CN111023039A - Bent substrate bracket assembly and manufacturing method thereof - Google Patents
Bent substrate bracket assembly and manufacturing method thereof Download PDFInfo
- Publication number
- CN111023039A CN111023039A CN201911156485.2A CN201911156485A CN111023039A CN 111023039 A CN111023039 A CN 111023039A CN 201911156485 A CN201911156485 A CN 201911156485A CN 111023039 A CN111023039 A CN 111023039A
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- Prior art keywords
- bending
- substrate
- groove
- assembly
- bent
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000000758 substrate Substances 0.000 title claims abstract description 84
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 20
- 238000005452 bending Methods 0.000 claims abstract description 101
- 238000003698 laser cutting Methods 0.000 claims abstract description 14
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052782 aluminium Inorganic materials 0.000 claims description 12
- 238000005520 cutting process Methods 0.000 claims description 10
- 239000002245 particle Substances 0.000 claims description 10
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 abstract description 21
- 238000009434 installation Methods 0.000 abstract description 8
- 208000010392 Bone Fractures Diseases 0.000 abstract description 5
- 206010017076 Fracture Diseases 0.000 abstract description 5
- 239000000463 material Substances 0.000 description 4
- 239000004411 aluminium Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 239000008187 granular material Substances 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000008707 rearrangement Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/19—Attachment of light sources or lamp holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60Q—ARRANGEMENT OF SIGNALLING OR LIGHTING DEVICES, THE MOUNTING OR SUPPORTING THEREOF OR CIRCUITS THEREFOR, FOR VEHICLES IN GENERAL
- B60Q1/00—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor
- B60Q1/26—Arrangement of optical signalling or lighting devices, the mounting or supporting thereof or circuits therefor the devices being primarily intended to indicate the vehicle, or parts thereof, or to give signals, to other traffic
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S43/00—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights
- F21S43/10—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source
- F21S43/13—Signalling devices specially adapted for vehicle exteriors, e.g. brake lamps, direction indicator lights or reversing lights characterised by the light source characterised by the type of light source
- F21S43/14—Light emitting diodes [LED]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2103/00—Exterior vehicle lighting devices for signalling purposes
- F21W2103/55—Daytime running lights [DRL]
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21W—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO USES OR APPLICATIONS OF LIGHTING DEVICES OR SYSTEMS
- F21W2107/00—Use or application of lighting devices on or in particular types of vehicles
- F21W2107/10—Use or application of lighting devices on or in particular types of vehicles for land vehicles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to the field of car lamp accessories and discloses a bent substrate bracket assembly and a manufacturing method thereof. The bending substrate bracket assembly comprises a bracket, a substrate and a patch, wherein the bracket is provided with an accommodating groove; the substrate is arranged in the accommodating groove, and a bending plate is arranged on the substrate; the paster and the base plate are packaged into an integral structure, a bending piece is arranged on the paster, and the bending piece is attached to the bending plate. The manufacturing method of the bent substrate bracket assembly is used for preparing the bent substrate bracket assembly. The invention reduces the thickness and the bending stress by carrying out laser cutting at the preset bending position, ensures that the substrate does not have fracture risk in the bending process, ensures that the substrate does not contact with the light guide sheet after assembly, avoids the risk of circuit breaking caused by friction, has convenient and quick installation, simple working procedure, easy manufacture, high assembly efficiency and low requirement on assembly space.
Description
Technical Field
The invention relates to the field of car lamp accessories, in particular to a bent substrate bracket assembly and a manufacturing method thereof.
Background
For aluminium base board day portable lighter, because the structural design demand of car lamp, often can meet the condition that the LED granule is not at the coplanar, aluminium base board need bend and place, and the copper line on the aluminium base board is thinner, receives external force to bend the copper line and can break, leads to opening a way badly.
The common solution in the prior art is to divide the aluminum substrate into two parts, namely a flexible substrate and an aluminum sheet, wherein the two parts are separated from each other, and the connection of the power lines is performed only by virtue of a conducting wire or a flexible sheet. This soft substrate and aluminum sheet structure has the following disadvantages: a plurality of aluminum sheets are assembled on the soft substrate, so that the repeated procedures are too many, and the assembly efficiency is low; the soft substrate is a non-complete fixed part and can be contacted with the light guide sheet after being assembled, so that the risk of circuit open caused by friction exists in the long-time working process; when the aluminum sheet is fixed with the bracket, a single aluminum sheet needs two positioning points and two hot stamping points, and the requirement on the assembly space is high.
Disclosure of Invention
Based on the above problems, the invention aims to provide a bent substrate support assembly which is simple in process, high in assembly efficiency and low in requirement on assembly space.
In view of the above problems, an object of the present invention is to provide a method for manufacturing a bent substrate holder assembly, which has simple process, high assembly efficiency, and low requirement for assembly space.
In order to achieve the purpose, the invention adopts the following technical scheme:
a bent substrate support assembly, comprising:
a bracket provided with a receiving groove;
the base plate is arranged in the accommodating groove, and a bending plate is arranged on the base plate;
the patch and the substrate are packaged into an integral structure, a bending piece is arranged on the patch, and the bending piece is attached to the bending plate.
As a preferred scheme of the substrate support assembly for bending of the invention, a first groove is arranged at the bending position of the bending plate.
As a preferable scheme of the bending substrate support assembly of the present invention, a second groove is provided at a bending position of the bending piece.
As a preferable embodiment of the bent substrate holder assembly of the present invention, a plurality of the bent plates and the bent pieces are provided.
As a preferred scheme of the bending substrate support assembly, an installation seat is arranged in the accommodating groove, an installation groove is arranged on the installation seat, an included angle is formed between the groove bottom of the installation groove and the groove bottom of the accommodating groove, and the bending plate and the bending sheet are both arranged in the installation groove.
As a preferable scheme of the bent substrate bracket assembly of the present invention, an elastic buckle is disposed on the mounting seat, and the elastic buckle is configured to press the patch and the substrate against a groove bottom of the accommodating groove.
As a preferable aspect of the bent substrate holder assembly of the present invention, a plurality of snaps are provided on both sides of the holder.
In a preferred embodiment of the bent substrate holder assembly according to the present invention, the patch is made of aluminum.
As a preferable scheme of the bent substrate support assembly of the present invention, the bent sheet is provided with LED particles, and the patch is provided with a connection circuit, which is connected to the LED particles.
A method of manufacturing a bent substrate holder assembly, for preparing a bent substrate holder assembly as described above, comprising the steps of:
s1, packaging the patch and the substrate into an integrated structure, and cutting at a preset cutting position;
s2, performing laser cutting at a preset bending position to reduce the thickness;
s3, stamping at a preset bending position at a high temperature to form a bending structure;
and S4, mounting the integrated structure in the accommodating groove of the bracket.
The invention has the beneficial effects that:
according to the bending substrate support assembly provided by the invention, a patch and a substrate are packaged into an integrated structure, a bending piece is arranged on the patch, a bending plate is arranged on the substrate, the bending piece is attached to the bending plate to jointly form a bending structure as a carrier of LED particles, an accommodating groove is arranged on a support, and the integrated structure packaged by the patch and the substrate is arranged in the accommodating groove. According to the bent substrate support assembly provided by the invention, the substrate is not in contact with the light guide sheet after assembly, the risk of circuit breaking caused by friction is avoided, the structure is simple, the installation is convenient and rapid, the process is simple, the manufacturing is easy, the assembly efficiency is high, and the requirement on the assembly space is low.
The manufacturing method of the bent substrate support assembly comprises the steps of firstly packaging a patch and a substrate into an integrated structure, cutting at a preset cutting position, then carrying out laser cutting at the preset bending position to reduce the thickness, then stamping at the preset bending position to form a bent structure, and finally installing the integrated structure in an accommodating groove of a support. According to the manufacturing method of the bent substrate bracket assembly, the thickness is reduced by carrying out laser cutting at the preset bending position, the bending stress is reduced, the substrate is ensured not to have a fracture risk in the bending process, the substrate is not in contact with the light guide sheet after assembly, the risk of circuit breaking caused by friction is avoided, the mounting is convenient and rapid, the process is simple, the manufacturing is easy, the assembly efficiency is high, and the requirement on the assembly space is low.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
FIG. 1 is a schematic diagram of a bent substrate support assembly according to an embodiment of the present invention;
FIG. 2 is an exploded view of a bent substrate support assembly according to an embodiment of the present invention;
FIG. 3 is a flow chart of a method of manufacturing a bent substrate support assembly according to an embodiment of the present invention.
In the figure:
1-a scaffold; 2-a substrate; 3-pasting a piece;
11-a holding tank; 12-a mounting seat; 121-mounting grooves; 122-snap fastener; 13-buckling;
21-bending a plate; 22-a first groove;
31-bending sheet; 32-second groove.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it should be noted that unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection or a removable connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The present embodiment provides a folded substrate support assembly, which includes a support 1, a substrate 2, and a die 3, as shown in fig. 1 and 2. Wherein, the bracket 1 is provided with a containing groove 11; the substrate 2 is arranged in the accommodating groove 11, and a bending plate 21 is arranged on the substrate 2; paster 3 and base plate 2 encapsulation formula structure as an organic whole, be provided with bending piece 31 on paster 3, bending piece 31 is attached on board 21 of bending.
The integrated structure of the paster 3 and the substrate 2 is packaged into an integrated structure, the bending piece 31 is arranged on the paster 3, the bending plate 21 is arranged on the substrate 2, the bending piece 31 is attached to the bending plate 21 to jointly form a bending structure as a bearing body of LED particles, the accommodating groove 11 is formed in the support 1, and the integrated structure of the paster 3 and the substrate 2 is arranged in the accommodating groove 11.
In order to prevent the substrate 2 from breaking during bending, optionally, the bending part of the bending plate 21 is provided with a first groove 22. Carry out laser cutting at the department of bending of the board 21 of bending and form first recess 22 to reduce the thickness of the department of bending of the board 21 of bending, reduce the stress of buckling, guarantee that base plate 2 can not have the fracture risk at the in-process of buckling.
In order to prevent the patch 3 from breaking during bending, optionally, a second groove 32 is provided at the bending position of the bending piece 31. Carry out laser cutting at the department of bending of piece 31 and form second recess 32 to reduce the thickness of the department of bending of piece 31, reduce the stress of buckling, guarantee that paster 3 can not have the fracture risk at the in-process of buckling.
In this embodiment, the bending sheet 31 is provided with LED particles, and the patch 3 is provided with a connection circuit, which is connected to the LED particles. In order to meet the requirement of the vehicle lamp on the distribution position of the LED particles, optionally, a plurality of bending plates 21 and bending pieces 31 are provided. To ensure a better bending performance and a light weight design, the patch 3 is optionally made of aluminum.
In order to facilitate mounting of the patch 3 and the substrate 2, optionally, a mounting seat 12 is provided in the accommodating groove 11, a mounting groove 121 is provided on the mounting seat 12, an included angle is formed between the groove bottom of the mounting groove 121 and the groove bottom of the accommodating groove 11, and the bending plate 21 and the bending piece 31 are both disposed in the mounting groove 121. In order to prevent the chip 3 and the substrate 2 from tilting, optionally, a spring buckle 122 is disposed on the mounting base 12, and the spring buckle 122 is used for pressing the chip 3 and the substrate 2 against the bottom of the accommodating groove 11. To facilitate detachable connection with external components, optionally, both sides of the bracket 1 are provided with a plurality of snaps 13.
The substrate support assembly that bends that this embodiment provided encapsulates paster 3 and base plate 2 formula structure as an organic whole, is provided with the piece 31 of bending on the paster 3, is provided with the board 21 of bending on the base plate 2, and the piece 31 of bending attaches and forms the bearing body of bending structure as the LED granule jointly on the board 21 of bending, sets up holding tank 11 on support 1, sets up the formula structure of paster 3 and base plate 2 encapsulation in holding tank 11.
The bending substrate support assembly provided by the embodiment has the advantages that the substrate 2 is not in contact with the light guide sheet after assembly, the risk of circuit breaking caused by friction is avoided, the structure is simple, the installation is convenient and fast, the process is simple, the manufacturing is easy, the assembly efficiency is high, and the requirement on the assembly space is low.
The present embodiment further provides a method for manufacturing a bent substrate holder assembly, for preparing the bent substrate holder assembly, as shown in fig. 3, the method for manufacturing a bent substrate holder assembly includes the following steps:
s1, packaging the patch 3 and the substrate 2 into an integrated structure, and cutting at a preset cutting position;
s2, performing laser cutting at a preset bending position to reduce the thickness;
s3, stamping at a preset bending position at a high temperature to form a bending structure;
and S4, mounting the integrated structure in the accommodating groove 11 of the bracket 1.
Specifically, firstly, the patch 3 and the substrate 2 are packaged into an integrated structure, and are cut at a preset cutting position, secondly, the thickness is reduced by laser cutting at a preset bending position, then, the bending structure is formed by high-temperature stamping at the preset bending position, and finally, the integrated structure is installed in the accommodating groove 11 of the bracket 1.
In step S2, laser cutting is performed at the preset bending position to reduce the thickness and reduce the stress concentration, thereby reducing the bending stress, and the process is completed by using a laser cutting technique and a numerical control machine tool technique. The laser cutting is to focus a CO2 laser beam on the surface of a material by using a focusing lens to melt the material, blow away the melted material by using compressed gas coaxial with the laser beam, and make the laser beam and the material move relatively along a certain track, thereby forming a cut with a certain shape. The numerical control machine tool is an automatic machine tool provided with a program control system. The control system is capable of logically processing and decoding a program defined by a control code or other symbolic instructions, represented by coded numbers, which are input to the numerical control device via the information carrier. After operation, the numerical control device sends out various control signals to control the action of the machine tool, and the parts are automatically machined according to the shape and the size required by the drawing.
Alternatively, before step S1, it is necessary to determine the arrangement positions of the LED particles and the connection lines on the substrate 2. Alternatively, in step S3, the ambient temperature of the high temperature workshop is 85 ℃, and various bending angles of the substrate 2 smaller than 90 ° are achieved by adjusting the punch angle of the punching die during the punching process.
In the manufacturing method of the bent substrate holder assembly provided in this embodiment, first, the patch 3 and the substrate 2 are packaged into an integrated structure, and are cut at a preset cutting position, then, the laser cutting is performed at the preset bending position to reduce the thickness, then, the bent structure is formed at the preset bending position by high-temperature stamping, and finally, the integrated structure is mounted in the accommodating groove 11 of the holder 1.
According to the manufacturing method of the bent substrate support assembly, the thickness is reduced by performing laser cutting at the preset bending position, the bending stress is reduced, the substrate 2 is guaranteed not to have a fracture risk in the bending process, the substrate 2 is not in contact with the light guide sheet after assembly, the risk of circuit breaking caused by friction is avoided, the mounting is convenient and rapid, the process is simple, the manufacturing is easy, the assembly efficiency is high, and the requirement on the assembly space is low.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments illustrated herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (10)
1. A bent substrate support assembly, comprising:
the bracket (1) is provided with an accommodating groove (11);
the base plate (2) is arranged in the accommodating groove (11), and a bending plate (21) is arranged on the base plate (2);
the patch (3) and the substrate (2) are packaged into an integrated structure, a bending piece (31) is arranged on the patch (3), and the bending piece (31) is attached to the bending plate (21).
2. The bent substrate support assembly according to claim 1, wherein the bend of the bend plate (21) is provided with a first groove (22).
3. The bent substrate holder assembly according to claim 1, wherein the bend of the bending tab (31) is provided with a second groove (32).
4. The bent substrate holder assembly according to claim 1, wherein a plurality of the bending plates (21) and the bending pieces (31) are provided.
5. The bending substrate support assembly according to claim 1, wherein a mounting seat (12) is disposed in the accommodating groove (11), a mounting groove (121) is disposed on the mounting seat (12), a groove bottom of the mounting groove (121) and a groove bottom of the accommodating groove (11) are disposed at an included angle, and the bending plate (21) and the bending piece (31) are disposed in the mounting groove (121).
6. The bending baseplate support assembly according to claim 5, wherein the mounting seat (12) is provided with a snap (122), and the snap (122) is used for pressing the patch (3) and the baseplate (2) against the groove bottom of the accommodating groove (11).
7. Bend baseplate holder assembly according to claim 1, characterized in that the holder (1) is provided with a plurality of snap-in hooks (13) on both sides.
8. Bending baseplate holder assembly according to claim 1, wherein the patch (3) is made of aluminum.
9. Bending substrate holder assembly according to claim 1, wherein the bending blades (31) are provided with LED particles and the patches (3) are provided with connection tracks, the connection tracks being connected to the LED particles.
10. A method of manufacturing a bent substrate holder assembly, for preparing a bent substrate holder assembly according to any one of claims 1-9, comprising the steps of:
s1, packaging the patch (3) and the substrate (2) into an integrated structure, and cutting at a preset cutting position;
s2, performing laser cutting at a preset bending position to reduce the thickness;
s3, stamping at a preset bending position at a high temperature to form a bending structure;
and S4, mounting the integrated structure in the accommodating groove (11) of the bracket (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911156485.2A CN111023039A (en) | 2019-11-22 | 2019-11-22 | Bent substrate bracket assembly and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911156485.2A CN111023039A (en) | 2019-11-22 | 2019-11-22 | Bent substrate bracket assembly and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111023039A true CN111023039A (en) | 2020-04-17 |
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ID=70202726
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911156485.2A Pending CN111023039A (en) | 2019-11-22 | 2019-11-22 | Bent substrate bracket assembly and manufacturing method thereof |
Country Status (1)
| Country | Link |
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| CN (1) | CN111023039A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012160430A (en) * | 2011-01-14 | 2012-08-23 | Koito Mfg Co Ltd | Lighting system |
| CN203036422U (en) * | 2013-01-22 | 2013-07-03 | 福州海华星测控技术有限公司 | Light-emitting diode (LED) mirror front lamp which is with heat pipe for radiating and with light-emitting angles adjustable |
| CN206072785U (en) * | 2016-08-29 | 2017-04-05 | 苏州弘瀚光电有限公司 | Automobile-used aluminium base bending structure |
| CN106764779A (en) * | 2016-11-14 | 2017-05-31 | 广东雷腾智能光电有限公司 | A kind of manufacture method of vehicle lamp light source |
| JP2018206534A (en) * | 2017-05-31 | 2018-12-27 | 株式会社小糸製作所 | Multilamp and multistep type light source device and vehicular lamp |
| CN210601463U (en) * | 2019-11-22 | 2020-05-22 | 华域视觉科技(上海)有限公司 | Bending substrate support assembly |
-
2019
- 2019-11-22 CN CN201911156485.2A patent/CN111023039A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012160430A (en) * | 2011-01-14 | 2012-08-23 | Koito Mfg Co Ltd | Lighting system |
| CN203036422U (en) * | 2013-01-22 | 2013-07-03 | 福州海华星测控技术有限公司 | Light-emitting diode (LED) mirror front lamp which is with heat pipe for radiating and with light-emitting angles adjustable |
| CN206072785U (en) * | 2016-08-29 | 2017-04-05 | 苏州弘瀚光电有限公司 | Automobile-used aluminium base bending structure |
| CN106764779A (en) * | 2016-11-14 | 2017-05-31 | 广东雷腾智能光电有限公司 | A kind of manufacture method of vehicle lamp light source |
| JP2018206534A (en) * | 2017-05-31 | 2018-12-27 | 株式会社小糸製作所 | Multilamp and multistep type light source device and vehicular lamp |
| CN210601463U (en) * | 2019-11-22 | 2020-05-22 | 华域视觉科技(上海)有限公司 | Bending substrate support assembly |
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