CN110926641A - Plug-in temperature transmitter - Google Patents
Plug-in temperature transmitter Download PDFInfo
- Publication number
- CN110926641A CN110926641A CN201911407930.8A CN201911407930A CN110926641A CN 110926641 A CN110926641 A CN 110926641A CN 201911407930 A CN201911407930 A CN 201911407930A CN 110926641 A CN110926641 A CN 110926641A
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- detection
- heat dissipation
- power supply
- probe
- inner cavity
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/02—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using thermoelectric elements, e.g. thermocouples
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/08—Protective devices, e.g. casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/14—Supports; Fastening devices; Arrangements for mounting thermometers in particular locations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
- G01K7/16—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements using resistive elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses an insertion type temperature transmitter which comprises a power supply mechanism, a processing mechanism, a cooling mechanism, an adjusting mechanism and a detection mechanism, wherein the processing mechanism is fixedly installed at the bottom of the power supply mechanism, the cooling mechanism is fixedly installed at the bottom of the processing mechanism, and the detection mechanism is inserted at the bottom of the cooling mechanism. According to the invention, one end of the detection mechanism can be cooled through cold air, so that the temperature on the detection mechanism can be effectively prevented from being transmitted to the inner cavity of the processing mechanism, meanwhile, heat can be rapidly dissipated through heat dissipation holes in the surface of the cooling mechanism, so that the heat dissipation effect on the detection mechanism can be further improved, through rotating the lead screw, the other end of the lead screw can push one end of the detection mechanism to be inserted into the inner cavity of the detection equipment through the fixing plate under the pushing of threads, and through adjusting the adjusting mechanism, the insertion depth of the detection mechanism can be flexibly adjusted, so that the detection precision on the temperature can be effectively improved.
Description
Technical Field
The invention relates to the technical field of detection equipment, in particular to an insertion type temperature transmitter.
Background
The temperature transmitter adopts a thermocouple and a thermal resistor as temperature measuring elements, signals output by the temperature measuring elements are sent to a transmitter module, the signals are converted into 4-20 mA current signals 0-5V/0-10V voltage signals which are in linear relation with the temperature after being processed by circuits such as voltage stabilizing filtering, operational amplification, nonlinear correction, V/I conversion, constant current and reverse protection, RS485 digital signals are output, and physical measurement signals or common electric signals are converted into standard electric signals to be output or can be output in a communication protocol mode. Temperature transmitters are instruments that convert temperature variables into a transmittable standardized output signal, and are mainly used for measuring and controlling temperature parameters of industrial processes. The current transducer converts the alternating current of the main loop to be measured into a standard signal of a constant current loop, and continuously transmits the standard signal to the receiving device.
However, the existing plug-in temperature transmitter has the following disadvantages in the using process:
1. current bayonet temperature transmitter detects mechanism one end and injects the detection liquid of high temperature in the use, and current changer can't carry out the separation to the temperature to lead to high temperature to go in the gauge outfit is transmitted along protecting a section of thick bamboo, thereby cause the damage to the gauge outfit.
2. The insertion depth of the detection mechanism can not be flexibly adjusted along with actual use requirements in the use process of the existing plug-in temperature transmitter, so that the measurement accuracy is poor.
Disclosure of Invention
The invention aims to provide an insertion type temperature transmitter, and the problem that in the background technology, one end of a detection mechanism of the existing insertion type temperature transmitter is inserted into high-temperature detection liquid in the use process, the existing transmitter cannot block the temperature, so that the high temperature is transmitted to a gauge outfit along a protective cylinder, the gauge outfit is damaged, and the insertion depth of the detection mechanism cannot be flexibly adjusted along with actual use requirements in the use process of the existing insertion type temperature transmitter, so that the measurement accuracy is poor is solved.
In order to achieve the purpose, the invention provides the following technical scheme:
a plug-in temperature transmitter comprises a power supply mechanism, a processing mechanism, a cooling mechanism, an adjusting mechanism and a detection mechanism, wherein the processing mechanism is fixedly installed at the bottom of the power supply mechanism, the cooling mechanism is fixedly installed at the bottom of the processing mechanism, the detection mechanism is inserted into the bottom of the cooling mechanism, and the adjusting mechanism is sleeved on the surface of the detection mechanism;
the power supply mechanism consists of a power supply, a sealing ring and a power line, wherein the sealing ring is fixedly embedded at one end of the power supply, the power line is inserted into an inner cavity of the sealing ring, and one end of the power line is electrically connected with the power supply;
the processing mechanism comprises a display screen, a support frame, a damping spring, a heat dissipation aluminum plate, a main plate, a heat dissipation fan and a waterproof adhesive film, wherein the display screen is fixedly embedded on the surface of the processing mechanism;
the cooling mechanism consists of a spherical shield, semiconductor refrigeration sheets and radiating holes, the semiconductor refrigeration sheets are fixedly arranged in the inner cavity of the spherical shield through a support, two groups of semiconductor refrigeration sheets are arranged, and the radiating holes are formed in the surface of the spherical shield;
the adjusting mechanism comprises a mounting plate, mounting bolts, a conical sealing sleeve, universal balls, a screw rod and a fixing plate, the mounting bolts are inserted at two ends of the surface of the mounting plate, the conical sealing sleeve is inserted in the middle of the surface of the mounting plate, a protective sleeve penetrates through the inner cavity of the conical sealing sleeve, the universal balls are movably embedded at two sides of the mounting bolts, the screw rod is fixedly welded at the top of each universal ball, the fixing plate is fixedly welded at the bottom of the cooling mechanism, and the top of each screw rod penetrates through the fixing plate in a spiral manner;
the detection mechanism comprises a protective cylinder, a probe and rubber blocks, wherein one end of the protective cylinder is fixedly inserted into an inner cavity of the cooling mechanism, one end of the protective cylinder is located on one side of a semiconductor refrigerating sheet, the probe is inserted into the inner cavity of the protective cylinder, the other end of the probe is electrically connected with a main board through a wire, the rubber blocks are fixedly adhered to two sides of the surface of the probe, multiple groups of rubber blocks are arranged on the surface of the probe, and the surface of the probe is connected with the inner wall of the protective cylinder through the rubber blocks.
The invention provides an insertion type temperature transmitter, which has the following beneficial effects:
(1) according to the invention, through the semiconductor refrigeration sheet and by utilizing the Peltier effect of the semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so that cold air can be released, one end of the detection mechanism can be cooled through the cold air, the temperature on the detection mechanism can be effectively prevented from being transmitted to an inner cavity of the processing mechanism, meanwhile, the heat can be rapidly dissipated through the heat dissipation holes on the surface of the cooling mechanism, and the heat dissipation effect on the detection mechanism can be further improved.
(2) The adjusting mechanism can be fixedly arranged on the surface of the detection equipment through the mutual matching of the mounting plate and the mounting bolt, the conical sealing sleeve is inserted into the mounting hole during the installation, and the conical sealing sleeve is extruded through the mounting plate, so that the leakage at the mounting hole can be effectively avoided, the protective sleeve is inserted into the inner cavity of the conical sealing sleeve, the sealing effect of the joint can be effectively improved, the other end of the screw rod can push one end of the detection mechanism to be inserted into the inner cavity of the detection equipment through the fixed plate under the pushing of the screw thread by rotating the screw rod, and the insertion depth of the detection mechanism can be flexibly adjusted by adjusting the adjusting mechanism, so that the detection precision of the temperature can be effectively improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the internal structure of the present invention;
FIG. 3 is a schematic view of the processing mechanism of the present invention;
FIG. 4 is a schematic view of the cooling mechanism of the present invention
FIG. 5 is a schematic view of an adjustment mechanism of the present invention;
fig. 6 is a schematic structural diagram of the detection mechanism of the present invention.
In the figure: 1. a power supply mechanism; 101. a power source; 102. a seal ring; 103. a power line; 2. a processing mechanism; 201. a display screen; 202. a support frame; 203. a damping spring; 204. a heat dissipation aluminum plate; 205. a main board; 206. a heat dissipation fan; 207. a waterproof glue film; 3. a cooling mechanism; 301. a spherical shield; 302. a semiconductor refrigeration sheet; 303. heat dissipation holes; 4. an adjustment mechanism; 401. mounting a plate; 402. installing a bolt; 403. a conical sealing sleeve; 404. a universal ball; 405. a screw rod; 406. a fixing plate; 5. a detection mechanism; 501. protecting the cylinder; 502. a probe; 503. a rubber block.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1 to 6, the present invention provides a technical solution: the utility model provides an insert temperature transmitter, insert temperature transmitter includes electrical mechanism 1, processing mechanism 2, cooling mechanism 3, adjustment mechanism 4 and detection mechanism 5, electrical mechanism 1 bottom fixed mounting has processing mechanism 2, 2 bottom fixed mounting of processing mechanism has cooling mechanism 3, 3 bottom pegs graft in the cooling mechanism has detection mechanism 5, adjustment mechanism 4 has been cup jointed on the 5 surfaces of detection mechanism.
The power supply mechanism 1 is composed of a power supply 101, a sealing ring 102 and a power line 103, the sealing ring 102 is fixedly embedded at one end of the power supply 101, the power line 103 is inserted into an inner cavity of the sealing ring 102, one end of the power line 103 is electrically connected with the power supply 101, and one end of the power line 103 is connected with a control device, so that the power supply 101 can be supplied.
The processing mechanism 2 is composed of a display screen 201, a support frame 202, a damping spring 203, a heat dissipation aluminum plate 204, a main board 205, a heat dissipation fan 206 and a waterproof adhesive film 207, and the display screen 201, the support frame 202, the damping spring 203, the heat dissipation aluminum plate 204, the main board 205, the heat dissipation fan 206 and the waterproof adhesive film 207 form the processing mechanism 2.
The display screen 201 is fixedly embedded on the surface of the processing mechanism 2, a support 202 is integrally formed in an inner cavity of the processing mechanism 2, a damping spring 203 is fixedly mounted on the upper surface of the support 202, a plurality of groups of damping springs 203 are arranged on the damping spring 203, a heat dissipation aluminum plate 204 is fixedly connected to the top of the damping spring 203, a main board 205 is fixedly mounted on the upper surface of the heat dissipation aluminum plate 204, a heat dissipation fan 206 is fixedly mounted at the bottom of the support 202, a waterproof adhesive film 207 is fixedly coated on the surface of the inner wall of the processing mechanism 2, signals transmitted by the detection mechanism 5 can be analyzed and processed through the main board 205, so that a measured temperature result is displayed through the display screen 201, a heat dissipation aluminum plate 204 is mounted at the bottom of the main board 205, the heat dissipation aluminum plate 204 is made of aluminum, and has the characteristics of high heat absorption speed, and mutually support with heat dissipation fan 206, thereby can realize the radiating effect to mainboard 205 fast, heat dissipation aluminum plate 204 bottom is connected with support frame 202 through damping spring 203, when using under the vibration environment, can absorb and filter the vibration through damping spring 203, thereby slow down vibration transmission to mainboard 205, thereby can effectively promote mainboard 205 stability at the during operation, water-proof glue membrane 207 adopts high-quality waterproof ventilated membrane material to make, stronger water-proof effects has, thereby can effectively avoid in the course of the work liquid infiltration advance the 2 inner chambers of processing mechanism, use safe and reliable more.
The cooling mechanism 3 is composed of a spherical shield 301, semiconductor refrigeration pieces 302 and heat dissipation holes 303, and the spherical shield 301, the semiconductor refrigeration pieces 302 and the heat dissipation holes 303 form the cooling mechanism 3.
The detection mechanism 5 is composed of a protective cylinder 501, a probe 502 and a rubber block 503, one end of the protective cylinder 501 is fixedly inserted in the inner cavity of the cooling mechanism 3, one end of the protective cylinder 501 is positioned on one side of the semiconductor refrigeration sheet 302, the probe 502 is inserted in the inner cavity of the protective cylinder 501, the other end of the probe 502 is electrically connected with the main board 205 through a lead, the rubber blocks 503 are fixedly adhered to two sides of the surface of the probe 502, the rubber blocks 503 are provided with a plurality of groups, the surface of the probe 502 is connected with the inner wall of the protective cylinder 501 through the rubber block 503, one end of the detection mechanism 5 is inserted into a detection hole, so that the temperature of a detection area can be measured through the probe 502, the protective cylinder 501 is wrapped on the surface of the probe 502, the protective cylinder 501 can protect the probe 502 through the protective cylinder 501, the probe 502 is prevented from being damaged in the measurement process, the surface of the probe 502 is connected with the, thereby reducing the transmission of vibrations.
The adjusting mechanism 4 is composed of a mounting plate 401, a mounting bolt 402, a conical sealing sleeve 403, a universal ball 404, a screw rod 405 and a fixing plate 406, and the mounting plate 401, the mounting bolt 402, the conical sealing sleeve 403, the universal ball 404, the screw rod 405 and the fixing plate 406 form the adjusting mechanism 4.
Mounting bolts 402 are inserted at two ends of the surface of the mounting plate 401, a conical sealing sleeve 403 is inserted in the middle of the surface of the mounting plate 401, a protective sleeve 501 penetrates through the inner cavity of the conical sealing sleeve 403, universal balls 404 are movably embedded at two sides of the mounting bolts 402, a lead screw 405 is fixedly welded at the top of each universal ball 404, the fixing plate 406 is fixedly welded at the bottom of the cooling mechanism 3, the top of the lead screw 405 spirally penetrates through the fixing plate 406, the adjusting mechanism 4 can be matched with the mounting bolts 402 through the mounting plate 401 and is fixedly mounted on the surface of the detection equipment, the conical sealing sleeve 403 is inserted into the mounting hole when the detection equipment is mounted, and the conical sealing sleeve 403 is extruded through the mounting plate 401, so that leakage at the mounting hole can be effectively avoided, the protective sleeve 501 is inserted into the inner cavity of the conical sealing sleeve, the sealing effect at the connecting part can be effectively, promote detection mechanism 5 one end through fixed plate 406 and inject the check out test set inner chamber, through adjusting adjustment mechanism 4 to can carry out nimble regulation to the depth of insertion of detection mechanism 5, thereby can effectively promote the detection precision to the temperature.
It should be noted that, in the case of an insertion type temperature transmitter, when working, one end of the power line 103 is connected to the control device, so as to supply power to the power source 101, one end of the detection mechanism 5 is inserted into the detection hole, so as to measure the temperature of the detection area through the probe 502, meanwhile, the surface of the probe 502 is wrapped with the protection tube 501, the probe 502 can be protected through the protection tube 501, the surface of the probe 502 is connected to the inner wall of the protection tube 501 through the rubber block 503, the vibration can be absorbed and filtered through the rubber block 503, the signal transmitted from the detection mechanism 5 can be analyzed and processed through the motherboard 205, so as to display the measured temperature result through the display screen 201, and meanwhile, the bottom of the motherboard 205 is provided with the heat dissipation aluminum plate 204, the heat dissipation aluminum plate 204 is made of aluminum, which has the characteristics of fast heat absorption speed and fast heat dissipation speed, so as to quickly absorb the high, and is mutually matched with a heat radiation fan 206, thereby being capable of quickly realizing the heat radiation effect to the mainboard 205, the bottom of the heat radiation aluminum plate 204 is connected with the support frame 202 through the damping spring 203, when the heat radiation aluminum plate is used under the vibration environment, the vibration can be absorbed and filtered through the damping spring 203, thereby slowing down the transmission of the vibration to the mainboard 205, the waterproof glue film 207 is made of high-quality waterproof breathable membrane material, and has stronger waterproof effect, thereby effectively avoiding the liquid from permeating into the inner cavity of the processing mechanism 2 in the working process, through the semiconductor refrigeration sheet 302, by utilizing the Peltier effect of semiconductor material, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be respectively absorbed and released at the two ends of the couple, thereby releasing cold air, cooling one end of the detection mechanism 5 through the cold air, thereby effectively avoiding the temperature on the detection mechanism 5 from being transmitted to the inner cavity of the processing mechanism 2, meanwhile, heat can be rapidly dissipated through the heat dissipating holes 303 on the surface of the cooling mechanism 3, so that the heat dissipating effect on the detection mechanism 5 is further improved, the adjusting mechanism 4 can be fixedly arranged on the surface of the detection equipment through the mutual matching of the mounting plate 401 and the mounting bolt 402, and the tapered gland 403 is inserted into the mounting hole at the time of installation, and the tapered gland 403 is pressed by the mounting plate 401, thereby effectively avoiding leakage at the mounting hole, and the protective sleeve 501 is inserted in the inner cavity of the conical sealing sleeve 403, the sealing effect of the joint can be effectively improved, by rotating the screw rod 405, the other end of the screw rod 405 can be pushed by the screw thread, one end of the detection mechanism 5 is pushed to be inserted into the inner cavity of the detection device through the fixing plate 406, and by adjusting the adjusting mechanism 4, thereby can carry out nimble regulation to detection mechanism 5's the depth of insertion to can effectively promote the detection precision to the temperature.
The 5V-DRGB type heat dissipation fan 206 and the TEC1-12706 type semiconductor cooling plate 302 are both products of the prior art, and will not be described in detail herein.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (1)
1. An insert temperature transmitter, characterized by: the plug-in temperature transmitter comprises a power supply mechanism (1), a processing mechanism (2), a cooling mechanism (3), an adjusting mechanism (4) and a detection mechanism (5), wherein the processing mechanism (2) is fixedly installed at the bottom of the power supply mechanism (1), the cooling mechanism (3) is fixedly installed at the bottom of the processing mechanism (2), the detection mechanism (5) is inserted into the bottom of the cooling mechanism (3), and the adjusting mechanism (4) is sleeved on the surface of the detection mechanism (5);
the power supply mechanism (1) is composed of a power supply (101), a sealing ring (102) and a power line (103), the sealing ring (102) is fixedly embedded at one end of the power supply (101), the power line (103) is inserted into an inner cavity of the sealing ring (102), and one end of the power line (103) is electrically connected with the power supply (101);
the processing mechanism (2) comprises a display screen (201), a support frame (202), a damping spring (203), a heat dissipation aluminum plate (204), a mainboard (205), a heat dissipation fan (206) and a waterproof adhesive film (207), wherein the display screen (201) is fixedly embedded on the surface of the processing mechanism (2), the support frame (202) is integrally formed in an inner cavity of the processing mechanism (2), the damping spring (203) is fixedly installed on the upper surface of the support frame (202), a plurality of groups of damping springs (203) are arranged, the heat dissipation aluminum plate (204) is fixedly connected to the top of each damping spring (203), the mainboard (205) is fixedly installed on the upper surface of each heat dissipation aluminum plate (204), the heat dissipation fan (206) is fixedly installed at the bottom of the support frame (202), and the waterproof adhesive film (207) is fixedly wrapped on the surface of the;
the cooling mechanism (3) is composed of a spherical shield (301), semiconductor refrigerating sheets (302) and radiating holes (303), the semiconductor refrigerating sheets (302) are fixedly arranged in the inner cavity of the spherical shield (301) through a support, the semiconductor refrigerating sheets (302) are arranged in two groups, and the radiating holes (303) are formed in the surface of the spherical shield (301);
the adjusting mechanism (4) is composed of a mounting plate (401), mounting bolts (402), a conical sealing sleeve (403), universal balls (404), a screw rod (405) and a fixing plate (406), the mounting bolts (402) are inserted at two ends of the surface of the mounting plate (401), the conical sealing sleeve (403) is inserted in the middle of the surface of the mounting plate (401), a protective sleeve (501) penetrates through the inner cavity of the conical sealing sleeve (403), the universal balls (404) are movably inserted at two sides of the mounting bolts (402), the screw rod (405) is fixedly welded at the top of each universal ball (404), the fixing plate (406) is fixedly welded at the bottom of the cooling mechanism (3), and the fixing plate (406) penetrates through the top of each screw rod (405) in a spiral manner;
detection mechanism (5) are by protecting a section of thick bamboo (501), probe (502) and rubber block (503) and constitute, protect a fixed grafting in cooling mechanism (3) inner chamber of a section of thick bamboo (501) one end, and protect a section of thick bamboo (501) one end and be located semiconductor refrigeration piece (302) one side, it has probe (502) to protect a section of thick bamboo (501) inner chamber grafting, probe (502) other end passes through the wire and links to each other with mainboard (205) electrical property, probe (502) surface both sides all fix paste rubber block (503), and rubber block (503) are provided with the multiunit altogether, probe (502) surface links to each other with protecting a section of thick bamboo (501) inner wall through rubber block (503).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911407930.8A CN110926641A (en) | 2019-12-31 | 2019-12-31 | Plug-in temperature transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911407930.8A CN110926641A (en) | 2019-12-31 | 2019-12-31 | Plug-in temperature transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110926641A true CN110926641A (en) | 2020-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911407930.8A Withdrawn CN110926641A (en) | 2019-12-31 | 2019-12-31 | Plug-in temperature transmitter |
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| Country | Link |
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| CN (1) | CN110926641A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111649845A (en) * | 2020-06-11 | 2020-09-11 | 浙江奥新仪表有限公司 | Intelligent temperature transmitter |
-
2019
- 2019-12-31 CN CN201911407930.8A patent/CN110926641A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111649845A (en) * | 2020-06-11 | 2020-09-11 | 浙江奥新仪表有限公司 | Intelligent temperature transmitter |
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Application publication date: 20200327 |