CN111088508A - Universal electroplating additive and preparation method thereof - Google Patents
Universal electroplating additive and preparation method thereof Download PDFInfo
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- CN111088508A CN111088508A CN202010051233.XA CN202010051233A CN111088508A CN 111088508 A CN111088508 A CN 111088508A CN 202010051233 A CN202010051233 A CN 202010051233A CN 111088508 A CN111088508 A CN 111088508A
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- universal
- electroplating
- electroplating additive
- additive
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
Abstract
The invention discloses a universal electroplating additive which is prepared from the following raw materials in parts by weight: sodium tartrate, sodium citrate, benzalacetone, 2-mercaptobenzimidazole, 2-ethylhexyl sodium sulfate and allyl thiourea. The universal electroplating additive can be suitable for various electroplating processes, such as copper plating, zinc plating, copper-zinc alloy plating and the like, greatly improves the flatness and the glossiness of a surface coating of an electroplating product, can also obviously improve the corrosion resistance, improve the hardness of the coating and well improve the current efficiency, the dispersing capacity and other properties of the plating solution.
Description
Technical Field
The invention relates to the technical field of additives for electroplating, in particular to a universal electroplating additive and a preparation method thereof.
Background
Electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material product by using the action of electrolysis, thereby having the effects of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like.
Copper electroplating is the most prominent method for achieving electrical interconnections in electronic products, and organic additives are commonly used to achieve uniform conductive patterns and to obtain coatings with good properties. The present copper electroplating additive for manufacturing printed circuit boards mainly comprises: three of the most important components, accelerator, inhibitor and leveler. The accelerator can accelerate the deposition of copper, the inhibitor and the leveling agent mainly have the functions of improving the overpotential of the deposition of copper, refining grains and improving the uniform plating capacity of plating solution, and a uniform and bright plating layer can be obtained through the synergistic effect of the three additives.
Chinese patent CN104630837A discloses an electroplating solution and an electroplating method for acidic copper plating of an anthrone dye system, wherein the electroplating additive comprises chloride ions, anthrone dye, dimethyl phthalein amidosulfonate, polyethylene glycol, polyethylene imine alkyl compound and polyethylene imine alkyl salt, the allowable electroplating solution temperature is 15-40 ℃, and the average electrolytic current density is 15-40 mA/cm 2.
However, the plating additives currently used have the following problems:
1. the universality is poor, and the use requirement of the electroplated copper-zinc alloy cannot be met only by aiming at certain electroplating (such as electroplated copper or electroplated zinc);
2. the performance of the alloy electroplating solution is not improved well;
3. the performance of the plated layer after electroplating is not improved well.
Based on the situation, the invention provides a universal electroplating additive and a preparation method thereof, which can effectively solve the problems.
Disclosure of Invention
The invention aims to provide a universal electroplating additive and a preparation method thereof. The universal electroplating additive can be suitable for various electroplating processes, such as copper plating, zinc plating, copper-zinc alloy plating and the like, greatly improves the flatness and the glossiness of a surface coating of an electroplating product, can also obviously improve the corrosion resistance, improve the hardness of the coating and well improve the current efficiency, the dispersing capacity and other properties of the plating solution.
In order to solve the technical problems, the technical scheme provided by the invention is as follows:
a universal electroplating additive is prepared from the following raw materials in parts by weight:
sodium tartrate, sodium citrate, benzalacetone, 2-mercaptobenzimidazole, 2-ethylhexyl sodium sulfate and allyl thiourea.
The universal electroplating additive can be suitable for various electroplating processes, such as copper plating, zinc plating, copper-zinc alloy plating and the like, greatly improves the flatness and the glossiness of a surface coating of an electroplating product, can also obviously improve the corrosion resistance, improve the hardness of the coating and well improve the current efficiency, the dispersing capacity and other properties of the plating solution.
Preferably, the dosage of the universal electroplating additive is that the content of each raw material in each liter of electroplating solution is respectively as follows: 10-20 mg/L of sodium tartrate, 8-14 mg/L of sodium citrate, 45-75 mg/L of benzalacetone, 30-45 mg/L of 2-mercaptobenzimidazole, 25-32 mg/L of 2-ethylhexyl sodium sulfate and 5-10 mg/L of allylthiourea.
Preferably, the dosage of the universal electroplating additive is that the content of each raw material in each liter of electroplating solution is respectively as follows: 12-17 mg/L of sodium tartrate, 9.5-12 mg/L of sodium citrate, 56-64 mg/L of benzalacetone, 34-40 mg/L of 2-mercaptobenzimidazole, 27-30 mg/L of 2-ethylhexyl sodium sulfate and 7-9 mg/L of allylthiourea.
Preferably, the dosage of the universal electroplating additive is that the content of each raw material in each liter of electroplating solution is respectively as follows: 14.5mg/L of sodium tartrate, 10.8mg/L of sodium citrate, 60mg/L of benzalacetone, 37mg/L of 2-mercaptobenzimidazole, 28.5mg/L of 2-ethylhexyl sodium sulfate and 8mg/L of allyl thiourea.
The invention also provides a preparation method of the universal electroplating additive, which comprises the following steps:
A. respectively calculating the addition amount of each raw material of the universal electroplating additive according to the total volume of the electroplating solution;
B. and respectively weighing each raw material of the universal electroplating additive according to the calculation result for later use, wherein the sum of the raw materials of the universal electroplating additive is the universal electroplating additive.
Compared with the prior art, the invention has the following advantages and beneficial effects:
the universal electroplating additive can be suitable for various electroplating processes, such as copper plating, zinc plating, copper-zinc alloy plating and the like, greatly improves the flatness and the glossiness of a surface coating of an electroplating product, can also obviously improve the corrosion resistance, improve the hardness of the coating and well improve the current efficiency, the dispersing capacity and other properties of the plating solution.
The universal electroplating additive is prepared by selecting raw materials and optimizing the content of each raw material, and the optimal formula is as follows: the dosage of the universal electroplating additive is that each liter of electroplating solution contains the following raw materials: 14.5mg/L of sodium tartrate, 10.8mg/L of sodium citrate, 60mg/L of benzalacetone, 37mg/L of 2-mercaptobenzimidazole, 28.5mg/L of 2-ethylhexyl sodium sulfate and 8mg/L of allyl thiourea. When the copper-zinc alloy electroplating solution is used for an electroplating process of copper-zinc alloy plating, the glossiness of a plating layer (with the thickness of 10 mu m) can reach 347Gs, a salt spray test is carried out for over 1000h without corrosion, the hardness of the plating layer is improved, and the performances of the galvanizing plating solution, such as current efficiency, dispersing capacity and the like, are all improved well.
Detailed Description
In order that those skilled in the art will better understand the technical solutions of the present invention, the following description of the preferred embodiments of the present invention is provided in connection with specific examples, which should not be construed as limiting the present patent.
Example 1:
a universal electroplating additive is prepared from the following raw materials in parts by weight:
sodium tartrate, sodium citrate, benzalacetone, 2-mercaptobenzimidazole, 2-ethylhexyl sodium sulfate and allyl thiourea.
Preferably, the dosage of the universal electroplating additive is that the content of each raw material in each liter of electroplating solution is respectively as follows: 10-20 mg/L of sodium tartrate, 8-14 mg/L of sodium citrate, 45-75 mg/L of benzalacetone, 30-45 mg/L of 2-mercaptobenzimidazole, 25-32 mg/L of 2-ethylhexyl sodium sulfate and 5-10 mg/L of allylthiourea.
Preferably, the dosage of the universal electroplating additive is that the content of each raw material in each liter of electroplating solution is respectively as follows: 12-17 mg/L of sodium tartrate, 9.5-12 mg/L of sodium citrate, 56-64 mg/L of benzalacetone, 34-40 mg/L of 2-mercaptobenzimidazole, 27-30 mg/L of 2-ethylhexyl sodium sulfate and 7-9 mg/L of allylthiourea.
Preferably, the dosage of the universal electroplating additive is that the content of each raw material in each liter of electroplating solution is respectively as follows: 14.5mg/L of sodium tartrate, 10.8mg/L of sodium citrate, 60mg/L of benzalacetone, 37mg/L of 2-mercaptobenzimidazole, 28.5mg/L of 2-ethylhexyl sodium sulfate and 8mg/L of allyl thiourea.
The invention also provides a preparation method of the universal electroplating additive, which comprises the following steps:
A. respectively calculating the addition amount of each raw material of the universal electroplating additive according to the total volume of the electroplating solution;
B. and respectively weighing each raw material of the universal electroplating additive according to the calculation result for later use, wherein the sum of the raw materials of the universal electroplating additive is the universal electroplating additive.
Example 2:
a universal electroplating additive is prepared from the following raw materials in parts by weight:
sodium tartrate, sodium citrate, benzalacetone, 2-mercaptobenzimidazole, 2-ethylhexyl sodium sulfate and allyl thiourea.
In this embodiment, the amount of the universal electroplating additive is, per liter of electroplating solution, the content of each raw material is: 12mg/L of sodium tartrate, 9.5mg/L of sodium citrate, 56mg/L of benzalacetone, 34mg/L of 2-mercaptobenzimidazole, 27mg/L of 2-ethylhexyl sodium sulfate and 7mg/L of allylthiourea.
In this embodiment, the preparation method of the universal electroplating additive includes the following steps:
A. respectively calculating the addition amount of each raw material of the universal electroplating additive according to the total volume of the electroplating solution;
B. and respectively weighing each raw material of the universal electroplating additive according to the calculation result for later use, wherein the sum of the raw materials of the universal electroplating additive is the universal electroplating additive.
Example 3:
a universal electroplating additive is prepared from the following raw materials in parts by weight:
sodium tartrate, sodium citrate, benzalacetone, 2-mercaptobenzimidazole, 2-ethylhexyl sodium sulfate and allyl thiourea.
In this embodiment, the amount of the universal electroplating additive is, per liter of electroplating solution, the content of each raw material is: 17mg/L of sodium tartrate, 12mg/L of sodium citrate, 64mg/L of benzalacetone, 40mg/L of 2-mercaptobenzimidazole, 30mg/L of 2-ethylhexyl sodium sulfate and 9mg/L of allylthiourea.
In this embodiment, the preparation method of the universal electroplating additive includes the following steps:
A. respectively calculating the addition amount of each raw material of the universal electroplating additive according to the total volume of the electroplating solution;
B. and respectively weighing each raw material of the universal electroplating additive according to the calculation result for later use, wherein the sum of the raw materials of the universal electroplating additive is the universal electroplating additive.
Example 4:
a universal electroplating additive is prepared from the following raw materials in parts by weight:
sodium tartrate, sodium citrate, benzalacetone, 2-mercaptobenzimidazole, 2-ethylhexyl sodium sulfate and allyl thiourea.
In this embodiment, the amount of the universal electroplating additive is, per liter of electroplating solution, the content of each raw material is: 14.5mg/L of sodium tartrate, 10.8mg/L of sodium citrate, 60mg/L of benzalacetone, 37mg/L of 2-mercaptobenzimidazole, 28.5mg/L of 2-ethylhexyl sodium sulfate and 8mg/L of allyl thiourea.
In this embodiment, the preparation method of the universal electroplating additive includes the following steps:
A. respectively calculating the addition amount of each raw material of the universal electroplating additive according to the total volume of the electroplating solution;
B. and respectively weighing each raw material of the universal electroplating additive according to the calculation result for later use, wherein the sum of the raw materials of the universal electroplating additive is the universal electroplating additive.
The above is only a preferred embodiment of the present invention, and it should be noted that the above preferred embodiment should not be considered as limiting the present invention, and the protection scope of the present invention should be subject to the scope defined by the claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the invention, and these modifications and adaptations should be considered within the scope of the invention.
Claims (5)
1. The universal electroplating additive is characterized by being prepared from the following raw materials in parts by weight:
sodium tartrate, sodium citrate, benzalacetone, 2-mercaptobenzimidazole, 2-ethylhexyl sodium sulfate and allyl thiourea.
2. The universal electroplating additive as claimed in claim 1, wherein the universal electroplating additive is used in an amount that each liter of electroplating bath contains the following raw materials: 10-20 mg/L of sodium tartrate, 8-14 mg/L of sodium citrate, 45-75 mg/L of benzalacetone, 30-45 mg/L of 2-mercaptobenzimidazole, 25-32 mg/L of 2-ethylhexyl sodium sulfate and 5-10 mg/L of allylthiourea.
3. The universal electroplating additive as claimed in claim 1, wherein the universal electroplating additive is used in an amount that each liter of electroplating bath contains the following raw materials: 12-17 mg/L of sodium tartrate, 9.5-12 mg/L of sodium citrate, 56-64 mg/L of benzalacetone, 34-40 mg/L of 2-mercaptobenzimidazole, 27-30 mg/L of 2-ethylhexyl sodium sulfate and 7-9 mg/L of allylthiourea.
4. The universal electroplating additive as claimed in claim 1, wherein the universal electroplating additive is used in an amount that each liter of electroplating bath contains the following raw materials: 14.5mg/L of sodium tartrate, 10.8mg/L of sodium citrate, 60mg/L of benzalacetone, 37mg/L of 2-mercaptobenzimidazole, 28.5mg/L of 2-ethylhexyl sodium sulfate and 8mg/L of allyl thiourea.
5. A method for preparing a universal plating additive according to any of claims 1 to 4, comprising the steps of:
A. respectively calculating the addition amount of each raw material of the universal electroplating additive according to the total volume of the electroplating solution;
B. and respectively weighing each raw material of the universal electroplating additive according to the calculation result for later use, wherein the sum of the raw materials of the universal electroplating additive is the universal electroplating additive.
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| CN202010051233.XA CN111088508A (en) | 2020-01-17 | 2020-01-17 | Universal electroplating additive and preparation method thereof |
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| CN202010051233.XA CN111088508A (en) | 2020-01-17 | 2020-01-17 | Universal electroplating additive and preparation method thereof |
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Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302635A (en) * | 2008-01-18 | 2008-11-12 | 梁国柱 | Steel member acidic electroplating additive for copper pre-plating and pre-plating process |
| CN102234826A (en) * | 2010-04-29 | 2011-11-09 | 比亚迪股份有限公司 | Electroplating liquid and electroplating method using same |
| CN104388991A (en) * | 2014-11-14 | 2015-03-04 | 无锡信大气象传感网科技有限公司 | Copper electroplate liquid and preparation method thereof |
| CN104499018A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Alkaline non-cyanide pre-plated copper plating solution and process |
| CN106065486A (en) * | 2016-06-10 | 2016-11-02 | 太原工业学院 | A kind of non-cyanide copper electroplating compound additive and production technology thereof |
| CN108207090A (en) * | 2017-12-29 | 2018-06-26 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board |
| CN110284162A (en) * | 2019-07-22 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
-
2020
- 2020-01-17 CN CN202010051233.XA patent/CN111088508A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101302635A (en) * | 2008-01-18 | 2008-11-12 | 梁国柱 | Steel member acidic electroplating additive for copper pre-plating and pre-plating process |
| CN102234826A (en) * | 2010-04-29 | 2011-11-09 | 比亚迪股份有限公司 | Electroplating liquid and electroplating method using same |
| CN104388991A (en) * | 2014-11-14 | 2015-03-04 | 无锡信大气象传感网科技有限公司 | Copper electroplate liquid and preparation method thereof |
| CN104499018A (en) * | 2014-11-28 | 2015-04-08 | 广东致卓精密金属科技有限公司 | Alkaline non-cyanide pre-plated copper plating solution and process |
| CN106065486A (en) * | 2016-06-10 | 2016-11-02 | 太原工业学院 | A kind of non-cyanide copper electroplating compound additive and production technology thereof |
| CN108207090A (en) * | 2017-12-29 | 2018-06-26 | 广州兴森快捷电路科技有限公司 | The production method of printed circuit board |
| CN110284162A (en) * | 2019-07-22 | 2019-09-27 | 广州三孚新材料科技股份有限公司 | Cyanide-free alkaline copper plating solution for photovoltaic confluence welding strip and preparation method thereof |
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Application publication date: 20200501 |