CN110901071A - Method and system for 3D printing of circuit board and 3D printer - Google Patents

Method and system for 3D printing of circuit board and 3D printer Download PDF

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Publication number
CN110901071A
CN110901071A CN201911195873.1A CN201911195873A CN110901071A CN 110901071 A CN110901071 A CN 110901071A CN 201911195873 A CN201911195873 A CN 201911195873A CN 110901071 A CN110901071 A CN 110901071A
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CN
China
Prior art keywords
layer
data information
printing
slice data
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201911195873.1A
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Chinese (zh)
Inventor
肖骏松
赵刚
张立恒
郑睿鑫
陈开显
王重阳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Wuhan University of Science and Engineering WUSE
Wuhan University of Science and Technology WHUST
Original Assignee
Wuhan University of Science and Engineering WUSE
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Filing date
Publication date
Application filed by Wuhan University of Science and Engineering WUSE filed Critical Wuhan University of Science and Engineering WUSE
Priority to CN201911195873.1A priority Critical patent/CN110901071A/en
Publication of CN110901071A publication Critical patent/CN110901071A/en
Pending legal-status Critical Current

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/80—Data acquisition or data processing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/307—Handling of material to be used in additive manufacturing
    • B29C64/321—Feeding
    • B29C64/336—Feeding of two or more materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C64/00—Additive manufacturing, i.e. manufacturing of three-dimensional [3D] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3D printing, stereolithography or selective laser sintering
    • B29C64/30—Auxiliary operations or equipment
    • B29C64/386—Data acquisition or data processing for additive manufacturing
    • B29C64/393—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y40/00—Auxiliary operations or equipment, e.g. for material handling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B33—ADDITIVE MANUFACTURING TECHNOLOGY
    • B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
    • B33Y50/00—Data acquisition or data processing for additive manufacturing
    • B33Y50/02—Data acquisition or data processing for additive manufacturing for controlling or regulating additive manufacturing processes
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T17/00—Three dimensional [3D] modelling, e.g. data description of 3D objects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F10/00—Additive manufacturing of workpieces or articles from metallic powder
    • B22F10/60—Treatment of workpieces or articles after build-up
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F12/00—Apparatus or devices specially adapted for additive manufacturing; Auxiliary means for additive manufacturing; Combinations of additive manufacturing apparatus or devices with other processing apparatus or devices
    • B22F12/20—Cooling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P10/00—Technologies related to metal processing
    • Y02P10/25—Process efficiency

Abstract

The invention discloses a method for 3D printing a circuit board, which comprises the steps of carrying out layered slice modeling on a Gerber file to obtain multilayer slice data information containing material attributes; respectively loading a metal printing material and a nonmetal printing material into a metal printing material feeding mechanism and a nonmetal printing material feeding mechanism; reading single-layer slice data information in the multi-layer slice data information, and printing a metal layer or a nonmetal layer; and continuously reading the single-layer slice data information in the multi-layer slice data information, and printing until all the slice data information in each layer of the multi-layer slice data information is printed. The invention avoids complex processes of drilling, electroplating and the like for manufacturing the circuit board, is convenient for customizing the circuit board in small batch, individuation and automation, and shortens the manufacturing period. The invention further comprises a system for 3D printing the circuit board and a 3D printer.

Description

Method and system for 3D printing of circuit board and 3D printer
Technical Field
The invention relates to the technical field of printing, in particular to a method and a system for 3D printing of a circuit board and a 3D printer.
Background
The research and development and application of electronic technology cannot be separated from the circuit board. The existing circuit board manufacturing generally needs a series of processes such as drilling, electroplating and the like, is usually completed by a special circuit board manufacturer, and has the disadvantages of complex process, long period, more manual intervention and inconvenience in automatic production. Especially for some circuit boards in the research and development stage, the circuit boards are produced in small batches, most circuit board manufacturers are manufactured in batches and in large scale, and production is carried out only when orders reach a certain number in off seasons, so that the production period is further prolonged. The factory production mode of the circuit board is difficult to meet the individual and small-batch diversified production requirements of users.
Disclosure of Invention
The invention provides a method and a system for 3D printing of a circuit board and a 3D printer based on the problems.
In view of this, the present invention provides a method for 3D printing a circuit board, including the following steps:
carrying out layered slice modeling on the Gerber file to obtain multilayer slice data information containing material attributes, wherein the material attributes are metal materials or non-metal materials;
respectively loading a metal printing material and a nonmetal printing material into a metal printing material feeding mechanism and a nonmetal printing material feeding mechanism;
reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, and printing a metal layer or a nonmetal layer;
and continuously reading the single-layer slice data information in the multi-layer slice data information, and printing until all the slice data information in each layer of the multi-layer slice data information is printed.
The invention also discloses a system for 3D printing the circuit board, which comprises
The slice modeling module is used for carrying out layered slice modeling on the Gerber file to obtain multilayer slice data information containing material attributes, wherein the material attributes are metal materials or non-metal materials;
the loading module is used for loading the metal printing material and the nonmetal printing material into the metal printing material feeding mechanism and the nonmetal printing material feeding mechanism respectively;
the single-layer printing module is used for reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, and printing a metal layer or a nonmetal layer;
and the circulating module is used for continuously reading the single-layer slice data information in the multi-layer slice data information and printing the single-layer slice data information until all the single-layer slice data information in the multi-layer slice data information is printed.
The invention also discloses a 3D printer, and a method for printing the circuit board in the 3D mode by adopting the technical scheme.
The invention has the beneficial effects that: the Gerber file is subjected to layered slicing modeling and converted into multilayer slicing data suitable for 3D printing, different printing material feeding mechanisms are selected according to material attribute information of the multilayer slicing data, and then the circuit board is printed layer by layer, so that complex processes of drilling, electroplating and the like for manufacturing the circuit board are avoided, the circuit board can be conveniently customized in small batches, individually and automatically, and the manufacturing period is shortened.
Drawings
Fig. 1 shows a flow chart of a 3D printed circuit board method provided according to an embodiment of the invention.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the features of the embodiments of the present invention, i.e., the embodiments, may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
Fig. 1 shows a flow chart of a 3D printed circuit board method provided according to an embodiment of the invention.
As shown in fig. 1, in this embodiment, a method for 3D printing a circuit board includes the following steps:
carrying out layered slice modeling on the Gerber file to obtain multilayer slice data information containing material attributes, wherein the material attributes are metal materials or non-metal materials;
respectively loading a metal printing material and a nonmetal printing material into a metal printing material feeding mechanism and a nonmetal printing material feeding mechanism;
reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, and printing a metal layer or a nonmetal layer;
and continuously reading the single-layer slice data information in the multi-layer slice data information, and printing until all the single-layer slice data information in the multi-layer slice data information is printed, thus obtaining the circuit board.
A Gerber file is the raw data file used to make the circuit board.
In the embodiment, the Gerber file is subjected to layered slicing modeling and converted into multilayer slicing data suitable for 3D printing, different printing material feeding mechanisms are selected according to material attribute information of the multilayer slicing data, and then the circuit board is printed layer by layer, so that complex processes of drilling, electroplating and the like for manufacturing the circuit board are avoided, small-batch, personalized and automatic circuit board customization is facilitated, and the manufacturing period is shortened.
Optionally, the metallic printing material is a lead-tin alloy with a tin content of 75%, and the non-metallic printing material is a PLA wire.
PLA wire, namely polylactic acid, also known as polylactide, has the English name of polylactic acid/polylactic acid.
In the embodiment, the manufacturing complexity is reduced by selecting the low-melting-point lead-tin alloy, and the circuit board has better tensile strength and extensibility by selecting the PLA wire.
Optionally, reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, printing a metal layer or a nonmetal layer, including,
reading single-layer slice data information in the multi-layer slice data information;
when the material attribute of the single-layer slice data information is a metal material, selecting a metal printing material feeding mechanism and printing the metal layer;
and when the material attribute of the single-layer slice data information is a non-metal material, selecting a non-metal printing material feeding mechanism and printing the non-metal layer.
In the above embodiment, the circuit board is very conveniently printed by distinguishing the metal part and the non-metal part of the circuit board and adopting different printing material feeding mechanisms.
Optionally, the printing thickness of the metal layer is 0.05-0.1 mm.
The printing thickness of the metal layer is 0.05-0.1 mm, so that a good forming effect can be obtained, and the circuit board has good conductivity.
Optionally, the printing thickness of the non-metal layer is 0.5-1.0 mm.
The printing thickness of the non-metal layer is 0.5-1 mm, so that a good forming effect can be obtained, and the structure of the circuit board is more compact.
Optionally, after reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, and printing a metal layer or a nonmetal layer, further comprising,
and cooling the metal layer or the nonmetal layer.
By adding the cooling step, the forming effect of the circuit board is better, and the combination is tighter.
Optionally, cooling the metal or non-metal layer, including,
and cooling the metal layer or the nonmetal layer by using a cooling fan to reach a cooling temperature of 90 ℃.
Through choosing for use cooling fan to cool off, can reduce cost, through establishing cooling temperature into 90 degrees, make the combination that metal material and non-metallic material layer can be fine be in the same place, combine more closely, the circuit board is more firm.
Optionally, the method further includes, after the single-layer slice data information in the multi-layer slice data information is continuously read and printed until all the single-layer slice data information in the multi-layer slice data information is printed, performing surface treatment on the circuit board, and mounting an electronic component to obtain a finished circuit board.
The circuit board is subjected to surface treatment, so that the appearance effect of the circuit board is better.
The embodiment of the invention also discloses a system for 3D printing the circuit board, which comprises
The slice modeling module is used for carrying out layered slice modeling on the Gerber file to obtain multilayer slice data information containing material attributes, wherein the material attributes are metal materials or non-metal materials;
the loading module is used for loading the metal printing material and the nonmetal printing material into the metal printing material feeding mechanism and the nonmetal printing material feeding mechanism respectively;
the single-layer printing module is used for reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, and printing a metal layer or a nonmetal layer;
and the circulating module is used for continuously reading the single-layer slice data information in the multi-layer slice data information and printing the single-layer slice data information until all the single-layer slice data information in the multi-layer slice data information is printed.
The embodiment of the invention also discloses a 3D printer, and the method for printing the circuit board by using the 3D printer adopts the technical scheme.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A method for 3D printing a circuit board is characterized by comprising the following steps:
carrying out layered slice modeling on the Gerber file to obtain multilayer slice data information containing material attributes, wherein the material attributes are metal materials or non-metal materials;
respectively loading a metal printing material and a nonmetal printing material into a metal printing material feeding mechanism and a nonmetal printing material feeding mechanism;
reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, and printing a metal layer or a nonmetal layer;
and continuously reading the single-layer slice data information in the multi-layer slice data information, and printing until all the single-layer slice data information in the multi-layer slice data information is printed, thus obtaining the circuit board.
2. A method for 3D printing of circuit boards according to claim 1 characterized in that the metallic printing material is a lead-tin alloy with a tin content of 75% and the non-metallic printing material is a PLA wire.
3. The method of 3D printing circuit board according to claim 1, wherein single-layer slice data information among the multi-layer slice data information is read, a metallic printing material feeding mechanism or a non-metallic printing material feeding mechanism is selected according to a material property of the single-layer slice data information, a metallic layer or a non-metallic layer is printed, including,
reading single-layer slice data information in the multi-layer slice data information;
when the material attribute of the single-layer slice data information is a metal material, selecting the metal printing material feeding mechanism and printing the metal layer;
and when the material attribute of the single-layer slice data information is a non-metal material, selecting the non-metal printing material feeding mechanism and printing the non-metal layer.
4. A method of 3D printing a circuit board according to claim 1 wherein the printed thickness of the metal layer is 0.05 to 0.1 mm.
5. A method of 3D printing a circuit board according to claim 1 wherein the non-metallic layer is printed to a thickness of 0.5 to 1.0 mm.
6. The method of 3D printing circuit board according to claim 1, wherein after reading single-layer slice data information in the multi-layer slice data information, selecting a metallic printing material feeding mechanism or a non-metallic printing material feeding mechanism according to a material property of the single-layer slice data information, printing a metallic layer or a non-metallic layer, further comprising,
and cooling the metal layer or the nonmetal layer.
7. A method of 3D printing a circuit board according to claim 6, characterized in that cooling the metallic or non-metallic layer comprises,
and cooling the metal layer or the nonmetal layer by using a cooling fan to reach a cooling temperature of 90 ℃.
8. The method of 3D printing circuit board according to claim 6, wherein reading single-layer slice data information of the multi-layer slice data information and printing are continued until printing of each layer of slice data information of the multi-layer slice data information is completed, further comprising,
and carrying out surface treatment on the circuit board, and mounting electronic elements to obtain a finished circuit board.
9. A system for 3D printing of circuit boards, comprising:
the slice modeling module is used for carrying out layered slice modeling on the Gerber file to obtain multilayer slice data information containing material attributes, wherein the material attributes are metal materials or non-metal materials;
the loading module is used for loading the metal printing material and the nonmetal printing material into the metal printing material feeding mechanism and the nonmetal printing material feeding mechanism respectively;
the single-layer printing module is used for reading single-layer slice data information in the multi-layer slice data information, selecting a metal printing material feeding mechanism or a nonmetal printing material feeding mechanism according to the material attribute of the single-layer slice data information, and printing a metal layer or a nonmetal layer;
and the circulating module is used for continuously reading the single-layer slice data information in the multi-layer slice data information and printing the single-layer slice data information until all the single-layer slice data information in the multi-layer slice data information is printed.
10. A 3D printer comprising the system of 3D printed circuit boards of claim 9.
CN201911195873.1A 2019-11-28 2019-11-28 Method and system for 3D printing of circuit board and 3D printer Pending CN110901071A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
CN201911195873.1A CN110901071A (en) 2019-11-28 2019-11-28 Method and system for 3D printing of circuit board and 3D printer

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113290843A (en) * 2021-05-12 2021-08-24 上海趣立信息科技有限公司 Preparation method and system of 3D printing AR/VR equipment circuit board

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113290843A (en) * 2021-05-12 2021-08-24 上海趣立信息科技有限公司 Preparation method and system of 3D printing AR/VR equipment circuit board

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Inventor after: Zhao Gang

Inventor after: Xiao Junsong

Inventor after: Zhang Liheng

Inventor after: Zheng Ruixin

Inventor after: Chen Kaixian

Inventor after: Wang Zhongyang

Inventor before: Xiao Junsong

Inventor before: Zhao Gang

Inventor before: Zhang Liheng

Inventor before: Zheng Ruixin

Inventor before: Chen Kaixian

Inventor before: Wang Zhongyang

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