CN110887006A

CN110887006A - LED car lamp module, manufacturing method thereof and circuit board for LED car lamp module

Info

Publication number: CN110887006A
Application number: CN201810942625.8A
Authority: CN
Inventors: 林伟健; 赵永新; 秦典成
Original assignee: Rayben Technologies Hk Ltd
Current assignee: Fengpeng Electronics (Zhuhai) Co., Ltd
Priority date: 2018-08-17
Filing date: 2018-08-17
Publication date: 2020-03-17
Anticipated expiration: 2038-08-17
Also published as: CN110887006B; WO2020035013A1

Abstract

The invention discloses an LED car lamp module, a manufacturing method thereof and a circuit board, wherein the LED car lamp module comprises the circuit board, wherein a circuit pattern, an LED bonding pad and a lens positioning hole are formed on the circuit board; an injection-molded LED limiting part is further arranged on the circuit board, a limiting hole is formed in the LED limiting part, and an LED chip is welded on the LED bonding pad and is positioned in the limiting hole; a positioning piece is formed on the peripheral wall of the lens positioning hole, and the positioning piece and the LED limiting piece are integrally formed in an injection molding mode. The method comprises the steps of forming a circuit pattern and an LED pad on a circuit board, and drilling at least one positioning base hole on the circuit board; the LED limiting part and the positioning part are formed on the circuit board in an injection molding mode, the LED limiting part and the positioning part are integrally formed in an injection molding mode, and the LED limiting part is located on the outer side of the periphery of the LED bonding pad; the positioning piece is positioned on the inner wall of the positioning base hole; and welding the LED chip on the LED bonding pad to enable the LED chip to be positioned in the limiting hole. The invention can reduce the position error of the LED chip and the lens.

Description

LED car lamp module, manufacturing method thereof and circuit board for LED car lamp module

Technical Field

The invention relates to the field of light emitting diodes, in particular to an LED car lamp module, a manufacturing method of the LED car lamp module and a circuit board used by the LED car lamp module.

Background

The existing vehicle lamps mainly comprise halogen lamps and LED vehicle lamps, wherein the LED vehicle lamps have the advantages of low power consumption, long service life and the like, and gradually replace the halogen lamps as the mainly used vehicle lamps. The existing LED car lamp comprises an LED car lamp module, wherein the module comprises a circuit board, an LED bonding pad is arranged on the circuit board, and an LED chip is welded on the LED bonding pad. Because the light beam emitted by the LED chip has a scattering property, in order to meet the illumination brightness requirement of the vehicle lamp for a specific area, the LED vehicle lamp needs to be provided with a lens, and the path of the light beam emitted by the LED chip is changed through the lens, so that the light beam is intensively irradiated on the specific area.

Generally, set up the lens locating hole on the circuit board of LED car light module, be provided with the reference column on the lens, when installing the circuit board with lens, insert the reference column of lens in the lens locating hole, realize the fixed of lens and circuit board. In order to ensure that the light beam emitted from the LED chip can be accurately irradiated onto a specific area after passing through the lens, the positional relationship between the LED chip and the lens is required to be very precise, and the positional error between the lens and the LED chip is required to be very small.

However, the current welding of the LED chip is usually realized by using a surface mount technology, no special process control is usually added, the position offset of the optical center of the LED chip relative to the LED bonding pad on the circuit board can reach ± 0.15mm, and the technical requirements of the current LED car lamp for light emission cannot be met.

In order to reduce the offset of the optical center of the LED chip relative to the LED pad, a common processing method at present is to fix the LED chip by using glue, that is, a dispensing process is performed, so that the offset of the LED chip caused by tension in the tin melting process of the LED chip can be reduced to a certain extent. However, since the glue also has fluidity, the dispensing process can only control the deviation of the optical center of the LED chip within the range of +/-0.12 mm, and the technical requirements of the vehicle lamp of a high-end vehicle type on light emitting cannot be met. In addition, when the optical center of the LED chip is fixed by using a dispensing process, the position of the LED chip is fixed by bonding the bottom and the side surface of the LED chip by glue, so that the requirements on the dispensing position and the glue amount are very strict, the poor problems of floating height, little tin and the like of the LED chip are easily caused, and the service life of the LED car lamp is influenced.

Disclosure of Invention

The invention mainly aims to provide an LED car lamp module capable of effectively reducing the position deviation between the optical center of an LED chip and the position of a lens.

The invention also provides a circuit board used for the LED vehicle lamp module.

Still another object of the present invention is to provide a method for manufacturing an LED vehicle lamp module that improves the positional matching accuracy between an LED chip and a lens.

In order to achieve the above main objective, the LED car lamp module provided by the present invention comprises a circuit board, wherein a circuit pattern and at least one LED bonding pad are formed on the circuit board, and at least one lens positioning hole is formed on the circuit board; the LED chip is welded on the LED bonding pad and positioned in the limiting hole; a positioning piece is formed on the peripheral wall of the lens positioning hole, and the positioning piece and the LED limiting piece are integrally formed in an injection molding mode.

According to the scheme, the LED locating part and the locating piece are integrally formed in the LED car lamp module in an injection molding mode, the LED chip is welded in the limiting hole of the LED locating part, and the locating column of the lens can be installed in the lens locating hole formed by the locating piece. Thus, the positional deviation between the LED chip and the lens is determined by the positional deviation of the LED stopper and the lens positioning hole. Because the LED locating part and the locating piece of the lens locating hole are integrally injection-molded through the mold, the position offset between the LED chip and the lens can be ensured by ensuring the dimensional tolerance of the mold. Since the dimensional tolerance of the target injection mold is very small, by being within 30 micrometers, the positional offset between the LED chip and the lens in the LED vehicle lamp mold is very small.

Preferably, the upper surface of the LED position limiting member is not higher than the upper surface of the LED chip in the direction perpendicular to the surface of the circuit board.

Therefore, the upper surface of the LED chip is higher than the upper surface of the LED limiting part, so that the interference of the LED limiting part on light beams emitted by the LED chip can be avoided, the light beams emitted by the LED chip can be completely incident into the lens, and the light emitting efficiency of the LED module is improved.

The LED limiting part is close to the inner side surface of the LED chip, and inclines outwards from the inside of the limiting hole in the direction extending upwards from the surface of the circuit board.

Therefore, the LED limiting part is obliquely arranged close to the inner side surface of the LED chip, so that the cross section area of the notch of the limiting hole is larger than that of the groove bottom, the LED chip is favorably placed in the limiting hole, and the welding process of the LED chip is simpler.

According to a further scheme, an injection molding groove is formed in the circuit board and is communicated with the LED limiting part and the positioning part, preferably, the injection molding groove is sunken from the surface of the circuit board to the inner side of the circuit board, an injection molding part is filled in the injection molding groove, and the upper surface of the injection molding part is flush with the surface of the circuit board.

Therefore, the injection molding groove is formed in the circuit board, and one-time injection molding of the LED limiting part and the positioning part can be facilitated. And, the upper surface of injection molding and the upper surface flush of circuit board are favorable to the lens to be installed on the surface of circuit board.

The LED limiting part is provided with a plurality of limiting holes, and each limiting hole is internally provided with an LED chip; preferably, the number of the lens positioning holes is more than two, wherein at least one lens positioning hole is a waist-shaped hole.

In order to achieve the other object, a circuit pattern and at least one LED pad are formed on the circuit board for the LED car lamp module, and at least one lens positioning hole is formed on the circuit board; the circuit board is also provided with an injection-molded LED limiting part, the LED limiting part is formed on the circumferential outer side of the LED bonding pad, and a limiting hole is formed in the LED limiting part; a positioning piece is formed on the peripheral wall of the lens positioning hole, and the positioning piece and the LED limiting piece are integrally formed in an injection molding mode.

In order to achieve the above another object, the present invention provides a method for manufacturing an LED car light module, including forming a circuit pattern and an LED pad on a circuit board, and drilling at least one positioning base hole on the circuit board; the LED limiting part and the positioning part are formed on the circuit board in an injection molding mode, the LED limiting part and the positioning part are integrally formed in an injection molding mode, the LED limiting part is located on the outer side of the periphery of the LED bonding pad, and at least one limiting hole is formed in the LED limiting part; the positioning piece is positioned on the inner wall of the positioning base hole, the positioning piece is annular, and a lens positioning hole is formed in the positioning piece; and welding the LED chip on the LED bonding pad to enable the LED chip to be positioned in the limiting hole.

According to the scheme, when the LED car lamp module is manufactured, after the circuit board is drilled to be the base hole, the LED limiting part and the positioning part are formed on the circuit board in an injection molding mode, therefore, the LED chip can be welded on the LED bonding pad in the limiting hole of the LED limiting part, and the positioning column of the lens can be inserted into the lens positioning hole. Through the metric control of the size of the injection mold, the position deviation between the LED chip and the lens can be ensured, so that the position deviation between the LED chip and the lens is very small.

Preferably, the LED locating part and the locating piece are formed on the circuit board by injection molding and comprise: and (3) injection molding the LED limiting part and the positioning part on the circuit board by using a prefabricated mold.

Therefore, the LED limiting part and the positioning part are formed by injection molding through the prefabricated mold, the size deviation between the size of the limiting hole in the LED limiting part and the size of the positioning part is small, and the deviation between the LED chip and the lens is small.

Drawings

Fig. 1 is a schematic structural diagram of an embodiment of an LED vehicle lamp module according to the present invention.

Fig. 2 is an exploded view of an LED vehicle lamp module according to an embodiment of the present invention.

Fig. 3 is a schematic structural diagram of another view angle of the LED vehicle lamp module according to the embodiment of the invention.

Fig. 4 is a sectional view taken along line a-a in fig. 3.

Fig. 5 is a partially enlarged view of fig. 4.

Fig. 6 is a schematic diagram of an LED position limiter formed by injection molding according to an embodiment of the method for manufacturing an LED vehicle lamp module according to the invention.

FIG. 7 is a schematic view of a printing solder paste in an embodiment of the method for manufacturing an LED vehicle lamp module according to the invention.

FIG. 8 is a schematic diagram of the method for manufacturing an LED vehicle lamp module according to the invention, wherein the LED chip is soldered.

The invention is further explained with reference to the drawings and the embodiments.

Detailed Description

The LED vehicle lamp module of the present embodiment includes one or more LED chips for emitting light as a key component of the LED vehicle lamp. Referring to fig. 1 and 2, the LED lamp module has a circuit board 10, a circuit pattern 11 formed on the circuit board 10, and a plurality of LED pads 18 formed thereon. Preferably, the circuit board 10 is a copper-clad PCB, and the circuit pattern 11 and the LED pad 18 are formed by etching or pattern transfer, so that the circuit pattern 11 and the LED pad 18 are formed of a copper-clad layer. The LED chip 30 is soldered on the LED pad 18, and in this embodiment, the LED chip 30 can be soldered on the LED pad 18 by reflow soldering or the like. Preferably, a plurality of LED chips 30 are soldered on the circuit board 10, and the LED chips 30 are arranged in a row, so that the LED pads 18 are also arranged in a row.

Since the circuit board 10 is required to mount the lens, two

lens positioning holes

13 and 14 are provided on the circuit board 10, wherein the lens positioning hole 13 is a circular through hole, and the lens positioning hole 14 is a kidney-shaped hole, so that when the lens is mounted on the circuit board 10, one of the positioning posts can be inserted into the lens positioning hole 13, and the other positioning post is inserted into the lens positioning hole 14. Since the lens positioning hole 14 is a waist-shaped hole, the positioning post inserted into the lens positioning hole 14 can move within a certain distance, and even if there is a certain offset between the axis of the positioning post of the lens and the axis of the lens positioning hole 14, the positioning post can be inserted into the lens positioning hole 14, thereby ensuring that the lens can be mounted on the circuit board 10.

In addition, in order to facilitate the mounting of the LED lamp module on the heat sink, two mounting holes 12 are further provided on the circuit board 10, both the two mounting holes 12 are circular through holes, and screws or the like can be used to penetrate through the mounting holes 12 and fix the circuit board 10 on the heat sink.

In order to realize the accurate positioning of the LED chip 30 on the circuit board 10, in the embodiment, the LED limiting member 20 is formed on the circuit board 10 by injection molding, the LED limiting member 20 includes a plurality of limiting holes 21, and each limiting hole 21 can be installed with one LED chip 30. Preferably, the limiting hole 21 is a through hole penetrating through the upper and lower surfaces of the limiting member 20, and each limiting hole 21 is located on the outer side of the circumference of one LED pad 18. Thus, the limiting member 20 does not block the LED bonding pad 18, and the LED chip 30 can be bonded on the LED bonding pad 18.

In this embodiment, the

lens positioning holes

13 and 14 are limited in size by positioning members formed by injection molding, specifically,

positioning base holes

15 and 16 are drilled in the circuit board 10, wherein the inner diameter of the positioning base hole 15 is larger than the inner diameter of the lens positioning hole 13, and the inner diameter of the positioning base hole 16 is also larger than the inner diameter of the lens positioning hole 14. The

positioning members

25, 26 are formed by injection molding at the same time as the LED position limiting member 20, wherein the positioning member 25 is formed by injection molding in the positioning base hole 15, preferably, the cross section of the positioning base hole 15 is circular, the positioning member 25 formed by injection molding in the inner wall of the positioning base hole 15 is circular column-shaped, and the lens positioning hole 13 formed in the positioning member 25. Therefore, the axial height of the positioning member 25 is equal to the axial height of the positioning base hole 15.

Similarly, the positioning base hole 16 is a kidney-shaped hole, the positioning element 26 is formed inside the inner wall of the positioning base hole 16 by injection molding, the lens positioning hole 14 with a kidney-shaped cross section is formed in the positioning element 26, and the axial height of the positioning element 26 is equal to the axial height of the positioning base hole 16.

Since the LED position-limiting element 20 and the

positioning elements

25 and 26 are integrally injection-molded, in order to facilitate the injection molding process, the liquid glue can flow onto the circuit board 10 from one injection hole of the mold, and two injection molding grooves 17 are formed on the circuit board 10, as can be seen from fig. 2, the injection molding grooves 17 are recessed from the surface of the circuit board 10 to the inside of the circuit board 10, that is, along the thickness direction of the circuit board 10. Meanwhile, the injection molding groove 17 communicates with the LED position limiting member 20 and the

positioning base holes

15 and 16.

Thus, the liquid glue can flow from the injection hole of the mold to the upper side of the circuit board 10 and form the LED position-limiting member 20, and flow along the injection groove 17 to the

positioning base holes

15, 16 and form the positioning member 25 in the positioning base hole 15 and the positioning member 26 in the positioning base hole 16. And the liquid glue is injected into the injection groove 17 to form the injection molding part 27, and the injection molding part 27 is completely positioned in the injection groove 17, so that the injection molding part 27 is connected with the LED limiting part 20 and the

positioning parts

25 and 26.

Referring to fig. 3 to 5, in a direction perpendicular to the surface of the circuit board 10, i.e., in the thickness direction of the circuit board 10, the upper surface of the limiting member 20 is lower than the upper surface of the LED chip 30, i.e., in the thickness direction of the circuit board 10, the height of the LED chip 30 is greater than the height of the LED limiting member 20. In this way, the upper surface of the LED chip 30 is exposed outside the LED limiting member 20, so as to prevent the LED limiting member 20 from blocking the light emitting surface of the LED chip 30, and ensure that the light beam emitted by the LED chip 30 is not blocked by the LED limiting member 20.

In practical application, the upper surface of the LED position limiting member 20 is equal to the upper surface of the LED chip 30, that is, the upper surface of the LED position limiting member 20 is not higher than the upper surface of the LED chip 30, so that the LED position limiting member 20 does not block the light beam emitted from the LED chip 30.

In addition, for the aesthetic appearance of the surface of the circuit board 10 and also for facilitating the mounting of the lens on the surface of the circuit board 10, the upper surface of the injection molded part 27 is flush with the upper surface of the circuit board 10, i.e. the upper surface of the injection molded part 27 is on the same plane as the upper surface of the circuit board 10. Thus, the surface of the lens attached to the circuit board 10 can be made flat, and the attaching surface can be attached to the surface of the circuit board 10 and the surface of the injection-molded part 27.

The following describes a manufacturing process of the LED lamp module with reference to fig. 6 to 8. First, the circuit board 10 is manufactured by forming the circuit pattern 11 and the LED pads 18 on one substrate by a pattern transfer technique, the circuit pattern 11 and the LED pads 18 may be configured in different shapes according to the requirements of the LED vehicle lamp, and the LED pads 18 are determined according to the positions of the LED chips 30.

Then, drilling equipment is used to drill the circuit board 10 to form the base holes 13 and 14 and the mounting hole 12, the positions of the base holes 13 and 14 are determined according to the positions of the positioning columns of the lens, preferably, the inner diameters of the positioning base holes 13 and 14 are larger than the outer diameters of the positioning columns, further, one of the positioning base holes is a circular through hole, the other positioning base hole is a kidney-shaped hole, for example, the positioning base hole 13 is a circular through hole, and the positioning base hole 14 is a kidney-shaped hole. When the mounting hole 12 is drilled, the position of the mounting hole 12 is determined according to the position of a through hole of the radiator, and the inner diameter of the mounting hole 12 is slightly larger than the outer diameter of a screw rod of a screw, so that the screw can smoothly penetrate through the mounting hole 12.

Next, the circuit board 10 is placed on an injection molding apparatus, and the LED position-limiting member 20 and the

positioning members

25 and 26 are injection molded on the circuit board 10 using a pre-fabricated mold. As shown in fig. 6, the mold 50 has a cavity 51 extending upward from a lower surface of the mold, and the lower surface of the mold 50 is closely attached to the upper surface of the circuit board 10 during the injection molding process. When the liquid glue flows into the mold cavity 51, the LED position limiting member 20 extending upward from the upper surface of the circuit board 10 is formed on the upper surface of the circuit board 10. In the present embodiment, the LED limiting member 20 is formed with a plurality of limiting holes 21, and an inner side surface 23 of each mounting groove 21, that is, an inner side surface of the LED limiting member 20 close to the LED chip 30, is disposed obliquely. Specifically, the inner side surface 23 is inclined outward from the inside of the limiting hole 21 in a direction extending upward from the surface of the circuit board 10, for example, on the side wall on the right side of the limiting hole 21 in fig. 6, the inner side surface 23 is inclined outward from the inside of the limiting hole 21 from bottom to top. Thus, the cross-sectional area of the side of each limiting hole 21 close to the circuit board 10 is smaller, and the cross-sectional area of the side far away from the circuit board 10 is larger, that is, the limiting hole 21 is in a shape with a larger top and a smaller bottom, which is beneficial to placing the LED chip 30 in the limiting hole 21.

Of course, fig. 6 shows only one structure of the limiting hole 21, and in practical applications, the inner side surface 23 of the limiting hole 21 close to the LED chip 30 may include two sections, wherein one section close to the circuit board 10 is perpendicular to the surface of the circuit board 10, and the other section far from the circuit board 10 is inclined from inside to outside, so that the LED chip 30 can be conveniently placed.

Further, the LED limiting member 20 may include a plurality of limiting holes 21, in which case, a plurality of different cavities 51 are disposed on the mold 50, and the positions of the cavities 51 are set according to the positions of the plurality of limiting holes 21. Preferably, each of the limiting holes 21 has the same shape, that is, each of the limiting holes 21 has a shape with a larger top and a smaller bottom. Preferably, each of the limiting holes 21 is located at the circumferential outer side of one of the LED pads 18, i.e. the LED limiting member 20 cannot block the LED pad 18, so as to ensure that one LED chip 30 can be soldered to the corresponding LED pad 18.

During injection molding, the liquid glue not only forms the LED position limiting member 20 on the circuit board 10, but also forms the

positioning members

25 and 26 by injection molding, in this embodiment, the

positioning members

25 and 26 are respectively disposed in the positioning base holes 15 and 16, so that the liquid glue can flow into the positioning base holes 15 and 16 along the injection molding groove 17 on the circuit board 10, and the positioning base holes 15 and 16 are respectively disposed with mold cavities for forming the

positioning members

25 and 26. After demolding, the

retainer

25, 26 will be formed in the

retainer base hole

15, 16, respectively.

The lens positioning hole 13 is formed in the positioning member 25 by controlling the cavity shape of the positioning member 25 so that the positioning member 25 has a circular column shape, and the lens positioning hole 14 is formed in the positioning member 26 by controlling the cavity shape of the positioning member 26 so that the positioning member 26 has a cylindrical shape of a kidney-shaped hole. Thus, the inner diameter, shape, and position of the lens positioning holes 13, 14 are determined by the mold 50. It should be noted that the axis of the positioning member 25 does not necessarily coincide with the axis of the positioning base hole 15, and the axis of the positioning member 25 may be offset from the axis of the positioning base hole 15. Likewise, the axis of the positioning member 26 and the axis of the positioning base hole 16 do not necessarily coincide.

Since the LED position-limiting member 20 and the

positioning members

25 and 26 are integrally injection-molded by the mold 50, the dimensional deviation of the LED position-limiting member 20 and the lens positioning holes 13 and 14 can be made very small by controlling the dimensional tolerance of the mold, and the dimensions of the LED position-limiting member 20 and the lens positioning holes 13 and 14 are substantially the same as the designed dimensions and positions.

Then, solder paste 31 is placed on the LED pads 18 in each of the limiting holes 21, as shown in fig. 7, two solder pastes 31 are placed on the LED pads 18 of the circuit board 10 by the 3D printing technique, and each solder paste 30 is located under one lead of one LED chip 30. Next, as shown in fig. 8, the LED chip 30 is placed on the solder paste 31, and the LED chip 30 is located in one of the limiting holes 21. As can be seen from fig. 8, the upper surface of the LED chip 30 is higher than the upper surface of the LED stopper 20 in the direction perpendicular to the surface of the circuit board 10, so that the LED stopper 20 can be prevented from blocking the light emitting surface of the LED chip 20.

Finally, the circuit board 10 on which the LED chip 30 is placed is soldered, for example, by a reflow process, and the LED chip 30 is soldered on the circuit board 10, thereby electrically connecting the LED chip 30 to the LED pad 18. Although the LED chip 30 may be displaced relative to the LED bonding pad 18 during the soldering process, the LED chip 30 may be limited in displacement distance due to the limiting effect of the LED limiting member 20, so as to ensure that the positional deviation between the LED chip 30 and the lens positioning holes 13 and 14 is within an acceptable range.

In this embodiment, the position deviation between the LED chip 30 and the lens positioning holes 13 and 14 is determined by the cavity tolerance between the cavity of the LED limiting member 20 and the

positioning members

25 and 26 in the mold, and because the precision of the existing mold is very high, the tolerance of the mold can be within 30 micrometers, so the position deviation between the LED chip 30 and the lens positioning holes 13 and 14 can be controlled in a very small range.

After the LED chip 30 is soldered, a lens manufactured in advance can be mounted on the circuit board 10, specifically, the positioning posts of the lens are inserted into the lens positioning holes 13 and 14, and since the lens positioning posts are precisely matched with the lens positioning holes 13 and 14, the position deviation between the optical center of the LED chip 30 and the lens can be controlled within 0.05 mm, so as to meet the precision requirement of the high-altitude automobile on the LED automobile lamp.

Of course, the above-mentioned embodiments are only preferred embodiments of the present invention, and many modifications may be made in practical applications, for example, changes in the specific shape of the LED position-limiting element, changes in the position and shape of the lens positioning hole, etc., which do not affect the implementation of the present invention, and are also included in the scope of the present invention.

Claims

The LED car lamp module comprises a circuit board, wherein a circuit pattern and at least one LED bonding pad are formed on the circuit board, and at least one lens positioning hole is formed in the circuit board;

the method is characterized in that:

the circuit board is also provided with an injection-molded LED limiting part, the LED limiting part is formed on the circumferential outer side of the LED bonding pad, a limiting hole is formed in the LED limiting part, and an LED chip is welded on the LED bonding pad and is positioned in the limiting hole;

and a positioning piece is formed on the peripheral wall of the lens positioning hole, and the positioning piece and the LED limiting piece are integrally formed by injection molding.
2. The LED vehicle lamp module according to claim 1, characterized in that:

in the surface direction perpendicular to the circuit board, the upper surface of the LED limiting piece is not higher than the upper surface of the LED chip.
3. The LED vehicle lamp module according to claim 1, characterized in that:

the LED locating part is close to the inside surface of LED chip, certainly on the surface of circuit board upwards extends the direction, certainly spacing downthehole portion outwards inclines.
4. The LED vehicle lamp module according to any one of claims 1 to 3, wherein:

an injection molding groove is formed in the circuit board and communicated with the LED limiting part and the positioning part.
5. The LED vehicle lamp module according to claim 4, characterized in that:

the injection molding groove is sunken from the surface of the circuit board to the inner side of the circuit board, an injection molding part is filled in the injection molding groove, and the upper surface of the injection molding part is flush with the surface of the circuit board.
6. The LED vehicle lamp module according to any one of claims 1 to 3, wherein:

a plurality of limiting holes are formed in the LED limiting part, and one LED chip is installed in each limiting hole.
The circuit board for the LED car lamp module is provided with a circuit pattern and at least one LED bonding pad, and the circuit board is provided with at least one lens positioning hole;

the method is characterized in that:

the circuit board is also provided with an injection-molded LED limiting part, the LED limiting part is formed on the circumferential outer side of the LED bonding pad, and a limiting hole is formed in the LED limiting part;

and a positioning piece is formed on the peripheral wall of the lens positioning hole, and the positioning piece and the LED limiting piece are integrally formed by injection molding.
The manufacturing method of the LED vehicle lamp module comprises the following steps:

forming a circuit pattern and an LED pad on a circuit board, and drilling at least one positioning base hole on the circuit board;

the method is characterized in that:

the LED limiting part and the positioning part are formed on the circuit board in an injection molding mode, the LED limiting part and the positioning part are integrally formed in an injection molding mode, the LED limiting part is located on the outer side of the periphery of the LED bonding pad, and at least one limiting hole is formed in the LED limiting part;

the positioning piece is positioned on the inner wall of the positioning base hole, the positioning piece is annular, and a lens positioning hole is formed in the positioning piece;

and welding an LED chip on the LED bonding pad to enable the LED chip to be positioned in the limiting hole.
9. The manufacturing method of the LED vehicle lamp module according to claim 8, wherein:

injection molding the LED locating part and the locating part on the circuit board comprises: and injection molding the LED limiting part and the positioning part on the circuit board by using a prefabricated mold.
10. The method for manufacturing an LED vehicle lamp module according to claim 8 or 9, wherein:

injection moulding among the LED locating part, the LED locating part is close to the inboard surface of LED chip, certainly on the surface of circuit board upwards extends the direction, certainly spacing downthehole portion leans out.