CN111090357B - Touch module, preparation method thereof and electronic equipment - Google Patents
Touch module, preparation method thereof and electronic equipment Download PDFInfo
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- CN111090357B CN111090357B CN201911164694.1A CN201911164694A CN111090357B CN 111090357 B CN111090357 B CN 111090357B CN 201911164694 A CN201911164694 A CN 201911164694A CN 111090357 B CN111090357 B CN 111090357B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
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Abstract
The invention relates to a touch module, a preparation method thereof and electronic equipment. The preparation method comprises the following steps: providing a stacked structure, wherein the stacked structure comprises a substrate, and a first conducting layer and a metal layer which are sequentially arranged on the substrate; etching the metal layer to form a first wire, a second wire and a plurality of metal connecting pads; etching the first conductive layer to form a first electrode, wherein the first electrode is electrically connected with the first routing; forming an insulating layer above the first electrode, wherein the insulating layer at least partially covers the area between the adjacent metal connecting pads, and the insulating layer can volatilize gas in a vacuum environment; forming a second conductive layer on the insulating layer and the metal connection pad; and etching the second conductive layer to form a second electrode, wherein the second electrode is electrically connected with the second routing wire. The preparation method can avoid short circuit caused by conduction of the adjacent metal connecting pads.
Description
Technical Field
The invention relates to the technical field of touch display, in particular to a touch module, a preparation method of the touch module and electronic equipment.
Background
In a SITO (Single ITO, Single conductive layer structure) process, a sensing electrode and an emission electrode are disposed on one side of a substrate. Aiming at the defects of the traditional diamond circuit design, such as poor lap joint of a metal bridge, and the like, researchers provide a new design scheme, an insulating protective layer is arranged between a sensing electrode and an emitting electrode, and the sensing electrode and the emitting electrode in the arrangement mode are positioned on different layers, so that the metal bridge does not need to be additionally arranged, the product yield is improved, and the process flow is simplified. The insulating protective layer may be made of TPF (Transparent Photosensitive Film).
The production process of the touch module comprises the following steps: (1) etching a copper connecting pad on an incoming material, wherein the incoming material comprises a substrate, a first ITO layer and a copper layer which are formed on the substrate; (2) etching a first electrode and a first wire on the first ITO layer, wherein the tail end of the first wire is overlapped with the copper connecting pad; (3) preparing a TPF layer covering the first electrode in the touch area; (4) forming a second ITO layer; (5) and etching a second electrode and a second wire on the second ITO layer by oxalic acid, wherein the tail end of the second wire is overlapped with the other copper connecting pad.
The areas where the first electrode and the second electrode are located are touch areas, and the area where the copper connecting pad is located is a binding area. And (4) forming crystalline ITO in the binding region in the step (4) because the TPF layer only covers the touch region, namely no TPF layer exists in the binding region. And the crystalline ITO is difficult to be etched by oxalic acid, so that a large amount of ITO is remained between the copper connecting pads after the oxalic acid etching treatment in the step (5), and the residual ITO causes the adjacent copper connecting pads to be mutually conducted to generate short circuit, thereby influencing the product yield.
Disclosure of Invention
Therefore, it is necessary to provide a touch module, a method for manufacturing the touch module, and an electronic device, in order to solve the problem that the residual ITO causes the adjacent copper connection pads to be electrically connected to each other and short-circuited.
A preparation method of a touch module comprises the following steps:
providing a stacked structure, wherein the stacked structure comprises a substrate, a first conducting layer and a metal layer, and the first conducting layer and the metal layer are sequentially arranged on the substrate;
etching the metal layer to form a first wire, a second wire and a plurality of metal connecting pads;
etching the first conductive layer to form a first electrode, wherein the first electrode is electrically connected with the first routing;
forming an insulating layer above the first electrode, wherein the insulating layer at least partially covers the area between the adjacent metal connecting pads, and the insulating layer can volatilize gas in a vacuum environment;
forming a second conductive layer on the insulating layer and the metal connection pad;
and etching the second conductive layer to form a second electrode, wherein the second electrode is electrically connected with the second routing wire.
According to the preparation method of the touch module, the design of the photomask is changed, and the insulating layer is formed in the area between the adjacent metal connecting pads. When the second conductive layer is formed by vacuum sputtering in step S500, the insulating layer can volatilize gas in a vacuum environment (i.e., an outgassing effect) to promote the material of the second conductive layer to be in an amorphous state, and the amorphous second conductive layer can be removed by etching with oxalic acid, so that the second conductive layer between adjacent metal connecting pads can be completely removed, thereby preventing the adjacent metal connecting pads from being in conduction and short-circuited.
In one embodiment, the material of the insulating layer includes an optically transparent material.
In one embodiment, the second conductive layer is made of indium tin oxide or indium zinc oxide.
In one embodiment, the insulating layer includes a main body portion and an isolation portion, the main body portion is located in a region where the first electrode is located, the isolation portion is located in a region between adjacent metal connection pads, the length of each metal connection pad is d, and the size of the isolation portion along the length direction of each metal connection pad is larger than or equal to d.
In one embodiment, the isolation portion comprises a plurality of rectangles, diamonds or hexagons arranged in a staggered manner.
In one embodiment, the partition is elongated.
In one embodiment, the isolation portion completely covers the area between the adjacent metal connection pads.
In one embodiment, the width of the spacer is greater than 30 μm.
A touch module is characterized by being prepared by the preparation method.
An electronic device comprises the touch module.
Drawings
Fig. 1 is a schematic structural diagram of a touch module according to an embodiment;
FIG. 2 is a flowchart illustrating a method for manufacturing a touch module according to an embodiment;
fig. 3A to 3E respectively correspond to cross-sectional views of the binding regions of the sample obtained in steps S100, S200, S300, S400, and S500 along the a-a direction in the method for manufacturing the touch module shown in fig. 2;
FIG. 4 is an enlarged view of a bonding area of the touch module shown in FIG. 1;
FIG. 5 is an enlarged view of a bonding area of a touch module according to another embodiment.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, an electronic device includes a touch module 100, and the electronic device may be a smart phone, a tablet computer, a liquid crystal television, a wearable device, and the like. The touch module 100 includes a substrate 10, a first electrode 20, a first trace 60, a metal connecting pad 30(Bonding pad), an insulating layer 40, a second electrode 50, and a second trace 70. The surface of the touch module 100 is divided into a touch area 100a, a bonding area 100b and a routing area (not shown), the area where the first electrode 20 and the second electrode 50 are located is the touch area 100a, the area where the metal connecting pad 30 is located is the bonding area 100b, the portions other than the touch area 100a and the bonding area 100b are routing areas, and the first routing 60 and the second routing 70 are both located in the routing area.
The substrate 10 is made of a transparent material, and may be glass, sapphire, transparent resin, transparent ceramic, or the like.
The first electrode 20 is disposed on the substrate 10 and extends along the X direction, and the first electrode 20 is electrically connected to the metal pad 30 through a first trace 60. The first electrode 20 and the second electrode 50 are stacked, the insulating layer 40 is disposed between the first electrode 20 and the second electrode 50, the insulating layer 40 is made of a Transparent Optical material, such as Optical Clear (OC), thermoplastic elastomer (TPF), and the like, and the insulating layer 40 can prevent signal interference between the first electrode 20 and the second electrode 50. The second electrode 50 extends along the Y direction on the insulating layer 40 to be overlapped with the first electrode 20 in an insulating manner, and the second electrode 50 is electrically connected to the metal connection pad 30 through a second trace 70.
A method for manufacturing a touch module 100 includes the following steps:
s100: referring to fig. 3A, a stacked structure is provided, which includes a substrate 10, and a first conductive layer 210 and a metal layer 220 sequentially disposed on the substrate 10.
Specifically, the first conductive layer 210 may be Indium Tin Oxide (ITO) or Indium zinc Oxide (izo), and the material of the metal layer 220 includes silver, copper, aluminum, and the like. The substrate may further include a strengthening layer (Hard coat, HC) and an optical adjustment layer (Index Matching, IM), the strengthening layer may prevent the substrate 10 from being scratched and prevent the substrate 10 from volatilizing gas, and the optical adjustment layer is used to improve the optical properties of the substrate 10, so that the optical effect of the ito layer plated on the substrate 10 is optimized.
S200: referring to fig. 3B, the metal layer 220 is etched to form a first trace 60, a second trace 70 and a plurality of metal pads 30.
The etching treatment specifically includes: a photoresist layer is formed on the metal layer 220, and the photoresist layer is exposed and developed by using a predetermined mask pattern to remove the excess metal layer 220 in the touch area 100a and the partial bonding area 100b, so as to etch the first trace 60, the second trace 70 and the plurality of metal connecting pads 30. Each of the first traces 60 or the second traces 70 is connected to the metal connecting pad 30. The metal connection pads 30 are also called gold fingers and can be electrically connected to the flexible circuit board through a bonding process.
S300: referring to fig. 3C, the first conductive layer 210 is etched to form the first electrode 20, and the first electrode 20 is electrically connected to the first trace 60.
In the etching process, the area of the first conductive layer 210 covered by the first trace 60 and the metal connecting pad 30 is left to form the connecting portion 21, and the connecting portion 21 and the first electrode 20 are integrated. The connection portion 21 is electrically connected to the first trace 60 covering the connection portion 21, so as to electrically connect the first electrode 20 and the first trace 60.
S400: referring to fig. 3D, an insulating layer 40 is formed over the first electrode 20, the insulating layer 40 covers the region where the first electrode 20 is located and at least partially covers the region between the adjacent metal pads 30, and the insulating layer 40 can volatilize gas in a vacuum environment. The insulating layer 40 includes a main body portion 41 and a spacer portion 42, the main body portion 41 is located in a region where the first electrode 20 is located, i.e., the touch region 100a, and the spacer portion 42 is located in a region between adjacent metal connection pads 30.
The insulating layer 40 is formed as follows: a film material containing an insulating material is attached to the upper side of the bottom layer circuit by a film laminator, and after exposure and development of the film material, the insulating layer 40 is produced.
The insulating layer 40 is made of a Transparent Optical material, such as Optical Clear (OC), thermoplastic elastomer (TPF), etc., which can isolate electrical signals and volatilize gas in a vacuum environment, i.e., has an outgassing effect. It should be noted that the metal connecting pads 30 and the second traces 70 are exposed outside the insulating layer 40, that is, the insulating layer 40 is not covered on the metal connecting pads 30 and the second traces 70, so as to avoid affecting the electrical connection between the metal connecting pads 30 and the second traces 70 and other components.
S500: referring to fig. 3E, a second conductive layer 230 is formed.
Vacuum sputtering is performed to form the second conductive layer 230 on the touch area 100 a.
S600: the second conductive layer 230 is etched to form a second electrode 50, the second electrode 50 is located in the touch area 100a, and the second electrode 50 is electrically connected to the second trace 70.
In the prior art, the second conductive layer 230 is formed on the substrate 10 by vacuum sputtering, the material of the second conductive layer 230 is easily changed into a crystalline state, and the crystalline second conductive layer 230 cannot be removed by etching with oxalic acid, so that the second conductive layer 230 remains between two adjacent metal connecting pads 30 to cause short circuit.
In the method for manufacturing the touch module 100, the insulating layer 40 is formed in the region between the adjacent metal pads 30 by changing the mask design. When the second conductive layer 230 is formed by vacuum sputtering in step S500, the insulating layer 40 can volatilize gas in a vacuum environment (i.e., an out-gassing effect) to promote the material of the second conductive layer 230 to be in an amorphous state, and the amorphous second conductive layer 230 can be removed by etching with oxalic acid, so that the second conductive layer 230 between the adjacent metal pads 30 can be completely removed, thereby preventing the adjacent metal pads 30 from being connected to each other to cause short circuit.
The length of the metal connecting pad 30 is d, and the dimension of the isolation portion 42 along the length direction of the metal connecting pad 30 is greater than or equal to d. That is, the two adjacent metal connecting pads 30 are separated by the insulating layer 40 in the length direction, so as to ensure that the second conductive layer 230 located between the metal connecting pads 30 forms an electrical insulating tape after the etching process of step S600, and the electrical insulating tape can prevent the two adjacent metal connecting pads 30 from being short-circuited due to conduction. It is understood that the electrically insulating tape, i.e., the gap formed after the second conductive layer 230 is etched, the air filled in the gap cannot conduct electricity, and thus plays an insulating role.
The width of the spacer 42 is greater than 30 μm. When the width of the isolation portion 42 is too small, the second conductive layer 230 may be etched to form a gap too small, and the two sides of the gap may still be partially connected, which may still result in a short circuit. Tests prove that when the width is larger than 30 μm, the adjacent two metal connecting pads 30 are not short-circuited.
In one embodiment, referring to fig. 4, the isolation portion 42 is a strip. In other embodiments, referring to fig. 5, the isolation portion 42 includes a plurality of rectangles, diamonds, or hexagons arranged in a staggered manner. In another embodiment, the isolation portion 42 completely covers the area between the adjacent metal connection pads 30, ensuring that the second conductive layer 230 located between two metal connection pads 30 can be completely removed.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A preparation method of a touch module is characterized by comprising the following steps:
providing a stacked structure, wherein the stacked structure comprises a substrate, and a first conducting layer and a metal layer which are sequentially arranged on the substrate;
etching the metal layer to form a first wire, a second wire and a plurality of metal connecting pads;
etching the first conductive layer to form a first electrode, wherein the first electrode is electrically connected with the first routing;
forming an insulating layer above the first electrode, wherein the insulating layer at least partially covers the area between the adjacent metal connecting pads, and the insulating layer can volatilize gas in a vacuum environment;
forming a second conductive layer on the insulating layer and the metal connection pad;
and etching the second conductive layer to form a second electrode, wherein the second electrode is electrically connected with the second routing wire.
2. The method according to claim 1, wherein the insulating layer comprises an optically transparent material.
3. The method according to claim 1, wherein the second conductive layer is made of indium tin oxide or indium zinc oxide.
4. The method according to claim 1, wherein the insulating layer includes a main body portion and an isolation portion, the main body portion is located in a region where the first electrode is located, the isolation portion is located in a region between adjacent metal connection pads, the length of each metal connection pad is d, and the dimension of the isolation portion along the length direction of each metal connection pad is greater than or equal to d.
5. The method of claim 4, wherein the partition comprises a plurality of rectangles, diamonds, or hexagons arranged in a staggered pattern.
6. The method as set forth in claim 4, wherein the partition is elongated.
7. The method of claim 4, wherein the isolation portion completely covers a region between adjacent metal connection pads.
8. The production method according to claim 4, wherein the width of the partition is larger than 30 μm.
9. A touch module prepared by the preparation method of any one of claims 1-8.
10. An electronic device comprising the touch module of claim 9.
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| CN201911164694.1A CN111090357B (en) | 2019-11-25 | 2019-11-25 | Touch module, preparation method thereof and electronic equipment |
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| CN201911164694.1A CN111090357B (en) | 2019-11-25 | 2019-11-25 | Touch module, preparation method thereof and electronic equipment |
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| CN111090357B true CN111090357B (en) | 2022-04-22 |
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| KR102525982B1 (en) * | 2015-12-28 | 2023-04-27 | 삼성디스플레이 주식회사 | Liquid crystal display appartus and method of manufacturing the same |
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| CN103396012A (en) * | 2013-07-23 | 2013-11-20 | 蓝思科技（长沙）有限公司 | Method for realizing patterns and colors of visual window frames of touch panel by adopting metal or alloy |
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