CN111024235B - Infrared focal plane supporting structure with thermal stress unloading function - Google Patents
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- CN111024235B CN111024235B CN201911156871.1A CN201911156871A CN111024235B CN 111024235 B CN111024235 B CN 111024235B CN 201911156871 A CN201911156871 A CN 201911156871A CN 111024235 B CN111024235 B CN 111024235B
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- 230000008646 thermal stress Effects 0.000 title claims abstract description 31
- 239000000758 substrate Substances 0.000 claims abstract description 81
- 230000000149 penetrating effect Effects 0.000 claims description 30
- 239000000126 substance Substances 0.000 claims description 3
- 230000035882 stress Effects 0.000 description 12
- 238000003384 imaging method Methods 0.000 description 10
- 239000000463 material Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 238000001816 cooling Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000571 coke Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- WUUZKBJEUBFVMV-UHFFFAOYSA-N copper molybdenum Chemical compound [Cu].[Mo] WUUZKBJEUBFVMV-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 240000004282 Grewia occidentalis Species 0.000 description 1
- 229910000661 Mercury cadmium telluride Inorganic materials 0.000 description 1
- MCMSPRNYOJJPIZ-UHFFFAOYSA-N cadmium;mercury;tellurium Chemical compound [Cd]=[Te]=[Hg] MCMSPRNYOJJPIZ-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 238000013016 damping Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0205—Mechanical elements; Supports for optical elements
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J2005/0077—Imaging
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/28—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using photoemissive or photovoltaic cells
- G01J2005/283—Array
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- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
The invention discloses an infrared focal plane supporting structure with a thermal stress unloading function, which comprises: the device comprises a detector reading circuit, a substrate, a supporting structure, a cold head, a cold finger and a flexible unloading heat-conducting wire; wherein the detector readout circuit is bonded to the substrate; the substrate is bonded on the supporting structure; the support structure is mounted on the cold head; the cold finger is connected with the cold head; the flexible unloading heat-conducting wire is arranged in the supporting structure. The invention solves the problems of high-efficiency heat conduction, thermal stress and thermal deformation of the infrared focal plane assembly.
Description
Technical Field
The invention belongs to the technical field of focal plane supporting structures of space remote sensors, and particularly relates to an infrared focal plane supporting structure with a thermal stress unloading function.
Background
In recent years, with the continuous development of space infrared cameras, the infrared detector is developed from a unit, a few-element and a multi-element linear array to a multi-element area array, a long-element array and a large-area array, and the development of an infrared detection technology from a point target to scanning imaging, push-scan imaging to staring imaging is promoted. At present, the splicing technology of a plurality of detectors is widely adopted to meet the use requirement, and the size of a focal plane can reach 100-300 mm.
The flip-chip interconnection welding focal mode is one of the main modes of detector integration, and the mercury cadmium telluride photosensitive element chip and the reading circuit chip are interconnected and coupled to form the focal plane detector. The detector is then bonded to a tiled substrate (sapphire, silicon carbide, silicon, etc. are the base materials) and then to the focal plane support structure. The support structure is connected with the coke surface substrate and a cold head of the refrigerator, and the cold head generally adopts red copper, molybdenum copper and other materials. Various materials are integrated or assembled together at normal temperature, and when working at low temperature, thermal deformation and thermal stress are inevitably generated. The main functions of the support structure are: 1) transferring the cold of the cold head to the coke surface efficiently; 2) the thermal deformation of the focal plane is reduced, the thermal stress of the detector is reduced, and the flatness of the focal plane is ensured.
The infrared detector needs to reduce thermal noise through a refrigeration means, and generally needs to have good imaging performance at low temperature (55K-120K). The detector assembly is assembled at normal temperature, and thermal stress and deformation can be generated due to the difference of the thermal expansion coefficients of materials in the cooling process, so that the photosensitive surface of the detector is not coplanar, even the detector is broken, and the imaging quality and the assembly reliability are seriously influenced.
Disclosure of Invention
The technical problem solved by the invention is as follows: the defects of the prior art are overcome, the infrared focal plane supporting structure with the thermal stress unloading function is provided, and the problems of high-efficiency heat conduction, thermal stress and thermal deformation of the infrared focal plane assembly are solved.
The purpose of the invention is realized by the following technical scheme: an infrared focal plane support structure with thermal stress relief, comprising: the device comprises a detector reading circuit, a substrate, a supporting structure, a cold head, a cold finger and a flexible unloading heat-conducting wire; wherein the detector readout circuit is bonded to the substrate; the substrate is bonded on the supporting structure; the support structure is mounted on the cold head; the cold finger is connected with the cold head; the flexible unloading heat-conducting wire is arranged in the supporting structure.
In the infrared focal plane supporting structure with the thermal stress unloading function, the supporting structure is a flat plate, wherein the lower surface of the flat plate is provided with an H-shaped cold finger bonding surface; the upper surface of the flat plate is provided with a first detector substrate side bonding surface, a second detector substrate side bonding surface, a third detector substrate side bonding surface, a fourth detector substrate side bonding surface and a flexible heat transfer area; the first detector substrate side bonding surface and the second detector substrate side bonding surface are opposite to each other and are positioned at the outer edge of the upper surface of the flat plate; the third detector substrate side bonding surface and the fourth detector substrate side bonding surface are opposite, and the third detector substrate side bonding surface and the fourth detector substrate side bonding surface are both positioned at the outer edge of the upper surface of the flat plate; the flexible heat transfer area is located in the middle of the upper surface of the flat plate, and the flexible unloading heat conduction wires are arranged in the flexible heat transfer area.
In the infrared focal plane supporting structure with the thermal stress unloading function, the upper surface of the flat plate is provided with a through groove X1, a through groove X2, a through groove X3, a through groove X4, a non-through groove X5, a non-through groove X6, a non-through groove Y1 and a non-through groove Y2; wherein, the through groove X1, the through groove X2, the through groove X3, the through groove X4, the non-through groove X5, the non-through groove X6, the non-through groove Y1 and the non-through groove Y2 are positioned at the boundary position of the H-shaped cold finger bonding surface; the non-penetrating groove X5 is opposite to the non-penetrating groove X6, and the non-penetrating groove X5 is parallel to the non-penetrating groove X6; the through groove X1 is opposite to the through groove X2, and the through groove X1 is parallel to the through groove X2; the through groove X3 is opposite to the through groove X4, and the through groove X3 is parallel to the through groove X4; the non-penetrating groove Y1 and the non-penetrating groove Y2 are opposed to each other, and the non-penetrating groove Y1 and the non-penetrating groove Y2 are parallel to each other.
In the infrared focal plane supporting structure with the thermal stress unloading function, the lower surface of the flat plate is provided with a non-through groove X7, a non-through groove X8, a non-through groove Y3, a non-through groove Y4, a non-through groove Y5 and a non-through groove Y6; the non-through groove X7 is located at the inner boundary of the first detector substrate side bonding surface 1, the non-through groove X8 is located at the inner boundary of the second detector substrate side bonding surface 2, the non-through groove Y3 is located at the inner boundary of the third detector substrate side bonding surface 3, the non-through groove Y4 is located at the inner boundary of the fourth detector substrate side bonding surface 4, the non-through groove Y5 is located at the central position of the first detector substrate side bonding surface 1, and the non-through groove Y6 is located at the central position of the second detector substrate side bonding surface 2.
In the infrared focal plane supporting structure with the thermal stress unloading function, the flat plate is provided with a non-through groove Z1, a non-through groove Z2, a non-through groove Z3 and a non-through groove Z4; the non-through groove Z1 is positioned at the position 1/3-1/2 along the thickness direction of the left boundary of the third detector substrate side bonding surface 3; the non-through groove Z3 is positioned at the position 1/3-1/2 along the thickness direction of the left boundary of the fourth detector substrate side bonding surface 4; the non-through groove Z2 is positioned at the position 1/3-1/2 along the thickness direction of the right boundary of the third detector substrate side bonding surface 3; the non-through groove Z4 is located at the position 1/3-1/2 along the thickness direction of the right boundary of the fourth detector substrate side bonding surface 4.
In the infrared focal plane supporting structure with the thermal stress unloading function, the coordinate system takes the intersection point of the long edge and the short edge of the lower surface of the flat plate as the origin, the long edge is in the X direction, the short edge is in the Y direction, and the thickness direction is in the Z direction.
Compared with the prior art, the invention has the following beneficial effects:
1) according to the invention, the thermal stress on the infrared focal plane is fully unloaded through three unloading grooves in the X direction, the Y direction and the Z direction, so that the imaging quality is ensured;
2) the invention fully transmits the cold quantity of the refrigerator to the detector through the flexible heat transfer area formed by the flexible heat transfer wires, ensures the ambient temperature of the imaging of the detector and the uniform transmission of the temperature, and simultaneously, the flexible structure can not cause stress concentration.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a cross-sectional view of an infrared focal plane support structure with thermal stress relief provided by an embodiment of the present invention;
FIG. 2 is an exploded view of an infrared focal plane support structure with thermal stress relief provided by an embodiment of the present invention;
FIG. 3 is a schematic view of a support structure provided by an embodiment of the present invention;
FIG. 4 is another schematic view of a support structure provided by an embodiment of the present invention;
FIG. 5 is a further schematic view of a support structure provided by an embodiment of the present invention;
fig. 6 is a schematic diagram of a simulation result of the support structure according to the embodiment of the present invention.
Detailed Description
Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art. It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Fig. 1 is a cross-sectional view of an infrared focal plane support structure with thermal stress relief provided by an embodiment of the invention. Fig. 2 is an exploded view of an infrared focal plane support structure with thermal stress relief provided by an embodiment of the present invention. As shown in fig. 1 and 2, the infrared focal plane support structure includes a detector readout circuit 100, a substrate 200, a support structure 300, a cold head 400, a cold finger 500, and a flexible unload thermal conductive filament 600; wherein the content of the first and second substances,
the detector readout circuit 100 is bonded to a substrate 200; the substrate 200 is bonded to the support structure 300; the support structure 300 is mounted on a coldhead 400; the cold finger 500 is connected with the cold head 400; the flexible unloaded thermal wire 600 is disposed within the support structure 300.
Fig. 3 is a schematic view of a support structure provided by an embodiment of the present invention. As shown in fig. 3, the supporting structure 300 is a flat plate, wherein the lower surface of the flat plate is provided with an H-shaped cold finger bonding surface; the upper surface of the flat plate is provided with a first detector substrate side bonding surface 1, a second detector substrate side bonding surface 2, a third detector substrate side bonding surface 3, a fourth detector substrate side bonding surface 4 and a flexible heat transfer area; the first detector substrate side bonding surface 1 and the second detector substrate side bonding surface 2 are opposite, and the first detector substrate side bonding surface 1 and the second detector substrate side bonding surface 2 are both positioned at the outer edge of the upper surface of the flat plate; the third detector substrate side bonding surface 3 is opposite to the fourth detector substrate side bonding surface 4, and the third detector substrate side bonding surface 3 and the fourth detector substrate side bonding surface 4 are both positioned at the outer edge of the upper surface of the flat plate; the flexible heat transfer area is located at the middle position of the upper surface of the flat plate, and the flexible unloading heat transfer wire 600 is arranged in the flexible heat transfer area.
As shown in fig. 3, the upper surface of the flat plate is provided with a through groove X1, a through groove X2, a through groove X3, a through groove X4, a non-through groove X5, a non-through groove X6, a non-through groove Y1, and a non-through groove Y2; wherein, the through groove X1, the through groove X2, the through groove X3, the through groove X4, the non-through groove X5, the non-through groove X6, the non-through groove Y1 and the non-through groove Y2 are positioned at the boundary position of the H-shaped cold finger bonding surface; the non-penetrating groove X5 is opposite to the non-penetrating groove X6, and the non-penetrating groove X5 is parallel to the non-penetrating groove X6; the through groove X1 is opposite to the through groove X2, and the through groove X1 is parallel to the through groove X2; the through groove X3 is opposite to the through groove X4, and the through groove X3 is parallel to the through groove X4; the non-penetrating groove Y1 and the non-penetrating groove Y2 are opposed to each other, and the non-penetrating groove Y1 and the non-penetrating groove Y2 are parallel to each other. The through groove X1, the through groove X2, the through groove X3, the through groove X4, the non-through groove X5, the non-through groove X6, the non-through groove Y1, and the non-through groove Y2 are used to unload X, Y thermal stress.
As shown in fig. 5, the lower surface of the flat plate is provided with a non-through groove X7, a non-through groove X8, a non-through groove Y3, a non-through groove Y4, a non-through groove Y5 and a non-through groove Y6; the non-through groove X7 is located at the inner boundary of the first detector substrate side bonding surface 1, the non-through groove X8 is located at the inner boundary of the second detector substrate side bonding surface 2, the non-through groove Y3 is located at the inner boundary of the third detector substrate side bonding surface 3, the non-through groove Y4 is located at the inner boundary of the fourth detector substrate side bonding surface 4, the non-through groove Y5 is located at the central position of the first detector substrate side bonding surface 1, and the non-through groove Y6 is located at the central position of the second detector substrate side bonding surface 2. The non-penetrating groove X7, the non-penetrating groove X8, the non-penetrating groove Y3, the non-penetrating groove Y4, the non-penetrating groove Y5, and the non-penetrating groove Y6 are used to unload X, Y thermal stress.
Fig. 4 is another schematic view of a support structure provided by an embodiment of the invention. As shown in fig. 4, the flat plate is provided with a non-through groove Z1, a non-through groove Z2, a non-through groove Z3 and a non-through groove Z4; the non-through groove Z1 is positioned at the position 1/3-1/2 along the thickness direction of the left boundary of the third detector substrate side bonding surface 3; the non-through groove Z3 is positioned at the position 1/3-1/2 along the thickness direction of the left boundary of the fourth detector substrate side bonding surface 4; the non-through groove Z2 is positioned at the position 1/3-1/2 along the thickness direction of the right boundary of the third detector substrate side bonding surface 3; the non-through groove Z4 is located at the position 1/3-1/2 along the thickness direction of the right boundary of the fourth detector substrate side bonding surface 4. The non-through groove Z1, the non-through groove Z2, the non-through groove Z3 and the non-through groove Z4 are used for unloading Z thermal stress.
The coordinate system is based on the intersection point of the long side and the short side of the lower surface (cold head bonding surface side) of the flat plate, the long side is in X direction, the short side is in Y direction, and the thickness direction is in Z direction
The working principle of the infrared focal plane supporting structure is as follows: in the process of cooling, the cold head and the supporting structure are made of the same material (molybdenum copper, red copper and the like), the thermal expansion coefficient is larger than that of the substrate, and convex deformation is generated. The upward convex stress is decomposed into X, Y, Z forces in three directions, each force in the three directions is provided with a stress unloading groove, and meanwhile, a stress unloading fillet is designed in a stress concentration area at the root of the groove. The middle thermal stress is relieved at the middle groove by passing through the support structure; the thermal stress of the peripheral concave part is unloaded by the annular unloading groove. The substrate has higher hardness and can also improve the deformation of the bonding surface of the silicon wafer.
In addition, in the process of cooling the cold finger, on one hand, mechanical vibration or pressure gas fluctuation can be generated, the vibration is transmitted to the focal plane of the detector along with the cold finger, and the imaging quality of the focal plane is affected in severe cases. The supporting structure prolongs the transmission path of vibration, thereby reducing the vibration at the detector; on the other hand, the small contact area between the support structure and the substrate is not beneficial to the transmission of cold energy. A fine wire structure (copper foil, copper wire, indium wire and other materials can be selected) with good damping characteristics and high heat conductivity coefficient is bonded in the central groove of the supporting structure, so that the thermal resistance is effectively reduced, and sufficient contact area is ensured to transfer cold.
Simulation analysis of the support structure was performed using Patran software, and the results are shown in FIG. 6. The stress concentration area is in the four-corner unconstrained area (cold finger side), the stress of the coupling substrate is small, the stress distribution is uniform, and large stress concentration does not occur. The central area is the bonding position of the detector chip, and the simulation result shows that the stress towards the central direction is gradually reduced, the force directly acting on the device is smaller, and the purpose of stress unloading is achieved.
According to the invention, the thermal stress on the infrared focal plane is fully unloaded through three unloading grooves in the X direction, the Y direction and the Z direction, so that the imaging quality is ensured; the invention fully transmits the cold quantity of the refrigerator to the detector through the flexible heat transfer area formed by the flexible heat transfer wires, ensures the ambient temperature of the imaging of the detector and the uniform transmission of the temperature, and simultaneously, the flexible structure can not cause stress concentration.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention, and those skilled in the art can make variations and modifications of the present invention without departing from the spirit and scope of the present invention by using the methods and technical contents disclosed above.
Claims (4)
1. An infrared focal plane support structure with thermal stress unloading function, characterized by comprising: a detector readout circuit (100), a substrate (200), a support structure (300), a cold head (400), a cold finger (500), and a flexible unload thermal conductive filament (600); wherein the content of the first and second substances,
the detector readout circuit (100) is bonded to a substrate (200);
-said base plate (200) is bonded to said support structure (300);
the support structure (300) is mounted on a cold head (400);
the cold finger (500) is connected with the cold head (400);
the flexible unloading heat-conducting wire (600) is arranged inside the supporting structure (300);
the supporting structure (300) is a flat plate, wherein the lower surface of the flat plate is provided with an H-shaped cold finger bonding surface; the upper surface of the flat plate is provided with a first detector substrate side bonding surface (1), a second detector substrate side bonding surface (2), a third detector substrate side bonding surface (3), a fourth detector substrate side bonding surface (4) and a flexible heat transfer area; the first detector substrate side bonding surface (1) is opposite to the second detector substrate side bonding surface (2), and the first detector substrate side bonding surface (1) and the second detector substrate side bonding surface (2) are both positioned at the outer edge of the upper surface of the flat plate; the third detector substrate side bonding surface (3) is opposite to the fourth detector substrate side bonding surface (4), and the third detector substrate side bonding surface (3) and the fourth detector substrate side bonding surface (4) are both positioned at the outer edge of the upper surface of the flat plate; the flexible heat transfer area is positioned in the middle of the upper surface of the flat plate, and the flexible unloading heat conduction wire (600) is arranged in the flexible heat transfer area;
the upper surface of the flat plate is provided with a through groove X1, a through groove X2, a through groove X3, a through groove X4, a non-through groove X5, a non-through groove X6, a non-through groove Y1 and a non-through groove Y2; wherein, the through groove X1, the through groove X2, the through groove X3, the through groove X4, the non-through groove X5, the non-through groove X6, the non-through groove Y1 and the non-through groove Y2 are positioned at the boundary position of the H-shaped cold finger bonding surface; the non-penetrating groove X5 is opposite to the non-penetrating groove X6, and the non-penetrating groove X5 is parallel to the non-penetrating groove X6; the through groove X1 is opposite to the through groove X2, and the through groove X1 is parallel to the through groove X2; the through groove X3 is opposite to the through groove X4, and the through groove X3 is parallel to the through groove X4; the non-penetrating groove Y1 and the non-penetrating groove Y2 are opposed to each other, and the non-penetrating groove Y1 and the non-penetrating groove Y2 are parallel to each other.
2. The infrared focal plane support structure with thermal stress relief according to claim 1, wherein: the lower surface of the flat plate is provided with a non-through groove X7, a non-through groove X8, a non-through groove Y3, a non-through groove Y4, a non-through groove Y5 and a non-through groove Y6; wherein the content of the first and second substances,
the non-through groove X7 is located at the inner boundary of a first detector substrate side bonding surface (1), the non-through groove X8 is located at the inner boundary of a second detector substrate side bonding surface (2), the non-through groove Y3 is located at the inner boundary of a third detector substrate side bonding surface (3), the non-through groove Y4 is located at the inner boundary of a fourth detector substrate side bonding surface (4), the non-through groove Y5 is located at the central position of the first detector substrate side bonding surface (1), and the non-through groove Y6 is located at the central position of the second detector substrate side bonding surface (2).
3. The infrared focal plane support structure with thermal stress relief according to claim 2, wherein: the flat plate is provided with a non-through groove Z1, a non-through groove Z2, a non-through groove Z3 and a non-through groove Z4; the non-through groove Z1 is positioned at the position of the left boundary of the third detector substrate side bonding surface (3) along the thickness direction 1/3-1/2; the non-through groove Z3 is positioned at the position 1/3-1/2 along the thickness direction of the left boundary of the fourth detector substrate side bonding surface (4); the non-through groove Z2 is positioned at the position of the right boundary of the third detector substrate side bonding surface (3) along the thickness direction 1/3-1/2; the non-through groove Z4 is located at the position 1/3-1/2 along the thickness direction of the right boundary of the fourth detector substrate side bonding surface (4).
4. The infrared focal plane support structure with thermal stress relief according to claim 3, wherein: the coordinate system takes the intersection point of the long side and the short side of the lower surface of the flat plate as an origin, the long side is in the X direction, the short side is in the Y direction, and the thickness direction is in the Z direction.
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| CN111624171B (en) * | 2020-05-07 | 2023-08-11 | 北京空间机电研究所 | Low-temperature vacuum large-optical-path high-sensitivity linear scanning device |
| CN111812912A (en) * | 2020-08-03 | 2020-10-23 | 中国科学院长春光学精密机械与物理研究所 | Focal plane image rotating mechanism |
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