CN111086211A - 3d additive forming device and additive forming method - Google Patents

3d additive forming device and additive forming method Download PDF

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Publication number
CN111086211A
CN111086211A CN201911297459.1A CN201911297459A CN111086211A CN 111086211 A CN111086211 A CN 111086211A CN 201911297459 A CN201911297459 A CN 201911297459A CN 111086211 A CN111086211 A CN 111086211A
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CN
China
Prior art keywords
flexible circuit
nozzle
circuit board
piezoelectric
plate
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Pending
Application number
CN201911297459.1A
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Chinese (zh)
Inventor
戴成杰
韩炜
王磊
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Aistar Intelligent Manufacturing Jiangsu Co Ltd
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Aistar Intelligent Manufacturing Jiangsu Co Ltd
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Priority to CN201911297459.1A priority Critical patent/CN111086211A/en
Publication of CN111086211A publication Critical patent/CN111086211A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/20Apparatus for additive manufacturing; Details thereof or accessories therefor
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/10Processes of additive manufacturing
    • B29C64/106Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material
    • B29C64/112Processes of additive manufacturing using only liquids or viscous materials, e.g. depositing a continuous bead of viscous material using individual droplets, e.g. from jetting heads
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y10/00Processes of additive manufacturing
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B33ADDITIVE MANUFACTURING TECHNOLOGY
    • B33YADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y30/00Apparatus for additive manufacturing; Details thereof or accessories therefor

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Optics & Photonics (AREA)

Abstract

The invention discloses a 3d additive forming device and a 3d additive forming method. The scheme can accurately control the stacking sequence and the stacking density of each material, and the forming efficiency is higher.

Description

3d additive forming device and additive forming method
Technical Field
The invention relates to a 3d additive forming device and a 3d additive forming method, and particularly relates to the technical field of 3d additive forming.
Background
There are 3 technologies mainly used in the existing 3D forming apparatus, which are respectively: ink-jet technology, deposition molding technology and laser sintering technology. Both of the latter techniques generate heat during the molding process, and therefore have limitations on the materials used (e.g., biomaterials, heat sensitive materials). In the molding size, the laser sintering technique cannot be widely applied to large-size molds. The efficiency of the inkjet technique is highest in terms of molding efficiency. The advantages of inkjet technology in terms of the dimensions of the shapes are also evident. The ink jet technology is more suitable for industrial production.
In the additive manufacturing process, a plurality of materials are involved, so that an execution unit supporting the plurality of materials is a key of additive manufacturing equipment, a composite process of the plurality of materials can be realized, and more novel materials and new processes are created. Since the ink jet technology is used, the ejection material is required to be a solution. Therefore, the application researches a 3d additive forming device and a 3d additive forming method adopting a 3d ink-jet technology.
Disclosure of Invention
The invention aims to provide a 3d additive forming device and an additive forming method, so as to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a 3d vibration material disk forming device contains three piezoelectric nozzle module, wherein every piezoelectric nozzle module contains the orifice plate, the orifice welt, piezoceramics, first flexible circuit board, the second flexible circuit board, first pressure chamber, second pressure chamber and advance the china ink board, first pressure chamber and second pressure chamber set up side by side, one side of first pressure chamber is provided with first flexible circuit board, the outside of first flexible circuit board is provided with the orifice welt, the outside of orifice welt is provided with the orifice plate, the outside of second pressure chamber is provided with the second flexible circuit board, the second flexible circuit board outside is provided with advances the china ink board, and piezoceramics sets up respectively on first flexible circuit board and second flexible circuit board.
A material increase forming method of a 3d material increase forming device comprises the following steps: adjusting driving parameters of three piezoelectric nozzle modules, wherein the volume of liquid drops output by each group of piezoelectric nozzle modules is 5-80PL, the ejection frequency of the liquid drops is 0-100KHz, the inverse piezoelectric effect of the piezoelectric ceramic is used, the piezoelectric ceramic is deformed by applying pulse voltage to the piezoelectric ceramic, the electric energy is converted into mechanical energy, so that a first pressure cavity and a second pressure cavity are deformed to generate pressure, and the ink drops are ejected from an ejection hole in an ejection hole plate, a first flexible circuit and a second flexible circuit are used for connecting the piezoelectric ceramic and a driving chip, an ink inlet plate is used for guiding ink to enter the first pressure cavity and the second pressure cavity, the generation of each model is formed by stacking a plurality of two-dimensional planes, each two-dimensional plane structure is formed by a plurality of liquid drops, and the difference of the stacking densities of a plurality of materials is realized by adjusting the size and the number of each material liquid drop in the two-dimensional planes, the difference of the stacking sequence is realized by controlling the triggering sequence of each piezoelectric nozzle module, and the types and the positions of the liquid drops in each two-dimensional plane structure can be finally manufactured into a printer RIP file to be specified.
Compared with the prior art, the invention has the beneficial effects that: the scheme can realize the superposition of multiple materials, can accurately control the stacking sequence and stacking density of each material, and has higher molding efficiency.
Drawings
Fig. 1 is a schematic perspective view of a piezoelectric nozzle module in a 3d additive forming apparatus according to the present invention;
FIG. 2 is a schematic view of a flow structure of a 3d additive molding method according to the present invention;
FIG. 3 is a diagram showing a molding diagram in step 1-1 in example 1 of the present invention;
FIG. 4 is a diagram showing the formation in steps 1 to 2 in example 1 of the present invention;
FIG. 5 is a diagram showing a molding diagram in step 1-1 in example 2 of the present invention;
FIG. 6 is a diagram showing the formation in steps 1 to 2 in example 2 of the present invention;
FIG. 7 is a diagram showing a molding diagram in step 1-1 in example 3 of the present invention;
FIG. 8 is a diagram showing the formation patterns in steps 1 to 2 in example 3 of the present invention.
Reference numerals: the nozzle plate 010, the nozzle lining plate 020, the piezoelectric ceramic 030, the first flexible circuit board 041, the second flexible circuit board 042, the first pressure chamber 051, the second pressure chamber 052 and the ink inlet plate 060.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a 3d additive forming device includes three piezoelectric nozzle modules, wherein each piezoelectric nozzle module includes a nozzle plate 010, a nozzle liner 020, piezoelectric ceramics 030, a first flexible circuit board 041, a second flexible circuit board 042, a first pressure chamber 051, a second pressure chamber 052 and an ink inlet plate 060, the first pressure chamber 051 and the second pressure chamber 052 are arranged in parallel, the first flexible circuit board 041 is arranged on one side of the first pressure chamber 051, the nozzle liner 020 is arranged on the outer side of the first flexible circuit board 041, the nozzle plate 010 is arranged on the outer side of the nozzle liner 020, the second flexible circuit board 042 is arranged on the outer side of the second pressure chamber 052, the ink inlet plate 060 is arranged on the outer side of the second flexible circuit board 042, and the piezoelectric ceramics 030 is respectively arranged on the first flexible circuit board 041 and the second flexible circuit board 042.
A material increase forming method of a 3d material increase forming device comprises the following steps: adjusting driving parameters of three piezoelectric nozzle modules, wherein the piezoelectric nozzle module of each group outputs 5-80PL of liquid drop volume, the ejection frequency of the liquid drop is 0-100KHz, by using the inverse piezoelectric effect of the piezoelectric ceramic 030, the piezoelectric ceramic 030 is deformed by applying pulse voltage to the piezoelectric ceramic 030, the electric energy is converted into mechanical energy, so that a first pressure chamber 051 and a second pressure chamber 052 are deformed to generate pressure, the liquid drop is ejected from an ejection hole in an ejection hole plate 010, a first flexible circuit 041 and a second flexible circuit 042 are used for connecting the piezoelectric ceramic 030 with a driving chip, an ink inlet plate 060 is used for guiding the ink to enter the first pressure chamber 051 and the second pressure chamber 052, the generation of each model is formed by stacking a plurality of two-dimensional planes, each two-dimensional plane structure is formed by a plurality of liquid drops, and the difference of the stacking densities of a plurality of materials is realized by adjusting the size and the number of each liquid drop in each two-dimensional plane, the difference of the stacking sequence is realized by controlling the triggering sequence of each piezoelectric nozzle module, and the types and the positions of the liquid drops in each two-dimensional plane structure can be finally manufactured into a printer RIP file to be specified.
Example 1: since the number of materials in this scheme is not limited, the three materials are taken as an example, and the bulk density of the droplets in the printed pattern is represented by DPI:
preparing 3 liquid materials A, B, C, and respectively inputting the liquid materials into 3 piezoelectric nozzle modules, wherein the specific input method is shown in FIG. 2;
the stacking ratio A, B and C is 1, 1 and 1, the stacking sequence A → B → C
1-1: the driving parameters of 3 piezoelectric nozzle modules are adjusted, the volume of liquid drops output by the #1#2#3 nozzle module is 5PL, the spraying frequency is 23696Hz, the stacking resolution of three materials in the X direction of the two-dimensional plane ABC is 1200DPI, the stacking resolution of three materials in the Y direction is 400DPI, and the triggering time sequence is 1 → 2 → 3. The forming diagram is shown in FIG. 3;
1-2: adjusting the driving parameters of 3 piezoelectric nozzle modules, wherein the volume of the liquid drop output by the #1#2#3 nozzle module is 5PL, the injection frequency is 7874Hz, the stacking resolution of three materials in the X direction and the Y direction of ABC on the two-dimensional plane is 400DPI, the stacking resolution of three materials in the Y direction is 1200DPI, the triggering time sequence is 1 → 2 → 3, and the forming diagram is shown in FIG. 4;
example 2: preparing 3 liquid materials A, B, C, and respectively inputting the liquid materials into 3 piezoelectric nozzle modules;
the stacking ratio of A to B to C is 1 to 1, and the stacking sequence C → B → A
2-1: the driving parameters of 3 piezoelectric nozzle modules are adjusted, the volume of liquid drops output by the #1#2#3 nozzle module is 5PL, the spraying frequency is 23696Hz, the stacking resolution of three materials in the X direction of the two-dimensional plane ABC is 1200DPI, the stacking resolution of three materials in the Y direction is 400DPI, and the triggering time sequence is 3 → 2 → 1. The forming diagram is shown in FIG. 5;
2-2: adjusting the driving parameters of 3 piezoelectric nozzle modules, wherein the volume of the liquid drop output by the #1#2#3 nozzle module is 5PL, the injection frequency is 7874Hz, the stacking resolution of three materials in the X direction and the Y direction of ABC on the two-dimensional plane is 400DPI, the stacking resolution of three materials in the Y direction is 1200DPI, the triggering time sequence is 3 → 2 → 1, and the forming diagram is shown in FIG. 6;
example 3: preparing 3 liquid materials A, B, C, and respectively inputting the liquid materials into 3 piezoelectric nozzle modules;
the stacking ratio A, B and C is 1, 2 and 3, the stacking sequence A → B → C
3-1: the driving parameters of 3 piezoelectric nozzle modules are adjusted, the volume of the liquid drop output by the #1 nozzle module is 5PL, the volume of the liquid drop output by the #2 nozzle module is 10PL, the volume of the liquid drop output by the #3 nozzle module is 15PL, the spraying frequency is 17730Hz, the three-material stacking resolution in the X direction ABC of the two-dimensional plane is 900DPI, the three-material stacking resolution in the Y direction is 300DPI, and the triggering time sequence is 1 → 2 → 3. The forming diagram is shown in FIG. 7;
3-2: the driving parameters of 3 piezoelectric nozzle modules are adjusted, the volume of the liquid drop output by the #1 nozzle module is 5PL, the volume of the liquid drop output by the #2 nozzle module is 10PL, the volume of the liquid drop output by the #3 nozzle module is 15PL, the spraying frequency is 5910Hz, the three-material stacking resolution in the X direction and the Y direction of the two-dimensional plane ABC is 300DPI, the three-material stacking resolution in the Y direction is 900DPI, and the triggering time sequence is 1 → 2 → 3. The forming pattern is shown in fig. 8.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (2)

1. The utility model provides a 3d vibration material disk forming device which characterized in that: the nozzle comprises three piezoelectric nozzle modules, wherein each piezoelectric nozzle module comprises a nozzle plate (010), a nozzle lining plate (020), piezoelectric ceramics (030), a first flexible circuit board (041), a second flexible circuit board (042), a first pressure cavity (051), a second pressure cavity (052) and an ink inlet plate (060), the first pressure cavity (051) and the second pressure cavity (052) are arranged in parallel, the first flexible circuit board (041) is arranged on one side of the first pressure cavity (051), the nozzle lining plate (020) is arranged on the outer side of the first flexible circuit board (041), the nozzle plate (010) is arranged on the outer side of the nozzle lining plate (020), the second flexible circuit board (042) is arranged on the outer side of the second pressure cavity (052), and the ink inlet plate (060) is arranged on the outer side of the second flexible circuit board (042), and the piezoelectric ceramics (030) are respectively arranged on the first flexible circuit board (041) and the second flexible circuit board (042).
2. A method of additive forming of a 3d additive forming device according to claim 1, wherein: the specific method comprises the following steps: adjusting driving parameters of three piezoelectric nozzle modules, wherein the piezoelectric nozzle module of each group outputs 5-80PL liquid drop, the ejection frequency of the liquid drop is 0-100KHz, pulse voltage is applied to the piezoelectric ceramic (030) to deform the piezoelectric ceramic (030), electric energy is converted into mechanical energy, so that a first pressure chamber (051) and a second pressure chamber (052) are deformed to generate pressure, ink drops are ejected from an ejection hole in an ejection hole plate (010), a first flexible circuit (041) and a second flexible circuit (042) are used for connecting the piezoelectric ceramic (030) and a driving chip, an ink inlet plate (060) is used for guiding ink to enter the first pressure chamber (051) and the second pressure chamber (052), the generation of each model is formed by a plurality of two-dimensional planes, and a plurality of liquid drops are stacked in each two-dimensional plane, the difference of the stacking density of various materials is realized by adjusting the size and the number of each material liquid drop in a two-dimensional plane, the difference of the stacking sequence is realized by controlling the triggering sequence of each piezoelectric nozzle module, and the type and the position of the liquid drop in each two-dimensional plane structure can be finally manufactured into a RIP file of a printer for designation.
CN201911297459.1A 2019-12-16 2019-12-16 3d additive forming device and additive forming method Pending CN111086211A (en)

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CN201911297459.1A CN111086211A (en) 2019-12-16 2019-12-16 3d additive forming device and additive forming method

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727800B1 (en) * 2005-07-20 2007-06-18 재단법인서울대학교산학협력재단 Method for Manufacturing Piezoelectric Fiber Coated with Interior Electrode by Coextrusion
CN104442011A (en) * 2014-12-30 2015-03-25 广州市爱司凯科技股份有限公司 Ink cavity structure of sprayer of ink-jet printer
CN106725999A (en) * 2017-01-12 2017-05-31 吉林大学 The anti-blocking multicellular organism increasing material manufacturing method and device of high-precision ultrasound
CN107377873A (en) * 2017-07-27 2017-11-24 宁夏共享模具有限公司 A kind of non-contact piezoelectric type 3D printing droplet ejection printhead

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100727800B1 (en) * 2005-07-20 2007-06-18 재단법인서울대학교산학협력재단 Method for Manufacturing Piezoelectric Fiber Coated with Interior Electrode by Coextrusion
CN104442011A (en) * 2014-12-30 2015-03-25 广州市爱司凯科技股份有限公司 Ink cavity structure of sprayer of ink-jet printer
CN106725999A (en) * 2017-01-12 2017-05-31 吉林大学 The anti-blocking multicellular organism increasing material manufacturing method and device of high-precision ultrasound
CN107377873A (en) * 2017-07-27 2017-11-24 宁夏共享模具有限公司 A kind of non-contact piezoelectric type 3D printing droplet ejection printhead

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
王运赣: "《3D打印技术》", 31 July 2014, 华中科技大学出版社 *

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Application publication date: 20200501