CN111083601A

CN111083601A - Electronic device

Info

Publication number: CN111083601A
Application number: CN201911207628.8A
Authority: CN
Inventors: 吴磊
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-04-28

Abstract

The embodiment of the application discloses electronic equipment, electronic equipment includes: the body is provided with a first accommodating cavity and a second accommodating cavity; wherein the first accommodating cavity and the second accommodating cavity are separated from each other; an audio playing component; the magnetic circuit part of the audio playing component is positioned in the first accommodating cavity, and the vibration part of the audio playing component is connected with the wall body forming the first accommodating cavity through the supporting part of the audio playing component; the audio circuit board is arranged in the second accommodating cavity and is electrically connected with the audio playing component; the mainboard is arranged in the second accommodating cavity and electrically connected with the audio circuit board. The electronic equipment of this application embodiment, first chamber and the second that holds the chamber and separate each other, can prevent audio circuit board and mainboard to the influence of audio playback subassembly, can improve the audio performance of audio playback subassembly effectively.

Description

Electronic device

Technical Field

The present application relates to an electronic device.

Background

Electronic equipment is equipment frequently used by people, and is generally provided with a main board and an audio playing component; however, the audio playing component in the prior art is easily affected by the main board in the using process, so that the audio performance of the audio playing component is poor.

Disclosure of Invention

In view of the above, embodiments of the present application are directed to providing an electronic device.

In order to achieve the purpose, the technical scheme of the application is realized as follows:

an embodiment of the present application provides an electronic device, which includes:

the body is provided with a first accommodating cavity and a second accommodating cavity; wherein the first accommodating cavity and the second accommodating cavity are separated from each other;

an audio playing component; the magnetic circuit part of the audio playing component is positioned in the first accommodating cavity, and the vibration part of the audio playing component is connected with the wall body forming the first accommodating cavity through the supporting part of the audio playing component;

the audio circuit board is arranged in the second accommodating cavity and is electrically connected with the audio playing component;

the mainboard is arranged in the second accommodating cavity and electrically connected with the audio circuit board.

In some optional implementations, the first receiving cavity is a sealed cavity.

In some optional implementations, the electronic device further includes:

the first connecting hole is respectively communicated with the first accommodating cavity and the second accommodating cavity;

the first connecting wire penetrates through the first connecting hole and is electrically connected with the audio playing assembly and the audio circuit board respectively;

and a first sealing member disposed between the first connection wire and an inner wall forming the first connection hole, for sealing the first connection hole.

In some optional implementations, the first receiving cavity and the second receiving cavity are juxtaposed along a first direction; the first direction is the height direction of the electronic equipment;

the electronic device further includes:

the partition plate is arranged between the first accommodating cavity and the second accommodating cavity;

the first connection hole is located on the partition plate.

In some optional implementations, the electronic device further includes:

an audio receiving component, the audio receiving component comprising:

at least one microphone arranged on a top wall body forming the first accommodating cavity;

the second connecting hole is respectively communicated with the first accommodating cavity and the second accommodating cavity;

the second connecting wire penetrates through the second connecting hole and is electrically connected with the at least one microphone and the audio circuit board respectively;

and a second sealing member disposed between the second connection wire and an inner wall forming the second connection hole, for sealing the second connection hole.

In some optional implementations, the second connection hole and the first connection hole are the same connection hole or different connection holes;

the first seal and the second seal are the same seal or different seals.

In some optional implementations, the electronic device further includes:

the first fixing structure is arranged in the first accommodating cavity, is connected with the fixing section part of the first connecting lead and is used for preventing the first connecting lead from vibrating;

the second fixing structure is arranged in the first accommodating cavity, is connected with the fixing section part of the second connecting lead and is used for preventing the second connecting lead from vibrating;

the first elastic piece is sleeved outside the suspended section part of the first connecting wire and used for preventing the suspended section part of the first connecting wire from vibrating to generate sound;

the second elastic piece is sleeved outside the suspended section part of the second connecting wire and used for preventing the suspended section part of the second connecting wire from vibrating to generate sound.

In some optional implementations, the electronic device further includes:

at least two first-type openings arranged on adjacent or opposite side wall bodies forming the first accommodating cavity;

the audio playing component comprises:

at least two first-type loudspeakers for outputting sound in different directions; the magnetic circuit part of the first type of horn is positioned in the first accommodating cavity, and the supporting part of the first type of horn is clamped in the first type of opening;

the electronic device further includes:

and the third sealing member is arranged between the supporting part of the first-type loudspeaker and a wall body forming the first-type opening and used for sealing the first-type opening.

In some optional implementations, the electronic device further includes:

at least two second-type openings are arranged on adjacent or opposite side wall bodies forming the first accommodating cavity;

the audio playback assembly further comprises:

at least two second-type loudspeakers used for outputting sound to different directions; the supporting part of the second type loudspeaker is clamped in the second type opening; the second type of horn is a passive horn, and the first type of horn is a full-frequency horn;

the electronic device further includes:

and the fourth sealing element is arranged between the supporting part of the second type loudspeaker and a wall body forming the second type opening and is used for sealing the second type opening.

In some optional implementations, the electronic device further includes:

the processor is arranged on the mainboard, is electrically connected with the audio receiving component of the electronic equipment, and is used for identifying the audio information received by the audio receiving component and adjusting the playing parameters of the audio playing component based on the audio data when the audio information is determined to comprise the audio data used for adjusting the audio playing component; wherein the playing parameters at least comprise one of the following: sound size, playing sequence, playing target.

In the electronic device according to the embodiment of the application, the magnetic circuit part of the audio playing component is arranged in the first accommodating cavity, and the vibration part of the audio playing component is connected with the wall body forming the first accommodating cavity through the supporting part of the audio playing component; the audio circuit board and the mainboard are arranged in the second accommodating cavity, and the first accommodating cavity and the second accommodating cavity are mutually separated, so that the influence of the audio circuit board and the mainboard on the audio playing component can be prevented, and the audio performance of the audio playing component can be effectively improved; meanwhile, the vibration generated by the audio playing component can be prevented from damaging the mainboard and the audio circuit board or influencing the work of the mainboard and the audio circuit board; in addition, the heat generated by the mainboard and the audio circuit board during working can be prevented from influencing the audio performance of the audio playing component.

Drawings

FIG. 1 is a cross-sectional view of an alternative configuration of an electronic device in an embodiment of the present application;

FIG. 2 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 3 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 4 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 5 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 6 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 7 is a schematic view of an alternative configuration of a second connecting lead of the electronic device in the embodiment of the present application;

FIG. 8 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 9 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 10 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 11 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 12 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 13 is a schematic diagram of an alternative configuration of an electronic device in an embodiment of the application;

FIG. 14 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 15 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 16 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the present application;

FIG. 17 is a schematic diagram of an alternative partial structure of an electronic device in an embodiment of the application;

FIG. 18 is a schematic diagram of an alternative configuration of an electronic device in an embodiment of the application;

fig. 19 is an alternative structural diagram of an electronic device in an embodiment of the present application.

Reference numerals: 101. a first connecting wire; 102. a first seal member; 103. a partition plate; 104. a second connecting wire; 105. a reticulated shell; 107. a second fixed structure; 108. a second elastic member; 109. a second seal member; 110. a body; 111. a first accommodating chamber; 112. a second accommodating chamber; 113. a second type of opening; 114. A first type of opening; 121. a magnetic circuit portion; 122. a second type horn; 123. a first type horn; 124. a vibrating portion; 125. a support portion; 130. an audio circuit board; 140. a User Interface (UI) board; 150. a main board; 161. a top cover; 162. a bottom cover; 163. a first screw; 164. a second screw; 165. a foot pad; 166. a fifth seal member; 167. a switch button; 168. a spring; 169. a label; 170. a heat dissipating component; 180. operating a button; 190. a group of holes is received.

Detailed Description

The present application will be described in further detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

In the description of the embodiments of the present application, it should be noted that, unless otherwise specified and limited, the term "connected" should be interpreted broadly, for example, as an electrical connection, a communication between two elements, a direct connection, or an indirect connection via an intermediate, and the specific meaning of the terms may be understood by those skilled in the art according to specific situations.

It should be noted that the terms "first \ second \ third" referred to in the embodiments of the present application are only used for distinguishing similar objects, and do not represent a specific ordering for the objects, and it should be understood that "first \ second \ third" may exchange a specific order or sequence order if allowed. It should be understood that "first \ second \ third" distinct objects may be interchanged under appropriate circumstances such that the embodiments of the application described herein may be implemented in an order other than those illustrated or described herein.

It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict. The electronic device according to the embodiment of the present application will be described in detail below with reference to fig. 1 to 19.

The electronic device includes: the main body 110, the audio playing component, the audio circuit board 130 and the main board 150. The body 110 has a first receiving cavity 111 and a second receiving cavity 112; wherein the first accommodating chamber 111 and the second accommodating chamber 112 are spaced apart from each other; the magnetic circuit part 121 of the audio playing component is located in the first accommodating cavity 111, and the vibration part 124 of the audio playing component is connected with the wall body forming the first accommodating cavity 111 through the supporting part 125 of the audio playing component; the audio circuit board 130 is disposed in the second accommodating cavity 112, and the audio circuit board 130 is electrically connected to the audio playing component; the main board 150 is disposed in the second accommodating cavity 112, and the main board 150 is electrically connected to the audio circuit board 130.

In the embodiment of the present application, by disposing the magnetic circuit portion 121 of the audio playing component in the first accommodating cavity 111, the vibration portion 124 of the audio playing component is connected to the wall body forming the first accommodating cavity 111 through the supporting portion 125 of the audio playing component; the audio circuit board 130 and the main board 150 are disposed in the second accommodating cavity 112, and the first accommodating cavity 111 and the second accommodating cavity 112 are separated from each other, so that the influence of the audio circuit board 130 and the main board 150 on the audio playing component can be prevented, and the audio performance of the audio playing component can be effectively improved; meanwhile, the vibration generated by the audio playing component can be prevented from damaging the main board 150 and the audio circuit board 130 or influencing the work of the main board 150 and the audio circuit board 130; in addition, the heat generated by the main board 150 and the audio circuit board 130 during operation can be prevented from affecting the audio performance of the audio playing component.

In the embodiment of the present application, the structure of the body 110 is not limited as long as the body 110 has the first receiving chamber 111 and the second receiving chamber 112; and the first receiving chamber 111 and the second receiving chamber 112 are spaced apart from each other.

Here, the first receiving chamber 111 may be a sealed chamber or a non-sealed chamber. When the first accommodating cavity 111 is a non-sealed cavity, the electronic device has a simple structure, and can prevent the audio circuit board 130 and the main board 150 from influencing the audio playing component, and effectively improve the audio performance of the audio playing component; meanwhile, the vibration generated by the audio playing component can be prevented from damaging the main board 150 and the audio circuit board 130 or influencing the work of the main board 150 and the audio circuit board 130; in addition, the heat generated by the main board 150 and the audio circuit board 130 during operation can be prevented from affecting the audio performance of the audio playing component. When first chamber 111 is sealed cavity, on the basis of aforementioned effect, the audio playback subassembly can also effectively utilize resonance, improves the audio performance of audio playback subassembly.

For example, the electronic device may further include a third opening, a fourth opening, a top cover 161, and a bottom cover 162; the third opening is communicated with the first accommodating cavity 111, the top cover 161 is connected with the body 110, and the top cover 161 covers the third opening; the fourth opening is communicated with the second accommodating cavity 112, the bottom cover 162 is connected with the body 110, and the bottom cover 162 covers the fourth opening; so that the audio playing component is placed in the first accommodating cavity 111 through the third opening, and the audio circuit board 130 and the main board 150 are placed in the second accommodating cavity 112 through the fourth opening.

Here, the implementation manner of the top cap 161 being connected with the body 110 is not limited. For example, as shown in fig. 14, the top cover 161 is fixedly connected to the body 110 by a first screw 163.

Here, as shown in fig. 12, a fifth sealing member 166 is further provided between the top cover 161 and the body 110 so as to form the first receiving chamber 111 as a sealed chamber.

Here, the implementation of the bottom cover 162 connected with the body 110 is not limited. For example, as shown in fig. 17, the bottom cover 162 is fixedly connected with the body 110 by the second screw 164; at this time, the electronic device may further include a foot pad 165, the foot pad 165 being disposed on a surface of the bottom cover 162, and the second screw 164 covering the second screw 164.

In the embodiment of the present application, the structure of the audio playing component is not limited. For example, as shown in fig. 1, the audio playing component includes: the magnetic circuit portion 121, the vibration portion 124, and the support portion 125.

Here, the magnetic circuit portion 121 serves to vibrate the vibration portion 124.

Here, the vibration part 124 is used to vibrate to push air to generate sound. The structure of the vibration part 124 is not limited. For example, the vibrating portion 124 may include a diaphragm.

Here, the supporting portion 125 is for supporting the vibration portion 124, and is also for being connected to a wall body forming the first receiving chamber; thereby achieving connection of the vibration part 124 with the wall body forming the first receiving chamber through the support part 125. The structure of the support portion 125 is not limited. For example, the supporting portion 125 may include an outer side sleeved on the vibrating portion 124.

Here, by separately disposing the audio playing component in the first accommodating cavity 111, the audio playing component can be prevented from being influenced by other structures.

Here, the implementation manner of the vibration portion 124 of the audio playing component being connected with the wall forming the first receiving cavity 111 through the supporting portion 125 of the audio playing component is not limited. For example, an opening is disposed on a wall of the first accommodating cavity 111, and the supporting portion 125 of the audio playing component is clamped in the opening; so that the inner side of the vibration part 124 is separated from the outer space by the wall of the first receiving cavity 111. Here, the electronic apparatus may further include a sealing member disposed between the supporting portion 125 and a wall body forming the opening, the sealing member being configured to seal the opening so as to ensure that the first receiving chamber 111 is a sealed chamber. Here, the sealing member may be a rubber member or a plastic member.

In the embodiment of the present application, the implementation manner of electrically connecting the audio circuit board 130 and the audio playing component is not limited. For example, the audio circuit board 130 and the audio playing component may be electrically connected through the first connecting wire 101.

In the embodiment of the present application, the implementation manner of electrically connecting the motherboard 150 and the audio circuit board 130 is not limited. For example, the main board 150 and the audio circuit board 130 may be electrically connected by a connection wire. For another example, the electronic device includes a first connection portion and a second connection portion, the first connection portion is fixed on the surface of the motherboard 150, and the first connection portion is electrically connected to the motherboard 150; the second connecting portion is fixed on the surface of the audio circuit board 130, the second connecting portion is electrically connected to the audio circuit board 130, the first connecting portion and the second connecting portion are butted and electrically connected, and the main board 150 and the audio circuit board 130 are electrically connected through the first connecting portion and the second connecting portion.

Here, when the electronic device includes the bottom cover 162, the main board 150 may be fixed to the bottom cover 162 as shown in fig. 16, so that the main board 150 may be placed in the second receiving cavity 112 along with the bottom cover 162 as shown in fig. 17.

In some optional implementations in the embodiment of the present application, the electronic device may further include: a first connection hole, a first connection wire 101 and a first sealing 102. The first connection holes communicate with the first accommodation chamber 111 and the second accommodation chamber 112, respectively. A first connecting wire 101 penetrates through the first connecting hole, and the first connecting wire 101 is electrically connected with the audio playing component and the audio circuit board 130 respectively; the first sealing element 102 is disposed between the first connecting wire 101 and an inner wall forming the first connecting hole, and the first sealing element 102 is used for sealing the first connecting hole, so that the first accommodating cavity 111 is a sealed cavity, and the audio performance of the audio playing component is improved.

In this implementation, the position where the first connection hole is provided is not limited. For example, as shown in fig. 1, the electronic device may further include: a partition plate 103, wherein the partition plate 103 is arranged between the first accommodating cavity 111 and the second accommodating cavity 112; the first connection hole is located on the partition plate 103.

In the present implementation, the audio circuit board 130 may be fixed to the partition 103 as shown in fig. 1 and 6 in order to reduce the length of the first connecting wire 101.

In the present implementation, the structure of the first seal 102 is not limited. For example, the first sealing member 102 may be of a plastic structure or a rubber structure.

In this implementation, the arrangement of the first accommodating cavity 111 and the second accommodating cavity 112 is not limited. For example, the first accommodating chamber 111 and the second accommodating chamber 112 are juxtaposed in a first direction; here, the first direction may be a height direction of the electronic device, as shown in fig. 1; the length direction of the electronic equipment can be also taken; but also the width direction of the electronic device.

In this implementation, the electronic device may further include: a first fixing structure disposed in the first accommodating cavity 111, the first fixing structure being connected to a fixing section of the first connecting wire 101, the first fixing structure being configured to prevent the first connecting wire 101 from vibrating; in order to reduce the influence of the first connecting wire 101 on the audio playback assembly.

Here, the first fixing structure may be a first fixing clip groove, and the fixing segment of the first connecting wire 101 is clipped in the first fixing clip groove. The first fixing structure may also be a first adhesive member, and the fixing section of the first connecting wire 101 is adhered to the first adhesive member; it should be noted that the first adhesive member can also absorb the sound generated by the vibration of the fixed segment of the first connecting wire 101, thereby improving the audio performance of the audio playing assembly.

In this implementation, the electronic device may further include: the first elastic piece is sleeved outside the suspended section of the first connecting wire 101 and used for preventing the suspended section of the first connecting wire 101 from vibrating to generate sound; the first elastic element is also used for absorbing sound generated by vibration of the suspended section of the first connecting wire 101, so that the audio performance of the audio playing assembly is improved.

Here, the structure of the first elastic member is not limited. For example, the first elastic member may be a plastic structure or a rubber structure.

In this implementation, the electronic device may further include: an audio receiving component, the audio receiving component comprising: at least one microphone disposed on a top wall body forming the first accommodating chamber 111; so that audio information can also be received by the electronic device.

Here, the audio receiving assembly may be electrically connected with the audio circuit board 130 through a connection wire.

For example, the electronic device may further include: a second connection hole, a second connection wire 104, and a second sealing member 109. The second connection hole is respectively communicated with the first accommodating cavity 111 and the second accommodating cavity 112; a second connecting wire 104 is inserted into the second connecting hole, and the second connecting wire 104 is electrically connected to the at least one microphone and the audio circuit board 130 respectively; the second sealing element 109 is disposed between the second connecting wire 104 and an inner wall forming the second connecting hole, and the second sealing element 109 is used for sealing the second connecting hole, so that the first accommodating cavity 111 is a sealed cavity, and the audio performance of the audio playing assembly is improved.

Here, the structure of the second seal 109 is not limited. For example, the second sealing member 109 may be a plastic member or a rubber member.

Here, when the electronic apparatus includes the partition plate 103, the second connection hole may also be provided on the partition plate 103.

Here, the second connection hole may be the same connection hole as the first connection hole, or may be a different connection hole.

Here, when the second connection hole is the same connection hole as the first connection hole, the first sealing member 102 and the second sealing member 109 may be the same sealing member in order to simplify a sealing structure. Of course, the first seal 102 and the second seal 109 may be different seals.

Here, when the second connection hole is a different connection hole from the first connection hole, the first sealing member 102 and the second sealing member 109 may be different sealing members.

Here, the electronic device may further include: the second fixing structure 107, the second fixing structure 107 is disposed in the first accommodating cavity 111, the second fixing structure 107 is connected to the fixing section of the second connecting wire 104, and the second fixing structure 107 is used for preventing the second connecting wire 104 from vibrating, so as to reduce the influence of the second connecting wire 104 on the audio playing component.

Here, the second fixing structure 107 may be a second fixing clip groove, and the fixing segment of the second connecting lead 104 is clipped in the second fixing clip groove. The second fixing structure 107 may also be a second adhesive, to which the fixing segment of the second connecting lead 104 is adhered; it should be noted that the second adhesive member can also absorb the sound generated by the vibration of the fixing segment of the second connecting wire 104, thereby improving the audio performance of the audio playing assembly.

Here, the fixing step portion of the second connecting lead 104 may be bonded to the second adhesive such that the first surface of the fixing step portion of the second connecting lead 104 is bonded to the second adhesive, as shown in fig. 4 and 8; the fixed segment of the second connecting wire 104 is bonded to the second bonding member, and the second bonding member wraps the outside of the fixed segment of the second connecting wire 104, as shown in fig. 9, so as to improve the fixing strength of the second connecting wire 104, and the fixed segment of the second connecting wire 104 can be completely separated from the body 110, and the second bonding member can absorb more vibration energy of the second connecting wire 104, thereby further improving the audio performance of the audio playing component.

In this implementation, as shown in fig. 10, the electronic device may further include: a second elastic member 108, wherein the second elastic member 108 is sleeved outside the suspended section of the second connecting wire 104, and the second elastic member 108 is used for preventing the suspended section of the second connecting wire 104 from vibrating to generate sound; the second elastic element 108 is also used for absorbing the sound generated by the vibration of the suspended section of the second connecting wire 104, thereby improving the audio performance of the audio playing component.

Here, the structure of the second elastic member 108 is not limited. For example, the second elastic member 108 may be a plastic member or a rubber member.

Here, the type of the second connecting wire 104 is not limited. For example, as shown in fig. 5, 7, and 8, the second connection lead 104 is a Flexible Flat Cable (FFC).

In some optional implementations of embodiments of the present application, the electronic device may further include: at least two first type openings 114, at least two first type openings 114 may be disposed on the adjacent sidewall body forming the first accommodating cavity 111, or disposed on the opposite sidewall body forming the first accommodating cavity 111, as shown in fig. 2. The electronic device may further include: at least two first type speakers 123, the at least two first type speakers 123 being used to output sound in different directions; the magnetic circuit part 121 of the first-type horn 123 is positioned in the first accommodating cavity 111, and the supporting part 125 of the first-type horn 123 is clamped in the first-type opening 114; therefore, the electronic equipment can generate sound in different directions, and the playing effect of the electronic equipment is improved.

In the present implementation, the number of the at least two first-type openings 114 is not limited. As an example, the number of the at least two first type openings 114 is two, as shown in fig. 2 and 4.

In this implementation, the type of the first type horn 123 is not limited. For example, as shown in fig. 1 and 3, the first type of horn 123 is a full range horn.

In this implementation, the electronic device may further include: a third sealing member arranged between the supporting portion 125 of said first type horn 123 and the wall forming said first type opening 114, for sealing said first type opening 114; so that the first accommodating cavity 111 forms a sealed cavity, and the playing effect of the first type of speaker 123 is improved.

Here, the structure of the third seal member is not limited. For example, the third sealing member may be a plastic member or a rubber member.

In this implementation, the electronic device may further include: at least two second type openings 113, wherein the at least two second type openings 113 are disposed on adjacent or opposite sidewall bodies forming the first accommodating cavity 111; the audio playing component may further include: at least two second type horns 122, the at least two second type horns 122 being for outputting sound in different directions; the supporting part of the second type horn 122 is clamped in the second type opening 113; therefore, the electronic device can generate sound in different directions through the second type of speaker 122, and the playing effect of the electronic device is improved.

Here, the number of the at least two second type openings 113 is not limited. As an example, the number of the at least two second type openings 113 is two, as shown in fig. 2.

Here, the type of the second type horn 122 is not limited. For example, as shown in fig. 3 and 4, the second type of horn 122 is a passive horn; the first type of horn 123 can sink the frequency of the super bass sound frequency response with the help of the bass basin of the passive horn, thereby improving the bass playing effect of the audio playing component. It is to be noted that when the horn 122 of the second type is a passive horn, the bass bowl of the passive horn forms a vibrating portion, and the passive horn has no magnetic circuit portion.

Here, the electronic device may further include: a fourth sealing member disposed between the supporting portion of the second type horn 122 and the wall forming the second type opening 113, the fourth sealing member being configured to seal the second type opening 113; so that the first accommodating cavity 111 forms a sealed cavity, and the playing effect of the second type loudspeaker 122 is improved.

Here, the structure of the fourth seal is not limited. For example, the fourth sealing member may be a plastic member or a rubber member.

In some optional implementations of embodiments of the application, the electronic device may further include: the processor is arranged on the mainboard 150, electrically connected with the audio receiving component of the electronic device, and used for identifying the audio information received by the audio receiving component, and adjusting the playing parameters of the audio playing component based on the audio data when the processor determines that the audio information comprises the audio data used for adjusting the audio playing component; so as to control the playing parameters of the audio playing component through the processor.

In this implementation manner, the playing parameter at least includes one of the following: sound size, playing sequence, playing target.

In some optional implementations of the embodiments of the application, as shown in fig. 11, the electronic device may further include: a UI plate 140, wherein the UI plate 140 is disposed on a top wall body forming the first accommodating cavity 111; so that the user can operate the electronic device through the UI board 140.

In this implementation manner, the audio receiving component may be disposed on the UI board 140, in this case, the second connecting wire 104 may be electrically connected to the UI board 140 and the audio circuit board 130, respectively, and the audio receiving component may be electrically connected to the audio circuit board 130 through the UI board 140. At this time, the top wall body forming the first receiving cavity 111 is disposed in the receiving hole group 190 corresponding to the audio receiving component.

In this implementation, when the electronic device includes the top cover 161, the top wall body forming the first receiving cavity 111 is the top cover 161.

In the present implementation, when the electronic device includes the top cover 161, the UI board 140 may be fixed to an inner surface of the top cover 161, as shown in fig. 11.

In this implementation, as shown in fig. 13, an outer surface of the top wall body forming the first accommodating cavity 111 may be further provided with an operation button 180 assembly, so that the electronic device is operated by operating the button 180.

In some optional implementations of the embodiments of the application, as shown in fig. 15 and 17, the electronic device may further include: the reticulated shell 105, the reticulated shell 105 is sleeved outside the body 110; so that the portion of the body 110 and the audio playing component exposed through the opening is protected by the mesh shell 105.

In this implementation manner, the structure of the net shell 105 is not limited as long as the net shell 105 and the corresponding portion of the audio playing component are provided with meshes. It is to be noted that the meshes of the net housing 105 in fig. 15, 18, 19 and 17 are not shown.

In this implementation, when the electronic device further includes the top cover 161 and the bottom cover 162, the mesh case 105 does not cover the top cover 161 and the bottom cover 162, so that the top cover 161 and the bottom cover 162 are opened.

In this implementation, the electronic device may further include a switch button 167, and the switch button 167 is used to control the audio playing component to be turned on or off.

Here, the structure of the switch button 167 connected to the body 110 is not limited. For example, as shown in fig. 18 and 19, the switch button 167 is connected to the body 110 by a spring 168.

In this implementation, as shown in fig. 19, the electronic device may further include a label 169, and the label 169 is attached to a surface of the electronic device.

In some optional implementations of the embodiment of the present application, as shown in fig. 1, the electronic device may further include a heat dissipation assembly 170, the heat dissipation assembly 170 is disposed in the second accommodating cavity 112, the heat dissipation assembly 170 is configured to dissipate heat for the motherboard 150 and the audio circuit board 130, and by disposing the heat dissipation assembly 170 in the second accommodating cavity 112, the influence of the air flow generated by the heat dissipation assembly 170 on the audio playing assembly can be prevented.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, the electronic device comprising:

2. The electronic device of claim 1, the first receiving cavity being a sealed cavity.

3. The electronic device of claim 1, further comprising:

4. The electronic device according to claim 3, wherein the first accommodating chamber and the second accommodating chamber are juxtaposed in a first direction; the first direction is the height direction of the electronic equipment;

the electronic device further includes:

the first connection hole is located on the partition plate.

5. The electronic device of claim 3, further comprising:

an audio receiving component, the audio receiving component comprising:

6. The electronic device of claim 5, the second connection hole being the same connection hole or a different connection hole than the first connection hole;

the first seal and the second seal are the same seal or different seals.

7. The electronic device of claim 5, further comprising:

8. The electronic device of claim 1, further comprising:

the audio playing component comprises:

the electronic device further includes:

9. The electronic device of claim 8, further comprising:

the audio playback assembly further comprises:

the electronic device further includes:

10. The electronic device of any of claims 1-9, further comprising: