CN110996524B - Circuit board production equipment - Google Patents
Circuit board production equipment Download PDFInfo
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- CN110996524B CN110996524B CN201911362948.0A CN201911362948A CN110996524B CN 110996524 B CN110996524 B CN 110996524B CN 201911362948 A CN201911362948 A CN 201911362948A CN 110996524 B CN110996524 B CN 110996524B
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- rear part
- sliding strip
- circuit board
- front part
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/148—Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
A circuit board production device comprises a horizontal feeding track for placing and conveying a substrate, wherein a push rod module for pushing a sliding strip out is assembled at the front part of the feeding track, the push rod module comprises a lead screw horizontally fixed through the front part, the lead screw is coaxially assembled with the sliding strip, a moving screw sleeve in threaded connection is wrapped outside the lead screw, the rear part of the lead screw penetrates through the rear part of the moving screw sleeve, and external teeth are machined on the outer side of the front part of the moving screw sleeve; the outer side of the rear part of the moving wire sleeve is provided with a pressure roller through a connecting rod, the pressure roller is pressed on an acting plate at the rear part of the base plate, and the front part of the acting plate is provided with a circular bulge. When the device works, the ejector rod elastically strikes the sliding strip, so that the sliding strip 12 can not be separated from the printed circuit, the sliding strip 12 can be pushed out towards the rear part, and meanwhile, the stable connection of the printed circuit is guaranteed.
Description
Technical Field
The invention relates to the field of circuit boards, in particular to circuit board production equipment.
Background
The circuit board is also called a circuit board, a printed circuit board, etc., and the circuit board can be called a rigid circuit board or a flexible circuit board due to the selection of different materials of the substrate. The circuit board is printed to copy the circuit corresponding to the electric appliance on the substrate of the circuit board, so that the circuit board has the advantages of high wiring density, light weight, thin thickness and the like, and is convenient for assembling various electric appliance elements, thereby forming the main boards of different electric appliance elements. Traditional circuit board is the straight plate shape usually, and the direct assembly is in the inside of electrical apparatus casing, and the design of straight plate makes the casing volume of electrical apparatus great, and the circuit board of straight plate shape is when carrying out the circuit connection moreover, and space utilization is lower, especially in some circuits are comparatively complicated, the electrical equipment that the circuit board area is great. Although the flexible circuit board can be bent, the material and the natural limitation of the flexible circuit board cannot add a patch or a jack element in the middle of the circuit board, which is industrialized like a rigid circuit board, so the conventional flexible circuit board is usually only used as a connecting part.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a circuit board production process, which can industrially produce foldable circuit boards in batch.
The technical scheme adopted by the invention for solving the technical problem is as follows: a circuit board production process comprises the following production steps:
the base plate comprises more than two veneers which are horizontally arranged side by side, the front edge and the rear edge of each veneer are attached to each other, the lower parts of two adjacent veneer contact positions are respectively connected with a hinged hinge, the upper parts of two adjacent independent veneer edge positions are provided with convex sliding strips, the lower parts of two connected veneer contact positions of the base plate are connected through an adjusting module, the adjusting module comprises more than two fixed blocks from left to right, the two fixed blocks are connected in a limiting mode through a straight rod, and the two adjacent veneers of the base plate are fixed into a plane plate.
And secondly, printing a substrate, namely printing a circuit on the whole plane of the substrate, and punching the positions of element contacts of the printed circuit.
Thirdly, substrate mounting, namely, distributing the substrate, baking the distributed substrate, loading the baked substrate, then carrying out solder paste printing and pre-operation through point fixing glue on the loaded substrate, sending the substrate into a high-speed chip mounter and a general chip mounter in sequence for mounting after detection, then detecting again, carrying out reflow soldering on the qualified substrate and the qualified chip element, detecting and repairing the chip element after reflow soldering, and then sending the qualified substrate into a testing station for circuit testing.
And fourthly, welding the jack elements, performing wave soldering on the plug-in units inserted on the substrate, detecting the substrate subjected to wave soldering, and then performing quality inspection and repair on the detected substrate.
Fifthly, bending the base plate, namely extracting the sliding strips on the upper parts of the two single plates of the base plate, pushing the straight rod to separate the two adjacent fixed blocks, bending the base plate along the contact edges of the two adjacent single plates through a hinged hinge, and fixing the two single plates of the bent base plate; and performing quality inspection and repair on the bent substrate again.
And sixthly, packaging and delivering the bent substrate.
Preferably, a T-shaped groove which penetrates through the adjusting module from left to right is designed in the fixing block of the adjusting module, the section of the straight rod is T-shaped and is assembled in the T-shaped groove of the fixing block, and adjusting teeth which can push the straight rod from left to right are designed at the lower part of the fixing block; an insertion groove perpendicular to the T-shaped groove is designed in the adjusting module left side fixing block, and after the base plate is bent, the front end of the straight rod can be inserted into the insertion groove to fix the bent shape of the base plate.
Preferably, the upper edges of the two single-plate contact positions connected with the substrate are designed to be round-cornered edges.
Preferably, when the sliding strip is placed between two single plates of the substrate, the upper protruding part of the sliding strip is covered with an insulating demolding layer.
A production device for pushing and extracting the sliding bar in the processing step 5 of the circuit board comprises a horizontal feeding track for placing and conveying a substrate, wherein a push rod module for pushing the sliding bar is assembled at the front part of the feeding track, the sliding bar is made of a rigid material due to the requirement of keeping certain hardness, the push rod module comprises a lead screw horizontally fixed through the front part, the lead screw and the sliding bar are coaxially assembled, a moving wire sleeve in threaded connection is wrapped outside the lead screw, the rear part of the lead screw penetrates through the rear part of the moving wire sleeve, external teeth are processed on the outer side of the front part of the moving wire sleeve, and a transmission gear is meshed with the external teeth of the moving wire sleeve and is in transmission connection with a power source; the outer side of the rear part of the moving wire sleeve is provided with a pressure roller through a connecting rod, the pressure roller is tightly pressed on an acting plate at the rear part of the base plate, the outer edge of the acting plate is connected with more than two elastic ropes which are uniformly distributed, the acting plate is pulled forwards by the elastic ropes and is tightly propped against the pressure roller, the front part of the acting plate is provided with a circular bulge, and when the pressure roller rotates along with the moving wire sleeve, the pressure roller passes through the bulge at the front end of the acting plate; a transmission rod is assembled at the rear part of the action plate, a transmission hole is processed at the rear part of the transmission rod, a push rod capable of sliding back and forth is assembled in the transmission hole, the front part of the push rod is connected with the front part of the transmission hole through a spring, and the push rod and the screw rod are coaxially assembled; the upper part of the sliding strip is provided with a press roller with the axis parallel to the sliding strip, the surface of the press roller is coated with an elastic pressing material layer, and the press roller is pressed on the upper part of the substrate; the rear part of the feeding track is provided with paired discharging wheels, the axes of the discharging wheels are in transmission connection with the power module, pressing grooves are machined in the outer rings of the discharging wheels, the outer rings of the discharging wheels are made of elastic materials, the paired discharging wheel pressing grooves are right opposite to the axial positions of the sliding strips, when the sliding strips are ejected out, the front parts of the sliding strips extend into the paired discharging wheel pressing grooves, and the sliding strips are elastically pressed by the two discharging wheel pressing grooves. Thus, when the discharging wheel rotates, the sliding strip is pushed forwards.
Preferably, the rear part of the feeding track is provided with more than two pairs of discharging wheels.
Preferably, more than two pressure rollers which are uniformly distributed relative to the axis of the motion screw sleeve are arranged on the outer side of the rear part of the motion screw sleeve through connecting rods, and bulges with the same number as the pressure rollers are uniformly distributed on the front part of the action plate.
The invention has the beneficial effects that: compared with the traditional processing technology, the production technology of the circuit board has the advantages that the substrate is composed of more than two single boards, the sliding strip with the convex upper surface is assembled at the joint, then the circuit board is directly printed on the whole substrate, the chip mounting processing and the jack processing can be directly carried out on the substrate after the printed circuit board, so that the whole circuit processing process is completed, then the sliding strip is taken away, and therefore the printed circuit position on the upper portion of the sliding strip and the connecting circuit form strip-shaped flexible circuit-like circuit connection which can be bent and convex. At the moment, the straight rod for limiting the adjacent single boards is pulled away, so that the two adjacent single boards can be mutually bent, and then the bent single boards are fixed to form the bent circuit main board. Compared with the traditional small mainboard, the mainboard processed by the processing technology can be used for more complex circuit printing without connecting redundant circuits between two electric boards, so that the overall layout of the circuit is more convenient, and the design of the bent circuit mainboard ensures that the overall size of the circuit mainboard is smaller and the layout is more compact. The processing mode of the processing circuit main board can process the circuit main board to be bent, integrates the advantages of a hard circuit board and a flexible circuit board, can be used for printing and forming a more complex circuit structure at one time, and has higher circuit design stability, lower assembly cost and higher production speed of electrical appliances compared with the traditional circuit connection between different circuits.
Drawings
FIG. 1 is a schematic view of a substrate according to the present invention.
Fig. 2 is a front view of the substrate in a flat state.
Fig. 3 is a front view of the substrate in a bent state.
Fig. 4 is an assembly flow diagram of the substrate patch and jack component soldering.
Fig. 5 is a schematic sectional view taken along the line a-a in fig. 2.
Fig. 6 is a schematic view of the top view of the slide bar pushing and extracting production apparatus in preparation for operation.
Fig. 7 is a schematic structural view in a top view of the production equipment for pushing and extracting the slide bar.
Fig. 8 is a schematic structural diagram of the B-direction putter module of fig. 7.
Fig. 9 is a schematic view of the structure in the direction C-C in fig. 7.
Detailed Description
The invention is further illustrated with reference to the following figures and examples:
the production process of the circuit board is mainly used for industrially producing the circuit board needing to be bent in the circuit board, and comprises the following production steps:
firstly, pre-treating a substrate 1; the structure of the base plate is shown in fig. 1 and fig. 2, compared with the base plate of the traditional circuit board, the base plate 1 comprises more than two single plates which are horizontally arranged in parallel, the front edge and the rear edge of each single plate are attached to each other, the lower parts of the contact positions of the two adjacent single plates are respectively connected with a hinged hinge 11, and the maximum rotation angle of the hinged hinge 11 is a right angle, as shown in fig. 3. In the substrate 1, the upper parts of the edge positions of two adjacent independent single plates are designed with a convex sliding strip 12, the lower parts of the contact positions of the two connected single plates of the substrate 1 are connected through an adjusting module 2, the adjusting module 2 comprises more than two fixed blocks 21 from left to right, the two connected fixed blocks 21 are in limit connection through a straight rod 22, and the two adjacent single plates of the substrate 1 are fixed into a plane plate.
Secondly, printing the substrate 1; a printed circuit is formed on the entire surface of the substrate 1, and the positions of the element contacts of the printed circuit are punched. The process is the same as the conventional circuit board processing method, and can be directly processed by using conventional processing equipment and methods, which are not described in detail herein.
Thirdly, substrate surface mounting; as shown in fig. 4, the substrate 1 is fed from a feeding device at the front part, the substrate 1 after feeding is baked, the substrate 1 after baking is fed, then solder paste printing and pre-operation is performed on the substrate 1 after feeding by using a spot fixing adhesive, the substrate 1 is sequentially fed into a high-speed chip mounter and a general chip mounter after passing detection to respectively mount different circuit elements, then detection is performed again, reflow soldering is performed on the substrate 1 and the chip elements which are qualified in detection, the chip elements after reflow soldering are detected and repaired, then the substrate 1 after qualified mounting is fed into a testing station to perform circuit testing, and the next process operation is convenient. In this embodiment, the detection mainly adopts comparison and visual inspection, and in the specific implementation process, other detection modes can be performed according to needs.
Fourthly, welding the jack elements; as shown in fig. 4, the interposer inserted on the substrate 1 is wave-soldered, the substrate 1 after wave-soldering is inspected, and then the inspected substrate 1 is subjected to quality inspection and repair; the substrate 1 of which the quality is satisfied is directly sent to the next step for operation, and the repair operation is performed for the substrate 1 product which does not satisfy the requirement, and the quality inspection operation is performed again after the repair is completed.
Fifthly, bending the substrate 1; the sliding strips 12 on the upper parts of the two single boards of the substrate 1 are extracted, the straight rod 22 is pushed to separate the two adjacent fixed blocks 21, the substrate 1 is bent along the contact edges of the two adjacent single boards through the hinged hinges 11, and the two single boards 1 of the substrate 1 after being bent are fixed; the quality inspection and repair are performed again on the substrate 1 after the bending.
And sixthly, packaging and delivering the bent substrate.
Compared with the traditional processing technology, the circuit board production technology has the advantages that the substrate 1 is composed of more than two single boards, the sliding strips 12 with the convex upper surfaces are assembled at the joints, then the circuit board is directly printed on the whole substrate 1, and the chip mounting processing and the jack processing can be directly carried out on the substrate 1 after the printed circuit board is printed, so that the whole circuit processing process is completed. The slider 12 is then withdrawn so that the printed circuit on the upper portion of the slider 12 is positioned to connect the circuits to form a flexible circuit-like circuit connection in the form of a strip of bendable tabs. At this time, the straight rod 22 for limiting the adjacent single boards is pulled away, so that the two adjacent single boards can be mutually bent, and then the bent single boards are fixed to form the bent circuit main board. Compared with the traditional small mainboard, the mainboard processed by the processing technology can be used for more complex circuit printing without connecting redundant circuits between two electric boards, so that the overall layout of the circuit is more convenient, and the design of the bent circuit mainboard ensures that the overall size of the circuit mainboard is smaller and the layout is more compact. The processing mode of the processing circuit main board can process the circuit main board to be bent, integrates the advantages of a hard circuit board and a flexible circuit board, can be used for printing and forming a more complex circuit structure at one time, and has higher circuit design stability, lower assembly cost and higher production speed of electrical appliances compared with the traditional circuit connection between different circuits.
In the specific design, as shown in fig. 1, 2 and 3, a T-shaped groove 23 penetrating through the fixing block 21 of the adjusting module 2 from left to right is designed in the fixing block 21, the cross section of the straight rod 22 is T-shaped and is assembled in the T-shaped groove 23 of the fixing block 21, an adjusting tooth 24 capable of pushing the straight rod 22 from left to right is designed at the lower part of the fixing block 21, in this embodiment, the adjusting tooth 24 extends out of a lower opening of the T-shaped groove 23, and the adjusting tooth 24 is assembled at the rear part of the straight rod 22; the adjustment teeth 24 may be designed to manually push the straight bar 22 to the left or right, or may be designed to cooperate with a gear structure for electrically moving the straight bar 22 forward or backward, for example, the adjustment teeth 24 may be operated by mounting an action gear at the lower part of the transportation base plate rail. An insertion groove 25 perpendicular to the T-shaped groove 23 is designed in the fixing block 21 on the left side of the adjusting module 2, and after the substrate is bent, the front end of the straight rod 22 can be inserted into the insertion groove 25 to fix the bent shape of the substrate 1. This adjusting module 2's design not only can make base plate 1 carry out holistic paster and jack welding on the production line, and two veneers at base plate 1 are buckled the back and are cooperated with articulated hinge 11 and lock the base plate at the shape of buckling simultaneously. The adjusting module 2 is suitable for industrial processing, and meanwhile, the processed bent circuit board can be straightened again, so that the circuit board produced by the process is wider in application range.
In the specific design, as shown in fig. 2 and 3, the upper edge of the contact position of the two single boards connected to the substrate 1 is designed as a fillet edge. Thus, after the two single plates of the substrate 1 are bent, the printed board on the upper part of the substrate is smoothly contacted with the corner position of the substrate when the printed board is bent, and the printed board can be protected. In a specific design, when the sliding bar 12 is placed between two single plates of the substrate 1, the upper protruding part of the sliding bar 12 is covered with an insulating release layer 13. The demoulding layer 13 with the sliding strip 12 is in a separated state, can relatively slide in the front and back direction, and after the printed circuit board on the upper portion of the substrate 1, the printed circuit is combined with the demoulding layer 13, so that the printed circuit layer is not tightly adhered to the upper portion of the sliding strip 12, the printed circuit layer is easy to strip, the next step of extraction of the sliding strip 12 is facilitated, meanwhile, the demoulding layer 13 can play a role in insulation and water resistance, oxidation and corrosion of the printed circuit can be effectively prevented, the using effect is better, meanwhile, the demoulding layer 13 can enable the printed circuit to be higher in bending part strength and not easy to break, and the circuit is more stable in use.
In the production process, the sliding strip 12 needs to be extracted, the traditional circuit board production equipment cannot complete the operation, and the patent discloses the production equipment for pushing out and extracting the sliding strip in the fifth step of the circuit board processing process in the right 1. As shown in fig. 6, 7, 8 and 9, the production apparatus includes a horizontal feeding rail 3 for placing and conveying the substrate 1, the substrate 1 is placed on an upper portion of the feeding rail 3, and a push rod module 4 for pushing out the slide bar 12 is mounted on a front portion of the feeding rail 3. The slide bar 12 is made of a rigid material because a certain hardness needs to be maintained. The push rod module 4 comprises a screw rod 41 horizontally fixed through the front part, the screw rod 41 and the sliding bar 12 are coaxially assembled, a moving screw sleeve 42 in threaded connection is wrapped outside the screw rod 41, the rear part of the screw rod 41 penetrates through the rear part of the moving screw sleeve 42, external teeth are machined on the outer side of the front part of the moving screw sleeve 42, a transmission gear 43 is meshed on the external teeth of the moving screw sleeve 42, and the transmission gear 43 is in transmission connection with a power source.
A pressure roller 44 is installed on the outer side of the rear part of the movement wire sleeve 42 through a connecting rod, the pressure roller 44 is pressed on an acting plate 45 at the rear part of the base plate 1, the outer edge of the acting plate 45 is connected with more than two elastic ropes 46 which are uniformly distributed, the acting plate 45 is pulled forwards and tightly pressed on the pressure roller 44 by the elastic ropes 46, a circular bulge 451 is processed at the front part of the acting plate 45, and when the pressure roller 44 rotates along with the movement wire sleeve 42, the pressure roller 44 passes through the bulge 451 at the front end of the acting plate 45; a transmission rod 47 is arranged at the rear part of the acting plate 45, a transmission hole is formed at the rear part of the transmission rod 47, a push rod 48 capable of sliding back and forth is arranged in the transmission hole, the front part of the push rod 48 is connected with the front part of the transmission hole through a spring 49, and the push rod 48 is coaxially assembled with the screw rod 41; a press roller 5 with an axis parallel to the sliding strip 12 is assembled on the upper part of the sliding strip 12, the press roller 5 can rotate around a shaft, an elastic pressing material layer is wrapped on the surface of the press roller 5, and the press roller 5 is elastically pressed on the upper part of the substrate 1 through the pressing material layer; when the substrate 1 moves horizontally on the feeding track 3, the pressing roller 5 rotates synchronously, while the lower part of the pressing roller 5 keeps pressing the printed circuit on the upper part of the substrate 1, and when the sliding strip 12 part of the substrate 1 moves to the lower part of the pressing roller 5, as shown in fig. 9, the pressing layer of the pressing roller 5 presses the printed circuit at the substrate bending position and the sliding strip 12 elastically.
The rear part of the feeding track 3 is provided with paired discharging wheels 6, the axes of the discharging wheels 6 are in transmission connection with a power module, pressing grooves 61 are machined on the outer rings of the discharging wheels 6, the outer rings of the discharging wheels 6 are made of elastic materials, the pressing grooves 61 of the paired discharging wheels 6 are over against the axial position of the sliding strip 12, when the sliding strip 12 is ejected, the front part of the sliding strip 12 extends into the pressing grooves 61 of the paired discharging wheels 6, and the pressing grooves 61 of the two discharging wheels 6 elastically press the sliding strip 12. This pushes the slide bar 12 forward during the rotational movement of the outlet wheel 6.
When the production equipment for pushing out and extracting the sliding strip is used, the substrate 1 and the sliding strip 12 are fixed through the compression roller 5, at this time, the sliding strip 12 is over against the ejector rod 48, before the sliding strip 12 is pushed out, as shown in fig. 7, the ejector rod 48 is positioned in front of the sliding strip 12, when the transmission gear 43 rotates, the moving wire sleeve 42 is driven to rotate, and due to the limiting of the screw rod 41, the moving wire sleeve 42 moves backwards. While the pressure roller 44 at the rear of the moving wire package 42 follows. Since the pressure roller 44 continuously passes through the protrusion 451 at the front end of the acting plate 45 during the rotation process, the pressure roller 44 makes the acting plate jump back and forth while pushing the acting plate 45 to move backward as a whole. This drives the ejector pin 48 to knock the slide bar 12, and due to the action of the spring 49, the knocking of the ejector pin 48 on the slide bar 12 is elastic knocking, which not only makes the slide bar 12 detachable from the printed circuit, but also pushes the slide bar 12 out toward the rear. In addition, the printed circuit is ensured to be stably connected in the process of separating from the sliding strip 12 due to the elastic compression of the pressing material layer outside the pressing roller 5 on the printed circuit. The sliding strip 12 knocked out of the substrate 1 backwards enters the pressing grooves 61 symmetrically arranged on the discharging wheels 6, as shown in fig. 8, at this time, the discharging wheels 6 designed at the rear part of the feeding track 3 synchronously rotate, and the sliding strip is extracted backwards through the pressing grooves 61 symmetrically arranged on the feeding track until the sliding strip is completely extracted, so that the whole extraction process is completed. The discharging wheel 6 is designed for the sliding strip 12 extraction structure, so that the equipment can extract the sliding strip 12 from the wide substrate 1, and the process is wider in suitable range.
In a specific design, as shown in fig. 7 and 8, the rear part of the feeding track 3 is provided with more than two pairs of discharging wheels 6. This provides a better extraction of the slide bar 12. The movement of the slide bar 12 is more stable during the process of being withdrawn. More than two pressure rollers 44 which are uniformly distributed relative to the axis of the movement wire sleeve 42 are arranged on the outer side of the rear part of the movement wire sleeve 42 through connecting rods, and bulges 451 with the same number as the pressure rollers 44 are uniformly distributed on the front part of the acting plate 45. In this embodiment, the number of the rollers 44 and the protrusions 451 is two, so that when the moving wire sleeve 42 drives the pressure roller 44 to rotate, the stress is more balanced, and at the same time, each time the moving wire sleeve 42 rotates for one circle, the acting plate 45 and the ejector rod 48 can be driven to vibrate twice, so that the ejection vibration frequency of the ejector rod 48 is higher, and the ejection effect is better. The outside cover of transfer line 47 has solid fixed ring 7, gu fixed ring 7 is relative pay-off track 3 fixed assembly, transfer line 47 is relative gu fixed ring 7 assembly that slides from beginning to end. The fixing ring 7 can limit and guide the transmission rod 47 and the whole action plate 45, so that the pushing accuracy of the ejector rod 48 is ensured.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, but rather as the subject matter of the invention is to be construed in all aspects and as broadly as possible, and all changes, equivalents and modifications that fall within the true spirit and scope of the invention are therefore intended to be embraced therein.
Claims (4)
1. A circuit board production device comprises a horizontal feeding track (3) used for placing a substrate (1) for conveying and processing a circuit board, wherein the substrate (1) comprises more than two single boards which are horizontally arranged in parallel, the front edge and the rear edge of each single board are attached, the lower parts of the contact positions of the two adjacent single boards are respectively connected with a hinged hinge (11), and the upper parts of the edge positions of the two adjacent independent single boards are provided with convex sliding strips (12); the method is characterized in that: the front part of the feeding track (3) is provided with a push rod module (4) for pushing the sliding bar (12) out, the push rod module (4) comprises a lead screw (41) which is horizontally fixed through the front part, the lead screw (41) is coaxially assembled with the sliding bar (12), the outside of the lead screw (41) is wrapped with a moving screw sleeve (42) in threaded connection, the rear part of the lead screw (41) penetrates through the rear part of the moving screw sleeve (42), the outer side of the front part of the moving screw sleeve (42) is provided with outer teeth, the outer teeth of the moving screw sleeve (42) are meshed with a transmission gear (43), and the transmission gear (43) is in transmission connection with a power source; a pressure roller (44) is mounted on the outer side of the rear part of the moving wire sleeve (42) through a connecting rod, the pressure roller (44) is pressed on an acting plate (45) at the rear part of the base plate, more than two elastic ropes (46) which are uniformly distributed are connected to the outer edge of the acting plate (45), the acting plate (45) is pulled forwards and tightly pressed on the pressure roller (44) through the elastic ropes (46), a circular bulge (451) is processed at the front part of the acting plate (45), and when the pressure roller (44) rotates along with the moving wire sleeve (42), the pressure roller (44) passes through the bulge (451) at the front end of the acting plate (45); a transmission rod (47) is assembled at the rear part of the acting plate (45), a transmission hole is processed at the rear part of the transmission rod (47), a push rod (48) capable of sliding back and forth is assembled in the transmission hole, the front part of the push rod (48) is connected with the front part of the transmission hole through a spring (49), and the push rod (48) and the screw rod (41) are coaxially assembled; the upper part of the sliding strip (12) is provided with a press roller (5) with the axis parallel to the sliding strip (12), the press roller (5) can rotate around the axis, the surface of the press roller (5) is wrapped with an elastic pressing material layer, and the press roller (5) is elastically pressed on the upper part of the substrate through the pressing material layer; the rear portion of the feeding track (3) is provided with paired discharging wheels (6), the axes of the discharging wheels (6) are in transmission connection with a power module, pressing grooves (61) are machined in the outer rings of the discharging wheels (6), the outer rings of the discharging wheels (6) are made of elastic materials, the pressing grooves (61) of the paired discharging wheels (6) are opposite to the axial position of the sliding strip (12), when the sliding strip (12) is ejected, the front portion of the sliding strip (12) extends into the pressing grooves (61) of the paired discharging wheels (6), and the pressing grooves (61) of the two discharging wheels (6) elastically press the sliding strip (12).
2. The circuit board production apparatus according to claim 1, wherein: the rear part of the feeding track (3) is provided with more than two pairs of discharging wheels (6).
3. A circuit board production apparatus according to claim 2, wherein: more than two pressure rollers (44) which are uniformly distributed relative to the axis of the movement wire sleeve (42) are arranged on the outer side of the rear part of the movement wire sleeve (42) through connecting rods, and bulges (451) with the same number as the pressure rollers (44) are uniformly distributed on the front part of the action plate (45).
4. The circuit board production apparatus according to claim 1, wherein: the outside cover of transfer line (47) has solid fixed ring (7), gu fixed ring (7) is relative pay-off track (3) fixed assembly, transfer line (47) are relative gu fixed ring (7) sliding assembly around.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201911362948.0A CN110996524B (en) | 2019-08-14 | 2019-08-14 | Circuit board production equipment |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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CN201911362948.0A CN110996524B (en) | 2019-08-14 | 2019-08-14 | Circuit board production equipment |
CN201910746600.5A CN110337181B (en) | 2019-08-14 | 2019-08-14 | Circuit board production process |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910746600.5A Division CN110337181B (en) | 2019-08-14 | 2019-08-14 | Circuit board production process |
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