CN111031687A - Method for preparing heat dissipation circuit board - Google Patents
Method for preparing heat dissipation circuit board Download PDFInfo
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- CN111031687A CN111031687A CN201911390577.7A CN201911390577A CN111031687A CN 111031687 A CN111031687 A CN 111031687A CN 201911390577 A CN201911390577 A CN 201911390577A CN 111031687 A CN111031687 A CN 111031687A
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0207—Cooling of mounted components using internal conductor planes parallel to the surface for thermal conduction, e.g. power planes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0256—Electrical insulation details, e.g. around high voltage areas
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
- H05K1/113—Via provided in pad; Pad over filled via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/07—Electric details
- H05K2201/0753—Insulation
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a method for preparing a heat dissipation circuit board, which comprises the following steps: forming a through hole penetrating through the metal plate at a predetermined position of the metal plate, and filling insulating resin in the through hole; locally etching two opposite surfaces of the metal plate to obtain a metal heat dissipation plate and heat conduction bosses formed on two opposite sides of the metal heat dissipation plate; removing the insulating resin protruding out of the surface of the metal radiating plate; arranging an insulating layer and a copper foil layer on two opposite sides of the metal heat dissipation plate; manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole; manufacturing a conductive circuit and a device heat conduction bonding pad on two opposite surfaces of the circuit board; the conductive circuits on the two opposite surfaces of the circuit board are electrically connected through the conductive through holes, and the device heat conduction bonding pad is directly connected with the heat conduction boss. The preparation method of the circuit board enables the conductive circuit and the insulating base material to have good bonding force, and the electric insulation reliability between the conductive via hole and the metal heat dissipation plate is high.
Description
Technical Field
The invention relates to the field of circuit boards; and more particularly, to a method of making a circuit board.
Background
Power semiconductor devices such as LEDs (light emitting diodes), MOSFETs (power field effect transistors), IGBTs (insulated gate bipolar transistors) and the like generally have a circuit board as a mounting carrier, and the circuit board as the mounting carrier is required to have good heat conductivity because the power semiconductor devices generate a large amount of heat during operation.
Chinese patent application CN201110031935.2 discloses a method for manufacturing a double-layer high heat dissipation sandwich metal-based printed circuit board, in which a copper-based or aluminum-based heat dissipation plate is disposed at the core of an insulating substrate to form a "sandwich metal circuit board, so as to utilize the copper-based or aluminum-based heat dissipation plate to enhance the heat dissipation performance of the circuit board. However, since the copper-based or aluminum-based heat dissipation plate is disposed in the core portion of the insulating substrate, the power semiconductor device mounted on the insulating substrate cannot be directly connected to the copper-based or aluminum-based heat dissipation plate, and therefore the heat dissipation performance of the circuit board is still to be further improved.
Chinese patent application CN201110139947.7 discloses a method for preparing a printed circuit board with a metal micro-radiator, which comprises the steps of preparing a metal bottom layer and a metal micro-radiator which are connected into a whole, and combining a conventional printed circuit board with the metal bottom layer and the metal micro-radiator into a whole; the power semiconductor device is arranged on the surface of the metal micro radiator, and heat emitted during working can be conducted to the metal bottom layer through the metal micro radiator and then conducted to the outside of the printed circuit board through the metal bottom layer, so that the problem of heat conduction between the power semiconductor device and the metal plate is effectively solved. However, the circuit board obtained by the preparation method can only be provided with a power device on one side, and is more limited in application occasions.
Disclosure of Invention
Aiming at the defects of the prior art, the invention mainly aims to provide a preparation method of a heat dissipation circuit board with conductive circuits on two sides, the circuit board is provided with a sandwich type metal heat dissipation plate, the preparation method can ensure that the conductive circuits on the surface of the circuit board have good bonding force with an insulating layer, and the electric insulation reliability between the conductive through holes and the metal heat dissipation plate is high.
In order to achieve the above main object, an embodiment of the present invention provides a method for manufacturing a heat dissipation circuit board, including the steps of:
forming a through hole penetrating through the metal plate at a preset position of the flat metal plate, and filling insulating resin in the through hole;
covering a preset area of two opposite surfaces of the metal plate with a corrosion resistant film, and etching the area which is not covered by the corrosion resistant film in the two opposite surfaces of the metal plate to obtain a metal heat dissipation plate and heat conduction bosses formed on two opposite sides of the metal heat dissipation plate;
removing the insulating resin protruding out of the surface of the metal radiating plate;
the insulating layer and the copper foil layer are sequentially arranged on two opposite sides of the metal heat dissipation plate, the insulating layer and the copper foil layer are provided with windows through which the heat conduction bosses penetrate, and the surfaces of the copper foil layer and the heat conduction bosses are flush;
manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole, wherein the diameter of the conductive through hole is smaller than that of the through hole;
manufacturing a conductive circuit and a device heat conduction bonding pad on two opposite surfaces of the circuit board; the conductive circuits on the two opposite surfaces of the circuit board are electrically connected through the conductive through holes, and the device heat conduction bonding pad is directly connected with the heat conduction boss.
According to the technical scheme, the through hole of the metal plate is filled with the insulating resin, so that the space in the through hole can be completely filled with the insulating resin, and the conductive through hole and the metal heat dissipation plate are reliably and electrically insulated by the insulating resin in the through hole, so that the circuit board has good electrical insulation performance. Particularly, insulating resin is filled in the through hole of the metal plate, then the insulating layer and the copper foil layer are arranged on two sides of the metal heat dissipation plate formed by etching, and then the conductive through hole is formed, so that the conductive circuit (particularly the conductive circuit at the connection part of the conductive through hole) and the insulating layer have good bonding force.
According to a preferred embodiment of the invention, the copper foil layer is a calendered copper foil layer. And the rolled copper foil layer is adopted, so that the bonding force between the conductive circuit and the insulating layer is further improved.
According to a preferred embodiment of the present invention, the insulating layer includes a base insulating film for supporting the copper foil layer and an insulating adhesive layer adhesively connecting the base insulating film and the metal heat dissipation plate, and the insulating adhesive layer has a thermal expansion coefficient between that of the base insulating film and that of the insulating resin.
In the technical scheme, through controlling the thermal expansion coefficient of the material, the bonding performance deterioration caused by the difference of the thermal expansion coefficients between the insulating adhesive layer and the insulating base film and between the insulating adhesive layer and the insulating resin can be reduced, and the bonding force between the conductive circuit and the insulating layer can be further improved. In particular, by controlling the thermal expansion coefficient of the material, the probability of generating a gap between the insulating adhesive layer and the insulating resin due to a difference in thermal expansion coefficient after long-term use can be reduced, which gap will significantly reduce the electrical insulating ability between the conductive via and the metal heat sink.
In the present invention, the metal plate is preferably a flat copper plate, and the heights of the heat conductive bosses on the two opposite surface sides of the metal heat dissipation plate are the same, so that etching can be performed easily. Wherein each of the thermally conductive bosses may have the same or different shapes.
In the present invention, the device thermal pad is preferably formed to completely cover the thermal conductive boss to promote minimization of thermal resistance therebetween.
According to an embodiment of the present invention, the insulating resin protruding from the surface of the metal heat sink is removed by mechanical milling.
According to one embodiment of the present invention, the conductive via includes a conductive ring and a resin filled in the conductive ring, and the step of forming the conductive via includes: forming an insulation hole penetrating through the circuit board at a position corresponding to the through hole, wherein the diameter of the insulation hole is smaller than that of the through hole; forming a conductive ring on the entire inner wall of the insulating hole; and filling resin in the conductive ring by a resin hole filling process.
Preferably, the step of forming the conductive via further comprises grinding the two opposing surfaces of the circuit board after filling the resin.
According to a more specific embodiment of the present invention, a first copper-clad layer connected to a conductive ring is formed on two opposite surfaces of a circuit board while the conductive ring is formed; after the resin is filled into the conductive ring, the copper foil layers and the first copper-clad layers on the two opposite surfaces of the circuit board are subjected to graphical etching treatment, so that conductive circuits and device heat-conducting bonding pads are manufactured on the two opposite surfaces of the circuit board.
According to another more specific embodiment of the present invention, the conductive ring is formed while forming the first copper clad layers connected to the conductive ring on two opposite surfaces of the circuit board; after resin is filled into the conductive ring, second copper-clad layers are formed on two opposite surfaces of the circuit board; and carrying out graphical etching treatment on the copper foil layers, the first copper-clad layers and the second copper-clad layers on the two opposite surfaces of the circuit board so as to manufacture conductive circuits and device heat-conducting bonding pads on the two opposite surfaces of the circuit board.
The circuit board preparation method can also comprise other steps, such as a step of manufacturing solder masks on two opposite surfaces of the circuit board, wherein the solder masks are configured to expose the conductive pads in the conductive circuit and the device heat conduction pads.
To more clearly illustrate the objects, technical solutions and advantages of the present invention, the present invention will be further described in detail with reference to the accompanying drawings and detailed description.
Drawings
FIG. 1 is a schematic structural diagram of a method for forming a through hole in a flat metal plate and filling an insulating resin in the through hole according to an embodiment of the present invention;
FIG. 2 is a schematic view showing a structure in which resist films are coated on predetermined regions of both opposite surfaces of a metal plate according to an embodiment of the production method of the present invention;
FIG. 3 is a schematic structural diagram of a metal plate after two opposite surfaces of the metal plate are partially etched according to an embodiment of the manufacturing method of the present invention;
FIG. 4 is a schematic structural view of an embodiment of the method for manufacturing a heat sink of the present invention, in which the insulating resin protruding from the surface of the metal heat sink is removed;
fig. 5 is a schematic structural view illustrating an insulating layer and a copper foil layer are disposed on opposite sides of a metal heat dissipation plate according to an embodiment of a method of manufacturing the heat dissipation plate;
FIG. 6 is a schematic structural diagram of an embodiment of a manufacturing method of the present invention for forming an insulation hole penetrating a circuit board;
FIG. 7 is a schematic structural diagram of a conductive ring formed on the inner wall of the insulating hole and a first copper-clad layer formed on two opposite surfaces of the circuit board according to the embodiment of the present invention;
FIG. 8 is a schematic structural diagram of a conductive ring filled with resin according to an embodiment of the present invention;
FIG. 9 is a schematic structural diagram of a second copper-clad layer formed on two opposite surfaces of a circuit board according to an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of a method for manufacturing a circuit board according to an embodiment of the present invention, in which conductive traces and device heat-conducting pads are formed on two opposite surfaces of the circuit board;
fig. 11 is a schematic structural diagram of a solder resist layer manufactured by an embodiment of the manufacturing method of the present invention.
Detailed Description
The preparation method comprises the steps of forming a through hole penetrating through a flat metal plate at a preset position of the metal plate, and filling insulating resin in the through hole. An example of this step can be seen in fig. 1, a plurality of through holes 12 penetrating through the metal plate 11 are formed at predetermined positions of the flat metal plate 11 by, for example, a mechanical drilling or laser drilling process, and the through holes 12 are filled with an insulating resin 13. The metal plate 11 is preferably a copper plate, and the number of the through holes 12 may be set as required.
The preparation method comprises the step of carrying out local etching treatment on two opposite surfaces of the metal plate so as to manufacture the heat conduction bosses on two opposite sides of the metal plate. For example, referring to fig. 2, resist films 14 are coated on predetermined regions of both opposite surfaces of the metal plate 11, and regions of both opposite surfaces of the metal plate 11 not coated with the resist films 14 are etched; as shown in fig. 3, the metal heat sink 111 and the heat conductive bosses 112 formed on opposite sides of the metal heat sink 111 are obtained after etching. The heights of the heat conductive bosses 112 on two opposite surfaces of the metal heat dissipation plate 111 are the same.
The preparation method comprises the step of removing the insulating resin protruding out of the surface of the metal heat dissipation plate. For example, the insulating resin 13 protruding from the surface of the metal heat sink 111 is removed by mechanical milling (depth milling) so that the surfaces of the insulating resin 13 and the metal heat sink 111 are flush with each other as shown in fig. 4.
The preparation method comprises the step of sequentially arranging the insulating layer and the copper foil layer on two opposite sides of the metal heat dissipation plate. For example, referring to fig. 5, the insulating layer includes an insulating base film 310 for supporting the copper foil layer 31 and an insulating adhesive layer 21 for adhesively connecting the insulating base film 310 and the metal heat sink 111, the insulating layer and the copper foil layer 31 have windows for the heat conductive bosses 112 to pass through, and the surfaces of the copper foil layer 31 and the heat conductive bosses 112 are flush. Among them, the copper foil layer 31 is preferably a rolled copper foil layer, and the thermal expansion coefficient of the insulating adhesive layer 21 is between the thermal expansion coefficient of the insulating base film 310 and the thermal expansion coefficient of the insulating resin 13.
The preparation method comprises the step of manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole, wherein the diameter of the conductive through hole is smaller than that of the through hole. In the present invention, an example of the conductive via includes a conductive ring 42 and a resin 43 filled in the conductive ring 42, and the step of forming the conductive via includes: first, as shown in fig. 6, laser drilling or mechanical drilling is performed on the circuit board at a position corresponding to the through hole 12 to fabricate an insulation hole 41 penetrating the circuit board, wherein the diameter of the insulation hole 41 is smaller than that of the through hole 12; then, as shown in fig. 7, a conductive copper ring 42 is formed on the entire inner wall of the insulating hole 41 by electroless plating or electroless plating followed by electroplating; next, as shown in fig. 8, the conductive ring 42 is filled with resin 43 by a resin plug process. Preferably, after filling the conductive ring 42 with the resin 43, the circuit board is ground on two opposite surfaces.
With continued reference to fig. 7, while the conductive ring 42 is formed, the first copper clad layer 32 connected to the conductive ring 42 is formed on two opposite surfaces of the circuit board, and the first copper clad layer 32 covers the copper foil layer 31 and the surfaces of the heat conductive bosses 112 (i.e., the circuit board is subjected to full-sheet electroplating). Referring to fig. 9, the method of manufacturing the present invention further includes a step of forming a second copper-clad layer 33 covering the first copper-clad layer 32 and the resin 43 on two opposite surfaces of the circuit board after filling the resin 43 into the conductive ring 42.
The preparation method comprises the step of manufacturing a conductive circuit and a device heat conduction bonding pad on two opposite surfaces of a circuit board. As shown in fig. 10, the copper foil layer 31, the first copper clad layer 32 and the second copper clad layer 33 on two opposite surfaces of the circuit board are etched to form a conductive trace 301 and a device thermal pad 302 on the two opposite surfaces of the circuit board. The conductive lines 301 are formed on the insulating layer and include conductive pads 3011 formed on the conductive vias, and the conductive lines 301 on two opposite surfaces of the circuit board are electrically connected through the conductive vias; device thermal conductive pad 302 is directly connected to thermal conductive boss 112, and device thermal conductive pad 302 is formed to completely cover thermal conductive boss 112.
It will be readily appreciated that when it is not necessary to form conductive pads at the conductive via locations, it may not be necessary to form second copper-clad layers on opposite surfaces of the circuit board covering the first copper-clad layers and resin 43. That is, when the conductive pad is not required to be formed at the position of the conductive via, the copper foil layers and the first copper-clad layers on the two opposite surfaces of the circuit board may be etched to form the conductive circuit and the device heat-conducting pad on the two opposite surfaces of the circuit board.
The preparation method embodiment of the invention also comprises the step of manufacturing solder mask layers on two opposite surfaces of the circuit board. Referring to fig. 11, solder mask layer 50 is configured to expose device thermal pads 302 and electrical pads 3011. The preparation method of the present invention may further include a step of forming a metal protection layer (e.g., a nickel/palladium/gold composite film) on the surfaces of the heat conductive pad 302 and the electric conductive pad 3011.
According to the embodiment of the preparation method, the conductive circuits which are electrically connected through the conductive through holes are manufactured on the two opposite surfaces of the circuit board, so that the semiconductor devices can be mounted on the two surfaces of the circuit board, and the miniaturization of the circuit board is facilitated; the device heat conduction pad is directly connected with the heat conduction boss, and heat generated by the power device arranged on the device heat conduction pad during working can be quickly diffused through the heat conduction boss and the metal heat dissipation plate, so that the circuit board has good heat conduction performance.
Although the present invention has been described with reference to specific embodiments, these embodiments are not intended to limit the scope of the invention. It will be appreciated by those skilled in the art that various changes/substitutions may be made without departing from the scope of the invention, and it is intended that all equivalent changes and modifications made in accordance with the present invention shall be embraced by the scope of the invention.
Claims (10)
1. A method of making a heat dissipating circuit board comprising the steps of:
forming a through hole penetrating through the metal plate at a preset position of the flat metal plate, and filling insulating resin in the through hole;
covering a preset area of two opposite surfaces of the metal plate with a corrosion resistant film, and etching the area which is not covered by the corrosion resistant film in the two opposite surfaces of the metal plate to obtain a metal heat dissipation plate and heat conduction bosses formed on two opposite sides of the metal heat dissipation plate;
removing the insulating resin protruding out of the surface of the metal radiating plate;
an insulating layer and a copper foil layer are sequentially arranged on two opposite sides of the metal heat dissipation plate, the insulating layer and the copper foil layer are provided with windows through which the heat conduction bosses penetrate, and the surfaces of the copper foil layer and the heat conduction bosses are flush;
manufacturing a conductive through hole penetrating through the circuit board at a position corresponding to the through hole, wherein the diameter of the conductive through hole is smaller than that of the through hole;
manufacturing a conductive circuit and a device heat conduction bonding pad on two opposite surfaces of the circuit board; the conductive circuits on two opposite surfaces of the circuit board are electrically connected through the conductive through holes, and the device heat conduction bonding pad is directly connected with the heat conduction boss.
2. The method for manufacturing a heat-dissipating circuit board according to claim 1, wherein the copper foil layer is a rolled copper foil layer.
3. The method of manufacturing a heat-dissipating circuit board according to claim 1, wherein the insulating layer includes a base insulating film for supporting the copper foil layer and an insulating adhesive layer adhesively connecting the base insulating film and the metal heat-dissipating plate, the insulating adhesive layer having a thermal expansion coefficient between that of the base insulating film and that of the insulating resin.
4. The method for manufacturing a heat dissipating circuit board according to claim 1, wherein the metal plate is a flat copper plate; the height of the heat conducting bosses on the two opposite surface sides of the metal heat dissipation plate is the same.
5. The method of manufacturing a heat dissipating circuit board according to claim 1, wherein the device heat conducting pad is formed to entirely cover the heat conducting boss.
6. The method for manufacturing a heat-dissipating circuit board according to claim 1, wherein the insulating resin protruding from the surface of the metal heat-dissipating board is removed by mechanical milling.
7. The method for preparing a heat dissipating circuit board according to claim 1, wherein the conductive via includes a conductive ring and a resin filled in the conductive ring, and the step of forming the conductive via includes the steps of: forming an insulation hole penetrating through the circuit board at a position corresponding to the through hole, wherein the diameter of the insulation hole is smaller than that of the through hole; forming the conductive ring on the entire inner wall of the insulating hole; and filling the resin in the conductive ring by a resin hole plugging process.
8. The method of manufacturing a heat dissipating circuit board according to claim 7, wherein the fabricating of the conductive via further comprises a step of grinding both opposite surfaces of the circuit board after the filling of the resin.
9. The method for manufacturing a heat dissipating circuit board according to claim 7, wherein the conductive ring is formed while forming first copper clad layers connected to the conductive ring on both opposite surfaces of the circuit board; and after the conductive ring is filled with the resin, carrying out graphical etching treatment on the copper foil layers and the first copper-clad layers on the two opposite surfaces of the circuit board so as to manufacture the conductive circuit and the device heat conduction bonding pad on the two opposite surfaces of the circuit board.
10. The method for manufacturing a heat dissipating circuit board according to claim 7, wherein the conductive ring is formed while forming first copper clad layers connected to the conductive ring on both opposite surfaces of the circuit board; after the resin is filled into the conductive ring, forming second copper-clad layers on two opposite surfaces of the circuit board; and carrying out graphical etching treatment on the copper foil layers, the first copper-clad layers and the second copper-clad layers on the two opposite surfaces of the circuit board so as to manufacture the conductive circuits and the device heat-conducting bonding pads on the two opposite surfaces of the circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911390577.7A CN111031687A (en) | 2019-12-30 | 2019-12-30 | Method for preparing heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911390577.7A CN111031687A (en) | 2019-12-30 | 2019-12-30 | Method for preparing heat dissipation circuit board |
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| Publication Number | Publication Date |
|---|---|
| CN111031687A true CN111031687A (en) | 2020-04-17 |
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|---|---|---|---|
| CN201911390577.7A Pending CN111031687A (en) | 2019-12-30 | 2019-12-30 | Method for preparing heat dissipation circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113825305A (en) * | 2021-09-30 | 2021-12-21 | 乐健科技（珠海）有限公司 | Metal-based double-sided circuit board and preparation method thereof |
| CN113966067A (en) * | 2020-07-20 | 2022-01-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN114126187A (en) * | 2020-08-26 | 2022-03-01 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
-
2019
- 2019-12-30 CN CN201911390577.7A patent/CN111031687A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113966067A (en) * | 2020-07-20 | 2022-01-21 | 宏恒胜电子科技（淮安）有限公司 | Circuit board and manufacturing method thereof |
| CN114126187A (en) * | 2020-08-26 | 2022-03-01 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
| CN114126187B (en) * | 2020-08-26 | 2024-05-10 | 宏恒胜电子科技（淮安）有限公司 | Circuit board with embedded heat dissipation structure and manufacturing method thereof |
| CN113825305A (en) * | 2021-09-30 | 2021-12-21 | 乐健科技（珠海）有限公司 | Metal-based double-sided circuit board and preparation method thereof |
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