CN110948079B - Double-laser tin soldering combined device and welding method thereof - Google Patents
Double-laser tin soldering combined device and welding method thereof Download PDFInfo
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- CN110948079B CN110948079B CN201911347977.XA CN201911347977A CN110948079B CN 110948079 B CN110948079 B CN 110948079B CN 201911347977 A CN201911347977 A CN 201911347977A CN 110948079 B CN110948079 B CN 110948079B
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/005—Soldering by means of radiant energy
- B23K1/0056—Soldering by means of radiant energy soldering by means of beams, e.g. lasers, E.B.
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses a double-laser soldering combined device, which comprises a base part with three lens barrels, a control system, an A laser system, a B laser system and a wire feeding mechanism, wherein the three lens barrels of the base part are a left shaft lens barrel, a middle shaft lens barrel and a right shaft lens barrel respectively, the control system is arranged in the middle shaft lens barrel and is used for intelligently identifying the size of a bonding pad and carrying out regional temperature detection and soldering parameter control, the A laser system is arranged in the left shaft lens barrel and comprises an A laser soldering head, an A laser spot adjusting mechanism and a focusing mechanism which are sequentially arranged from top to bottom, and the B laser system comprises a B laser system soldering head, a B laser spot adjusting mechanism, a galvanometer mechanism and a field lens which are sequentially arranged from top to bottom, so that soldering work of a bonding pad with an oversized diameter can be carried out.
Description
Technical Field
The invention belongs to the field of laser welding, and particularly relates to a double-laser tin soldering combined device and a double-laser tin soldering method.
Background
Laser welding is replacing traditional welding and is increasingly being widely used. Since the limitation of the spot diameter of the laser beam of the common laser soldering cannot heat the large-size bonding pad and the welding spot at the same time, so that the soldering work of the bonding pad with the ultra-large diameter (the welding spot is larger than 2 mm and the bonding pad is larger than 5 mm) in an automobile electrical appliance, for example, cannot be finished.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides a double-laser soldering combined device and a soldering method thereof, which can perform the soldering work of a bonding pad with an oversized diameter.
In order to achieve the above purpose, the invention adopts the following technical scheme: the utility model provides a double-laser tin soldering's composite set, includes the base member, control system, A laser system, B laser system, the wire feed mechanism that have three lens cone, three lens cone of base member is left axle lens cone, axis lens cone and right side axle lens cone respectively, control system installs in the axis lens cone for intelligent recognition pad size, carry out regional temperature detection and tin soldering parameter control, A laser system installs in the axis lens cone of left side, A laser system includes from the top down the A laser tin bonding head that arranges in proper order, A laser spot adjustment mechanism and focusing mechanism, B laser system includes B laser system tin bonding head, B laser spot adjustment mechanism, galvanometer mechanism and the field lens that from the top down arranged in proper order, wire feed mechanism connects in axis lens cone lower part, A laser system, B laser system, wire feed mechanism all are connected with control system electricity.
In the above technical scheme, the control system comprises an intelligent identification module, a zone temperature detection module and a soldering parameter control module.
In the above technical scheme, the wire feeding mechanism comprises a wire coil, a wire feeding moving mechanism and a wire feeding tube, wherein the wire coil is connected to the wire feeding moving mechanism, the bottom of the wire feeding moving mechanism is connected with the wire feeding tube, and the wire feeding moving mechanism is connected with the lower part of the middle shaft lens barrel.
In the technical scheme, the wire feeding moving mechanism comprises an electric control two-dimensional device, and moves and feeds wires according to wire feeding requirements.
A welding method of a double-laser tin soldering combined device comprises the following steps: the method comprises the following steps:
(1) Setting a welding process code number, including a welding type, a welding parameter number of a laser system A, a working mode of a tin welding head of a laser system B and a welding parameter number;
(2) Confirming the working shape, identifying the current type of the bonding pad, measuring the size of the bonding pad and the size of the welding leg through an intelligent identification module of the control system;
(3) For different welding leg sizes, automatically matching the process code number and the parameter number of the A laser system through a control system, and recording the process code number and the parameter number;
(4) According to the size of the bonding pad, automatically matching the process code of the B laser system through a control system, generating a laser motion track of the B laser system, and generating a wire feeding track of a wire feeding mechanism;
(5) Starting welding;
(6) Before welding, measuring temperature of a welding area in real time through a regional temperature detection module of a control system, feeding temperature data back to the control system, controlling power output of an A laser system and a B laser system through a soldering control module, and starting wire feeding to a welding pad through a wire feeding mechanism when a wire feeding condition is met, wherein the B laser system moves according to a laser movement track, and the wire feeding mechanism moves according to the wire feeding track;
(7) And (5) finishing the motion trail and finishing welding.
In the above technical solution, in step (1), the welding parameters of the a laser system and the B laser system include the welding time segment, the welding holding time, the raising temperature, the wire feeding speed or length, the tin stripping speed or length, and the track running parameters.
The beneficial effects of the invention are as follows: the device can select any one laser system or two laser systems to work according to different requirements of soldering, and has wide application range; when the welding device is combined, the laser system A is mainly used for heating welding spots, the laser system B is mainly used for heating welding spots through quick scanning of the vibrating mirror, so that soldering tin is melted and infiltrated well, the welding quality is guaranteed, and the welding device is particularly suitable for welding large welding spots of electric appliances.
Drawings
Fig. 1 is a schematic structural view of the present invention.
Fig. 2 is a schematic view of laser irradiation during operation of the present invention.
Fig. 3 is a block diagram of the workflow of the present invention.
Fig. 4 is a schematic view of the control system of the present invention to obtain the shape and size of the fillets and pads.
FIG. 5 is a diagram of the scanning motion trace of the galvanometer of the B laser system of the invention.
FIG. 6 is a diagram of the motion profile of the wire feeder of the present invention.
Wherein: 1. the control system, 2A laser system tin welding head, 2a.A laser spot adjusting mechanism, 2b focusing mechanism, 3.B laser system tin welding head, 3a.B laser spot adjusting mechanism, 3b galvanometer mechanism, 3c field lens, 4 wire feeding mechanism, 4a welding wire coil, 4b wire feeding moving mechanism, 4c wire feeding pipe, 4d tin wire, 5 base piece and 6 electric control two-dimensional device.
Detailed Description
The invention will be further described with reference to the accompanying drawings and specific examples.
The combined device for double-laser soldering shown in fig. 1 and 2 comprises a base part 5 with three lens barrels, a control system 1, an A laser system, a B laser system and a wire feeding mechanism 4, wherein the three lens barrels of the base part 5 are a left shaft lens barrel, a middle shaft lens barrel and a right shaft lens barrel respectively, the control system 1 is arranged in the middle shaft lens barrel and is used for intelligently identifying the size of a bonding pad and carrying out region temperature detection and soldering parameter control, the A laser system is arranged in the left shaft lens barrel and comprises an A laser tin soldering head 2, an A laser spot adjusting mechanism 2a and a focusing mechanism 2B which are sequentially arranged from top to bottom, the B laser system comprises a B laser system tin soldering head 3, a B laser spot adjusting mechanism 3a, a vibrating mirror mechanism 3B and a field mirror 3c which are sequentially arranged from top to bottom, the wire feeding mechanism 4 is connected to the lower part of the middle shaft, and the A laser system, the B laser system and the wire feeding mechanism 4 are electrically connected with the control system 1.
In the above technical solution, the control system 1 includes an intelligent identification module, a zone temperature detection module, and a soldering parameter control module.
In the above technical scheme, the wire feeding mechanism 4 includes a wire coil 4a, a wire feeding moving mechanism 4b, and a wire feeding tube 4c, the wire coil is connected to the wire feeding moving mechanism, the bottom of the wire feeding moving mechanism is connected to the wire feeding tube, and the wire feeding moving mechanism is connected to the lower part of the central shaft barrel. The wire coil passes through the wire feeding moving mechanism and finally passes through the wire feeding tube to feed out the tin wire 4d.
In the above technical scheme, the wire feeding moving mechanism comprises the electric control two-dimensional device 6, and the electric control two-dimensional device 6 can move in a plane according to the wire feeding requirement and feed wires, so that the wire feeding mechanism can be driven to move in the plane.
The welding method of the double-laser soldering combined device is as shown in fig. 3: the method comprises the following steps:
(1) Setting a welding process code number, including a welding type, a welding parameter number of a laser system A, a working mode of a tin welding head of a laser system B and a welding parameter number;
(2) As shown in fig. 4, the intelligent recognition module of the control system is used for confirming the working shape, recognizing the current type of the bonding pad, measuring the size of the bonding pad and the size of the soldering leg, wherein the outer diameter of the bonding pad is D, the inner diameter of the bonding pad is D1, and the diameter of the soldering leg is D2;
(3) For different soldering leg sizes, automatically matching the process code number and the parameter number of the A laser system through a control system, and recording the process code number and the parameter number;
(4) According to the size of the bonding pad, the process code number of the B laser system is automatically matched through the control system, the laser motion track of the B laser system is generated, M represents the light spot of the B laser system, as shown in fig. 5, the light spot moves from the middle to the lower left corner and starts to emit laser, the light spot moves along the circular arc with an arrow in the middle until the upper left end stops emitting light, the wire feeding track of the wire feeding mechanism is generated, as shown in fig. 6, the wire feeding track is fed from the starting position X point of the welding wire in the middle and moves downwards, then moves leftwards and rightwards, then moves along the circular arc section and moves leftwards and rightwards, and finally moves downwards to return to the starting position, namely the middle position;
(5) Starting welding;
(6) Before welding, measuring temperature of a welding area in real time through a regional temperature detection module of a control system, feeding temperature data back to the control system, controlling power output of an A laser system and a B laser system through a soldering control module, and starting wire feeding to a welding pad through a wire feeding mechanism when a wire feeding condition is met, wherein the B laser system moves according to a laser movement track, and the wire feeding mechanism moves according to the wire feeding track;
(7) And (5) finishing the motion trail and finishing welding.
In the above technical solution, in step 1, the welding parameters of the a laser system and the B laser system include the welding time segment, the welding holding time, the raising temperature, the wire feeding speed or length, the tin stripping speed or length, and the track operation parameters.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention.
Claims (3)
1. A double-laser soldering combined device is characterized in that: the laser device comprises a base piece with three lens barrels, a control system, an A laser system, a B laser system and a wire feeding mechanism, wherein the three lens barrels of the base piece are a left shaft lens barrel, a middle shaft lens barrel and a right shaft lens barrel respectively, the control system is installed in the middle shaft lens barrel and comprises an intelligent identification module, a region temperature detection module and a soldering parameter control module, the intelligent identification module is used for intelligently identifying the size of a bonding pad and carrying out region temperature detection and soldering parameter control, the A laser system is installed in the left shaft lens barrel and comprises an A laser tin bonding head, an A laser spot adjusting mechanism and a focusing mechanism which are sequentially arranged from top to bottom, the B laser system tin bonding head, a B laser spot adjusting mechanism, a galvanometer mechanism and a field lens which are sequentially arranged from top to bottom, the A laser system, the B laser spot adjusting mechanism, the galvanometer mechanism and the wire feeding mechanism are electrically connected with the control system, the A laser system, the B laser system and the wire feeding mechanism are electrically connected with the control system, the wire feeding mechanism comprises a wire bonding coil, a wire feeding moving mechanism and a wire tube, the wire feeding mechanism is connected with the wire moving mechanism, the wire welding coil is connected with the wire feeding mechanism, the wire heating mechanism is connected with the wire feeding mechanism and the wire welding head moving mechanism, and the wire heating system is used for heating the wire feeding a wire, and the wire is mainly used for heating the wire system and carrying out two-dimensional laser system and heating by the wire welding system.
2.A method of welding a dual laser soldering assembly as defined in claim 1, wherein: the method comprises the following steps:
(1) Setting a welding process code number, including a welding type, a welding parameter number of a laser system A, a working mode of a tin welding head of a laser system B and a welding parameter number;
(2) Confirming the working shape, identifying the current type of the bonding pad, measuring the size of the bonding pad and the size of the welding leg through an intelligent identification module of the control system;
(3) For different soldering leg sizes, automatically matching the process code number and the parameter number of the A laser system through a control system, and recording the process code number and the parameter number;
(4) According to the size of the bonding pad, automatically matching the process code of the B laser system through a control system, generating a laser motion track of the B laser system, and generating a wire feeding track of an electric control two-dimensional wire feeding mechanism;
(5) Starting welding;
(6) Before welding, measuring temperature of a welding area in real time through a regional temperature detection module of a control system, feeding temperature data back to the control system, controlling power output of an A laser system and a B laser system through a soldering control module, and starting wire feeding to a welding pad through an electric control two-dimensional wire feeding mechanism when a wire feeding condition is met, wherein the B laser system moves according to a laser movement track, and the electric control two-dimensional wire feeding mechanism moves according to the wire feeding track;
(7) And (5) finishing the motion trail and finishing welding.
3. The welding method of the double-laser soldering combined device according to claim 2, characterized in that: in step 1, welding parameters of the A laser system and the B laser system comprise welding time segments, welding maintaining time, rising temperature, wire feeding speed or length, tin withdrawing speed or length and track operation parameters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911347977.XA CN110948079B (en) | 2019-12-24 | 2019-12-24 | Double-laser tin soldering combined device and welding method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911347977.XA CN110948079B (en) | 2019-12-24 | 2019-12-24 | Double-laser tin soldering combined device and welding method thereof |
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| CN110948079A CN110948079A (en) | 2020-04-03 |
| CN110948079B true CN110948079B (en) | 2023-10-10 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113770468B (en) * | 2021-08-27 | 2022-05-27 | 武汉锐科光纤激光技术股份有限公司 | Light beam welding apparatus, method, device, storage medium, and electronic device |
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| JP2014104472A (en) * | 2012-11-26 | 2014-06-09 | Fujitsu Ltd | Solder joint device and solder joint method |
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| CN106270877A (en) * | 2016-09-28 | 2017-01-04 | 深圳市艾贝特电子科技有限公司 | Based on FPC golden finger laser soldering apparatus and welding method |
| CN107999917A (en) * | 2018-01-09 | 2018-05-08 | 深圳市海目星激光智能装备股份有限公司 | A kind of laser soldering equipment |
| CN109352115A (en) * | 2018-12-13 | 2019-02-19 | 武汉雷英激光科技有限公司 | A kind of constant temperature high speed and precision laser Soldering machine and its control method |
| CN211490004U (en) * | 2019-12-24 | 2020-09-15 | 武汉嘉铭激光股份有限公司 | Large-size double-laser soldering combined device |
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2019
- 2019-12-24 CN CN201911347977.XA patent/CN110948079B/en active Active
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2038220A (en) * | 1978-08-24 | 1980-07-23 | Raytheon Co | Soldering apparatus and method |
| JPH067922A (en) * | 1992-05-26 | 1994-01-18 | Nec Corp | Local soldering device |
| JPH09199846A (en) * | 1996-01-19 | 1997-07-31 | Toshiba Electron Eng Corp | Mounting of electronic component and electronic component mounting device |
| CN201002157Y (en) * | 2006-12-08 | 2008-01-09 | 华南理工大学 | Selective laser micro-braze-welding system based on vibration mirror scanning |
| JP2014104472A (en) * | 2012-11-26 | 2014-06-09 | Fujitsu Ltd | Solder joint device and solder joint method |
| CN105458445A (en) * | 2014-09-11 | 2016-04-06 | 大族激光科技产业集团股份有限公司 | Laser tin soldering device and soldering method |
| CN106270877A (en) * | 2016-09-28 | 2017-01-04 | 深圳市艾贝特电子科技有限公司 | Based on FPC golden finger laser soldering apparatus and welding method |
| CN107999917A (en) * | 2018-01-09 | 2018-05-08 | 深圳市海目星激光智能装备股份有限公司 | A kind of laser soldering equipment |
| CN109352115A (en) * | 2018-12-13 | 2019-02-19 | 武汉雷英激光科技有限公司 | A kind of constant temperature high speed and precision laser Soldering machine and its control method |
| CN211490004U (en) * | 2019-12-24 | 2020-09-15 | 武汉嘉铭激光股份有限公司 | Large-size double-laser soldering combined device |
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