CN110908245B - Patterning method, glass substrate manufacturing method and display panel - Google Patents
Patterning method, glass substrate manufacturing method and display panel Download PDFInfo
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- CN110908245B CN110908245B CN201911105472.2A CN201911105472A CN110908245B CN 110908245 B CN110908245 B CN 110908245B CN 201911105472 A CN201911105472 A CN 201911105472A CN 110908245 B CN110908245 B CN 110908245B
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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Abstract
The embodiment of the application provides a patterning method, a manufacturing method of a glass substrate and a display panel. The present application provides a method of patterning, comprising the steps of: one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer form a photoresist; coating the photoresist on the metal layer to form a photoresist layer; a temperature focused probe is used to pattern the photoresist layer. The embodiment of the application can reduce the yellow light process procedure and avoid the problem of uneven etching of the photoresist layer.
Description
Technical Field
The present disclosure relates to the field of panel manufacturing technologies, and in particular, to a patterning method, a manufacturing method of a glass substrate, and a display panel.
Background
With the continuous development of electronic display technology. Display technologies such as LCD (Liquid Crystal Display) are becoming mature, and the requirement for circuit refinement in Display panels is gradually increasing. The yellow light technology is gradually favored by research and production teams due to the characteristics of high precision, stable manufacturing process and the like. And becomes a patterning technology which is most widely applied.
In the related art, the photoresist layer used in the yellow light patterning process needs to undergo complex processes such as exposure and development. Not only the process is complicated, but also the photoresist layer has some unavoidable problems such as non-uniform etching due to the difference of the substrate material.
Disclosure of Invention
The embodiment of the application provides a patterning method, a manufacturing method of a glass substrate and a display panel. The process of yellow light process can be reduced, and the problem of non-uniform etching of the photoresist layer can be avoided.
A first aspect of embodiments of the present application provides a patterning method, including:
one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer form a photoresist;
coating the photoresist on the metal layer to form a photoresist layer;
a temperature focused probe is used to pattern the photoresist layer.
In some embodiments, the polyphthalamide and propylene glycol methyl ether acetate fixed content is between fifteen percent to twenty percent.
In some embodiments, the formulation viscosity of one or both of the polyphthalamide and propylene glycol methyl ether acetate with the organic polymer is between two centipoise-second and ten centipoise-second.
In some embodiments, the photoresist is coated between one hundred nanometers to one hundred micrometers thick on the metal layer.
In some embodiments, said coating said photoresist on a metal layer further comprises: and drying the photoresist to enable the photoresist to form a photoresist layer.
In some embodiments, the patterning the photoresist layer using a temperature-focused probe comprises: and forming a preset pattern on the photoresist layer by using an automatic device through a temperature-concentrated probe.
In some embodiments, the temperature of the temperature focused probe is between two hundred sixty degrees celsius and eight hundred degrees celsius.
The second surface of the embodiment of the present application further provides a method for manufacturing a glass substrate, including:
providing a glass substrate, wherein the glass substrate comprises a first surface and a second surface which are oppositely arranged;
arranging a metal layer on the first surface;
one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer form a photoresist;
coating the photoresist on the metal layer to form a photoresist layer;
a temperature focused probe is used to pattern the photoresist layer.
The third surface of the embodiment of the application also provides a display panel, which comprises a glass substrate, wherein the glass substrate is manufactured by adopting the patterning method
In the embodiment of the application, one or two of polyphthalamide and propylene glycol methyl ether acetate and a photoresist formed by an organic polymer have good light or heat sensitivity, the photoresist is coated on the metal layer to form a photoresist layer, and a pattern is formed on the photoresist layer through a probe with concentrated temperature, so that the exposure and development processes in a yellow light process can be reduced, the patterning process in a display panel is simpler, and the problem of uneven etching of the photoresist layer is solved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly introduced below.
FIG. 1 is a schematic flow chart of a patterning method provided in an embodiment of the present application
Fig. 2 is a schematic flow chart of a method for manufacturing a glass substrate provided in an embodiment of the present application.
Fig. 3 is a front view of a glass substrate provided in an embodiment of the present application.
Fig. 4 is a top view of a glass substrate provided in an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a patterning method, a photoresist composition and a manufacturing method of a glass substrate. The patterning method is further described below.
Referring to fig. 1, fig. 1 is a schematic flow chart of a patterning method provided in an embodiment of the present application. The embodiment of the application provides a patterning method, which comprises the following steps:
101. one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer form a photoresist.
The organic polymer may be polyethylene, cyclic amine, polyvinyl chloride, phenol resin, or the like. In the embodiment of the application, one or more organic polymers can be selected to be mixed with one or two of polyphthalamide and propylene glycol methyl ether acetate to form the photoresist.
For example, the photoresist layer is formed by polyphthalamide, polyethylene and cyclic amine, wherein the fixed content of polyphthalamide is fifteen to twenty percent. Specifically, the fixed content of polyphthalamide may be fifteen percent, eighteen percent, twenty percent, or the like. For another example, photoresists are formed from polyphthalamide and propylene glycol methyl ether acetate with polyethylene, cyclic amines. Wherein the fixed content of the polyphthalamide and the propylene glycol methyl ether acetate is fifteen percent, eighteen percent, twenty percent and the like. The photoresist formed in the embodiments of the present application has sufficiently high sensitivity to light and heat.
It is understood that the polyphthalamide and propylene glycol monomethyl ether acetate materials themselves have good light and heat sensitivity, and thus, the photoresist formed also has good light and heat sensitivity.
102. Coating the photoresist on the metal layer, so that the photoresist forms a photoresist layer.
It should be noted that the photoresist is uniformly coated on the metal layer. It will be appreciated that a coater may be used to apply the photoresist to the metal layer. Of course, photoresist can also be applied to the metal layer by hand. It should be noted that, during the coating process, it is necessary to ensure that the photoresist is uniformly coated on the metal layer, so as to ensure that the thickness of the photoresist layer after formation is uniform. Thereby providing a good display effect for the display panel. After the photoresist is coated on the metal layer, a baking process is usually used to make the photoresist form a photoresist layer on the metal layer. Of course, after the photoresist is coated on the metal layer, other methods can be used to make the photoresist form a photoresist layer. For example, air drying is used. In the embodiment of the present application, the method of forming the photoresist layer is not limited thereto.
103. A temperature focused probe is used to pattern the photoresist layer.
The probe with the concentrated temperature may be a laser probe or a high temperature probe. The specific structure adopted by the probe with concentrated temperature in the embodiment of the application is not described in detail. Specifically, the formed pattern can be set according to the specific required pattern of the metal layer. In the embodiment of the present application, the specific shape of the pattern is not described in detail.
In addition, the probe with concentrated temperature refers to a probe capable of focusing on a straight line or a point and continuously emitting the probe with stable temperature, and the temperature range of the probe with concentrated temperature is between 260 ℃ and 800 ℃.
The patterning process of the photoresist layer formation is that the probe with concentrated temperature moves on the photoresist layer according to a preset track, after the photoresist layer meets the probe with concentrated temperature, the position corresponding to the probe volatilizes, and the metal layer is not left at the position corresponding to the probe, so that the photoresist layer forms a pattern on the metal layer.
In the embodiment of the application, the photoresist is formed by using one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer, because the polyphthalamide and propylene glycol methyl ether acetate materials have good light and heat sensitivity, the photoresist also has good light or heat sensitivity, so that the photoresist is easy to volatilize after receiving light and heat, the photoresist is coated on a metal layer, after the photoresist is formed into the photoresist layer, the photoresist layer is irradiated by a probe with concentrated temperature, the irradiated part is volatilized, and the non-irradiated part is left on the metal layer. Therefore, the preset pattern is formed on the photoresist layer, and the exposure and development processes in the yellow light process can be reduced by forming the pattern on the metal layer at one time, so that the patterning process in the display panel is simpler, and the photoresist layer is not easy to etch unevenly.
Wherein the fixed content of the polyphthalamide and the propylene glycol methyl ether acetate is fifteen percent to twenty percent.
It is understood that in the examples of the present application, one or both of the fixed amounts of polyphthalamide and propylene glycol methyl ether acetate are fifteen percent, eighteen percent, twenty percent, etc. In the present embodiment, the fixed content of one or both of polyphthalamide and propylene glycol methyl ether acetate is controlled to be between fifteen percent and twenty percent. This ensures that the photoresist has good light and thermal sensitivity. That is, when the photoresist layer is patterned by a light or heat probe, the photoresist layer can be patterned well without damaging the metal layer.
Wherein one or both of the polyphthalamide and propylene glycol methyl ether acetate and the organic polymer have a formulation viscosity of between two centipoise and ten centipoise.
The formulation viscosity of the organic polymer and one or both of the polyphthalamide and propylene glycol monomethyl ether acetate may be two cps, four cps, six cps, ten cps, or the like. The preparation viscosity of one or two of the polyphthalamide and the propylene glycol monomethyl ether acetate and the organic polymer is controlled within the range, so that the photoresist can be smoothly coated on the metal layer and is difficult to flow freely. Thereby ensuring uniformity when forming the photoresist layer.
Wherein, the thickness of the photoresist coating on the metal layer is between one hundred nanometers and one hundred micrometers.
The photoresist may be coated on the metal layer to a thickness of one hundred nanometers, two hundred nanometers, fifty micrometers, one hundred micrometers, and the like. It is understood that the thickness of the photoresist coating on the metal layer in the embodiments of the present application can be appropriately changed according to the requirement. In the embodiment of the present application, the specific thickness setting of the metal layer is not described in detail.
Wherein, said coating said photoresist on the metal layer further comprises: and drying the photoresist to enable the photoresist to form a photoresist layer.
It should be noted that, the photoresist layer may be baked to form a photoresist layer by heating the photoresist layer using a baking apparatus. Specifically, the temperature during the drying process may be 200 to 400 ℃. Except, of course, that the photoresist is formed into a photoresist layer by baking. The photoresist may also be formed into a photoresist layer in other ways. For example, air drying is used. In the embodiment of the present application, the method for forming a photoresist layer by using a photoresist is not limited thereto, and will not be described herein.
Wherein the patterning the photoresist layer using a temperature-focused probe comprises: and forming a preset pattern on the photoresist layer by using an automatic device through a temperature-concentrated probe.
It should be noted that, the running program of the automation device can be designed according to the requirement of the display panel, and the probe movement of the temperature concentration is controlled by the running program to form the pattern on the photoresist layer. The pattern formed in this way can be more accurate. Specifically, the probe with concentrated temperature may be a laser probe or a high temperature probe. The specific structural form of the probe with concentrated temperature is not described in detail in the embodiment of the application.
Wherein the temperature of the temperature focused probe is between two hundred sixty degrees Celsius and eight hundred degrees Celsius.
It should be noted that the temperature of the probe in the temperature set may be two hundred and sixty degrees celsius, three sixty degrees celsius, eight hundred degrees celsius, and the like. The temperature of the probe with concentrated temperature is controlled between two hundred sixty degrees centigrade and eight hundred degrees centigrade to ensure that the etched surface of the photoresist layer is relatively flat. Is beneficial to the display effect of the display panel.
Also provided in embodiments herein is a photoresist composition comprising: one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer are mixed, wherein the fixed content of the polyphthalamide and the propylene glycol methyl ether acetate is fifteen to twenty percent.
The organic polymer may be polyethylene, cyclic amine, polyvinyl chloride, phenol resin, or the like. In the embodiment of the application, one or more organic polymers can be selected to be mixed with one or two of polyphthalamide and propylene glycol methyl ether acetate to form the photoresist.
For example, the photoresist layer is formed by polyphthalamide, polyethylene and cyclic amine, wherein the fixed content of polyphthalamide is fifteen to twenty percent. Specifically, the fixed content of polyphthalamide may be fifteen percent, eighteen percent, twenty percent, or the like. For another example, the light-blocking layer is formed by polyphthalamide and propylene glycol methyl ether acetate with polyethylene and cyclic amine. Wherein the fixed content of the polyphthalamide and the propylene glycol methyl ether acetate is fifteen percent, eighteen percent, twenty percent and the like. The photoresist formed in the embodiments of the present application has sufficiently high sensitivity to light and heat.
Wherein one or both of the polyphthalamide and propylene glycol methyl ether acetate and the organic polymer have a formulation viscosity of between two centipoise and ten centipoise.
The photoresist may be coated on the metal layer to a thickness of one hundred nanometers, two hundred nanometers, fifty micrometers, one hundred micrometers, and the like. It is understood that the thickness of the photoresist coating on the metal layer in the embodiments of the present application can be appropriately changed according to the requirement. In the embodiment of the present application, the specific thickness setting of the metal layer is not described in detail.
It should be noted that the polyphthalamide and propylene glycol methyl ether acetate materials have good light and heat sensitivity, and therefore, the formed photoresist also has good light and heat sensitivity.
Referring to fig. 2, fig. 2 is a schematic flow chart illustrating a method for manufacturing a glass substrate according to an embodiment of the present disclosure. The manufacturing method of the glass substrate provided by the embodiment of the application comprises the following steps:
201. providing a glass substrate, wherein the glass substrate comprises a first surface and a second surface which are oppositely arranged.
202. And arranging a metal layer on the first surface.
203. One or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer form a photoresist.
The organic polymer may be polyethylene, cyclic amine, polyvinyl chloride, phenol resin, or the like. In the embodiment of the application, one or more organic polymers can be selected to be mixed with one or two of polyphthalamide and propylene glycol methyl ether acetate to form the photoresist.
For example, the photoresist layer is formed by polyphthalamide, polyethylene and cyclic amine, wherein the fixed content of polyphthalamide is fifteen to twenty percent. Specifically, the fixed content of polyphthalamide may be fifteen percent, eighteen percent, twenty percent, or the like. For another example, the light-blocking layer is formed by polyphthalamide and propylene glycol methyl ether acetate with polyethylene and cyclic amine. Wherein the fixed content of the polyphthalamide and the propylene glycol methyl ether acetate is fifteen percent, eighteen percent, twenty percent and the like. The photoresist formed in the embodiments of the present application has sufficiently high sensitivity to light and heat.
204. And coating the photoresist layer on the metal layer to form a photoresist layer.
It should be noted that the photoresist is uniformly coated on the metal layer. It will be appreciated that a coater may be used to apply the photoresist to the metal layer. Of course, photoresist can also be applied to the metal layer by hand. It should be noted that, during the coating process, it is necessary to ensure that the photoresist is uniformly coated on the metal layer, so as to ensure that the thickness of the photoresist layer after formation is uniform. Thereby providing a good display effect for the display panel. After the photoresist is coated on the metal layer, a baking process is usually used to make the photoresist form a photoresist layer on the metal layer. Of course, after the photoresist is coated on the metal layer, other methods can be used to make the photoresist form a photoresist layer. For example, air drying is used. In the embodiment of the present application, the method for forming a photoresist layer by using a photoresist is not described herein.
205. A temperature focused probe is used to pattern the photoresist layer.
The probe with the concentrated temperature may be a laser probe or a high temperature probe. The specific structure of the probe with concentrated temperature is not described in detail in the embodiment of the application. Specifically, the formed pattern can be set according to the specific required pattern of the metal layer. In the embodiment of the present application, the specific shape of the pattern is not described in detail.
In the embodiment of the application, the photoresist is formed by using one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer, because the polyphthalamide and propylene glycol methyl ether acetate materials have good light and heat sensitivity, the photoresist has good light or heat sensitivity, so that the photoresist is easy to volatilize after receiving light and heat, the photoresist is coated on a metal layer, after the photoresist forms a photoresist layer, the photoresist layer is irradiated by a probe with concentrated temperature, the irradiated part is volatilized, and the non-irradiated part is left on the metal layer. Therefore, the preset pattern is formed on the photoresist layer, and the exposure and development processes in the yellow light process can be reduced by forming the pattern on the metal layer at one time, so that the patterning process in the display panel is simpler, and the photoresist layer is not easy to etch unevenly.
Referring to fig. 3 and 4, fig. 3 is a front view of a glass substrate provided in an embodiment of the present application. Fig. 4 is a top view of a glass substrate provided in an embodiment of the present application.
The glass substrate 100 includes a glass substrate 10, a metal layer 20, and a photoresist layer 30. The glass substrate 10 has a first surface 10a and a second surface 10b which are oppositely arranged, the metal layer 20 is arranged on the first surface 10a, the photoresist layer 30 is arranged on a surface of the metal layer 20 far away from the glass substrate 100, and a pattern is formed on the photoresist layer 30.
The embodiment of the application also provides a display panel, which comprises a glass substrate, wherein the glass substrate is manufactured by adopting the patterning method. The patterning method in the embodiment of the present application is the same as the patterning method in the above embodiment, and therefore, redundant description is not repeated.
The patterning method, the glass substrate manufacturing method, and the display panel provided in the embodiments of the present application are described in detail above. The principles and implementations of the present application are described herein using specific examples, which are presented only to aid in understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (6)
1. A method of patterning, comprising the steps of:
forming a photoresist by one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer, wherein the fixed content of the polyphthalamide and the propylene glycol methyl ether acetate is fifteen to twenty percent, and the preparation viscosity of the organic polymer and the one or two of the polyphthalamide and the propylene glycol methyl ether acetate is between two centipoise and ten centipoise;
coating the photoresist on the metal layer to form a photoresist layer;
forming a pattern on the photoresist layer by using a temperature-concentrated probe, wherein the temperature-concentrated probe moves on the photoresist layer according to a preset track, and the photoresist layer is volatilized at a position corresponding to the temperature-concentrated probe after encountering the temperature-concentrated probe;
the probe with concentrated temperature refers to a probe which is focused on a straight line or a point and continuously emits stable temperature, and the temperature of the probe with concentrated temperature is between two hundred sixty degrees centigrade and eight hundred degrees centigrade.
2. The patterning process of claim 1, wherein the photoresist is applied to the metal layer to a thickness of between one hundred nanometers and one hundred micrometers.
3. The patterning process of claim 1, further comprising, after the coating of the photoresist on the metal layer:
and drying the photoresist to enable the photoresist to form a photoresist layer.
4. The method of claim 1, wherein the patterning the photoresist layer using the temperature-focused probe comprises:
and forming a preset pattern on the photoresist layer by using an automatic device through the temperature-concentrated probe.
5. A method for manufacturing a glass substrate, comprising:
providing a glass substrate, wherein the glass substrate comprises a first surface and a second surface which are oppositely arranged;
arranging a metal layer on the first surface;
forming a photoresist by one or two of polyphthalamide and propylene glycol methyl ether acetate and an organic polymer, wherein the fixed content of the polyphthalamide and the propylene glycol methyl ether acetate is fifteen to twenty percent, and the preparation viscosity of the organic polymer and the one or two of the polyphthalamide and the propylene glycol methyl ether acetate is between two centipoise and ten centipoise;
coating the photoresist on the metal layer to form a photoresist layer;
forming a pattern on the photoresist layer by using a temperature-concentrated probe, wherein the temperature-concentrated probe moves on the photoresist layer according to a preset track, and the photoresist layer is volatilized at a position corresponding to the temperature-concentrated probe after encountering the temperature-concentrated probe;
the probe with concentrated temperature refers to a probe which is focused on a straight line or a point and continuously emits stable temperature, and the temperature of the probe with concentrated temperature is between two hundred sixty degrees centigrade and eight hundred degrees centigrade.
6. A display panel comprising a glass substrate, wherein the glass substrate is manufactured by the patterning method according to any one of claims 1 to 4.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911105472.2A CN110908245B (en) | 2019-11-13 | 2019-11-13 | Patterning method, glass substrate manufacturing method and display panel |
| PCT/CN2019/120147 WO2021092998A1 (en) | 2019-11-13 | 2019-11-22 | Patterning method, method for manufacturing glass substrate, and display panel |
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| CN201911105472.2A CN110908245B (en) | 2019-11-13 | 2019-11-13 | Patterning method, glass substrate manufacturing method and display panel |
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| CN110908245B true CN110908245B (en) | 2021-11-23 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104049462A (en) * | 2012-11-19 | 2014-09-17 | 罗门哈斯电子材料有限公司 | Self-assembled structures, method of manufacture thereof and articles comprising the same |
| CN105468190A (en) * | 2014-09-29 | 2016-04-06 | 富士胶片株式会社 | Touch screen sensor and manufacturing method thereof, touch screen, and touch screen display device |
| CN106632921A (en) * | 2015-10-31 | 2017-05-10 | 罗门哈斯电子材料有限责任公司 | Block copolymers and pattern treatment compositions and methods |
| CN107615171A (en) * | 2015-05-28 | 2018-01-19 | 富士胶片株式会社 | Manufacture method, circuit layout, input unit and the display device of circuit layout |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1413925A3 (en) * | 2002-10-23 | 2004-08-25 | Konica Minolta Holdings, Inc. | Photosensitive composition and photosensitive lithographic printing plate |
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- 2019-11-13 CN CN201911105472.2A patent/CN110908245B/en active Active
- 2019-11-22 WO PCT/CN2019/120147 patent/WO2021092998A1/en active Application Filing
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104049462A (en) * | 2012-11-19 | 2014-09-17 | 罗门哈斯电子材料有限公司 | Self-assembled structures, method of manufacture thereof and articles comprising the same |
| CN105468190A (en) * | 2014-09-29 | 2016-04-06 | 富士胶片株式会社 | Touch screen sensor and manufacturing method thereof, touch screen, and touch screen display device |
| CN107615171A (en) * | 2015-05-28 | 2018-01-19 | 富士胶片株式会社 | Manufacture method, circuit layout, input unit and the display device of circuit layout |
| CN106632921A (en) * | 2015-10-31 | 2017-05-10 | 罗门哈斯电子材料有限责任公司 | Block copolymers and pattern treatment compositions and methods |
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| WO2021092998A1 (en) | 2021-05-20 |
| CN110908245A (en) | 2020-03-24 |
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