CN110988552A - Component data acquisition and processing system and method - Google Patents

Component data acquisition and processing system and method Download PDF

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Publication number
CN110988552A
CN110988552A CN201911309728.1A CN201911309728A CN110988552A CN 110988552 A CN110988552 A CN 110988552A CN 201911309728 A CN201911309728 A CN 201911309728A CN 110988552 A CN110988552 A CN 110988552A
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module
tested
component
test
axis
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赵建北
高瞻
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Beijing Institute of Radio Measurement
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Beijing Institute of Radio Measurement
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/04Housings; Supporting members; Arrangements of terminals

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The invention discloses a component data acquisition and processing system, comprising: test equipment module, motion motor module, subassembly control module, computer, wherein: the test equipment module is used for testing the electrical index of the tested microwave component; the motion motor module is used for connecting the microwave component to be tested with the test equipment module; the component control module is used for controlling the working state of the tested microwave component; and the computer is used for carrying out state and flow control on the test equipment module, the motion motor module and the component control module.

Description

Component data acquisition and processing system and method
Technical Field
The invention relates to the field of testing, in particular to a system and a method for acquiring and processing component data.
Background
Microwave components play a key role in many radio frequency systems, and testing microwave components is also an important and time-consuming process in the production process. The testing of the components comprises a plurality of electrical indexes such as power, top drop, gain, phase, noise, frequency spectrum and the like, and various instruments and equipment such as a power meter, a vector network analyzer, a frequency spectrograph, a noise meter, a signal source and the like are required to be used. In the face of various testing parameters, testing instruments and a large number of T/R components to be tested, the testing task is very heavy and generates a large amount of data.
According to the conventional method, manual measurement is generally adopted, the measurement time of the assembly is long, and the measurement precision is influenced by an installer to cause errors. Depending on traditional manual testing and processing of data, the realistic requirements of production tasks are difficult to meet
Disclosure of Invention
It is an object of the present invention to provide a component data acquisition and processing system.
Another object of the present invention is to provide a component data acquisition and processing method.
In order to achieve the purpose, the invention adopts the following technical scheme:
in a first aspect, the present invention provides an assembly data acquisition and processing system comprising:
test equipment module, mechanical motion module, subassembly control module, computer, wherein:
the test equipment module is used for testing the electrical index of the tested microwave component;
the mechanical motion module is used for connecting the microwave component to be tested with the test equipment module;
the component control module is used for controlling the working state of the tested microwave component;
the computer is used for controlling the test equipment module, the mechanical motion module and the component control module.
Optionally, the test equipment module comprises:
the device comprises a vector network analyzer, a power meter, a frequency spectrograph, a signal source, a noise meter and a circuit integrated board;
the interfaces of the vector network analyzer, the power meter, the frequency spectrograph, the signal source and the noise meter are all integrated on the circuit integrated board,
wherein the content of the first and second substances,
the vector network analyzer is used for testing the electromagnetic wave energy of the tested microwave component;
the power meter is used for measuring the electric power of the measured microwave component;
the frequency spectrograph is used for measuring the power, the frequency and distortion products of the microwave component to be measured;
the signal source is used for extracting, performing digital-to-analog conversion and performing digital signal processing on the signal of the tested microwave component;
the noise meter is used for carrying out noise detection on the measured microwave component;
the circuit integrated board is used for being connected with the tested piece.
Optionally, the mechanical motion module comprises:
the mechanical transmission device comprises a mechanical control module and a mechanical transmission module; wherein the content of the first and second substances,
the mechanical control module is used for controlling the mechanical transmission module to work;
and the mechanical transmission module is used for receiving a control instruction of the mechanical control module and connecting the tested piece and the circuit integrated board in a matching way.
Optionally, the mechanical rotation module comprises a three-axis motion mechanism, a joint converter and a test rack;
the three-axis motion mechanism comprises an X-axis slide, a Y-axis slide and a Z-axis slide;
the X-axis slide piece can slide along the X-axis direction;
the Y-axis slide piece can slide along the Y-axis direction;
the Z-axis slide piece can slide along the Z-axis direction;
the X-axis slide piece and the Y-axis slide piece are in sliding connection, and the Y-axis slide piece and the Z-axis slide piece are in sliding connection;
the test frame is arranged on the three-axis movement mechanism, so that the test frame can move along the X-axis direction, the Y-axis direction and the Z-axis direction;
the splice transition piece includes a first end and a second end; the first end is fixed on the test frame and moves along with the test frame; the second end is connected with the measured piece.
Optionally, the mechanical rotation module is configured with three-axis motion motors for driving the X-axis slide, the Y-axis slide and the Z-axis slide to move.
In a second aspect, the present invention provides a component data acquisition and processing method, comprising the steps of:
s1, connecting the microwave component to be tested with the second end of the joint conversion piece, wherein the first end of the joint conversion piece is fixed on the test rack;
s2, electrifying the test equipment module;
s3, calling a state file for a corresponding instrument in the test equipment module according to the electrical index of the tested microwave component to be tested;
s4, setting the motion trail of the test rack according to the structural parameters of the microwave component to be tested;
s5, moving the test rack to the circuit integrated board through the motion control module, and inserting the second end of the conversion joint with a mating instrument joint on the circuit integrated board;
s6, transmitting control parameters and timing pulses to the microwave component to be detected through the component control module, and opening a channel to be detected;
s7, storing the test data through the test equipment module and sending the test data to the computer;
s8, closing a channel to be tested of the microwave component to be tested;
s9, moving the test frame to the next position to be measured and repeating the processes of S2-S8;
and S10, processing the test data through a computer.
The invention has the following beneficial effects:
the invention discloses a component data acquisition and processing system, which can quickly perform microwave performance test on a component, improve the test efficiency, reduce manual operation, automatically test various electrical indexes of a large number of microwave components, realize high-power, high-precision, high-speed and multi-parameter automatic test of the component, and realize automatic acquisition, storage, statistical processing and analysis of a large data volume by the data processing function.
Drawings
The following describes embodiments of the present invention in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic diagram of an assembly data acquisition and processing system according to the present invention;
fig. 2 shows a schematic structural diagram of the mechanical rotation module of the present invention.
Wherein, 1, X-axis slide; 2. a Y-axis slide; 3. a Z-axis slide; 4. a test jig; 5. a splice adaptor; 6. a second end of the splice transition piece; 7. and (4) a circuit integrated board.
Detailed Description
In order to more clearly illustrate the invention, the invention is further described below with reference to preferred embodiments and the accompanying drawings. Similar parts in the figures are denoted by the same reference numerals. It is to be understood by persons skilled in the art that the following detailed description is illustrative and not restrictive, and is not to be taken as limiting the scope of the invention.
To solve the technical problems in the background art, fig. 1 illustrates a hardware composition, a test equipment module, a mechanical motion module, a component control module, and a computer of a component data acquisition and processing system according to an embodiment of the present invention, wherein:
the test equipment module is used for testing the electrical index of the tested microwave component;
the mechanical motion module is used for connecting the microwave component to be tested with the test equipment module;
the component control module is used for controlling the working state of the tested microwave component;
the computer is used for controlling the test equipment module, the mechanical motion module and the component control module.
Specifically, the test equipment module includes:
the device comprises a vector network analyzer, a power meter, a frequency spectrograph, a signal source, a noise meter and a circuit integrated board;
the interfaces of the vector network analyzer, the power meter, the frequency spectrograph, the signal source and the noise meter are all integrated on the circuit integrated board,
wherein the content of the first and second substances,
the vector network analyzer is used for testing the electromagnetic wave energy of the tested microwave component;
the power meter is used for measuring the electric power of the measured microwave component;
the frequency spectrograph is used for measuring the power, the frequency and distortion products of the microwave component to be measured;
the signal source is used for extracting, performing digital-to-analog conversion and performing digital signal processing on the signal of the tested microwave component;
the noise meter is used for carrying out noise detection on the measured microwave component;
the circuit integrated board is used for being connected with the tested piece;
the specific construction of the test equipment module can be replaced by actual requirements.
Specifically, the mechanical motion module includes:
the mechanical transmission device comprises a mechanical control module and a mechanical transmission module; wherein the content of the first and second substances,
the mechanical control module is used for controlling the mechanical transmission module to work;
and the mechanical transmission module is used for receiving a control instruction of the mechanical control module and connecting the tested piece and the circuit integrated board in a matching way.
Specifically, the mechanical rotation module shown in fig. 2 includes a three-axis movement mechanism, a joint converter 5, and a test rack 4;
the three-axis motion mechanism comprises an X-axis slide 1, a Y-axis slide 2 and a Z-axis slide 3;
the X-axis slide piece 1 can slide along the X-axis direction;
the Y-axis slide piece 2 can slide along the Y-axis direction;
the Z-axis slide piece 3 can slide along the Z-axis direction;
the X-axis slider 1 and the Y-axis slider 2 are in sliding connection, and the Y-axis slider 2 and the Z-axis slider 3 are in sliding connection;
the test jig 4 is arranged on the three-axis movement mechanism so that the test jig 4 can move in the X-axis direction, the Y-axis direction and the Z-axis direction;
the splice transition piece 5 includes a first end and a second end; the first end is fixed on the test frame 4 and moves along with the test frame 4; the second end is connected with the measured piece.
In particular, the mechanical rotation module is equipped with three-axis motion motors for driving the X-axis slide 1, the Y-axis slide 2 and the Z-axis slide 3 into motion.
Before the component data acquisition and processing system is used, the position of a motor needs to be calibrated, a tested piece is connected with a test rack through a joint converter, then the position of the test rack is acquired to serve as an original point, and the position to be reached by a second end of the joint converter is obtained through calculation according to the size of the tested piece, the position of a microwave interface and the like; aiming at different tested components, the motion trail of the test frame can be planned according to the electrically designed microwave interface position, and each interface to be tested is automatically plugged through the connector converter. A space transformation algorithm is added in the motion control module, when the assembly mounting position and the three-dimensional coordinate plane of the test frame have angle difference, the corresponding plug position can be correctly found after calibration, and the test accuracy is ensured without damaging the microwave plug.
The invention provides a component data acquisition and processing method, which comprises the following steps:
s1, connecting the tested microwave component with the second end of the joint conversion piece 5, wherein the first end of the joint conversion piece 5 is fixed on the test rack 4;
s2, electrifying the test equipment module;
s3, calling a state file for a corresponding instrument in the test equipment module according to the electrical index of the tested microwave component to be tested;
s4, setting the motion trail of the test rack 4 according to the structural parameters of the microwave component to be tested;
s5, moving the test rack 4 to the circuit integrated board 7 through the motion control module, and inserting the second end of the conversion joint with a mating instrument joint on the circuit integrated board;
s6, transmitting control parameters and timing pulses to the microwave component to be detected through the component control module, and opening a channel to be detected;
s7, storing the test data through the test equipment module and sending the test data to the computer;
s8, closing a channel to be tested of the microwave component to be tested;
s9, moving the test frame 4 to the next position to be measured and repeating the processes of S2-S8;
and S10, processing the test data through a computer.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention, and it will be obvious to those skilled in the art that other variations or modifications may be made on the basis of the above description, and all embodiments may not be exhaustive, and all obvious variations or modifications may be included within the scope of the present invention.

Claims (6)

1. A component data acquisition and processing system, comprising:
test equipment module, mechanical motion module, subassembly control module, computer, wherein:
the test equipment module is used for testing the electrical index of the tested microwave component;
the mechanical motion module is used for connecting the microwave component to be tested with the test equipment module;
the component control module is used for controlling the working state of the tested microwave component;
the computer is used for controlling the test equipment module, the mechanical motion module and the component control module.
2. The component data acquisition and processing system of claim 1, wherein the test equipment module comprises:
the device comprises a vector network analyzer, a power meter, a frequency spectrograph, a signal source, a noise meter and a circuit integrated board;
the interfaces of the vector network analyzer, the power meter, the frequency spectrograph, the signal source and the noise meter are all integrated on the circuit integrated board,
wherein the content of the first and second substances,
the vector network analyzer is used for testing the electromagnetic wave energy of the tested microwave component;
the power meter is used for measuring the electric power of the measured microwave component;
the frequency spectrograph is used for measuring the power, the frequency and distortion products of the microwave component to be measured;
the signal source is used for extracting, performing digital-to-analog conversion and performing digital signal processing on the signal of the tested microwave component;
the noise meter is used for carrying out noise detection on the measured microwave component;
the circuit integrated board is used for being connected with the tested piece.
3. The component data acquisition and processing system of claim 1, wherein the mechanical motion module comprises:
the mechanical transmission device comprises a mechanical control module and a mechanical transmission module; wherein the content of the first and second substances,
the mechanical control module is used for controlling the mechanical transmission module to work;
and the mechanical transmission module is used for receiving a control instruction of the mechanical control module and connecting the tested piece and the circuit integrated board in a matching way.
4. The component data acquisition and processing system of claim 3, wherein the mechanical rotation module comprises a three-axis motion mechanism, a joint translator, and a test rack;
the three-axis motion mechanism comprises an X-axis slide, a Y-axis slide and a Z-axis slide;
the X-axis slide piece can slide along the X-axis direction;
the Y-axis slide piece can slide along the Y-axis direction;
the Z-axis slide piece can slide along the Z-axis direction;
the X-axis slide piece and the Y-axis slide piece are in sliding connection, and the Y-axis slide piece and the Z-axis slide piece are in sliding connection;
the test frame is arranged on the three-axis movement mechanism, so that the test frame can move along the X-axis direction, the Y-axis direction and the Z-axis direction;
the splice transition piece includes a first end and a second end; the first end is fixed on the test frame and moves along with the test frame; the second end is connected with the measured piece.
5. The component data acquisition and processing system according to claim 4, wherein the mechanical rotation module is configured with three-axis motion motors for driving the X-axis slide, the Y-axis slide and the Z-axis slide into motion.
6. A method for component data acquisition and processing, comprising the steps of:
s1, connecting the microwave component to be tested with the second end of the joint conversion piece, wherein the first end of the joint conversion piece is fixed on the test rack;
s2, electrifying the test equipment module;
s3, calling a state file for a corresponding instrument in the test equipment module according to the electrical index of the tested microwave component to be tested;
s4, setting the motion trail of the test rack according to the structural parameters of the microwave component to be tested;
s5, moving the test rack to the circuit integrated board through the motion control module, and inserting the second end of the conversion joint with a mating instrument joint on the circuit integrated board;
s6, transmitting control parameters and timing pulses to the microwave component to be detected through the component control module, and opening a channel to be detected;
s7, storing the test data through the test equipment module and sending the test data to the computer;
s8, closing a channel to be tested of the microwave component to be tested;
s9, moving the test frame to the next position to be measured and repeating the processes of S2-S8;
and S10, processing the test data through a computer.
CN201911309728.1A 2019-12-18 2019-12-18 Component data acquisition and processing system and method Pending CN110988552A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111830293A (en) * 2020-08-13 2020-10-27 上海悦易网络信息技术有限公司 Interface plug device and detection equipment

Citations (6)

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CN105445555A (en) * 2015-12-17 2016-03-30 中国电子科技集团公司第五十四研究所 Phased array antenna unit active standing-wave ratio calculating method
US20160174349A1 (en) * 2014-12-12 2016-06-16 Ir-Tec International Ltd. Wallmount dual beam sensing device
CN107872280A (en) * 2016-09-27 2018-04-03 安立股份有限公司 Near field determines device and near field assay method
CN108155958A (en) * 2017-11-22 2018-06-12 西南电子技术研究所(中国电子科技集团公司第十研究所) Extensive mimo antenna array far field calibration system
CN110561080A (en) * 2019-08-23 2019-12-13 中国电子科技集团公司第三十八研究所 high-density assembly multi-stage blind-mating intelligent assembly device and blind-mating method

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202282781U (en) * 2011-11-01 2012-06-20 南京鑫轩电子***工程有限公司 TR assembly automatic test system
US20160174349A1 (en) * 2014-12-12 2016-06-16 Ir-Tec International Ltd. Wallmount dual beam sensing device
CN105445555A (en) * 2015-12-17 2016-03-30 中国电子科技集团公司第五十四研究所 Phased array antenna unit active standing-wave ratio calculating method
CN107872280A (en) * 2016-09-27 2018-04-03 安立股份有限公司 Near field determines device and near field assay method
CN108155958A (en) * 2017-11-22 2018-06-12 西南电子技术研究所(中国电子科技集团公司第十研究所) Extensive mimo antenna array far field calibration system
CN110561080A (en) * 2019-08-23 2019-12-13 中国电子科技集团公司第三十八研究所 high-density assembly multi-stage blind-mating intelligent assembly device and blind-mating method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111830293A (en) * 2020-08-13 2020-10-27 上海悦易网络信息技术有限公司 Interface plug device and detection equipment

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Application publication date: 20200410