CN1110822C - Posistor of laminar polymer - Google Patents
Posistor of laminar polymer Download PDFInfo
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- CN1110822C CN1110822C CN 97106303 CN97106303A CN1110822C CN 1110822 C CN1110822 C CN 1110822C CN 97106303 CN97106303 CN 97106303 CN 97106303 A CN97106303 A CN 97106303A CN 1110822 C CN1110822 C CN 1110822C
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Abstract
The present invention relates to a positive temperature coefficient thermistor which aims to provide a novel positive temperature coefficient thermistor of a lamellar heavy polymer. The positive temperature coefficient thermistor has the advantages of simple technology and low cost. The core materials of the positive temperature coefficient thermistor of the heavy polymer of the present invention are mainly formed by the combination of 45 to 55% of heavy polymers, 20 to 35% of conductive filler, 5 to 20% of surface treatment inorganic filler, 1 to 3% of processing agent, etc. The present invention has the advantage that the thermistor manufactured by the method has good performance. Besides, the thermistor can satisfy the requirements of a clamped coupling in an overcurrent protection safety unit in telephone communication, the cost is reduced, and the application is widened.
Description
The present invention relates to a kind of semistor.
Positive temperature coefficient thermistor is widely used in the fields such as current-limiting protection from the heating of adjusting power limit temperature, electric component; mainly contain pottery and high molecular polymer two big classes at present; and with the high molecular polymer be that the semistor of matrix has that initial zero power resistance is little, characteristics such as cutout speed is fast during current overload, safe current is big; the share of therefore, occupying in actual applications has the trend that rises gradually in recent years.In concrete application, lead-out mode to the thermistor electrode has different requirements, the high molecular polymer PTC thermistor is all made pin mode traditionally, adopt welding procedure only, but a lot of electric components need adopt clamping technology, just need corresponding laminated high molecular polymer PTC thermistor.Existing high molecular polymer positive-temperature-coefficient thermistor technology more complicated, the cost height.
The object of the invention is exactly to produce simple, the lower-cost novel posistor of laminar polymer device of a kind of technology.
Purpose of the present invention can be achieved through the following technical solutions: the posistor of laminar polymer device, metal level by two of core and cores constitutes, wherein, core is that a kind of thickness is the conducting polymer sheet material of 0.1-5mm, and metal level is that thickness is sheet metal or the wire netting of 0.01-0.03mm.
The core of described high molecular polymer positive-temperature-coefficient thermal resistor mainly is formed by combining by high molecular polymer 45-55%, conductive filler 20-35%, surface treated inorganic filler 5-20%, processing aid 1-3%.
Its moulding process is at first in banbury, and temperature is controlled at the above 50-80 of high molecular polymer fusing point ℃, shears torsional moment and be under the 0.2-0.7KNm condition mixing 5-10 minute, and discharging is after cooling, pulverize.Adopt hot-press method then, the mold temperature of hot pressing is controlled at 150 ℃-170 ℃ on press, and pressure is under the condition of 4MPa, and suppressing area is 100-10000cm
2, thickness is the sheet material of 0.1-5mm.Or adopt double screw extruder mixing, and to extrude with extruder, each of extruder section temperature is controlled at: extrude under 150 ℃, 160 ℃, 170 ℃, 180 ℃ the condition, the melt of extruding cools off with the calender typing, cuts into the sheet material of certain size again.Suppressing area is 100-10000cm
2, thickness is the sheet material of 0.1-5mm.This sheet material need carry out chemistry or cross-linking radiation, and described chemical crosslinking is to add crosslinking agent to carry out chemical crosslinking in mixture recipes under high temperature; Described cross-linking radiation is a core material sheet material of making Non-crosslinked earlier, and with gamma-rays or electron beam to irradiate crosslinked, irradiation dose is at 5-100mrad.Then in hot pressing under the above 10-50 of high molecular polymer melting temperature ℃ condition on the press, sheet metal hot pressing is covered on two of above-mentioned crosslinked high molecular polymer positive-temperature-coefficient sheet material, described metal level can be that thickness is the tinsel of 0.01-0.03mm, also can be the metal stratum reticulare of respective thickness.This metal lamella is as forming synusia shape composite board electrode, and the small pieces under die-cut are operational posistor of laminar polymer device by certain size with stamping machine with this composite plate.
Described high molecular polymer is meant the high molecular polymer of various partially crystallizable types, as polyethylene, poly-interior alkene, polytetrafluoroethylene, Kynoar, polytrifluorochloroethylene, nylon, poly terephthalic acid diethylester, polybutyl terapthalate, polyformaldehyde etc. and their co-polymer.
Described conductive filler is meant that carbon black, graphite, metal dust, various draw ratio are that the metallic fiber of 15-50, various draw ratio are inorfil and the organic fiber that the surface of 15-50 is coated with metal coating.
Described metal can be copper, iron, nickel, silver, aluminium and their alloy.
Described inorfil can be glass fibre, carbon fiber, mineral fibres; Described organic fiber can be natural organic fiber and Kevlar-49 synthetic organic fibres such as (Kevler-49) such as cotton.
Described inorganic filler is meant the inorganic compound of particle diameter ∠ 50 μ m, as zinc oxide, aluminium oxide, silicon dioxide, kaolin, talcum powder, calcium carbonate, aluminium hydroxide, magnesium hydroxide, calcium silicates etc.
Described processing aid is meant:
(1) antioxidant: mainly contain hindered phenolic antioxidant and amine antioxidants;
(2) auxiliary anti-oxidant: mainly contain phosphorous acid esters, phosphonic acid ester and thioether class auxiliary anti-oxidant;
(3) crosslinking agent: mainly be meant various organic peroxides;
(4) coupling agent: mainly be meant various silane and phthalate organic compound;
(5) lubricant: be meant that mainly hard acid ester salt class, oleic acid salt, low-molecular-weight Ployethylene Wax and low-molecular-weight polypropylene are cured etc.
(6) processing overall balance agent: mainly be vinyl-acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer.
The invention has the advantages that: the thermistor function admirable that makes with this method; as when being applied to the overcurrent protection of telephone communication; its every technical indicator all can be by the relevant industry standard of the Ministry of Posts and Telecommunications; can satisfy the requirement that plug-in connects in the overcurrent protection Security Unit in the telephone communication; reduce cost, enlarged application surface.
Embodiments of the invention are as follows:
Embodiment 1:
High molecular polymer is a polyethylene, and its volume content is 50%, and conductive filler is that its volume content of carbon black (particle diameter ∠ 100 μ m) is 30%, and inorganic filler is that zinc oxide (particle diameter ∠ 50 μ m) volume content is 8%, aluminium hydroxide (Al
2O
33H
2O, particle diameter ∠ 50 μ m) volume content is 10%, and processing aid is antioxidant, coupling agent, crosslinking agent, and its volume content is 2% mixingly in banbury under 190-200 ℃ of temperature evenly to place it in the pressing mold through cooling, after pulverizing, and is 4MPa/cm with pressure
2, temperature is that being pressed into area is 100cm under 170 ℃ the condition
2Thickness is the core of 2.0mm, with Ni after surfacingization, at pressure is that 2MPa, temperature are under 150 ℃ of conditions Ni to be hot-pressed onto two of core, this synusia composite board is struck out the 6*6mm small pieces on stamping machine, through finishing can be practical the posistor of laminar polymer device, zero power resistance ∠ 10 Ωs of this resistor in the time of 25 ℃, the extreme difference ∠ 30% that resistance appreciates after 20 surges.
Embodiment 2:
High molecular polymer is a polyethylene, its volume content is 50%, conductive filler is that its volume content of carbon black (particle diameter ∠ 50 μ m) is 30%, inorganic filler is that magnesium hydroxide (particle diameter ∠ 50 μ m) volume content is 18%, processing aid is antioxidant, coupling agent, and its volume content is 2%, and is mixing even in banbury under 190-200 ℃ of temperature, placing it in the pressing mold after cooling, pulverizing, is 4MPa/cm with pressure
2, temperature is that being pressed into area is 100cm under 170 ℃ the condition
2Thickness is the core of 2.0mm, with this core through Co
80Gamma-ray irradiation, dosage is 12Mrad, through irradiated core, with the Ni sheet after surfacingization, at pressure is to be hot-pressed onto two of core under 150 ℃ of conditions for the 2Mpa temperature, and this synusia composite board is struck out the 6*6mm small pieces on stamping machine, can practical posistor of laminar polymer device, zero power resistance ∠ 10 Ωs of this resistor in the time of 25 ℃, the extreme difference ∠ 30% that resistance appreciates after 20 surges.
Embodiment 3:
Method for mixing is changed into double screw extruder mixing, other conditions are all identical with embodiment 2, can obtain the product similar with embodiment 2.
Embodiment 4:
The preparation of core changes into extruder extrudes.Each of extruder section temperature is controlled under 150 ℃, 160 ℃, 170 ℃, 180 ℃ the condition and extrudes, and it is 100cm that the melt of extruding cuts into area again with calender typing cooling
2, thickness is the core of 2.0mm, other conditions are all identical with embodiment 2, can obtain the product similar with embodiment 2.
Embodiment 5:
The radiation mode of core changes electron beam irradiation into, and dosage is 12Mrad, and other conditions are all identical with embodiment 2, can obtain the product similar with embodiment 2.
Embodiment 6:
High molecular polymer is a polyethylene, its volume content is 48%, processing overall balance agent is an ethylene-vinyl acetate copolymer, volume content is 5%, and conductive filler is carbon black (particle diameter ∠ 50 μ m), and its volume content is 30%, inorganic filler is that alundum (Al (particle diameter ∠ 50 μ m) volume content is 15%, processing aid is antioxidant, coupling agent, and its volume content is that 2% other conditions are all identical with embodiment 2, can obtain the product similar with embodiment 2.
Embodiment 7:
Conductive filler change nickel powder into, volume content is 30%, other conditions are all identical with embodiment 6, can obtain the product similar with embodiment 6.
Embodiment 8:
Conductive filler is changed into the carbon fiber (draw ratio is 20) of plating nickel on surface, and volume content is 30%, and other conditions are all identical with embodiment 6, can obtain the product similar with embodiment 6.
Claims (7)
1, the posistor of laminar polymer device, metal level by two of core and cores constitutes, and its characteristic is: described core is that a kind of thickness is the conducting polymer sheet material of 0.1-5mm, and metal level is that thickness is sheet metal or the wire netting of 0.01-0.03mm; Wherein, the volume percent content of forming described conducting polymer core is high molecular polymer 45-55%, conductive filler 20-35%, inorganic filler 5-20%, processing aid 1-3%, wherein, described high molecular polymer is meant the high molecular polymer of partially crystallizable type, comprises a kind of in polyethylene, polypropylene, polytetrafluoroethylene, Kynoar, polytrifluorochloroethylene, nylon, poly terephthalic acid diethylester, polybutyl terapthalate, the polyformaldehyde and their co-polymer; Described conductive filler is that carbon black, graphite, metal dust, various draw ratio are that the metallic fiber of 15-50, various draw ratio are that the surface of 15-50 is coated with the inorfil of metal coating or a kind of or its mixture in the organic fiber; Described processing aid is more than one a mixture of antioxidant, auxiliary anti-oxidant, crosslinking agent, coupling agent, lubricant, processing overall balance agent; Described inorganic filler is meant that particle diameter is less than a kind of in the zinc oxide of 50 μ m, aluminium oxide, silicon dioxide, kaolin, talcum powder, calcium carbonate, aluminium hydroxide, magnesium hydroxide, the calcium silicates and more than one; Wherein, antioxidant: mainly contain hindered phenolic antioxidant and amine antioxidants; Auxiliary anti-oxidant: mainly contain phosphorous acid esters, phosphonic acid ester and thioether class auxiliary anti-oxidant; Crosslinking agent: mainly be meant various organic peroxides; Coupling agent: mainly be meant various silane and phthalate organic compound; Lubricant: be meant that mainly hard acid ester salt class, oleic acid salt, low-molecular-weight Ployethylene Wax and low-molecular-weight polypropylene are cured; Processing overall balance agent mainly is vinyl-acrylate copolymer, ethylene-methyl acrylate copolymer, ethylene-vinyl acetate copolymer.
2, posistor of laminar polymer device according to claim 1 is characterised in that: described metal level is a kind of in copper, iron, nickel, silver, aluminium and their alloy.
3, posistor of laminar polymer device according to claim 1, be characterised in that: the preparation method of described core, at first will be pressed into certain thickness core material sheet material after each batch mixes processing, two at core paste sheet metal respectively, are cut into the size that needs at last.
4, posistor of laminar polymer device according to claim 3, be characterised in that: in the preparation method of core, described hybrid process mode is for selecting mixer mixing for use, melting temperature is controlled at the above 50-80 of polymeric matrix melting temperature ℃, the shearing torsional moment is 0.2-0.7KNm, pulverizes after the mixing 5-10 minute discharging; Described compacting method in blocks is put into mould for adopting hot-press method with stock, and it is 4MPa that the mold temperature of hot pressing is controlled at 150 ℃-170 ℃, pressure.
5, posistor of laminar polymer device according to claim 3, it is characterized in that: the preparation method of described core, adopt the mixing back of double screw extruder to extrude with extruder, extruder feeding section to each temperature section of head is: 150 ℃, 160 ℃, 170 ℃, 180 ℃, the melt of extruding cools off with the calender typing, cuts into the core material sheet material of certain size again.
6. posistor of laminar polymer device according to claim 5 is characterised in that: in the preparation method of core, described conducting polymer core material sheet material carries out chemical crosslinking under high temperature when extruder is extruded processing.
7, posistor of laminar polymer device according to claim 3 is characterized in that: in the preparation method of core, and the conducting polymer core material sheet material of making, with gamma-rays or electron beam to irradiate crosslinked, irradiation dose is at 5-100mrad.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 97106303 CN1110822C (en) | 1996-07-16 | 1997-03-03 | Posistor of laminar polymer |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 96116425 CN1174383A (en) | 1996-07-16 | 1996-07-16 | Laminated high molecular polymer positive-temperature-coefficient thermal resistor |
| CN96116425.5 | 1996-07-16 | ||
| CN 97106303 CN1110822C (en) | 1996-07-16 | 1997-03-03 | Posistor of laminar polymer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1222743A CN1222743A (en) | 1999-07-14 |
| CN1110822C true CN1110822C (en) | 2003-06-04 |
Family
ID=25744022
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 97106303 Expired - Fee Related CN1110822C (en) | 1996-07-16 | 1997-03-03 | Posistor of laminar polymer |
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| Country | Link |
|---|---|
| CN (1) | CN1110822C (en) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6197220B1 (en) * | 2000-06-06 | 2001-03-06 | Therm-O-Disc Corporation | Conductive polymer compositions containing fibrillated fibers and devices |
| US6620343B1 (en) * | 2002-03-19 | 2003-09-16 | Therm-O-Disc Incorporated | PTC conductive composition containing a low molecular weight polyethylene processing aid |
| CN102427617B (en) * | 2011-09-02 | 2013-07-10 | 西安盖沃热能科技有限公司 | Unidirectional heat transfer flame retardation PTC macromolecule self-limiting temperature electrothermal film and preparation method thereof |
| CN102315408A (en) * | 2011-09-29 | 2012-01-11 | 北京神州远望科技有限公司 | Reusable thermistor overcurrent protection device and application in battery module |
| CN102723153B (en) * | 2012-06-20 | 2016-05-18 | 上海神沃电子有限公司 | A kind of PTC core and manufacture and application with ptc characteristics |
| CN103408835B (en) * | 2013-07-15 | 2016-08-10 | 惠州市昌亿科技股份有限公司 | A kind of fiberglass reinforced heat transfer heat conduction PP composite and its preparation method and application |
| CN103484028B (en) * | 2013-07-24 | 2015-09-30 | 深圳市金瑞电子材料有限公司 | Enhanced polyethylene is with the method for metalwork strength of joint |
| CN104693649B (en) * | 2015-03-03 | 2017-01-11 | 界首市天鸿新材料股份有限公司 | Monocyclic carboxylate nucleating agent modified polytrifluorochloroethylene |
| CN106068041A (en) * | 2016-06-07 | 2016-11-02 | 安邦电气股份有限公司 | A kind of self limiting temperature accompanying-heat cable convenient for installation and maintenance |
| CN106229098B (en) * | 2016-08-09 | 2018-08-31 | 安徽省宁国天成电工有限公司 | A kind of thermal resistor and its application based on three-dimensional netted graphene |
| CN106947248A (en) * | 2017-05-08 | 2017-07-14 | 句容市博远电子有限公司 | A kind of macromolecular PTC thermistor and preparation method thereof |
-
1997
- 1997-03-03 CN CN 97106303 patent/CN1110822C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1222743A (en) | 1999-07-14 |
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