CN111065208A - Circuit board and preparation method thereof - Google Patents
Circuit board and preparation method thereof Download PDFInfo
- Publication number
- CN111065208A CN111065208A CN201911422725.9A CN201911422725A CN111065208A CN 111065208 A CN111065208 A CN 111065208A CN 201911422725 A CN201911422725 A CN 201911422725A CN 111065208 A CN111065208 A CN 111065208A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulating layer
- recess
- metal layer
- optical fiber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/424—Mounting of the optical light guide
- G02B6/4243—Mounting of the optical light guide into a groove
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Couplings Of Light Guides (AREA)
Abstract
The invention discloses a circuit board and a preparation method thereof, wherein the method comprises the steps of providing a substrate, wherein the substrate comprises a first metal layer, a first insulating layer and a second metal layer which are arranged in a stacking mode; etching the first metal layer and the first insulating layer to form a recess; disposing an optical fiber along the recessed bottom and side walls; and forming a second insulating layer in the recess to cover the portion of the optical fiber in the recess. Therefore, the embedded type arrangement of the optical fibers is realized, the situation that the optical fibers are arranged on the surface of the circuit board to occupy space and influence other modules is avoided, and the integration level of a product is improved.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a circuit board and a preparation method thereof.
Background
At present, the semiconductor industry has a strong demand for miniaturization of devices.
For some optoelectronic devices, the arrangement of optical fibers is involved in the packaging process, and the prior art is to perform wiring on a circuit board, but such a form occupies space on the circuit board, which is not favorable for high integration of the device.
Disclosure of Invention
The invention aims to provide a circuit board and a preparation method thereof, and the circuit board and the preparation method thereof can improve the packaging integration level.
In order to solve the above technical problem, the present invention provides a method for manufacturing a circuit board, comprising:
providing a substrate, wherein the substrate comprises a first metal layer, a first insulating layer and a second metal layer which are arranged in a stacked mode;
etching the first metal layer and the first insulating layer to form a recess;
disposing an optical fiber along the recessed bottom and side walls; and
and forming a second insulating layer in the recess to cover the part of the optical fiber in the recess.
Optionally, in the method for manufacturing the circuit board, the first metal layer and the first insulating layer are etched by laser.
Optionally, in the preparation method of the circuit board, the depth of the recess is 1/3-2/3 of the total thickness of the circuit board.
Optionally, for the preparation method of the circuit board, the second insulating layer is formed by a pressing process.
Optionally, in the method for manufacturing a circuit board, one end of the optical fiber is exposed on the front surface of the circuit board, and the other end of the optical fiber is exposed on the side surface of the circuit board.
Optionally, for the method for manufacturing a circuit board, the recess is step-shaped.
The present invention also provides a circuit board comprising:
a second metal layer;
a first insulating layer disposed on the second metal layer, the first insulating layer having a recess;
an optical fiber disposed in the recess;
a first metal layer disposed on the first insulating layer at a non-recessed position; and
and the second insulating layer is arranged on the first insulating layer and covers the part of the optical fiber, which is positioned in the recess.
Optionally, for the circuit board, one end of the optical fiber is exposed on the front surface of the circuit board, and the other end of the optical fiber is exposed on the side surface of the circuit board.
Optionally, for the circuit board, the recess is stepped.
The invention provides a circuit board and a preparation method thereof, wherein the method comprises the steps of providing a substrate, wherein the substrate comprises a first metal layer, a first insulating layer and a second metal layer which are arranged in a stacking mode; etching the first metal layer and the first insulating layer to form a recess; disposing an optical fiber along the recessed bottom and side walls; and forming a second insulating layer in the recess to cover the portion of the optical fiber in the recess. Therefore, the embedded type arrangement of the optical fibers is realized, the situation that the optical fibers are arranged on the surface of the circuit board to occupy space and influence other modules is avoided, and the integration level of a product is improved.
Drawings
FIG. 1 is a flow chart of a method for manufacturing a circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of a substrate according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view illustrating the formation of a recess in accordance with one embodiment of the present invention;
FIG. 4 is a cross-sectional view of an embodiment of the present invention illustrating the formation of an optical fiber;
FIG. 5 is a cross-sectional view illustrating the formation of a second insulating layer according to an embodiment of the present invention;
fig. 6 is a schematic cross-sectional view of a circuit board in an embodiment of the invention.
Detailed Description
The circuit board and the method for manufacturing the same of the present invention will be described in more detail with reference to the schematic drawings, in which preferred embodiments of the present invention are shown, it being understood that those skilled in the art can modify the invention described herein while still achieving the advantageous effects of the present invention. Accordingly, the following description should be construed as broadly as possible to those skilled in the art and not as limiting the invention.
The invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
In the description that follows, it will be understood that when a layer (or film), region, pattern, or structure is referred to as being "on" a substrate, layer (or film), region, and/or pattern, it can be directly on another layer or substrate, and/or intervening layers may also be present. In addition, it will be understood that when a layer is referred to as being "under" another layer, it can be directly under the other layer, and/or one or more intervening layers may also be present. In addition, references to "on" and "under" layers may be made based on the drawings.
As shown in fig. 1, the present embodiment proposes a method for manufacturing a circuit board, including:
step S101, providing a substrate, wherein the substrate comprises a first metal layer, a first insulating layer and a second metal layer which are arranged in a stacked mode;
step S102, etching the first metal layer and the first insulating layer to form a recess;
step S103, arranging the optical fiber along the bottom wall and the side wall of the recess; and
step S104, forming a second insulating layer in the recess to cover the portion of the optical fiber in the recess.
Therefore, embedded arrangement of the optical fibers is realized, and the improvement of the integration level is facilitated.
The following examples are given for illustrative purposes of the present invention, and it should be understood that the present invention is not limited to the following examples, and other modifications by conventional means of ordinary skill in the art are within the scope of the present invention.
In this embodiment, a method for manufacturing a circuit board is provided, and the embodiment is directed to further optimization and supplementation in the first embodiment, specifically:
referring to fig. 2, fig. 2 is a schematic cross-sectional view of the substrate in the present embodiment.
For step S101: providing a substrate comprising a first metal layer 21, a first insulating layer 10 and a second metal layer 22 arranged in a stack;
further, a first surface insulating layer 11 and a second surface insulating layer 12 may be respectively disposed on the front and back surfaces of the substrate.
The substrate may be, for example, a prior art product.
Referring to fig. 3, for step S102, the first metal layer 21 and the first insulating layer 10 are etched to form a recess 30.
In one embodiment, this step may be performed using laser etching. Further, for example, wet etching or dry etching may be selectively used.
In one embodiment, the recess 30 is stepped.
In one embodiment, the depth of the recess 30 is 1/3-2/3, such as 1/2, and the like, of the total thickness of the circuit board, and specifically, the depth refers to the distance from the surface of the first surface insulation layer 11 to the bottom of the recess 30.
Next, referring to fig. 4, the optical fiber 40 is disposed along the bottom wall and the side wall of the recess 30.
Specifically, the optical fiber 40 has two ends respectively extending beyond the recess 30, such as one end extending beyond the upper surface and one end extending beyond the side surface.
Then, referring to fig. 5, a second insulating layer 50 is formed in the recess to cover the portion of the optical fiber 40 in the recess.
In one embodiment, the second insulating layer 50 may be made of the same material as the first insulating layer 10.
In one embodiment, the second insulating layer 50 is formed by a pressing process.
Further, after the second insulating layer 50 is formed, a planarization process may be further performed to planarize the second insulating layer 50.
Referring to fig. 6, by the above method, the present invention obtains a circuit board, including:
a second metal layer 22;
a first insulating layer 10 disposed on the second metal layer 22, the first insulating layer having a recess;
an optical fiber 40 disposed in the recess;
a first metal layer 21 disposed on the first insulating layer 10 at a non-recessed position; and
a second insulating layer 50 disposed on the first insulating layer 10 covers a portion of the optical fiber 40 located in the recess.
As can be seen in fig. 6, the optical fibers 40 are exposed at one end to the front surface of the circuit board and at the other end to the side surface of the circuit board.
In an embodiment of the invention, the recess is stepped.
Further, a first surface insulating layer 11 and a second surface insulating layer 12 may be respectively disposed on the front and back surfaces of the circuit board, wherein the first surface insulating layer 11 is located on the first metal layer.
Fig. 6 also illustrates the use condition of the circuit board obtained by the present invention, for example, the optical fiber can be directly externally used without special winding.
In summary, in the circuit board and the method for manufacturing the same provided by the present invention, the method includes providing a substrate, where the substrate includes a first metal layer, a first insulating layer and a second metal layer, which are stacked; etching the first metal layer and the first insulating layer to form a recess; disposing an optical fiber along the recessed bottom and side walls; and forming a second insulating layer in the recess to cover the portion of the optical fiber in the recess. Therefore, the embedded type arrangement of the optical fibers is realized, the situation that the optical fibers are arranged on the surface of the circuit board to occupy space and influence other modules is avoided, and the integration level of a product is improved.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (9)
1. A method for manufacturing a circuit board, comprising:
providing a substrate, wherein the substrate comprises a first metal layer, a first insulating layer and a second metal layer which are arranged in a stacked mode;
etching the first metal layer and the first insulating layer to form a recess;
disposing an optical fiber along the recessed bottom and side walls; and
and forming a second insulating layer in the recess to cover the part of the optical fiber in the recess.
2. The method of manufacturing a circuit board according to claim 1, wherein the first metal layer and the first insulating layer are etched using a laser.
3. The method for manufacturing a circuit board according to claim 1, wherein the depth of the recess is 1/3-2/3 of the total thickness of the circuit board.
4. The method of manufacturing a circuit board according to claim 1, wherein the second insulating layer is formed by a press-fit process.
5. The method of manufacturing a circuit board according to claim 1, wherein one end of the optical fiber is exposed on the front surface of the circuit board and the other end is exposed on the side surface of the circuit board.
6. The method for manufacturing a circuit board according to claim 1, wherein the recess is stepped.
7. A circuit board, comprising:
a second metal layer;
a first insulating layer disposed on the second metal layer, the first insulating layer having a recess;
an optical fiber disposed in the recess;
a first metal layer disposed on the first insulating layer at a non-recessed position; and
and the second insulating layer is arranged on the first insulating layer and covers the part of the optical fiber, which is positioned in the recess.
8. The circuit board of claim 1, wherein the optical fiber has one end exposed at a front surface of the circuit board and another end exposed at a side surface of the circuit board.
9. The circuit board of claim 1, wherein the recess is stepped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911422725.9A CN111065208A (en) | 2019-12-31 | 2019-12-31 | Circuit board and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911422725.9A CN111065208A (en) | 2019-12-31 | 2019-12-31 | Circuit board and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111065208A true CN111065208A (en) | 2020-04-24 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911422725.9A Pending CN111065208A (en) | 2019-12-31 | 2019-12-31 | Circuit board and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111065208A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040031555A1 (en) * | 2002-08-16 | 2004-02-19 | Young-Woo Kim | Method of embedding optical fiber in multilayer printed circuit board |
| KR20110090406A (en) * | 2010-02-03 | 2011-08-10 | 고려오트론(주) | Connecting apparatus for optical-pcbs |
| CN107526138A (en) * | 2017-09-25 | 2017-12-29 | 中山市美速光电技术有限公司 | A kind of Double End fiber array and its manufacture method |
| CN109358393A (en) * | 2018-11-22 | 2019-02-19 | 中山市美速光电技术有限公司 | A kind of high-temperature resistant optical fiber array and its manufacturing method |
| CN109839696A (en) * | 2017-11-29 | 2019-06-04 | 建毅科技股份有限公司 | The manufacturing method of soft board fibre circuit device |
-
2019
- 2019-12-31 CN CN201911422725.9A patent/CN111065208A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040031555A1 (en) * | 2002-08-16 | 2004-02-19 | Young-Woo Kim | Method of embedding optical fiber in multilayer printed circuit board |
| KR20110090406A (en) * | 2010-02-03 | 2011-08-10 | 고려오트론(주) | Connecting apparatus for optical-pcbs |
| CN107526138A (en) * | 2017-09-25 | 2017-12-29 | 中山市美速光电技术有限公司 | A kind of Double End fiber array and its manufacture method |
| CN109839696A (en) * | 2017-11-29 | 2019-06-04 | 建毅科技股份有限公司 | The manufacturing method of soft board fibre circuit device |
| CN109358393A (en) * | 2018-11-22 | 2019-02-19 | 中山市美速光电技术有限公司 | A kind of high-temperature resistant optical fiber array and its manufacturing method |
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Application publication date: 20200424 |
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| RJ01 | Rejection of invention patent application after publication |