the holding position can be eliminated by adding the results of the two measurements, and the purpose of accurate measurement is achieved. If the states of the tested pieces at different angles need to be measured, the steps are repeated, and the rotation platform B14 rotates for a certain angle to perform the test. The number of the lifting adsorption devices 15 can be adjusted as required, for example, one is disposed at the center of the rotation platform B14, or four are uniformly distributed at the edge of the rotation platform B14, and the like, so that the stability of adsorbing the wafer can be improved, and the practicability of the rotary placing platform is improved.
Referring to fig. 1-3, the clasping mechanism 12 is disposed at one end of the rotating base 11, and includes a fixed seat 18, a sliding rod 19 is disposed on the fixed seat 18, a clasping gripper 20 is mounted on the sliding rod 19, a first driving device 21 is connected to a rear end of the clasping gripper 20, and the first driving device 21 is activated to control the tightness of the gripper. The holding gripper 20 can adjust the position on the fixed seat 18 through the slide rod 19, so as to be convenient for holding wafers with different sizes, the two clamping jaws 22 of the holding gripper 20 are respectively provided with the force sensors 23, the clamping force of the clamping jaws 22 is adjusted through the numerical values of the force sensors 23, the numerical values of the two force sensors 23 are equal, and the measured wafer is in a vertical state; or the values of the two force sensors 23 are not equal, the error is compensated through compensation calculation, the chuck of the clamping jaw 22 is generally a spherical chuck, the wafer can be stably held without scratching the surface of the wafer, and the practicability and the accuracy of the rotary placing platform mechanism are improved.
Referring to fig. 1-3, a first rotation driving part 26 is fixedly mounted at the bottom of the rotating base 11, the first rotation driving part 26 is rotatably connected to the bottom of the rotation platform a 13 through a hollow rotation shaft 27, the first rotation driving part 26 is started to drive the rotation platform a 13 to rotate, the hollow rotation shaft 27 is further rotatably connected with a connecting bearing 28, the connecting bearing 28 is connected with a belt mechanism 29, the belt mechanism 29 is connected to a second rotation driving part 30 fixed at the bottom of the rotation platform a 13, the connecting bearing 28 is driven to rotate through the belt mechanism 29, the connecting bearing 28 drives the rotation platform B14 to rotate, and the functions of separating respective rotations of the rotation platform a 13 and the rotation platform B14 can be realized through the arrangement. The rotating shafts 31 are symmetrically arranged on the side walls of the two ends of the rotating base 11 along the axis, the second driving device 32 is fixedly arranged on the fixed base 10, the second driving device 32 is connected with the rotating base 11 through one end of the rotating shaft 31, the second driving device 32 is started, the rotating shaft 31 rotates the angle of the rotating base 11 to the vertical state, and the wafer is tested.
The above description is only an embodiment of the present invention, but the technical features of the present invention are not limited thereto, and any changes or modifications within the technical field of the present invention by those skilled in the art are covered by the claims of the present invention.
Claims (9)
1. A rotary placing platform mechanism is used for wafer testing and is characterized in that: comprises a fixed base; the rotary base is rotatably arranged on the fixed base and at least comprises a vertical state used for testing; the device comprises a rotating base, a clamping mechanism and a force measuring sensor, wherein the clamping mechanism is arranged at one end of the rotating base and used for clamping a tested piece, the clamping mechanism comprises a clamping hand, and the clamping hand comprises a pair of clamping jaws and force measuring sensors respectively arranged on the two clamping jaws and used for detecting whether the tested piece is in a vertical state or not; the rotary base is rotatably provided with an autorotation platform A and an autorotation platform B rotatably arranged on the autorotation platform A, and the autorotation platform B is provided with at least one lifting adsorption device for fixing or releasing the tested piece in cooperation with the holding mechanism.
2. The rotating placement platform mechanism of claim 1, wherein: the lifting adsorption device comprises a lifting cylinder fixed on the rotation platform B, and the lifting cylinder is connected with a lifting sucker in a sliding mode and used for sucking the piece to be detected.
3. A rotational placement platform mechanism according to claim 1 or 2, characterized in that: the number of the lifting adsorption devices is four, and the lifting adsorption devices are uniformly distributed on the edge of the rotation platform B.
4. The rotating placement platform mechanism of claim 1, wherein: the holding mechanism comprises a fixed seat, the holding gripper is slidably mounted on the fixed seat through a sliding rod, and a first driving device is connected to the rear end of the holding gripper and used for controlling the tightness of the holding gripper.
5. The rotating placement platform mechanism of claim 1, wherein: the rotation platform A is fixedly provided with a support column A used for supporting a measured sheet along the edge, and the outer wall of the support column A is provided with a circle of recess used for clamping the measured sheet.
6. The rotating placement platform mechanism of claim 1, wherein: the rotary base is characterized in that a first rotary driving part is fixedly mounted at the bottom of the rotary base, the first rotary driving part is rotatably connected with a hollow rotary shaft, and the other end of the hollow rotary shaft is rotatably mounted at the bottom of the self-rotation platform A.
7. The rotating placement platform mechanism of claim 6, wherein: the hollow rotating shaft is connected with the rotation platform B through a connecting bearing, and the connecting bearing is connected with a second rotary driving part installed at the bottom of the rotation platform A through a belt mechanism.
8. The rotating placement platform mechanism of claim 1, wherein: the rotating shaft is symmetrically installed on the side wall of the rotating base along the axis, the second driving device is fixedly installed on the fixed base and connected with the rotating base through one end of the rotating shaft for driving the rotating base to rotate along the rotating shaft.
9. The rotating placement platform mechanism of claim 4, wherein: the first driving device, the second driving device, the first rotary driving part and the second rotary driving part are rotary cylinders; alternatively, the first drive device, the second drive device, the first rotary drive member, and the second rotary drive member are rotary motors.
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| CN202010003625.9A CN111137628B (en) | 2020-01-03 | 2020-01-03 | Rotary placing platform mechanism |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010003625.9A CN111137628B (en) | 2020-01-03 | 2020-01-03 | Rotary placing platform mechanism |
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| CN111137628A CN111137628A (en) | 2020-05-12 |
| CN111137628B true CN111137628B (en) | 2021-07-27 |
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Citations (6)
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|---|---|---|---|---|
| JPH07286955A (en) * | 1994-04-20 | 1995-10-31 | Nippon Steel Corp | Sample rotary holder for spectrometry |
| US5642298A (en) * | 1994-02-16 | 1997-06-24 | Ade Corporation | Wafer testing and self-calibration system |
| JP2000114332A (en) * | 1998-10-09 | 2000-04-21 | Haimekku:Kk | Visual wafer inspection equipment |
| CN202471910U (en) * | 2012-01-19 | 2012-10-03 | 嘉兴景焱智能装备技术有限公司 | Test stand for posture sensing sensor chip |
| JP2013228214A (en) * | 2012-04-24 | 2013-11-07 | Atel Corp | Macro observation device |
| KR101467121B1 (en) * | 2013-01-04 | 2014-12-01 | 주식회사 엘지실트론 | Apparatus for inspecting wafer surface |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6204917B1 (en) * | 1998-09-22 | 2001-03-20 | Kla-Tencor Corporation | Backside contamination inspection device |
-
2020
- 2020-01-03 CN CN202010003625.9A patent/CN111137628B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5642298A (en) * | 1994-02-16 | 1997-06-24 | Ade Corporation | Wafer testing and self-calibration system |
| JPH07286955A (en) * | 1994-04-20 | 1995-10-31 | Nippon Steel Corp | Sample rotary holder for spectrometry |
| JP2000114332A (en) * | 1998-10-09 | 2000-04-21 | Haimekku:Kk | Visual wafer inspection equipment |
| CN202471910U (en) * | 2012-01-19 | 2012-10-03 | 嘉兴景焱智能装备技术有限公司 | Test stand for posture sensing sensor chip |
| JP2013228214A (en) * | 2012-04-24 | 2013-11-07 | Atel Corp | Macro observation device |
| KR101467121B1 (en) * | 2013-01-04 | 2014-12-01 | 주식회사 엘지실트론 | Apparatus for inspecting wafer surface |
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Denomination of invention: A rotating placement platform mechanism Effective date of registration: 20220623 Granted publication date: 20210727 Pledgee: Bank of Jiaxing science and technology branch of Limited by Share Ltd. Pledgor: Zhejiang Baisheng photoelectric Co.,Ltd. Registration number: Y2022980008691 |
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