CN110948573A - Annular high-viscosity double-sided adhesive die cutting process - Google Patents
Annular high-viscosity double-sided adhesive die cutting process Download PDFInfo
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- CN110948573A CN110948573A CN201911394660.1A CN201911394660A CN110948573A CN 110948573 A CN110948573 A CN 110948573A CN 201911394660 A CN201911394660 A CN 201911394660A CN 110948573 A CN110948573 A CN 110948573A
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- die
- cutting
- die cutting
- sided adhesive
- adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26F—PERFORATING; PUNCHING; CUTTING-OUT; STAMPING-OUT; SEVERING BY MEANS OTHER THAN CUTTING
- B26F1/00—Perforating; Punching; Cutting-out; Stamping-out; Apparatus therefor
- B26F1/38—Cutting-out; Stamping-out
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B26—HAND CUTTING TOOLS; CUTTING; SEVERING
- B26D—CUTTING; DETAILS COMMON TO MACHINES FOR PERFORATING, PUNCHING, CUTTING-OUT, STAMPING-OUT OR SEVERING
- B26D7/00—Details of apparatus for cutting, cutting-out, stamping-out, punching, perforating, or severing by means other than cutting
- B26D7/18—Means for removing cut-out material or waste
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- Life Sciences & Earth Sciences (AREA)
- Forests & Forestry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Adhesive Tapes (AREA)
Abstract
The invention provides an annular high-viscosity double-sided adhesive die-cutting process, which comprises the following steps: s1, carrying out primary die cutting on the adhesive layer to form the outer contour of the product, and reserving the whole adhesive area of the high-viscosity double-sided adhesive tape; and S2, compounding the release layer on the adhesive layer subjected to the primary die cutting, positioning the adhesive layer and the release layer by taking the positioning hole as a reference, performing secondary die cutting on the adhesive layer and the release layer, wherein the secondary die cutting penetrates through the release layer and the adhesive layer to form the inner contour of the product, and waste materials formed by the secondary die cutting are discharged in an automatic blanking mode. The annular high-viscosity double-sided adhesive die-cutting process has the advantages of no displacement and no warping by firstly cutting the appearance to leave a whole block of adhesive area. Meanwhile, the inner hole is subjected to a blanking process, and inner hole waste materials do not need to be removed in a lifting mode, so that the problems of deformation or local displacement and the like caused by small annular edges are solved.
Description
Technical Field
The invention relates to the technical field of die cutting processing, in particular to a die cutting process for annular high-viscosity double-sided adhesive.
Background
Currently, the adhesive product used in many electronic products is a ring-shaped high-viscosity foam cotton adhesive. In the existing production and manufacturing processes of the product, an inner hole is cut firstly, and then the appearance is cut. However, in the above process, the product has a small single edge, and the tape cannot be made of a material with too high release force (the too high release force may cause reverse release), which results in the problems of product size, displacement or deformation. Therefore, it is necessary to provide a further solution to the above problems.
Disclosure of Invention
The invention aims to provide an annular high-viscosity double-sided adhesive die-cutting process to overcome the defects in the prior art.
In order to solve the technical problems, the technical scheme of the invention is as follows:
a die-cutting process of annular high-viscosity double-sided adhesive comprises the following steps:
s1, carrying out primary die cutting on the adhesive layer to form the outer contour of the product, and reserving the whole adhesive area of the high-viscosity double-sided adhesive tape;
and S2, compounding the release layer on the adhesive layer subjected to the primary die cutting, positioning the adhesive layer and the release layer by taking the positioning hole as a reference, performing secondary die cutting on the adhesive layer and the release layer, wherein the secondary die cutting penetrates through the release layer and the adhesive layer to form the inner contour of the product, and waste materials formed by the secondary die cutting are discharged in an automatic blanking mode.
As an improvement of the die cutting process of the annular high-viscosity double-sided adhesive, the adhesive layer is subjected to primary die cutting through a first cutting die, and the first cutting die comprises: a first blade adapted to form an outer profile of the product when die cut.
As an improvement of the annular high-viscosity double-sided adhesive die-cutting process, the first cutting dies are arranged in a plurality, and the first cutting dies are arranged at intervals according to the conveying direction of the product material belt.
As an improvement of the die cutting process of the annular high-viscosity double-sided adhesive, the positioning holes are formed in a mode of being sleeved with the first-time die cutting.
As an improvement of the die cutting process of the annular high-viscosity double-sided adhesive, the positioning holes are distributed at two sides of the whole adhesive area.
As an improvement of the die cutting process of the annular high-viscosity double-sided adhesive, the number of the positioning holes on any side is two.
As an improvement of the die cutting process of the annular high-viscosity double-sided adhesive, the adhesive layer and the release layer are subjected to secondary die cutting through a second cutting die, and the second cutting die comprises: a second blade adapted to form an inner profile of the product when die cut.
As an improvement of the die cutting process of the annular high-viscosity double-sided adhesive tape, the number of the second cutting dies is multiple, and the second cutting dies are arranged at intervals according to the conveying direction of the product material tape.
Compared with the prior art, the invention has the beneficial effects that: the annular high-viscosity double-sided adhesive die-cutting process has the advantages of no displacement and no warping by firstly cutting the appearance to leave a whole block of adhesive area. Meanwhile, the inner hole is subjected to a blanking process, and inner hole waste materials do not need to be removed in a lifting mode, so that the problems of deformation or local displacement and the like caused by small annular edges are solved. The method has the advantages of reducing the waste discharge caused by high viscosity, reducing the displacement and deformation caused by small size, reducing the processing difficulty, improving the yield and the like.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an annular high-tack double-sided adhesive product according to an embodiment of the present invention;
FIG. 2 is a die diagram of a first die in accordance with an embodiment of the present invention;
fig. 3 is a die diagram of a second die in an embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1, the present embodiment relates to an annular high-adhesion double-sided adhesive tape product, which has an annular high-adhesion double-sided adhesive tape a, a release layer b on one side of the adhesive tape, and a material-carrying layer c on the other side of the adhesive tape.
The processing technology of the embodiment comprises the following steps:
and S1, carrying out primary die cutting on the adhesive layer to form the outer contour of the product, and reserving the whole adhesive area of the high-viscosity double-sided adhesive tape.
As shown in fig. 2, regarding step S1, in one embodiment, the first cutting die 1 is used to perform a first die cutting on the adhesive layer, and the first cutting die 1 includes: a first blade 11 adapted to form the outer contour of the product when die-cut. In the present embodiment, the first blade 11 has a substantially closed rectangular blade shape. Thus, in step S1, the whole glue area is left by cutting the outline first, which has the advantages of no displacement and no warping.
Meanwhile, according to actual requirements, the first cutting dies 1 can be arranged in a plurality of numbers, and the first cutting dies 1 are arranged at intervals in the conveying direction of the product material belt. For example, as shown in fig. 2, four first cutting dies 1 of the above-described structure may be provided.
And S2, compounding the release layer on the adhesive layer subjected to the primary die cutting, positioning the adhesive layer and the release layer by taking the positioning hole as a reference, performing secondary die cutting on the adhesive layer and the release layer, wherein the secondary die cutting penetrates through the release layer and the adhesive layer to form the inner contour of the product, and waste material formed by the secondary die cutting is discharged in an automatic blanking mode.
As shown in fig. 3, in step S2, the positioning holes can improve the precision of the second die cutting. During positioning, the positioning guide pillar 22 on the second cutting die 2 is matched with the positioning hole to realize the positioning. In one embodiment, the positioning holes are formed by punching the first die cutting sleeve with a circular blade. Specifically, the positioning holes are distributed on two sides of the whole glue area, and the number of the positioning holes on any side is two.
In one embodiment, the adhesive layer and the release layer are subjected to secondary die cutting through a second cutting die 2, and the second cutting die 2 includes: a second blade 21 adapted to form the inner contour of the product when die cut. In the present embodiment, the second blade 21 has a substantially closed rectangular shape, and the size of the second blade 21 is smaller than that of the first blade 11 to form a ring-shaped structure. Thus, through step S2, the inner hole is processed by blanking, and inner hole waste materials do not need to be removed in a lifting mode, so that the problems of deformation or local displacement and the like caused by small annular edges are solved.
When the first cutting die 1 is provided in plurality, similarly, the second cutting die 2 is provided in a corresponding manner.
In conclusion, the annular high-viscosity double-sided adhesive die-cutting process has the advantages of no displacement and no warping by firstly cutting the appearance and leaving a whole block of adhesive area. Meanwhile, the inner hole is subjected to a blanking process, and inner hole waste materials do not need to be removed in a lifting mode, so that the problems of deformation or local displacement and the like caused by small annular edges are solved. The method has the advantages of reducing the waste discharge caused by high viscosity, reducing the displacement and deformation caused by small size, reducing the processing difficulty, improving the yield and the like.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (8)
1. The die cutting process for the annular high-viscosity double-sided adhesive is characterized by comprising the following steps of:
s1, carrying out primary die cutting on the adhesive layer to form the outer contour of the product, and reserving the whole adhesive area of the high-viscosity double-sided adhesive tape;
and S2, compounding the release layer on the adhesive layer subjected to the primary die cutting, positioning the adhesive layer and the release layer by taking the positioning hole as a reference, performing secondary die cutting on the adhesive layer and the release layer, wherein the secondary die cutting penetrates through the release layer and the adhesive layer to form the inner contour of the product, and waste materials formed by the secondary die cutting are discharged in an automatic blanking mode.
2. The die cutting process of the annular high-viscosity double-sided adhesive according to claim 1, wherein the adhesive layer is subjected to first die cutting through a first cutting die, and the first cutting die comprises: a first blade adapted to form an outer profile of the product when die cut.
3. The die cutting process for the annular high-viscosity double-sided adhesive according to claim 1 or 2, wherein the first cutting die is arranged in a plurality, and the plurality of first cutting dies are arranged at intervals according to the conveying direction of the product material belt.
4. The die cutting process of annular high-viscosity double-sided adhesive according to claim 1, wherein the positioning holes are formed by being punched in a first time die cutting process.
5. The die cutting process for the annular high-viscosity double-sided adhesive according to claim 1, wherein the positioning holes are distributed on two sides of the whole adhesive area.
6. The die cutting process for annular high-viscosity double-sided adhesive according to claim 5, wherein the number of the positioning holes on either side is two.
7. The die cutting process of the annular high-viscosity double-sided adhesive according to claim 1, wherein the adhesive layer and the release layer are subjected to secondary die cutting by a second cutting die, and the second cutting die comprises: a second blade adapted to form an inner profile of the product when die cut.
8. The die-cutting process of the annular high-viscosity double-sided adhesive according to claim 1 or 7, wherein the second cutting die is arranged in a plurality, and the plurality of second cutting dies are arranged at intervals according to the conveying direction of the product material belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911394660.1A CN110948573A (en) | 2019-12-30 | 2019-12-30 | Annular high-viscosity double-sided adhesive die cutting process |
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| CN201911394660.1A CN110948573A (en) | 2019-12-30 | 2019-12-30 | Annular high-viscosity double-sided adhesive die cutting process |
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| CN110948573A true CN110948573A (en) | 2020-04-03 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113500660A (en) * | 2021-06-25 | 2021-10-15 | 麦格磁电科技（珠海）有限公司 | Differential contour sheet material opposite pasting method |
| CN115157152A (en) * | 2022-08-16 | 2022-10-11 | 深圳安洁电子有限公司 | A supplementary tool for PET material cnc engraving and milling processing |
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| KR100954883B1 (en) * | 2010-01-14 | 2010-04-28 | 김태식 | Apparatus of auto removal |
| JP2013125925A (en) * | 2011-12-16 | 2013-06-24 | Furukawa Electric Co Ltd:The | Wafer processing tape, wafer processing tape manufacturing method and punching rotation blade |
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| CN115157152A (en) * | 2022-08-16 | 2022-10-11 | 深圳安洁电子有限公司 | A supplementary tool for PET material cnc engraving and milling processing |
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Application publication date: 20200403 |