CN111129347A - Display panel and manufacturing method thereof - Google Patents
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- CN111129347A CN111129347A CN201911340850.5A CN201911340850A CN111129347A CN 111129347 A CN111129347 A CN 111129347A CN 201911340850 A CN201911340850 A CN 201911340850A CN 111129347 A CN111129347 A CN 111129347A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
A display panel and a manufacturing method thereof are provided, wherein the display panel is provided with a hollow part on a first inorganic packaging layer and is combined with a structure of a packaging anti-cracking piece filled in the hollow part, so that the stress of a packaging film of the display panel in a cutting process or a bending process is well dispersed, the tearing risk of the inorganic layer part in the packaging film is reduced, the packaging performance of the packaging film is improved, and the narrow frame of an OLED display panel is facilitated.
Description
Technical Field
The present disclosure relates to display panels, and particularly to a display panel and a method for manufacturing the same.
Background
With the development of display technology, an OLED display panel is widely applied due to its advantages of fast response speed, wide temperature application range, self-luminescence, realization of flexible display, and the like, and with the continuous increase of market demand, the research and development and production of flexible OLEDs become the popular field of the development of the current display industry, wherein a thin film packaging technology is a key technology for ensuring the reliability of the flexible OLED display panel. Generally, the flexible encapsulation film is formed by an inorganic/organic/inorganic laminated film, so that the inorganic film layer at the edge of the panel (panel loader) is at risk of tearing (crack) during the cutting process and bending (bending), causing cracks and even peeling of the encapsulation film, and reducing the water and oxygen barrier property of the encapsulation film, thereby affecting the reliability of the OLED panel. Therefore, how to reduce the inorganic film crak at the edge of the panel in the flexible display is also a difficult problem to be improved.
Disclosure of Invention
The embodiment of the application provides a display panel and a manufacturing method thereof, and aims to solve the problems that in the panel cutting process and the bending process, an inorganic film layer at the edge (panel border) of a panel has the risk of tearing (crack), so that a packaging film cracks or even peels off, the water and oxygen barrier property of the packaging film is reduced, and the reliability of an OLED panel is affected.
The embodiment of the application provides a display panel, which comprises a display area and a non-display area arranged around the display area;
the display panel includes the base plate, locates TFT layer on the base plate, locate on the TFT layer and be located organic luminescent layer in the display area and locate the TFT layer with on the organic luminescent layer and cover the film packaging layer of organic luminescent layer, the film packaging layer includes:
the first inorganic packaging layer is arranged on the TFT layer and the organic light emitting layer and covers the organic light emitting layer, a hollow part located in the non-display area is arranged on the first inorganic packaging layer and surrounds the display area, a packaging anti-cracking piece is filled in the hollow part, and the upper end of the packaging anti-cracking piece is flush with the upper surface of the first inorganic packaging layer;
the organic packaging layer is arranged on the first inorganic packaging layer and at least corresponds to the display area; and
and the second inorganic packaging layer is arranged on the first inorganic packaging layer, the packaging crack-resistant piece and the organic packaging layer and covers the organic packaging layer.
According to a preferred embodiment of the present application, the hollow portion includes at least two circles of grooves surrounding the display area, and two adjacent circles of the grooves are arranged at intervals, and the packaging crack resistant member is filled in each of the grooves.
According to a preferred embodiment of the present application, the groove has a circular or rectangular cross-section in a direction parallel to the substrate.
According to a preferred embodiment of the present application, the hollow portion includes at least two annular grooves disposed around the display area, and each of the annular grooves is filled with the package crack resistant member.
According to a preferred embodiment of the present application, the TFT layer includes a TFT array layer located in the display area, a TFT routing layer located in the non-display area, and a TFT blocking member, a blocking groove is formed in the TFT routing layer, the TFT blocking member is disposed in the blocking groove, the TFT blocking member protrudes from the TFT routing layer, and the first inorganic encapsulation layer is disposed on the TFT array layer, the TFT routing layer, the TFT blocking member, and the organic light emitting layer and covers the organic light emitting layer.
According to a preferred embodiment of the present application, the hollow portion is disposed on a side of the TFT blocking member away from the display area and/or a side of the TFT blocking member close to the display area.
According to a preferred embodiment of the present application, the material of the encapsulation crack resistant member is the same as the material of the organic encapsulation layer, and the encapsulation crack resistant member and the organic encapsulation layer are an integrally formed structure.
According to a preferred embodiment of the present application, the material of the encapsulation crack resistant member is polyacrylate, polycarbonate, acrylate or polystyrene.
The embodiment of the application also provides a manufacturing method of the display panel, wherein the display panel comprises a display area and a non-display area arranged around the display area; the method comprises the following steps:
providing a substrate, and forming a TFT layer on the substrate;
forming an organic light emitting layer positioned in the display region on the TFT layer; and
forming a thin film encapsulation layer covering the organic light emitting layer on the TFT layer and the organic light emitting layer;
the forming of the thin film encapsulation layer covering the organic light emitting layer on the TFT layer and the organic light emitting layer includes:
forming a first inorganic packaging layer covering the organic light emitting layer on the TFT layer and the organic light emitting layer, forming a hollow part positioned in the non-display area on the first inorganic packaging layer, wherein the hollow part is arranged around the display area, forming a packaging anti-cracking piece in the hollow part, and the upper end of the packaging anti-cracking piece is flush with the upper surface of the first inorganic packaging layer;
forming an organic encapsulation layer at least corresponding to the display region on the first inorganic encapsulation layer; and
and forming a second inorganic packaging layer covering the organic packaging layer on the first inorganic packaging layer, the packaging crack resistant member and the organic packaging layer.
According to a preferred embodiment of the present application, the forming of the hollow portion in the non-display area on the first inorganic encapsulation layer, the hollow portion being disposed around the display area, and the forming of the encapsulation crack resistant member in the hollow portion includes:
forming a hollow-out part positioned in the non-display area on the first inorganic packaging layer in an exposure development or dry etching mode, wherein the hollow-out part is arranged around the display area;
and forming a packaging anti-cracking part in the hollow part in an ink-jet printing mode.
The beneficial effect of this application does: the stress of the packaging film of the display panel in a cutting process or a bending process is well dispersed by arranging the hollow part on the first inorganic packaging layer and combining the structure that the packaging anti-cracking piece is filled in the hollow part, so that the tearing risk of the inorganic layer part in the packaging film is reduced, the packaging performance of the packaging film is improved, and the narrow frame of the OLED display panel is facilitated; in addition, according to the manufacturing method of the display panel, a mature process is adopted for manufacturing the hollow part and the packaging anti-cracking piece, and the manufacturing method is suitable for batch manufacturing.
Drawings
The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a top view of a display panel according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a cross section of one side of a display panel according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a cross section of another display panel according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a cross section of another display panel according to an embodiment of the present disclosure;
FIG. 5 is a schematic diagram of a groove in a non-display area on one side of a display panel according to an embodiment of the present disclosure;
FIG. 6 is a schematic diagram of another exemplary embodiment of a groove structure in a non-display area on a side of a display panel;
fig. 7 is a schematic block diagram of a process of a method for manufacturing a display panel according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.
The present application is further described below with reference to the accompanying drawings and examples.
As shown in fig. 1 to 4, an embodiment of the present application provides a display panel, including a display area 10 and a non-display area 20 disposed around the display area 10;
the display panel comprises a substrate 100, a TFT layer 200 disposed on the substrate 100, an organic light emitting layer 300 disposed on the TFT layer 200 and located in the display region 10, and a thin film encapsulation layer 400 disposed on the TFT layer 200 and the organic light emitting layer 300 and covering the organic light emitting layer 300, wherein the thin film encapsulation layer 400 comprises:
a first inorganic encapsulation layer 410, disposed on the TFT layer 200 and the organic light emitting layer 300 and covering the organic light emitting layer 300, wherein a hollow portion 420 located in the non-display area 20 is disposed on the first inorganic encapsulation layer 410, the hollow portion 420 is disposed around the display area 10, a package anti-crack member 430 is filled in the hollow portion 420, and an upper end of the package anti-crack member 430 is flush with an upper surface of the first inorganic encapsulation layer 410;
an organic encapsulation layer 440 disposed on the first inorganic encapsulation layer 410 and corresponding to at least the display region 10; and
and a second inorganic encapsulation layer 450 disposed on the first inorganic encapsulation layer 410, the encapsulation crack preventer 430, and the organic encapsulation layer 440 and covering the organic encapsulation layer 440.
It can be understood that, at present, a process for manufacturing a display panel is to simultaneously manufacture a plurality of display panels on a motherboard, then divide the motherboard into a plurality of display panel monomers by cutting, and during the cutting or the subsequent process of bending the display panel, the inorganic encapsulation layer at the edge (panel border) of the display panel is easily torn or broken by the corresponding stress action, so that the encapsulation film is cracked or even peeled off, the water and oxygen barrier property of the encapsulation film is reduced, and the functional layers such as the organic light emitting layer 300 cannot be sealed and protected. In this embodiment, a hollow portion 420 surrounding the display region 10 is disposed on the first inorganic encapsulation layer 410 of the thin film encapsulation layer 400, and an encapsulation anti-crack 430 is filled in the hollow portion 420 to buffer the stress when the display panel is bent and folded and prevent the crack from extending when the display panel is cut.
Specifically, the material of the encapsulation crack-resistant member 430 is organic materials such as polyacrylate and its derivatives, polycarbonate and its derivatives, Acrylate (Acrylate) or polystyrene, the materials of the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 450 are inorganic materials for increasing the water and oxygen blocking performance of the device, such as SiNx, SiOx, SiON or Al2O3, and the ratio between the depth of the hollow portion 420 or the height of the encapsulation crack-resistant member 430 and the thickness of the first inorganic encapsulation layer 410 may be set according to actual needs.
In this embodiment, the hollow portion 420 at least includes two circles of grooves 421 disposed around the display area 10, and two adjacent circles of the grooves 421 are arranged at intervals, and the packaging crack resistant member 430 is filled in each of the grooves 421, it can be understood that the greater the arrangement density of each circle of the grooves 421 or two adjacent circles of the grooves 421 is, the better the effect of the packaging film on buffering stress and preventing crack extension is. Specifically, as shown in fig. 5 to 6, fig. 5 and 6 only show the groove 421 located at a partial area of one side of the display panel, and mainly include four circles of grooves 421 disposed around the display area 10, the cross section of the groove 421 in the direction parallel to the substrate 100 is circular or rectangular, of course, the cross section of the groove 421 in the direction perpendicular to the substrate 100 may be rectangular or trapezoidal, and the short side of the trapezoid is located at a side of the first inorganic encapsulation layer 410 away from the substrate 100.
In this embodiment, as shown in fig. 1, the hollow-out portion 420 at least includes two annular grooves 422 disposed around the display area 10, and each annular groove 422 is filled with the package anti-crack 430, it can be understood that the annular grooves 422 are disposed around the display area 10, and the specific shape thereof can be adaptively adjusted according to the specific shape of the display area 10 and the position of the non-display area 20, and the contour of the annular grooves 422 is not limited to a circular shape or a rectangular shape.
In this embodiment, as shown in fig. 2 to fig. 4, the TFT layer 200 includes a TFT array layer 210 located in the display area 10, and a TFT routing layer 220 and a TFT blocking member 230 located in the non-display area 20, a blocking groove is disposed on the TFT routing layer 220, the TFT blocking member 230 is disposed in the blocking groove, the TFT blocking member 230 protrudes from the TFT routing layer 220, the first inorganic encapsulation layer 410 is disposed on the TFT array layer 210, the TFT routing layer 220, the TFT blocking member 230, and the organic light emitting layer 300 and covers the organic light emitting layer 300, it can be understood that the TFT routing layer 220 extends from structures such as a source, a drain, an insulating layer, and the like in the TFT array layer 210, the TFT blocking member 230 is used for blocking and relieving a stress applied to the TFT layer 200 and also plays a certain water and oxygen blocking role, and in addition, the TFT blocking member 230 protrudes from the TFT routing layer 220, one end of the TFT blocking member 230, which is far away from the substrate 100, is embedded in the thin film encapsulation layer 400, so that a contact surface between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 450 in the thin film encapsulation layer 400 is changed, a water-oxygen channel between the first inorganic encapsulation layer 410 and the second inorganic encapsulation layer 450, through which water and oxygen easily enter, is bent, the water-oxygen blocking performance of the thin film encapsulation layer 400 is improved, and meanwhile, a channel between the thin film encapsulation layer 400 and the TFT routing layer 220 is blocked; specifically, the material of the TFT stopper 230 may be an organic material.
It is to be noted that the hollow portion 420 is disposed on a side of the TFT barrier 230 away from the display area 10 and/or a side close to the display area 10, specifically, taking a structure that the hollow portion 420 includes four annular grooves 422 disposed around the display area 10 as an example, as shown in fig. 2, the hollow portion 420 is disposed on a side of the TFT barrier 230 away from the display area 10, and the hollow portion 420 is closer to an edge of the display panel, which is beneficial for blocking cracks during cutting; as shown in fig. 3, the hollow portion 420 is disposed on a side of the TFT barrier 230 close to the display area 10, obviously, the hollow portion 420 is closer to the display area 10, which is more beneficial to sealing and protecting functional layers such as the organic light emitting layer 300 in the display panel; as shown in fig. 4, the hollow portions 420 are disposed on both sides of the TFT barriers 230, which, although having the advantages of the two structures, requires hollowing all the portions of the first inorganic encapsulation layer 410 in the non-display area 20 and filling more of the anti-crack encapsulation members 430, consuming more material.
In this embodiment, the material of the encapsulation crack resistant member 430 is the same as the material of the organic encapsulation layer 440, and the encapsulation crack resistant member 430 and the organic encapsulation layer 440 are an integrally formed structure, which obviously simplifies the process of separately manufacturing the encapsulation crack resistant member 430 and improves the manufacturing efficiency.
To sum up, the display panel is provided with the hollow part 420 on the first inorganic packaging layer 410, and is combined with the structure that the packaging anti-cracking piece 430 is filled in the hollow part 420, so that the stress of the packaging film of the display panel in the cutting process or the bending process is well dispersed, the tearing risk of the inorganic layer part in the packaging film is reduced, the packaging performance of the packaging film is improved, and the narrow frame of the OLED display panel is more facilitated.
The embodiment of the application also provides a manufacturing method of the display panel, wherein the display panel comprises a display area 10 and a non-display area 20 arranged around the display area 10; as shown in fig. 7, the method comprises the following steps:
step S10: providing a substrate 100, and forming a TFT layer 200 on the substrate 100;
step S20: forming an organic light emitting layer 300 positioned in the display region 10 on the TFT layer 200; and
step S30: forming a thin film encapsulation layer 400 covering the organic light emitting layer 300 on the TFT layer 200 and the organic light emitting layer 300;
in the step S30, the forming of the thin film encapsulation layer 400 on the TFT layer 200 and the organic light emitting layer 300 to cover the organic light emitting layer 300 includes:
step S31: forming a first inorganic encapsulation layer 410 covering the organic light emitting layer 300 on the TFT layer 200 and the organic light emitting layer 300, forming a hollow portion 420 positioned in the non-display area 20 on the first inorganic encapsulation layer 410, wherein the hollow portion 420 is disposed around the display area 10, forming a package anti-crack member 430 in the hollow portion 420, and an upper end of the package anti-crack member 430 is flush with an upper surface of the first inorganic encapsulation layer 410;
step S32: forming an organic encapsulation layer 440 at least corresponding to the display region 10 on the first inorganic encapsulation layer 410; and
step S33: a second inorganic encapsulation layer 450 covering the organic encapsulation layer 440 is formed on the first inorganic encapsulation layer 410, the encapsulation crack resistant member 430, and the organic encapsulation layer 440.
In this embodiment, in step S31: the forming of the hollow portion 420 on the first inorganic encapsulation layer 410 in the non-display area 20, the hollow portion 420 being disposed around the display area 10, and the forming of the encapsulation crack resistant member 430 in the hollow portion 420 includes:
forming a hollow portion 420 located in the non-display area 20 on the first inorganic encapsulation layer 410 by means of exposure, development or dry etching, wherein the hollow portion 420 is disposed around the display area 10;
an encapsulation crack preventing member 430 is formed in the hollow part 420 by means of inkjet printing.
It is understood that the material for manufacturing the encapsulation crack-resistant member 430 and the material for manufacturing the organic encapsulation layer 440 may be the same material, and the encapsulation crack-resistant member 430 and the organic encapsulation layer 440 may be integrally formed by the same inkjet printing process; the mask may be manufactured by exposure and development using an HTM (half tone mask).
In summary, in the manufacturing method of the display panel of the present application, each part structure (including the hollow part 420 and the anti-crack package 430) is manufactured by a mature process method, the manufacturing processes of the hollow part 420 and the anti-crack package 430 are simple, the yield is high, and the manufacturing method is suitable for batch manufacturing,
to sum up, the hollow part 420 is arranged on the first inorganic packaging layer 410 and combined with the structure that the packaging anti-cracking piece 430 is filled in the hollow part 420, so that the stress of the packaging film of the display panel in the cutting process or the bending process is well dispersed, the tearing risk of the inorganic layer part in the packaging film is reduced, the packaging performance of the packaging film is improved, and the narrow frame of the OLED display panel is more facilitated.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
The above embodiments of the present application are described in detail, and specific examples are applied in the present application to explain the principles and implementations of the present application, and the description of the above embodiments is only used to help understand the technical solutions and core ideas of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.
Claims (10)
1. A display panel characterized by comprising a display area and a non-display area provided around the display area;
the display panel includes the base plate, locates TFT layer on the base plate, locate on the TFT layer and be located organic luminescent layer in the display area and locate the TFT layer with on the organic luminescent layer and cover the film packaging layer of organic luminescent layer, the film packaging layer includes:
the first inorganic packaging layer is arranged on the TFT layer and the organic light emitting layer and covers the organic light emitting layer, a hollow part located in the non-display area is arranged on the first inorganic packaging layer and surrounds the display area, a packaging anti-cracking piece is filled in the hollow part, and the upper end of the packaging anti-cracking piece is flush with the upper surface of the first inorganic packaging layer;
the organic packaging layer is arranged on the first inorganic packaging layer and at least corresponds to the display area; and
and the second inorganic packaging layer is arranged on the first inorganic packaging layer, the packaging crack-resistant piece and the organic packaging layer and covers the organic packaging layer.
2. The display panel of claim 1, wherein the hollowed-out portion comprises at least two circles of grooves surrounding the display area, the two adjacent circles of grooves are arranged at intervals, and the package crack resistant members are filled in each groove.
3. The display panel according to claim 2, wherein a cross section of the groove in a direction parallel to the substrate is circular or rectangular.
4. The display panel of claim 1, wherein the hollowed-out portion comprises at least two annular grooves surrounding the display area, and each annular groove is filled with the encapsulation crack resistant member.
5. The display panel of claim 1, wherein the TFT layer comprises a TFT array layer in the display region, and a TFT routing layer and a TFT blocking member in the non-display region, the TFT routing layer has a blocking groove, the TFT blocking member is disposed in the blocking groove and protrudes from the TFT routing layer, and the first inorganic encapsulation layer is disposed on the TFT array layer, the TFT routing layer, the TFT blocking member, and the organic light emitting layer and covers the organic light emitting layer.
6. The display panel of claim 5, wherein the hollow portion is disposed on a side of the TFT barrier away from the display area and/or a side of the TFT barrier close to the display area.
7. The display panel of claim 1, wherein the material of the encapsulation crack resistant member is the same as the material of the organic encapsulation layer, and the encapsulation crack resistant member and the organic encapsulation layer are of an integrally molded structure.
8. The display panel of claim 7, wherein the material of the encapsulation crack resistant member is polyacrylate, polycarbonate, acrylate, or polystyrene.
9. The manufacturing method of the display panel is characterized in that the display panel comprises a display area and a non-display area arranged around the display area; the method comprises the following steps:
providing a substrate, and forming a TFT layer on the substrate;
forming an organic light emitting layer positioned in the display region on the TFT layer; and
forming a thin film encapsulation layer covering the organic light emitting layer on the TFT layer and the organic light emitting layer;
the forming of the thin film encapsulation layer covering the organic light emitting layer on the TFT layer and the organic light emitting layer includes:
forming a first inorganic packaging layer covering the organic light emitting layer on the TFT layer and the organic light emitting layer, forming a hollow part positioned in the non-display area on the first inorganic packaging layer, wherein the hollow part is arranged around the display area, forming a packaging anti-cracking piece in the hollow part, and the upper end of the packaging anti-cracking piece is flush with the upper surface of the first inorganic packaging layer;
forming an organic encapsulation layer at least corresponding to the display region on the first inorganic encapsulation layer; and
and forming a second inorganic packaging layer covering the organic packaging layer on the first inorganic packaging layer, the packaging crack resistant member and the organic packaging layer.
10. A manufacturing method of a display panel is characterized in that a hollow-out portion located in a non-display area is formed on a first inorganic packaging layer, the hollow-out portion is arranged around the display area, and a packaging anti-cracking piece is formed in the hollow-out portion, and the manufacturing method comprises the following steps:
forming a hollow-out part positioned in the non-display area on the first inorganic packaging layer in an exposure development or dry etching mode, wherein the hollow-out part is arranged around the display area;
and forming a packaging anti-cracking part in the hollow part in an ink-jet printing mode.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112038356A (en) * | 2020-08-31 | 2020-12-04 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
| CN112563431A (en) * | 2020-12-03 | 2021-03-26 | 惠州Tcl移动通信有限公司 | Curved surface display device and electronic equipment |
| CN112599693A (en) * | 2020-12-07 | 2021-04-02 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN113471262A (en) * | 2021-06-30 | 2021-10-01 | 武汉华星光电半导体显示技术有限公司 | Display panel and display device |
| CN115275044A (en) * | 2022-07-18 | 2022-11-01 | 武汉华星光电半导体显示技术有限公司 | Display panel |
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| WO2022041337A1 (en) * | 2020-08-31 | 2022-03-03 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
| CN112038356B (en) * | 2020-08-31 | 2023-03-21 | 武汉华星光电半导体显示技术有限公司 | Flexible display panel |
| US11917889B2 (en) | 2020-08-31 | 2024-02-27 | Wuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd. | Flexible display panel with hollow structure |
| CN112563431A (en) * | 2020-12-03 | 2021-03-26 | 惠州Tcl移动通信有限公司 | Curved surface display device and electronic equipment |
| CN112599693A (en) * | 2020-12-07 | 2021-04-02 | 合肥维信诺科技有限公司 | Display panel and display device |
| CN112599693B (en) * | 2020-12-07 | 2022-09-06 | 合肥维信诺科技有限公司 | Display panel and display device |
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| CN115275044A (en) * | 2022-07-18 | 2022-11-01 | 武汉华星光电半导体显示技术有限公司 | Display panel |
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Application publication date: 20200508 |