CN111093348A - Liquid cooling case and method based on 3U-VPX - Google Patents
Liquid cooling case and method based on 3U-VPX Download PDFInfo
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- CN111093348A CN111093348A CN201911387814.4A CN201911387814A CN111093348A CN 111093348 A CN111093348 A CN 111093348A CN 201911387814 A CN201911387814 A CN 201911387814A CN 111093348 A CN111093348 A CN 111093348A
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- liquid cooling
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20272—Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
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Abstract
The invention relates to the technical field of power supply heat dissipation, and discloses a liquid cooling case based on 3U-VPX and a method, wherein the liquid cooling case adopted by the method comprises the following steps: the inner division fluid connector comprises a cover plate, a left side plate, a right side plate, a front panel, a rear panel, a bottom plate and a TSF; the bottom plate is of a rectangular structure, and a heat exchange flow channel are respectively arranged on two sides of the rectangular structure bottom plate; the heat exchange flow channel is parallel to the heat exchange flow channel, and the heat exchange flow channel is communicated with the heat exchange flow channel through a plurality of TSF internal division fluid connectors to form a liquid cooling heat exchange converging channel of the liquid cooling case; one end of the upper heat exchange flow channel on the bottom plate is communicated with the TSA external fluid connector; the end of the base plate out of the heat exchange flow path communicates with an external TSA fluid connector. The invention has strong heat dissipation capability through the liquid cooling heat dissipation technology, can meet the liquid supply requirement of the high-power supply heat dissipation liquid for cooling and heating, obviously improves the heat dissipation capability of the power supply, enables the power supply power to be larger, and has wide application prospect.
Description
Technical Field
The invention relates to the technical field of power supply heat dissipation, in particular to a liquid cooling case based on 3U-VPX and a method.
Background
With the development of miniaturization of power modules, the heat density of the modules is higher and higher, the traditional power heat dissipation mode mostly adopts air-cooling and air-cooling heat dissipation, and the heat dissipation capacity is limited, so that the output power of the power supply is limited. In addition, the demand of high-power 3U-VPX power supply is increasing, and the corresponding chassis demand is also increasing.
Disclosure of Invention
In view of the above technical problems, an object of the present invention is to provide a liquid-cooled chassis and method based on 3U-VPX, which can significantly improve the power supply heat dissipation capability and increase the power supply power by the liquid-cooled heat dissipation technology.
In order to achieve the purpose, the invention adopts the following technical scheme:
a liquid cooling machine case based on 3U-VPX comprises: a cover plate 3, a left side plate 1, a right side plate 4, a front plate 5, a rear plate 2, a bottom plate 8, a TSA external fluid connector 6, a TSF internal fluid connector 7;
the bottom plate 8 is of a rectangular structure, and a heat inlet exchange flow channel 8.1 and a heat outlet exchange flow channel 8.2 are respectively arranged on two sides of the rectangular structure bottom plate 8; the heat inlet exchange flow channel 8.1 is parallel to the heat outlet exchange flow channel 8.2, and the heat inlet exchange flow channel 8.1 is communicated with the heat outlet exchange flow channel 8.2 through a plurality of TSF internal division fluid connectors 7 to form a liquid cooling heat exchange converging channel of the liquid cooling case; one end of the upper heat exchange flow channel 8.1 on the bottom plate is communicated with the TSA outer fluid connector 6 to form a liquid cooling inlet end of the liquid cooling case; one end of the heat exchange flow channel 8.2 on the bottom plate is communicated with the TSA external fluid connector 6 to form a liquid cooling outlet end of the liquid cooling cabinet.
A fixed socket of a board card 7.1 or a power supply card is arranged on a TSF internal branching connector 7 based on a 3U-VPX liquid cooling case.
A liquid cooling heat exchange method based on a 3U-VPX liquid cooling case comprises the following steps: liquid cooling circulating liquid enters a bottom plate confluence channel through a TSA external fluid connector 6 at a liquid cooling inlet end of a liquid cooling case, the liquid cooling circulating liquid flows into each board card 7.1 and each power supply card 7.2 arranged on each TSF internal fluid connector 7 through a plurality of TSF internal fluid connectors 7 from a heat exchange flow channel 8.1 for heat exchange, then flows back from the other end to a heat exchange flow channel 8.2, and flows out through a liquid cooling outlet end of the liquid cooling case of the TSA external fluid connector 6 for confluence, so that one liquid cooling circulation is completed, and heat of the case and the internal board cards is taken away;
the design key points of liquid cooling machine case:
(1) for the fluid connector, the fluid connector bears 5-8 kg of pressure in a connection state, is strictly sealed, can be quickly self-sealed in butt joint and separation, and avoids the pollution of cooling liquid to a circuit board;
(2) the chassis slot is guided, so that the verticality and reliability of plugging between the power board card and the bottom plate and between the power board card liquid cooling connector and the chassis liquid cooling connector are ensured;
(3) the fit tolerance is considered, the butt joint of the power connector plug and the socket, the effective fixation of the pulling plate clamp, the effective butt joint of the fluid connector and the fixed fit of the back plate are realized;
(4) the straight flow channel cavities of the front wall plate and the rear wall plate of the liquid cooling case are just right opposite to the side wall of the guide groove, so that the cold plate module can be conveniently inserted and then conducted to the side wall of the guide groove of the front wall plate and the rear wall plate to perform heat convection.
Due to the adoption of the technical scheme, the invention has the following advantages:
A3U-VPX liquid cooling case and a method thereof can meet the liquid supply requirement of high-power 3U-VPX power supply heat dissipation liquid cooling and provide power and a communication interface. Through the liquid cooling heat dissipation technology, the power supply heat dissipation capacity can be remarkably improved, and the power supply power can be larger. The invention is designed according to VATA48, has small size, light weight, strong heat dissipation capability and convenient disassembly, assembly and maintenance, solves the heat dissipation problem of the high-power VPX-3U power supply, and controls the overall temperature of the power supply within a more reasonable temperature range. And has wide application prospect in the aspect of heat dissipation of high-power supplies.
Drawings
FIG. 1 is a schematic view of a liquid cooling enclosure assembly;
FIG. 2 is a top plan view of a base plate of the liquid-cooled enclosure;
FIG. 3 is a schematic view of the overall flow path of a liquid cooled enclosure.
Detailed Description
This patent is further described below with reference to figures 1, 2 and 3.
Example 1
As shown in fig. 1, a liquid cooling cabinet based on 3U-VPX includes: a cover plate 3, a left side plate 1, a right side plate 4, a front plate 5, a rear plate 2, a bottom plate 8, a TSA external fluid connector 6, a TSF internal fluid connector 7;
the bottom plate 8 is of a rectangular structure, and a heat inlet exchange flow channel 8.1 and a heat outlet exchange flow channel 8.2 are respectively arranged on two sides of the rectangular structure bottom plate 8; the heat inlet exchange flow channel 8.1 is parallel to the heat outlet exchange flow channel 8.2, and the heat inlet exchange flow channel 8.1 is communicated with the heat outlet exchange flow channel 8.2 through a plurality of TSF internal division fluid connectors 7 to form a liquid cooling heat exchange converging channel of the liquid cooling case; one end of the upper heat exchange flow channel 8.1 on the bottom plate is communicated with the TSA outer fluid connector 6 to form a liquid cooling inlet end of the liquid cooling case; one end of the heat exchange flow channel 8.2 on the bottom plate is communicated with the TSA external fluid connector 6 to form a liquid cooling outlet end of the liquid cooling cabinet.
And a fixed socket of a functional board card 7.1 or a power supply board card 7.2 is arranged on the TSF internal shunting connector 7. The liquid cooling circulating liquid is low-temperature-65-degree liquid cooling antifreezing liquid.
A liquid cooling heat exchange method based on a 3U-VPX liquid cooling case comprises the following steps: liquid cooling circulating liquid enters a bottom plate confluence channel through a TSA external fluid connector 6 at a liquid cooling inlet end of a liquid cooling case, the liquid cooling circulating liquid flows into each functional board card 7.1 and each power board card 7.2 arranged on each TSF internal fluid connector 7 through a plurality of TSF internal shunting fluid connectors 7 from a heat inlet exchange flow channel 8.1 for heat exchange, then flows back from the other end to a heat outlet exchange flow channel 8.2, and flows out through a liquid cooling outlet end of the liquid cooling case of the TSA external fluid connector 6 for confluence, so that one liquid cooling circulation is completed, and heat of the case and the internal board cards is taken away; as shown in fig. 3.
Meanwhile, the design of the liquid cooling case also considers the following elements:
(1) for the fluid connector, not only a certain pressure is guaranteed to be borne and strictly sealed in a connection state, but also the connector can be quickly self-sealed in butt joint and separation, so that the pollution of cooling liquid to a circuit board is avoided;
(2) the chassis slot is guided, so that the verticality and reliability of plugging between the power board card and the bottom plate and between the power board card liquid cooling connector and the chassis liquid cooling connector are ensured;
(3) the matching tolerance is considered, the butt joint of a power supply power connector plug and a socket, the effective fixation of a pulling plate clamp, the effective butt joint of a fluid connector, the fixed matching of a back plate and the like are realized;
(4) the straight flow channel cavity of the front wall plate and the rear wall plate of the liquid cooling case is just right opposite to the side wall of the guide groove, so that the cold plate module can be conveniently conducted to the side wall of the guide groove of the front wall plate and the rear wall plate after being inserted, and then convective heat transfer is carried out.
The circulating liquid enters the bottom plate confluence channel through the fluid connector at one end, flows into each board card through the shunt fluid connector for heat exchange, and then flows back from the other end and is confluent to complete one cycle, so that heat is taken away.
Wherein, two main flow branches of the bottom plate, one main branch enters a heat exchange flow channel 8.1 and supplies liquid to a power supply board card and a function board card through 4 cavities, and fluid flowing through 4 cold plates is converged in the other main branch outlet heat exchange flow channel 8.2 and finally flows out through an outer fluid connector of a liquid outlet and an outlet end. As can be seen from the figure, the flow channel of the liquid cooling power supply board card after being matched with the chassis is as follows: outer fluid connector of inlet end → inlet port → inner fluid connector of inlet side → cold plate fluid connector of power supply → cold plate fluid connector of outlet side → inner fluid connector of outlet side → outer fluid connector of outlet side.
The invention is designed according to VATA48, has small size, light weight, strong heat dissipation capability and convenient disassembly, assembly and maintenance, and has wide application prospect in the aspect of heat dissipation of high-power supplies.
Claims (4)
1. A liquid cooling machine case based on 3U-VPX is characterized in that: the method comprises the following steps: a cover plate 3, a left side plate 1, a right side plate 4, a front plate 5, a rear plate 2, a bottom plate 8, a TSA external fluid connector 6, a TSF internal fluid connector 7; the bottom plate 8 is of a rectangular structure, and a heat inlet exchange flow channel 8.1 and a heat outlet exchange flow channel 8.2 are respectively arranged on two sides of the rectangular structure bottom plate 8; the heat inlet exchange flow channel 8.1 is parallel to the heat outlet exchange flow channel 8.2, and the heat inlet exchange flow channel 8.1 is communicated with the heat outlet exchange flow channel 8.2 through a plurality of TSF internal division fluid connectors 7 to form a liquid cooling heat exchange converging channel of the liquid cooling case; one end of the upper heat exchange flow channel 8.1 on the bottom plate is communicated with the TSA outer fluid connector 6 to form a liquid cooling inlet end of the liquid cooling case; one end of the heat exchange flow channel 8.2 on the bottom plate is communicated with the TSA external fluid connector 6 to form a liquid cooling outlet end of the liquid cooling cabinet.
2. The 3U-VPX-based liquid cooled chassis of claim 1, wherein: and a fixed socket of a board card 7.1 or a power card is arranged on the TSF internal division fluid connector 7.
3. The 3U-VPX-based liquid cooled chassis of claim 1, wherein: the liquid cooling circulating liquid is low-temperature-65-degree liquid cooling antifreezing liquid.
4. The liquid cooling heat exchange method based on the 3U-VPX liquid cooling cabinet as claimed in claim 1, wherein: the method comprises the following steps: liquid cooling circulating liquid enters a bottom plate confluence channel through a TSA external fluid connector 6 at a liquid cooling inlet end of a liquid cooling case, the liquid cooling circulating liquid flows into each board card 7.1 and each power supply card 7.2 arranged on each TSF internal fluid connector 7 through a plurality of TSF internal fluid connectors 7 from a heat exchange flow channel 8.1 for heat exchange, then flows back from the other end to a heat exchange flow channel 8.2, and flows out through a liquid cooling outlet end of the liquid cooling case of the TSA external fluid connector 6 for confluence, so that one liquid cooling circulation is completed, and heat of the case and the internal board cards is taken away;
the design key points of liquid cooling machine case:
(1) for the fluid connector, the fluid connector bears 5-8 kg of pressure in a connection state, is strictly sealed, can be quickly self-sealed in butt joint and separation, and avoids the pollution of cooling liquid to a circuit board;
(2) the chassis slot is guided, so that the verticality and reliability of plugging between the power board card and the bottom plate and between the power board card liquid cooling connector and the chassis liquid cooling connector are ensured;
(3) the fit tolerance is considered, the butt joint of the power connector plug and the socket, the effective fixation of the pulling plate clamp, the effective butt joint of the fluid connector and the fixed fit of the back plate are realized;
(4) the straight flow channel cavities of the front wall plate and the rear wall plate of the liquid cooling case are just right opposite to the side wall of the guide groove, so that the cold plate module can be conveniently inserted and then conducted to the side wall of the guide groove of the front wall plate and the rear wall plate to perform heat convection.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911387814.4A CN111093348A (en) | 2019-12-30 | 2019-12-30 | Liquid cooling case and method based on 3U-VPX |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911387814.4A CN111093348A (en) | 2019-12-30 | 2019-12-30 | Liquid cooling case and method based on 3U-VPX |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040730A (en) * | 2020-08-31 | 2020-12-04 | 上海航天电子通讯设备研究所 | Array surface power supply liquid cooling plug box |
| CN113966152A (en) * | 2021-10-29 | 2022-01-21 | 中国电子科技集团公司第二十九研究所 | Three-dimensional shunting device and method for modular mixed liquid cooling rack |
| CN115426832A (en) * | 2022-08-10 | 2022-12-02 | 中国电子科技集团公司第二十九研究所 | Welding-free spliced shunting cold plate structure and liquid cooling case |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112040730A (en) * | 2020-08-31 | 2020-12-04 | 上海航天电子通讯设备研究所 | Array surface power supply liquid cooling plug box |
| CN112040730B (en) * | 2020-08-31 | 2023-01-20 | 上海航天电子通讯设备研究所 | Array surface power supply liquid cooling plug box |
| CN113966152A (en) * | 2021-10-29 | 2022-01-21 | 中国电子科技集团公司第二十九研究所 | Three-dimensional shunting device and method for modular mixed liquid cooling rack |
| CN113966152B (en) * | 2021-10-29 | 2023-05-05 | 中国电子科技集团公司第二十九研究所 | Three-dimensional flow dividing device and method for modularized mixed liquid cooling rack |
| CN115426832A (en) * | 2022-08-10 | 2022-12-02 | 中国电子科技集团公司第二十九研究所 | Welding-free spliced shunting cold plate structure and liquid cooling case |
| CN115426832B (en) * | 2022-08-10 | 2024-06-04 | 中国电子科技集团公司第二十九研究所 | Welding-free spliced split-flow cooling plate structure and liquid cooling machine box |
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Application publication date: 20200501 |