CN111019350B - Silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance - Google Patents
Silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance Download PDFInfo
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- CN111019350B CN111019350B CN201911368898.7A CN201911368898A CN111019350B CN 111019350 B CN111019350 B CN 111019350B CN 201911368898 A CN201911368898 A CN 201911368898A CN 111019350 B CN111019350 B CN 111019350B
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
- C08K3/042—Graphene or derivatives, e.g. graphene oxides
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/21—Urea; Derivatives thereof, e.g. biuret
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K9/00—Use of pretreated ingredients
- C08K9/04—Ingredients treated with organic substances
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
- C08K2003/382—Boron-containing compounds and nitrogen
- C08K2003/385—Binary compounds of nitrogen with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P20/00—Technologies relating to chemical industry
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Abstract
The invention discloses a silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance, which comprises the following components: 1-3g of MXene material; 3-5g of h-BN material; 0.5-1.5g of single-layer graphene powder; 20-50g of urea; 10-45g of silica gel; the MXene material has the functions of electromagnetic shielding, heat conduction and electric charge conduction; the h-BN material has the functions of insulating, isolating MXene and graphene nanosheets and conducting heat; the graphene has the functions of electromagnetic shielding and heat conduction; the urea is a ball milling agent and has the function of modifying the surface of a two-dimensional material. MXene material, h-BN material and single-layer graphene powder are used as fillers, urea molecules are stripped and mixed under the condition of plasma ball milling to prepare composite fillers, and the composite fillers are dispersed in silica gel to obtain the silica gel-based composite material.
Description
Technical Field
The invention relates to the technical field of composite materials, in particular to a silica gel composite material with high heat conductivity and excellent electromagnetic shielding performance.
Background
Thermal conductivity, i.e., thermal conductivity, refers to the ability of a material to conduct heat directly, or thermal conductivity. Thermal conductivity is defined as the amount of heat conducted directly by a material per unit cross-section, length, at a unit temperature difference, and per unit time. The unit of thermal conductivity is watt meter -1 Kelvin -1 . The thermal conductivity, which is the cross-sectional area of the thermal conductor, is the amount of heat conducted per unit time, and the thickness of the thermal conductor between two heat sources, is the temperature difference.
Shielding is one of the important measures for improving electromagnetic compatibility of electronic systems and electronic devices, and generally, effective technical measures are taken for controlling electromagnetic wave radiation, and the method mainly has two aspects: firstly, through optimization design; the second is shielding technology. The shielding techniques can be classified into electric shielding, magnetic shielding and electromagnetic shielding according to the difference of their action mechanisms. The shielding effectiveness of the shield is related to the electrical conductivity and magnetic permeability of the shielding material, the structure of the shield and the frequency of the shielded electromagnetic field. The research on light and good shielding materials is one of the keys for solving the shielding problem.
The existing silica gel composite material has high heat conductivity coefficient and excellent electromagnetic shielding performance, and the performance of the silica gel composite material cannot meet the actual requirement.
Disclosure of Invention
The invention aims to solve the defects in the prior art, and provides a silica gel composite material with high heat conductivity and excellent electromagnetic shielding performance.
In order to achieve the purpose, the invention provides the following technical scheme: a silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance comprises the following components:
1-3g of MXene material;
h-BN material 3-5 g;
0.5-1.5g of single-layer graphene nanosheet;
20-50g of urea;
10-45g of silica gel;
the MXene material has the functions of electromagnetic shielding, heat conduction and electric charge conduction; the h-BN material has the functions of insulating, isolating MXene and graphene nanosheets and conducting heat; the graphene has the functions of electromagnetic shielding and heat conduction; the urea is a ball milling agent and has the function of modifying the surface of a two-dimensional material;
the MXene material, the h-BN material and the graphene nanosheet are used as fillers, are peeled and mixed by urea molecules under the condition of a plasma ball mill to prepare the composite filler, and are dispersed in silica gel to obtain the silica gel-based composite material.
Preferably, the proportion of the filler concentration is controlled to be 10 wt%, and the specific components of the silica gel composite material are as follows: MXene material 1 g; 3g of h-BN material; 1g of graphene; 25g of urea; 45g of silica gel.
Preferably, the proportion of the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: 1g of MXene material; h-BN material 3 g; 1g of graphene; 25g of urea; 20g of silica gel.
Preferably, the filler concentration is controlled to be 30 wt%, and the silica gel composite material comprises the following specific components: MXene material 1 g; h-BN material 3 g; 1g of graphene; 25g of urea; 12g of silica gel.
Preferably, the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: MXene material 1 g; 3g of h-BN material; 1g of graphene; 50g of urea; 20g of silica gel.
Preferably, the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: MXene material 3 g; 3g of h-BN material; 1g of graphene; 50g of urea; 28g of silica gel.
Preferably, the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: MXene material 3 g; 3g of h-BN material; 2g of graphene; 50g of urea; 32g of silica gel.
Preferably, the composite material is intercepted and taken as a sample to respectively carry out a heat conduction experiment and an electromagnetic shielding performance experiment.
Preferably, the thickness of the sample is 250-300 um.
The invention provides a silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance, which has the following beneficial effects:
the method comprises the steps of taking MXene materials, h-BN materials and graphene as fillers, stripping and mixing urea molecules under the condition of plasma ball milling to obtain a composite filler, dispersing the composite filler in silica gel to obtain a silica gel-based composite material, and controlling the component proportion of the filler, wherein when the concentration proportion of the filler is 20 wt%, and the proportion of the MXene materials, the h-BN materials and the graphene in the filler is 3:3:2, the in-plane thermal conductivity coefficient, the out-of-plane thermal conductivity coefficient and the electromagnetic shielding performance of the obtained silica gel composite material are optimal, so that the silica gel composite material has high thermal conductivity and excellent electromagnetic shielding performance.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1
A silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance comprises the following components:
1-3g of MXene material;
h-BN material 3-5 g;
0.5-1.5g of single-layer graphene powder;
20-50g of urea;
10-45g of silica gel;
the MXene material has the functions of electromagnetic shielding, heat conduction and electric charge conduction; the h-BN material has the functions of insulating, coating, isolating MXene and graphene nanosheets and conducting heat; the graphene has the functions of electromagnetic shielding and heat conduction; the urea is an intercalation stripping reagent and has the function of modifying the surface of the two-dimensional material;
the MXene material, the h-BN material and the graphene are used as fillers, the fillers are subjected to urea molecule stripping under the condition of plasma ball milling to prepare composite fillers, and the composite fillers are dispersed in silica gel to obtain the composite material.
Wherein, the proportion of 10 wt% of the filler concentration is controlled, and the specific components of the silica gel composite material are as follows: MXene material 1 g; 3g of h-BN material; 1g of graphene; 25g of urea; 45g of silica gel.
Intercepting the combined material carries out heat conduction experiment and electromagnetic shielding performance experiment as the sample respectively, just sample thickness be 260 um.
Example 2
The silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance has the following specific components by weight percent of the filler concentration: MXene material 1 g; 3g of h-BN material; 1g of graphene; 25g of urea; 20g of silica gel.
And (3) stripping the MXene material, the h-BN material and the graphene by urea, ball-milling and mixing to prepare a filler, dispersing the filler in silica gel, and intercepting a sample to detect B.
Example 3
The silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance has the following specific components by weight percent, and the filler concentration is controlled to be 30 percent: 1g of MXene material; 3g of h-BN material; 1g of graphene; 25g of urea; 12g of silica gel.
And (3) stripping the MXene material, the h-BN material and the graphene by urea, ball-milling and mixing to prepare a filler, dispersing the filler in silica gel, and intercepting a sample to detect C.
Example 4
The silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance has the following specific components by weight percent of filler concentration controlled: 1g of MXene material; 3g of h-BN material; 1g of graphene; 50g of urea; 20g of silica gel.
And (3) stripping the MXene material, the h-BN material and the graphene by urea, ball-milling and mixing to prepare a filler, dispersing the filler in silica gel, and intercepting a sample for detection D.
Example 5
The silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance has the following specific components by weight percent of filler concentration controlled: MXene material 3 g; 3g of h-BN material; 1g of graphene; 50g of urea; 28g of silica gel.
And (3) stripping the MXene material, the h-BN material and the graphene by urea, ball-milling and mixing to prepare a filler, dispersing the filler in silica gel, and intercepting a sample to detect E.
Example 6
The silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance has the following specific components by weight percent of filler concentration controlled: MXene material 3 g; 3g of h-BN material; 2g of graphene; 50g of urea; 32g of silica gel.
And (3) stripping the MXene material, the h-BN material and the graphene by urea, ball-milling and mixing to prepare a filler, dispersing the filler in silica gel, and intercepting a sample to detect F.
The in-plane thermal conductivity, the out-of-plane thermal conductivity, and the electromagnetic shielding performance of samples a, B, C, D, E, and F of examples 1 to 6 were measured and compared, respectively, to obtain data as shown in the following table.
Wherein, when the electromagnetic shielding performance of the sample is detected, the X wave band is selected.
Through detection, according to the analysis of the detection results of the sample A, the sample B and the sample C, when the concentration ratio of the filler is increased, the in-plane thermal conductivity coefficient, the out-of-plane thermal conductivity coefficient and the electromagnetic shielding performance of the final material are improved; according to the analysis of the detection results of the sample B and the sample D, when the component ratio of urea is increased, the in-plane thermal conductivity is reduced, and the out-of-plane thermal conductivity and the electromagnetic shielding performance are improved.
According to the invention, the concentration proportion of the filler is controlled to be 20 wt%, and the proportion of the MXene material, the h-BN material and the graphene in the filler is 3:3:2, so that the in-plane thermal conductivity coefficient, the out-of-plane thermal conductivity coefficient and the electromagnetic shielding performance of the obtained silica gel composite material are optimal.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the invention.
Claims (9)
1. The silica gel composite material with high heat conductivity coefficient and excellent electromagnetic shielding performance is characterized by comprising the following components:
1-3g of MXene material;
3-5g of h-BN material;
0.5-1.5g of single-layer graphene powder;
20-50g of urea;
10-45g of silica gel;
the MXene material has the functions of electromagnetic shielding, heat conduction and electric charge conduction; the h-BN material has the functions of insulating, isolating MXene and graphene nanosheets and conducting heat; the graphene has the functions of electromagnetic shielding and heat conduction; the urea molecules are ball milling agents and have the function of modifying the surface of a two-dimensional material;
the MXene material, the h-BN material and the single-layer graphene powder are stripped and mixed by urea molecules under the condition of plasma ball milling to prepare the composite filler, and the composite filler is dispersed in silica gel to obtain the silica gel-based composite material.
2. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in claim 1, wherein: the filler concentration is controlled to be 10 wt%, and the silica gel composite material comprises the following specific components: MXene material 1 g; h-BN material 3 g; 1g of single-layer graphene powder; 25g of urea; 45g of silica gel.
3. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in claim 1, wherein: the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: MXene material 1 g; h-BN material 3 g; 1g of single-layer graphene powder; 25g of urea; 20g of silica gel.
4. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in claim 1, wherein: controlling the proportion of the filler concentration to be 30 wt%, wherein the specific components of the silica gel composite material are as follows: MXene material 1 g; 3g of h-BN material; 1g of single-layer graphene powder; 25g of urea; 12g of silica gel.
5. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in claim 1, wherein: the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: 1g of MXene material; 3g of h-BN material; 1g of single-layer graphene powder; 50g of urea; 20g of silica gel.
6. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in claim 1, wherein: the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: MXene material 3 g; 3g of h-BN material; 1g of single-layer graphene powder; 50g of urea; 28g of silica gel.
7. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in claim 1, wherein: the filler concentration is controlled to be 20 wt%, and the silica gel composite material comprises the following specific components: MXene material 3 g; 3g of h-BN material; 2g of single-layer graphene powder; 50g of urea; 32g of silica gel.
8. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in any one of claims 1 to 7, wherein: and intercepting the composite material as a sample to respectively perform a heat conduction experiment and an electromagnetic shielding performance experiment.
9. The silica gel composite material with high thermal conductivity and excellent electromagnetic shielding performance as claimed in claim 8, wherein: the thickness of the sample is 250-300 um.
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| CN111372435B (en) * | 2020-04-25 | 2022-04-12 | 郑州大学 | MXene-based high-thermal-conductivity fireproof electromagnetic shielding composite film and preparation method thereof |
| CN112194903B (en) * | 2020-09-21 | 2022-07-15 | 深圳市鸿富诚新材料股份有限公司 | Heat-conducting wave-absorbing silica gel composite material and preparation method thereof |
| CN112251153B (en) * | 2020-10-23 | 2022-04-05 | 松山湖材料实验室 | Carbon nanofiber membrane/silica gel composite material and preparation method thereof |
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| CN103571215A (en) * | 2012-07-18 | 2014-02-12 | 天瑞企业股份有限公司 | High thermal conductivity and EMI sheltering high polymer composite material |
| CN112911917A (en) * | 2016-04-22 | 2021-06-04 | 德雷塞尔大学 | Two-dimensional metal carbide, nitride and carbonitride films and composites for EMI shielding |
| KR102028145B1 (en) * | 2017-12-18 | 2019-10-04 | 한국과학기술연구원 | Thermoelectric material comprising mxene and method for manufacturing the same |
| CN108559131B (en) * | 2018-05-11 | 2019-07-12 | 四川大学 | A kind of edge hydroxylating method of modifying of six sides layered nitride boron |
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