CN110932526A - Power supply device - Google Patents
Power supply device Download PDFInfo
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- CN110932526A CN110932526A CN201811084506.XA CN201811084506A CN110932526A CN 110932526 A CN110932526 A CN 110932526A CN 201811084506 A CN201811084506 A CN 201811084506A CN 110932526 A CN110932526 A CN 110932526A
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- space
- module
- power supply
- storage capacitor
- energy storage
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Dc-Dc Converters (AREA)
Abstract
A power supply device comprises a device shell, an energy storage capacitor module, a switching element module, a magnetic element module and a cooling fan. The device shell is provided with an air inlet end, an air outlet end and an accommodating space, the accommodating space is positioned between the air inlet end and the air outlet end and is respectively communicated with the air inlet end and the air outlet end, and the accommodating space is divided to form a low heating element arrangement space and a high heating element arrangement space. The energy storage capacitor module comprises a plurality of energy storage capacitor elements positioned in the low heating element arrangement space. The switching element module includes a plurality of switching elements disposed in the high heat generating element disposing space. The magnetic element module comprises a plurality of magnetic elements positioned in the high heat generating element arrangement space. The heat dissipation fan is arranged at the air inlet end and used for providing heat dissipation airflow towards the high heating element arrangement space.
Description
Technical Field
The present invention relates to a power supply device, and more particularly, to a power supply device having a low heating element installation space and a high heating element installation space.
Background
Generally, a circuit module of an electrical apparatus is mainly composed of a circuit board and various electronic components disposed on the circuit board, and common electronic components include components such as resistors, capacitors, switches, or transistors, however, when the circuit module is designed, various electronic components of the same type are usually distributed on the circuit board according to a general layout principle, so that the electronic components with high heat generation and the electronic components with low heat generation are often arranged in a staggered manner on a path through which a heat dissipation airflow passes, and at this time, it is likely that the heat dissipation airflow passes through the electronic components with high heat generation and then passes through the electronic components with low heat generation, so that heat energy taken away by the heat dissipation airflow from the electronic components with high heat generation is transferred to the electronic components with low heat generation, and the working efficiency of the electronic components with low heat generation is affected; in addition, when the size of the electronic component with low heat generation is too large, the flow of the heat dissipation air flow may be blocked, thereby affecting the overall heat dissipation efficiency.
As mentioned above, since the high-heat electronic components and the low-heat electronic components are distributed on the circuit board, the heat dissipation path of the circuit module needs to be designed widely to dissipate heat of all the high-heat electronic components, but the heat dissipation airflow cannot be concentrated, so that the heat dissipation efficiency is relatively reduced; or the fan speed is increased to increase the heat dissipation airflow, but the power consumption is increased.
Disclosure of Invention
In view of the problems that various types of electronic components of the conventional circuit module are generally scattered on the circuit board according to a general layout principle, and then the low-heat electronic component is blocked to the heat dissipation airflow, or the heat dissipation airflow transfers the heat energy taken away from the high-heat electronic component to the low-heat electronic component; accordingly, the present invention is directed to a power supply device, which can efficiently dissipate heat generated by high-heat-generating electronic components without affecting low-heat-generating electronic components.
In order to achieve the above objectives, the present invention provides a power supply device, which includes a device housing, an energy storage capacitor module, a switching element module, a magnetic element module, and a heat dissipation fan. The device shell is provided with an air inlet end, an air outlet end and an accommodating space, the accommodating space is positioned between the air inlet end and the air outlet end and is respectively communicated with the air inlet end and the air outlet end, and the accommodating space is divided to form a low heating element arrangement space and a high heating element arrangement space. The energy storage capacitor module comprises a plurality of energy storage capacitor elements, and the energy storage capacitor elements are located in the low heating element arrangement space. The switching element module includes a plurality of switching elements, and the switching elements are located in the high heat generating element disposing space. The magnetic element module comprises a plurality of magnetic elements, and the magnetic elements are positioned in the high-heat-generating element arrangement space. The heat dissipation fan is arranged at the air inlet end and used for providing heat dissipation airflow towards the high heating element arrangement space.
In an auxiliary technical means derived from the above-mentioned necessary technical means, the energy storage capacitor module further includes an energy storage capacitor circuit board disposed in the accommodating space, and the accommodating space is divided into a low heating element disposing space and a high heating element disposing space, and the energy storage capacitor element is disposed on the energy storage capacitor circuit board.
In an auxiliary technical means derived from the above-mentioned necessary technical means, the switch element module further includes a switch element circuit board, the switch element circuit board is disposed in the accommodating space, and the switch element is disposed on the switch element circuit board.
In an auxiliary technical means derived from the above-mentioned necessary technical means, the magnetic element module further includes a magnetic element circuit board, the magnetic element circuit board is disposed in the accommodating space, and the magnetic element is disposed on the magnetic element circuit board.
In an auxiliary technical means derived from the above-mentioned necessary technical means, the switching element module and the magnetic element module are respectively disposed at two sides of the high heat generating element disposing space.
In an auxiliary technical means derived from the above-mentioned necessary technical means, the power supply device further includes a heat dissipation element disposed in the high heat generating element disposing space and thermally connected to at least one of the switch element module and the magnetic element module.
In one implementation derived from the above-described essential implementation, the switching element includes a Metal Oxide Semiconductor Field Effect Transistor (MOSFET).
In an additional embodiment derived from the above-described essential embodiment, the magnetic element comprises a transformer or an inductor.
As described above, the power supply device provided by the present invention divides the accommodating space of the device housing into the low heating element installation space and the high heating element installation space, and respectively installs the low heating electronic element and the high heating electronic element in the low heating element installation space and the high heating element installation space, so that the low heating electronic element and the high heating electronic element are not interfered with each other, and the heat dissipation efficiency can be effectively improved.
The invention is described in detail below with reference to the drawings and specific examples, but the invention is not limited thereto.
Drawings
Fig. 1 is a schematic exploded perspective view of a power supply device according to a first preferred embodiment of the invention;
fig. 2 is a schematic perspective view of a power supply device according to a first preferred embodiment of the invention;
fig. 3 is a schematic diagram illustrating an internal configuration of a power supply device according to a first preferred embodiment of the invention;
fig. 4 is a schematic diagram illustrating another internal configuration of a power supply device according to a first preferred embodiment of the invention; and
fig. 5 is a schematic diagram illustrating an internal configuration of a power supply device according to a second preferred embodiment of the invention.
Wherein the reference numerals
100 power supply device
1 device case
11 casing body
111 air inlet end
112 air outlet end
113 space for accommodating
1131 Low heating element installation space
1132 high heating element installation space
12 cover plate
2 energy storage capacitor module
21 energy storage capacitor circuit board
22 energy storage capacitor element
3 switching element module
31 switching element circuit board
32 switching element
4 magnetic element module
41 magnetic element circuit board
42 magnetic element
5 Heat radiation fan
6 Heat radiation fan
100a power supply device
1a device housing
11a case body
12a cover plate
1131a Low heating element installation space
1132a high heating element installation space
2a energy storage capacitor module
21a energy storage capacitor circuit board
22a energy storage capacitor element
3a switching element module
31a switch element circuit board
32a switching element
4a magnetic element module
41a magnetic element circuit board
42a magnetic element
5a heat dissipation element
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. Advantages and features of the present invention will become apparent from the following description and from the scope of the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Referring to fig. 1 and fig. 2, fig. 1 is a schematic exploded perspective view of a power supply device according to a first preferred embodiment of the invention; fig. 2 is a schematic perspective view of a power supply device according to a first preferred embodiment of the invention. As shown in the figure, a power supply device 100 includes a device housing 1, an energy storage capacitor module 2, a switching element module 3, a magnetic element module 4, a heat dissipation element 5 and a heat dissipation fan 6.
The device housing 1 includes a housing body 11 and a cover plate 12, wherein the housing body 11 has an air inlet end 111, an air outlet end 112 and an accommodating space 113. The air inlet end 111 and the air outlet end 112 are disposed opposite to each other, the air outlet end 112 is provided with a plurality of air outlet holes (only one is labeled in the figure), and the accommodating space 113 is located between the air inlet end 111 and the air outlet end 112 and is respectively communicated with the air inlet end 111 and the air outlet end 112.
Referring to fig. 3 and fig. 4, fig. 3 is a schematic diagram illustrating an internal configuration of a power supply device according to a first preferred embodiment of the invention; fig. 4 is a schematic diagram illustrating another internal configuration of a power supply device according to a first preferred embodiment of the invention. As shown, the energy storage capacitor module 2 includes an energy storage capacitor circuit board 21 and a plurality of energy storage capacitor elements 22 (only one is labeled in the figure). The energy storage capacitor circuit board 21 is disposed in the accommodating space 113, and divides the accommodating space 113 into a low heating element disposing space 1131 and a high heating element disposing space 1132. The energy storage capacitor element 22 is disposed on the energy storage capacitor circuit board 21 and located in the low heat element disposing space 1131.
The switching element module 3 includes a switching element circuit board 31 and a plurality of switching elements 32 (only one is labeled in the figure). The switching element circuit board 31 is disposed in the high heat element disposition space 1132, and the switching element 32 is disposed on the switching element circuit board 31, thereby being located in the high heat element disposition space 1132. The switching element 32 includes a Metal Oxide Semiconductor Field Effect Transistor (MOSFET).
The magnetic element module 4 includes a magnetic element circuit board 41 and a plurality of magnetic elements 42 (only one is labeled in the figure). The magnetic element circuit board 41 is disposed in the high heat element disposition space 1132, and the magnetic element 42 is disposed on the switching element circuit board 31, thereby being located in the high heat element disposition space 1132. Wherein the magnetic element 42 comprises a transformer or an inductor. In addition, in the present embodiment, the switching element module 3 and the magnetic element module 4 are respectively disposed at both sides in the high heat generating element disposing space 1132.
The heat dissipation member 5 is thermally connected to the switching element circuit board 31 of the switching element module 3 and is disposed in the high heat generating element disposing space 1132; the heat dissipation element 5 is a heat dissipation fin. In practical applications, the heat dissipation element 5 and the switch element circuit board 31 are thermally connected by, for example, a thermal conductive paste, and are fixed by a locking element or a locking element. In addition, although the heat dissipation element 5 is only thermally connected to the switching element module 3 in the embodiment, in other embodiments, the heat dissipation element 5 may also be thermally connected to the magnetic element module 4, and even may be thermally connected to both the switching element module 3 and the magnetic element module 4.
The heat dissipation fan 6 is disposed at the air inlet end 111 and provides a heat dissipation airflow DF toward the high heat generating element disposing space 1132; in the power supply apparatus 100 of the present embodiment, the accommodating space 113 is divided into the low-heat-element disposing space 1131 and the high-heat-element disposing space 1132, the energy-storage capacitor element 22 is disposed in the low-heat-element disposing space 1131, and the plurality of switch elements 32 and the plurality of magnetic elements 42 are disposed in the high-heat-element disposing space 1132, so that the heat dissipation airflow DF provided by the heat dissipation fan 6 can be only used for dissipating heat of the switch element module 3 and the magnetic element module 4, and is not affected by the energy-storage capacitor element 22.
Referring to fig. 5, fig. 5 is a schematic diagram illustrating an internal configuration of a power supply device according to a second preferred embodiment of the invention. As shown in the drawings, the present embodiment further provides a power supply apparatus 100a, and the power supply apparatus 100a is similar to the power supply apparatus 100 described above, and the power supply apparatus 100a also includes an energy storage capacitor module 2a, a switching element module 3a, a magnetic element module 4a, and a heat dissipation element 5 a; the main difference is that the power supply apparatus 100a arranges the switch element circuit board 31a in the casing body 11a of the apparatus casing 1a, further divides the accommodating space (not shown) of the casing body 11a into a low-heat element arrangement space 1131a and a high-heat element arrangement space 1132a, and covers the cover plate 12a on the switch element circuit board 31 a.
As described above, the heat dissipating element 5a thermally connected to the switching element circuit board 31a is located in the high heat generating element disposing space 1132a, the magnetic element circuit board 41a is located on the other side of the high heat generating element disposing space 1132a, and the magnetic element 42a is located in the high heat generating element disposing space 1132 a. Although the switching element 32a is located in the low heat element installation space 1131a, the heat energy of the switching element 32a is mainly conducted to the heat dissipation element 5a, so that the heat can be effectively dissipated through the heat dissipation element 5 a. In addition, the storage capacitor circuit board 21a and the storage capacitor element 22a are located in the low heat element installation space 1131 a.
In this embodiment, the power supply apparatus 100a can also utilize a heat dissipation fan (not shown) to make a heat dissipation airflow (not shown) pass through the high heat element installation space 1132a to take away the heat energy generated by the operation of the switch element 32a (through the heat dissipation element 5a) and the magnetic element 42 a.
In summary, compared with the existing circuit module, because various types of electronic components are scattered on the circuit board, the problem that the low-heat electronic component is blocked to the heat dissipation airflow easily occurs, or the heat energy taken away by the high-heat electronic component is transmitted to the low-heat electronic component by the heat dissipation airflow is easily caused; the power supply device divides the accommodating space of the device shell into a low heating element arrangement space and a high heating element arrangement space, and arranges the low heating electronic element and the high heating electronic element in the low heating element arrangement space and the high heating element arrangement space respectively, so that the heat dissipation airflow can effectively dissipate the heat of the high heating electronic element through the high heating element arrangement space without being influenced by the low heating electronic element, and the heat dissipation efficiency is effectively improved. In addition, since the low-heat-generating electronic component is provided separately from the high-heat-generating electronic component in the present invention, the low-heat-generating electronic component does not receive more heat energy.
In the preferred embodiment of the present invention, although only the embodiment of dividing the accommodating space by the energy storage capacitor circuit board and the switch element circuit board is illustrated, the present invention is not limited thereto, and in other embodiments, the accommodating space may be divided by the magnetic element circuit board; in addition, the heat dissipation element can be used for simultaneously thermally connecting the switch element module and the magnetic element module in the high-heat-generating-element arrangement space.
It should be noted that, in the preferred embodiment of the present invention, the power supply device is provided with other electronic components besides the energy storage capacitor module, the switch element module and the magnetic element module, including various electronic components such as a general capacitor (whose size is very small compared to the energy storage capacitor element) or a resistor, and the energy storage capacitor module, the switch element module and the magnetic element module are mainly defined according to the electronic components mainly provided.
The present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof, and it should be understood that various changes and modifications can be effected therein by one skilled in the art without departing from the spirit and scope of the invention as defined in the appended claims.
Claims (8)
1. A power supply device, comprising:
the device comprises a device shell, a heat sink and a heat sink, wherein the device shell is provided with an air inlet end, an air outlet end and an accommodating space, the accommodating space is positioned between the air inlet end and the air outlet end and is respectively communicated with the air inlet end and the air outlet end, and the accommodating space is divided into a low heating element arrangement space and a high heating element arrangement space;
the energy storage capacitor module comprises a plurality of energy storage capacitor elements, and the energy storage capacitor elements are positioned in the low heating element arrangement space;
a switching element module including a plurality of switching elements, the switching elements being located in the high heat generating element installation space;
a magnetic element module, which comprises a plurality of magnetic elements, wherein the magnetic elements are positioned in the high heating element arrangement space; and
a heat dissipation fan, which is arranged at the air inlet end and is used for providing a heat dissipation airflow towards the high heating element arrangement space.
2. The power supply device according to claim 1, wherein the energy storage capacitor module further comprises an energy storage capacitor circuit board disposed in the accommodating space, and the accommodating space is divided into the low heating element disposing space and the high heating element disposing space, and the energy storage capacitor elements are disposed on the energy storage capacitor circuit board.
3. The power supply apparatus according to claim 1, wherein the switch module further comprises a switch circuit board disposed in the accommodating space, and the switch elements are disposed on the switch circuit board.
4. The power supply device according to claim 1, wherein the magnetic element module further comprises a magnetic element circuit board, the magnetic element circuit board is disposed in the accommodating space, and the magnetic elements are disposed on the magnetic element circuit board.
5. The power supply device according to claim 1, wherein the switching element module and the magnetic element module are respectively disposed at two sides of the high heat generating element disposing space.
6. The power supply apparatus according to claim 1, further comprising a heat sink disposed in the high heat-generating component disposing space and thermally connected to at least one of the switch component module and the magnetic component module.
7. The power supply device according to claim 1, wherein the switching elements comprise metal oxide semiconductor field effect transistors.
8. The power supply device according to claim 1, wherein the magnetic elements comprise transformers or inductors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811084506.XA CN110932526A (en) | 2018-09-18 | 2018-09-18 | Power supply device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811084506.XA CN110932526A (en) | 2018-09-18 | 2018-09-18 | Power supply device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110932526A true CN110932526A (en) | 2020-03-27 |
Family
ID=69855760
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811084506.XA Pending CN110932526A (en) | 2018-09-18 | 2018-09-18 | Power supply device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110932526A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023236950A1 (en) * | 2022-06-06 | 2023-12-14 | 广东美的暖通设备有限公司 | Air conditioner indoor unit |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101202529A (en) * | 2006-12-11 | 2008-06-18 | 丹佛斯传动有限公司 | Electronic device and electric motor frequency converter |
| CN203775010U (en) * | 2014-03-11 | 2014-08-13 | 浙江华邦电力仪表有限公司 | Frequency converter |
| CN203967954U (en) * | 2014-07-02 | 2014-11-26 | 黄剑敏 | Frequency converter |
| CN104319980A (en) * | 2014-10-28 | 2015-01-28 | 张家港市华为电子有限公司 | Switching power supply with large power |
-
2018
- 2018-09-18 CN CN201811084506.XA patent/CN110932526A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101202529A (en) * | 2006-12-11 | 2008-06-18 | 丹佛斯传动有限公司 | Electronic device and electric motor frequency converter |
| CN203775010U (en) * | 2014-03-11 | 2014-08-13 | 浙江华邦电力仪表有限公司 | Frequency converter |
| CN203967954U (en) * | 2014-07-02 | 2014-11-26 | 黄剑敏 | Frequency converter |
| CN104319980A (en) * | 2014-10-28 | 2015-01-28 | 张家港市华为电子有限公司 | Switching power supply with large power |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023236950A1 (en) * | 2022-06-06 | 2023-12-14 | 广东美的暖通设备有限公司 | Air conditioner indoor unit |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200327 |
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| RJ01 | Rejection of invention patent application after publication |