CN110925903A - Semiconductor dehumidifier capable of being combined in modules and using method thereof - Google Patents
Semiconductor dehumidifier capable of being combined in modules and using method thereof Download PDFInfo
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- CN110925903A CN110925903A CN201911252700.9A CN201911252700A CN110925903A CN 110925903 A CN110925903 A CN 110925903A CN 201911252700 A CN201911252700 A CN 201911252700A CN 110925903 A CN110925903 A CN 110925903A
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- side wall
- air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/02—Ducting arrangements
- F24F13/04—Air-mixing units
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/08—Air-flow control members, e.g. louvres, grilles, flaps or guide plates
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/20—Casings or covers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F13/222—Means for preventing condensation or evacuating condensate for evacuating condensate
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/28—Arrangement or mounting of filters
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F3/00—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems
- F24F3/12—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling
- F24F3/14—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification
- F24F2003/144—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only
- F24F2003/1446—Air-conditioning systems in which conditioned primary air is supplied from one or more central stations to distributing units in the rooms or spaces where it may receive secondary treatment; Apparatus specially designed for such systems characterised by the treatment of the air otherwise than by heating and cooling by humidification; by dehumidification by dehumidification only by condensing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F13/00—Details common to, or for air-conditioning, air-humidification, ventilation or use of air currents for screening
- F24F13/22—Means for preventing condensation or evacuating condensate
- F24F2013/221—Means for preventing condensation or evacuating condensate to avoid the formation of condensate, e.g. dew
Abstract
The invention discloses a semiconductor dehumidifier which can be combined by modules and a using method thereof, belonging to the technical field of a dehumidifier device, in particular to a semiconductor dehumidifier which can be combined by modules and a using method thereof, comprising a shell, an inner bin, a groove and a convex strip, wherein the semiconductor dehumidifier which can be combined by modules and the using method thereof, the cold end of a semiconductor refrigeration sheet cools air, when the air is cooled to be lower than the dew point of ambient air, water vapor in the air is condensed at the cold end to drip on a water receiving tray at the bottom, meanwhile, part of the air flows through the hot end of the semiconductor to be heated and dehumidified to become dry air, the cooled low-temperature air is mixed with the dried high-temperature air at an air outlet, thereby preventing the low-temperature air from being condensed water beads when encountering humid air at the air outlet, by utilizing the combination mode of the convex strip and the groove, and carrying out the combination connection by a USB plug and a USB socket on a slide, the size of the applicable place can be adjusted as required, and the flexibility is strong.
Description
Technical Field
The invention relates to the technical field of dehumidification devices, in particular to a semiconductor dehumidifier capable of being combined in a module mode and a using method thereof.
Background
The dehumidifier uses the fan to pump the damp air into the dehumidifier, through the heat exchange treatment, along with the continuous improvement of the living standard of people in recent years, the renewal of the consumption concept of people and the improvement of the health cognition degree of people, the dehumidifier is gradually expanded from the former commercial use to the household use, and becomes one of the indispensable modern household electrical appliances of many families.
The semiconductor dehumidifier classifies one of the dehumidifiers, and the semiconductor dehumidifier is a novel dehumidifier for dehumidifying by semiconductor refrigeration, and is generally only suitable for small spaces, such as wardrobes, cabinets, shoe cabinets and toilets.
When the existing semiconductor dehumidifier is used, the discharged low-temperature air can condense water drops when meeting humid air at an air outlet position, the use effect of the device is easily influenced, the dehumidification amount of the semiconductor dehumidifier on the existing market is generally between 100ml/24h and 600ml/24h, the semiconductor dehumidifier is generally recommended to be used in a space within 20 square meters, the use flexibility is reduced under the condition of lacking of module combination, the adjustability of an application place is poor, and the popularization and the use of the semiconductor dehumidifier are limited and hindered.
Disclosure of Invention
The invention aims to provide a semiconductor dehumidifier capable of being combined in a module mode and a using method thereof, and aims to solve the problems that in the using process of the existing semiconductor dehumidifier in the background technology, the discharged low-temperature air can condense water drops when meeting humid air at an air outlet position, the using effect of the device is easily influenced, the dehumidifying amount of the semiconductor dehumidifier in the current market is generally between 100ml/24h and 600ml/24h, the semiconductor dehumidifier is generally suggested to be used in a space within 20 square meters, the using flexibility is reduced under the condition of lacking the module combination, the adjustability of the applicable place is poor, and the popularization and the use of the semiconductor dehumidifier are limited and prevented.
In order to achieve the purpose, the invention provides the following technical scheme: a semiconductor dehumidifier capable of being combined in a module manner comprises a shell, an inner bin, a groove and a convex strip, wherein the inner part of the shell is connected with the inner bin in an integrated manner, the groove is reserved on the right side wall of the shell, the left side wall of the shell is fixedly connected with the convex strip through a bolt, an air inlet grille is arranged on the front side wall of the shell, the bottom of the shell is connected with a water outlet through a flange, an air outlet is reserved on the top of the shell, a frame is fixedly connected with the rear side wall of an inner cavity of the inner bin through a screw, a semiconductor refrigerating sheet is fixedly connected with the right side wall of the inner cavity of the shell through a screw, a direct current fan is fixedly connected with the left side wall and the right side wall of the inner cavity of the shell through a screw, a current socket is reserved on the right side, the utility model discloses a semiconductor refrigeration piece, including recess, inner chamber, spout, inside wall, outside wall, inside wall, outside wall, inside wall, bonding have the slider, the top of slider is pegged graft and is had the USB plug, the electric output of USB plug.
Preferably, the front side wall of the housing is movably connected with a flip cover through a hinge.
Preferably, the inner frame is fixedly connected to the rear side wall of the inner cavity of the air inlet grille through screws, a double-layer metal wire separation net is bonded inside the inner frame, and a filter disc is clamped inside the double-layer metal wire separation net.
Preferably, the left side wall and the right side wall of the inner cavity of the shell are fixedly connected with a water receiving disc through screws, the output end of the bottom of the water receiving disc is connected with a pipeline through a flange, the outer wall of a circular shaft of the pipeline is connected with a check valve through a flange, and the output end of the pipeline is fixedly connected with the input end of the water outlet through a flange.
Preferably, the height and the depth of the groove are matched with the height and the width of the convex strip, and the USB socket is matched with the USB plug.
Preferably, the left side wall and the right side wall of the inner cavity of the inner groove are fixedly connected with side strips through screws, shaft rods are inserted into the front side wall and the rear side wall of each side strip, rollers are inserted into the outer walls of the circumferences of the shaft rods, and the left side wall and the right side wall of each roller are in contact with the left side wall and the right side wall of the inner groove plate.
Preferably, a hard rubber plate is bonded to the front side wall of the slider, and transverse grains are formed in the front side wall of the hard rubber plate.
A method for using a semiconductor dehumidifier capable of being combined by modules comprises the following steps:
s1: single module detection: inserting a direct current plug into the current socket on the right side wall of the shell, checking whether single-module operation can be carried out or not, forcibly sucking air from the air inlet grille by the direct current motor, enabling the air to flow through the semiconductor refrigerating sheet, cooling the air by the cold end of the semiconductor refrigerating sheet, observing whether water vapor in the air is formed at the cold end and can drip on the water receiving tray or not, and judging whether the position of the air outlet is used for normally exhausting air or not;
s2: and (3) checking accessories: ensuring that the USB socket at the top of the groove and the USB plug at the top of the raised line are complete and effective;
s3: combining: aligning another convex strip of another device with the groove on the right side wall of the shell, and pushing and applying force on the side surface of the other device to enable the another convex strip on the other device to be inserted into the groove;
s4: electrical connection: pushing the sliding block to enable the sliding block to be matched with the inner groove plate to slide in the inner groove, so that the USB plug moves in position and can be electrically connected with the USB socket;
s5: multi-module detection: after the modules are combined, a direct current plug is inserted into the current jack, and whether the other device can normally supply power to operate under the condition that the USB plug is electrically connected with the USB jack is observed.
Compared with the prior art, the invention has the beneficial effects that: the semiconductor dehumidifier capable of being combined by modules and the using method thereof are applied by combining accessories, the cold end of a semiconductor refrigeration sheet cools air, when the air is cooled to be lower than the dew point of ambient air, water vapor in the air is condensed into water at the cold end and drips on a water receiving tray at the bottom, meanwhile, part of air flows through the hot end of the semiconductor, the air is heated and dehumidified to become dry air, the cooled low-temperature air and the dry high-temperature air are mixed at an air outlet, condensation of water drops caused by the low-temperature air meeting humid air at the air outlet can be avoided, the combination mode of convex strips and grooves is utilized, the USB plug on a sliding block is combined with a USB socket, the module combination is electrically connected, single-module independent work or multi-module combination work can be realized, the size of an applicable place can be adjusted according to needs, and the flexibility is strong.
Drawings
FIG. 1 is a schematic front view of the present invention;
FIG. 2 is a schematic view of the interior of the front structure of the present invention;
FIG. 3 is a schematic view of a rib structure according to the present invention;
FIG. 4 is a schematic view of a side structure of a protrusion according to the present invention;
FIG. 5 is a schematic diagram of the steps of the present invention.
In the figure: 100 outer shell, 110 flip, 120 air inlet grille, 130 water outlet, 140 air outlet, 200 inner bin, 210 semiconductor refrigeration piece, 220 DC fan, 230PCB, 240 current socket, 300 groove, 310USB socket, 400 convex strip, 410 movable groove, 420 sliding groove, 430 inner groove, 440 inner groove plate, 450 sliding block, 460USB plug.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention provides a semiconductor dehumidifier capable of being combined in modules and a using method thereof, which are convenient for reducing the defect of condensed water drops at an air outlet position and improving the flexibility of combination and use by combining and applying accessories, please refer to fig. 1-5, and the semiconductor dehumidifier comprises a shell 100, an inner bin 200, a groove 300 and a convex strip 400;
referring to fig. 1 again, the front side wall of the housing 100 has a flip 110, specifically, the front side wall of the housing 100 is movably connected to the flip 110 through a hinge, the front side wall of the housing 100 is provided with an air inlet grille 120, the bottom of the housing 100 is connected to a water outlet 130 through a flange, and the top of the housing 100 is reserved with an air outlet 140;
referring to fig. 2 again, the exterior of the inner chamber 200 is fixedly connected to the outer casing 100, specifically, the interior of the outer casing 100 is integrally connected to the inner chamber 200, the rear side wall of the inner chamber 200 is fixedly connected to a frame by screws, the right side wall of the frame is fixedly connected to a semiconductor refrigeration sheet 210 by screws, the left and right side walls of the inner chamber of the outer casing 100 are fixedly connected to a dc fan 220 by bolts, the right side wall of the inner chamber of the outer casing 100 is fixedly connected to a PCB230 by screws, a current socket 240 is reserved on the right side wall of the PCB230, the current socket 240 penetrates through the right side wall of the inner, the semiconductor refrigerating plate 210 is also called a thermoelectric refrigerating plate, and when direct current passes through a couple formed by connecting two different semiconductor materials in series by using the peltier effect of the semiconductor materials, the purpose of refrigeration can be realized by respectively absorbing heat and releasing heat at two ends of the couple, and the couple is a refrigeration technology generating negative thermal resistance; the dc fan 220 is a fan that rotates a dc motor to drive a fan impeller to rotate by inputting dc power, thereby realizing a process of converting dc power into mechanical power, and since the dehumidification process of the semiconductor dehumidifier is the prior art, all related accessories are not described herein; the current plug 240 includes not only a 12V dc power outlet;
referring to fig. 2 again, the left sidewall of the groove 300 is fixedly connected to the right sidewall of the housing 100, specifically, the groove 300 is reserved on the right sidewall of the housing 100, the USB socket 310 is reserved on the top of the cavity of the groove 300, and the electrical input terminal of the USB socket 310 is electrically connected to the electrical output terminal of the PCB230, wherein relevant parameters such as voltage, maximum output current, output power and the like which can be provided by the USB socket can be adjusted according to specific regulations and practical situations;
referring to fig. 2-4 again, the right side wall of the protruding strip 400 is fixedly connected to the left side wall of the housing 100, specifically, the left side wall of the housing 100 is fixedly connected to the protruding strip 400 through a bolt, the top of the protruding strip 400 is integrally connected to a movable slot 410, the front side wall of the movable slot 410 is integrally connected to a sliding slot 420, the front side wall of the sliding slot 420 is opened and closed with an inner slot 430, the inner slot 430 is slidably connected to an inner slot plate 440, a sliding block 450 is adhered to the front side wall of the inner slot plate 440, a USB plug 460 is inserted on the top of the sliding block 450, an electrical output end of the USB plug 460 is electrically connected to the dc fan 220 and an electrical input end of the semiconductor refrigeration sheet 210 through a wire, wherein the USB plug 460 can ensure a connection effect by utilizing a self-locking property with the USB socket 310, and can also be according to requirements of actual use places, under the condition of external vibration, the housings 100 of the two modules are tightly connected in cooperation with external fixing means such as a cross plate and bolts to ensure the stability of the USB plug 460 and the USB socket 310;
a method for using a semiconductor dehumidifier capable of being combined by modules comprises the following steps:
s1: single module detection: inserting a direct current plug into a current socket 240 on the right side wall of the shell 100, checking whether single-module operation can be performed or not, forcibly sucking air from the air inlet grille 120 by using the direct current motor 220, allowing the air to flow through the semiconductor refrigeration sheet 210, cooling the air by using the cold end of the semiconductor refrigeration sheet 210, observing whether water vapor in the air is formed at the cold end and drops on the water pan or not, and whether the position of the air outlet 140 is normally exhausted;
s2: and (3) checking accessories: the USB socket 310 at the top of the groove 300 and the USB plug 460 at the top of the convex strip 400 are ensured to be complete and effective;
s3: combining: aligning the other convex strip 400 of the other device with the groove 300 on the right side wall of the shell 100, and pushing and applying force on the side surface of the other device to enable the other convex strip 400 on the other device to be inserted into the groove 300;
s4: electrical connection: pushing the sliding block 450 to make the sliding block 450 slide in the inner groove 430 in cooperation with the inner groove plate 440, so that the USB plug 460 moves and can be electrically connected to the USB socket 310;
s5: multi-module detection: after the module assembly is completed, a dc plug is inserted into the current outlet 240 to observe whether another device can perform normal power supply operation under the condition that the USB plug 460 and the USB outlet 310 are electrically connected.
When the air conditioner is used specifically, firstly, a direct current plug is inserted into the current socket 240 on the right side wall of the shell 100, whether single-module operation can be carried out is checked, air is forcibly sucked from the air inlet grille 120 by the direct current motor 220, the air flows through the semiconductor refrigerating sheet 210, the cold end of the semiconductor refrigerating sheet 210 cools the air, water vapor in the air is observed to be condensed into water at the cold end, whether the water vapor can drip on a water receiving tray or not is observed, and whether the position of the air outlet 140 is normally exhausted; the USB socket 310 at the top of the groove 300 and the USB plug 460 at the top of the convex strip 400 are ensured to be complete and effective; aligning the other convex strip 400 of the other device with the groove 300 on the right side wall of the shell 100, and pushing and applying force on the side surface of the other device to enable the other convex strip 400 on the other device to be inserted into the groove 300; pushing the sliding block 450 to make the sliding block 450 slide in the inner groove 430 in cooperation with the inner groove plate 440, so that the USB plug 460 moves and can be electrically connected to the USB socket 310; after the module combination is completed, through inserting the direct current plug in the current socket 240, observe whether another device can be under the condition of USB plug 460 and USB socket 310 electric connection, carry out normal power supply operation, the cold junction of semiconductor refrigeration 210 pieces cools down the air, when cooling to be less than ambient air dew point, vapor in the air coalesces into water at the cold junction, drip on the bottom water collector, part of air flows through the hot junction of semiconductor simultaneously, the air intensifies and dehumidifies, become dry air, the low temperature air after the cooling mixes with the high temperature air after the drying at air outlet 140, can avoid low temperature air to meet humid air at air outlet 140 and condense the drop.
Referring to fig. 1 again, in order to filter air while extracting wind power and ensure stable internal environment of the casing 100, specifically, the rear side wall of the inner cavity of the air inlet grille 120 is fixedly connected with an inner frame through screws, a double-layer metal wire separation net is bonded inside the inner frame, and a filter plate is clamped inside the double-layer metal wire separation net.
Referring to fig. 1 again, in order to guide the water source and prevent backflow, specifically, the left and right sidewalls of the inner cavity of the housing 100 are fixedly connected with a water pan through screws, the bottom output end of the water pan is connected with a pipeline through a flange, the outer wall of the circular shaft of the pipeline is connected with a check valve through a flange, and the output end of the pipeline is fixedly connected with the input end of the water outlet 130 through a flange.
Referring again to fig. 2-3, to ensure the stability of the module assembly, specifically, the height and depth of the groove 300 and the height and width of the protrusion 400 are matched, and the USB socket 310 is matched with the USB plug 460.
Referring to fig. 3-4 again, in order to make the sliding block 450 move smoothly in the sliding groove 420, specifically, the left and right side walls of the inner cavity of the inner groove 430 are fixedly connected with side bars through screws, the front and rear side walls of the side bars are inserted with shaft rods, the circumferential outer walls of the shaft rods are inserted with rollers, and the left and right side walls of the rollers are in contact with the left and right side walls of the inner groove plate 440.
Referring to fig. 3 again, in order to ensure the friction force during the pushing of the slider 450 and reduce the slipping risk, specifically, a hard rubber plate is bonded to the front side wall of the slider 450, and a cross grain is formed on the front side wall of the hard rubber plate.
While the invention has been described above with reference to an embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the invention. In particular, the various features of the embodiments disclosed herein may be used in any combination, provided that there is no structural conflict, and the combinations are not exhaustively described in this specification merely for the sake of brevity and conservation of resources. Therefore, it is intended that the invention not be limited to the particular embodiments disclosed, but that the invention will include all embodiments falling within the scope of the appended claims.
Claims (8)
1. A semiconductor dehumidifier which can be combined by modules is characterized in that: the air-conditioning cabinet comprises a shell (100), an inner bin (200), a groove (300) and a convex strip (400), wherein the inner bin (200) is connected with the shell (100) through an integrated forming mode, the groove (300) is reserved on the right side wall of the shell (100), the convex strip (400) is fixedly connected with the left side wall of the shell (100) through a bolt, an air inlet grille (120) is arranged on the front side wall of the shell (100), a water outlet (130) is connected with the bottom of the shell (100) through a flange, an air outlet (140) is reserved on the top of the shell (100), a frame is fixedly connected with the rear side wall of an inner cavity of the inner bin (200) through a bolt, a semiconductor refrigerating sheet (210) is fixedly connected with the right side wall of the frame through a bolt, a direct current fan (220) is fixedly connected with the left side wall and right side wall of the inner cavity of the shell (100), a current jack (240) is reserved on the right side wall of the PCB (230), the current jack (240) penetrates through the right side wall of the inner cavity of the shell (100), a USB socket (310) is reserved at the top of the inner cavity of the groove (300), the electrical input end of the USB socket (310) is electrically connected with the electrical output end of the PCB (230), the top of the convex strip (400) is integrally connected with a movable groove (410), the front side wall of the movable groove (410) is integrally connected with a sliding groove (420), an inner groove (430) is opened and closed on the front side wall of the sliding groove (420), an inner groove plate (440) is connected inside the inner groove (430) in a sliding manner, a sliding block (450) is bonded on the front side wall of the inner groove plate (440), a USB plug (460) is inserted at the top of the sliding block (450), the electrical output end of the USB plug (460) is electrically connected with the electrical input ends of the direct current fan (220) and the semiconductor refrigeration piece (210) through a lead.
2. The semiconductor dehumidifier of claim 1, wherein: the front side wall of the shell (100) is movably connected with a flip cover (110) through a hinge.
3. The semiconductor dehumidifier of claim 1, wherein: the air inlet grille is characterized in that the rear side wall of the inner cavity of the air inlet grille (120) is fixedly connected with an inner frame through screws, a double-layer metal wire separation net is bonded inside the inner frame, and a filter disc is clamped inside the double-layer metal wire separation net.
4. The semiconductor dehumidifier of claim 1, wherein: the water receiving plate is fixedly connected to the left side wall and the right side wall of the inner cavity of the shell (100) through screws, the output end of the bottom of the water receiving plate is connected with a pipeline through a flange, the outer wall of a circular shaft of the pipeline is connected with a check valve through a flange, and the output end of the pipeline is fixedly connected with the input end of the water outlet (130) through a flange.
5. The semiconductor dehumidifier of claim 1, wherein: the height and the depth of the groove (300) and the height and the width of the convex strip (400) are matched, and the USB socket (310) is matched with the USB plug (460).
6. The semiconductor dehumidifier of claim 1, wherein: the left side wall and the right side wall of the inner cavity of the inner groove (430) are fixedly connected with side strips through screws, shaft rods are inserted into the front side wall and the rear side wall of each side strip, rollers are inserted into the outer walls of the circumferences of the shaft rods, and the left side wall and the right side wall of each roller are in contact with the left side wall and the right side wall of the inner groove plate (440).
7. The semiconductor dehumidifier of claim 1, wherein: the front side wall of the sliding block (450) is bonded with a hard rubber plate, and the front side wall of the hard rubber plate is provided with transverse grains.
8. A method of using a semiconductor dehumidifier as claimed in any one of claims 1 to 7 in which: the use method of the semiconductor dehumidifier capable of being combined by modules comprises the following steps:
s1: single module detection: inserting a direct current plug into the current socket (240) on the right side wall of the shell (100), checking whether single-module operation can be performed or not, forcibly sucking air from the air inlet grille (120) by the direct current motor (220), enabling the air to flow through the semiconductor refrigerating sheet (210), cooling the air by the cold end of the semiconductor refrigerating sheet (210), observing whether water vapor formed by condensation of the water in the air at the cold end drops on the water receiving tray or not, and judging whether the position of the air outlet (140) is normally exhausted;
s2: and (3) checking accessories: ensuring that the USB socket (310) at the top of the groove (300) and the USB plug (460) at the top of the convex strip (400) are complete and effective;
s3: combining: aligning another convex strip (400) of another device with the groove (300) on the right side wall of the shell (100), and pushing and applying force on the side surface of the other device to enable the other convex strip (400) on the other device to be inserted into the groove (300);
s4: electrical connection: pushing the sliding block (450), so that the sliding block (450) can be matched with the inner groove plate (440) to slide in the inner groove (430), the position of the USB plug (460) is moved, and the USB plug can be electrically connected with the USB socket (310);
s5: multi-module detection: after the module combination is completed, whether another device can perform normal power supply operation under the condition that the USB plug (460) is electrically connected with the USB socket (310) is observed by inserting a direct current plug into the current socket (240).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911252700.9A CN110925903A (en) | 2019-12-09 | 2019-12-09 | Semiconductor dehumidifier capable of being combined in modules and using method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911252700.9A CN110925903A (en) | 2019-12-09 | 2019-12-09 | Semiconductor dehumidifier capable of being combined in modules and using method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110925903A true CN110925903A (en) | 2020-03-27 |
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| CN201911252700.9A Pending CN110925903A (en) | 2019-12-09 | 2019-12-09 | Semiconductor dehumidifier capable of being combined in modules and using method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113983620A (en) * | 2021-10-27 | 2022-01-28 | 郑州新基业汽车电子有限公司 | Novel multi-functional clarifier of electricity generation |
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