CN111031664A - Flexible circuit board and manufacturing method thereof - Google Patents
Flexible circuit board and manufacturing method thereof Download PDFInfo
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- CN111031664A CN111031664A CN201811176176.7A CN201811176176A CN111031664A CN 111031664 A CN111031664 A CN 111031664A CN 201811176176 A CN201811176176 A CN 201811176176A CN 111031664 A CN111031664 A CN 111031664A
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- functionalized graphene
- circuit board
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- based ink
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/0709—Catalytic ink or adhesive for electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
Abstract
The invention provides a flexible circuit board and a manufacturing method thereof.A modified functionalized graphene is used for preparing functionalized graphene-based ink, the functionalized graphene-based ink is printed on the surface of a flexible plastic substrate to form a pattern of a conductive trace of a circuit, and then a layer of deposited copper is formed on the surface of the functionalized graphene-based ink through a chemical copper plating process; the flexible circuit board and the manufacturing method thereof provided by the invention use the functionalized graphene-based ink as a catalyst for electroless copper plating, do not need hexavalent chromium and palladium as catalysts, have the advantages of environmental protection and low cost, and the conductive trace formed by the functionalized graphene-based ink has excellent adhesiveness and is more flexible, can be reliably adhered to the surface of the flexible plastic substrate and can be used as an adhesive between deposited copper and the flexible plastic substrate.
Description
Technical Field
The invention relates to the technical field of flexible circuit boards, in particular to a flexible circuit board and a manufacturing method thereof.
Background
The Flexible Printed Circuit (FPC) is formed by attaching a Flexible Copper Clad Laminate (FCCL) and a Flexible insulating layer using an adhesive (adhesive) and then laminating the attached layers, and is subjected to processes such as etching and the like to leave a required conductive trace as a medium for power or electronic signal transmission. The applicable range of the flexible circuit board widely includes the fields of computers and peripheral equipment, communication products, consumer electronics, automobiles, military affairs and the like, wherein the communication products account for the heaviest proportion. Materials used for the flexible insulating layer of the flexible circuit board can be classified into a Polyimide Film (PIFilm for short) and a polyester resin Film (PET Film), and among them, a PI Film (PI Film) is most commonly used.
The flexible circuit board can be divided into a two-Layer structure of a non-adhesive flexible printed circuit board (2Layer FCCL) and a three-Layer structure of an adhesive flexible printed circuit board (3Layer FCCL), and the greatest difference between the two is the presence or absence of an adhesive between the copper foil and the polyimide film. The substrate with a three-layer structure having a flexible printed circuit board is resistant to a short heat treatment time due to the adhesive, and its reliability is reduced due to the deterioration of the adhesive caused by the heat treatment, and the adhesive has various problems such as film stress, migration of copper atoms, and plating solution penetration. In contrast, the two-layer substrate without the adhesive has no problems of the three-layer substrate with the adhesive.
The main manufacturing method of the prior non-glue soft board substrate with a two-layer structure comprises the following steps: coating (Casting), laminating (Plating), Sputtering/Plating (Sputtering/Plating), and electroless Plating (electroplating). The coating method is to coat PI varnish (PI varnish) on a thin copper foil and then heat the copper foil to over 300 ℃ to perform polyimide condensation (polyimide condensation) to form a glue-free flexible printed circuit board with a two-layer structure, and the coating method can obtain good adhesion strength between a PI film and the copper foil. The press-bonding method is a method in which a thermoplastic PI film and a copper foil are press-bonded at high temperature and high pressure, and the manufacturing cost is high. The sputtering/plating method is a method of depositing copper directly on the PI film, in which the adhesion between the deposited copper and the PI film is the smallest of the above three methods. Electroless copper plating is a known technique in the field of Printed Circuit Board (PCB) manufacturing, and a method for forming a conductive circuit on the surface of a non-metallic substrate of a printed circuit board by electroless copper plating is known, in which a surface treatment of the substrate (substrate) is first performed with a catalyst (catalyst) to adsorb an active particle on the surface of the non-metallic substrate, this step is generally called sensitization (sensitization), the commonly used active particles for sensitization are metallic palladium particles (Pd) and silver particles (Ag), and a catalyst containing palladium particles is known as an aqueous solution containing tin/palladium colloid, wherein the tin/palladium colloid includes a palladium metal core surrounded by a stable layer of tin ions (II), but the catalyst has the following problems, including: the stability of tin/palladium colloids is poor and palladium is expensive. For the manufacturing technology of the non-glue flexible printed circuit board with the two-layer structure, the improvement of the adhesiveness and the flexibility between the PI film and the copper foil is a technical problem to be overcome in the development process of the manufacturing technology.
In the aforementioned known methods, nickel is used as a catalyst for copper deposition in sputtering and electroless plating processes, and the deposited copper loses adhesion properties on the film without nickel pretreatment. In a further etching process, nickel is difficult to etch by conventional etching chemistries. Furthermore, the pretreatment solution is relevant to the treatment of the composition used. In order to better treat the used pretreatment solution, hexavalent chromium compounds must be reduced and the reduction products neutralized. Hexavalent chromium is a carcinogen with genetic toxicity and is highly dangerous. Workers exposed to hexavalent chromium are at risk of suffering lung cancer, asthma or damage to the nasal epithelium and skin. The use of hexavalent chromium may cause long-term environmental pollution and is widely banned in the electronics industry in the united states, europe and china. At the same time as the neutralization, large amounts of chromium hydroxide are formed, which treatment considerably hinders the removal of the compositions used. Furthermore, the pretreatment solution of the known method is very corrosive and requires a large amount of water to completely remove it from the surface of the non-metallic material. In addition, the conventional surface pretreatment process before electroplating is complicated and time-consuming.
Disclosure of Invention
The invention aims to provide a flexible circuit board and a manufacturing method thereof.
The invention provides a flexible circuit board, comprising: a flexible plastic substrate, a layer of functionalized graphene-based ink attached to a surface of the flexible plastic substrate according to a pattern of conductive traces of an electrical circuit, and deposited copper deposited and attached to a surface of the functionalized graphene-based ink.
The invention provides a manufacturing method of a flexible circuit board, which comprises the following steps: preparing a functionalized graphene-based ink; printing the functionalized graphene-based ink on the surface of a flexible plastic substrate by a screen printing process to form a pattern of conductive traces of a circuit; drying the functionalized graphene-based ink on the surface of the flexible plastic substrate at a temperature of 60-200 ℃; and soaking the flexible plastic substrate with the functionalized graphene-based ink on the surface in a chemical plating solution, and forming a layer of deposited copper on the surface of the functionalized graphene-based ink through an electroless copper plating process.
The flexible plastic substrate is made of any one of polyimide, polyester, epoxy resin, fluorocarbon film and aramid paper.
Wherein the functionalized graphene-based ink contains at least modified graphene oxide.
Wherein the functionalized graphene-based ink is a composition comprising: a mixture of functionalized graphene, a dispersant, a solvent, a binder, a thickener, a crosslinker, and an initiator.
Wherein the functionalized graphene-based ink may further comprise a cross-linking agent and an initiator.
Wherein the surface of the functionalized graphene contains: any one of oxygen, lactitol (lactitol), ester (ester), hydroxyl (hydroxyl), epoxy (epoxy) and ketone (ketone).
Wherein the oxygen content of the functionalized graphene containing oxygen functional groups is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing oxygen functional groups.
Wherein the functionalized graphene is further doped with any one or a combination of nitrogen (N), sulfur (S), boron (B), fluorine (F) and phosphorus (P).
Wherein the functionalized graphene contains the combination of elements in an amount of 1 wt% to 20 wt% of the total weight of the functionalized graphene.
One aspect of the method of manufacturing a flexible circuit board of the present invention further includes: a step of modifying any one of a binder, a crosslinking agent, a monomer, and a polymer of the functionalized graphene-based ink.
Wherein the binder, crosslinker, monomer, and polymer used to modify the functionalized graphene-based ink contain at least one functional group from the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond, and haloalkane functional groups.
Wherein the binder (adhesive) is made of a polymer or a resin, and the content of the binder is 0.1 wt% to 30 wt% of the total weight of solids of the functionalized graphene-based ink.
Wherein the electroless plating solution is formaldehyde-based electroless copper plating solution.
The flexible circuit board and the manufacturing method thereof have the advantages that the functionalized graphene-based ink is used as a catalyst for electroless copper plating, hexavalent chromium and palladium do not need to be used as the catalyst, the flexible circuit board has the advantages of environmental protection and low cost, the conductive trace formed by the functionalized graphene-based ink has excellent adhesiveness and is more flexible, the flexible circuit board cannot be broken when being bent, and the flexible circuit board can be reliably adhered to the surface of a flexible plastic substrate and can be used as an adhesive between deposited copper and the flexible plastic substrate.
Other features and embodiments of the present invention will be described in detail below with reference to the drawings.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a cross-sectional view of a structure of one embodiment of a flexible circuit board of the present invention;
FIG. 2 is a flow chart of the steps of the method of manufacturing a flexible circuit board of the present invention;
FIGS. 3A and 3B are schematic views showing the construction of steps of the method for manufacturing a flexible circuit board according to the present invention;
fig. 4A and 4B are functional schematic diagrams of the flexible circuit board of the present invention, respectively showing the cross-sectional structures of the conductive traces made of the functionalized graphene-based ink before and after stretching.
Description of the symbols
10 flexible plastic substrate 20 functionalized graphene-based ink
30 deposition of copper 40 graphene sheet material
41 Binder and/or crosslinking agent
Detailed Description
The positional relationship described in the following embodiments includes: the top, bottom, left and right, unless otherwise indicated, are based on the orientation of the elements in the drawings.
Fig. 1 is a cross-sectional view of a flexible circuit board according to an embodiment of the present invention.
The preferable structure of the flexible circuit board of the invention comprises: a flexible plastic substrate 10, a layer of functionalized graphene-based ink 20(functionalized ink) attached to a surface of the flexible plastic substrate 10 according to a pattern of conductive traces of an electrical circuit, and deposited copper 30 deposited and attached to a surface of the functionalized graphene-based ink 20.
Referring to fig. 2, a flow chart of steps of a method for manufacturing a flexible printed circuit board according to the present invention is shown. An embodiment of the method of manufacturing a flexible circuit board of the present invention includes the steps of:
(a) preparing a functional graphene-based ink 20;
(b) printing the functionalized graphene-based ink 20 on the surface of the flexible plastic substrate 10 by a screen printing process to form a pattern of conductive traces of a circuit (the cross-sectional structure of which is shown in fig. 3A);
(c) drying the functionalized graphene-based ink 20 on the surface of the flexible plastic substrate 10 at a temperature of 60-200 ℃; and
(d) the flexible plastic substrate 10 having the functionalized graphene-based ink 20 on the surface thereof is immersed in a electroless copper plating solution, and a layer of deposited copper 30 (the cross-sectional structure thereof is shown in fig. 3B) is formed on the surface of the functionalized graphene-based ink 20 through an electroless copper plating process, wherein the electroless copper plating solution is a formaldehyde-based electroless copper plating solution.
As a preferred embodiment of the present invention, wherein the flexible plastic substrate 10 is made of a material including any one of polyimide (polyimide), polyester (polyester), epoxy resin (epoxy), fluorocarbon films (fluorocarbon films) and aramid papers (aramid papers).
Wherein the functionalized graphene-based ink 20 is a composition comprising: functionalized graphene, dispersants (dispersants), solvents (solvants), binders (binders), and thickeners (thinkeeners). As another preferred embodiment of the present invention, the functionalized graphene-based ink 20 may further include cross-linking agents (cross linkers) and initiators (initiators). As a preferred embodiment of the functionalized graphene-based ink 20, the content of the functionalized graphene is 0.5 wt% to 30 wt% of the mixture. The content of the dispersant accounts for 0.05 to 20 weight percent of the mixture, and the dispersant can be ionic or non-ionic dispersant. The solvent can be selected from organic, inorganic or aqueous systems and accounts for 30-90 wt% of the mixture. At least one of a resin or a polymer is used as the binder. It is noted that when graphene sheet materials or graphene oxide are used as the catalyst, it is not necessary to use any polymer or resin as the binder. The high viscosity functionalized graphene-based ink 20 can also be made with the thickener in an amount of 0.01 wt% to 10 wt% of the mixture.
The functionalized graphene contained in the functionalized graphene-based ink 20 is a modified Graphene Oxide (GO), and a specific embodiment of the modified graphene oxide is obtained by performing surface modification on graphene oxide (preferably a graphene sheet material), so that the modified graphene oxide can obtain more excellent characteristics and can be used as a catalyst for electroless copper plating; as a preferred embodiment of the modified graphene oxide, wherein the surface of the functionalized graphene contains: any one of an oxygen functional group, lactitol (lactol), ester (ester), hydroxyl (hydroxyl), epoxy (epoxy), and ketone (ketone), wherein the oxygen content of the functionalized graphene containing the oxygen functional group is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing the oxygen functional group.
As other preferred embodiments of the present invention, the functionalized graphene is further doped with any one or a combination of nitrogen (N), sulfur (S), boron (B), fluorine (F) and phosphorus (P), wherein the functionalized graphene contains the combination of elements in an amount of 1 wt% to 20 wt% of the total weight of the functionalized graphene.
A further preferred embodiment of the method for manufacturing a flexible circuit board of the present invention further comprises: a step of modifying any one of the binder, the crosslinking agent, the monomer, and the polymer of the functionalized graphene-based ink 20, in other words, a step of modifying the functionalized graphene-based ink 20 by any one of the binder, the crosslinking agent, the monomer, and the polymer contained in the components of the functionalized graphene-based ink 20.
Wherein the binder, the cross-linking agent, the monomer and the polymer used to modify the functionalized graphene-based ink 20 contain at least one functional group of the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond and haloalkane functional groups, wherein the binder (adhesive) is made of a polymer or a resin, and the content of the binder is 0.1 wt% to 30 wt% of the total solid weight of the functionalized graphene-based ink.
As can be understood from the above-described embodiments, the present invention provides a cost-effective, efficient and environmentally friendly flexible circuit board and a method for manufacturing the same, without using heavy metals as a catalyst for an electroless copper plating process, and a preferred embodiment is to functionalize graphene with oxygen into functionalized graphene having an oxygen functional group, and then use the functionalized graphene having an oxygen functional group to mix the foregoing dispersant, solvent, binder, thickener, cross-linking agent and initiator to prepare the functionalized graphene-based ink 20.
Fig. 4A and 4B are functional schematic diagrams of the flexible circuit board according to the present invention, which respectively show the cross-sectional structures of the conductive traces formed by the functionalized graphene-based ink 20 before and after stretching. As an embodiment of the present invention, in which graphene sheet materials (graphene platelet materials) are selected as the functionalized graphene in the functionalized graphene-based ink 20, the layered structure formed by the graphene sheet materials 40 can be seen from fig. 4A, and then the pattern of the conductive traces formed by the functionalized graphene-based ink 20 is not broken both before and after stretching by the action of the adhesive and/or the crosslinking agent 41 mixed between the graphene sheet materials 40, the functionalized graphene-based ink 20 can be reliably adhered to the surface of the flexible plastic substrate 10 and serves as an adhesive between the deposited copper 30 and the flexible plastic substrate 10.
Example 1
As an example of the method for manufacturing the flexible printed circuit board according to the present invention, a polyimide film (PI film) is used as the flexible plastic substrate 10, wherein the functional graphene-based ink 20 is printed on the surface of the PI film by a screen printing process to form a pattern of a conductive trace of a circuit, and then dried in an oven at 100 ℃ for 20 minutes, and after the drying is completed, the PI film with the functional graphene-based ink 20 printed thereon is placed in a formaldehyde-based electroless copper plating solution at 50 ℃ to 70 ℃ for 30 to 120 minutes, so that uniformly deposited copper 30 can be obtained on the surface of the functional graphene-based ink 20 to form the conductive trace of the circuit.
The above-described embodiments and/or implementations are only for illustrating the preferred embodiments and/or implementations of the present technology, and are not intended to limit the implementations of the present technology in any way, and those skilled in the art may make modifications or changes to other equivalent embodiments without departing from the scope of the technical means disclosed in the present disclosure, but should be construed as the technology or implementations substantially the same as the present technology.
Claims (24)
1. A flexible circuit board, comprising: a flexible plastic substrate, a layer of functionalized graphene-based ink attached to a surface of the flexible plastic substrate according to a pattern of conductive traces of an electrical circuit, and deposited copper deposited and attached to a surface of the functionalized graphene-based ink.
2. The flexible circuit board of claim 1, wherein: the flexible plastic substrate is made of any one of polyimide, polyester, epoxy resin, fluorocarbon film and aramid paper.
3. The flexible circuit board of claim 1, wherein: the functionalized graphene-based ink at least contains modified graphene oxide.
4. The flexible circuit board of claim 1, wherein: the functionalized graphene-based ink comprises: functionalized graphene, a dispersant, a solvent, a binder and a thickener.
5. The flexible circuit board of claim 1, wherein: the functionalized graphene-based ink may further include a cross-linking agent and an initiator.
6. The flexible circuit board of claim 4, wherein: the surface of the functionalized graphene contains: any one of oxygen, lactitol, ester, hydroxyl, epoxy, and ketone functional groups.
7. The flexible circuit board of claim 6, wherein: the oxygen content of the functionalized graphene containing oxygen functional groups is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing oxygen functional groups.
8. The flexible circuit board of claim 6, wherein: the functionalized graphene is further doped with any one or combination of nitrogen, sulfur, boron, fluorine and phosphorus.
9. The flexible circuit board of claim 8, wherein: the content of the combination of elements contained in the functionalized graphene is 1 wt% to 20 wt% of the total weight of the functionalized graphene.
10. The flexible circuit board of claim 5, wherein: the functionalized graphene-based ink is modified with any one of the binder, the crosslinker, a monomer, and a polymer.
11. The flexible circuit board of claim 10, wherein the binder, the cross-linking agent, the monomer, and the polymer that modify the functional graphene-based ink comprise at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond, and haloalkane functional groups.
12. The flexible circuit board of claim 4, wherein: the binder is made of a polymer or a resin, and the content of the binder is 0.1 wt% to 30 wt% of the total solid weight of the functionalized graphene-based ink.
13. A method of manufacturing a flexible circuit board, comprising:
preparing a functionalized graphene-based ink;
printing the functionalized graphene-based ink on the surface of a flexible plastic substrate by a screen printing process to form a pattern of conductive traces of a circuit;
drying the functionalized graphene-based ink on the surface of the flexible plastic substrate at a temperature of 60-200 ℃; and
and soaking the flexible plastic substrate with the functionalized graphene-based ink on the surface in a chemical plating solution, and forming a layer of deposited copper on the surface of the functionalized graphene-based ink through an electroless copper plating process.
14. The method of manufacturing a flexible circuit board according to claim 13, wherein: the functionalized graphene-based ink comprises: functionalized graphene, a dispersant, a solvent, a binder and a thickener.
15. The flexible circuit board of claim 13, wherein: the functionalized graphene-based ink may further include a cross-linking agent and an initiator.
16. The method of manufacturing a flexible circuit board according to claim 14, wherein: the surface of the functionalized graphene contains: any one of oxygen, lactitol, ester, hydroxyl, epoxy, and ketone functional groups.
17. The method of manufacturing a flexible circuit board according to claim 16, wherein: the oxygen content of the functionalized graphene containing oxygen functional groups is 5 wt% to 50 wt% of the total weight of the functionalized graphene containing oxygen functional groups.
18. The method of manufacturing a flexible circuit board according to claim 16, wherein: the functionalized graphene is further doped with any one or combination of nitrogen, sulfur, boron, fluorine and phosphorus.
19. The method of manufacturing a flexible circuit board according to claim 18, wherein: the content of the combination of elements contained in the functionalized graphene is 1 wt% to 20 wt% of the total weight of the functionalized graphene.
20. The method for manufacturing a flexible circuit board according to claim 15, comprising: a step of modifying any one of the binder, the crosslinking agent, the monomer, and the polymer of the functionalized graphene-based ink.
21. The method of manufacturing a flexible circuit board according to claim 20, wherein: the binder, the cross-linking agent, the monomer, and the polymer that modify the functional graphene-based ink contain at least one functional group selected from the group consisting of amino, carboxyl, hydroxyl, double bond, triple bond, and haloalkane functional groups.
22. The method of manufacturing a flexible circuit board according to claim 13, wherein: the functionalized graphene-based ink at least contains modified graphene oxide.
23. The method of manufacturing a flexible circuit board according to claim 13, wherein: the flexible plastic substrate is made of any one of polyimide, polyester, epoxy resin, fluorocarbon film and aramid paper.
24. The method of manufacturing a flexible circuit board according to claim 13, wherein: the electroless plating solution is a formaldehyde-based electroless copper plating solution.
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| CN201811176176.7A CN111031664A (en) | 2018-10-10 | 2018-10-10 | Flexible circuit board and manufacturing method thereof |
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| CN115474345A (en) * | 2022-09-14 | 2022-12-13 | 东华大学 | Method for manufacturing ceramic fabric circuit based on screen printing and chemical deposition |
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