CN110880526A - Manufacturing method of flexible display panel, flexible display panel and display device - Google Patents
Manufacturing method of flexible display panel, flexible display panel and display device Download PDFInfo
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- CN110880526A CN110880526A CN201911158948.9A CN201911158948A CN110880526A CN 110880526 A CN110880526 A CN 110880526A CN 201911158948 A CN201911158948 A CN 201911158948A CN 110880526 A CN110880526 A CN 110880526A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1213—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being TFTs
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- H—ELECTRICITY
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- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
- H10K59/1315—Interconnections, e.g. wiring lines or terminals comprising structures specially adapted for lowering the resistance
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Abstract
The invention discloses a manufacturing method of a flexible display panel, the flexible display panel and a display device, wherein the display panel comprises a display area and a non-display area, and the non-display area comprises a pad area; the manufacturing method comprises the following steps: forming a first mother board on a first glass substrate, wherein the first mother board comprises a plurality of first functional film layer group areas; forming a second motherboard on a second glass substrate, wherein the second motherboard comprises a plurality of second functional film layer group areas, the second functional film layer group areas comprise a second flexible substrate and functional element layers formed on the second flexible substrate, and at least the area of the second flexible substrate corresponding to the pad area is subjected to patterning treatment; bonding the first mother board and the second mother board through a bonding layer to form a flexible display panel mother board, wherein the orthographic projection of the second functional film layer group area on the first flexible substrate at least exposes the pad area; peeling off the glass substrate; and cutting the flexible display panel mother board. The manufacturing method has simple process and is beneficial to the folding performance and the product yield of the display panel.
Description
Technical Field
The invention relates to the technical field of display, in particular to a manufacturing method of a flexible display panel, the flexible display panel and a display device.
Background
At present, foldable flexible display panels have been applied to various display devices, such as mobile phones, notebook computers, or display screens.
In order to improve the performance of the flexible display screen, strict requirements are imposed on the thickness of the flexible display panel and the width of a frame. In the prior art, when two functional element layers of a flexible display panel are integrated together, the laminating is generally used or another functional element layer is directly manufactured on one functional element layer, however, the laminating mode of each film layer is not easy to manufacture into a super-thin film layer, the thickness of the flexible display panel is influenced, the improvement of the folding performance of the flexible display panel is not facilitated, another functional element layer is manufactured on one functional element layer, the manufacturing process is complex, and the product yield is reduced.
Disclosure of Invention
The invention provides a manufacturing method of a flexible display panel, the flexible display panel and a display device.
In order to achieve the purpose, the invention provides the following technical scheme:
a manufacturing method of a flexible display panel comprises a display area and a non-display area, wherein the non-display area comprises a pad area;
the manufacturing method comprises the following steps:
forming a first motherboard on a first glass substrate, wherein the first motherboard comprises a plurality of first functional film layer group areas, each first functional film layer group area comprises a first flexible substrate, a driving circuit layer formed on the first flexible substrate, a light-emitting device layer formed on one side, away from the first flexible substrate, of the driving circuit layer, a thin film packaging layer formed on one side, away from the driving circuit layer, of the light-emitting device layer, and a conductive pad formed on a pad area of the first flexible substrate;
forming a second motherboard on a second glass substrate, wherein the second motherboard comprises a plurality of second functional film layer group regions corresponding to the first functional modules one to one, each second functional film layer group region comprises a second flexible substrate and a functional element layer formed on the second flexible substrate, and at least the region of the second flexible substrate corresponding to the pad region is removed after patterning; the end part of the second flexible substrate formed after patterning treatment comprises a slope surface, and an included angle between the slope surface and the surface of the second flexible substrate, which is far away from the functional element layer, is an acute angle;
bonding the first mother board and the second mother board through a bonding layer to form a flexible display panel mother board comprising a plurality of flexible display panels, wherein the orthographic projection of each second functional film layer group region on the first flexible substrate at least exposes the pad region, the bonding layer comprises a first bonding part at least formed between the display region and the pad region of the flexible display panel and a second bonding part formed on one side of the first bonding part far away from the pad region, the manufacturing materials of the first bonding part and the second bonding part are in a fluid state, and the flowability of the manufacturing material of the second bonding part is higher than that of the manufacturing material of the first bonding part;
peeling the first glass substrate and the second glass substrate by adopting a large double-sided peeling technology;
and cutting the flexible display panel mother board to form a plurality of separated flexible display panels.
The invention also provides a flexible display panel which is manufactured by the manufacturing method of the flexible display panel.
The invention also provides a display device which adopts the flexible display panel provided in the technical scheme.
The invention has the beneficial effects that:
in the method for manufacturing a flexible display panel, the flexible display panel and the display device provided in the embodiments of the present invention, a first mother board having a plurality of first functional film layer group regions is formed on a first glass substrate, and a second mother board having a plurality of second functional film layer group regions is formed on a second glass substrate, where at least a region of the second flexible substrate corresponding to a pad region is removed after patterning, and then the first mother board and the second mother board are bonded by a bonding layer to form a flexible display panel mother board having a plurality of flexible display panels, and then the first glass substrate and the second glass substrate are peeled by a large-piece peeling technique, and finally the display panel mother board is integrally cut to form a plurality of separated flexible display panels. In the manufacturing method of the flexible display panel provided by the embodiment of the invention, the second flexible substrate is subjected to patterning treatment in the process of manufacturing the second mother board, and after the first mother board and the second mother board are attached to form the flexible display panel mother board, the pad area formed on the first flexible substrate can be directly exposed, and a plurality of separated flexible display panels can be manufactured only by integrally cutting the flexible display panel mother board, so that the manufacturing procedure is simple, and the production efficiency is improved. And the first mother board and the second mother board are jointed through the bonding layer, the bonding layer comprises a first bonding part at least formed between the display area and the pad area and a second bonding part formed on one side, far away from the pad area, of the first bonding part, and the manufacturing materials of the first bonding part and the second bonding part are both in a fluid state in the coating process. The flowability of the second bonding part manufacturing material is higher than that of the first bonding part manufacturing material, so that the manufacturing material of the first bonding part with low flowability does not influence the pad area when the first bonding part is manufactured, the formed first bonding part can prevent the second bonding part with high flowability from flowing to the pad area, and the influence of the second bonding part with high flowability on the circuit of the pad area is avoided.
Drawings
Fig. 1 is a schematic plan view of a flexible display panel according to an embodiment of the present invention;
fig. 2 is a flowchart illustrating a manufacturing process of a flexible display panel according to an embodiment of the present invention;
fig. 3 is a schematic plan view of a first motherboard according to an embodiment of the present invention;
fig. 4 is a schematic plan view of a second motherboard according to an embodiment of the present invention;
fig. 5 is a schematic plan view of a flexible display panel motherboard according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of an adhesive layer according to an embodiment of the present invention;
FIG. 7 is a flowchart illustrating a process of manufacturing a first motherboard according to an embodiment of the present invention;
FIG. 8 is a flowchart illustrating a second motherboard according to an embodiment of the present invention;
FIG. 9 is a flow chart illustrating the fabrication of an adhesive layer according to an embodiment of the present invention;
FIG. 10 is a schematic structural diagram of an adhesive layer according to an embodiment of the present invention;
FIG. 11 is a schematic structural diagram of an adhesive layer according to an embodiment of the present invention;
fig. 12 is a schematic plan view of a first functional film layer set according to an embodiment of the present invention;
fig. 13 is a schematic plan view of another first functional film layer set provided in accordance with an embodiment of the present invention;
fig. 14 is a schematic plan view of another first functional film layer set provided in accordance with an embodiment of the present invention;
fig. 15 is a schematic structural diagram of a flexible display panel according to an embodiment of the present invention;
fig. 16 is a schematic structural diagram of a display area of a flexible display panel according to an embodiment of the present invention;
FIG. 17 is a schematic view of a structure of FIG. 1 at cut line D1;
FIG. 18 is a schematic view of a structure of FIG. 1 at cut line D2;
FIG. 19 is another schematic view of the structure of FIG. 1 at cut line D1;
fig. 20 is a schematic plan view of another first functional film layer set provided in accordance with an embodiment of the present invention;
fig. 21 is a schematic structural diagram of a display device according to an embodiment of the present invention.
Icon:
a-a display area; b-a non-display area; a C-pad region;
1-a first functional membrane layer group; 11-a first flexible substrate; 12-a drive circuit layer; 121-a first planar layer; 13-a light emitting device layer; 131-a first electrode; 132-an organic light-emitting layer; 133-a second electrode; 134-pixel definition layer; 14-a thin film encapsulation layer; 141-a first inorganic encapsulation layer; 142-a first organic encapsulation layer; 143-a second inorganic encapsulation layer; 15-dam construction; 16-an inorganic encapsulation layer; 2-a second functional membrane layer group; 21-a second flexible substrate; 211-slope surface; 221-a color filter layer; 2211-color filter unit; 22-a functional element layer; 222-a touch sensing layer; 23-black matrix; 3-a conductive pad; 4-an adhesive layer; 41-a first adhesive portion; 411. 412-sub-adhesive layer; 42-a second adhesive portion; 5-a flexible circuit board; 6-driving the chip.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the related art, the flexible display panel includes a substrate, a driving circuit layer on the substrate, a light emitting device layer on the driving circuit layer, a thin film encapsulation layer on the light emitting device layer, a touch sensing layer on the thin film encapsulation layer, and a polarizer on the touch sensing layer.
The manufacturing method of the flexible display panel may specifically be that, first, a substrate is formed on a first glass substrate, a driving circuit layer is formed on the substrate, and then a light emitting device is formed on the driving circuit layer; and then manufacturing a thin film packaging layer on the light-emitting device layer. In the related art, the polarizer, the touch layer and the upper cover plate layer are separately manufactured films, and thus the separately manufactured films need to be attached to the thin film encapsulation layer by layer through an adhesion process. At present, the whole thickness of the flexible display screen needs to be controlled, a neutral plane during bending is designed on an organic light-emitting structure layer, and the thicknesses of a polarizing film, an upper cover plate layer and a touch layer are difficult to thin when the thicknesses of films above and below the organic light-emitting structure layer are adjusted. And when the organic electroluminescent device is manufactured, each film layer is independently formed and then attached, the use of the adhesive material not only increases the thickness of the organic electroluminescent device, but also makes the organic electroluminescent device difficult to realize folding or difficult to restore after standing after folding due to the attachment of the adhesive material.
In another manufacturing method of the flexible display surface, the substrate base plate, the driving circuit layer and the light-emitting device layer are sequentially manufactured, and the touch layer is directly manufactured on the thin film packaging layer.
The embodiment of the invention provides a manufacturing method of a flexible display panel, the flexible display panel and a display device, aiming at the problems generated by the manufacturing method of the flexible display panel in the related art. In order to make the objects, technical solutions and advantages of the present invention clearer, specific embodiments of a flexible display panel, a manufacturing method thereof and a display device according to an embodiment of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the preferred embodiments described below are only for illustrating and explaining the present invention and are not to be used for limiting the present invention. And the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The embodiment of the invention provides a manufacturing method of a flexible display panel, and particularly, as shown in fig. 1, the display panel comprises a display area a and a non-display area B, wherein the non-display area B comprises a pad area C;
as shown in fig. 2 to 6, the method for manufacturing a flexible display panel specifically includes:
s201: forming a first mother board M1 on the first glass substrate, where the first mother board M1 includes a plurality of first functional film group regions Q1, and as shown in fig. 3, the first functional film group regions include a first flexible substrate, a driving circuit layer formed on the first flexible substrate, a light emitting device layer formed on a side of the driving circuit layer away from the first flexible substrate, a thin film encapsulation layer formed on a side of the light emitting device layer away from the driving circuit layer, and conductive pads formed on a pad region C of the first flexible substrate;
s202: forming a second mother board M2 on the second glass substrate, the second mother board including a plurality of second functional film group regions Q2 corresponding to the first functional film group regions one to one, as shown in fig. 4, the second functional film group regions including a second flexible substrate and a functional element layer formed on the second flexible substrate, wherein at least a region of the second flexible substrate corresponding to the pad region is removed after patterning; the end part of the second flexible substrate formed after patterning treatment comprises a slope surface, and an included angle between the slope surface and the surface of the second flexible substrate, which is far away from the functional element layer, is an acute angle;
s203: bonding the first mother board M1 and the second mother board M2 through a bonding layer 4 to form a flexible display panel mother board R including a plurality of flexible display panels, as shown in fig. 5 and 6, an orthographic projection of each second functional film layer group region on the first flexible substrate at least exposes the pad region, the bonding layer 4 includes at least a first bonding portion 41 formed between a display region a and a pad region C of the flexible display panel and a second bonding portion 42 formed on a side of the first bonding portion away from the pad region, the first bonding portion and the second bonding portion are made of a material in a fluid state in a coating process, and the flowability of the second bonding portion is higher than that of the first bonding portion;
s204: peeling the first glass substrate and the second glass substrate by adopting a large double-sided peeling technology;
s205: and cutting the flexible display panel mother board to form a plurality of separated flexible display panels.
In some optional embodiments, the flexible display panel may be manufactured by first forming a first mother substrate having a plurality of first functional film layer group regions on a first glass substrate; then, cutting the first motherboard to form a plurality of first functional film layer groups, wherein each first functional film layer group comprises a substrate base plate, a driving circuit layer positioned on the substrate base plate, a light-emitting device layer positioned on the driving circuit layer and a thin film packaging layer positioned on the light-emitting device layer; simultaneously, forming a second mother board with a plurality of second functional film layer group areas on a second glass substrate; then, cutting the second motherboard to form a plurality of second functional film layer groups, wherein the second functional film layer groups comprise polaroids and touch induction layers; then, the first functional film layer group and the second functional film layer group are attached through solid optical glue to form a flexible display panel; and finally, forming a packaging cover plate on one side of the polaroid, which deviates from the touch induction layer. Because in the final display panel, the size and the dimension of the second flexible substrate in the second functional film layer group are different from the size and the dimension of the first flexible substrate in the first functional film layer group, the first flexible substrate and the second flexible substrate with different dimensions cannot be obtained through one-time cutting process, and therefore the two substrates need to be cut firstly and then attached. The manufacturing method needs to respectively cut the first mother board and the second mother board and then laminate the first functional film layer group and the second functional film layer group, the manufacturing process is complex, the production efficiency is low, and the formed flexible display panel is not beneficial to improving the folding performance due to the fact that the thickness of the solid optical adhesive and the thickness of the polaroid are thick. In the method for manufacturing a flexible display panel according to the embodiment of the present invention, a first mother board having a plurality of first functional film layer group regions is formed on a first glass substrate, a second mother board having a plurality of second functional film layer group regions is formed on a second glass substrate, at least a region of the second flexible substrate corresponding to a pad region is removed after patterning, the first mother board and the second mother board are bonded by an adhesive layer to form a flexible display panel mother board having a plurality of flexible display panels, the first glass substrate and the second glass substrate are peeled by a large-piece peeling technique, and finally, the display panel mother board is integrally cut to form a plurality of separated flexible display panels. In the manufacturing method of the flexible display panel provided by the embodiment of the invention, the second flexible substrate is subjected to patterning treatment in the process of manufacturing the second mother board, and after the first mother board and the second mother board are attached to form the flexible display panel mother board, the pad area formed on the first flexible substrate can be directly exposed, and a plurality of separated flexible display panels can be manufactured only by integrally cutting the flexible display panel mother board, so that the manufacturing procedure is simple, and the production efficiency is improved.
In addition, in the manufacturing method of the flexible display panel provided by the embodiment of the invention, the first motherboard and the second motherboard are bonded by the bonding layer, the bonding layer 4 includes at least the first bonding part 41 formed between the display area and the pad area and the second bonding part 42 formed on the side of the first bonding part far from the pad area, because the manufacturing material of the first bonding part and the manufacturing material of the second bonding part are both in a fluid state in the coating process, through the fluidity of the manufacturing material of the first bonding part and the manufacturing material of the second bonding part, an ultrathin bonding layer can be directly formed on the first functional film layer group or the second functional film layer group, after the ultrathin bonding layer is cured, the ultrathin bonding of the first functional film layer group and the second functional film layer group can be realized, the thickness of the flexible display panel is reduced, the folding performance of the flexible display panel is further improved, and the manufacturing process of the flexible display panel is simple, the yield of the flexible display panel is improved. Because the fluidity of the second bonding part manufacturing material is higher than that of the first bonding part manufacturing material, the cut-off position of the coating edge of the second bonding part is difficult to control in the process of manufacturing the second bonding part, and the process precision is low, so that the second bonding part is easy to flow to the pad area and affects the pad area; the first bonding part has low material flowability, is easier to form a specific shape and a cut-off edge, and has high processing precision, so that the manufacturing material of the first bonding part with low flowability does not influence the pad area when manufacturing the first bonding part, and the formed first bonding part can prevent the second bonding part with high flowability from flowing to the pad area, thereby avoiding the influence of the second bonding part with high flowability on the circuit of the pad area. And in the display panel, since the display area has thicker film layers such as a pixel defining layer, an organic encapsulation layer, and the like, and the number of film layers stacked in the display area is greater, the thickness of the display area is greater than that of the non-display area. Therefore, the display region needs to be provided with an adhesive layer with a smaller thickness, and in the embodiment of the invention, the first adhesive part has larger fluidity, so that a thinner adhesive layer can be formed; in the embodiment of the invention, the flowability of the second bonding part is small, which is beneficial to forming the bonding layer with larger thickness, so that the second bonding part compensates the thickness difference between the display area and the non-display area, and the first mother board and the second mother board can be smoothly attached.
Specifically, when the second mother substrate is formed on the second glass substrate, patterning is performed on the second flexible substrate, the end part formed after the patterning treatment of the second flexible substrate is provided with a slope, the included angle between the slope and the surface of the second flexible substrate far away from the functional element layer is an acute angle, in the cut and separated flexible display panel, when the orthographic projection of the first bonding part on the first flexible substrate is not overlapped with the orthographic projection of the slope surface on the first flexible substrate, an accommodating space can be formed between the region of the slope surface of the second flexible substrate on the second functional film layer group and the first functional film layer, when the flexible circuit board with the driving chip is jointed with the conductive bonding pad of the bonding pad region, the jointed end part of the flexible circuit board can extend into the accommodating space, so that the space is saved, and then reduce the width of the frame that the pad district belongs to, can realize narrow frame, increase flexible display panel's screen accounts for the ratio.
Specifically, the forming of the first mother substrate on the first glass substrate may include, as shown in fig. 7:
s701: forming a large first flexible substrate on a first glass substrate;
s702: forming a large-piece driving circuit layer on a large-piece first flexible substrate;
s703: forming a large-sheet light emitting device layer on the large-sheet driving circuit layer;
s704: and forming a large-sheet thin film packaging layer on the large-sheet light-emitting device layer.
Specifically, forming the second mother substrate on the second glass substrate may include, as shown in fig. 8:
s801: and forming a large second flexible substrate on the second glass substrate.
S802: and carrying out patterning treatment on the second flexible substrate with large piece. And at least the region of the second flexible substrate with large size corresponding to the pad region on the first flexible substrate with large size is removed after patterning treatment. Alternatively, when the patterning process is performed on the large-piece second flexible substrate, the large-piece second flexible substrate may also be patterned to form a separate second flexible substrate.
S803: and forming a functional element layer on the patterned second flexible substrate. After the second flexible substrate is subjected to patterning processing, a slope is formed in the patterned area, and the functional element layer may include a color filter layer and a touch sensing layer.
Specifically, the specific steps of fabricating the adhesive layer may be, as shown in fig. 9:
s901: and coating the manufacturing material of the first bonding part on the first motherboard to form the first bonding part. Because the manufacturing material of the first bonding part is in a fluid state, the fluidity of the first bonding part is beneficial to manufacturing the ultrathin bonding layer. The first adhesion part 41 may be formed only between the display area a and the pad area C of each first functional film layer group region Q1, as shown in fig. 6; may also be formed around each first functional film layer group region Q1 and between the display region a and the pad region C of each first functional film layer group region Q1, as shown in fig. 10; alternatively, it may be formed between the display region a and the pad region C of each first functional film layer group region Q1 and on the side of each first functional film layer group region Q1 away from the pad region thereof, as shown in fig. 11. Alternatively, the first adhesive portion may also be formed on the second mother board. Since the first adhesive portion has low fluidity, it cannot flow to the pad region at the time of coating, avoiding an influence on the pad region at the time of forming an ultra-thin adhesive layer.
S902: and dripping the manufacturing material of the second bonding part on one side of the first bonding part, which is far away from the pad area, on each first functional film layer group area so as to form the ultrathin bonding layer. For example, when the first adhesive part 41 is formed around each first functional film layer group region Q1 and between the display region a and the pad region C of each first functional film layer group region Q1, the material for forming the second adhesive part 42 may be dropped into the region surrounded by the first adhesive part 41 on the side away from the pad region C, as shown in fig. 10. Because the manufacturing material of the second bonding part has high fluidity, the second bonding part which is flat and extremely thin can be formed, and the risk of uneven display of the flexible display panel can be reduced. The first bonding part can block the high-fluidity manufacturing material of the second bonding part from flowing to the pad area, and the influence on the circuit of the pad area is avoided.
In the description of the large substrate or the large driving circuit layer, the term "large" refers to a state of the display panel when the display panel is arranged in an array on the mother substrate before the mother substrate of the display panel is cut into individual display panels.
Specifically, the thickness of the portion of the adhesive layer located in the display region may be less than 10 μm, that is, the thickness of the portion of the second adhesive portion located in the display region may be less than 10 μm, so that the ultra-thin bonding between the first functional film layer group and the second functional film layer group is realized.
Specifically, when the first motherboard and the second motherboard are bonded by the bonding layer, the first bonding portion of the bonding layer may be located between the two flexible display panels and between the display region and the pad region of the flexible display panel.
Specifically, when the flexible display panel motherboard is cut, the specific steps include cutting and removing the bonding layer between the two flexible display panels. As shown in fig. 12, after the flexible display panel mother board is cut, the structure of the first functional film layer group 1 of the flexible display panel may be as shown in fig. 12, and the first bonding portion 41 is only located between the display area a and the pad area B of the flexible display panel. Optionally, when the flexible display panel mother board is cut, a part of the first bonding portion may be further remained in the edge region of the flexible display panel, where, as shown in fig. 13, the first bonding portion 41 is specifically provided between the display region a and the pad region C of the flexible display panel and at the end of the flexible display panel opposite to the pad region C; alternatively, as shown in fig. 14, a portion of the connection portion is remained except for the edge having the pad region of the flexible display panel, that is, the first adhesion portion is provided around the display region of the flexible display panel after the cutting is completed.
Specifically, when the first adhesive part is manufactured, the specific steps may include: and coating and curing at least twice on the first mother board to form at least two sub-bonding layers, wherein the at least two bonding layers are stacked in the thickness direction of the first flexible substrate. For example, if the first adhesive part has two sub-adhesive layers, the specific manufacturing steps are as follows: first, after a first sub-adhesive layer is coated on a first mother substrate, the first sub-adhesive layer is cured, and then, a second sub-adhesive layer is coated on the cured first sub-adhesive layer and the second sub-adhesive layer is cured, thereby forming a first adhesive portion. By adopting the scheme of coating and curing for multiple times, the first bonding part is formed, and compared with the method of coating and curing only once to form the first bonding part, the width of the first bonding part can be made as narrow as possible, and the effect of reducing the width of the frame is realized.
Specifically, after the first bonding portion is formed through at least two coating and curing processes, along the direction in which the first flexible substrate points to the second flexible substrate, the sides, in contact with the second bonding portion, of the at least two sub-bonding layers are arranged in a step shape, and along the direction in which the first flexible substrate points to the second flexible substrate, the distance from the side, in contact with the second bonding portion, of the sub-bonding layers to the display area gradually increases.
Specifically, when the adhesive layer is formed, the adhesive layer may be formed on the first motherboard as described above, and then the first motherboard may be attached to the second motherboard. Or an adhesive layer may be formed on the second motherboard, and then the first motherboard and the second motherboard are attached.
Based on the same inventive concept, an embodiment of the present invention further provides a flexible display panel, which is manufactured by the manufacturing method of the flexible display panel provided by the embodiment of the present invention, as shown in fig. 1, and includes a display area a and a non-display area B, where the non-display area B includes a pad area C, and the pad area C includes a conductive pad 3;
as shown in fig. 15, the flexible display panel has a first functional film layer group 1, a second functional film layer group 2, and an adhesive layer 4 between the first functional film layer group 1 and the second functional film layer group 2;
specifically, as shown in fig. 16, the first functional film layer group 1 includes a first flexible substrate 11, a driving circuit layer 12 on the first flexible substrate 11, a light emitting device layer 13 on a side of the driving circuit layer 12 facing away from the first flexible substrate 11, and a thin film encapsulation layer 14 on a side of the light emitting device layer 13 facing away from the driving circuit layer 12, and the conductive pad 3 is located on the first flexible substrate 11;
specifically, as shown in fig. 16, the second functional film layer group 2 includes a second flexible substrate 21, and a functional element layer 22 located on a side of the second flexible substrate 21 close to the first flexible substrate 11, and an orthographic projection of the second flexible substrate 21 on the first flexible substrate 11 at least exposes the conductive pad 3; as shown in fig. 15, the second flexible substrate 21 includes a first end and a second end opposite to each other along the first direction E, the second end being located at a side of the first end near the pad region C; the flexible substrate comprises a slope 211 at the second end of the second flexible substrate 21, and an included angle between the slope 211 and the surface of the second flexible substrate 21 away from the functional element layer 22 is an acute angle; the first direction E is the direction in which the pad region C points to the display region A;
it should be noted that, the orthographic projection of the second flexible substrate 21 on the first flexible substrate 11 only needs to expose at least the pad region, and no specific requirement is made on the shape of the second end edge of the second flexible substrate 21, which may be determined according to the actual situation. For example, the edge of the second end of the second flexible substrate 21 may be a straight edge as shown in fig. 1, exposing the pad region C, or the edge of the second end of the second flexible substrate 21 may be an inverted U shape, exposing the pad region C.
Specifically, as shown in fig. 15, the bonding layer 4 includes at least a first bonding portion 41 located between the display area a and the pad area C, and a second bonding portion 42 located on a side of the first bonding portion 41 away from the pad area C, and when the first bonding portion 41 and the second bonding portion 42 are both in a fluid state, the fluidity of the material for making the second bonding portion 42 is higher than that of the material for making the first bonding portion 41.
In the flexible display panel provided in the above embodiment of the invention, the first functional film layer group 1 and the second functional film layer group 2 are bonded together by the bonding layer 4, the bonding layer 4 includes the first bonding part 41 located between the display area a and the pad area C and the second bonding part 42 located on the side of the first bonding part 41 far from the pad area C, because the manufacturing material of the first bonding part 41 and the manufacturing material of the second bonding part 42 are both in a fluid state during the coating process, an ultra-thin bonding layer can be directly formed on the first functional film layer group or the second functional film layer group by the fluidity of the manufacturing material of the first bonding part 41 and the manufacturing material of the second bonding part 42, after the ultra-thin bonding layer is cured, the ultra-thin bonding of the first functional film layer group 1 and the second functional film layer group 2 can be realized, the thickness of the flexible panel is reduced, and the folding performance of the flexible display panel is further improved, and the manufacturing process of the flexible display panel is simple, and the yield of the flexible display panel is improved. Since the fluidity of the material for forming the second adhesive part 42 is higher than that of the material for forming the first adhesive part 41, that is, the viscosity of the material for forming the second adhesive part 42 is lower than that of the material for forming the first adhesive part 41, the material for forming the first adhesive part 41 with low fluidity does not affect the pad region when forming the first adhesive part, and the formed first adhesive part can prevent the second adhesive part 42 with high fluidity from flowing to the pad region C, thereby avoiding the influence of the second adhesive part 42 with high fluidity on the circuit of the pad region C.
As shown in fig. 15, in the flexible display panel, the second flexible substrate 21 is close to the second end of the pad region C, the second flexible substrate 21 includes a slope 211, an included angle between the slope 211 and the surface of the second flexible substrate 21 away from the functional element layer 22 is an acute angle, after the first functional film layer group 1 and the second functional film layer group 2 are bonded by the bonding layer 4, when the orthographic projection of the first bonding part 41 on the first flexible substrate 11 and the orthographic projection of the slope 211 on the first flexible substrate 11 do not coincide, an accommodation space can be formed between the area of the slope 211 of the second flexible substrate 21 on the second functional film layer group 2 and the first functional film layer group 1, and when the flexible circuit board 5 having the driver chip is bonded to the conductive pad 3 of the pad region C, the end of the flexible circuit board 5 can be inserted into the accommodation space, thereby saving space and further reducing the width of the frame where the pad region C is located, narrow frame can be realized, and flexible display panel's screen is account for than increasing.
Specifically, as shown in fig. 16, fig. 16 is a schematic structural diagram of a display area of a flexible display panel according to an embodiment of the present invention; in the first functional film layer group 1, the driving circuit layer 12 includes a plurality of gate lines, a plurality of data lines, and other signal lines in the display region a, a plurality of pixel driving units electrically connected to the gate lines and the data lines, and a first planarization layer (not shown in fig. 16) covering a side of the plurality of pixel driving units away from the first flexible substrate 11, for protecting the driving circuit layer 12 and providing a planar surface for preparing the light emitting device layer 13.
The conductive pad 3 may be used for binding with a flexible circuit board with a touch driving chip, and the conductive pad 3 may be disposed on the first flat layer.
The light emitting device layer 13 includes a plurality of organic electroluminescent devices located on a side of the first flat layer away from the first flexible substrate 11 and located in the display area a, and a pixel defining layer 134 surrounding the organic electroluminescent devices, the pixel driving unit is electrically connected to the organic electroluminescent devices for driving the organic electroluminescent devices to emit light, and the organic electroluminescent devices include a first electrode 131, an organic light emitting layer 132, and a second electrode 133 that are sequentially stacked.
The thin film encapsulation layer 14 may include a plurality of inorganic encapsulation layers and organic encapsulation layers alternately arranged, and specifically, the thin film encapsulation layer 14 may include a first inorganic encapsulation layer 141, a first organic encapsulation layer 142 and a second inorganic encapsulation layer 143 sequentially stacked, wherein the first inorganic encapsulation layer 141 is in contact with the light emitting device layer 13 and blocks water and oxygen from invading into the flexible display panel, and the first organic encapsulation layer 142 is used for buffering stress of the device when the device is bent and folded and covering of particle pollutants. The first inorganic encapsulating layer 141 and the second inorganic encapsulating layer 143 are used to encapsulate the first organic encapsulating layer 142, so that the encapsulating effect of the side edge of the flexible display panel can be improved, and the invasion of oxygen and water from the outside can be reduced or eliminated.
Specifically, as shown in fig. 16, in the second functional film layer group 2, the second flexible substrate 21 is a transparent substrate, and the functional element layer 22 may include a color filter layer 221 and a touch sensing layer 222, where the color filter layer 221 is located on one side of the second flexible substrate 21, and the touch sensing layer 222 is located on one side of the color filter layer 221 away from the second flexible substrate 21 and located in the display area a; or the touch sensing layer is positioned on the second flexible substrate and in the display area, and the color filter layer is positioned on one side of the touch sensing layer, which is far away from the second flexible substrate; or the touch sensing layer and the color filter layer are integrated together. In the related art, a polarizer is usually disposed on one side of the touch sensing layer 222 for preventing external light reflection, but the thickness of the polarizer is relatively thick, which is not favorable for folding the flexible display panel, and a color filter layer is used to replace the polarizer, and the color filter layer can only transmit light (e.g., red, green, or blue light) in a predetermined wavelength range, that is, the color filter layer prevents light in other wavelength ranges except the predetermined wavelength range from transmitting, thereby reducing reflection of external light, and the thickness of the color filter layer can be made thinner than the polarizer, which is favorable for improving folding performance of the flexible display panel. The color filter layer 221 may include color filter units 2211 corresponding one-to-one to the organic electroluminescent devices in the light emitting device layer 13, and the color filter layer 221 may include at least three color filter units, for example, a red color filter unit, a green color filter unit, and a blue color filter unit.
The second functional film layer group 2 further includes a black matrix 23 positioned around each color filter unit 2211. The color filter layer 221 is located on one side of the second flexible substrate 21, the touch sensing layer 222 is located on one side of the color filter layer 221, which is away from the second flexible substrate 21, and the black matrix 23 is formed on the second flexible substrate 21.
Specifically, as shown in fig. 12, the first adhesion part 41 may be located only between the display area a and the pad area C for preventing the second adhesion part 42 having high fluidity when fabricating the adhesion layer from flowing to the pad area C. Alternatively, as shown in fig. 13, a first portion of the first adhesion portion 41 may be disposed in the non-display region B where the first end of the second flexible substrate 21 is located, a second portion is disposed between the display region a and the pad region C, and the second adhesion portion 42 is located between the first portion and the second portion of the first adhesion portion 41; alternatively, as shown in fig. 14, the first adhesive part 41 is located in the non-display area B and surrounds the display area a, wherein a portion of the first adhesive part 41 is located between the display area a and the pad area C, and the second adhesive part 42 is located in the area surrounded by the first adhesive part 41, when forming the adhesive layer, the first adhesive part 41 blocks the manufacturing material of the high-fluidity second adhesive part 42, so that the second adhesive parts 42 in the display area a are uniformly distributed, and the first adhesive part 41 surrounding the display area a can prevent the lateral light leakage of the display panel, thereby improving the display quality of the display panel.
Specifically, as shown in fig. 17, the first adhesive part 41 may be formed between the black matrix 23 and the first flat layer 121, or, as shown in fig. 18, the black matrix 23 and the color filter layer 221 may be stacked in the non-display region, and the first adhesive part 41 may be formed between the color filter layer 221 and the first flat layer 121 in the non-display region B.
As shown in fig. 17, the non-display area B of the second functional film layer group 2 further includes a touch lead 2221 electrically connected to the touch sensing layer, the touch lead extends to an area corresponding to the first bonding portion between the display area and the pad area, the touch lead may be electrically connected to a connection terminal correspondingly disposed on the first functional film layer through a through hole formed on the first bonding portion and a connection structure in the through hole, the connection terminal is electrically connected to the conductive pad, and thus, transmission of a touch signal is achieved.
Specifically, the first bonding portion 41 may be a black sealant, so that the risk of light leakage at the edge of the display panel is reduced. The material for forming the second adhesive portion 42 may be a transparent optical adhesive with high fluidity, and when the second adhesive portion 42 is formed, the transparent optical adhesive with high fluidity is formed in the region surrounded by the first adhesive portion 41, so that the second adhesive portion 42 can be formed flat and extremely thin, and the risk of uneven display of the flexible display panel can be reduced.
Specifically, the thickness of the portion of the adhesive layer 4 located in the display region a may be less than 10 μm, that is, the thickness of the portion of the second adhesive portion 42 located in the display region a may be less than 10 μm, so that the ultra-thin adhesion between the first functional film layer group 1 and the second functional film layer group 2 is achieved. Specifically, the sum of the thicknesses of the thin film encapsulation layer 14 and the adhesive layer 4 in the display area a can be controlled to be less than 15 μm, the implementation method is flexible and various, and the manufacturability is strong.
Specifically, the first adhesive portion 41 may be provided as one layer, as shown in fig. 17; at least two sub-adhesive layers stacked in the thickness direction of the first flexible substrate 11 may also be included, and for example, as shown in fig. 19, the first adhesive layer 41 includes a sub-adhesive layer 411 and a sub-adhesive layer 412. In the flexible display panel, the first organic encapsulation layer 142 may be formed only in the display region, and the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 may extend to the non-display region, the first organic encapsulation layer 142 may enable a large step difference between the display region a and the non-display region B, in order to compensate for the large step difference between the display region a and the non-display region B, the first adhesion portion 41 may be configured to have at least two sub-adhesion layers stacked in the thickness direction of the first flexible substrate 11, a scheme of multiple coating and curing may be adopted in manufacturing the multi-sub-adhesion layer, the width of the first adhesion portion 41 may be made as narrow as possible, and an effect of reducing the bezel width is achieved.
Specifically, when at least two sub-adhesive layers 411 of the first adhesive part 41 are provided, as shown in fig. 19, the sides of the at least two sub-adhesive layers 411 in contact with the second adhesive part 42 may be arranged in a stepped manner along the direction in which the first flexible substrate 11 is directed to the second flexible substrate 21, so that the width of the first adhesive part 41 is as narrow as possible.
Specifically, in manufacturing at least two sub-adhesive layers of the first adhesive part 41, as shown in fig. 19, the distances from the display area a of the side of the first flexible substrate 11 that is in contact with the second adhesive part 42 and the sub-adhesive layers 411 and 412 may be gradually increased in a direction in which the first flexible substrate 11 is directed to the second flexible substrate 21, so that the width of the first adhesive part 41 is gradually narrowed.
Specifically, as shown in fig. 20, the flexible display panel further includes a bank structure 15 located in the non-display region B and surrounding the display region a, the bank structure 15 serving to confine an outer edge of the first organic encapsulation layer 142, edges of the first inorganic encapsulation layer 141 and the second inorganic encapsulation layer 143 covering the bank structure 15 to form the inorganic encapsulation layer 16 on the bank structure 15, and the first adhesive part 41 may be located on a side of the bank structure 15 away from the display region a, as shown in fig. 19.
In the flexible display panel, as shown in fig. 18, the orthographic projection of the second end of the second flexible substrate 21 on the first flexible substrate 11 may be located within the orthographic projection range of the first bonding portion 41 on the first flexible substrate 11, and a gap may be prevented from being generated after the first functional film group 1 and the second functional film group 2 are bonded to each other. The orthographic projection of the second end of the second flexible substrate 21 on the first flexible substrate 11 may not be located in the orthographic projection range of the first adhesive part 41 on the first flexible substrate 11, as shown in fig. 15.
Based on the same inventive concept, the embodiment of the invention further provides a display device, and any one of the flexible display panels provided by the technical scheme is adopted. The display device may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like. Other essential components of the display device are understood by those skilled in the art, and are not described herein or should not be construed as limiting the invention.
As shown in fig. 21, the display device according to the embodiment of the present invention further includes a flexible circuit board 5 bonded to the pad region of the flexible display panel and having a driving chip 6, and a package cover (not shown in fig. 21) located on a side of the second flexible substrate away from the first flexible substrate. The manufacturing process of the display device provided by the embodiment of the invention is that after the flexible display panel mother board is cut, the flexible circuit board is bound and attached in the pad area, and then the packaging cover plate is formed on one side of the second flexible substrate, which is far away from the first flexible substrate.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (15)
1. The manufacturing method of the flexible display panel is characterized in that the display panel comprises a display area and a non-display area, wherein the non-display area comprises a pad area;
the manufacturing method comprises the following steps:
forming a first motherboard on a first glass substrate, wherein the first motherboard comprises a plurality of first functional film layer group areas, each first functional film layer group area comprises a first flexible substrate, a driving circuit layer formed on the first flexible substrate, a light-emitting device layer formed on one side, away from the first flexible substrate, of the driving circuit layer, a thin film packaging layer formed on one side, away from the driving circuit layer, of the light-emitting device layer, and a conductive pad formed on a pad area of the first flexible substrate;
forming a second mother board on a second glass substrate, wherein the second mother board comprises a plurality of second functional film layer group regions corresponding to the first functional film layer group regions one to one, each second functional film layer group region comprises a second flexible substrate and a functional element layer formed on the second flexible substrate, and at least the region of the second flexible substrate corresponding to the pad region is removed after patterning; the end part of the second flexible substrate formed after patterning treatment comprises a slope surface, and an included angle between the slope surface and the surface of the second flexible substrate, which is far away from the functional element layer, is an acute angle;
bonding the first mother board and the second mother board through a bonding layer to form a flexible display panel mother board comprising a plurality of flexible display panels, wherein the orthographic projection of each second functional film layer group region on the first flexible substrate at least exposes the pad region, the bonding layer comprises a first bonding part at least formed between the display region and the pad region of the flexible display panel and a second bonding part formed on one side of the first bonding part far away from the pad region, the manufacturing materials of the first bonding part and the second bonding part are in a fluid state, and the flowability of the manufacturing material of the second bonding part is higher than that of the manufacturing material of the first bonding part;
peeling the first glass substrate and the second glass substrate by adopting a large double-sided peeling technology;
and cutting the flexible display panel mother board to form a plurality of separated flexible display panels.
2. The manufacturing method according to claim 1, wherein when the first mother board and the second mother board are bonded by a bonding layer, the first bonding portion is formed between the two flexible display panels and between a display region and a pad region of the flexible display panel.
3. The method for manufacturing a flexible display panel mother board according to claim 1, wherein the cutting of the flexible display panel mother board includes:
and cutting and removing the bonding layer between the two flexible display panels.
4. The method according to claim 1, wherein the step of forming the first adhesive portion includes:
and coating and curing the first mother board for at least two times to form at least two sub-bonding layers, wherein the at least two bonding layers are stacked in the thickness direction of the first flexible substrate.
5. The flexible display panel is characterized by comprising a display area and a non-display area, wherein the non-display area comprises a pad area, and the pad area comprises a conductive pad;
the flexible display panel has:
the first functional film layer group comprises a first flexible substrate, a driving circuit layer, a light-emitting device layer and a thin film packaging layer, wherein the driving circuit layer is positioned on the first flexible substrate, the light-emitting device layer is positioned on one side, away from the first flexible substrate, of the driving circuit layer, the thin film packaging layer is positioned on one side, away from the driving circuit layer, of the light-emitting device layer, and the conductive bonding pads are positioned on the first flexible substrate;
the second functional film layer group comprises a second flexible substrate and a functional element layer positioned on one side, close to the first flexible substrate, of the second flexible substrate, and the conductive pad is at least exposed out of the orthographic projection of the second flexible substrate on the first flexible substrate; the second flexible substrate comprises a first end and a second end which are opposite along a first direction, and the second end is positioned on one side of the first end close to the pad area; at a second end of the second flexible substrate, the second flexible substrate comprises a slope surface, and an included angle between the slope surface and the surface of the second flexible substrate, which is far away from the functional element layer, is an acute angle; the first direction is a direction in which the pad region points to the display region;
the display panel comprises a display area, a pad area, a first bonding portion and a second bonding portion, wherein the first bonding portion is located between the display area and the pad area, the second bonding portion is located on one side, far away from the pad area, of the first bonding portion, and when the first bonding portion and the second bonding portion are in a fluid state, the fluidity of the second bonding portion is higher than that of the first bonding portion.
6. The flexible display panel according to claim 5, wherein the first adhesive portion is a black sealant.
7. The flexible display panel according to claim 5, wherein the first adhesive portion is located in the non-display region and surrounds the display region, and the second adhesive portion is located in a region surrounded by the first adhesive portion.
8. The flexible display panel according to claim 5, wherein the first adhesive portion comprises at least two sub-adhesive layers stacked in a thickness direction of the first flexible substrate.
9. The flexible display panel according to claim 8, wherein a side of the at least two sub-adhesive layers contacting the second adhesive portion is stepped in a direction in which the first flexible substrate is directed to the second flexible substrate.
10. The flexible display panel according to claim 8, wherein a side of the sub-adhesive layer in contact with the second adhesive portion is gradually increased in distance from the display area in a direction in which the first flexible substrate is directed to the second flexible substrate.
11. The flexible display panel according to claim 5, further comprising a dam structure located in the non-display region and surrounding the display region, wherein the first adhesive portion is located on a side of the dam structure away from the display region.
12. The flexible display panel of claim 5, wherein the portion of the adhesive layer located in the display area has a thickness of less than 10 μm.
13. The flexible display panel of claim 5, wherein an orthographic projection of the second end of the second flexible substrate on the first flexible substrate is within an orthographic projection of the first bonding portion on the first flexible substrate.
14. The flexible display panel of claim 5, wherein the functional element layer comprises a color filter layer and a touch sensing layer.
15. A display device comprising the flexible display panel according to any one of claims 5 to 14.
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635530A (en) * | 2020-12-21 | 2021-04-09 | 武汉天马微电子有限公司 | Display panel and display device |
| CN113644222A (en) * | 2021-08-13 | 2021-11-12 | 武汉天马微电子有限公司 | Display panel and display device |
| CN114927071A (en) * | 2022-05-31 | 2022-08-19 | 武汉天马微电子有限公司 | Display module and display device |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681737A (en) * | 2012-08-31 | 2014-03-26 | 乐金显示有限公司 | Organic light emitting display and method for manufacturing the same |
| CN103811529A (en) * | 2012-11-06 | 2014-05-21 | 三星显示有限公司 | Display panel, chip on film and display device including the same |
| US20170250357A1 (en) * | 2016-02-26 | 2017-08-31 | Japan Display Inc. | Display device and manufacturing method of display device |
| CN108232043A (en) * | 2018-01-31 | 2018-06-29 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
| CN110058445A (en) * | 2019-05-28 | 2019-07-26 | 深圳市华星光电半导体显示技术有限公司 | Motherboard of liquid crystal display structure and its cutting method |
| US20190252643A1 (en) * | 2013-02-12 | 2019-08-15 | Japan Display Inc. | Oled with a flattening layer between two barrier layers |
| CN110308579A (en) * | 2018-03-22 | 2019-10-08 | 上海和辉光电有限公司 | A kind of rigidity display panel and preparation method thereof |
-
2019
- 2019-11-22 CN CN201911158948.9A patent/CN110880526B/en active Active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103681737A (en) * | 2012-08-31 | 2014-03-26 | 乐金显示有限公司 | Organic light emitting display and method for manufacturing the same |
| CN103811529A (en) * | 2012-11-06 | 2014-05-21 | 三星显示有限公司 | Display panel, chip on film and display device including the same |
| US20190252643A1 (en) * | 2013-02-12 | 2019-08-15 | Japan Display Inc. | Oled with a flattening layer between two barrier layers |
| US20170250357A1 (en) * | 2016-02-26 | 2017-08-31 | Japan Display Inc. | Display device and manufacturing method of display device |
| CN108232043A (en) * | 2018-01-31 | 2018-06-29 | 京东方科技集团股份有限公司 | Display panel and its manufacturing method, display device |
| CN110308579A (en) * | 2018-03-22 | 2019-10-08 | 上海和辉光电有限公司 | A kind of rigidity display panel and preparation method thereof |
| CN110058445A (en) * | 2019-05-28 | 2019-07-26 | 深圳市华星光电半导体显示技术有限公司 | Motherboard of liquid crystal display structure and its cutting method |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112635530A (en) * | 2020-12-21 | 2021-04-09 | 武汉天马微电子有限公司 | Display panel and display device |
| CN113644222A (en) * | 2021-08-13 | 2021-11-12 | 武汉天马微电子有限公司 | Display panel and display device |
| CN113644222B (en) * | 2021-08-13 | 2024-02-27 | 武汉天马微电子有限公司 | Display panel and display device |
| CN114927071A (en) * | 2022-05-31 | 2022-08-19 | 武汉天马微电子有限公司 | Display module and display device |
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|---|---|
| CN110880526B (en) | 2022-06-03 |
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