CN110996230B - Speaker module and electronic equipment - Google Patents
Speaker module and electronic equipment Download PDFInfo
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- CN110996230B CN110996230B CN201911343385.0A CN201911343385A CN110996230B CN 110996230 B CN110996230 B CN 110996230B CN 201911343385 A CN201911343385 A CN 201911343385A CN 110996230 B CN110996230 B CN 110996230B
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/06—Loudspeakers
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04R—LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
- H04R9/00—Transducers of moving-coil, moving-strip, or moving-wire type
- H04R9/02—Details
Abstract
The invention discloses a loudspeaker module and electronic equipment, wherein the loudspeaker module comprises a module shell, a loudspeaker single body and a heat dissipation piece, and the module shell is provided with an accommodating cavity. The loudspeaker monomer is arranged in the accommodating cavity, the accommodating cavity is divided into a front sound cavity and a rear sound cavity, the loudspeaker monomer comprises a monomer shell and a magnetic circuit system arranged on the monomer shell, the monomer shell comprises a heat conducting part, and the heat conducting part is connected with the magnetic circuit system. The heat dissipation piece comprises a heat dissipation plate and a heat conduction plate connected to the heat dissipation plate, the heat dissipation plate is arranged on the outer surface of the module shell, and the heat conduction plate penetrates into the module shell and is in heat conduction connection with the heat conduction part. The technical scheme of the invention can improve the heat dissipation capability of the loudspeaker module.
Description
Technical Field
The present invention relates to the field of acoustic energy conversion technologies, and in particular, to a speaker module and an electronic device.
Background
The speaker module is portable electronic equipment's important acoustics device, a conversion between completion signal of telecommunication and the acoustic signal, for realize better ground sound playback effect under less cavity space, what adopt at present is Smart PA (intelligent power amplifier) and tuning algorithm, but at Smart PA application process, the speaker module can work for a long time under the high power condition, can increase the heat that the speaker module produced, present speaker module mainly dispels the heat through the play sound hole on the casing, the radiating effect is poor, the unable effective conduction of high temperature in the speaker module distributes away, speaker module voice coil burns the ring risk great.
Disclosure of Invention
The invention mainly aims to provide a loudspeaker module, aiming at improving the heat dissipation capability of the loudspeaker module.
In order to achieve the above object, the present invention provides a speaker module, including:
a module housing having a receiving cavity;
the loudspeaker single body is arranged in the accommodating cavity and divides the accommodating cavity into a front sound cavity and a rear sound cavity, the loudspeaker single body comprises a single body shell and a magnetic circuit system arranged on the single body shell, the single body shell comprises a heat conducting part, and the heat conducting part is connected with the magnetic circuit system; and the number of the first and second groups,
the heat dissipation piece comprises a heat dissipation plate and a heat conduction plate connected to the heat dissipation plate, the heat dissipation plate is arranged on the outer surface of the module shell, and the heat conduction plate penetrates into the module shell and is in heat conduction connection with the heat conduction part.
Optionally, the front acoustic cavity has a heat dissipation opening, the vibration system of the speaker unit is opposite to the heat dissipation opening, and the heat dissipation plate covers the heat dissipation opening.
Optionally, the heat dissipation plate and the module housing are molded as a whole; or, the heat dissipation plate is adhered to the module housing.
Optionally, the module housing has a side wall, and the side wall is formed with a sound outlet hole communicated with the front sound cavity; the heat dissipation plate is provided with a first lateral edge facing the side wall, two second lateral edges connected with the first lateral edge, and a third lateral edge opposite to the first lateral edge, and at least one of the third lateral edge and the two second lateral edges is provided with the heat conduction plate.
Optionally, a heat conducting medium is filled between the heat conducting portion and the heat conducting plate.
Optionally, the heat dissipation plate is integrally formed with the heat conductive plate.
Optionally, the magnetic circuit system comprises a magnetic yoke, an edge magnet arranged on the magnetic yoke, and an edge magnetic conductive plate arranged on the upper end of the edge magnet; the heat conduction part is annular, the vibration system of the loudspeaker monomer is connected to one end of the heat conduction part, and the edge magnetic conduction plate is connected to the other end of the heat conduction part and integrally formed with the heat conduction part.
Optionally, the magnetic circuit system comprises a magnetic yoke, an edge magnet arranged on the magnetic yoke, and an edge magnetic conductive plate arranged on the upper end of the edge magnet; the heat conducting plate extends towards the direction of the magnetic yoke, and is at least connected with the outer peripheral surface of one of the magnetic yoke, the side magnet and the side magnetic conductive plate in a heat conduction mode.
Optionally, a flexible deformation portion is arranged on a module shell corresponding to the rear acoustic cavity, the speaker module further includes an electronic device housing, a sealed cavity is formed between the electronic device housing and the module shell, and the electronic device housing isolates sound generated by the flexible deformation portion from sound transmitted by the speaker monomer through the front acoustic cavity; the module shell is provided with a communication port communicated with the closed cavity, and the communication port is opposite to the flexible deformation part; the loudspeaker module is characterized by further comprising a heat dissipation cover plate located at the communication port, and the heat dissipation cover plate is provided with a heat dissipation through hole.
The invention further provides electronic equipment which comprises the loudspeaker module, wherein the loudspeaker module comprises a module shell, a loudspeaker single body and a heat dissipation piece, and the module shell is provided with an accommodating cavity. The loudspeaker monomer is arranged in the accommodating cavity, the accommodating cavity is divided into a front sound cavity and a rear sound cavity, the loudspeaker monomer comprises a monomer shell and a magnetic circuit system arranged on the monomer shell, the monomer shell comprises a heat conducting part, and the heat conducting part is connected with the magnetic circuit system. The heat dissipation piece comprises a heat dissipation plate and a heat conduction plate connected to the heat dissipation plate, the heat dissipation plate is arranged on the outer surface of the module shell, and the heat conduction plate penetrates into the module shell and is in heat conduction connection with the heat conduction part.
According to the technical scheme, the single shell of the loudspeaker monomer is provided with the heat conducting part, the heat conducting part is connected with the magnetic circuit system, so that heat in the magnetic circuit system can be conducted to the heat conducting part, the module shell is provided with the heat radiating plate and the heat conducting plate, the heat radiating plate is arranged on the outer surface of the module shell, one end of the heat conducting plate is connected with the heat radiating plate, and the other end of the heat conducting plate penetrates into the module shell and is in heat conduction connection with the heat conducting part. So that the heat in the magnetic circuit system can be conducted to the heat dissipation plate from the heat conduction part and the heat conduction plate in sequence and then radiated out from the surface of the heat dissipation plate exposed outside. Compare in the radiating mode through going out the sound hole, carry out the heat conduction through setting up heat conduction portion and heat-conducting plate in this scheme, the rethread heating panel carries out the heat dissipation, and the heat conduction effect of heat conduction portion and heat-conducting plate is better, can dispel the heat with magnetic circuit's heat conduction to the heating panel effectively, can reduce 5 ℃ with the temperature in the speaker monomer at least, has improved the heat-sinking capability of speaker module. The temperature protection mechanism of Smart PA (Intelligent Power Amplifier) caused by overhigh temperature in the loudspeaker unit can be effectively reduced, so that the input voltage is reduced by being triggered, the possibility of poor replay tone quality is caused, and the risk of voice coil burning of the loudspeaker unit can be reduced. And when through the heating panel heat dissipation, partial heat also can radiate away through going out the sound hole, can be equivalent to through going out the sound hole and carrying out radiating basis on, can further dispel the heat through the heating panel, the heat-sinking capability of speaker is stronger.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a speaker module according to an embodiment of the present invention;
FIG. 2 is a schematic view of a cut-away view in the direction X-X in FIG. 1;
FIG. 3 is an enlarged view taken at A in FIG. 2;
FIG. 4 is a schematic view of a cut-away view in the direction Y-Y of FIG. 1;
FIG. 5 is an enlarged view at B in FIG. 4;
FIG. 6 is a schematic structural diagram of a speaker unit in the speaker module according to the present invention;
fig. 7 is an enlarged view at C in fig. 4.
The reference numbers illustrate:
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides a loudspeaker module which can be used for electronic equipment capable of producing sound, such as earphones, mobile phones and the like.
In an embodiment of the present invention, referring to fig. 1 to 5, the speaker module includes a module housing 10, a speaker unit 20, and a heat sink 50, wherein the module housing 10 has a receiving cavity 11. The speaker unit 20 is disposed in the accommodating cavity 11, and the accommodating cavity 11 is partitioned into a front acoustic cavity 111 and a rear acoustic cavity 112, the speaker unit 20 includes a unit housing 21, and a magnetic circuit 22 and a vibration system 23 disposed in the unit housing 21, the unit housing 21 includes a heat conduction portion 211, and the heat conduction portion 211 is connected to the magnetic circuit 22. The heat sink 50 includes a heat sink 51 and a heat conductive plate 52 connected to the heat sink 51, the heat sink 51 is disposed on the outer surface of the module case 10, and the heat conductive plate 52 penetrates the module case 10 and is thermally conductively connected to the heat conductive portion 211.
In this embodiment, the vibration system 23 includes a diaphragm 231 and a voice coil 232 fixed to one side of the diaphragm 231. Magnetic circuit 22 includes a yoke 221, and inner and outer magnetic circuit portions are provided on yoke 221 with a magnetic gap therebetween to accommodate voice coil 232. In one case, the inner magnetic path portion includes a center magnet 224 disposed at a central position of the yoke 221 and a center magnetic conductive plate disposed on the center magnet 224, and the outer magnetic path portion includes an edge magnet 223 disposed at an edge position of the yoke 221 and an edge magnetic conductive plate 222 disposed on the edge magnet 223.
The heat dissipation plates 51 are exposed on the outer surface of the module housing 10, and the number of the heat dissipation plates 51 may be one or more, for example, in an embodiment, the number of the heat dissipation plates 51 may be two, and the two heat dissipation plates 51 are respectively disposed at positions corresponding to the front acoustic cavity 111 and the rear acoustic cavity 112. When the heat in the accommodating chamber 11 is conducted to the heat dissipating plate 51 through the heat conductive plate 52, the heat can be radiated from the surface of the heat dissipating plate 51 exposed to the outside, and a heat dissipating effect can be obtained. The material of the heat conducting portion 211 may be metal, heat conducting plastic or composite heat conducting material. The heat conducting plate 52 is in heat-conducting connection with the heat conducting portion 211 to conduct the heat of the heat conducting portion 211 to the heat conducting plate 52, and the specific manner includes, but is not limited to, directly abutting the heat conducting plate 52 with the heat conducting portion 211, or disposing the heat conducting medium 60 between the heat conducting plate 52 and the heat conducting portion 211, and the like.
According to the technical scheme, the heat conducting part 211 is arranged on the single body shell 21 of the loudspeaker single body 20, the heat conducting part 211 is connected with the magnetic circuit system 22, so that heat in the magnetic circuit system 22 can be conducted to the heat conducting part 211, the module shell 10 is further provided with the heat radiating plate 51 and the heat conducting plate 52, the heat radiating plate 51 is arranged on the outer surface of the module shell 10, one end of the heat conducting plate 52 is connected with the heat radiating plate 51, and the other end of the heat conducting plate 52 penetrates into the module shell 10 and is in heat conduction connection with the heat conducting part 211. So that the heat in the magnetic circuit system 22 can be conducted to the heat dissipation plate 51 from the heat conduction portion 211 and the heat conduction plate 52 in sequence, and then radiated from the surface of the heat dissipation plate 51 exposed to the outside. Compared with the mode of radiating through the sound outlet hole 12, the heat conduction part 211 and the heat conduction plate 52 are arranged to conduct heat in the scheme, and then the radiating plate 51 conducts heat, so that the heat conduction effect of the heat conduction part 211 and the heat conduction plate 52 is better, the heat of the magnetic circuit system 22 can be effectively conducted to the radiating plate 51 to be radiated, the temperature in the loudspeaker single body 20 can be reduced by 5 ℃, and the heat radiating capacity of the loudspeaker module is improved. The possibility that the temperature in the speaker unit 20 is too high to trigger a Smart PA (intelligent power amplifier) temperature protection mechanism to reduce the input voltage, thereby resulting in poor reproduction sound quality, and the risk of burning the voice coil 232 of the speaker unit 20 can be effectively reduced. In addition, when the heat is dissipated through the heat dissipating plate 51, part of the heat can also be radiated out through the sound outlet 12, which is equivalent to further dissipating the heat through the heat dissipating plate 51 on the basis of dissipating the heat through the sound outlet 12, and the heat dissipating capability of the speaker module is stronger.
For example, in one embodiment, the front acoustic cavity 111 has a heat dissipation opening, the vibration system 23 of the speaker unit 20 is opposite to the heat dissipation opening, and the heat dissipation plate 51 covers the heat dissipation opening. Specifically, the heat dissipation opening is disposed on the wall of the cavity opposite to the diaphragm 231, so that the heat dissipation plate 51 can directly contact with heat in the front acoustic cavity 111, so that the heat in the front acoustic cavity 111 can be conducted and radiated out through the heat dissipation plate 51, and the heat dissipation effect of the speaker module can be further improved. In addition, in the present embodiment, the heat dissipation plate 51 is made of metal, so that the strength of the heat dissipation plate 51 is high, and the thickness of the heat dissipation plate 51 can be set to be thin, so that the space of the front acoustic cavity 111 can be increased, or the thickness of the speaker module can be reduced. Of course, in other embodiments, the heat dissipation plate 51 may be directly attached to the outer surface of the module case 10 without providing the heat dissipation opening, and in this embodiment, the material of the heat dissipation plate 51 may be graphite, silicon, or the like. In addition, a heat dissipation opening may be provided in the rear acoustic cavity 112, and the magnetic circuit system 22 faces the heat dissipation opening, or heat dissipation openings are provided in the front acoustic cavity 111 and the rear acoustic cavity 112, each heat dissipation opening is provided with a heat dissipation plate 51, and at least one heat dissipation plate 51 is connected to the magnetic circuit system 22 through a heat conduction plate 52 in a heat conduction manner.
In one embodiment, the heat spreader plate 51 is integrally formed with the heat conductive plate 52. Particularly, heating panel 51 and heat-conducting plate 52 are the metalwork, through with heating panel 51 and heat-conducting plate 52 integrated into one piece, can make heating panel 51 and heat-conducting plate 52 be connected inseparabler, avoided having the clearance between heating panel 51 and the heat-conducting plate 52 and lead to the poor condition of heat conduction effect to take place, the heat conduction radiating effect is better, the follow-up assembly process of heating panel 51 and heat-conducting plate 52 on the limit also can be removed from, the installation procedure of the speaker module of having simplified, be favorable to improving production efficiency. Of course, in other embodiments, the heat dissipating plate 51 may be welded to the heat conductive plate 52, or bonded by heat conductive glue, etc.
The connected mode of radiating piece 50 and module shell 10 has the multiple, for example, in one embodiment, radiating piece 50 moulds plastics as an organic wholely with module shell 10, be about to heating panel 51 and heat-conducting plate 52 as inserts and the integrative injection moulding of module shell 10, heating panel 51 inlays the surface of locating module shell 10, heat-conducting plate 52 inlays and locates in module shell 10, so make heating panel 51 be connected more firmly with module shell 10, high stability, can also improve the structural strength of module shell 10, and the subsequent assembly process of heating panel 51 and module shell 10 has still been removed from, the installation process of the speaker module of having simplified, be favorable to improving production efficiency. In addition, in other embodiments, the heat sink 51 is adhered to the module case 10.
In one embodiment, the module housing 10 has a sidewall formed with a sound outlet hole 12 communicating with the front sound chamber 111, the heat dissipation plate 51 has a first side edge 511 facing the sidewall, two second side edges 512 connected to the first side edge 511, and a third side edge 513 opposite to the first side edge 511, and at least one of the third side edge 513 and the two second side edges 512 is provided with a heat conductive plate 52. Specifically, the heat dissipating plate 51 has a rectangular plate shape, two second side edges 512 are opposite to each other, a first side edge 511 is opposite to a third side edge 513, the first side edge 511 is close to a side wall provided with the sound outlet 12, and the first side edge 511 is provided at a position corresponding to the sound outlet 12. Two second lateral margins 512 and third lateral margin 513 are equallyd divide and are equipped with heat-conducting plate 52 respectively, and the quantity that is equivalent to heat-conducting plate 52 is a plurality of for a plurality of positions that a plurality of heating panels 51 can contact magnetic circuit 22 carry out the heat conduction, can further improve magnetic circuit 22's heat-conduction effect, and then can improve speaker module's heat-sinking capability. The adjacent heat dissipation plates 51 may be spaced apart from each other or may be connected to each other. In addition, in other embodiments, a heat-conducting plate 52 may be connected to only one of the second side edges 512. Or a heat-conducting plate 52 is attached only to the third edge 513. Or the two second side edges 512 are respectively provided with the heat conducting plates 52. Or one of the second side edges 512 is connected with a heat-conducting plate 52, and the third side edge 513 is connected with a heat-conducting plate 52, and so on.
In one embodiment, the heat conducting medium 60 is filled between the heat conducting portion 211 and the heat conducting plate 52. Specifically, the heat conducting medium 60 may be a heat conducting glue, a heat conducting silica gel, a heat conducting silicone grease, a soft silica gel heat conducting pad, or the like. It can be understood that, when the heat conducting portion 211 is directly abutted to the heat conducting plate 52 for heat conduction, a gap is easily formed between the heat conducting portion 211 and the heat conducting plate 52, so that the heat transfer effect between the heat conducting portion 211 and the heat conducting plate 52 can be reduced, and when the heat conducting medium 60 is filled between the heat conducting portion 211 and the heat conducting plate 52, the heat conducting medium 60 can be filled in the gap between the heat conducting portion 211 and the heat conducting plate 52, and the heat conducting medium 60 has better heat conducting performance, so that the heat conducting effect between the heat conducting portion 211 and the heat conducting plate 52 can be improved. In addition, in this embodiment, the heat conducting medium 60 is heat conducting glue, and the heat conducting portion 211 and the heat conducting plate 52 are bonded together by the heat conducting glue, so that the heat conducting portion 211 and the heat conducting plate 52 can be connected more firmly under the condition that the heat conducting effect is ensured, and the risk of separation of the heat conducting portion 211 and the heat conducting plate 52 is reduced.
In one embodiment, the heat conducting portion 211 is annular, the vibration system 23 of the speaker unit 20 is connected to one end of the heat conducting portion 211, and the edge magnetic plate 222 is connected to the other end of the heat conducting portion 211 and is integrally formed with the heat conducting portion 211. Specifically, the heat conducting portion 211 is made of the same material as the side magnetic plate 222, and is made of a magnetic conductive metal. The heat conducting portion 211 and the edge magnetic plate 222 may be integrally formed by drawing or bending through a stamping die, the edge magnetic plate 222 may be formed by thinning the middle portion of the annular magnetic metal plate, the non-thinned portion of the periphery of the annular metal plate serves as the heat conducting portion 211, and the heat conducting portion 211 and the edge magnetic plate 222 may be formed by cutting or the like. The diaphragm 231 is attached to the upper end surface of the heat-conducting portion 211, and the heat-conducting plate 52 is located on the outer peripheral surface of the heat-conducting portion 211. Through with limit magnetic conduction board 222 and heat conduction portion 211 integrated into one piece, can make the connection of limit magnetic conduction board 222 and heat conduction portion 211 inseparabler, avoided limit magnetic conduction board 222 and heat conduction portion 211 to have the clearance and lead to the poor condition of heat conduction effect to take place, the heat conduction radiating effect is better, the follow-up equipment process of limit magnetic conduction board 222 and monomer shell 21 also can be removed from, the installation process of the speaker module that has simplified is favorable to improving production efficiency.
In addition, referring to fig. 3, fig. 5 and fig. 6, in an embodiment, the single housing 21 further includes a mounting portion 212, the mounting portion 212 is a plastic part, the mounting portion 212 and the heat conducting portion 211 are integrally injection molded, the mounting portion 212 can be used for mounting a pad (not shown) and the magnetic circuit system 22, compared with a metal with a complex structure which is difficult to mold, the plastic mounting portion 212 is easier to mold a structure for mounting the magnetic circuit system 22, and the process is simple and can reduce the cost. Of course, in other embodiments, the single housing 21 may be entirely provided in metal, that is, the single housing 21 includes only the heat conduction portion 211. In addition, in an embodiment, the single housing 21 is rectangular ring-shaped, that is, the heat conducting portion 211 is rectangular ring-shaped, and the mounting portion 212 is disposed at a corner between two adjacent straight sides of the heat conducting portion 211, so that the straight sides of the heat conducting portion 211 are exposed, thereby ensuring that the heat conducting plate 52 is in heat-conducting connection with the straight sides of the heat conducting portion 211, and thus the contact area between the two is large, and the heat conducting effect is better. Of course, in other embodiments, the heat conduction portion 211 may be provided in an annular shape, and a plurality of mounting portions 212 may be provided on the heat conduction portion 211 at intervals in the circumferential direction.
In order to increase the heat dissipation effect, the heat conducting plate 52 may extend toward the magnetic conductive yoke 221, and the heat conducting plate 52 may be thermally conductively connected to at least an outer peripheral surface of one of the magnetic conductive yoke 221, the side magnet 223, and the side magnetic plate 222. Specifically, in one embodiment, the upper surface of the side magnetic plate 222 is connected to the lower surface of the heat conducting portion 211, and the lower end of the heat conducting plate 52 extends to the outer peripheral surface of the side magnetic plate 222 and is connected to the outer peripheral surface of the side magnetic plate 222 in a heat conducting manner. In one embodiment, the lower end of the heat conductive plate 52 extends to the outer circumferential surface of the side magnet 223 and is thermally conductively coupled to the outer circumferential surface of the side magnet 223. In one embodiment, the lower end of the heat conducting plate 52 extends to the magnetic conducting yoke 221 and is connected to the outer peripheral surface of the magnetic conducting yoke 221 in a heat conducting manner. In one embodiment, the heat conducting plate 52 may be thermally conductive coupled to any two of the magnetic yoke 221, the side magnet 223, and the side magnetic plate 222, or the heat conducting plate 52 may be thermally conductive coupled to all three of the magnetic yoke 221, the side magnet 223, and the side magnetic plate 222. By connecting the heat conducting plate 52 with at least one of the outer peripheral surfaces of the magnetic yoke 221, the side magnet 223 and the side magnetic plate 222 in a heat conducting manner, the contact area between the heat conducting plate 52 and the magnetic circuit system 22 is increased, the heat conducting effect of the magnetic circuit system 22 can be further improved, and the heat dissipation capability of the speaker module can be further improved.
Referring to fig. 4 and fig. 7, in an embodiment, the module housing 10 corresponding to the rear acoustic cavity 112 is provided with a flexible deformation portion 30, the speaker module further includes an electronic device housing (not shown), a sealed cavity is formed between the electronic device housing and the module housing 10, and the electronic device housing isolates sound generated by the flexible deformation portion 30 from sound emitted from the speaker unit 20 through the front acoustic cavity 111; the module shell 10 is provided with a communication port communicated with the closed cavity, and the communication port is opposite to the flexible deformation part 30; the speaker module further comprises a heat dissipation cover plate 40 located at the communication port, and the heat dissipation cover plate 40 is provided with a plurality of heat dissipation through holes 41.
The electronic device case in the present embodiment may have a case structure integrally formed with the module case 10, that is, the electronic device case is a part of the speaker module, and when the speaker module is mounted on an electronic device such as a mobile phone, the module case 10 and the electronic device case are mounted in the electronic device such as the mobile phone. Of course, in other embodiments, the electronic device housing may be used as a housing of an electronic device such as a mobile phone.
Specifically, the rear acoustic chamber 112 is a closed acoustic chamber, the flexible deformation portion 30 includes a central portion 31 and a convex suspension portion 32 located outside the central portion 31, and the suspension portion 32 is fixedly connected to the module case 10. The flexible deformation portion 30 may be a single-layer structure, the single-layer structure is made of one of polymer plastic, thermoplastic elastomer and silicone rubber, or a multi-layer structure, and at least one layer of the multi-layer structure is made of one of polymer plastic, thermoplastic elastomer and silicone rubber. By arranging the flexible deformation part 30, the flexible deformation part 30 deforms along with sound pressure, so that the volume of the rear sound cavity 112 is adjustable, the equivalent acoustic compliance of the rear sound cavity 112 is increased, the resonance frequency of the loudspeaker module is effectively reduced, and the low-frequency sensitivity is improved; and through the design of the electronic equipment shell to isolate the sound production unit of the vibration system of the speaker monomer 20 from the flexible deformation part 30, the radiation sound wave of the flexible deformation part 30 is sealed inside the electronic equipment shell, so that the reverse phase radiation sound wave of the flexible deformation part 30 is avoided, the offset influence on the forward radiation sound wave of the speaker monomer 20 is caused, and the low-frequency band sensitivity of the product is further improved by a large amplitude on the whole.
The heat dissipation cover plate 40 is a metal member, the outer surface of the heat dissipation cover plate 40 is exposed outside the speaker module, the flexible deformation portion 30 is covered by the heat dissipation cover plate 40, and the heat dissipation through hole 41 penetrates through the heat dissipation cover plate 40. The heat in the speaker module can radiate away through heat dissipation apron 40 betterly, and set up heat dissipation through-hole 41 and can increase the heat radiating area who looses heat dissipation apron 40 on heat dissipation apron 40, and when flexible deformation portion 30 vibrates, pressure balance among the flexible deformation portion 30 vibration process can be realized to heat dissipation through-hole 41, when flexible deformation portion 30 vibrates promptly, the air current of heat dissipation apron 40 both sides can flow into and flow out the cavity between heat dissipation apron 40 and the flexible deformation portion 30 through heat dissipation through-hole 41, and then can drive the heat in the flexible deformation portion 30 and distribute away from heat dissipation through-hole 41, can further improve the radiating effect of speaker module. In addition, the heat-dissipating cover plate 40 has a certain hardness and strength, and can protect the inner flexible deformation portion 30. In addition, in order to further improve the heat dissipation effect of the heat dissipation cover plate 40, a material with good heat conductivity, such as a graphite sheet, a copper foil or an aluminum foil, may be attached to the outer surface of the heat dissipation cover plate 40.
Further, in order to improve the vibration effect, a composite sheet (not shown) having a higher strength than that of the flexible deformation portion 30, which may be metal, plastic, carbon fiber, or a composite structure thereof, may be stacked on the central portion 31 of the flexible deformation portion 30. In addition, the central portion 31 may be a sheet-shaped integral structure or a hollow structure, and the hollow structure is sealed by a composite sheet.
The present invention further provides an electronic device, which includes a device housing, a host, and a speaker module, and the specific structure of the speaker module refers to the foregoing embodiments, and since the electronic device employs all technical solutions of all the foregoing embodiments, the electronic device at least has all beneficial effects brought by the technical solutions of the foregoing embodiments, and details are not repeated herein. Wherein, host computer and speaker module all locate in the equipment casing. At least one part of the equipment shell and the rear sound cavity 112 of the loudspeaker module form a sealed cavity, the sealed cavity and the sound outlet hole 12 are hermetically arranged, the reverse phase radiation sound wave of the flexible deformation part 30 is avoided, the offset influence on the forward radiation sound wave of the loudspeaker module is avoided, and the low-frequency band sensitivity of the product is improved in a large range on the whole. And the device shell is also used as the cavity wall of the rear sound cavity 112, so that the internal space of the electronic device can be fully utilized, meanwhile, the space occupied by a part of the cavity wall is saved, and the thinning design of the electronic device is facilitated.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A speaker module, comprising:
the module shell is provided with an accommodating cavity and a sound outlet hole;
the loudspeaker single body is arranged in the accommodating cavity, the accommodating cavity is divided into a front sound cavity and a rear sound cavity, the front sound cavity is communicated with the sound outlet hole, the loudspeaker single body comprises a single body shell and a magnetic circuit system arranged on the single body shell, the single body shell comprises a heat conducting part, and the heat conducting part is connected with the magnetic circuit system;
the heat dissipation part comprises a heat dissipation plate and a heat conduction plate connected with the heat dissipation plate, the heat dissipation plate is arranged on the outer surface of the module shell, and the heat conduction plate penetrates through the module shell and is in heat conduction connection with the heat conduction part;
the front sound cavity is provided with a heat dissipation opening, a vibration system of the loudspeaker single body is opposite to the heat dissipation opening, and the heat dissipation plate covers the heat dissipation opening;
be equipped with flexible deformation portion on the module shell that back sound chamber corresponds, the speaker module still includes the electronic equipment casing, the electronic equipment casing with form the airtight chamber between the module shell, the electronic equipment casing will the sound that flexible deformation portion produced with the speaker monomer passes through the sound that preceding sound chamber spreads is kept apart.
2. The speaker module as claimed in claim 1, wherein the heat sink is made of metal.
3. The speaker module of claim 1, wherein the heat sink is injection molded as one piece with the module housing; or, the heat sink is adhered to the module housing.
4. The speaker module as claimed in claim 1, wherein the module housing has a side wall formed with a sound outlet hole communicating with the front acoustic chamber;
the heat dissipation plate is provided with a first lateral edge facing the side wall, two second lateral edges connected with the first lateral edge, and a third lateral edge opposite to the first lateral edge, and at least one of the third lateral edge and the two second lateral edges is provided with the heat conduction plate.
5. The speaker module as claimed in claim 1, wherein a heat conductive medium is filled between the heat conductive portion and the heat conductive plate.
6. The speaker module as claimed in claim 1, wherein the heat radiating plate is integrally formed with the heat conductive plate.
7. The speaker module as claimed in any one of claims 1 to 6, wherein the magnetic circuit system comprises a yoke, a side magnet disposed on the yoke, and a side magnetic plate disposed on an upper end of the side magnet;
the heat conduction part is annular, the vibration system of the loudspeaker monomer is connected to one end of the heat conduction part, and the edge magnetic conduction plate is connected to the other end of the heat conduction part and integrally formed with the heat conduction part.
8. The speaker module as claimed in any one of claims 1 to 6, wherein the magnetic circuit system comprises a yoke, a side magnet disposed on the yoke, and a side magnetic plate disposed on an upper end of the side magnet;
the heat conducting plate extends towards the direction of the magnetic yoke, and is at least connected with the outer peripheral surface of one of the magnetic yoke, the side magnet and the side magnetic conductive plate in a heat conduction mode.
9. The speaker module as claimed in claim 1, wherein the module housing is provided with a communication port communicating with the closed cavity, the communication port being opposite to the flexible deformation portion; the loudspeaker module is characterized by further comprising a heat dissipation cover plate located at the communication port, and the heat dissipation cover plate is provided with a heat dissipation through hole.
10. An electronic device comprising a speaker module according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911343385.0A CN110996230B (en) | 2019-12-20 | 2019-12-20 | Speaker module and electronic equipment |
| PCT/CN2020/129108 WO2021120948A1 (en) | 2019-12-20 | 2020-11-16 | Loudspeaker module and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911343385.0A CN110996230B (en) | 2019-12-20 | 2019-12-20 | Speaker module and electronic equipment |
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| Publication Number | Publication Date |
|---|---|
| CN110996230A CN110996230A (en) | 2020-04-10 |
| CN110996230B true CN110996230B (en) | 2021-11-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911343385.0A Active CN110996230B (en) | 2019-12-20 | 2019-12-20 | Speaker module and electronic equipment |
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| Country | Link |
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| CN (1) | CN110996230B (en) |
| WO (1) | WO2021120948A1 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110996230B (en) * | 2019-12-20 | 2021-11-30 | 歌尔股份有限公司 | Speaker module and electronic equipment |
| CN113617620B (en) * | 2021-08-18 | 2023-03-24 | 苏州东菱振动试验仪器有限公司 | Underwater vibration exciter and cooling method thereof |
| CN114979847B (en) * | 2022-04-07 | 2023-03-14 | 瑞声光电科技(常州)有限公司 | Loudspeaker module |
| CN116684787A (en) * | 2022-10-31 | 2023-09-01 | 荣耀终端有限公司 | Electronic equipment |
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| CN106851496A (en) * | 2016-12-12 | 2017-06-13 | 瑞声科技(新加坡)有限公司 | Microphone device |
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| US20130108099A1 (en) * | 2011-10-31 | 2013-05-02 | Jason Kemmerer | Loudspeaker having improved cooling system integrally formed on speaker frame |
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| CN205081906U (en) * | 2015-07-31 | 2016-03-09 | 瑞声光电科技(常州)有限公司 | Loudspeaker box |
| CN205081965U (en) * | 2015-10-27 | 2016-03-09 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN206100427U (en) * | 2016-08-30 | 2017-04-12 | 歌尔股份有限公司 | Loudspeaker unit |
| CN206807759U (en) * | 2017-05-27 | 2017-12-26 | 歌尔科技有限公司 | A kind of loudspeaker module |
| CN107682789A (en) * | 2017-10-31 | 2018-02-09 | 温州华大信息技术有限公司 | A kind of loudspeaker with heat sinking function |
| US10575098B2 (en) * | 2018-02-13 | 2020-02-25 | Nokia Technologies Oy | Speaker apparatus having a heat dissipation structure |
| CN110996230B (en) * | 2019-12-20 | 2021-11-30 | 歌尔股份有限公司 | Speaker module and electronic equipment |
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- 2020-11-16 WO PCT/CN2020/129108 patent/WO2021120948A1/en active Application Filing
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| CN205584479U (en) * | 2016-03-31 | 2016-09-14 | 歌尔声学股份有限公司 | Loudspeaker module group |
| CN205847576U (en) * | 2016-07-20 | 2016-12-28 | 瑞声科技(新加坡)有限公司 | Speaker module |
| CN106851496A (en) * | 2016-12-12 | 2017-06-13 | 瑞声科技(新加坡)有限公司 | Microphone device |
| CN206341416U (en) * | 2016-12-28 | 2017-07-18 | 歌尔科技有限公司 | Loudspeaker module |
| CN207219033U (en) * | 2017-09-08 | 2018-04-10 | 深圳市金立通信设备有限公司 | A kind of speaker chamber, loudspeaker and terminal |
Also Published As
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|---|---|
| WO2021120948A1 (en) | 2021-06-24 |
| CN110996230A (en) | 2020-04-10 |
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