CN110971727A - Electronic device - Google Patents
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- CN110971727A CN110971727A CN201911252980.3A CN201911252980A CN110971727A CN 110971727 A CN110971727 A CN 110971727A CN 201911252980 A CN201911252980 A CN 201911252980A CN 110971727 A CN110971727 A CN 110971727A
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- temperature sensor
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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Abstract
The embodiment of the application provides electronic equipment. The electronic equipment comprises a shell, a connecting wire, a first temperature sensor and a processor, wherein the shell comprises a through hole; the connecting wire penetrates through the through hole; the first temperature sensor is arranged on the outer surface of the shell; the processor is arranged in the shell, the processor penetrates through the through hole, the connecting line is electrically connected with the first temperature sensor, and the processor is used for acquiring a first temperature value acquired by the first temperature sensor. Through setting up the first temperature sensor at electronic equipment's shell surface, can directly acquire the first temperature value with the shell surface of user's contact, first temperature sensor transmits the first temperature value of its collection for the treater through the connecting wire that sets up in the casing through-hole, and the treater can acquire the first temperature value of accurate shell surface.
Description
Technical Field
The present application relates to the field of electronic technologies, and in particular, to an electronic device.
Background
At present, electronic equipment such as handheld equipment like mobile phones is smaller and smaller, the integration level is higher and higher, and the functions provided by the electronic equipment are more and more powerful, so that the problem of heat generation in the electronic equipment is more and more serious, and the electronic equipment needs to control the temperature of the electronic equipment to protect the electronic equipment and prevent users from being scalded. The electronic device is in contact with the user, namely, the temperature of the electronic device shell has the greatest influence on the user. The electronic equipment obtains the temperature inside the electronic equipment, and then the temperature of the shell is calculated by combining a preset formula measured in a laboratory, the electronic equipment shares the problem that the shell is calculated by using the preset formula under different environments, and the calculated temperature of the shell is inaccurate under many environments.
Disclosure of Invention
The embodiment of the application provides an electronic device, which can more accurately acquire the temperature of an electronic device shell.
An embodiment of the present application provides an electronic device, which includes:
a housing including a through hole;
the connecting wire penetrates through the through hole;
the first temperature sensor is arranged on the outer surface of the shell;
the processor is arranged in the shell and penetrates through the through hole, the connecting line is electrically connected with the first temperature sensor and used for acquiring a first temperature value acquired by the first temperature sensor.
In the embodiment of the application, through setting up the first temperature sensor at electronic equipment's shell surface, can directly acquire the first temperature value with the shell surface of user's contact, first temperature sensor transmits the first temperature value of its collection for the treater through the connecting wire that sets up in the casing through-hole, and the treater can acquire the first temperature value of accurate shell surface.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
Fig. 1 is a first structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 3 is a third schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 4 is a fourth schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 5 is a fifth structural schematic diagram of an electronic device according to an embodiment of the present application.
Fig. 6 is a schematic structural diagram of a first temperature sensor and a processor of an electronic device according to an embodiment of the present application.
Fig. 7 is a sixth schematic structural diagram of an electronic device according to an embodiment of the present application.
Fig. 8 is a seventh structural schematic diagram of an electronic device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without inventive step, are within the scope of the present application.
The embodiment of the application provides electronic equipment. The electronic device may be a smart phone, a tablet computer, or other devices, and may also be a game device, an AR (Augmented Reality) device, an automobile device, a data storage device, an audio playing device, a video playing device, a notebook computer, a desktop computing device, or other devices.
In order to improve the heat generation of the electronic device, the temperature of the electronic device is controlled within a reasonable range, and various schemes can be adopted. Some of these solutions are directed to controlling the heat generation of the processor of the electronic device, and some require control depending on the temperature of the outer surface of the housing of the electronic device. Since the skin of the user directly contacts the outer surface of the housing of the electronic device during the use of the electronic device, and the sensed temperature is also the outer surface temperature of the housing of the electronic device, it is necessary to acquire the outer surface temperature of the housing of the electronic device and control the heat generating source (a functional module with serious heat generation) of the electronic device according to the outer surface temperature of the housing of the electronic device.
The electronic equipment provided by the embodiment of the application can acquire the accurate temperature of the outer surface of the shell of the electronic equipment. Taking an electronic device as a mobile phone as an example, please refer to fig. 1, and fig. 1 is a schematic view of a first structure of the electronic device according to an embodiment of the present disclosure. The electronic device 10 includes a housing 120, a connecting wire 140, a first temperature sensor 160, and a processor 180.
The housing 120 of the electronic device 10 may include a through hole 122; the through hole 122 may penetrate the housing 120, and it is also understood that the through hole 122 communicates the inside and the outside of the electronic apparatus 10.
The connection line 140 passes through the through hole 122, and the connection line 140 may be a conductive line.
The first temperature sensor 160 may be a thermocouple temperature sensor, a thermal resistance temperature sensor, or the like. For example, the temperature sensor may be a negative temperature coefficient resistor (NTC resistor). The first temperature sensor 160 is disposed on the outer surface 124 of the housing 120, and the first temperature sensor 160 can be used to obtain a first temperature value of the outer surface 124 of the housing 120 (e.g., a temperature value of the outer surface 124 of the housing 120).
The processor 180 is disposed in the housing 120, and the processor 180 is electrically connected to the first temperature sensor 160 through the connecting line 140 passing through the through hole 122, and is configured to obtain a first temperature value collected by the first temperature sensor 160.
The electronic device 10 of the present embodiment can acquire the first temperature value of the outer surface 124 of the housing 120 through the first temperature sensor 160 under different environments, the first temperature sensor 160 transmits the acquired first temperature value to the processor 180 of the electronic device 10 through the connection line 140 penetrating through the housing 120, so as to provide an accurate first temperature value of the outer surface 124 of the housing 120, and the electronic device 10 can acquire an accurate first temperature value of the outer surface 124 of the housing 120 through the connection line 140 penetrating through the housing 120.
Referring to fig. 2, fig. 2 is a second structural schematic diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 10 further includes a function module 182 disposed in the housing 120, wherein the function module 182 is electrically connected to the processor 1820. Processor 180 is also configured to change an operating parameter of function module 182 to decrease the first temperature value when the first temperature value exceeds the temperature threshold.
Specifically, after the processor 180 of the electronic device 10 accurately obtains the first temperature value of the outer surface 124 of the housing 120, the temperature of the electronic device 10 can be controlled according to the first temperature value. For example, after the first temperature value exceeds the temperature threshold, the processor 180 may reduce power consumption of a part of the functional module 182 in the electronic device 10, so as to reduce heat generation in the electronic device 10 and reduce the temperature of the electronic device 10. The functional module 182 may be at least one of a main Chip (CPU), an image processing chip (GPU), a display screen, and the like. For example, the processor may reduce the operating frequency of the main Chip (CPU), the image processing chip (GPU), reduce the brightness and frame rate of the display screen, and so on.
In some embodiments, in order to obtain the temperature of the outer surface of the casing of the electronic device, a plurality of temperature sensors (NTC sensors) may be disposed on the main board of the electronic device, and these temperature sensors are close to the heat generating source inside the electronic device, and may be approximately regarded as the temperature of the casing of the electronic device. The temperature sensors are connected to a processor of the electronic device through connecting wires, and the processor of the electronic device can read the values of the temperature sensors so as to obtain temperature values.
The temperature of the electronic equipment acquired through the temperature sensor on the mainboard can only represent the temperature of the mainboard of the electronic equipment, and when the temperature of the outer surface of the shell of the electronic equipment needs to be accurately controlled, if the temperature of the mainboard is adopted, a large difference value exists in practice, and the condition of inaccurate control can be caused.
Therefore, a scheme of fitting the temperature of the outer surface of the shell can be adopted to obtain the temperature of the outer surface of the shell of the electronic device more accurately. The core thought is that a plurality of temperature sensors are added on the electronic equipment mainboard, each temperature sensor can acquire the temperature of one position in the electronic equipment, certain correlation exists between the temperature of the outer surface of the shell and the temperature acquired by the temperature sensors on the electronic equipment mainboard, and the correlation can be linear. And (4) fitting through some conventional algorithms, namely finally obtaining the outer surface temperature of the shell of the electronic equipment through the numerical value of the temperature sensor. The expression for a common fitting algorithm is:
T＝a0+a1x1+a2x2+..+anxn
wherein T is the outer surface temperature of the shell of the electronic equipment, xnIs the temperature of the nth temperature sensor, anIs the coefficient of the nth temperature sensor. In order to obtain a relatively accurate temperature of the outer surface of the housing, the coefficients need to be sufficiently accurate in addition to ensuring sufficient accuracy of the temperature sensor. Coefficient acquisition here is generally not calculated, but by a fitting algorithm.
The fitting process is that a thermocouple is pasted at the hottest heating point on the outer surface of the shell of the electronic equipment, and the temperature of the thermocouple can be read by a computer. In addition, the temperature on the mainboard of the electronic equipment can be directly read by a program in the electronic equipment. The actual temperature of the outer surface of the shell corresponds to the temperature of the main board temperature sensor according to a time relation, and then each coefficient value can be calculated by adopting a linear fitting mode.
When the program in the electronic device wants to acquire the temperature of the outer surface of the shell, a relatively accurate value can be obtained by calculating the coefficient value and the temperature of the mainboard temperature sensor.
However, temperature fitting needs to acquire enough data to fit accurate temperature parameters, and because the existing fitting original data depends on computer acquisition and electronic equipment acquisition, the fitting original data is limited to be acquired only in a laboratory environment in most cases, and the fitting parameters calculated through the data acquired in the laboratory can be inaccurate when being applied to an actual scene.
In the embodiment of the present application, an accurate coefficient can be obtained, specifically referring to fig. 3, and fig. 3 is a third schematic structural diagram of an electronic device provided in the embodiment of the present application. The electronic device 10 further includes a second temperature sensor 162 located in the housing 120, the second temperature sensor 162 is electrically connected to the processor 180, the processor 180 is configured to obtain a second temperature value acquired by the second temperature sensor 162, the processor 180 is further configured to calculate a conversion coefficient according to the first temperature value and the second temperature value, and the second temperature value can be calculated to obtain the first temperature value through the conversion coefficient.
The electronic device 10 may calculate a conversion coefficient between the first temperature sensor 160 and the second temperature sensor 162 during the test. When the electronic device 10 without the first temperature sensor 160 calculates the first temperature value of the outer surface 124 of the housing 120 accurately by the second temperature sensor 162 and the conversion coefficient in the housing 120. It should be noted that, in this embodiment, the obtaining of the conversion coefficient may be implemented without an additional computer or other electronic device 10, so that the electronic device 10 in this embodiment may not only obtain the conversion system through testing in a laboratory, but also obtain different conversion coefficients through testing in different scenarios, so as to obtain a plurality of conversion coefficients under multiple scenarios, multiple time periods, and multiple operating environments through testing, and store the plurality of conversion coefficients in the electronic device 10 to obtain a mapping table. For example, a conversion system corresponds to the outdoor environment, another conversion coefficient corresponds to the indoor environment, and for example, scenes such as walking, running, sitting on a subway, sitting on a bus, sitting on a train and the like all correspond to one conversion system, and a conversion coefficient can correspond to different operation environments of the electronic device 10 in different time periods in the same scene. It will be appreciated that the scenario, time period, and environment in which the electronic device 10 operates can be combined to provide a very large number of conversion systems, and that in various situations (scenario, time period, and environment) the first temperature value of the external surface 124 of the housing 120 can be accurately calculated from the second temperature sensor 162 within the electronic device 10. It is difficult to obtain such a large number of conversion factors from laboratory testing, or the conversion factors obtained from laboratory testing are in many cases inaccurate.
The quantity of second temperature sensor can be a plurality of, and a plurality of second temperature sensor intervals set up in the casing, and a plurality of second temperature sensor acquire a plurality of second temperature values, and a plurality of second temperature sensor all with treater electric connection, the treater is used for calculating according to first temperature value and a plurality of second temperature value and obtains a plurality of conversion coefficient, and wherein, each temperature sensor corresponds conversion coefficient, and a plurality of second temperature values calculate through a plurality of conversion coefficients and obtain first temperature value. The first temperature value obtained by calculation through one second temperature sensor and one conversion coefficient is easy to generate larger errors, and more accurate first temperature values can be obtained through a plurality of second temperature sensors at different positions in the electronic equipment and the conversion coefficient corresponding to each second temperature sensor. Meanwhile, the electronic equipment is prevented from being influenced by external factors, such as holding by a user, an interference heat source outside, shielding of the electronic equipment and the like, and the accuracy of the first temperature value can be prevented from being influenced by interference of single data through the plurality of second temperature sensors and the plurality of conversion coefficients.
The conversion coefficient can be obtained by calculating the first temperature value and the second temperature value in the embodiment, and other electronic equipment can be not provided with the through hole and can obtain the first temperature value of the outer surface of the shell by calculating the second temperature value and the conversion coefficient. In order to make the calculated first temperature value of other electronic devices more accurate, please continue to refer to fig. 1, the through hole 122 of the electronic device in this embodiment is spaced from the first temperature sensor 160. The through hole 122 is arranged at a distance from the first temperature sensor 160, heat in the shell 120 relative to the first temperature sensor 160 is not easily dissipated from the through hole 122, the environment of the electronic device with the through hole 122 is approximately the same as that of the electronic device without the through hole, the conversion coefficient obtained by testing and calculating the electronic device with the through hole 122 is also suitable for the electronic device without the through hole 122, the difference between the two electronic devices due to heat dissipation of the through hole 122 is avoided, and the first temperature value of the outer surface of the shell 120 obtained by calculating the conversion coefficient by the electronic device without the through hole is basically equal to the actual temperature value.
The connecting wire 140 may be interference fit with the through hole 122. The connection line 140 is in interference fit with the through hole 122, there is no gap between the connection line 140 and the through hole 122, and the temperature inside the housing 120 and the temperature on the outer surface of the housing 120 are not or are not very different due to the through hole 122.
In order to facilitate the connection wire 140 to pass through the through hole 122, a gap is formed between the connection wire 140 and the through hole 122. Or it is difficult to seal the connection line 140 and the through hole 122, a filler 142 may be further disposed in the first through hole 122, and the filler 142 may fill a gap between the through hole 122 and the connection line 140. That is, the housing 120 includes a sidewall forming the through hole 122, and a filler 142 is further disposed in the first through hole 122, wherein the filler 142 fills a gap between the sidewall and the connection line 140. It is achieved that the temperature inside the housing 120, the temperature of the outer surface of the housing 120 are not or not very different by the through holes 122.
Wherein the thermal conductivity of the filler 142 is less than or equal to the thermal conductivity of the housing 120. Thus, the electronic device with the via 122 has the same or similar environment as the electronic device without the via 122, and the data tested by the electronic device with the via 122 is very close to the data of the electronic device without the via 122. The filling body 142 may be a material having elasticity, and after the connection line 140 passes through the gap between the filling bodies 142, the filling body 142 fills the gap between the connection line 140 and the sidewall. The filling body 142 may also be formed by colloid, that is, after the connecting wire 140 passes through the through hole 122, the through hole 122 is filled with colloid, and the filling body 142 is formed after the colloid is solidified.
The through-holes 122 may not need to be additionally provided, but may utilize existing through-holes 122, such as the through-holes 122 for mounting the case module, as shown in fig. 4. The through hole 122 can also be used for generating sound holes, as shown in fig. 5, the existing through hole 122 is fully utilized, and the obtained conversion coefficient is more effective when the electronic device has the same environment as the electronic device without the through hole 122, that is, the first temperature value obtained by calculating the second temperature value and the conversion coefficient is very close to the actual temperature, even the actual temperature is equal.
The connecting wire comprises an insulating protective layer, and the thermal conductivity of the protective layer is smaller than or equal to that of the shell. The thermal conductivity of the protective layer at the outermost layer of the connecting wire is less than or equal to that of the shell, so that the electronic equipment with the through hole has the same or similar environment with the electronic equipment without the through hole, and the data obtained by testing the electronic equipment with the through hole is very close to that of the electronic equipment without the through hole.
Referring to fig. 6, fig. 6 is a schematic structural diagram of a first temperature sensor and a processor of an electronic device according to an embodiment of the present disclosure. The first temperature sensor 160 includes a power pin VDD, a ground pin GND and a data pin DQ, the number of the corresponding connecting wires 140 connected to the first temperature sensor 160 is also three, and the power pin, the ground pin and the data pin are all connected to the processor through one connecting wire 140. The three connecting wires 140 can be independently arranged and parallelly pass through the through holes 122, so that the arrangement is convenient. The three connecting wires 140 may also be provided within a larger protective layer to prevent heat from escaping from the gaps between the three connecting wires 140. The power pin of the processor 180 may be electrically connected to the power pin VDD of the first temperature sensor 160, the ground pin of the processor 180 may be electrically connected to the ground pin GND of the first temperature sensor 160, and the GPIO pin of the processor 180 may be electrically connected to the data pin DQ of the first temperature sensor 160.
Referring to fig. 7, fig. 7 is a schematic view illustrating a sixth structure of an electronic device according to an embodiment of the present disclosure. The electronic device 10 may further include a heat generating module 126 located in the housing 120, where the heat generating module 126 generates heat to raise the ambient temperature, and the heat generating module 126 may be understood as a heat generating source in the electronic device 10. The heat generation module 126 may be a main Chip (CPU), an image processing chip (GPU), or the like. The temperature of the outer surface 124 of the housing 120 of the electronic device 10 is mainly influenced by the heat generating module 126, the orthographic projection of the heat generating module 126 on the outer surface 124 of the housing 120 at least partially coincides with the first temperature sensor 160, and the highest temperature of the outer surface 124 of the housing 120 can be obtained by obtaining the temperature of the outer surface 124 of the housing 120 through the first temperature sensor 160 at least partially arranged opposite to the heat generating module 126.
Please refer to fig. 8, wherein fig. 8 is a schematic diagram illustrating a seventh structure of an electronic device according to an embodiment of the present disclosure. The electronic device 10 further includes a display screen 110, the display screen 110 is electrically connected to the processor 180, and the display screen 110 is configured to display the first temperature value obtained by the processor 180.
The electronic device 10 may also display a first temperature value via the display screen 110, the first temperature value being a temperature of an outer surface 124 of the housing 120 of the electronic device 10. When the first temperature sensor 160 is disposed opposite the heat generating module 126 within the housing 120, the first temperature sensor 160 detects primarily the temperature of the heat generating module 126 within the housing 120. When the first temperature sensor 160 is not disposed opposite the heat generating module 126 in the housing 120, the first temperature value collected by the first temperature sensor 160 may be an ambient temperature, and the display screen 110 displays the ambient temperature. If the housing 120 is made of a high thermal conductive material (e.g., a metal housing 120), the first temperature sensor 160 for collecting the ambient temperature may be disposed at some special positions of the housing 120, where the special positions are low thermal conductive areas, such as a flash lamp, an infrared sensor, and a distance sensor. In some electronic devices 10, when the housing 120 needs to be provided with a bezel antenna, it needs to be broken at the bezel portion and filled with low thermal conductive plastic, and the first temperature sensor 160 can also be used to fill the housing 120 with the low thermal conductive plastic. It should be noted that the display screen 110 may also display the second temperature value and/or the conversion coefficient, so as to facilitate the user to know the temperature condition inside the electronic device 10.
The number of the first temperature sensors in the above embodiments may be multiple, and multiple first temperature sensors are correspondingly disposed above the heat generating module. The first temperature value may be a temperature value with a highest temperature among the plurality of first temperature sensors, or a temperature value obtained by weighted calculation of the temperature values of the plurality of first temperature sensors.
The electronic device in the above-described embodiment may be applied in a test phase, i.e. for obtaining the conversion coefficients. The electronic device of the embodiment can also be applied to the normal use stage of the user, and the first temperature value of the outer surface of the shell is directly obtained through the first temperature sensor arranged on the outer surface of the shell.
It should be noted that the processor in the above embodiments may be a main chip of the electronic device, and may also be another chip.
It is understood that the first temperature sensor may be disposed at the outermost side of the housing, or may be disposed at the outer surface of the housing and then covered with a protective layer, such as a paint layer.
With continued reference to fig. 8, the electronic device 10 may further include a circuit board 82 and a battery 84. The housing 120 includes a middle frame, the middle frame includes a frame and a middle plate, the middle plate is located in the middle of the frame, and the middle plate may have a thin plate-like or sheet-like structure or a hollow frame structure. The middle frame is used for providing a supporting function for the electronic elements or functional components in the electronic device 10 so as to mount the electronic elements or functional components in the electronic device 10 together.
Wherein the middle frame and the rear cover may together form a housing of the electronic device 10 for accommodating or mounting electronic elements, functional components, etc. of the electronic device. For example, the display screen 110 may be mounted on the housing. In addition, functional components such as a camera, a receiver, a circuit board, a battery, and the like of the electronic apparatus may be mounted on the center frame for fixation. It is understood that the material of the middle frame may include metal or plastic.
The display screen 110 may be mounted on the center frame and form a display surface of the electronic device 10 for displaying images, text, and other information. The Display screen 110 may include a Liquid Crystal Display (LCD) or an Organic Light-Emitting Diode (OLED) Display screen.
It is understood that a cover plate may also be disposed on the display screen 110. The cover plate covers the display screen 110 to protect the display screen 110 and prevent the display screen 110 from being scratched or damaged by water. Wherein the cover may be a clear glass cover so that a user may view the information displayed by the display screen 110 through the cover. For example, the cover plate may be a glass cover plate of sapphire material.
The circuit board 82 may be mounted on the middle frame. The circuit board 82 may be a motherboard of the electronic device 10. One or more of the functional components such as a microphone, a speaker, a receiver, an earphone interface, a camera, an acceleration sensor, a gyroscope, a temperature sensor, and a processor may be integrated on the circuit board 82. Meanwhile, the display screen 110 may be electrically connected to the circuit board 82 to control the display of the display screen 110 by a processor on the circuit board 82.
The battery 84 may be mounted on the center frame. Meanwhile, the battery 84 is electrically connected to the circuit board 82 to enable the battery 84 to power the electronic device 10. Among them, the circuit board 82 may be provided with a power management circuit thereon. The power management circuitry is used to distribute the voltage provided by the battery 84 to the various electronic components in the electronic device 10.
The rear cover may be integrally formed. In the molding process of the rear cover, a rear camera hole and other structures can be formed on the rear cover.
In the description of the present application, it is to be understood that terms such as "first", "second", and the like are used merely to distinguish one similar element from another, and are not to be construed as indicating or implying relative importance or implying any indication of the number of technical features indicated.
The electronic device provided by the embodiment of the application is described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (13)
1. An electronic device, comprising:
a housing including a through hole;
the connecting wire penetrates through the through hole;
the first temperature sensor is arranged on the outer surface of the shell;
the processor is arranged in the shell and penetrates through the through hole, the connecting line is electrically connected with the first temperature sensor and used for acquiring a first temperature value acquired by the first temperature sensor.
2. The electronic device according to any one of claims 1, further comprising a second temperature sensor located in the housing, wherein the second temperature sensor is electrically connected to the processor, the processor is configured to obtain a second temperature value collected by the second temperature sensor, the processor is further configured to calculate a conversion coefficient according to the first temperature value and the second temperature value, and the second temperature value is calculated by the conversion coefficient to obtain the first temperature value.
3. The electronic device according to claim 2, wherein the number of the second temperature sensors is plural, the plural second temperature sensors are disposed in the housing at intervals, the plural second temperature sensors obtain plural second temperature values, the plural second temperature sensors are all electrically connected to the processor, and the processor is configured to calculate a plurality of conversion coefficients according to the first temperature value and the plural second temperature values, wherein each of the temperature sensors corresponds to a conversion coefficient, and the plural second temperature values calculate the first temperature value through the plural conversion coefficients.
4. The electronic device of any of claims 1-3, wherein the through-hole is spaced apart from the first temperature sensor.
5. The electronic device of any of claims 1-3, wherein the connecting wire is in an interference fit with the through hole.
6. The electronic device according to any one of claims 1 to 3, wherein the housing includes a sidewall forming the through hole, and a filler is further disposed in the first through hole, and the filler fills a gap between the sidewall and the connection line.
7. The electronic device of claim 6, wherein the thermal conductivity of the filler is less than or equal to the thermal conductivity of the housing.
8. The electronic device of any of claims 1-3, wherein a key module is mounted in the through hole.
9. The electronic device of any of claims 1-3, comprising a heat generating module located within the housing, wherein a orthographic projection of the heat generating module on the housing outer surface at least partially coincides with the first temperature sensor.
10. The electronic device according to any of claims 1-3, wherein the connection line comprises an insulating protective layer having a thermal conductivity less than or equal to a thermal conductivity of the housing.
11. The electronic device according to any one of claims 1-3, wherein the number of the connecting lines is three, the first temperature sensor includes a power pin, a ground pin, and a data pin, and the power pin, the ground pin, and the data pin are all electrically connected to the processor through one of the connecting lines.
12. The electronic device of any of claim 1, comprising a functional module located within the housing, the functional module electrically connected to the processor, the processor further configured to change an operating parameter of the functional module to lower the first temperature value when the first temperature value exceeds a temperature threshold.
13. The electronic device of claim 1, further comprising a display screen electrically connected to the processor, wherein the display screen is configured to display the first temperature value obtained by the processor.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111552333A (en) * | 2020-06-16 | 2020-08-18 | Oppo广东移动通信有限公司 | Temperature control system, temperature control method, electronic device, and storage medium |
| CN111596745A (en) * | 2020-05-13 | 2020-08-28 | 歌尔科技有限公司 | Temperature detection device, method and system and electronic equipment |
| WO2024139838A1 (en) * | 2022-12-30 | 2024-07-04 | 华为技术有限公司 | Electronic device and material coating method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104914944A (en) * | 2014-03-14 | 2015-09-16 | 联想(北京)有限公司 | Information processing method and electronic equipment |
| CN105549651A (en) * | 2015-11-06 | 2016-05-04 | 东莞酷派软件技术有限公司 | User terminal and temperature control method |
| CN205656548U (en) * | 2016-04-26 | 2016-10-19 | 广东欧珀移动通信有限公司 | Mobile terminal's apron subassembly and mobile terminal |
| CN206431521U (en) * | 2016-09-07 | 2017-08-22 | 广东虹勤通讯技术有限公司 | Terminal device |
| JP2018113513A (en) * | 2017-01-06 | 2018-07-19 | 京セラ株式会社 | Electronic apparatus |
| CN110411598A (en) * | 2019-07-30 | 2019-11-05 | Oppo广东移动通信有限公司 | The detection method of electronic equipment, thermocouple temperature measurement piece and battery temperature |
-
2019
- 2019-12-09 CN CN201911252980.3A patent/CN110971727B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104914944A (en) * | 2014-03-14 | 2015-09-16 | 联想(北京)有限公司 | Information processing method and electronic equipment |
| CN105549651A (en) * | 2015-11-06 | 2016-05-04 | 东莞酷派软件技术有限公司 | User terminal and temperature control method |
| CN205656548U (en) * | 2016-04-26 | 2016-10-19 | 广东欧珀移动通信有限公司 | Mobile terminal's apron subassembly and mobile terminal |
| CN206431521U (en) * | 2016-09-07 | 2017-08-22 | 广东虹勤通讯技术有限公司 | Terminal device |
| JP2018113513A (en) * | 2017-01-06 | 2018-07-19 | 京セラ株式会社 | Electronic apparatus |
| CN110411598A (en) * | 2019-07-30 | 2019-11-05 | Oppo广东移动通信有限公司 | The detection method of electronic equipment, thermocouple temperature measurement piece and battery temperature |
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| CN111596745A (en) * | 2020-05-13 | 2020-08-28 | 歌尔科技有限公司 | Temperature detection device, method and system and electronic equipment |
| CN111596745B (en) * | 2020-05-13 | 2022-03-01 | 歌尔科技有限公司 | Temperature detection device, method and system and electronic equipment |
| CN111552333A (en) * | 2020-06-16 | 2020-08-18 | Oppo广东移动通信有限公司 | Temperature control system, temperature control method, electronic device, and storage medium |
| WO2024139838A1 (en) * | 2022-12-30 | 2024-07-04 | 华为技术有限公司 | Electronic device and material coating method |
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