CN110875753A - Data communication device for warm-keeping table and warm-keeping table - Google Patents
Data communication device for warm-keeping table and warm-keeping table Download PDFInfo
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- CN110875753A CN110875753A CN201811009343.9A CN201811009343A CN110875753A CN 110875753 A CN110875753 A CN 110875753A CN 201811009343 A CN201811009343 A CN 201811009343A CN 110875753 A CN110875753 A CN 110875753A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/385—Transceivers carried on the body, e.g. in helmets
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
- A61B5/0205—Simultaneously evaluating both cardiovascular conditions and different types of body conditions, e.g. heart and respiratory condition
- A61B5/02055—Simultaneously evaluating both cardiovascular condition and temperature
-
- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61G—TRANSPORT, PERSONAL CONVEYANCES, OR ACCOMMODATION SPECIALLY ADAPTED FOR PATIENTS OR DISABLED PERSONS; OPERATING TABLES OR CHAIRS; CHAIRS FOR DENTISTRY; FUNERAL DEVICES
- A61G11/00—Baby-incubators; Couveuses
-
- G—PHYSICS
- G08—SIGNALLING
- G08B—SIGNALLING OR CALLING SYSTEMS; ORDER TELEGRAPHS; ALARM SYSTEMS
- G08B21/00—Alarms responsive to a single specified undesired or abnormal condition and not otherwise provided for
- G08B21/02—Alarms for ensuring the safety of persons
- G08B21/0202—Child monitoring systems using a transmitter-receiver system carried by the parent and the child
- G08B21/0205—Specific application combined with child monitoring using a transmitter-receiver system
- G08B21/0211—Combination with medical sensor, e.g. for measuring heart rate, temperature
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B2503/00—Evaluating a particular growth phase or type of persons or animals
- A61B2503/04—Babies, e.g. for SIDS detection
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B5/00—Measuring for diagnostic purposes; Identification of persons
- A61B5/02—Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
- A61B5/024—Detecting, measuring or recording pulse rate or heart rate
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Abstract
The invention provides a data communication device for a warm-keeping table and the warm-keeping table, wherein the data communication device comprises a communication device body, and the communication device body is provided with a microcontroller, an energy supply module, a storage module and a transmission module; a sensor probe assembly comprising a wearing portion and a detection portion; two ends of the wearing part are detachably connected together through a connecting piece; the detection part is provided with a physical sign sensor probe electrically connected with the microcontroller; the data communication device also comprises a mechanical transducer, wherein the mechanical transducer induces the vibration of the warm-keeping table and converts mechanical energy into electric energy; the mechanical energy converter is electrically connected with energy storage equipment, the energy storage equipment and the energy supply module are electrically connected together. The physical sign sensor probe is arranged on the skin of the neonate through the wearing part, the physical sign sensor probe detects physical sign data and sends the physical sign data to the microcontroller, and the microcontroller stores the physical sign data and transmits the physical sign data to the terminal equipment through the transmission module.
Description
Technical Field
The invention relates to the field of communication equipment and medical equipment, in particular to a data communication device for a warm-keeping table and the warm-keeping table.
Background
The infant radiation warm-keeping table is a special care warm-keeping apparatus for newborns, premature infants, sick-dangerous infants and wakened infants, provides a suitable environment for premature infants and sick infants, and is used for infusion, rescue, hospitalization observation and the like of the newborns. However, the traditional warm-keeping table realizes the temperature control of light irradiation by detecting the skin temperature, has a single function, cannot comprehensively master the physical sign data of the neonate, and cannot store and send the data to the mobile terminal so as to conveniently observe the neonate. Meanwhile, the warm-keeping table cannot collect the energy of vibration, and cannot realize the recovery and utilization of the energy.
Disclosure of Invention
In view of this, the present invention is directed to a data communication device for a warm-keeping table and a warm-keeping table, which can monitor physical sign data of a newborn so as to solve the problem that the warm-keeping table cannot collect and send the physical sign data to a mobile terminal.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a data communication device for a warm table, comprising:
the communication device comprises a communication device body, wherein the communication device body is provided with a microcontroller, an energy supply module electrically connected with the microcontroller, a storage module electrically connected with the microcontroller and a transmission module electrically connected with the microcontroller;
the sensor probe assembly comprises a wearing part and a detection part connected with the wearing part; two ends of the wearing part are detachably connected together through a connecting piece; the detection part is provided with a physical sign sensor probe electrically connected with the microcontroller;
the physical sign sensor probe detects physical sign data of an infant in the warm-keeping table and transmits the physical sign data to the microcontroller, the microcontroller stores the physical sign data in a storage module, and/or the microcontroller transmits the physical sign data to terminal equipment through the transmission module;
the data communication device also comprises a mechanical transducer, wherein the mechanical transducer induces the vibration of the warm-keeping table and converts mechanical energy into electric energy; the mechanical energy converter is electrically connected with energy storage equipment, the energy storage equipment and the energy supply module are electrically connected together.
Further, the communication device body comprises a first shell and a second shell, and the first shell and the second shell are detachably connected together; a placing cavity is arranged in the first shell, and the microcontroller, the energy supply module, the storage module and the transmission module are placed in the placing cavity.
Furthermore, a clamping groove is formed in the side wall of the placing cavity, and a clamping block matched with the clamping groove is arranged on the second shell; the fixture block is positioned in the clamping groove, and the second shell closes the placing cavity; the clamping groove is provided with a first threaded hole which penetrates through the clamping groove, and the clamping block is provided with a second threaded hole which penetrates through the clamping groove; the clamping block is located in the clamping groove, and the first threaded hole and the second threaded hole are overlapped and connected together through a screw.
Furthermore, a circuit board is arranged in the placing cavity, and the microcontroller, the storage module and the transmission module are arranged on the circuit board; the placing cavity is internally provided with an upright post with a shaft hole, and the circuit board is provided with a through hole matched with the shaft hole; the circuit board is placed on the stand column, and the shaft hole is overlapped with the through hole.
Furthermore, the data communication device also comprises an alarm device which is electrically connected with the microcontroller; the micro controller detects abnormal sign data, prompts the alarm device to alarm, and sends alarm information to the terminal equipment.
Further, the physical sign sensor probe comprises a skin temperature sensor probe, a pulse sensor probe and a heart rate sensor probe; the skin temperature sensor probe, the pulse sensor probe and the heart rate sensor probe are electrically connected with the micro controller through data transmission lines.
Furthermore, one end of the mechanical transducer is arranged on the second shell, and the other end of the mechanical transducer is arranged in a suspended mode.
Further, the mechanical transducer includes:
the front surface of the substrate is provided with a first open slot, and the back surface of the substrate is provided with a second open slot;
a first bonding layer on the first trench;
a first metal layer on the first bonding layer; the first metal layer forms an interdigital electrode which is provided with a lead connected with an external energy storage device;
the piezoelectric layer is positioned on the first metal layer, and one surface of the piezoelectric layer is flush with the first open slot;
the second slot comprises a second protruding end, and the second protruding end is a mass block; the substrate, the first bonding layer, the first metal layer and the piezoelectric layer except the mass constitute a cantilever beam.
Further, the mechanical transducer is prepared according to the following process:
forming protective layers with windows on the front surface and the back surface of the substrate; forming grooves on the front and back surfaces of the substrate, respectively, according to the positions of the windows; bonding a first metal layer in the groove on the front side of the substrate; bonding the piezoelectric layer on the first metal layer, forming interdigital electrodes on the second metal layer, and welding lead wires on the interdigital electrodes; thinning the piezoelectric layer until the piezoelectric layer is flush with the groove on the front surface of the substrate; scribing is carried out, and the cantilever beam arm and the mass block are released.
Compared with the prior art, the invention has the following advantages:
(1) the physical sign sensor probe is arranged on the skin of the neonate through the wearing part, the physical sign sensor probe detects physical sign data and sends the physical sign data to the microcontroller, and the microcontroller stores the physical sign data and transmits the physical sign data to the terminal equipment through the transmission module.
(2) The invention is provided with the mechanical transducer which can detect the vibration of the warm-keeping table, thereby collecting the energy of the vibration.
The invention also aims to provide a warm-keeping table to solve the problem that the warm-keeping table cannot collect physical sign data and send the physical sign data to a mobile terminal.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a warm-keeping table comprises a warm-keeping table body provided with casters, and the data communication device is arranged on the warm-keeping table body.
Compared with the prior art, the warm-keeping table and the data communication device have the same advantages, and are not described again.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention.
FIG. 1 is a schematic structural diagram of an embodiment of the present invention;
FIG. 2 is an exploded view of the body of the communication device;
FIG. 3 is a schematic side view of the first housing;
FIG. 4 is a schematic structural view of the other side of the first housing;
FIG. 5 is a schematic view of a second housing structure;
FIG. 6 is a schematic structural diagram of one embodiment of a mechanical transducer of the present invention;
FIG. 7 is a schematic view of a first slot and a second slot configuration;
FIG. 8 is a schematic view of substrate fabrication;
FIG. 9 is a schematic view of the ironing process;
FIG. 10 is a schematic view of the position of the protective gel;
FIG. 11 is a schematic view of a scratch;
FIG. 12 is a schematic view of an interdigitated electrode;
FIG. 13 is a schematic view of a warming table;
description of reference numerals:
1-a warm-keeping table body, 2-a mechanical transducer, 3-a communication device body, 4-a data transmission line and 5-a sensor probe component;
11-placing table, 21-substrate, 22-first metal layer, 23-second bonding layer, 24-piezoelectric layer, 25-third metal layer, 26-second metal layer, 27-interdigital electrode, 28-protective adhesive and 29-antenna equipment; 31-a second shell, 32-a circuit board, 33-a first shell, 34-a wire through hole, 41-a detection part, 42-a wearing part and 43-a sign sensor probe.
111-cavity, 211-protective layer, 212-first bonding layer, 213-groove, 214-first slot, 215-second slot, 241-seed layer, 221-scratch; 311-fixture block, 312-second heat dissipation hole, 321-through hole, 331-clamping groove and 332-placing cavity;
2111-window, 2141-first horizontal end, 2142-first protruding end, 2151-second horizontal end, 2152-second protruding end, 3111-second threaded hole, 3311-first threaded hole, 3321-first heat dissipation hole, 3322-column, 3323-isolation groove.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. In addition, the terms "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which refer to the orientation or positional relationship indicated in the embodiments of the present invention, are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
Example 1
As shown in fig. 1 to 5, a data communication device for a warm-keeping table comprises a communication device body 3, a sensor probe assembly 5 and a mechanical transducer 2.
The communication device body 3 is provided with a microcontroller, an energy supply module electrically connected with the microcontroller, a storage module electrically connected with the microcontroller and a transmission module electrically connected with the microcontroller, specifically, the communication device body 3 comprises a first shell 33 and a second shell 31, and the first shell 33 and the second shell 31 are detachably connected together, so that the assembly and maintenance of the communication device body 3 are facilitated; be provided with in the first casing 33 and place chamber 332, place microcontroller, energy supply module, storage module and transmission module in placing chamber 332, from this, the four puts easy to detach formula maintenance through placing chamber 332 dress, places chamber 332 moreover and can play the effect of protection microcontroller, energy supply module, storage module and transmission module.
In this embodiment, the first housing 33 and the second housing 31 are detachably connected together in the following manner: a clamping groove 331 is formed in the side wall of the placing cavity 332, and a clamping block 311 matched with the clamping groove 331 is formed in the second shell 31; when the latch 311 is located in the latch slot 331, the second housing 31 closes the placing cavity 332, so as to achieve the closing function; in order to promote the fastening connection between the two, the slot 331 is provided with a first threaded hole 3311, and the latch 311 is provided with a second threaded hole 3111; when the latch 311 is located in the latch slot 331, the first threaded hole 3311 and the second threaded hole 3111 are overlapped and coupled together by a screw.
In this embodiment, the transmission module may adopt one of a wifi mode, a bluetooth mode or a mobile communication mode, so that the transmission module can wirelessly transmit with the terminal device, and data transmission is not affected by the position; in another embodiment of the transmission module, the transmission module is connected with the terminal device by wire, that is, a tangible medium such as a metal wire and an optical fiber is used for transmitting information, so that the transmission module can perform wire transmission with the terminal device, and data transmission is more stable; the wired transmission and the wireless transmission of the transmission module can be used alternatively or together according to actual requirements.
The storage module is a memory and is used for memorizing the physical sign data detected by the physical sign sensor probe; the energy supply module is a rechargeable storage battery, and can be charged through a USB data interface of the energy supply module under the condition that the electric energy of the storage battery is insufficient, so that electric energy is mainly provided for normal operation of the whole device.
The sensor probe unit 5 includes a wearing portion 42 and a detection portion 41 connected to the wearing portion 42; two ends of the wearing part 42 are detachably connected together through a connecting piece, specifically, two ends of the wearing part 42 are respectively provided with a thread gluing, the two thread gluing can be mutually adhered together, and the wearing part 42 can be sleeved on the arms or legs of the neonate through the thread gluing at the two ends; the detection part 41 is provided with a physical sign sensor probe 43 electrically connected with the microcontroller; in particular, the vital signs sensor probe 43 is used to detect the body temperature, pulse and heart rate of the neonate and transmit these vital signs data to the microcontroller.
In this embodiment, sign sensor probe 43 transmits sign data to microcontroller after, the microcontroller with sign data storage to storage module, and/or the microcontroller passes through transmission module with sign data and transmits terminal equipment, and terminal equipment can be the nurse station of hospital, also can be the cell-phone of the head of a family.
In this embodiment, the physical sign sensor probe 43 includes a skin temperature sensor probe, a pulse sensor probe, and a heart rate sensor probe; the three are electrically connected with the micro-controller through a data transmission line 4, so that the skin temperature sensor probe realizes the detection of body temperature, the pulse sensor probe realizes the detection of pulse, and the heart rate sensor probe realizes the detection of heart rate; meanwhile, the first housing 33 is provided with a line passing hole 34 for the data transmission line 4 to pass through, so that the data transmission line 4 passes through the line passing hole 34, and the probe 43 of the physical sign sensor and the microcontroller are electrically connected conveniently.
The mechanical energy converter 2 induces the vibration of the warm-keeping table and converts mechanical energy into electric energy; the mechanical energy converter 2 is electrically connected with energy storage equipment, and the energy storage equipment is electrically connected with the energy supply module; from this, at the cold-proof platform of transport, adjust cold-proof platform mechanism, treatment neonate and the in-process that the neonate rocked, cold-proof platform can produce the vibration, and the vibration of the cold-proof platform of mechanical transducer 2 response turns into the electric energy with it, and energy storage equipment collects the electric energy of conversion and transmits the energy supply module after, assists the charging.
Example 2
In this embodiment, the data communication device further includes an alarm device, the alarm device is disposed in the placing cavity 332, the alarm device is a speaker or a buzzer, and the alarm device is electrically connected to the microcontroller; when the micro controller detects abnormal sign data, the micro controller prompts the alarm device to give an alarm, medical staff or parents are reminded auditorially through sound, meanwhile, the micro controller sends alarm information to the terminal equipment, and the terminal equipment is a mobile phone of a nurse station and the parents of the hospital and reminds the medical staff or the parents visually through characters.
The embodiment has the function of reminding from the visual aspect and the auditory aspect, and can better observe the newborn and prevent the occurrence of accidents.
Example 3
As shown in fig. 2, in the embodiment, the placing cavity 332 is provided with the circuit board 32, and the circuit board 32 is provided with the microcontroller, the storage module and the transmission module, so that the microcontroller, the storage module and the transmission module are integrated together through the circuit board 32, thereby facilitating the installation and the disassembly of circuit components; the placing cavity 332 is internally provided with a stand column 3322 with a shaft hole, and the circuit board 32 is provided with a through hole 321 matched with the shaft hole; the circuit board 32 is placed on the upright post 3322, the shaft holes are overlapped with the through holes 321, specifically, four upright posts 3322 are provided, and the four upright posts 3322 are symmetrically arranged in the placing cavity 332; the circuit board 32 is provided with four through holes 321, and when the circuit board 32 is disposed on the post 3322, the four through holes 321 are respectively overlapped with one post 3322 and connected together by a pin.
Example 4
As shown in fig. 2, in the present embodiment, the first housing 33 has a first heat dissipation hole 3321, and the second housing 31 has a second heat dissipation hole 312; the first heat dissipation hole 3321 and the second heat dissipation hole 312 form an air duct to dissipate heat from the inside of the placing cavity 332; because the circuit components in the placing cavity 332 generate heat during operation, the temperature in the placing cavity 332 is increased to be changed into hot air, the hot air is not exhausted, and the service life of the circuit components is shortened after a long time.
In this embodiment, the first housing 33 is provided with an isolation groove 3323, specifically, as shown in the direction of fig. 4, the isolation groove 3323 is disposed on the bottom end surface of the first housing 33, and the isolation groove 3323 is provided with a notch on the side wall of the first housing 33; the first heat dissipation hole 3321 is provided with an air hole in the isolation groove 3323, so that when the first housing 33 is horizontally placed, the bottom surface thereof abuts against the placement plane, and the first heat dissipation hole 3321 communicates with the outside by the isolation groove 3323, thereby not hindering the heat dissipation of the first heat dissipation hole 3321.
Example 5
As shown in fig. 1, in the present embodiment, the mechanical transducer 2 is disposed on the second housing 31, specifically, one end of the mechanical transducer 2 is fixedly connected to the first housing 33, and one end of the mechanical transducer 2, which is provided with the mass block, is disposed in a suspension manner, so that the vibration of the thermal platform can be sensed only when the end of the mechanical transducer 2, which is provided with the mass block, is in a suspension manner, thereby converting mechanical energy into electrical energy.
In another installation mode of the mechanical transducer 2, the mechanical transducer 2 is separated from the communication device body 3, the mechanical transducer 2 is arranged on a warm-keeping table, in order to better sense the vibration of the warm-keeping table, the mechanical transducer 2 is arranged on a placing table 11 of the warm-keeping table, the mechanical transducer can be internally arranged in the placing table 11 and can be externally connected to the placing table 11, and only one end of the mechanical transducer, which is provided with a mass block, is suspended and can sense external vibration.
In the present embodiment, as shown in fig. 6 and 7, the mechanical transducer 2 includes a substrate 21, a first bonding layer 212, a first metal layer 22, a second metal layer 26, a third metal layer 25, and a piezoelectric layer 24.
The substrate 21 is made of silicon, that is, a silicon substrate, the front surface of the substrate 21 is provided with a first open slot 214, the back surface of the substrate 21 is provided with a second open slot 215, wherein the cross sections of the first open slot 214 and the second open slot 215 are L-shaped, the first open slot 214 comprises a first horizontal end 2141 and a first raised end 2142, therefore, the first horizontal end 2141 is connected with the piezoelectric layer 24 to promote the first metal layer 22 to form the interdigital electrode 27, and the first raised end 2142 serves as a reference standard for the height of the piezoelectric layer 24; the second slot 215 includes a second water end 2151 and a second raised end 2152, whereby the second raised end 2152 forms a mass of the overall device for sensing environmental vibrations to vibrate up and down.
The first horizontal end 2141 is provided with a first metal layer 22, the first metal layer 22 forms an interdigital electrode 27, the interdigital electrode 27 is connected to an external energy storage device through a wire, the energy storage device is a storage battery, and thus, the output of charges is achieved, the first metal layer 22 is Au (gold), and the thickness of the Au layer is usually within the range of the Au layer thickness
But should not be lower than
Because of the fact that
The following Au layer cannot be realized; since it is difficult to directly grow Au on the silicon substrate 21.
The first bonding layer 212 is a conductive adhesive, which is located between the first horizontal end 2141 and the first metal layer 22, and has a thickness of 1um to 7um, but should not exceed 7 um; since the conductive adhesive is an epoxy conductive adhesive, and the conductive adhesive is doped with silver debris and has adhesive and conductive properties, the substrate 21 and the first metal layer 22 can be well adhered.
The thickness of the first bonding layer 212 and the thickness of the piezoelectric layer 24 have a direct relationship and are in an inverse relationship, and when the thickness of the conductive adhesive is large, the thickness of the piezoelectric layer 24 is small; when the conductive paste thickness is small, the thickness of the piezoelectric layer 24 is large.
The piezoelectric layer 24 is a PZT sheet, a second metal layer 26 is arranged on the lower surface of the PZT sheet, the second metal layer 26 is Au (gold), and the thickness of the Au layer is within the range
But do notShould be lower than
For collecting charge; the upper surface of the piezoelectric layer 24 is flush with the upper surface of the first opening 214, i.e., the piezoelectric layer 24 is flush with the second raised end 2152, thereby limiting the position of the upper surface of the piezoelectric layer 24.
Wherein, Cr (chromium) is also arranged between the second metal layer 26 and the PZT sheet as a seed layer 241 for the growth of the second metal layer 26, and the chromium has a general thickness of
But should not be lower than
The second metal layer 26 and the first metal layer 22 are connected through a second bonding layer 23, the first bonding layer 212 is a conductive adhesive, and the thickness is usually preferably 1um to 7um, but should not exceed 7 um; since the conductive adhesive is epoxy resin conductive adhesive, the conductive adhesive is doped with silver debris, and has the characteristics of adhesion and conductivity, the piezoelectric layer 24 and the substrate 21 can be well adhered.
The parts of the whole device except the mass block form a cantilever beam, when the device works, the mass block receives the vibration of the environment to drive the cantilever beam to vibrate, the PZT sheet deforms to generate charges on the upper surface and the lower surface, and finally the charges are led out through the interdigital electrode 27.
Example 6
As shown in fig. 8 to 12, the method of processing the mechanical transducer 2 in the present embodiment includes:
forming a protective layer 211 with windows 2111 on the front and back sides of the substrate 21;
specifically, first, a substrate 21 is prepared, and the material of the substrate 21 includes silicon, germanium, silicon carbide, and the like, and is preferably silicon, germanium, silicon carbide, and the like<110>Silicon, a double-side polishing (e.g., CMP) planarization process is used to reduce surface defects and roughness; followed by depositing silicon oxide (preferably a low temperature CVD process) on the front and back surfaces of the substrate 21 to form a protective layer 211, the substrate 1 protecting the layer 211 to a thickness of
Not less than
The deposition temperature is 600-900 ℃, and preferably 780 ℃.
Coating photoresist on the front side and the back side of the protective layer 211 for photoetching to form a photoresist window 2111 pattern, wherein the size of the window 2111 is 18mm in length and 1.7mm in width for example; anisotropic etching is performed on the protective layers 211 on the front and back sides by using a Reactive Ion Etching (RIE) technique, and the photoresist pattern is transferred to the protective layers 211 on the front and back sides, thereby forming windows 2111; and finally, removing the photoresist on the surface of the silicon wafer by using a method combining sulfuric acid/hydrogen peroxide wet photoresist removal and oxygen plasma dry photoresist removal.
Forming grooves 213 on the front and back surfaces of the substrate 21 in accordance with the positions of the windows 2111;
specifically, the silicon wafer obtained as described above is immersed in an etching solution, or sprayed with an etching solution so that the etching solution acts on the substrate 21 from the window 2111 on the front or back surface. The etching solution is etched by 30 percent KOH at about 70 ℃, the etching rate is 1um/min, and the etching time is 500 min; KOH can etch <110> silicon to form recess 13.
Bonding the first metal layer 22 in the groove 213 on the front surface of the substrate 21;
specifically, the first metal layer 22 is bonded on the front surface of the substrate 21 through the first bonding layer 212, in this step, the first bonding layer 212 is a conductive adhesive, and the conductive adhesive is usually applied in a spin coating manner; placing a substrate 21 on a spin coater, and uniformly preparing a conductive adhesive on a silicon wafer through high-speed rotation; after the preparation of the conductive adhesive layer is completed, the conductive adhesive layer needs to be semi-cured to ensure that the conductive adhesive has certain hardness and certain plasticity, otherwise, there is no way to continue to prepare the first metal layer 22 on the conductive adhesive.
After the first bonding layer 212 is prepared, the first metal layer 22 is evaporated on the first bonding layer 212, after the first metal layer 22 is prepared, the first metal layer 22 is scratched with a low power by a laser cutting machine 221,
bonding the piezoelectric layer 24 on the first metal layer 22, the first metal layer 22 forming interdigital electrodes 27, and bonding wires on the interdigital electrodes 27;
specifically, preparing a piezoelectric layer 24, the piezoelectric layer 24 being a PZT sheet, sputtering a Cr layer on the lower surface of the PZT sheet as a seed layer 241, and evaporating an Au layer on the seed layer 241 as a second metal layer 26; and coating conductive adhesive on the second metal layer 26 as a second bonding layer 23.
Putting the surface of the PZT sheet coated with the conductive adhesive into a groove 213 on the front surface of the substrate 21, and bonding the PZT sheet together through high temperature and high pressure, thereby the first metal layer 22 is clamped between the first bonding layer 212 and the second bonding layer 23, the bonding needs pressurization and heating, under the condition, the first metal layer 22 generates proper extension and breaks away from each other along the position of the laser scratch 221 to form the interdigital electrode 27, and a lead is welded on the interdigital electrode 27, thereby leading out the electric energy, specifically, the interdigital electrode 27 is connected with an energy storage device through the lead, the energy storage device is a storage battery, and the electric energy converted by the mechanical transducer 2 flows into the storage battery through the interdigital electrode 27.
Since the first bonding layer 212 and the second bonding layer 23 are conductive paste; after heating and pressurizing, the conductive adhesive is compressed, the thickness of the bonded conductive adhesive is usually between 700nm and 5um, and the PZT sheet and the substrate 21 are relatively tightly fixedly connected; some of the conductive paste will be squeezed into the gap between the PZT sheet and the recess 213, and if the conductive paste is too much, it will be separated from the recess 213 and squeezed above the substrate 21.
This process requires attention to: the PZT sheet should be sized to be slightly smaller than the recess 213 in the substrate 21, otherwise the piezoelectric material would not be placed, but should be tightly bonded, preferably without gaps, near the end of the bond (the end where the mass is not selected) near the end of the bond to prevent shorting.
Thinning the piezoelectric layer 24 until the piezoelectric layer 24 is flush with the recess 213 of the front surface of the substrate 21;
specifically, the PZT sheet is thinned by CMP (chemical mechanical polishing) and/or wet etching to be flush with the grooves 213 on the front surface of the substrate 21 to obtain a desired thickness.
In the process, the thickness of the PZT sheet is controlled by the thickness of the electric glue layer and the depth of the groove 213.
Scribing is carried out, and the cantilever beam arm and the mass block are released;
specifically, a scribing instrument is adopted, and 100um is reserved in a scribing channel; cutting through; so that the mass is released.
In this embodiment, the step of scribing to release the cantilever and the mass further includes a further corrosion of the back surface of the substrate 21, specifically, a third metal layer 25 is disposed on the piezoelectric layer 24, and then a protective glue 28 is applied on the third metal layer 25, so that the protective glue 28 can prevent the third metal layer 25 from being corroded by KOH; then the device is soaked in a KOH solution, and the KOH further etches the back of the substrate 21 until the required thickness of the substrate 21 is obtained, the thickness of the substrate 21 should be etched to be as much as the thickness of the conductive adhesive 28, and the structure has good conductivity; and finally, taking the device out of the KOH solution, and removing the protective glue 28 by using acetone or other organic solvents with stronger polarity, thereby further releasing the mass block and facilitating the sensing of the vibration in the environment.
Example 7
As shown in fig. 13, a warm-keeping table includes a warm-keeping table body 1 provided with casters, and the warm-keeping table body 1 includes the data communication device according to any of the above embodiments.
In this embodiment, cold-proof platform body 1 is equipped with the truckle, can remove cold-proof platform body 1 through the truckle, and cold-proof platform body 1 places platform 11 and is equipped with cavity 111.
When the mechanical transducer 2 is disposed on the second housing 31, the communication device body 3 and the mechanical transducer 2 are disposed in the cavity 111, so that the physical sign sensor probe 43 is placed on the skin of the neonate through the wearing portion 42, the physical sign sensor probe 43 detects physical sign data and sends the physical sign data to the microcontroller, and the microcontroller stores the physical sign data and transmits the physical sign data to the mobile terminal through the transmission module.
When mechanical transducer 2 and communication device body 3 separation, set up communication device body 3 in cavity 111, mechanical transducer 2 both can set up in cavity 111, also can place in addition on placing platform 11 equally, and mechanical transducer 2 can respond to the cold-proof platform of transport, adjust cold-proof platform mechanism, treat the vibrations of cold-proof platform in-process induction that neonate and neonate rocked to collect the energy of vibration, and transmit for energy storage equipment through the wire.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A data communication device for a warm-keeping table is characterized by comprising:
the communication device comprises a communication device body (3), wherein the communication device body (3) is provided with a microcontroller, an energy supply module electrically connected with the microcontroller, a storage module electrically connected with the microcontroller and a transmission module electrically connected with the microcontroller;
a sensor probe assembly (5), wherein the sensor probe assembly (5) comprises a wearing part (42) and a detection part (41) connected with the wearing part (42); two ends of the wearing part (42) are detachably connected together through a connecting piece; the detection part (41) is provided with a physical sign sensor probe (43) electrically connected with the microcontroller;
the physical sign sensor probe (43) detects physical sign data of an infant in the warm-keeping table and transmits the physical sign data to the microcontroller, the microcontroller stores the physical sign data in a storage module, and/or the microcontroller transmits the physical sign data to terminal equipment through the transmission module;
the data communication device further comprises a mechanical transducer (2), wherein the mechanical transducer (2) induces the vibration of the warm-keeping table and converts mechanical energy into electric energy; the mechanical energy converter (2) is electrically connected with energy storage equipment, and the energy storage equipment is electrically connected with the energy supply module.
2. The data communication device according to claim 1, wherein the communication device body (3) comprises a first housing (33) and a second housing (31), the first housing (33) and the second housing (31) being detachably connected together; a placing cavity (332) is arranged in the first shell (33), and the microcontroller, the energy supply module, the storage module and the transmission module are placed in the placing cavity (332).
3. The data communication device according to claim 2, wherein a slot (331) is formed on a side wall of the placing cavity (332), and the second housing (31) is provided with a latch (311) engaged with the slot (331); the clamping block (311) is positioned in the clamping groove (331), and the second shell (31) closes the placing cavity (332); the clamping groove (331) is provided with a first threaded hole (3311) which penetrates through the clamping groove, and the clamping block (311) is provided with a second threaded hole (3111) which penetrates through the clamping groove; the clamping block (311) is positioned in the clamping groove (331), and the first threaded hole (3311) and the second threaded hole (3111) are overlapped and connected together through a screw.
4. The data communication device according to claim 3, wherein a circuit board (32) is disposed in the placing cavity (332), and the microcontroller, the storage module and the transmission module are disposed on the circuit board (32); an upright post (3322) with a shaft hole is arranged in the placing cavity (332), and a through hole (321) matched with the shaft hole is arranged on the circuit board (32); the circuit board (32) is placed on the upright post (3322), and the shaft hole is overlapped with the through hole (321).
5. The data communication device according to claim 1, further comprising an alarm device electrically connected to the microcontroller; the micro controller detects abnormal sign data, prompts the alarm device to alarm, and sends alarm information to the terminal equipment.
6. The data communication device according to claim 1, wherein the vital sign sensor probe (43) comprises a skin temperature sensor probe, a pulse sensor probe, and a heart rate sensor probe; the skin temperature sensor probe, the pulse sensor probe and the heart rate sensor probe are electrically connected with the micro controller through a data transmission line (4).
7. The data communication device according to claim 1, wherein one end of the mechanical transducer (2) is disposed on the second housing (31), and the other end of the mechanical transducer (2) is suspended.
8. The data communication device according to any of claims 1 to 7, wherein the mechanical transducer (2) comprises:
the device comprises a substrate (21), wherein a first open slot (214) is formed in the front surface of the substrate (21), and a second open slot (215) is formed in the back surface of the substrate (21);
a first bonding layer (212), the first bonding layer (212) located on the first slot (214);
a first metal layer (22), the first metal layer (22) being located on the first bonding layer (212); the first metal layer (22) forms an interdigital electrode (27), and the interdigital electrode (27) is provided with a lead wire connected with the energy storage device;
a piezoelectric layer (24), said piezoelectric layer (24) being located on said first metal layer (22), one face of said piezoelectric layer (24) being flush with said first slot (214);
the second slot (215) includes a second raised end (2152), the second raised end (2152) being a mass; the substrate (21), the first bonding layer (212), the first metal layer (22), and the piezoelectric layer (24) other than the proof mass constitute a cantilever.
9. The data communication device according to claim 8, wherein the mechanical transducer (2) is a mechanical transducer prepared according to the following process:
forming a protective layer (211) with a window (2111) on the front and back sides of a substrate (21); forming grooves (213) on the front and back surfaces of the substrate (21) in accordance with the positions of the windows (2111); bonding a first metal layer (22) in a groove (213) on the front side of the substrate (21); bonding the piezoelectric layer (24) on the first metal layer (22), the second metal layer (26) forming interdigitated electrodes (27) on which wires are soldered; thinning the piezoelectric layer (24) until the piezoelectric layer (24) is flush with the groove (213) on the front surface of the substrate (21); scribing is carried out, and the cantilever beam arm and the mass block are released.
10. A warm-keeping table, comprising a warm-keeping table body (1) provided with casters, said warm-keeping table body (1) being provided with a data communication device according to claims 1-9 above.
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| CN201811009343.9A CN110875753A (en) | 2018-08-31 | 2018-08-31 | Data communication device for warm-keeping table and warm-keeping table |
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| CN201811009343.9A CN110875753A (en) | 2018-08-31 | 2018-08-31 | Data communication device for warm-keeping table and warm-keeping table |
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