CN110923770A - Electroplating method and electroplating device for circuit board - Google Patents
Electroplating method and electroplating device for circuit board Download PDFInfo
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- CN110923770A CN110923770A CN201911224861.7A CN201911224861A CN110923770A CN 110923770 A CN110923770 A CN 110923770A CN 201911224861 A CN201911224861 A CN 201911224861A CN 110923770 A CN110923770 A CN 110923770A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/06—Suspending or supporting devices for articles to be coated
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- Chemical Kinetics & Catalysis (AREA)
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- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses an electroplating method and an electroplating device for a circuit board. The electroplating method of the circuit board comprises the following steps: pasting an identification code on the surface of a plate to be electroplated, and acquiring the identification code information of the plate to be electroplated; fixing the plate to be electroplated, which is pasted with the identification code, by adopting a clamp of the flying bar, wherein the clamp is provided with a serial number; associating the serial number of the clamp for fixing the plate to be electroplated with the identification code information of the plate to be electroplated; and (4) transferring the flying bars of the plate to be electroplated into the electroplating cylinder, and carrying out electroplating operation. According to the technical scheme, the position of the plate to be electroplated on the flying bar can be traced, so that the running track of the electroplated plate in the electroplating cylinder can be traced, and the electroplating operation is facilitated.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to an electroplating method and an electroplating device for a circuit board.
Background
In the related art, a method of plating a circuit board generally hangs the circuit board to be plated on a flying bar in a plating line, and then performs a plating operation in a plating tank. However, because the number of the circuit board plates hung on the flying bar is large, and the position of each plate on the flying bar cannot be traced, the running track of the plate in the electroplating cylinder cannot be traced, and the electroplating operation is not facilitated.
The above is only for the purpose of assisting understanding of the technical aspects of the present invention, and does not represent an admission that the above is prior art.
Disclosure of Invention
The invention mainly aims to provide an electroplating method and an electroplating device of a circuit board, aiming at tracing back the position of a plate to be electroplated on a flying bar and further tracing back the running track of the plate to be electroplated in an electroplating cylinder, and being beneficial to the electroplating operation of the plate.
In order to achieve the purpose, the electroplating method of the circuit board provided by the invention comprises the following steps:
pasting an identification code on the surface of a plate to be electroplated, and acquiring the identification code information of the plate to be electroplated;
fixing the plate to be electroplated, which is pasted with the identification code, by adopting a clamp of the flying bar, wherein the clamp is provided with a serial number;
associating the serial number of the clamp for fixing the plate to be electroplated with the identification code information of the plate to be electroplated;
and (4) transferring the flying bars of the plate to be electroplated into the electroplating cylinder, and carrying out electroplating operation.
Optionally, the identification code is a graphic code or a digital code.
Optionally, the flying bar is provided with a plurality of clamps, and at least two clamps fix one electroplated panel;
in the step of the serial number of the clip of fixing waiting to electroplate the plate with wait to electroplate the identification code information correlation of plate, include:
reading the serial number of one clamp for fixing the same plate to be electroplated;
and associating the serial number of the clamp with the identification code corresponding to the plate to be electroplated.
Optionally, the flying bar is provided with a plurality of clamps, and at least two clamps fix one electroplated panel;
in the step of the serial number of the clip of fixing waiting to electroplate the plate with wait to electroplate the identification code information correlation of plate, include:
reading the serial number of each clamp for fixing the same plate to be electroplated;
and associating the serial number of each clip with the identification code of the corresponding plate to be electroplated.
Optionally, in the step of applying the identification code to the surface of the plate to be electroplated, the method includes:
and pasting an identification code on the surface of the plate to be electroplated, wherein the identification code is pasted on the edge of the plate to be electroplated.
The invention also provides an electroplating device of the circuit board, which comprises the following components: a plating cylinder containing a plating solution therein; a flying bar provided with a clip; the collecting device is used for collecting the identification code information of the plate to be electroplated; and the control device is electrically connected with the acquisition equipment and is used for associating the serial number of the clamp for fixing the plate to be electroplated with the identification code of the plate to be electroplated.
Optionally, the acquisition device is a code reader.
Optionally, the clip is provided with a plurality of, and a plurality of the clip is along the length direction interval setting of flying the crust, at least two the clip is fixed the same panel that waits to electroplate.
Optionally, the flying bar is arranged above the electroplating cylinder; and/or the acquisition device is disposed proximate to the femto.
Optionally, the electroplating device of the circuit board further comprises a control switch, and the control switch is electrically connected to the clip and the control device and used for controlling the opening or closing of the clip.
According to the technical scheme, firstly, an identification code is pasted on the surface of the plate to be electroplated, and the identification code information of the plate to be electroplated is collected so as to identify and mark the plate to be electroplated. And then fixing the plate to be electroplated, which is coated with the identification code, on a clamp of the flying bar. And then, associating the acquired identification code of the surface of the plate to be electroplated with the serial number of the clamp for fixing the plate to be electroplated to obtain an association table of the identification code and the serial number of the clamp. And then transferring the flying bars fixed with the plate to be electroplated into an electroplating cylinder for electroplating operation. In this way, since the position of the clamp on the flying bar is fixed, the position of the plate to be electroplated on the flying bar can be traced back according to the associated table, so that the positioning of the plate to be electroplated in the electroplating cylinder is realized, and the electroplating operation is facilitated.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic flow chart illustrating steps of an embodiment of a method for plating a circuit board according to the present invention;
FIG. 2 is a schematic flow chart illustrating a detailed step of step S30 in the method for plating a circuit board according to an embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a detailed step of step S30 in the electroplating method for circuit board according to another embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an embodiment of an electroplating apparatus for a circuit board according to the present invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | |
30 | |
| 10 | |
40 | |
| 20 | |
50 | |
| 21 | |
200 | Plate to be electroplated |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the technical solutions in the embodiments of the present invention may be combined with each other, but it must be based on the realization of those skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination of technical solutions should not be considered to exist, and is not within the protection scope of the present invention.
The invention provides an electroplating method of a circuit board.
Referring to fig. 1, in an embodiment of the electroplating method of the circuit board of the present invention, the electroplating method of the circuit board includes the following steps:
s10, pasting an identification code on the surface of the plate to be electroplated, and acquiring the identification code information of the plate to be electroplated;
s20, fixing the plate to be electroplated, to which the identification code is attached, by using a clamp of the flying bar, wherein the clamp is provided with a serial number;
s30, associating the serial number of the clamp for fixing the plate to be electroplated with the identification code information of the plate to be electroplated;
and S40, transferring the flying bars fixed with the plate to be electroplated into the electroplating cylinder to carry out electroplating operation.
Specifically, the identification code is first attached to the surface of the plate to be electroplated, the identification code may be directly attached to the surface of the plate to be electroplated when the plate to be electroplated is processed, or the surface identification code may be attached to the surface of the plate to be electroplated after the plate to be electroplated is processed, which is not limited herein. The plate to be electroplated is a circuit board, and the identification code is used for marking the plate to be electroplated. And then, acquiring the identification code information of the surface of the plate to be electroplated by utilizing acquisition equipment so as to identify and mark the plate to be electroplated. And then fixing the plate to be electroplated, which is coated with the identification code, on a clamp of the flying bar. It should be noted that, a clip is provided on the flying bar, the position of the clip on the flying bar is fixed, and the clip is provided with a serial number for marking and distinguishing the clip. And then associating the acquired identification code of the surface of the plate to be electroplated with the serial number of the clamp for fixing the plate to be electroplated to obtain an association table of the identification code and the serial number of the clamp. It can be understood that the serial number of the clip is first entered into the table, and then the collected identification code information is filled into the table corresponding to the serial number of the clip, so as to obtain the associated table of the two. Therefore, the position of the plate to be electroplated on the flying bar can be traced. And then transferring the flying bar fixed with the plate to be electroplated into an electroplating cylinder for electroplating operation, and tracing the position of the plate to be electroplated on the flying bar to the position of the plate to be electroplated in the electroplating cylinder so as to be beneficial to electroplating operation.
Therefore, it can be understood that, according to the technical scheme of the invention, the identification code is firstly pasted on the surface of the plate to be electroplated, and the identification code information of the plate to be electroplated is collected so as to identify and mark the plate to be electroplated. And then fixing the plate to be electroplated, which is coated with the identification code, on a clamp of the flying bar. And then, associating the acquired identification code of the surface of the plate to be electroplated with the serial number of the clamp for fixing the plate to be electroplated to obtain an association table of the identification code and the serial number of the clamp. And then transferring the flying bars fixed with the plate to be electroplated into an electroplating cylinder for electroplating operation. In this way, since the position of the clamp on the flying bar is fixed, the position of the plate to be electroplated on the flying bar can be traced back according to the associated table, so that the positioning of the plate to be electroplated in the electroplating cylinder is realized, and the electroplating operation is facilitated.
Optionally, the identification code is a graphic code or a digital code. Both the graphic code and the numerical code can be used for marking the plate to be electroplated, and one of the graphic code and the numerical code can be selected. The graphic code can be a two-dimensional code, and is simple and effective to set.
In one embodiment of the invention, the flying bar is provided with a plurality of clamps, and at least two clamps fix a plate to be electroplated. Generally, at least two clamps are generally adopted to effectively fix the same plate to be electroplated in order to ensure the installation stability of the plate to be electroplated.
Referring to fig. 2, S30, the step of associating the serial number of the clip for fixing the plate to be plated with the identification code information of the plate to be plated includes:
s31a, reading the serial number of one of the clamps for fixing the same plate to be electroplated;
and S32a, associating the serial number of the clamp with the identification code information of the corresponding plate to be electroplated.
Because the same plate to be electroplated is fixed by the plurality of clips, when the plate to be electroplated is identified, only the serial number of one clip can be associated with the identification code information of the corresponding plate to be electroplated, namely, only the serial number of one clip is needed to be adopted, and then the serial number of the clip and the identification code information of the corresponding plate to be electroplated are filled in a table to obtain an association table of the serial number and the identification code information. Thus, the operation can be simplified, and the efficiency of the identification correlation operation can be improved.
Referring to fig. 3, in an embodiment of the present invention, the step of associating the serial number of the clip for fixing the plate to be plated with the identification code of the plate to be plated in S30 includes:
s31b, reading the serial number of each clamp for fixing the same plate to be electroplated;
and S31b, associating the serial number of each clip with the identification code of the corresponding plate to be electroplated.
Because the same plate to be electroplated is fixed by the plurality of clips, when the plate to be electroplated is identified, the serial number of each clip for fixing the plate to be electroplated can be associated with the plate to be electroplated to form an associated table of the two, so that the position of the plate to be electroplated can be traced by selecting any associated information from the associated table, and the situation that the positioning of the plate to be electroplated is invalid due to the error of the associated information of a certain clip can be avoided. Meanwhile, the number of the clips for fixing the plate to be electroplated can be identified through the associated tables of the two.
Further, in the step of pasting the identification code on the surface of the plate to be electroplated, the method comprises the following steps:
and pasting an identification code on the surface of the plate to be electroplated, wherein the identification code is pasted on the edge of the plate to be electroplated.
The identification code is pasted on the edge of the plate to be electroplated, so that the collection and identification operation of the identification code can be facilitated, and meanwhile, the pasting operation of the identification code is also facilitated.
The invention also provides a circuit board electroplating device 100 applied to the circuit board electroplating method.
Referring to fig. 4, in an embodiment of the electroplating apparatus 100 for a circuit board of the present invention, the electroplating apparatus 100 for a circuit board includes: a plating cylinder 10, the plating cylinder 10 containing a plating solution therein; a flying bar 20, the flying bar 20 being provided with a clip 21; the collecting device 30, the collecting device 30 is used for collecting the identification code of the plate 200 to be electroplated; and the control device 40, the control device 40 is electrically connected to the collecting equipment 30, and is used for associating the serial number of the clamp 21 for fixing the plate to be electroplated 200 with the identification code information of the plate to be electroplated 200.
Specifically, the plating cylinder 10 is filled with a plating solution for a plating operation of a circuit board. The flying bar 20 is fixed with a clamp 21 for clamping and fixing the circuit board. The collecting device 30 is used for collecting the identification code of the surface of the plate 200 to be electroplated. The control device 40 is electrically connected to the collecting device 30 through a wire, so that the collecting device 30 can upload the collected identification code information to the control device 40, the control device 40 has previously input the serial number of the clamp 21 on the flying bar 20, and at this time, the collected identification code information on the surface of the plate 200 to be plated is associated with the serial number of the clamp 21 for fixing the plate 200 to be plated, so as to obtain an associated table of the two. Since the position of the clamp 21 on the flying bar 20 is fixed, the position of the plate to be plated 200 on the flying bar 20 can be traced back according to the associated table, so as to realize the positioning of the plate to be plated 200 in the plating cylinder 10, thereby facilitating the subsequent plating operation.
Optionally, the acquisition device 30 is a code reader. Generally, the identification code attached to the surface of the plate to be electroplated 200 is a two-dimensional code, and the collecting device 30 is a code reader, which can read the two-dimensional code information of the surface of the plate to be electroplated 200 to identify the mark of the plate to be electroplated 200.
Optionally, a plurality of clamps 21 are provided, the plurality of clamps 21 are arranged at intervals along the length direction of the flying bar 20, and at least two clamps 21 fix the same plate 200 to be electroplated.
Since the electroplating operation of the circuit board is to perform the electroplating operation on a plurality of plates 200 to be electroplated simultaneously to improve the electroplating efficiency, a plurality of clips 21 are disposed on the flying bar 20 for clipping and fixing the plurality of plates 200 to be electroplated. Generally, a plurality of clips 21 are spaced along the length of the flying bar 20, and optionally, a plurality of clips 21 are uniformly distributed, so as to facilitate the plating operation of a plurality of plates 200 to be plated. In order to ensure the installation stability of the plate member 200 to be electroplated, at least two clamps 21 are generally adopted to effectively fix the same plate member 200 to be electroplated.
Optionally, a femto 20 is provided above the plating cylinder 10. So set up, will wait to electroplate plate 200 and fix the back on flying the clip 21 of barre 20, can directly transfer down to electroplating cylinder 10 and carry out the electroplating operation through flying the barre 20 of waiting to electroplate plate 200 with fixing, make the removal operation of flying barre 20 simple and quick more like this to improve the electroplating efficiency of circuit board. It should be noted that, an adjusting mechanism is generally provided to move the flying bar 20, and the adjusting mechanism may be a lifting mechanism, such as a screw rod and a nut mechanism that are matched, or a gear and rack structure that are engaged with each other, or other reasonable and effective mechanisms, and therefore, the details are not repeated herein.
Optionally, an acquisition device 30 is disposed adjacent to the femto 20. Like this treat the identification code information on electroplating plate 200 surface and gather the back, will treat that electroplating plate 200 is fixed to flying to the crust 20 comparatively fast to save operating time, thereby improve the electroplating efficiency of whole circuit board.
Further, the electroplating device 100 for circuit board further includes a control switch 50, and the control switch 50 is electrically connected to the clamp 21 and the control device 40, and is used for controlling the opening or closing of the clamp 21.
Here, the setting of the control switch 50 is used to control the opening or closing operation of the clamp 21, so that the operation of clamping and fixing the plate member to be plated 200 is automated, and the operation efficiency is improved. It should be noted that one control switch 50 controls the opening or closing operation of one clip 21, that is, here, the number of control switches 50 is provided in plural, and the number of one control switch 50 is used to control the opening or closing operation of one clip 21.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A method for electroplating a circuit board is characterized by comprising the following steps:
pasting an identification code on the surface of a plate to be electroplated, and acquiring the identification code information of the plate to be electroplated;
fixing the plate to be electroplated, which is pasted with the identification code, by adopting a clamp of the flying bar, wherein the clamp is provided with a serial number;
associating the serial number of the clamp for fixing the plate to be electroplated with the identification code information of the plate to be electroplated;
and (4) transferring the flying bars of the plate to be electroplated into the electroplating cylinder, and carrying out electroplating operation.
2. The method for plating a wiring board according to claim 1, wherein the identification code is a graphic code or a numeric code.
3. The method for plating a wiring board according to claim 1, wherein said flying bar is provided with a plurality of clips, at least two of said clips holding a plated board;
in the step of the serial number of the clip of fixing waiting to electroplate the plate with wait to electroplate the identification code information correlation of plate, include:
reading the serial number of one clamp for fixing the same plate to be electroplated;
and associating the serial number of the clamp with the identification code corresponding to the plate to be electroplated.
4. The method for plating a wiring board according to claim 1, wherein said flying bar is provided with a plurality of clips, at least two of said clips holding a plated board;
in the step of the serial number of the clip of fixing waiting to electroplate the plate with wait to electroplate the identification code information correlation of plate, include:
reading the serial number of each clamp for fixing the same plate to be electroplated;
and associating the serial number of each clip with the identification code of the corresponding plate to be electroplated.
5. The method for electroplating a circuit board according to any one of claims 1 to 4, wherein the step of applying the identification code to the surface of the board to be electroplated comprises the following steps:
and pasting an identification code on the surface of the plate to be electroplated, wherein the identification code is pasted on the edge of the plate to be electroplated.
6. An electroplating device of a circuit board is characterized by comprising:
a plating cylinder containing a plating solution therein;
a flying bar provided with a clip;
the collecting device is used for collecting the identification code information of the plate to be electroplated; and
and the control device is electrically connected with the acquisition equipment and is used for associating the serial number of the clamp for fixing the plate to be electroplated with the identification code of the plate to be electroplated.
7. The apparatus of claim 6, wherein the collection device is a code reader.
8. The electroplating device for the circuit board according to claim 6, wherein a plurality of clips are arranged, the plurality of clips are arranged at intervals along the length direction of the flying bar, and at least two clips fix the same board to be electroplated.
9. The apparatus for plating a wiring board according to claim 6, wherein said flying bar is provided above said plating cylinder;
and/or the acquisition device is disposed proximate to the femto.
10. The apparatus for electroplating a wiring board according to any one of claims 6 to 9, further comprising a control switch electrically connected to the clip and the control device for controlling the opening or closing of the clip.
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| CN201911224861.7A CN110923770A (en) | 2019-12-03 | 2019-12-03 | Electroplating method and electroplating device for circuit board |
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| CN201911224861.7A CN110923770A (en) | 2019-12-03 | 2019-12-03 | Electroplating method and electroplating device for circuit board |
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| CN107135618A (en) * | 2017-06-09 | 2017-09-05 | 东莞市五株电子科技有限公司 | The control method and system of mixed batch are prevented in a kind of PCB production processes |
| CN107451628A (en) * | 2017-07-04 | 2017-12-08 | 全讯射频科技(无锡)有限公司 | The method of production information and the system with this method are traced by Quick Response Code |
| CN107358565A (en) * | 2017-08-09 | 2017-11-17 | 无锡南理工科技发展有限公司 | library management method based on RFID |
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Application publication date: 20200327 |