CN110972386A - Circuit board suitable for printed electronic component - Google Patents
Circuit board suitable for printed electronic component Download PDFInfo
- Publication number
- CN110972386A CN110972386A CN201811135842.2A CN201811135842A CN110972386A CN 110972386 A CN110972386 A CN 110972386A CN 201811135842 A CN201811135842 A CN 201811135842A CN 110972386 A CN110972386 A CN 110972386A
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- Prior art keywords
- layer
- flexible substrate
- heat dissipation
- printed electronic
- circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a circuit board suitable for a printed electronic element, which comprises a flexible substrate, at least one printed electronic element, a circuit layer, a protective layer and at least one heat dissipation layer. The printed electronic component is stacked on the flexible substrate. The circuit layer is electrically connected with the printed electronic element, and the circuit layer and the printed electronic element are both positioned on the same side of the flexible substrate. The protective layer is laminated on the printed electronic element and the circuit layer, so that the printed electronic element and the circuit layer are positioned between the flexible substrate and the protective layer. The heat dissipation layer is stacked on the protection layer and the heat dissipation layer and the circuit layer are respectively located on two opposite sides of the protection layer, or the heat dissipation layer is stacked on the flexible substrate and the heat dissipation layer and the circuit layer are respectively located on two opposite sides of the flexible substrate. Wherein, the printed electronic component and the circuit layer are manufactured by printing.
Description
Technical Field
The present invention relates to a circuit board suitable for printed electronic components, and more particularly, to a circuit board having a heat dissipation layer and both electronic components and circuit layers made by printing.
Background
With the trend of flexibility and thinning of consumer electronic products in the future, manufacturers are trying to apply flexible materials to the substrate of the circuit board, and trying to reduce the volume of the electronic components.
However, the thermal conductivity of the conventional flexible material is often too low, and the thermal conductivity of the flexible substrate made of the material is also too low. When the electronic element with reduced volume is stacked on the flexible substrate, the heat generated by the miniaturized electronic element during operation is not easy to be taken away by the flexible substrate. As a result, a large amount of heat generated by the miniaturized electronic component in a high power state is concentrated around the electronic component, which causes the temperature of the flexible substrate around the location of the electronic component to increase. The high temperature causes the flexible substrate to deform, which causes the electronic components or circuit layers stacked on the flexible substrate to be damaged along with the warping, and the whole circuit board cannot be used. When the problem of poor heat dissipation is more serious, the flexible substrate may even be burned.
Disclosure of Invention
The invention provides a circuit board suitable for printed electronic components, which solves the problems that a flexible substrate has poor heat dissipation performance, so that heat generated by miniaturized electronic components stacked on the flexible substrate is not easily taken away by the flexible substrate, and the whole circuit board is damaged and cannot be used or even burnt.
The circuit board suitable for the printed electronic component disclosed by the embodiment of the invention comprises a flexible substrate, at least one printed electronic component, a circuit layer, a protective layer and at least one heat dissipation layer. The printed electronic component is stacked on the flexible substrate. The circuit layer is electrically connected with the printed electronic element, and the circuit layer and the printed electronic element are both positioned on the same side of the flexible substrate. The protective layer is laminated on the printed electronic element and the circuit layer, so that the printed electronic element and the circuit layer are positioned between the flexible substrate and the protective layer. The heat dissipation layer is stacked on the protection layer and the heat dissipation layer and the circuit layer are respectively located on two opposite sides of the protection layer, or the heat dissipation layer is stacked on the flexible substrate and the heat dissipation layer and the circuit layer are respectively located on two opposite sides of the flexible substrate. Wherein, the printed electronic component and the circuit layer are manufactured by printing.
According to the circuit board suitable for the printed electronic component disclosed by the invention, through the arrangement of the heat dissipation layer, the heat generated by the printed electronic component during operation can be conducted and taken away through the heat dissipation layer, so that the flexible substrate and the printed electronic component are ensured to be maintained in a temperature range in which the printed electronic component can normally operate. Therefore, the thin and flexible circuit board can still be provided with high-power printed electronic elements and can normally function, so that the applicability of the thin and flexible circuit board is improved.
The foregoing summary of the invention, as well as the following detailed description of the embodiments, is provided to illustrate and explain the principles and spirit of the invention, and to provide further explanation of the invention as claimed.
Drawings
Fig. 1 is a side view of a circuit board according to a first embodiment of the present invention.
Fig. 2 is a side view of a circuit board according to a second embodiment of the present invention.
Fig. 3 is a side view of a circuit board according to a third embodiment of the present invention.
Wherein, the reference numbers:
10a, 10b, 10c circuit board
100a, 100b, 100c flexible substrate
200a, 200b, 200c printed electronic components
300a, 300b, 300c line layer
400a, 400c protective layer
500a, 500b, 500c heat sink layer
Detailed Description
The detailed features and advantages of the present invention are described in detail in the following embodiments, which are sufficient for those skilled in the art to understand the technical contents of the present invention and to implement the same, and the related objects and advantages of the present invention can be easily understood by those skilled in the art from the disclosure of the present specification, claims and drawings. The following examples further illustrate aspects of the present invention in detail, but are not intended to limit the scope of the present invention in any way.
The following description relates to a first embodiment of the present invention, and first refers to fig. 1. Fig. 1 is a side view of a circuit board according to a first embodiment of the present invention.
The circuit board 10a according to the first embodiment of the invention includes a flexible substrate 100a, at least one printed electronic component 200a, a circuit layer 300a, a protection layer 400a, and a heat dissipation layer 500 a. In the first embodiment of the present invention, the thickness of the flexible substrate 100a is less than 750 micrometers (μm), but not limited thereto. In other embodiments of the present invention, the thickness of the flexible substrate may be 30 μm to 500 μm, so that the flexible substrate maintains a better structural strength and has a better bending effect, wherein the thickness of the flexible substrate is, for example, 50 μm, 100 μm, 150 μm or other thicknesses that enable the flexible substrate to maintain a proper flexibility. In the first embodiment of the present invention, the thermal conductivity of the flexible substrate 100a is, for example, 0.4W/(m · kelvin) (W/m · K) or less, but not limited thereto. In another embodiment of the present invention, the flexible substrate has a thermal conductivity of 0.1 to 0.4W/mK. In the first embodiment of the present invention, the flexible substrate 100a is made of PET (polyethylene terephthalate), PE (polyethylene), PP (polypropylene), or epoxy resin up to FR4 grade, but not limited thereto. In other embodiments of the present invention, the flexible substrate may be made of other flexible polymer materials.
The printed electronic component 200a is stacked on the flexible substrate 100 a. The thickness of the printed electronic component 200a may be less than 1000 μm, such as 8 μm, 20 μm, 80 μm, 200 μm or 800 μm, to meet the requirement of thinning the circuit board 10 a. In the first embodiment of the invention, the printed electronic component 200a is, for example, a capacitor, a resistor or an inductor, but not limited thereto. In other embodiments of the present invention, the printed electronic component may be other electronic components. In the first embodiment of the present invention, the printed electronic component 200a is manufactured by printing conductive ink. The conductive ink is, for example, a conductive silver paste, a conductive copper paste, a conductive aluminum paste, or a conductive polymer material, wherein the conductive polymer material includes PEDOT (Poly (3, 4-ethylenedioxythiovinylene)), but is not limited thereto. In other embodiments of the present invention, the conductive ink used to form the printed electronic component may be an oil-based ink including powders of gold, silver, copper, aluminum, platinum, alloys thereof, other metals, or other alloys.
In the first embodiment of the present invention, the printed electronic component 200a is manufactured by using a printing method, such as screen printing, gravure printing, letterpress printing or inkjet printing. The printed electronic component 200a is manufactured by printing, which can eliminate the additional assembly time of the printed electronic component 200a on the flexible substrate 100a, thereby improving the efficiency of producing the circuit board 10 a. In the first embodiment of the present invention, the conductive ink is printed on the flexible substrate 100a in a liquid state, and after the liquid component, such as a volatile solvent, in the conductive ink is dried and removed, the remaining solid component forms the printed electronic component 200 a. The conductive ink is dried by baking the conductive ink printed on the flexible substrate 100a at a temperature of, for example, 60 to 80 degrees celsius for a time period of, for example, 5 to 15 minutes, but not limited thereto. In other embodiments of the present invention, the flexible substrate may be baked at a baking temperature or a baking time that does not cause deformation of the flexible substrate, or only the conductive ink may be naturally dried.
The circuit layer 300a is stacked on the flexible substrate 100a, the circuit layer 300a is electrically connected to the printed electronic component 200a, and the circuit layer 300a and the printed electronic component 200a are both located on the same side of the flexible substrate 100 a. In the first embodiment of the present invention, the circuit layer 300a is made of conductive ink by printing. The conductive ink is, for example, a conductive silver paste, a conductive copper paste, a conductive aluminum paste, or a conductive polymer material, wherein the conductive polymer material includes PEDOT (Poly (3, 4-ethylenedioxythiovinylene)), but is not limited thereto. In other embodiments of the present invention, the conductive ink used to form the printed electronic component may be an oil-based ink including powders of gold, silver, copper, aluminum, platinum, alloys thereof, other metals, or other alloys. In the first embodiment of the present invention, the circuit layer 300a is manufactured by using a printing method, such as screen printing, gravure printing, letterpress printing or inkjet printing. Manufacturing the wiring layer 300a in the printing form can save man-hours and reduce environmental pollution compared to manufacturing the wiring layer in the plating form, and thus can reduce the total cost of producing the circuit board 10 a. In the first embodiment of the present invention, the conductive ink is printed on the flexible substrate 100a in a liquid state, and after the liquid component, such as a volatile solvent, in the conductive ink is dried and removed, the remaining solid component forms the circuit layer 300 a. The conductive ink is dried by baking the conductive ink printed on the flexible substrate 100a at a temperature of, for example, 60 to 80 degrees celsius for a time period of, for example, 5 to 15 minutes, but not limited thereto. In other embodiments of the present invention, the flexible substrate may be baked at a baking temperature or a baking time that does not cause deformation of the flexible substrate, or only the conductive ink may be naturally dried.
The protective layer 400a is stacked on the printed electronic component 200a and the circuit layer 300a by, for example, printing, spraying, curtain coating, attaching, plating, sputtering, electroplating or chemical plating, so that the printed electronic component 200a and the circuit layer 300a are located between the flexible substrate 100a and the protective layer 400 a. In the first embodiment of the invention, the material of the protection layer 400a is, for example, epoxy resin or acryl, but not limited thereto. The protective layer 400a is dried and cured by a heat source such as an electric furnace or infrared irradiation, for example, in a low-temperature baking manner. In other embodiments of the present invention, in order to accelerate curing of the protective layer during the manufacturing process, the material of the protective layer may further include an ultraviolet light curing material. The uv curable material can be used as an initiator for accelerating the curing reaction, in other words, the material of the protective layer is, for example, epoxy resin containing the uv curable material or acryl with the uv curable material. The protective layer 400a covers the printed electronic component 200a and the circuit layer 300a and provides a stable environment for the printed electronic component 200a and the circuit layer 300a, thereby improving the weather resistance of the printed electronic component 200 a. Through the arrangement of the protective layer 400a, the resistance change rate of the printed electronic element 200a can still be maintained within 5% under the conditions of 65 ℃ and 95% relative humidity of the printed electronic element 200a and after 72 hours. Thus, the circuit board 10a with the printed electronic component 200a and the passivation layer 400a can expand the applicable environmental conditions.
The heat dissipation layer 500a is stacked on the protection layer 400a by, for example, printing, spraying, curtain coating, attaching, plating, sputtering, electroplating or chemical plating, and the heat dissipation layer 500a and the circuit layer 300a are respectively located on two opposite sides of the protection layer 400 a. That is, the heat dissipation layer 500a is stacked on the protection layer 400a at a side away from the circuit layer 300 a. The heat dissipation layer 500a has a thickness of 1 μm or more. The material of the heat dissipation layer 500a is, for example, metal oxide, such as zinc oxide or manganese oxide, ceramic, graphene, silicon dioxide, silica gel, or Polymer (Polymer). The heat dissipation layer 500a is baked at a temperature of, for example, 80 degrees celsius for 10 minutes, so that the liquid component in the heat dissipation layer 500a is evaporated, and the remaining solid component is attached to the protection layer 400 a. The thermal conductivity of the heat dissipation layer 500a is greater than that of the flexible substrate 100a, so that the heat generated by the printed electronic component 200a can be more effectively conducted. The heat generated by the printed electronic component 200a is conducted to the heat dissipation layer 500a through the protection layer 400a for heat dissipation, so that the heat is evenly distributed and not excessively concentrated around the printed electronic component 200a, thereby ensuring that the flexible substrate 100a and the printed electronic component 200a are maintained in a temperature range in which they can normally operate. In the first embodiment of the invention, the heat dissipation layer 500a is a single-layer structure, but not limited thereto. In other embodiments of the present invention, the heat dissipation layer may have a double-layer structure, for example, one layer is a metal layer and the other layer is a glue layer, and the metal layer is attached to the side of the protection layer away from the circuit layer through the glue layer. In other embodiments of the present invention, the heat dissipation layer is, for example, a copper tape, and the heat dissipation layer can be conveniently and rapidly attached to the side of the protection layer away from the circuit layer.
The thermal conductivity of the heat dissipation layer 500a is greater than that of the flexible substrate 100a, i.e., the thermal conductivity of the heat dissipation layer 500a exceeds 0.4W/m · K. When the thermal conductivity of the heat dissipation layer 500a only slightly exceeds 0.4W/m · K, in order to ensure that the heat dissipation capability of the heat dissipation layer 500a can meet the heat dissipation requirement of a common electronic component with a maximum power of 500 milliwatts (mW), the area of the heat dissipation layer 500a needs to be more than 1.875 times the area of the printed electronic component 200 a. When the thermal conductivity of the heat dissipation layer 500a slightly exceeds 0.4W/m · K, the relationship between the area of the a. heat dissipation layer 500a, the area of the b. printed electronic component 200a, and the maximum power of the c. printed electronic component 200a is shown in the table below. The ratio of the area of the heat dissipation layer 500a to the area of the printed electronic component 200a can also be derived from the following table.
As can be seen from the above table, if the heat dissipation layer 500a is not disposed on the circuit board 10a, i.e., the first item of the above table, the maximum power of the selected c. printed electronic component 200a can only reach 322mW, which does not meet the requirement that the maximum power of the c. printed electronic component 200a needs to reach 500 mW. If the circuit board 10a is provided with the heat dissipation layer 500a, it can be known from the above table that the maximum power of the c-pcb 200a can be higher when the area of the a-heat dissipation layer 500a is larger. However, if the ratio of the area of the heat dissipation layer 500a to the area of the printed electronic component 200a is less than 1.875 times, for example, the second item in the table above, the maximum power of the c-printed electronic component 200a is only 400mW, which cannot satisfy the requirement of 500mW or more. If d. the ratio of the area of the heat dissipation layer 500a to the area of the printed electronic component 200a reaches 100 times, the last item in the table is shown, and the heat dissipation capability of the heat dissipation layer 500a can satisfy the maximum power of 1428mW of the printed electronic component 200 a.
The heat dissipation layer 500a of the above embodiment is stacked on the protection layer 400a, and the heat dissipation layer 500a and the circuit layer 300a are respectively located on two opposite sides of the protection layer 400a, but not limited thereto. Referring to fig. 2, fig. 2 is a side view of a circuit board according to a second embodiment of the invention. Only the portions of the second embodiment of the present invention that are different from the portions of the first embodiment of the present invention will be described below, and the remaining portions that are the same will be omitted. In the second embodiment of the present invention, the heat dissipation layer 500b of the circuit board 10b is stacked on the flexible substrate 100b, and the heat dissipation layer 500b and the circuit layer 300b are respectively located on two opposite sides of the flexible substrate 100 b. That is, the heat dissipation layer 500b is stacked on the side of the flexible substrate 100b away from the circuit layer 300 b. The heat generated by the printed electronic component 200b is conducted to the heat dissipation layer 500b through the flexible substrate 100b for heat dissipation.
The heat dissipation layer 500a of the above embodiments is stacked on the protection layer 400a, and the heat dissipation layer 500a and the circuit layer 300a are respectively located on two opposite sides of the protection layer 400a, or the heat dissipation layer 500b is stacked on the flexible substrate 100b, and the heat dissipation layer 500b and the circuit layer 300b are respectively located on two opposite sides of the flexible substrate 100b, but not limited thereto. Referring to fig. 3, fig. 3 is a side view of a circuit board according to a third embodiment of the invention. Only the portions of the third embodiment of the present invention that are different from the portions of the first embodiment of the present invention will be described below, and the remaining portions that are the same will be omitted. In the third embodiment of the present invention, the number of the heat dissipation layers 500c of the circuit board 10c is two. The two heat dissipation layers 500c are respectively stacked on the protection layer 400c and the flexible substrate 100c, and the heat dissipation layer 500c and the circuit layer 300c are respectively located on two opposite sides of the protection layer 400 c. In other words, the two heat dissipation layers 500c are respectively stacked on the side of the protection layer 400c away from the circuit layer 300c and the side of the flexible substrate 100c away from the circuit layer 300 c. Alternatively, the outermost opposite sides of the circuit board 10c are heat dissipation layers 500 c. Since the heat generated by the printed electronic component 200c can be transferred to the outermost heat dissipation layers 500c through the protection layer 400c and the flexible substrate 100c in two directions, the heat dissipation effect is better.
According to the circuit board of the above embodiment, in order to solve the problem that the heat dissipation of the circuit board is poor after the circuit board is flexible and thinned, the heat dissipation layer is disposed on the outermost layer of the circuit board. If the thermal conductivity of the heat dissipation layer only slightly exceeds 0.4W/m.K and the heat dissipation layer is required to satisfy the heat dissipation requirement of 500mW of a common electronic component, the area of the heat dissipation layer is required to be more than 1.875 times of the area of the printed electronic component. Therefore, the heat dissipation layer can effectively and evenly distribute the heat generated by the printed electronic element during working. The heat dissipation layer is arranged to prevent the heat from being excessively concentrated on the printed electronic component, thereby ensuring that the flexible substrate and the printed electronic component are maintained in a temperature range in which the printed electronic component can normally work. Therefore, the maximum power of the used printed electronic element can reach more than 500mW, which is more than the minimum requirement standard when the electronic element is generally used, so as to match with various use conditions of the circuit board and increase the applicability of the circuit board.
Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.
Claims (10)
1. A circuit board adapted for use in printing electronic components, the circuit board comprising:
a flexible substrate;
at least one printed electronic component stacked on the flexible substrate;
a circuit layer stacked on the flexible substrate, the circuit layer being electrically connected to the at least one printed electronic component, and the circuit layer and the at least one printed electronic component being located on the same side of the flexible substrate;
a protective layer, which is stacked on the at least one printed electronic element and the circuit layer, so that the at least one printed electronic element and the circuit layer are positioned between the flexible substrate and the protective layer; and
at least one heat dissipation layer stacked on the protection layer and the heat dissipation layer and the circuit layer are respectively located on two opposite sides of the protection layer, or stacked on the flexible substrate and the heat dissipation layer and the circuit layer are respectively located on two opposite sides of the flexible substrate;
wherein, the at least one printed electronic element and the circuit layer are manufactured by printing.
2. The circuit board of claim 1, wherein the number of the heat dissipation layers is two, and the two heat dissipation layers are respectively stacked on the protection layer and the flexible substrate, and the heat dissipation layer and the circuit layer are respectively located on two opposite sides of the protection layer.
3. The circuit board of claim 1, wherein the thermal conductivity of the heat spreading layer is greater than the thermal conductivity of the flexible substrate.
4. The circuit board of claim 1, wherein the area of the heat spreading layer is greater than or equal to 1.875 times the area of the at least one printed electronic component.
5. The circuit board of claim 1, wherein the heat spreading layer has a thickness of 1 μm or more.
6. The circuit board of claim 1, wherein the material of the heat dissipation layer is metal oxide, ceramic, graphene, silicon dioxide, silica gel, or polymer.
7. The circuit board of claim 1, wherein the heat spreader layer is printed, sprayed, showered, attached, plated, sputtered, electroplated or electroless plated on the flexible substrate or the passivation layer.
8. The circuit board of claim 1, wherein the circuit layer is made of conductive ink.
9. The circuit board of claim 1, wherein the at least one printed electronic component has a thickness of 1000 microns or less.
10. The circuit board of claim 1, wherein the flexible substrate has a thickness of 750 μm or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811135842.2A CN110972386A (en) | 2018-09-28 | 2018-09-28 | Circuit board suitable for printed electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811135842.2A CN110972386A (en) | 2018-09-28 | 2018-09-28 | Circuit board suitable for printed electronic component |
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| Publication Number | Publication Date |
|---|---|
| CN110972386A true CN110972386A (en) | 2020-04-07 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811135842.2A Pending CN110972386A (en) | 2018-09-28 | 2018-09-28 | Circuit board suitable for printed electronic component |
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| CN (1) | CN110972386A (en) |
Citations (4)
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| US20060086619A1 (en) * | 2004-10-26 | 2006-04-27 | Seiko Epson Corporation | Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment |
| CN101321440A (en) * | 2007-06-08 | 2008-12-10 | Smk株式会社 | Circuit pattern design method using conductive coating paint and printed circuit board |
| CN201426214Y (en) * | 2009-03-23 | 2010-03-17 | 沈李豪 | PCB with radiating structure having heat-conducting and heat-radiating printing ink |
| TW201804878A (en) * | 2016-07-20 | 2018-02-01 | 斯天克有限公司 | Flexible printed circuit boards and method for fabricating the same |
-
2018
- 2018-09-28 CN CN201811135842.2A patent/CN110972386A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060086619A1 (en) * | 2004-10-26 | 2006-04-27 | Seiko Epson Corporation | Method of forming conductive pattern, wiring substrate, electronic device and electronic equipment |
| CN101321440A (en) * | 2007-06-08 | 2008-12-10 | Smk株式会社 | Circuit pattern design method using conductive coating paint and printed circuit board |
| CN201426214Y (en) * | 2009-03-23 | 2010-03-17 | 沈李豪 | PCB with radiating structure having heat-conducting and heat-radiating printing ink |
| TW201804878A (en) * | 2016-07-20 | 2018-02-01 | 斯天克有限公司 | Flexible printed circuit boards and method for fabricating the same |
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Application publication date: 20200407 |