CN111101175A - Method for forming electroplated copper on surface of non-metal material - Google Patents
Method for forming electroplated copper on surface of non-metal material Download PDFInfo
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- CN111101175A CN111101175A CN201811249064.XA CN201811249064A CN111101175A CN 111101175 A CN111101175 A CN 111101175A CN 201811249064 A CN201811249064 A CN 201811249064A CN 111101175 A CN111101175 A CN 111101175A
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- 239000007769 metal material Substances 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 45
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 39
- 239000010949 copper Substances 0.000 title claims abstract description 39
- 229910052755 nonmetal Inorganic materials 0.000 title claims description 11
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- 239000000178 monomer Substances 0.000 claims description 8
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- 239000003431 cross linking reagent Substances 0.000 claims description 7
- 239000002270 dispersing agent Substances 0.000 claims description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 150000001350 alkyl halides Chemical class 0.000 claims description 6
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- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 5
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- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 3
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
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- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
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- 230000008569 process Effects 0.000 abstract description 7
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- JOPOVCBBYLSVDA-UHFFFAOYSA-N chromium(6+) Chemical compound [Cr+6] JOPOVCBBYLSVDA-UHFFFAOYSA-N 0.000 description 6
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
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- 238000005516 engineering process Methods 0.000 description 4
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 4
- 229940117975 chromium trioxide Drugs 0.000 description 3
- WGLPBDUCMAPZCE-UHFFFAOYSA-N chromium trioxide Inorganic materials O=[Cr](=O)=O WGLPBDUCMAPZCE-UHFFFAOYSA-N 0.000 description 3
- GAMDZJFZMJECOS-UHFFFAOYSA-N chromium(6+);oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Cr+6] GAMDZJFZMJECOS-UHFFFAOYSA-N 0.000 description 3
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- VQWFNAGFNGABOH-UHFFFAOYSA-K chromium(iii) hydroxide Chemical compound [OH-].[OH-].[OH-].[Cr+3] VQWFNAGFNGABOH-UHFFFAOYSA-K 0.000 description 1
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Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/54—Electroplating of non-metallic surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/52—Electrically conductive inks
Abstract
The invention provides a method for forming electroplated copper on the surface of a non-metallic material, which comprises the steps of preparing graphene-based electroplating ink by using modified functionalized graphene, spraying the graphene-based electroplating ink on the surface of the non-metallic material, drying the graphene-based electroplating ink sprayed on the surface of the non-metallic material, and forming a layer of electroplated copper on the surface of the graphene-based electroplating ink by an electroplating process; the method uses the graphene-based electroplating ink as a conductor of the electroplated copper, enhances the bonding force between the functionalized graphene contained in the graphene-based electroplating ink and the non-metallic material by a modification means, does not need to use heavy metal as a catalyst in an electroplating process, has the advantages of environmental protection and low cost, has excellent adhesiveness and more flexibility, and can be reliably adhered to the surface of the non-metallic material and used as an adhesive between the electroplated copper and the non-metallic material.
Description
Technical Field
The invention relates to the technical field of copper electroplating, in particular to a method for forming copper electroplating on the surface of a non-metallic material.
Background
Electroplating has been widely used in industries on non-metallic materials (plastics, ceramics, glass, wood, etc.), and techniques of electroplating on non-metallic materials have been widely used in many products and industries such as automobiles, consumer goods, pipes, toys, foods and beverages, and cosmetics, because of the characteristics of corrosion resistance, toughness, wear resistance, and aesthetic appearance of the electroplated surfaces.
Conventional electroplating procedures for non-metallic materials generally involve two steps: surface pretreatment and metal plating. Surface preparation involves several chemical treatments and reaction procedures, such as cleaning (cleaning), etching (etching), sensitization (sensitization), activation (activation) and acceleration (neutralization). The surface is roughened using a strong oxidizing agent such as Chromium trioxide (Chromium trioxide) and sulfuric acid mixtures to obtain good mechanical adhesion, as well as creating microvoids to act as adhesion sites between the metal and the substrate.
The prior art pretreats the surface of non-metallic materials with a mixture of chromium trioxide, sulfuric acid and water, or a mixture of these inorganic components and phosphoric acid. However, this method has many disadvantages in that hexavalent chromium contained in the pretreatment solution is a carcinogen with genetic toxicity, and has a high risk. Workers exposed to hexavalent chromium are at risk of suffering lung cancer, asthma or damage to the nasal epithelium and skin. The use of hexavalent chromium may cause long-term environmental pollution and is widely banned in the electronics industry in the united states, europe and china. At the same time as the neutralization, large amounts of chromium hydroxide are formed, which treatment considerably hinders the removal of the compositions used. Furthermore, the pretreatment solution of the known method is very corrosive and requires a large amount of water to completely remove it from the surface of the non-metallic material. In addition, the conventional surface pretreatment process before electroplating is complicated and time-consuming. Because of the treatment of the pretreatment solution and the composition used therewith, it is necessary to reduce the hexavalent chromium compounds and to neutralize the reduction products in order to make it easier to treat the used pretreatment solution.
Disclosure of Invention
The technical problem to be solved by the invention is to provide a method for forming electroplated copper on the surface of a non-metallic material.
The invention finds that the conductivity of the functional graphene can be applied to the electroplating process of metal copper, and based on solving the technical problems, the invention discloses a preferable scheme of a method for forming electroplated copper on the surface of a non-metal material, which comprises the following steps:
preparing graphene-based electroplating ink;
spraying the graphene-based electroplating ink on the surface of a non-metallic material;
drying the graphene-based electroplating ink sprayed on the surface of the non-metallic material for 5-30 minutes at the temperature of 50-200 ℃; and
and soaking the non-metal material with the graphene-based electroplating ink on the surface in an electroplating solution, and applying voltage or current to form electroplated copper on the graphene-based electroplating ink.
Wherein the non-metallic material comprises: any one of plastic, ceramic, wood, glass, and cloth.
Wherein the graphene-based electroplating ink is a mixture consisting of functionalized graphene, a dispersant, a thickener (thickener), and a solvent, wherein the surface of the functionalized graphene contains an oxygen functional group, and the oxygen content of the functionalized graphene containing an oxygen functional group is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing an oxygen functional group.
Wherein the surface of the functionalized graphene contains: any one of amino (amino), hydroxyl (hydroxyl), carboxyl (carboxyl), double bond (double bond), triple bond (triple bond) and alkyl halide (haloalkone).
In a further preferred embodiment of the method for forming electrolytic copper plating on a surface of a non-metallic material of the present invention, the method comprises: a step of modifying the functionalized graphene by any one of binders (binders), cross-linkers (cross-linkers), monomers (monomers), oligomers (oligomers), and polymers (polymers).
The binders, crosslinkers, monomers, oligomers and polymers contain at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double, triple, and haloalkane functional groups.
Wherein a preferred embodiment of the mixture as a graphene-based electroplating ink further comprises: a crosslinking agent and an initiator (initiators).
Wherein the functionalized graphene is further doped with any one or a combination of nitrogen (N), sulfur (S), boron (B), fluorine (F) and phosphorus (P).
Wherein the functionalized graphene contains the combination of elements in an amount of 1 wt% to 20 wt% of the total weight of the functionalized graphene.
Wherein the mixture as the graphene-based electroplating ink further comprises: an adhesive (adhesive) made of a polymer or resin or binder (binders) in an amount of 0.1 to 30 wt% of the total weight of the graphene-based electroplating ink.
The method for forming the electroplated copper on the surface of the non-metallic material has the advantages that the method can provide a substitution scheme for the heavy metal catalyst used in the existing process for electroplating copper on the surface of the non-metallic material, realizes the aim of not using hexavalent chromium and palladium as catalysts, and has the advantages of environmental protection, low cost and time saving.
Other features and embodiments of the present invention will be described in detail below with reference to the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a cross-sectional view of an electroplated copper structure formed by the method of the present invention for forming electroplated copper on the surface of a non-metallic material;
FIG. 2 is a flow chart showing the steps of the method of forming electroplated copper on the surface of a non-metallic material according to the present invention;
FIGS. 3A and 3B are schematic views of the structure according to the steps of the method of the present invention;
FIGS. 4A and 4B are functional diagrams of the present invention, respectively showing the microstructure of the electroplated copper structure formed on the surface of the non-metallic material before and after stretching;
fig. 5 is a diagram illustrating an exemplary embodiment of the present invention.
Description of the symbols
10 nonmetal material 20 graphene-based electroplating ink
30 electro-coppering 40 functionalized graphene
41 Binder and/or crosslinking agent
Detailed Description
The positional relationship described in the following embodiments includes: the top, bottom, left and right, unless otherwise indicated, are based on the orientation of the elements in the drawings.
Referring to fig. 1, a cross-sectional view of an electroplated copper structure formed by the method of forming electroplated copper on the surface of a non-metal material according to the present invention is shown.
In one embodiment as shown in fig. 1, the electroplated copper structure on the surface of the non-metallic material comprises: the non-metallic material comprises a non-metallic material 10, a graphene-based plating ink 20 adhered to the surface of the non-metallic material 10, and a copper plate 30 formed on the graphene-based plating ink 20 by a plating process.
The preferred embodiment of the method for forming electroplated copper on the surface of the non-metallic material of the present invention comprises the following steps:
a. preparing a graphene-based electroplating ink 20;
b. spraying the graphene-based electroplating ink 20 on the surface of a non-metallic material 10 (see fig. 3A);
c. drying the graphene-based electroplating ink 20 sprayed on the surface of the non-metallic material 10 for 5-30 minutes at 50-200 ℃; and
d. the non-metallic material 10 having the graphene-based plating ink 20 on the surface thereof is soaked in a plating solution, and a plated copper 30 is formed on the graphene-based plating ink 20 by applying a voltage or a current (see fig. 3B).
In a further preferred embodiment of the method for forming electrolytic copper plating on a surface of a non-metallic material of the present invention, the method comprises: a step of modifying the functionalized graphene by any one of binders (binders), cross-linkers (cross-linkers), monomers (monomers), oligomers (oligomers), and polymers (polymers). The modification step can enhance the adhesion between the functionalized graphene contained in the graphene-based electroplating ink 20 and the non-metallic material 10. The binder, the crosslinking agent, the monomer, the oligomer and the polymer contain at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond and haloalkane functional groups, so as to enhance the adhesion between the functionalized graphene contained in the graphene-based electroplating ink 20 and the non-metallic material 10.
Wherein the non-metallic material 10 may be: any one of plastic, ceramic, wood, glass, and cloth.
One preferred embodiment of the graphene-based electroplating ink 20 is a mixture of functionalized graphene (functionalized graphene), dispersants (dispersants), thickeners (thickeners), and solvents (solvents). Wherein the surface of the functionalized graphene contains an oxygen functional group, and the oxygen content of the functionalized graphene containing an oxygen functional group is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing an oxygen functional group. As another preferred embodiment of the functionalized graphene, wherein the surface of the functionalized graphene contains: any one of amino (amino), hydroxyl (hydroxyl), carboxyl (carboxyl), double bond (double bond), triple bond (triple bond) and alkyl halide (haloalkone).
As a preferred embodiment of the mixture of the graphene-based electroplating ink 20, the functionalized graphene is contained in an amount of 0.5 wt% to 30 wt% of the mixture. The content of the dispersant accounts for 0.05 to 20 weight percent of the mixture, and the dispersant can be ionic or non-ionic dispersant. The solvent can be selected from organic, inorganic or aqueous systems and accounts for 30-90 wt% of the mixture. The thickener can also be used to make a high viscosity graphene-based electroplating ink 20 in an amount of 0.01 wt% to 10 wt% of the mixture.
Wherein a preferred embodiment of the mixture as the graphene-based plating ink 20 further comprises: cross-linking agents (crosslinkers) and initiators (initiators).
Wherein another preferred embodiment of the mixture as the graphene-based electroplating ink 20 further comprises: an adhesive (adhesive) made of a polymer or resin or binder (binders) in an amount of 0.1 to 30 wt% of the total weight of the graphene-based electroplating ink.
Wherein the functionalized graphene is further doped with any one or a combination of nitrogen (N), sulfur (S), boron (B), fluorine (F) and phosphorus (P). Wherein the functionalized graphene contains the combination of elements in an amount of 1 wt% to 20 wt% of the total weight of the functionalized graphene.
Please refer to fig. 4A and 4B. As can be seen from fig. 4A, the layered structure of the functionalized graphene 40 in the graphene-based plating ink 20 is not broken before and after stretching by the action of the binder and/or the crosslinking agent 41 mixed between the functionalized graphene 40, and the functionalized graphene 40 in the graphene-based plating ink 20 can be reliably adhered to the surface of the non-metallic material 10 and can be used as an adhesive between the copper plating 30 and the non-metallic material 10.
Example 1
Please refer to fig. 5, which is a diagram illustrating an exemplary implementation of the method of the present invention. As an example of the method for forming electroplated copper on the surface of the non-metal material according to the present invention, plastic is selected as the non-metal material 10, the graphene-based electroplating ink 20 is applied on the surface of the non-metal material 10, please refer to fig. 5(a), then dried in an oven at 100 ℃ for 20 minutes, after the drying is completed, the non-metal material 10 with the graphene-based electroplating ink 20 adhered on the surface is placed in an electroplating solution for 30 to 120 minutes, and an electroplated copper 30 is formed on the graphene-based electroplating ink 20 by applying a voltage or a current, please refer to fig. 5 (B).
The method for forming the electroplated copper on the surface of the non-metallic material has the advantages that the method can provide a substitution scheme for the heavy metal catalyst used in the existing process for electroplating copper on the surface of the non-metallic material, realizes the aim of not using hexavalent chromium and palladium as catalysts, and has the advantages of environmental protection, low cost and time saving. On the other hand, the modification step can enhance the adhesion between the functionalized graphene contained in the graphene-based electroplating ink 20 and the non-metallic material 10.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art may make modifications or changes to other equivalent embodiments without departing from the scope of the technical means disclosed in the present disclosure, but should be construed as the technology or implementations substantially the same as the present technology.
Claims (11)
1. A method of forming electroplated copper on a surface of a non-metallic material, comprising:
preparing graphene-based electroplating ink;
spraying the graphene-based electroplating ink on the surface of a non-metallic material;
drying the graphene-based electroplating ink sprayed on the surface of the non-metallic material for 5-30 minutes at 50-200 ℃; and
and soaking the non-metal material with the graphene-based electroplating ink on the surface in an electroplating solution, and applying voltage or current to form electroplated copper on the graphene-based electroplating ink.
2. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 1, wherein: the non-metallic material comprises: any one of plastic, ceramic, wood, glass, and cloth.
3. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 1, wherein: the graphene-based electroplating ink is a mixture consisting of functionalized graphene, a dispersant, a thickener and a solvent.
4. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the surface of the functionalized graphene contains oxygen functional groups, and the oxygen content of the functionalized graphene containing oxygen functional groups is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing oxygen functional groups.
5. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the surface of the functionalized graphene contains: any one functional group of amino, hydroxyl, carboxyl, double bond, triple bond and alkyl halide.
6. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: comprising the step of modifying the functionalized graphene with any one of a binder, a cross-linking agent, a monomer, an oligomer and a polymer.
7. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 6, wherein: the binder, the crosslinker, the monomer, the oligomer, and the polymer contain at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond, and haloalkane functional groups.
8. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the mixture as the graphene-based electroplating ink further comprises: a cross-linking agent and an initiator.
9. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 3, wherein: the functionalized graphene is further doped with any one or combination of nitrogen, sulfur, boron, fluorine and phosphorus.
10. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 9, wherein: the content of the combination of elements contained in the functionalized graphene is 1 wt% to 20 wt% of the total weight of the functionalized graphene.
11. The method of forming electroplated copper on the surface of non-metallic material as recited in claim 1, wherein: the mixture as the graphene-based electroplating ink further comprises: an adhesive made of a polymer or a resin or a binder, the content of the adhesive being 0.1 wt% to 30 wt% of the total weight of the graphene-based electroplating ink.
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