CN110913606A - Method for producing printed circuit board - Google Patents
Method for producing printed circuit board Download PDFInfo
- Publication number
- CN110913606A CN110913606A CN201811084561.9A CN201811084561A CN110913606A CN 110913606 A CN110913606 A CN 110913606A CN 201811084561 A CN201811084561 A CN 201811084561A CN 110913606 A CN110913606 A CN 110913606A
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- Prior art keywords
- board
- alignment
- printed circuit
- independently
- carrier
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/166—Alignment or registration; Control of registration
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a method for producing a printed circuit board, which comprises the following steps: providing a plurality of single boards, wherein each single board is provided with an identification mark; placing the plurality of single boards on the same carrier; carrying out alignment by utilizing an identification mark so as to identify the positions of the single boards on the carrier; and independently performing part assembly on each single board based on the alignment information of each single board.
Description
Technical Field
The present invention relates to a method for manufacturing a printed circuit board, and more particularly, to a method for manufacturing a printed circuit board for a plurality of single boards.
Background
In the prior art, in order to increase the production efficiency of Printed Circuit Board (PCB) production lines, a plurality of single boards are jointed into a large connected Board, such as a two-in-one connected Board, a four-in-one connected Board, and the like. The plurality of single boards are jointed into a large connecting board, and the whole connecting board is directly thrown into a PCB production line, so that the plurality of single boards can be taken and placed at one time, and the taking and placing time is saved.
After the jointed boards are connected, the connected boards are subjected to quality testing. In the quality test of the link board, if one of the single boards is found to have a problem, the single board is marked, i.e. a so-called single-out board (X-out board). In order to increase the production capacity, the PCB manufacturer will put the connecting boards marked with the single newspaper boards into the PCB production line to complement the production capacity. However, the connecting plate with the single newspaper plate will cause the loss of line body efficiency, increase the line changing frequency and cause the instability of the projection plate.
Disclosure of Invention
The invention provides a method for producing a printed circuit board, which can produce the printed circuit board under the condition of not influencing the productivity.
The printed circuit board production method of the invention comprises the following steps: providing a plurality of single boards, wherein each single board is provided with an identification mark; placing the plurality of single boards on the same carrier; carrying out alignment by utilizing the identification mark so as to identify the position of each single board on the carrier; and independently performing part assembly on each single board based on the alignment information of each single board.
In an embodiment of the present invention, the step of performing alignment by using the identification mark to identify the position of each veneer on the carrier includes: and independently aligning each veneer on the carrier by using the identification mark through a printer to obtain first position information of each veneer on the carrier.
In an embodiment of the present invention, the step of independently performing part assembly on each board based on the alignment information of each board includes: and independently printing each veneer through the printer based on the first position information.
In an embodiment of the present invention, the printing press includes a first aligning mechanism for performing alignment, and the first position information is obtained by the first aligning mechanism.
In an embodiment of the present invention, the step of performing alignment by using the identification mark to identify the position of each veneer on the carrier includes: and independently aligning each single board on the carrier by using the identification mark through the component placement machine so as to obtain second position information of each single board on the carrier.
In an embodiment of the present invention, the step of independently performing part assembly on each board based on the alignment information of each board includes: and independently placing the single board through the component placing machine based on the second position information.
In an embodiment of the invention, the part placing machine includes a second aligning mechanism for performing alignment, and the second position information is obtained by the second aligning mechanism.
In an embodiment of the present invention, the placement machine includes a scanning mechanism, and the method for producing a printed circuit board further includes: independently scanning the bar code on each single board through a scanning mechanism to obtain the serial number of each single board; inquiring a circuit layout diagram corresponding to each single board by a component placement machine according to the serial number of each single board so as to obtain component placement information of each single board; and independently placing the parts of each single board through the part placing machine according to the part placing information and the second position information of each single board.
In an embodiment of the present invention, the printed circuit board production method includes: and independently taking, placing and turning the board for each single board through the board turning machine.
In an embodiment of the present invention, the single board has different specifications.
In an embodiment of the present invention, the single boards have the same specification.
In an embodiment of the present invention, the layout diagram corresponding to each of the boards includes a reference mark.
Based on the above, the invention introduces the veneer independent alignment technology, changes the existing design, and not only can aim at the production of the connected veneer, but also can aim at the production of a plurality of veneers under the condition of not influencing the output.
In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.
Drawings
FIG. 1 is a flow chart of a method of manufacturing a printed circuit board according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a printed circuit board production line in accordance with one embodiment of the present invention;
FIG. 3 is a schematic diagram of a plurality of boards according to an embodiment of the present invention;
fig. 4 is a flow chart of a method for producing a printed circuit board according to an embodiment of the invention.
Description of reference numerals:
210: a carrier;
220: a printing press;
230: a placement machine;
240: a reflow furnace;
310. 310A to 310D: a single board;
311-314: identifying the mark;
321-324: a bar code;
s110 to S120: steps of a method for producing a printed circuit board;
s405 to S430: steps of a method for producing a printed circuit board.
Detailed Description
Fig. 1 is a flow chart of a method for producing a printed circuit board according to an embodiment of the present invention. Referring to fig. 1, in step S105, a plurality of boards are provided. These single plates may be of different specifications or of the same specification. Each single board is provided with an identification mark for detection so as to facilitate alignment. For example, a single board with an identification mark is generated by adding a reference mark (custom mark) to a layout corresponding to each of the multiple single boards.
In step S110, a plurality of veneers are placed on the same carrier. Here, in this embodiment, the single boards are not spliced into one continuous board, but the single boards are directly placed on the carrier. The single boards are not connected with each other.
In step S115, alignment is performed by using the identification mark to identify the position of each board on the carrier. Then, in step S120, the component assembly is independently performed for each board based on the alignment information for each board. The original tracking system is directed at a connecting plate, and the tracking system of the embodiment respectively tracks a plurality of single plates and can be embodied in a printing machine and a component placement machine.
Specifically, in the production process of a circuit printed board, the board passes through at least a printing machine, a placement machine, and the like. The single board independent contraposition technology is respectively introduced into the printing machine and the component placing machine, so that each single board is respectively contrapositioned in each machine, and corresponding actions are executed. In addition, if the printed circuit board is a double-sided circuit board, a single-board independent alignment technology is also introduced into the board turnover machine. And independently taking, placing and turning the board for each single board through the board turning machine.
FIG. 2 is a schematic diagram of a printed circuit board production line according to an embodiment of the invention. The components listed in this example are only one example of a production line, and are not limited thereto. Referring to fig. 2, first, a plurality of single boards (bare boards) are placed on a carrier 210.
Thereafter, the carrier 210 is passed through the printer 220 to perform a printing process. In the printer 220, a special steel plate (steel) may be used to control the printing of the solder paste, thereby more precisely applying the solder paste to a certain position and controlling the amount of the solder paste. Further Solder Paste Inspection (SPI) may be performed after the printing process.
Next, the carrier 210 is passed through the placement machine 230 to perform a placement procedure, that is, placing the electronic components on each single board. For example, the component placement machine 230 includes a quick component placement machine, a medium component placement machine, a general component placement machine, and the like. The quick workpiece placing machine is used for placing and taking small parts, the medium-speed workpiece placing machine is used for placing and taking medium parts, and the general workpiece placing machine is used for obtaining enlarged parts or parts with high precision requirements.
Then, the carrier 210 is passed through a Reflow oven (Reflow)240 to solder the electronic parts onto the board. The reflow furnace 240 may heat the printed circuit board after printing and placing the solder paste by hot air or infrared rays, etc. to melt the solder paste and then cool the solder paste, thereby soldering the electronic component on the board. In addition, an Automated Optical Inspection (AOI) may be provided before reflow oven 240.
The solder paste is printed on a solder pad of an electronic part to be soldered, the electronic part is then placed on the solder pad, the solder tail is just placed at the position of the solder paste, the solder paste passes through the high-temperature reflow furnace 240, the highest temperature in the furnace is higher than the melting point of the solder, but not higher than the temperature which can burn out the electronic part, the reflow furnace 240 melts the solder paste, the solder paste becomes liquid when melting, the liquid solder paste can cover the solder tail of the electronic part, and the electronic part is soldered on the printed circuit board after the solder paste is cooled to the temperature and becomes solid again.
In both SPI and AOI, a mode of independently inspecting each board may be adopted, an original operation mode of reading one link board is changed, and a mode of reading each board is changed.
Fig. 3 is a schematic diagram of a plurality of boards according to an embodiment of the present invention. In the present embodiment, 4 single boards 310(310A to 310D) are shown for explanation, but the present invention is not limited thereto. In other embodiments, the number of the single boards 310 may also be 2, 3, 5 or more. The single boards 310A, 310B, 310C, 310D have identification marks 311, 312, 313, 314 and barcodes 321, 322, 323, 324, respectively. The barcodes 321 to 324 will be described later. FIG. 3 is only one example, and the arrangement positions of the single board 310, the identification marks 311-314, and the barcodes 321-324 are not limited thereto.
Fig. 4 is a flow chart of a method for producing a printed circuit board according to an embodiment of the invention. Referring to fig. 2 to 4, in step S405, a plurality of single boards 310A to 310D are provided. These single boards 310A-310D may be of different specifications or of the same specification. Next, in step S410, the plurality of single boards 310A to 310D are placed on the same carrier 210.
Thereafter, in step S415, the printer 220 performs alignment on each veneer 310. In the embodiment, the printer 220 has a first alignment mechanism, and the first alignment mechanism is used to align each single board 310 to obtain first position information of each single board 310 on the carrier 210. Thereafter, in step S420, the printer 220 prints each veneer 310 independently. That is, the printer 220 independently prints each single sheet 310 based on the first position information.
The printer 220 obtains the position of the single board 310A on the carrier 210 using the identification mark 311, the position of the single board 310B on the carrier 210 using the identification mark 312, the position of the single board 310C on the carrier 210 using the identification mark 313, and the position of the single board 310D on the carrier 210 using the identification mark 314. Thereafter, the printer 220 prints one single sheet 310 by one for each tailored steel plate.
Thereafter, in step S425, the placement machine 230 performs alignment on each board 310. Here, the placement machine 230 has a second alignment mechanism, and performs alignment on each board 310 by using the second alignment mechanism to obtain second position information of each board 310 on the carrier 210.
Next, in step S430, the placement machine 230 independently performs placement on each board 310. That is, the component placement machine 230 independently performs component placement on each board based on the second location information of each board 310. In addition, the component placement machine 230 further includes a scanning mechanism, and the scanning mechanism scans the barcodes 321 to 324 on each single board 310 independently to obtain the serial number of each single board 310. The scanning mechanism of the embodiment changes a bar code reading mode to realize that reading of a whole connecting plate is changed into independent reading of a plurality of single plates. In addition, the embodiment changes the original mode that one connecting plate is matched with one bar code, and changes the mode that one single plate is matched with one bar code. Accordingly, the placement machine 230 can scan the barcodes 321 to 324 of the single boards 310 one by one through the scanning mechanism.
After obtaining the serial number of each board 310, the component placement machine 230 queries the circuit layout corresponding to each board 310 according to the serial number, thereby obtaining the component placement information of each board 310. For example, the component placement machine 230 is connected to a database to query the component placement information of each board 310. Then, the placement machine 230 may independently place the component on each board 310 according to the placement information of each board 310 and the second location information.
The first alignment mechanism and the second alignment mechanism are the same in structure, and are visual positioning cameras for example. The visual positioning camera may be formed of a Charge Coupled Device (CCD) or a Contact Image Sensor (CIS). For example, the first alignment mechanism and the second alignment mechanism are a CCD automatic alignment system, which is a combination of machine vision and a fine adjustment platform, and can automatically track coordinates, automatically correct deviations, and the like. The CCD automatic alignment system can adopt 2 CCDs, 4 CCDs or more.
In summary, in the embodiment, the original alignment of a whole connected board formed by splicing a plurality of veneers is changed to the alignment of each veneer in each machine for a plurality of veneers, and then the corresponding action is executed. In this way, the tie sheet can be produced as a single sheet. In addition, since the production can be performed for a single board, the production efficiency can be improved. That is, when the broken board is produced in the link plate, the link plate is cut, the good single boards are taken off, and then the good single boards are placed on the carrier, so that the parts can be assembled for the single boards. In addition, through the embodiment, the parts can be assembled by simultaneously using single plates with different specifications, and the use is more flexible.
Although the present invention has been described with reference to the above embodiments, it should be understood that the invention is not limited thereto, and various changes and modifications can be made by those skilled in the art without departing from the spirit and scope of the invention.
Claims (12)
1. A method of producing a printed circuit board, comprising:
providing a plurality of single boards, wherein each single board is provided with an identification mark;
placing the plurality of single boards on the same carrier;
carrying out alignment by utilizing the identification mark so as to identify the position of each veneer on the carrier; and
and independently performing part assembly on each single plate based on the alignment information of each single plate.
2. The method for manufacturing a printed circuit board according to claim 1, wherein the step of identifying the position of each single board on the carrier by using the identification mark for alignment comprises:
and independently aligning each veneer on the carrier by using the identification mark through a printer to obtain first position information of each veneer on the carrier.
3. The method of claim 2, wherein the step of independently performing component assembly on each of the single boards based on the alignment information of each of the single boards comprises:
and independently printing each veneer through the printer based on the first position information.
4. The printed circuit board production method according to claim 2, wherein the printer includes a first aligning mechanism that performs alignment, and the first positional information is obtained by the first aligning mechanism.
5. The method for manufacturing a printed circuit board according to claim 1, wherein the step of identifying the position of each single board on the carrier by using the identification mark for alignment comprises:
and independently aligning each single board on the carrier by using the identification mark through a component placement machine so as to obtain second position information of each single board on the carrier.
6. The method of claim 5, wherein the step of independently performing component assembly on each of the single boards based on the alignment information of each of the single boards comprises:
and independently placing the parts of each single board through the part placing machine based on the second position information.
7. The method for producing a printed circuit board according to claim 5, wherein the component placement machine includes a second alignment mechanism for performing alignment, and the second position information is obtained by the second alignment mechanism.
8. The printed circuit board production method of claim 5, wherein the placement machine includes a scanning mechanism, and the printed circuit board production method further comprises:
independently scanning the bar code on each single board through the scanning mechanism to obtain the serial number of each single board;
inquiring a circuit layout diagram corresponding to each single board by the component placement machine according to the serial number of each single board to obtain component placement information of each single board; and
and independently placing the parts of each single board through the part placing machine according to the part placing information of each single board and the second position information.
9. The printed circuit board production method according to claim 1, further comprising:
and independently taking, placing and turning the plates of each veneer through a plate turning machine.
10. The method of claim 1, wherein the plurality of single boards are of different specifications.
11. The method of claim 1, wherein the plurality of single boards are of the same specification.
12. The method of claim 1, wherein the layout corresponding to each of the plurality of single boards includes a fiducial mark.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811084561.9A CN110913606A (en) | 2018-09-17 | 2018-09-17 | Method for producing printed circuit board |
| TW108128552A TWI702889B (en) | 2018-09-17 | 2019-08-12 | Method for producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811084561.9A CN110913606A (en) | 2018-09-17 | 2018-09-17 | Method for producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110913606A true CN110913606A (en) | 2020-03-24 |
Family
ID=69813535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811084561.9A Pending CN110913606A (en) | 2018-09-17 | 2018-09-17 | Method for producing printed circuit board |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110913606A (en) |
| TW (1) | TWI702889B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020071602A1 (en) * | 2000-12-08 | 2002-06-13 | Tomoyuki Nakano | Component-mounting method and component-mounting apparatus |
| CN1672479A (en) * | 2002-08-23 | 2005-09-21 | 富士机械制造株式会社 | Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| JP2007053272A (en) * | 2005-08-19 | 2007-03-01 | Matsushita Electric Ind Co Ltd | Method of mounting electronic component |
| CN101312137A (en) * | 2007-05-22 | 2008-11-26 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
| WO2015159405A1 (en) * | 2014-04-17 | 2015-10-22 | 富士機械製造株式会社 | Machine for performing work on board, system for performing work on board, and method for performing work on board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI391052B (en) * | 2010-06-15 | 2013-03-21 | Zhen Ding Technology Co Ltd | Method for tracing quality of printed circuit board |
-
2018
- 2018-09-17 CN CN201811084561.9A patent/CN110913606A/en active Pending
-
2019
- 2019-08-12 TW TW108128552A patent/TWI702889B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020071602A1 (en) * | 2000-12-08 | 2002-06-13 | Tomoyuki Nakano | Component-mounting method and component-mounting apparatus |
| CN1672479A (en) * | 2002-08-23 | 2005-09-21 | 富士机械制造株式会社 | Circuit substrate management method, tag chip mounting method, and electronic circuit manufacturing system |
| JP2007053272A (en) * | 2005-08-19 | 2007-03-01 | Matsushita Electric Ind Co Ltd | Method of mounting electronic component |
| CN101312137A (en) * | 2007-05-22 | 2008-11-26 | 松下电器产业株式会社 | Electronic component mounting system and electronic component mounting method |
| WO2015159405A1 (en) * | 2014-04-17 | 2015-10-22 | 富士機械製造株式会社 | Machine for performing work on board, system for performing work on board, and method for performing work on board |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI702889B (en) | 2020-08-21 |
| TW202014088A (en) | 2020-04-01 |
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Application publication date: 20200324 |