CN110883433A - Micro-channel processing system based on liquid-assisted femtosecond laser on-line etching - Google Patents
Micro-channel processing system based on liquid-assisted femtosecond laser on-line etching Download PDFInfo
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- CN110883433A CN110883433A CN201911140271.6A CN201911140271A CN110883433A CN 110883433 A CN110883433 A CN 110883433A CN 201911140271 A CN201911140271 A CN 201911140271A CN 110883433 A CN110883433 A CN 110883433A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/03—Observing, e.g. monitoring, the workpiece
- B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/12—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure
- B23K26/122—Working by laser beam, e.g. welding, cutting or boring in a special atmosphere, e.g. in an enclosure in a liquid, e.g. underwater
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Abstract
The invention relates to a micro-channel processing system based on liquid-assisted femtosecond laser on-line etching, and belongs to the technical field of femtosecond laser application. The micro-channel processing system comprises a femtosecond laser, an optical element, a container, a six-dimensional translation table, an industrial camera and the like; the femtosecond laser emitted by the femtosecond laser device is emitted above the processing objective lens after passing through the collimation system, and is irradiated on a sample to be processed in a container on the six-dimensional translation stage after being focused by the processing objective lens. According to the micro-channel processing system, femtosecond laser scanning modification or ablation is carried out in the etching liquid, and chemical etching is carried out synchronously, so that the micro-channel ablation with high efficiency, high quality and high depth-diameter ratio can be realized, and the direct processing of a more complex 3D structure is completed.
Description
Technical Field
The invention relates to a micro-channel processing system based on liquid-assisted femtosecond laser on-line etching, and belongs to the technical field of femtosecond laser application.
Background
As a common structure, the micro-fluidic system plays a very important role in the fields of biochips, chemical analysis, drug research and the like, while the micro-channel is used as the most important component of the micro-fluidic system, and the characteristics of the micro-channel, such as depth-diameter ratio, quality, precision and the like, play a crucial role in research. The femtosecond laser as a new processing technology has great advantages in the aspect of processing a micro-channel structure.
The traditional method for processing the micro-channel by applying the femtosecond laser mainly comprises the steps of directly ablating the micro-channel by the femtosecond laser, ablating the micro-channel by the liquid auxiliary femtosecond laser and processing the micro-channel by the femtosecond laser auxiliary chemical etching. The femtosecond laser directly ablates the microchannel is the simplest and most direct method, but the machined microchannel has larger taper, smaller depth-diameter ratio and narrower application range. Liquid assisted femtosecond laser ablation substantially solves the above problems due to its optimization of the chip removal problem. The main working principle of the liquid-assisted femtosecond laser ablation processing micro-channel is that femtosecond laser ablation is carried out in a liquid environment, plasma and debris are dissolved by liquid and then are taken away from a processing area, the ablation is continuously carried out in the depth direction, and the micro-channel without conicity is obtained, so that the micro-channel has certain three-dimensional processing capacity. However, as the depth of the microchannel increases and the complexity of the three-dimensional structure increases, the chip removal problem still hinders the further development of the microchannel. On the basis, the material is pre-modified by femtosecond laser, and then the method of processing the micro-channel by chemical etching is combined, so that the micro-channel can have a very complex three-dimensional structure to a certain extent, but the whole process has the problems of more steps, low efficiency and the like. Therefore, how to meet the requirements of high depth-diameter ratio, high precision and high quality in the micro-channel processing process and solve the problem of chip removal and the problem of efficiency at the same time becomes the key of the femtosecond laser micro-channel processing.
Disclosure of Invention
The invention aims to provide a liquid-assisted femtosecond laser online etching-based micro-channel processing system, which improves the structure of the existing micro-channel processing system to solve several problems existing in the traditional femtosecond laser processing micro-channel, directly applies femtosecond laser in pre-configured etching liquid for modified etching, regulates and controls the speed and laser parameters in the processing process and realizes the micro-channel processing of a complex three-dimensional structure.
The invention provides a liquid-assisted femtosecond laser online etching-based micro-channel processing system, which comprises a femtosecond laser, a half-wave plate, a polarizing plate, a diaphragm, a mechanical shutter, a first reflecting mirror, a second reflecting mirror, a dichroic mirror, a processing objective lens, a container, a six-dimensional translation stage, a semi-transparent semi-reflecting mirror, an imaging lens, an industrial camera and a white light source, wherein the half-wave plate is arranged on the upper surface of the liquid-assisted femtosecond laser online etching system; wherein:
the femtosecond laser emitted by the femtosecond laser passes through the half-wave plate, the polarizing plate, the diaphragm and the mechanical shutter, then sequentially passes through the first reflecting mirror, the second reflecting mirror and the dichroic mirror, is incident above the processing objective lens, is focused by the processing objective lens and then irradiates in a container on a six-dimensional translation table, and a sample to be processed is placed in the container;
the half-wave plate and the polaroid jointly form an energy adjusting system, the energy of the femtosecond laser emitted by the femtosecond laser is adjusted, and the polarization direction of the emitted femtosecond laser is horizontal;
the dichroic mirror, the imaging lens positioned on one side of the dichroic mirror, the industrial camera and the white light source form a front imaging unit, and a real-time imaging photo processed by the micro-channel is obtained from the industrial camera through the front imaging unit;
the six-dimensional translation stage is used for moving a sample to be processed, so that the sample to be processed and the femtosecond laser can move mutually, and the femtosecond laser can scan a specific track.
In the micro-channel processing system, the parameters of the femtosecond laser generated by the femtosecond laser device are as follows: the femtosecond laser pulse repetition frequency is 10-1000Hz, the single pulse energy is 0.05-200 muJ, the beam waist diameter before the femtosecond laser focusing is 3-9mm, and the femtosecond laser scanning speed is 0.4-100 muM/s.
The invention provides a micro-channel processing system based on liquid-assisted femtosecond laser online etching, which has the advantages that:
1. the micro-channel processing system of the invention can realize high-efficiency micro-channel processing because femtosecond laser scanning modification or ablation is carried out in the etching liquid along with the synchronous operation of chemical etching.
2. According to the microchannel processing system, the etching liquid is used as a liquid environment on the basis of traditional liquid-assisted processing, so that the processing scraps can be directly dissolved in the liquid environment, and processing stagnation caused by incapability of discharging after the scraps are agglomerated is avoided. Meanwhile, the femtosecond laser interacts with the processing material and liquid to generate local high temperature, the high temperature accelerates the movement of ions in the etching liquid, and simultaneously increases the equilibrium constant of the etching reaction process, thereby being beneficial to further processing the etching process, realizing the micro-channel processing with high quality and high depth-diameter ratio and finishing the direct processing of a more complex 3D structure.
Drawings
FIG. 1 is a schematic structural diagram of a microchannel processing system based on liquid-assisted femtosecond laser on-line etching according to the present invention.
Detailed Description
The invention provides a liquid-assisted femtosecond laser online etching-based micro-channel processing system, which has a structure shown in figure 1 and comprises a femtosecond laser 1, a half-wave plate 2, a polarizing plate 3, a diaphragm 4, a mechanical shutter 5, a first reflecting mirror 6, a second reflecting mirror 7, a dichroic mirror 8, a processing objective 9, a container 11, a six-dimensional translation stage 12, a half-transmitting and half-reflecting mirror 13, an imaging lens 14, an industrial camera 15 and a white light source 16; wherein:
the femtosecond laser 1, the half-wave plate 2, the polaroid 3, the diaphragm 4 and the mechanical shutter 5 are sequentially arranged on a first optical axis, the femtosecond laser emitted by the femtosecond laser 1 passes through the half-wave plate 2, the polaroid 3, the diaphragm 4 and the mechanical shutter 5, then sequentially passes through the first reflecting mirror 6, the second reflecting mirror 7 and the dichroic mirror 8, is incident above the processing objective 9, is focused by the processing objective 9 and then irradiates in a container 11 on a six-dimensional translation stage 12, and a sample 10 to be processed is placed in the container 11;
the half-wave plate 2 and the polaroid 3 jointly form an energy adjusting system, the energy of the femtosecond laser emitted by the femtosecond laser 1 is adjusted, and the polarization direction of the emitted femtosecond laser is horizontal;
the dichroic mirror 8, the imaging lens 14 positioned on one side of the dichroic mirror 8, the industrial camera 15 and the white light source 16 form a front imaging unit, and real-time imaging photos processed by the micro-channel are obtained from the industrial camera 15 through the front imaging unit.
The six-dimensional translation stage 12 is used for moving the sample 10 to be processed, so that the sample to be processed and the femtosecond laser can move mutually, and the femtosecond laser can scan a specific track.
In the above micro-channel processing system, the parameters of the femtosecond laser generated by the femtosecond laser device are as follows: the pulse width of the femtosecond laser is 35fs, the repetition frequency is 1Hz-1KHz and is adjustable, the pulse repetition frequency is 10 Hz-1000 Hz, the energy of a single pulse is 0.05-200 muJ, and the laser is distributed in a spatial Gaussian way; the diameter of beam waist before focusing of femtosecond laser is 3-9mm, and the scanning speed of the femtosecond laser is 0.4-100 μm/s.
The working principle and the working process of the microchannel processing system of the invention are described in detail below with reference to the accompanying drawings and examples:
example 1: and (3) using a KOH solution as an etching solution, and applying femtosecond laser to process a micro-channel in a quartz glass sample.
The specific processing steps of this example are as follows:
sample preparation: a10 mm. times.20 mm. times.2 mm sample of quartz glass was prepared, and after washing with 99.9% strength absolute ethanol, it was used as a sample to be processed.
Optical path adjustment: and (3) turning on the femtosecond laser 1, after waiting for 20-30 minutes, enabling the laser to stably emit light, placing all light path elements into an optical platform according to the sequence shown in the figure 1, and then collimating and adjusting the femtosecond laser to enable the femtosecond laser to irradiate the edge of the surface of the quartz glass sample under the condition of unfocusing. The femtosecond laser pulse repetition frequency of the femtosecond laser 1 is set to 1000Hz, and the beam waist diameter before the femtosecond laser focusing is controlled to be 5 mm. Under the control of the six-dimensional translation stage 12, the focal plane of the processing objective 9 is determined at the end of the processing optical path, so that the focal point of the processing objective 9 is just positioned at the surface edge of the sample 10 to be processed.
Preparing KOH etching liquid: 40g of KOH solid was weighed and dissolved in 60ml of ultrapure water to obtain a KOH solution with a mass fraction of 40%, and after the solution was cooled, it was added to a container until the surface of the sample was submerged.
The height of the six-dimensional translation stage 12 is adjusted so that the femtosecond laser focusing focus is still positioned at the edge of the upper surface of the sample to be processed after passing through the solution with the larger refractive index. And then moving the sample to be processed upwards, so that the femtosecond laser focusing focus is sunk relative to the sample but is not lower than the lower surface of the sample to be processed. The mechanical shutter 5 was opened while moving the six-dimensional translation stage 12 toward the inside of the sample to be processed along the x-axis direction of the translation stage at a moving speed of 0.4 μm/s. And taking out the sample after the processing is finished, washing the sample with ethanol, and drying the sample.
Example 2: and (3) using an HF solution as an etching solution, and applying femtosecond laser to process a micro-channel in the sapphire sample.
The specific processing steps of this example are as follows:
sample preparation: a10 mm × 10mm × 1mm four-side polished sapphire sample was prepared, and was cleaned with 99.9% absolute ethanol and used as a sample to be processed subsequently.
Optical path adjustment: and (3) opening the femtosecond laser 1, after waiting for 20-30 minutes, enabling the laser to stably emit light, placing all light path elements into an optical platform according to the sequence of figure 1, and then collimating and adjusting the femtosecond laser to enable the femtosecond laser to irradiate the edge of the surface of the sapphire sample under the unfocused condition. The femtosecond laser pulse repetition frequency of the femtosecond laser 1 is set to 1000Hz, and the beam waist diameter before the femtosecond laser focusing is controlled to be 4 mm. Under the control of the six-dimensional translation stage 12, the focal plane of the processing objective 9 is determined at the end of the processing optical path, so that the focal point of the processing objective 9 is just positioned at the surface edge of the sample 10 to be processed.
Preparing an HF etching solution: 20mL of 40% mass fraction HF solution is measured and dissolved in 125mL of ultrapure water to obtain 3.6mol/L HF etching solution, and then the HF etching solution is added into the container 11 until the surface of the sample 10 to be processed is submerged. The height of the six-dimensional translation stage 12 is adjusted so that the femtosecond laser focusing focus is still positioned at the edge of the upper surface of the sample after passing through the solution with the larger refractive index. The sample to be processed is then moved upwards so that the focal point is depressed relative to the sample, but not below the lower surface of the sample. The mechanical shutter was opened while moving the translation stage toward the inside of the sample along the x-axis direction of the translation stage at a moving speed of 0.5 μm/s. And taking out the sample after the processing is finished, washing the sample with ethanol, and drying the sample.
In the above embodiment of the present invention, the femtosecond laser used is a titanium sapphire laser of Coherent corporation (Coherent), the center wavelength is 800nm, the pulse width is 35fs, the repetition frequency is 1000Hz at most, the maximum single pulse energy is 7mJ, and the optical field distribution is gaussian distribution. The x-, y-and z-axis repeat positioning accuracy of the six-dimensional translation stage used was. + -. 0.5. mu.m,. + -. 0.5. mu.m and. + -. 0.2. mu.m), and the six-dimensional translation stage was manufactured by Physik instruments, product model H-811. I2. The camera used was an industrial grade CCD.
The above embodiments are preferred embodiments of the present invention, but the present invention is not limited to the above embodiments, and any other changes, modifications, substitutions, combinations, and simplifications which do not depart from the spirit and principle of the present invention should be construed as equivalents thereof, and all such changes, modifications, substitutions, combinations, and simplifications are intended to be included in the scope of the present invention.
Claims (2)
1. A microchannel processing system based on liquid-assisted femtosecond laser online etching is characterized by comprising a femtosecond laser, a half-wave plate, a polarizing plate, a diaphragm, a mechanical shutter, a first reflecting mirror, a second reflecting mirror, a dichroic mirror, a processing objective lens, a container, a six-dimensional translation stage, a semi-transparent semi-reflecting mirror, an imaging lens, an industrial camera and a white light source; wherein:
the femtosecond laser emitted by the femtosecond laser passes through the half-wave plate, the polarizing plate, the diaphragm and the mechanical shutter, then sequentially passes through the first reflecting mirror, the second reflecting mirror and the dichroic mirror, is incident above the processing objective lens, is focused by the processing objective lens and then irradiates in a container on a six-dimensional translation table, and a sample to be processed is placed in the container;
the half-wave plate and the polaroid jointly form an energy adjusting system, the energy of the femtosecond laser emitted by the femtosecond laser is adjusted, and the polarization direction of the emitted femtosecond laser is horizontal;
the dichroic mirror, the imaging lens positioned on one side of the dichroic mirror, the industrial camera and the white light source form a front imaging unit, and a real-time imaging photo processed by the micro-channel is obtained from the industrial camera through the front imaging unit;
the six-dimensional translation stage is used for moving a sample to be processed, so that the sample to be processed and the femtosecond laser can move mutually, and the femtosecond laser can scan a specific track.
2. The microchannel processing system as set forth in claim 1, wherein the femtosecond laser generated by the femtosecond laser has parameters of: the femtosecond laser pulse repetition frequency is 10-1000Hz, the single pulse energy is 0.05-200 muJ, the beam waist diameter before the femtosecond laser focusing is 3-9mm, and the femtosecond laser scanning speed is 0.4-100 muM/s.
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| CN111926174A (en) * | 2020-07-28 | 2020-11-13 | 清华大学 | Method and system for carrying out non-crystallization treatment on metal material by adopting ultrafast pulse laser |
| CN111992876A (en) * | 2020-08-31 | 2020-11-27 | 北京理工大学重庆创新中心 | Complex three-dimensional micropore machining method based on laser and liquid interaction regulation and control |
| CN112192325A (en) * | 2020-10-09 | 2021-01-08 | 北京理工大学 | Method for machining micro-nano scale through hole in transparent hard and brittle material by femtosecond laser |
| CN112756819A (en) * | 2020-12-24 | 2021-05-07 | 清华大学 | System and method for processing micro-channel by femtosecond laser assisted by alternating electric field |
| CN113109915A (en) * | 2021-04-08 | 2021-07-13 | 北京大学 | Capillary channel preparation device |
| CN113414497A (en) * | 2021-07-16 | 2021-09-21 | 北京理工大学重庆创新中心 | Method for processing and preparing surface micro-nano composite structure |
| CN114273790A (en) * | 2022-02-15 | 2022-04-05 | 山东大学 | Femtosecond laser processing device and method for etching gallium nitride in liquid phase |
| CN114660705A (en) * | 2022-03-24 | 2022-06-24 | 西北大学 | Method for writing fiber Bragg grating one by one based on high-refractive-index matching fluid |
| CN115198226A (en) * | 2022-08-16 | 2022-10-18 | 中国人民解放军空军工程大学 | Method for improving metal corrosion resistance based on femtosecond laser induced surface oxidation layer |
| CN115609140A (en) * | 2022-09-20 | 2023-01-17 | 东莞赛诺高德蚀刻科技有限公司 | Vapor chamber preparation method and device based on laser-induced etching |
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| CN111926174B (en) * | 2020-07-28 | 2021-10-08 | 清华大学 | Method and system for carrying out non-crystallization treatment on metal material by adopting ultrafast pulse laser |
| CN111926174A (en) * | 2020-07-28 | 2020-11-13 | 清华大学 | Method and system for carrying out non-crystallization treatment on metal material by adopting ultrafast pulse laser |
| CN111992876A (en) * | 2020-08-31 | 2020-11-27 | 北京理工大学重庆创新中心 | Complex three-dimensional micropore machining method based on laser and liquid interaction regulation and control |
| CN111992876B (en) * | 2020-08-31 | 2022-05-20 | 北京理工大学重庆创新中心 | Complex three-dimensional micropore processing method based on laser and liquid interaction regulation and control |
| CN112192325A (en) * | 2020-10-09 | 2021-01-08 | 北京理工大学 | Method for machining micro-nano scale through hole in transparent hard and brittle material by femtosecond laser |
| CN112756819A (en) * | 2020-12-24 | 2021-05-07 | 清华大学 | System and method for processing micro-channel by femtosecond laser assisted by alternating electric field |
| CN113109915B (en) * | 2021-04-08 | 2022-04-22 | 北京大学 | Capillary channel preparation device |
| CN113109915A (en) * | 2021-04-08 | 2021-07-13 | 北京大学 | Capillary channel preparation device |
| CN113414497A (en) * | 2021-07-16 | 2021-09-21 | 北京理工大学重庆创新中心 | Method for processing and preparing surface micro-nano composite structure |
| CN113414497B (en) * | 2021-07-16 | 2022-07-29 | 北京理工大学重庆创新中心 | Method for processing and preparing surface micro-nano composite structure |
| CN114273790A (en) * | 2022-02-15 | 2022-04-05 | 山东大学 | Femtosecond laser processing device and method for etching gallium nitride in liquid phase |
| CN114660705A (en) * | 2022-03-24 | 2022-06-24 | 西北大学 | Method for writing fiber Bragg grating one by one based on high-refractive-index matching fluid |
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Application publication date: 20200317 |