CN110995363B

CN110995363B - High-speed half-duplex ultrasonic communication device with short distance between modules

Info

Publication number: CN110995363B
Application number: CN201911249460.7A
Authority: CN
Inventors: 付涛; 王晓春; 毕勇冠
Original assignee: WEIHAI PLOUMETER CO Ltd
Current assignee: WEIHAI PLOUMETER CO Ltd
Priority date: 2019-12-09
Filing date: 2019-12-09
Publication date: 2021-12-21
Anticipated expiration: 2039-12-09
Also published as: CN110995363A

Abstract

The invention provides a high-speed half-duplex ultrasonic communication method and a device thereof in short distance between modules, which are provided with a physical layer and a link layer, wherein the physical layer comprises a singlechip, a Tx sending pin, an Rx receiving pin and a transducer; the first single chip microcomputer is used for sending data, the second single chip microcomputer is used for receiving the data, the first energy converter is used for converting electric energy into ultrasonic waves, and the second energy converter is used for converting the ultrasonic waves into electric energy. The communication method solves the technical problems that the existing communication method between modules is high in cost, high in power consumption, large in size and difficult to apply in a large scale in severe environment. The invention can be widely applied to short-distance, low-power consumption and high-speed data communication when solid, liquid and gas media exist among modules.

Description

High-speed half-duplex ultrasonic communication device with short distance between modules

Technical Field

The present invention relates to an ultrasonic communication method and apparatus, and more particularly, to a high-speed half-duplex ultrasonic communication method and apparatus for short distance between modules.

Background

Along with the development of intelligent science and technology, in the equipment of constituteing by a plurality of modules, need to realize data intercommunication between each module to intelligent water gauge is the example, and current data interaction mode is: the dial plate with the metal sheet is added in the base meter, and the nonmagnetic flow measurement is realized through LC oscillation in the dial plate rotation, so that the mode cannot transmit digital signals and can only be used for flow measurement, and the use is very limited. The modes for realizing digital signal transmission generally adopt wired data communication, infrared light communication and RF wireless radio frequency communication, and the three modes have the following advantages and disadvantages:

(1) the wired data communication is adopted, such as a serial port, I2C, SPI or a high-speed bus mode, which is the most important communication mode at present, and the wired data communication has the advantages of low cost and power consumption, high speed and reliable communication. For a product with a severe working environment, such as a water meter, the waterproof grade of IP68 is required to be achieved, the waterproof treatment of wired connection is difficult, and particularly, when a module is replaced and maintained, the quick and reliable waterproof treatment is difficult to realize;

(2) adopting an infrared light communication mode: the optical communication can realize wireless non-contact communication, and has convenient use and higher performance-price ratio. But for products in severe working environments, the surface of the infrared lamp is easy to cover and deposit dirt, the light attenuation is serious, and long-term reliable communication is difficult;

(3) adopting an RF wireless radio frequency communication mode: the RF wireless radio frequency communication mode can realize non-contact and long-distance data communication and has powerful functions, but the radio frequency communication mode has higher cost and power consumption and larger volume and is difficult to be applied in large scale in practice.

Disclosure of Invention

The invention provides a short-distance high-speed half-duplex ultrasonic communication method and a device thereof between modules, which can be applied to solid, liquid and gas media, have low cost and small volume, are not influenced by severe environment and can be popularized and applied in large scale and can be used for solving the technical problems of high cost, high power consumption, large volume and difficult large-scale application of the existing communication method between modules in severe use.

Therefore, the technical scheme of the invention is that the high-speed half-duplex ultrasonic communication device with short distance between modules is provided with a physical layer and a link layer, wherein the physical layer comprises a single chip microcomputer, a Tx sending pin, an Rx receiving pin and a transducer;

the first single chip microcomputer is used for sending data, the second single chip microcomputer is used for receiving the data, the first energy converter is used for converting electric energy into ultrasonic waves, and the second energy converter is used for converting the ultrasonic waves into electric energy.

Preferably, the first single chip microcomputer is connected with the first transducer through a Tx sending pin, and the second single chip microcomputer is connected with the second transducer through an Rx receiving pin.

Preferably, a comparator is arranged on the Rx receiving pin, and the comparator can detect whether the transducer receives the ultrasonic signal.

Preferably, the transducer adopts a high-speed ultrasonic transducer, the working frequency is 200kHz, and the communication distance is not more than 10 mm.

Preferably, the sending pin of the single chip microcomputer Tx can send square waves in a PWM (pulse width modulation), timer and IO (input/output) polling and overturning mode.

A high-speed half-duplex ultrasonic communication method for short distance between modules is characterized by that when the first single-chip computer is used for transmitting data, the Tx transmitting pin of the first single-chip computer can produce square wave of working frequency of the first transducer, and after the comparator of Rx receiving pin of the second single-chip computer detects the waveform signal of transducer oscillation, it can immediately analyze data bit according to set baud rate, and at the same time reset transducer to start data receiving treatment.

Preferably, the first transducer transmits data to convert the electrical energy into ultrasonic waves, and the second transducer receives data to convert the ultrasonic waves into the electrical energy.

Preferably, the comparator sets a threshold value in advance, the threshold value is larger than one third of the wave peak value, dynamic adjustment can be carried out according to the working condition, and when the comparator detects that the waveform amplitude exceeds the set threshold value, a receiving timer of the single chip microcomputer is started to start the byte receiving process.

Preferably, the single chip Tx pin sends a square wave of the working frequency of the transducer, the single chip Tx pin sends a square wave at bit 0, and does not send a square wave at bit 1, the number of the square waves sent by each bit of the single chip Tx pin is 5 or more, and the sum of the time of sending the square wave by each bit and the transmission time of the square wave is less than half of the bit width of the baud rate.

Preferably, the receiving pin of the single chip microcomputer Rx may detect whether the transducer receives the ultrasonic signal within a bit width time through an internal or external comparator, and if the transducer signal is received, it is determined that a bit 0 is received, and if the transducer signal is not received, it is determined that a bit 1 is received.

The invention has the following beneficial effects:

(1) the energy converter can convert electric energy and ultrasonic waves, is not influenced by working environment, and can be widely applied to data transmission of solid, liquid and gas at a short distance;

(2) the Rx receiving pin is provided with the comparator, so that the ultrasonic signal can be judged to exist or not, the threshold value of the comparator can be adjusted, the threshold value can be set according to the data receiving requirement, the clutter can be effectively filtered, and the required data information can be collected more efficiently;

(3) because the link layer bit is judged only by the existence and nonexistence of ultrasonic waves, voltage regulation, frequency modulation and complex sampling and coding algorithms are not needed, and the link processing is very simple;

(4) through the technical scheme, data are transmitted between two close modules, the data can be mutually converted through electric energy and ultrasonic waves, an ultrasonic wave transmission mode is adopted, the environmental suitability is strong, the equipment cost is low, the size is small, the communication speed is high, and the method can be widely popularized and applied.

Drawings

FIG. 1 is a schematic diagram illustrating the communication between modules according to an embodiment of the present invention;

fig. 2 is a waveform diagram of data transmission and reception according to an embodiment of the present invention.

Detailed Description

The present invention will be further described with reference to the following examples.

As shown in fig. 1-2, a high-speed half-duplex ultrasonic communication method and device for short distance between modules, wherein a physical layer comprises a first single chip, a first transducer, a second single chip and a second transducer, data bytes of a link layer comprise a start bit, a data bit, a check bit and a stop bit, when the first single chip sends data and the second single chip receives data, a pin of the first single chip is set as a Tx sending pin and connected with the first transducer, a pin of the second single chip is set as an Rx receiving pin, an internal or external comparator is started and connected with the second transducer, the Tx sending pin of the first single chip starts a PWM function, the start bit of the data of the first byte is sent, 5 square waves are sent, the first transducer starts oscillation and sends an ultrasonic signal, the second transducer starts oscillation when receiving the ultrasonic signal, the amplitude gradually increases, the comparator of the second single chip detects that the waveform amplitude voltage exceeds a threshold voltage, and after receiving the bit 0, starting a receiving timer, starting a byte receiving process, simultaneously pulling an Rx pin to a low level for 5 waveform periods immediately to stop oscillation of the transducer, sending subsequent byte bits by the first singlechip, analyzing each bit by the second singlechip according to the timer, checking the bit, and storing byte data. The communication parties continue to send data bytes to complete the whole data frame forwarding process.

And when the second single chip microcomputer transmits data, the pin of the second single chip microcomputer is set as a Tx transmitting pin and the pin of the first single chip microcomputer is set as a Rx receiving pin, and the previous process is repeated to complete communication.

In the invention, a physical layer provides the specification characteristic of a physical medium of data communication, a customized high-speed ultrasonic transducer capable of working in solid, liquid and gas is adopted, when data is transmitted, if the bit is 1, a single chip machine Tx transmitting pin does not transmit square waves, if the bit is 0, square waves of the working frequency of the transducer are transmitted, the number of the square waves is 5 or more, the sum of the total transmitting time of each bit and the transmission time of the square waves is less than half of the bit width of a baud rate, and the requirements of starting oscillation and threshold amplitude of the receiving transducer are met. The single chip machine Rx receiving pin can detect whether the transducer receives an ultrasonic signal through a built-in or external comparator circuit, the threshold value of the comparator can be dynamically adjusted, the signal is detected, the bit 0 is received, the signal of the transducer is not detected, the bit 1 is received, the single chip machine Rx receiving pin can set the pin to be a low level immediately after the signal of the transducer is detected, the transducer is reset, the vibration starting process of the transducer is finished, and next bit data receiving is prepared.

In the invention, a link layer defines link characteristics of data communication, each data frame comprises a plurality of bytes, each byte comprises 1 start bit, 8 data bits, 1 check bit and 1 stop bit, a frame interval exists between the data frames, the data frame interval is not less than 22 bit, the start bit is bit 0, the data bit firstly sends a low bit, the check bit supports odd check, even check and no check, the stop bit is bit 1, when a sending pin of a single chip Tx sends the data frame, the idle time of a sound channel is judged to be not less than 22 bit firstly, and if the sound channel is not idle, the receiving process of the data frame is finished preferentially.

In the invention, when the communication rate is 2400bps, the bit width is 417us, the working frequency of the transducer is 200kHz, the time of 5 square waves is 25us, when the distance between the transducers is 10mm, the transmission time in ultrasonic air is 29us, the total time of the two is 54us, which is far less than the bit width 417us, and the rate transmission requirement of common equipment can be met.

The invention can realize data transmission among modules through simple IO port control of the singlechip without a complex coding mode, and the medium among the transducers can be solid, liquid or gas, so the invention has wide applicability and can be applied to data intercommunication of modules in products with low power consumption, short distance and high speed.

Only one transducer can send data at the same time, one transducer can receive the data, and a pair of transducers are required to be added in a full-duplex communication mode and the sound channel isolation is kept.

However, the above description is only exemplary of the present invention, and the scope of the present invention should not be limited thereby, and the replacement of the equivalent components or the equivalent changes and modifications made according to the protection scope of the present invention should be covered by the claims of the present invention.

Claims

1. A high-speed half-duplex ultrasonic communication device with short distance between modules is characterized in that a physical layer and a link layer are arranged, the physical layer comprises a single chip microcomputer, a Tx sending pin, an Rx receiving pin and a transducer, the single chip microcomputer comprises a first single chip microcomputer and a second single chip microcomputer, the transducer comprises a first transducer and a second transducer, and the link layer comprises a start bit, a data bit, a check bit and a stop bit; the first single chip microcomputer is connected with the first energy converter through the Tx sending pin, and the second single chip microcomputer is connected with the second energy converter through the Rx receiving pin;

the first single chip microcomputer is used for sending data, the second single chip microcomputer is used for receiving data, the first energy converter is used for converting electric energy into ultrasonic waves, and the second energy converter is used for converting the ultrasonic waves into electric energy;

the transducer adopts an ultrasonic transducer which can work in solid, liquid and gas, the working frequency is 200kHz, and the communication distance is not more than 10 mm.

2. The high-speed half-duplex ultrasonic communication device according to claim 1, wherein a comparator is provided on the Rx receive pin, and the comparator can detect whether the transducer receives the ultrasonic signal.

3. The high-speed half-duplex ultrasonic communication device according to claim 1, wherein the single-chip Tx issue pin can issue a square wave by PWM, timer, IO polling and flipping.

4. The high-speed half-duplex ultrasonic communication device according to claim 2, wherein when the first single-chip microcomputer transmits data, the Tx transmitting pin of the first single-chip microcomputer generates a square wave of the operating frequency of the first transducer, and after the comparator of the Rx receiving pin of the second single-chip microcomputer detects a waveform signal of the transducer oscillation, the comparator immediately analyzes data bits according to a set baud rate, and simultaneously resets the transducer to start data receiving processing.

5. The high-speed half-duplex ultrasonic communication device according to claim 4, wherein the first transducer transmits data to convert the electrical energy into ultrasonic waves and the second transducer receives data to convert the ultrasonic waves into electrical energy.

6. The high-speed half-duplex ultrasonic communication device according to claim 5, wherein the comparator sets a threshold in advance, the threshold is greater than one third of the peak value of the wave, and can be dynamically adjusted according to the working condition, and when the comparator detects that the amplitude of the waveform exceeds the set threshold, the receiving timer of the single chip microcomputer is started to start the byte receiving process.

7. The high-speed half-duplex ultrasonic communication device according to claim 6, wherein the one-chip Tx issue pin sends out a square wave of the operating frequency of the transducer, the one-chip Tx issue pin sends out a square wave at bit 0 and does not send out a square wave at bit 1, the number of square waves sent out by each bit of the one-chip Tx issue pin is 5 or more, and the sum of the time of sending a square wave by each bit and the transmission time of the square wave is less than half of the bit width of the baud rate.

8. The apparatus of claim 7, wherein the Rx pin of the single chip detects whether the transducer receives the ultrasonic signal within a bit width time through an internal or external comparator, and determines that a bit 0 is received if the Rx pin detects that the transducer signal is received, and determines that a bit 1 is received if the Rx pin does not receive the transducer signal.