CN111030640B - Surface-mounted miniature superposed circuit attenuation sheet and preparation method thereof - Google Patents
Surface-mounted miniature superposed circuit attenuation sheet and preparation method thereof Download PDFInfo
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- CN111030640B CN111030640B CN201911378978.0A CN201911378978A CN111030640B CN 111030640 B CN111030640 B CN 111030640B CN 201911378978 A CN201911378978 A CN 201911378978A CN 111030640 B CN111030640 B CN 111030640B
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- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
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Abstract
The invention discloses a surface-mounted miniature superposed circuit attenuation sheet and a preparation method thereof, wherein the size of the attenuation sheet is 2.5mm x 4mm x 0.635mm, the front surface of the attenuation sheet is provided with a first attenuation circuit and a second attenuation circuit, the first attenuation circuit and the second attenuation circuit are connected in series, and the first attenuation circuit and the second attenuation circuit share one resistor. The invention adopts the mode of connecting two attenuation circuits in series to obtain the attenuation circuit with a higher attenuation value, and the relative resistance value is smaller, thus better meeting the precision requirement; and creatively, the first attenuation circuit and the second attenuation circuit share one resistor to form respective attenuation circuits, so that the volume of the attenuation sheet is effectively reduced, the attenuation sheet is easier to arrange in a high-frequency circuit, and the end conductor of the attenuation sheet is processed at one time, thereby further improving the precision and quality of the attenuation sheet.
Description
Technical Field
The invention belongs to the technical field of attenuators, and particularly relates to a surface-mounted miniature superposed circuit attenuation sheet and a preparation method thereof.
Background
Most of the prior communication base stations use a high-power ceramic load sheet to absorb reverse input power in a communication component, the high-power ceramic load sheet can only simply consume and absorb redundant power but cannot monitor the working condition of the base station in real time, and when the base station fails, the base station cannot make a judgment in time and has no protection effect on equipment; the attenuation sheet can absorb reverse input power in the communication component in the communication base station, can extract partial signals in the communication component, monitors the base station in real time and has a protection effect on equipment.
In the 4G communication era, because the communication channels of the base station are few, generally 2 channels or 4 channels, enough space is left on the power amplification board of the base station for the circuit, including making a coupling circuit on the power amplification board and then mounting a load sheet, so that the signal can be monitored through the coupling circuit; in the 5G communication system, the number of channels is usually 64, and the base station needs to be miniaturized on the basis of the number of channels, so that a coupling circuit and a mounting load do not have enough space in a power amplification board circuit, and a miniature attenuation sheet needs to be used for replacing the coupling circuit and the mounting load, so that the function of overlapping the load of the coupling circuit can be met, and the attenuation value of the attenuation sheet needs to meet the requirement of 30dB, so that the accurate reading of the detection model is realized;
in addition, in the attenuation sheet in the prior art, the conductive conductors of the front conductor and the back conductor are all completed by adopting a side silver paste printing process, because the printing of the end conductor (side conductor) needs to be clamped twice to respectively complete the printing of the conductors on two sides, the process is complicated, the printing flatness and the thickness consistency of the thick film silver paste are not high, so that an interference electric field is easily generated in an attenuation circuit, or a larger inductor is generated, the attenuation precision is influenced, and more serious high-frequency reflection can be generated.
Disclosure of Invention
The invention mainly solves the technical problem of providing a surface-mounted miniature superposed circuit attenuation sheet which is applied to the field of 5G communication, has smaller size and higher design precision, the power requirement of the surface-mounted miniature superposed circuit attenuation sheet meets 20W and an attenuation value of 30dB, and an end conductor of the surface-mounted miniature superposed circuit attenuation sheet is processed at one time, so that the precision and the quality of the surface-mounted miniature superposed circuit attenuation sheet are further improved.
In order to solve the above technical problems, one technical solution adopted by the present invention is as follows:
the utility model provides a miniature superimposed circuit decay piece of table subsides formula, the base plate of decay piece is the aluminium nitride ceramic substrate, the size of decay piece is 2.5mm 4mm 0.635mm, the front of decay piece is equipped with first decay circuit and second decay circuit, first decay circuit with second decay circuit establishes ties, just first decay circuit with a resistance of second decay circuit sharing.
Further, the first attenuation circuit is a pi-type attenuation circuit including resistors R1, R3, and R4, the second attenuation circuit is a pi-type attenuation circuit including resistors R2, R3, and R5, and the resistor R3 is a common resistor.
Further, the first attenuation circuit and the second attenuation circuit are symmetrical pi-type attenuation circuits, i.e., the resistances of the resistors R1, R2 and R3 are the same.
Furthermore, the resistors R1, R3 and R2 are vertically arranged along the length direction of the substrate and are uniformly distributed, the resistor R4 is located above the resistors R1 and R3, two ends of the resistor R4 are respectively connected in series with the resistors R1 and R3, the resistor R5 is located above the resistors R3 and R2, and two ends of the resistor R5 are respectively connected in series with the resistors R3 and R2, so that the layout of the resistors can effectively reduce the circuit area, the layout of the resistors is more compact, and the arrangement of the attenuation circuit on the micro substrate is further ensured.
In addition, the attenuation amounts of the first attenuation circuit and the second attenuation circuit are both 15dB, that is, the overall attenuation value of the attenuation sheet of the present invention is 30dB, and the power of the attenuation sheet of the present invention is 20W.
The back of the attenuation sheet is provided with an input pad, an output pad and a grounding conductor, the input pad is connected with the input end of the first attenuation circuit through a first end conductor, the output pad is connected with the output end of the second attenuation circuit through a second end conductor, and the grounding conductor is connected with the grounding ends of the first attenuation circuit and the second attenuation circuit through a third end conductor.
Furthermore, the first end conductor, the second end conductor and the third end conductor are all metal conducting layers prepared in a magnetron vacuum sputtering mode, the first end conductor, the second end conductor and the third end conductor are processed at one time, the conducting layers sputtered in vacuum have good flatness and thickness consistency, the flatness and the thickness of the conductors directly influence the transmission of a circuit, and a lead with poor flatness easily generates an interference electric field to influence the stability of an attenuation circuit.
The front surface of the attenuation sheet is covered with a black protective film, the black protective film covers all resistors and part of conductors, the conductor part exposed out of the covering film is a position communicated with the first end conductor, the second end conductor and the third end conductor, and the black protective film is a black glass protective film formed by screen printing.
Further, the attenuation sheet is used for a 64-channel power amplifier circuit in 5G communication.
The surface-mounted miniature 30dB attenuation sheet applied to the 5G field has the power requirement of meeting 20W, and in order to further meet the requirement of miniaturization, the size is reduced by 2.5X 4X 0.635mm, an attenuation circuit is arranged in the miniature size, and as the surface-mounted miniature 30dB attenuation sheet meets the requirement of 3.5G for using 5G frequency, high-frequency application is input, and in order to better achieve the design precision, the attenuation circuit with a higher attenuation value is obtained by connecting two attenuation circuits in series, so that the relative resistance value is smaller, the precision requirement can be better achieved, and the first attenuation circuit and the second attenuation circuit are creatively enabled to jointly use one resistor to form respective attenuation circuits, thereby effectively reducing the volume of the attenuation sheet and enabling the attenuation sheet to be more easily arranged in the high-frequency circuit.
In order to solve the technical problem, the invention also provides a preparation method of the attenuation sheet, which is used for preparing the surface-mounted miniature superposed circuit attenuation sheet and comprises the following steps:
(1) cleaning: cleaning an aluminum nitride ceramic substrate by using clean water and alcohol in sequence, wherein the size of the ceramic substrate is 50mm by 60mm by 0.635 mm;
(2) back printing: printing a back conductor on the cleaned aluminum nitride ceramic substrate, wherein the printing adopts a screen printing process, printing slurry is high-temperature conductive silver paste, drying is carried out after the printing is finished, organic matters and water in the silver paste are taken out, the drying temperature is 140-200 ℃, and the drying time is 10-15 min;
(3) front printing: printing a front conductor on the front surface of the dried ceramic substrate, wherein the front conductor printing adopts the same process flow as the back conductor printing;
(4) sintering and forming: placing the ceramic substrate with the printed front conductor and the printed back conductor into a resistance furnace for high-temperature sintering at 800-900 ℃ for 35-45 min;
(5) resistance printing: further printing resistors on the front-side conductor, printing resistor slurry by using a steel wire mesh plate, drying in an oven at the drying temperature of 140-200 ℃ for 10-15min after printing, and then sintering at the high temperature of 850 ℃ for 40-50 min;
(6) printing a first protective layer: printing a first protective layer on the printed resistor, wherein the first protective layer is a green glass protective film, and then putting the green glass protective film into an oven for sintering, wherein the sintering temperature is 600 ℃, and the sintering time is 35 min;
(7) laser resistance adjustment: cutting the length-width ratio of the printed resistor by a laser process to adjust the initial R value to a required value;
(8) printing a second protective layer: printing a second protective layer after the resistance adjustment is finished, wherein the second protective layer is a black glass protective layer, and the printing process of the second protective layer is the same as that of the first protective layer;
(9) folding the strips: cutting the aluminum nitride ceramic substrate into strips of 2.5mm by 60mm by 0.635mm so as to facilitate the subsequent end conductor vacuum sputtering process;
(10) end conductor sputtering: putting the divided attenuation sheets into a sputtering jig for vacuum sputtering, wherein the sputtering jig is provided with a shield on the side wall of each attenuation sheet, shields the part without the end conductor, and only sputters the conductor part, thereby completing the one-time completion of all the end conductors;
(11) particle folding: the bar-shaped workpiece was divided into dimensions of 2.5mm 4mm 0.635 mm.
Further, the silver paste contains 0.5% of palladium.
And (3) further printing a mark layer after the step (8), printing character marks on the surface of the black glass protective layer, using white ink for printing, putting the black glass protective layer into an oven to be dried after printing, wherein the drying degree is 250 ℃, and the drying time is 20 min.
The invention has the beneficial effects that:
the invention adopts the mode of connecting two attenuation circuits in series to obtain the attenuation circuit with a higher attenuation value, and the relative resistance value is smaller, thus better meeting the precision requirement; the first attenuation circuit and the second attenuation circuit are creatively made to share one resistor to form respective attenuation circuits, so that the volume of the attenuation sheet is effectively reduced, and the attenuation sheet is easier to arrange in a high-frequency circuit;
the resistor arrangement mode in the invention can effectively reduce the circuit area, the resistor layout is more compact, and the arrangement of the attenuation circuit on the miniature substrate is further ensured; the first end conductor, the second end conductor and the third end conductor are all metal conducting layers prepared in a magnetron vacuum sputtering mode, the conducting layers subjected to vacuum sputtering have good flatness and thickness consistency, the flatness and the thickness of the conductors directly influence the transmission of a circuit, and a lead with poor flatness easily generates an interference electric field to influence the stability of an attenuation circuit; the almost completely covered black protective film can protect the conductor and the resistor printed on the attenuation sheet to the maximum extent, so that the conductor and the resistor cannot be influenced by the external environment, and the black protective film can also cover circuit layout information.
The attenuation sheet preparation method adopts a printing mode of back surface first and front surface second, and only the sintering process is adopted, so that the process flow of conductor printing is simplified; the whole substrate is adopted to print the surface conductor, the back conductor, the resistor and the like, and is folded into a strip shape when the end conductor needs to be prepared, the strip-shaped substrate is easy to clamp the jig, the efficiency is improved, the manufacturing precision requirement of the jig is reduced, and the cost is reduced;
the sputtering process of the end conductor shields the vacuum sputtering jig, can perform selective sputtering, realizes the conduction of the input and output end bonding pad and the front circuit and the conduction of the front grounding wire and the grounding conductor at the same time, simplifies the process steps, and can greatly improve the bottom flatness at the same time.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clearly understood and to implement them in accordance with the contents of the description, the following detailed description is given with reference to the preferred embodiments of the present invention and the accompanying drawings.
Drawings
FIG. 1 is a schematic front layout view (front view) of an attenuation sheet of the present invention;
FIG. 2 is a view from the direction A (side view) of FIG. 1;
FIG. 3 is a view from the direction B of FIG. 2 (rear view);
FIG. 4 is a schematic view of a black protective film of the attenuation sheet of the present invention;
FIG. 5 is a circuit diagram of two identical pi-type attenuation circuits;
FIG. 6 is a circuit diagram of a series arrangement of two identical pi-type attenuation circuits;
FIG. 7 is a circuit diagram of a series arrangement of two identical T-shaped attenuation circuits;
the parts in the drawings are marked as follows:
an aluminum nitride ceramic substrate 1, a first attenuation circuit 2A, a second attenuation circuit 2B, an input pad 3A, an output pad 3B, a ground conductor 4, a first end conductor 51, a second end conductor 52, a third end conductor 53, a black protective film 6, and a wire 7.
Detailed Description
The following detailed description of the preferred embodiments of the present invention, taken in conjunction with the accompanying drawings, will make the advantages and features of the invention easier to understand by those skilled in the art, and thus will clearly and clearly define the scope of the invention.
Example (b):
a surface-mounted miniature superposed circuit attenuation sheet is shown in figure 1: the substrate of the attenuation sheet is an aluminum nitride ceramic substrate 1, the size of the attenuation sheet is 2.5mm x 4mm x 0.635mm, a first attenuation circuit 2A and a second attenuation circuit 2B are arranged on the front surface of the attenuation sheet, the first attenuation circuit and the second attenuation circuit are connected in series, and the first attenuation circuit and the second attenuation circuit share one resistor;
the first attenuation circuit is a pi-type attenuation circuit comprising resistors R1, R3 and R4, the second attenuation circuit is a pi-type attenuation circuit comprising resistors R2, R3 and R5, the resistor R3 is a common resistor, and the attenuation circuits are communicated through a lead 7 (conductor).
Preferably, the first attenuation circuit and the second attenuation circuit are symmetrical pi-type attenuation circuits, that is, the resistances of the resistors R1, R2 and R3 are the same.
The arrangement of the attenuation circuit on the ceramic substrate in this embodiment is as follows: the resistors R1, R3 and R2 are vertically arranged along the length direction of the substrate and are uniformly distributed, the resistor R4 is positioned above the resistors R1 and R3, two ends of the resistor R4 are respectively connected in series with the resistors R1 and R3, the resistor R5 is positioned above the resistors R3 and R2, two ends of the resistor R5 are respectively connected in series with the resistors R3 and R2,
the resistor arrangement mode in the invention can effectively reduce the circuit area, the resistor layout is more compact, and the arrangement of the attenuation circuit on the miniature substrate is further ensured.
In the attenuation circuit of the present embodiment, the attenuation amounts of the first attenuation circuit and the second attenuation circuit are both 15dB, that is, the total attenuation value of the attenuation sheet of the present invention is 30dB, and the power of the attenuation sheet of the present invention is 20W.
As shown in fig. 2 and 3: the back of decay piece has input pad 3A, output pad 3B and ground conductor 4, the input pad passes through first end conductor 51 and connects first decay circuit's input, the output pad passes through second end conductor 52 and connects the output of second decay circuit, the ground conductor passes through third end conductor 53 and connects first decay circuit with the ground terminal of second decay circuit.
The first end conductor, the second end conductor and the third end conductor are all metal conducting layers prepared in a magnetron vacuum sputtering mode, the first end conductor, the second end conductor and the third end conductor are processed at one time, the conducting layers sputtered in vacuum have good flatness and thickness consistency, the flatness and the thickness of the conductors directly influence the transmission of a circuit, and a lead with poor flatness easily generates an interference electric field to influence the stability of an attenuation circuit.
As shown in fig. 4: the front surface of the attenuation sheet is covered with a black protection film 6 (a shaded part in fig. 4), the black protection film covers all resistors and part of conductors, the conductor part exposed out of the covering film is a position communicated with the first end conductor, the second end conductor and the third end conductor, and the black protection film is a black glass protection film formed by screen printing;
the attenuation sheet of the present invention includes two protective films printed in different processes, which are not described in detail in the drawings for convenience of description, and the front conductor layer also includes an intermediate layer and a soldering layer for facilitating soldering, which are well-known technologies and are not described in detail in this embodiment.
The attenuation sheet is used for a 64-channel power amplifier circuit in 5G communication, in particular to a power amplifier circuit board of a radio frequency antenna; in addition, as for the definition of the surface-mount type attenuator, that is, the attenuator patch, is a type of patch element that is attached to the PCB by a process such as SMT.
The circuit principle of the invention is as follows: as shown in FIG. 5, FIG. 5 is two identical pi-type attenuation circuits; the invention is shown in figure 6: two Pi-shaped attenuation circuits are connected in series, so that the attenuation value of the whole attenuation sheet is the sum of the two circuits, the attenuation value is not required to be adjusted by improving impedance, and the attenuation precision of the attenuation sheet is greatly improved;
of course, the present invention may also employ a T-type attenuator circuit, as shown in fig. 7: the resistor R3 is shared by the two series-connected T-shaped attenuation circuits, but the pi-shaped attenuation circuit is preferably used in the present invention for reasons of compactness of the circuit layout, etc.
In short, if a higher attenuation value needs to be obtained, the resistance value in the attenuation circuit is relatively high, and in the field of high-frequency signal attenuation, because a high-frequency signal is very sensitive to the resistance value of a resistor, the higher resistance value is easier to cause high-frequency reflection, and in the high-frequency circuit, a lead and the resistor generate inductance which affects the high-frequency signal, the lower the resistance value is, the better the attenuation circuit in high frequency is;
the invention adopts the mode of connecting two attenuation circuits in series to obtain the attenuation circuit with a higher attenuation value, and the relative resistance value is smaller, thus better meeting the precision requirement; and the first attenuation circuit and the second attenuation circuit are creatively made to share one resistor to form respective attenuation circuits, so that the volume of the attenuation sheet is effectively reduced, and the attenuation sheet is easier to arrange in a high-frequency circuit.
A preparation method of an attenuation sheet is used for preparing the surface-mounted miniature superposed circuit attenuation sheet and comprises the following steps:
(1) cleaning: cleaning an aluminum nitride ceramic substrate by using clean water and alcohol in sequence, wherein the size of the ceramic substrate is 50mm by 60mm by 0.635 mm;
(2) back printing: printing a back conductor on the cleaned aluminum nitride ceramic substrate, wherein the printing adopts a screen printing process, printing slurry is high-temperature conductive silver paste, drying is carried out after the printing is finished, organic matters and water in the silver paste are taken out, the drying temperature is 140-200 ℃, and the drying time is 10-15 min;
preferred parameters are: the drying temperature is 150 ℃, and the drying time is 12 min;
(3) front printing: printing a front conductor on the front surface of the dried ceramic substrate, wherein the front conductor printing adopts the same process flow as the back conductor printing;
(4) sintering and forming: placing the ceramic substrate with the printed front conductor and the printed back conductor into a resistance furnace for high-temperature sintering at 800-900 ℃ for 35-45 min;
preferred parameters are: the sintering temperature is 830 ℃, and the sintering time is 40 min;
the printing mode of back surface and front surface is adopted, and only one sintering process is carried out on the front surface printing, so that the process flow of conductor printing is simplified;
(5) resistance printing: further printing resistors on the front-side conductor, printing resistor slurry by using a steel wire mesh plate, drying in an oven at the drying temperature of 140-200 ℃ for 10-15min after printing, and then sintering at the high temperature of 850 ℃ for 40-50 min;
preferred parameters are: the drying temperature is 140 ℃, and the drying time is 10 min; the sintering temperature is 850 ℃, and the sintering time is 45 min;
(6) printing a first protective layer: printing a first protective layer on the printed resistor, wherein the first protective layer is a green glass protective film, and then putting the green glass protective film into an oven for sintering, wherein the sintering temperature is 600 ℃, and the sintering time is 35 min;
(7) laser resistance adjustment: cutting the length-width ratio of the printed resistor by a laser process to adjust the initial R value to a required value;
in the embodiment, simultaneous resistance adjustment is adopted for resistors R1 and R2, and resistors R3 and R4 respectively, and resistance adjustment with two opposite sides is adopted for R5;
the resistance adjusting process is to change the length-width ratio of the resistor by cutting the printed resistor body with a laser spot to adjust the initial R value to a required value; r is pl/s, p: resistivity of the material,: length of resistive material, s: cross-sectional area.
(8) Printing a second protective layer: printing a second protective layer after the resistance adjustment is finished, wherein the second protective layer is a black glass protective layer, and the printing process of the second protective layer is the same as that of the first protective layer;
(9) folding the strips: cutting the aluminum nitride ceramic substrate into strips of 2.5mm by 60mm by 0.635mm so as to facilitate the subsequent end conductor vacuum sputtering process;
(10) end conductor sputtering: putting the divided attenuation sheets into a sputtering jig for vacuum sputtering, wherein the sputtering jig is provided with a shield on the side wall of each attenuation sheet, shields the part without the end conductor, and only sputters the conductor part, thereby completing the one-time completion of all the end conductors;
(11) particle folding: the bar-shaped workpiece was divided into dimensions of 2.5mm 4mm 0.635 mm.
According to the attenuation sheet preparation method, the whole substrate is adopted to print the surface conductor, the back conductor, the resistor and the like, and the attenuation sheet is folded into a strip shape when the end conductor needs to be prepared, so that the strip-shaped base body is easy to clamp by a jig, the efficiency is improved, the requirement on the manufacturing precision of the jig is reduced, and the cost is reduced;
the sputtering process of the end conductor shields the vacuum sputtering jig, can perform selective sputtering, realizes the conduction of the input and output end bonding pad and the front circuit and the conduction of the front grounding wire and the grounding conductor at the same time, simplifies the process steps, and can greatly improve the bottom flatness at the same time.
The silver paste contains 0.5% of palladium.
In this embodiment, after the step (8), a mark layer is printed, a text mark is printed on the surface of the black glass protective layer, white ink is used for printing, and after the printing is completed, the black glass protective layer is placed into an oven for curing, wherein the drying degree is 250 ℃, and the drying time is 20 min.
The working process and working principle of the invention are as follows:
in the attenuation circuit, if a higher attenuation value needs to be obtained, the resistance value of a resistor in the circuit is relatively high, which is a proportional relation, in the field of high-frequency signal attenuation, because a high-frequency signal is very sensitive to the resistance value of the resistor, the higher resistance value is easy to cause high-frequency reflection, and in the high-frequency circuit, a lead and the resistor generate inductance which affects the high-frequency signal, so that the lower resistance value is better in the high-frequency attenuation circuit;
the attenuation sheet is a surface-mounted miniature superposed attenuation value 30dB attenuation sheet mainly applied to the field of 5G, the power of the attenuation sheet needs to meet 20W, in order to further meet the requirement of miniaturization, the size is reduced by 2.5X 4X 0.635mm (the common size in the industry is 2.5X 5X 1.0mm), an attenuation circuit is arranged in the tiny size, because the attenuation sheet meets the 5G frequency use requirement of 3.5G, high-frequency application is input, in order to better achieve the design precision, the attenuation circuit with a higher attenuation value is obtained by connecting two attenuation circuits in series, the relative resistance value is smaller, the precision requirement can be better achieved, in addition, the first attenuation circuit and the second attenuation circuit jointly use one resistor to form the respective attenuation circuit, the volume of the attenuation sheet is effectively reduced, and the attenuation sheet is more easily arranged in the high-frequency circuit, and the end conductor of the attenuation sheet is processed at one time, so that the precision and the quality of the attenuation sheet are further improved.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the present specification and the drawings, or applied directly or indirectly to other related technical fields, are included in the scope of the present invention.
Claims (5)
1. A preparation method of a surface-mounted miniature superposed circuit attenuation sheet for a 64-channel power amplifier circuit in 5G communication is disclosed, wherein the size of the attenuation sheet is 2.5mm x 4mm x 0.635mm, the attenuation sheet comprises an aluminum nitride ceramic substrate (1), a first attenuation circuit (2A) and a second attenuation circuit (2B) are arranged on the front surface of the aluminum nitride ceramic substrate (1), and an input pad (3A), an output pad (3B) and a ground conductor (4) are arranged on the back surface of the aluminum nitride ceramic substrate (1); the first attenuation circuit (2A) comprises a resistor R1, a resistor R3 and a resistor R4, and the second attenuation circuit (2B) comprises a resistor R2, a resistor R3 and a resistor R5; the resistor R1, the resistor R3 and the resistor R2 are vertically arranged and evenly distributed along the length direction of the substrate (1), the resistor R4 is located above the resistor R1 and the resistor R3, two ends of the resistor R4 are respectively connected in series with the upper end of the resistor R1 and the upper end of the resistor R3, the resistor R5 is located above the resistor R3 and the resistor R2, and two ends of the resistor R5 are respectively connected in series with the upper end of the resistor R3 and the upper end of the resistor R2; the input pad is connected with the input end of the first attenuation circuit (2A) through a first end conductor (51), the output pad is connected with the output end of the second attenuation circuit (2B) through a second end conductor (52), and the grounding conductor (4) is connected with the lower ends of the resistor R1, the resistor R3 and the resistor R2 through a third end conductor (53);
the preparation method comprises the following steps:
(1) cleaning: cleaning an aluminum nitride ceramic substrate by using clean water and alcohol in sequence, wherein the size of the ceramic substrate is 50mm by 60mm by 0.635 mm;
(2) back printing: printing a back conductor on the cleaned aluminum nitride ceramic substrate, wherein the printing adopts a screen printing process, printing slurry is high-temperature conductive silver paste, drying is carried out after the printing is finished, organic matters and water in the silver paste are taken out, the drying temperature is 140-200 ℃, and the drying time is 10-15 min;
(3) front printing: printing a front conductor on the front surface of the dried ceramic substrate, wherein the front conductor printing adopts the same process flow as the back conductor printing;
(4) sintering and forming: placing the ceramic substrate with the printed front conductor and the printed back conductor into a resistance furnace for high-temperature sintering at 800-900 ℃ for 35-45 min;
(5) resistance printing: further printing resistors on the front-side conductor, printing resistor slurry by using a steel wire mesh plate, drying in an oven at the drying temperature of 140-200 ℃ for 10-15min after printing, and then sintering at the high temperature of 850 ℃ for 40-50 min;
(6) printing a first protective layer: printing a first protective layer on the printed resistor, wherein the first protective layer is a green glass protective film, and then putting the green glass protective film into an oven for sintering, wherein the sintering temperature is 600 ℃, and the sintering time is 35 min;
(7) laser resistance adjustment: cutting the length-width ratio of the printed resistor by a laser process to adjust the initial R value to a required value;
(8) printing a second protective layer: printing a second protective layer after the resistance adjustment is finished, wherein the second protective layer is a black glass protective layer, and the printing process of the second protective layer is the same as that of the first protective layer;
(9) folding the strips: cutting the aluminum nitride ceramic substrate into strips of 2.5mm by 60mm by 0.635mm so as to facilitate the subsequent end conductor vacuum sputtering process;
(10) end conductor sputtering: putting the divided attenuation sheets into a sputtering jig for vacuum sputtering, wherein the sputtering jig is provided with a shield on the side wall of each attenuation sheet, shields the part without the end conductor, and only sputters the conductor part, thereby completing the one-time completion of all the end conductors;
(11) particle folding: the bar-shaped workpiece was divided into dimensions of 2.5mm 4mm 0.635 mm.
2. The method for preparing the surface-mounted miniature superposed circuit attenuation sheet for the 64-channel power amplifier circuit in the 5G communication according to claim 1, is characterized in that: the attenuation amount of the first attenuation circuit and the attenuation amount of the second attenuation circuit are both 15 dB.
3. The method for preparing the surface-mounted miniature superposed circuit attenuation sheet for the 64-channel power amplifier circuit in the 5G communication according to claim 1, is characterized in that: the front surface of the attenuation sheet is covered with a black protection film (6), the black protection film covers all resistors and part of conductors, and the conductor part exposed by the black protection film is communicated with the first end conductor, the second end conductor and the third end conductor.
4. The method for preparing the surface-mounted miniature superposed circuit attenuation sheet for the 64-channel power amplifier circuit in the 5G communication according to claim 1, is characterized in that: the silver paste contains 0.5% of palladium.
5. The method for preparing the surface-mounted miniature superposed circuit attenuation sheet for the 64-channel power amplifier circuit in the 5G communication according to claim 1, is characterized in that: and (3) printing a marking layer after the step (8), printing character marks on the surface of the black glass protective layer, using white ink for printing, putting the glass protective layer into an oven for drying after printing is finished, wherein the drying temperature is 250 ℃, and the drying time is 20 min.
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