CN110875414A - High-reliability LED support, LED and light-emitting device - Google Patents
High-reliability LED support, LED and light-emitting device Download PDFInfo
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- CN110875414A CN110875414A CN201811006238.XA CN201811006238A CN110875414A CN 110875414 A CN110875414 A CN 110875414A CN 201811006238 A CN201811006238 A CN 201811006238A CN 110875414 A CN110875414 A CN 110875414A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/564—Details not otherwise provided for, e.g. protection against moisture
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a high-reliability LED bracket, an LED and a light-emitting device, which comprise an anode substrate, a cathode substrate and an insulating isolation strip, wherein the insulating isolation strip is positioned between the anode substrate and the cathode substrate to isolate the anode substrate and the cathode substrate in an insulating way; in positive electrode base plate and negative pole base plate, have at least one target side in the side of at least one base plate, the surface path value of this target side is greater than the side height value of this target side, and this target side is the non-plane, be the setting of perpendicular for current base plate side, can prolong the route of base plate side, also prolong the route that moisture enters into the functional area, thereby promote the dampproofing property of LED support and the LED that utilizes this LED support to make, promote LED's reliability and durability, make LED can be better be applicable to the application scene of various environment, more do benefit to LED's popularization and use.
Description
Technical Field
The present invention relates to the field of Light Emitting Diodes (LEDs), and in particular, to a highly reliable LED support, an LED, and a Light Emitting device.
Background
Because the LED has the advantages of rich colors, small volume, environmental protection, energy conservation, long service life and the like, the LED is widely used and popularized in various fields, such as but not limited to daily illumination, outdoor illumination, light decoration, advertisement marks, automobile illumination or indication, traffic indication and the like.
Referring to fig. 1-1 to 1-2, the conventional LED support includes a plastic enclosure 10 forming a reflective cavity, a positive electrode substrate 11 enclosed by the plastic enclosure 10, a negative electrode substrate 12, and an isolation strip 13 insulating and isolating the positive electrode substrate 11 and the negative electrode substrate 12, wherein a partial area of the front surfaces of the positive electrode substrate 11 and the negative electrode substrate 12 is in direct contact with the plastic enclosure 10, which is called an enclosure contact area; the other part of the area is positioned at the bottom of the reflecting cavity and is used as a functional area which can be used for bearing an LED chip and other possible electronic devices, wiring, die bonding, a light reflecting area and the like. In the conventional LED bracket, the side surfaces of the anode substrate 11 and the cathode substrate 12 are vertical surfaces, as shown in fig. 1-2, so when moisture easily spreads to the front surface of the substrate along the joint of the side surface of the substrate and the plastic enclosure 10, the moisture easily enters the functional region through the contact region between the side surfaces of the anode substrate 11 and the cathode substrate 12 and the enclosure, which causes a short circuit in the functional region, damage to devices, and even directly causes a lamp failure; and most of the functional areas of the substrate are plated with metal silver layers, and the metal silver layers are also easily corroded under the action of moisture to cause functional defects. Therefore, the existing LED support and the LED prepared by the support have poor moisture resistance.
Disclosure of Invention
The invention provides a high-reliability LED bracket, an LED and a light-emitting device, which mainly solve the technical problems that: the problem that the existing LED support and an LED manufactured by the support are poor in moisture resistance is solved.
In order to solve the technical problem, the invention provides a high-reliability LED bracket, which comprises a positive electrode substrate, a negative electrode substrate and an insulating isolation strip, wherein the insulating isolation strip is positioned between the positive electrode substrate and the negative electrode substrate to isolate the positive electrode substrate and the negative electrode substrate in an insulating way; in the positive electrode substrate and the negative electrode substrate, at least one target side surface is arranged on at least one side surface of the substrate, the surface path value of the target side surface along the height direction is larger than the side surface height value of the target side surface, and the target side surface is a non-plane surface.
In one embodiment of the present invention, the target side is provided in each of the sides of the positive electrode substrate and the negative electrode substrate.
In one embodiment of the present invention, at least one of the sides of the positive electrode substrate and the negative electrode substrate that are in contact with the enclosure body has the target side;
and/or the presence of a gas in the gas,
and the side surfaces of the positive electrode substrate and the negative electrode substrate, which are contacted with the insulating isolation belt, are the target side surfaces.
In one embodiment of the present invention, the width of the front surface of the positive electrode substrate and the width of the back surface of the negative electrode substrate are larger than the width of the front surface of the positive electrode substrate and the back surface of the negative electrode substrate.
In one embodiment of the invention, the target side surface is a curved surface.
In one embodiment of the present invention, the target side surface is an arc-shaped curved surface.
In one embodiment of the present invention, the target side surface is a combined surface including at least two of a flat surface, a slope surface, and an arc surface.
In one embodiment of the present invention, the target side surface is a step combination surface including at least two of a flat surface, a slope surface, and an arc surface.
In one embodiment of the present invention, the step combination surface is composed of a horizontal plane and a vertical plane, and an arc-shaped surface connecting the horizontal plane and the vertical plane.
In an embodiment of the present invention, at least one end of the front surface of the insulating isolation belt is provided with an insulating protrusion.
In one embodiment of the present invention, the insulating protrusion spans across the front surface of the positive electrode substrate and/or the negative electrode substrate;
and/or the presence of a gas in the gas,
the functional areas of the anode substrate and the cathode substrate are positioned at the bottom of a reflection cavity formed by the wall body, the insulation bulge is in direct contact with the inner side surface of the reflection cavity, and the height of the insulation bulge is smaller than that of the inner side surface of the reflection cavity.
In an embodiment of the invention, two long sides of the insulating isolation strip opposite to each other in the cross-sectional profile are arc-shaped sides, or are curved sides with at least one bend, or are broken line sides with at least one bend, or are inclined sides with an included angle of 10 ° or more and less than 90 ° with the short sides of the negative electrode substrate.
In one embodiment of the invention, the two opposite long sides of the cross-sectional profile of the insulating isolation strip are parallel.
In order to solve the above problems, the present invention further provides an LED, including the above high-reliability LED support and at least one LED chip, where the LED chip is disposed on the positive substrate and/or the negative substrate, and a positive pin and a negative pin of the LED chip are electrically connected to the positive substrate and the negative substrate, respectively.
In order to solve the above problems, the present invention further provides a light emitting device, which includes the LED as described above, and the light emitting device is a lighting device, an optical signal indicating device, a light supplementing device, or a backlight device.
The invention has the beneficial effects that:
the high-reliability LED support, the LED and the light-emitting device comprise an anode substrate, a cathode substrate and an insulating isolation strip, wherein the insulating isolation strip is positioned between the anode substrate and the cathode substrate and used for insulating and isolating the anode substrate and the cathode substrate; in positive electrode base plate and negative pole base plate, have at least one target side in the side of at least one base plate, the surface path value of this target side is greater than the side height value of this target side, and this target side is the non-plane, be the setting of perpendicular for current base plate side, can prolong the route of base plate side, also prolong the route that moisture enters into the functional area, thereby promote the dampproofing property of LED support and the LED that utilizes this LED support to make, promote LED's reliability and durability, make LED can be better be applicable to the application scene of various environment, more do benefit to LED's popularization and use.
Drawings
FIG. 1-1 is a top view of an LED support;
1-2 are cross-sectional views of the LED support shown in FIG. 1-1;
FIG. 2-1 is a first cross-sectional view of an LED support according to a second embodiment of the present invention;
2-2 are sectional views of a second LED support provided in accordance with a second embodiment of the present invention;
2-3 are cross-sectional views of a third LED support provided in accordance with a second embodiment of the present invention;
2-4 are cross-sectional views of a second embodiment of the invention providing an LED support;
2-5 are cross-sectional views of a second embodiment of the invention providing an LED support;
2-6 are cross-sectional views six of an LED support provided in accordance with a second embodiment of the present invention;
fig. 3-1 is a first cross-sectional view of an LED mount according to a third embodiment of the present invention;
3-2 are cross-sectional views of a second LED support provided in accordance with a third embodiment of the present invention;
3-3 are cross-sectional views of a third LED support provided in accordance with a third embodiment of the present invention;
3-4 are cross-sectional views of a third embodiment of the invention providing an LED support;
3-5 are cross-sectional views of a third embodiment of the invention providing an LED support;
3-6 are cross-sectional views six of LED supports provided in accordance with a third embodiment of the present invention;
3-7 are cross-sectional views seven of LED supports provided in accordance with a third embodiment of the present invention;
3-8 are cross-sectional views eight of LED supports according to a third embodiment of the present invention;
fig. 4-1 is a first top view of an LED holder according to a fifth embodiment of the present invention;
fig. 4-2 is a second top view of an LED mount according to a fifth embodiment of the present invention;
fig. 4-3 are top views three of LED holders according to a fifth embodiment of the present invention;
4-4 are top views four of LED supports according to fifth embodiment of the present invention;
4-5 provide a fifth top view of an LED support according to fifth embodiment of the present invention;
4-6 provide top views six of LED stands for example five of the present invention;
fig. 5-1 is a top view seven of an LED fixture according to a fifth embodiment of the present invention;
fig. 5-2 is a top view eight of an LED mount according to a fifth embodiment of the present invention;
5-3 provide a top view nine of an LED support according to a fifth embodiment of the present invention;
5-4 are top views ten of LED supports according to fifth embodiment of the present invention;
wherein, the reference numeral 10 in fig. 1-1 to fig. 1-2 is a plastic fence, 11 is a positive electrode substrate, 12 is a negative electrode substrate, and 13 is an isolation strip; in fig. 2-1 to 2-6, 20 is a surrounding wall, 21 is a substrate, 211 is a functional region, and 212 is a target side; in FIGS. 3-1 to 3-8, 30 is a wall body, 31 is a substrate, 311 is a functional region, and 312 is a target side; in fig. 4-1 to 4-6, 50 is a wall body, 51 is a positive substrate, 52 is a negative substrate, and 53 is an insulating isolation region; in fig. 5-1 to 5-4, 60 is a surrounding wall, 61 is a substrate, 61 is a positive electrode substrate, 62 is a negative electrode substrate, and 63 is an insulating isolation region.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The first embodiment is as follows:
in order to solve the problem of poor moisture resistance of the existing LED support, the embodiment provides a high-reliability LED support, which includes a positive electrode substrate, a negative electrode substrate, an insulating isolation strip, and an insulating enclosure wall enclosing the positive electrode substrate, the negative electrode substrate, and the insulating isolation strip, wherein the insulating isolation strip is located between the positive electrode substrate and the negative electrode substrate to isolate the positive electrode substrate from the negative electrode substrate; in the positive electrode substrate and the negative electrode substrate, at least one target side surface is arranged on the side surface of at least one substrate, the surface path value of the target side surface along the height direction is larger than the side surface height value of the target side surface, and the target side surface is non-planar. For the setting of current base plate side for the perpendicular, can prolong the route of base plate side, also prolong the route that the moisture entered into the functional area in to promote the dampproofing property of LED support and the LED that utilizes this LED support to make, promote LED's reliability and durability, make the application scene that is applicable to various environment that LED can be better. In one example, the functional regions on the front sides of the positive and negative substrates are located at the bottom of the reflective cavity formed around the wall.
The positive electrode substrate and the negative electrode substrate in this embodiment are both conductive substrates, and the conductive substrate in this embodiment may be substrates made of various conductive materials, for example, various metal conductive substrates, including but not limited to a copper substrate, an aluminum substrate, an iron substrate, and a silver substrate; the conductive substrate may also be a hybrid material conductive substrate containing a conductive material, such as a conductive rubber or the like.
Optionally, in this embodiment, a reflective layer may be further disposed in the functional region on at least one front surface of the positive electrode substrate and the negative electrode substrate to improve the light extraction efficiency of the bracket, and the reflective layer may be various light reflective layers capable of improving the light extraction efficiency, for example, including but not limited to a silver plating layer.
Optionally, in this embodiment, the back surface of at least one of the positive electrode substrate and the negative electrode substrate is exposed to the bottom of the enclosure body as the electrode pad. Of course, in some examples, the back surface of at least one of the positive electrode substrate and the negative electrode substrate may not be used as the welding area, and the side surface thereof may be used as the welding area, and the specific arrangement may be flexibly determined according to the specific application requirements.
Optionally, the enclosure body in this embodiment may be made of various insulating materials, for example, but not limited to, various plastics, insulating ceramics, and the like. For example, in one example, the enclosure body may be made of Epoxy resin (EP), high temperature resistant nylon (PPA plastic), Polyphthalamide (PPA), 1, 4-cyclohexanedimethanol terephthalate (PCT, Poly1, 4-cyclohexylene dimethylene terephthalate), Liquid Crystal Polymer (LCP), Liquid Crystal Polymer (Liquid Crystal Polymer), Sheet Molding Compound (SMC), Epoxy Molding Compound (EMC), Unsaturated Polyester (UP) resin, polyester resin (PET), Polycarbonate (PC, Polycarbonate), polyhexamethylene adipamide (nylon 66), and glass fiber.
Optionally, the material of the insulating isolation strip in this embodiment may be the same as or different from the wall body, and it may be formed together with the wall body or formed separately.
In addition, it should be understood that the forming manner of the enclosure body in the embodiment may also be flexibly selected, for example, but not limited to, forming by injection molding.
In order to better improve the air tightness of the LED support and to improve the moisture resistance thereof, in some examples, the side surfaces of the positive electrode substrate and the negative electrode substrate may be provided with the target side surface, for example:
example one: arranging at least one target side surface in the side surfaces of the positive electrode substrate and the negative electrode substrate, which are in contact with the wall body;
for example, when the positive electrode substrate and the negative electrode substrate have three sides which need to be in contact with the enclosure body, and two sides in the width direction are opposite sides, the three sides may be both the target sides, or only two opposite sides of the three sides may be the target sides, or only one of the three sides may be the target side; which sides are set as the target sides can be selected according to requirements.
Example two:
the side surfaces of the positive electrode substrate and the negative electrode substrate, which are in contact with the insulating isolation belt, are set as the target side surfaces.
Example three:
the side face of the positive electrode substrate and the side face of the negative electrode substrate, which are contacted with the wall body, are provided with at least one target side face, and the side face of the positive electrode substrate and the side face of the negative electrode substrate, which are contacted with the insulating isolation belt, are provided with the target side faces.
In this embodiment, the target side surface may be an arbitrary surface that has a surface path value along the height direction greater than a side height value of the target side surface and is not planar; for example, the curved surface may be a regular arc-shaped curved surface or an irregular curved surface when the curved surface is a curved surface. For another example, in some examples, the target side surface may also be a combined surface including, but not limited to, a combined surface combining at least two of a flat surface, a sloped surface, and an arcuate surface. And when the combined surface is a combined surface, the combined surface can also be a step combined surface combined by at least two of planes, inclined planes and arc-shaped surfaces so as to further prolong the path of the side surface and improve the moisture-proof performance. For example, in one example, the stepped composition surface is composed of a horizontal plane and a vertical plane, and an arc-shaped surface connecting the horizontal plane and the vertical plane; or consists of a plurality of inclined planes, or consists of a transverse plane, or a vertical plane and an inclined plane, or consists of a vertical plane, an inclined plane and an arc surface, or consists of a transverse plane, an inclined plane and an arc surface; the specific combination composition mode can be flexibly set.
In an example of the embodiment, the width of the front surface of the positive electrode substrate and the width of the back surface of the negative electrode substrate can be set to be larger than that of the back surface of the positive electrode substrate and the back surface of the negative electrode substrate, so that external moisture can be better prevented from entering the functional region through the side surface of the substrate, and the manufacturing and processing of the substrate and the LED support can be better facilitated.
In this embodiment, the target side surface may be formed by, but not limited to, stamping, etching, cutting, and the like.
This embodiment is through setting up in anodal base plate and the negative pole base plate, the surface path value of at least one side of at least one base plate is greater than the side height value of this side, and this side is the non-plane, be the setting of perpendicular for current base plate side, can prolong the route of base plate side, also prolong the route that the moisture enters into in the functional area, thereby promote the LED support and utilize the moisture resistance of the LED that this LED support made, promote LED's reliability and durability, make LED can be better be applicable to the application scene of various environment, more do benefit to LED's popularization and use.
Example two:
for ease of understanding, the present embodiment is exemplified in several cases where the target side surface on the substrate is set to a curved surface.
Referring to fig. 2-1, wherein 20 is a surrounding wall, 21 is a substrate (which may be a positive substrate and/or a negative substrate), 211 is a functional region, and 212 is a target side of the substrate, and two opposite sides of the substrate are set as the target sides in the figure. In fig. 2-1, the target side surface 212 is a curved surface, the front width and the back width of the substrate are substantially consistent, the surface path value of the target side surface 212 in the height direction in fig. 2-1 is the length value of the line indicated by the target side surface 212 in the figure, the surface path value is arranged in a vertical plane relative to the substrate side surface, and the path is obviously lengthened, so that the path of moisture entering the functional region can be lengthened, the moisture resistance of the bracket is further improved, and the reliability of the LED lamp bead or other products manufactured by using the bracket is improved. Of course, in some examples, the target side surface may also be an inclined surface, and the side surface of the target may be a vertical surface, which may also extend the path of the moisture entering the functional region to some extent, but the path of the target side surface is shorter than that of the substrate side surface, and the curved surface or the combined surface is also more favorable for the substrate side surface to be combined with the enclosure body 20 or the insulating isolation strip, so as to increase the combining area of the two, and improve the air tightness and the overall strength of the bracket.
In some examples, the front width and the back width of the substrate may not be the same, for example, as shown in fig. 2-2, wherein the target side 212 is still configured as a curved surface, but the curved surfaces on both sides extend outward in a shape of "eight" overall, such that the front width of the substrate is smaller than the back width; this arrangement can further lengthen the path for moisture to enter the functional area; of course, the target side 212 shown in FIGS. 2-2 may also extend oppositely inward; in addition, when the target side surface in this embodiment is a curved surface, the curved surface may be set to any irregular curved surface theoretically, or may be set to a regular curved surface.
For example, referring to FIGS. 2-3, the target side 212 is formed by a combination of a plurality of small continuous curved surfaces, which are arranged in a manner that provides a more secure bond between the target side and the enclosure body 20 or the isolation band, thereby improving the strength and air tightness of the bracket. Referring to fig. 2-4, the target side 212 may extend relatively inward such that the substrate front width is greater than the back width, which may facilitate processing of the substrate and LED support.
For another example, the target side surface in the present embodiment may also be configured as an arc-shaped curved surface, and an example target side surface 212 is an arc-shaped curved surface shown in fig. 2 to 5, the arc-shaped curved surface exceeds a concave arc-shaped curved surface formed by the substrate being concave, and the specific radian of the arc-shaped curved surface can be flexibly set according to requirements. The arc-shaped curved surfaces shown in fig. 2-5 can prolong the path of moisture entering the functional area, improve the combination stability of the side surface of the substrate and the surrounding wall body or the insulating isolation belt, enable the front width of the substrate to be larger than the back width, and facilitate the processing of the substrate and the LED bracket.
When the target side surface in this embodiment is an arc-shaped curved surface, it may be a convex arc-shaped curved surface in addition to a concave arc-shaped curved surface. 2-6, the target side surface 212 is a convex arc-shaped curved surface protruding outward from the substrate, which can not only prolong the path of moisture entering the functional region, but also increase the bonding area between the substrate side surface and the surrounding wall or the insulating isolation belt, and increase the strength of the bracket; meanwhile, the width of the front surface of the substrate is smaller than that of the back surface of the substrate, so that the heat dissipation of the LED support is facilitated.
The present embodiment only illustrates some schematic diagrams in which the target side surface is set as a curved surface, and it should be understood that when at least two side surfaces exist on the substrate as the target side surface, each target side surface may be set as the same surface or may be set as a different surface; and when the target side surfaces are present on both the positive electrode substrate and the negative electrode substrate, the target side surfaces on the positive electrode substrate and the negative electrode substrate may be provided as the same surface or as different surfaces. For example, to allow for machining uniformity, the target sides may all be set to be the same.
Example three:
for convenience of understanding, the present embodiment is described by taking the target side as an example of a combined surface, and as can be understood from the above analysis, the combined surface includes, but is not limited to, a combined surface obtained by combining at least two of a plane, a slope, and an arc. And when the combined surface is a combined surface, the combined surface can also be a step combined surface combined by at least two of planes, inclined planes and arc-shaped surfaces so as to further prolong the path of the side surface and improve the moisture-proof performance. For example, in one example, the stepped composition surface is composed of a horizontal plane and a vertical plane, and an arc-shaped surface connecting the horizontal plane and the vertical plane; or consists of a plurality of inclined planes, or consists of a transverse plane, or a vertical plane and an inclined plane, or consists of a vertical plane, an inclined plane and an arc surface, or consists of a transverse plane, an inclined plane and an arc surface; the specific combination composition mode can be flexibly set. Several specific structures in which the target side surface is a combined surface will be described as an example.
For example, in an example, see fig. 3-1, where 30 is a surrounding body, 31 is a substrate (which may be a positive substrate and/or a negative substrate), 311 is a functional region, and 312 is a target side. In fig. 3-1, the target side surface 312 is a combined surface formed by combining two inclined surfaces and a plane connecting the two inclined surfaces, and in fig. 3-1, the included angle at the joint between the surfaces is greater than 90 °, and the arrangement manner is smaller than or equal to 90 ° relative to the included angle, so that bubbles can be prevented from being formed at the joint of the included angles in the injection molding process and the like, and the generation of bubbles can be further prevented while the moisture entering path is prolonged, thereby further improving the moisture resistance of the bracket.
For another example, referring to fig. 3-2, the target side 312 is composed of two vertical planes, a horizontal plane between the two vertical planes, and arc-shaped planes connecting the two vertical planes and the horizontal plane, so that the junction between the vertical planes and the horizontal plane is an arc-shaped curved surface, which can also prevent bubbles from forming at the junction during injection molding, and can further prevent bubbles from generating while prolonging the moisture entry path, and improve the moisture resistance of the bracket.
For another example, referring to fig. 3-3, the target side 312 is composed of two inclined planes, a transverse plane between the two inclined planes, and arc-shaped planes connecting the two inclined planes to the transverse plane, so that the junction between the inclined planes and the transverse plane is an arc-shaped curved surface, which can further prevent air bubbles from forming at the junction during injection molding.
For another example, referring to fig. 3-4, the target side 312 is composed of an inclined plane, a vertical plane, a horizontal plane between the inclined plane and the vertical plane, and an arc-shaped plane connecting the two inclined planes and the vertical plane with the horizontal plane, so that the junction between the inclined plane and the horizontal plane and the junction between the vertical plane and the horizontal plane are arc-shaped curved surfaces, which can further prevent air bubbles from forming at the junction during injection molding.
For another example, referring to fig. 3-5, the target side 312 is a step combination surface with multiple steps, which is composed of a vertical plane, a horizontal plane and an arc-shaped plane, and can further extend the moisture entry path, increase the bonding area with the enclosure body or the insulating isolation strip, and improve the air tightness and the overall strength of the LED support.
For another example, in one example, referring to fig. 3-6, the target side 312 is a combination of inclined surfaces, and the angle between the two inclined surfaces is greater than 90 °; referring to fig. 3-7, the target side 312 is a composite surface that is a combination of two inclined surfaces and an arcuate surface connecting the two inclined surfaces. According to the above examples, when the target side surface is the combined surface in this embodiment, the specific combination manner may be flexible and changeable, and may also be flexibly selected according to specific requirements, and the width of the front surface of the substrate may be larger than the width of the back surface of the substrate as a whole when the substrate is set; of course, the whole width of the front surface of the substrate can be flexibly set to be less than or equal to the width of the back surface of the substrate according to requirements.
As described above, in this embodiment, when at least two sides of the substrate are the target sides, the target sides may be the same or different; for example, as shown in fig. 3-8, different combined surfaces are provided on the two opposing target sides 312 of the substrate. Of course, one may be provided as a combined surface, one may be provided as a curved surface, or both may be provided as different curved surfaces.
In this embodiment, in order to further extend the moisture entry path, optionally, the functional region 311 on the front surface of the substrate may be set as an upwardly convex stepped surface or a downwardly concave stepped surface as required, so that the air tightness of the bracket may be further improved, and the moisture-proof performance may be further improved.
Example four:
referring to fig. 1-1 to 1-2, in a conventional LED support, an insulating isolation strip between a positive substrate and a negative substrate is perpendicular to a long side of the support and is parallel to the positive substrate and the negative substrate; and the insulating isolation belt is made of fragile insulating plastic materials, and the width of the insulating isolation belt is narrow, so that the amount of the plastic of the insulating isolation belt is small, the insulating isolation belt is easy to break, and the overall strength and reliability of the LED support and an LED manufactured by the support are reduced.
To above-mentioned problem, this embodiment is serving at least with the positive at least one of the median of two insulation isolation being equipped with insulating protruding being located between positive electrode base plate and the negative electrode base plate to increase the material weight of insulation median, and then increase the shared whole weight of insulation median in the support, promote the bulk strength of insulation median, and then promote the bulk strength and the reliability that have the LED support of this insulation median and utilize the LED that this support made.
In an example of the embodiment, both ends of the front surface of the insulating isolation belt may be provided with insulating protrusions to further improve the strength of the insulating isolation belt. When the two ends of the insulating isolation belt are provided with the insulating bulges, the shapes, the sizes and the materials of the insulating bulges at the two ends can be the same, and can also be set to be different according to requirements.
In an example of this embodiment, the insulating protrusion may span over the front surface of the positive substrate and/or the negative substrate to increase a contact area between the insulating isolation strip and the positive substrate and/or the negative substrate and a contact area between the insulating isolation strip and the inner wall of the enclosure, so that a part of mechanical force applied to the insulating isolation strip is transmitted to the positive substrate and/or the negative substrate and the enclosure, thereby further increasing the strength of the insulating isolation strip, and further increasing the overall strength and reliability of the LED support as a whole. And meanwhile, the air tightness of the LED support can be improved, and the moisture resistance of the LED support is further improved.
In an example of this embodiment, the functional regions of the positive substrate and the negative substrate are located at the bottom of a reflective cavity formed by the enclosure body, and optionally, an insulating protrusion disposed on the insulating isolation tape is in direct contact with the inner side surface of the reflective cavity, and the height of the insulating protrusion is less than the height of the inner side surface of the reflective cavity; the mechanical force part that makes the insulating median receive transmits to on the enclosure body to can further promote the intensity of insulating median, and then promote the bulk strength and the reliability of LED support on the whole. And meanwhile, the air tightness of the LED support can be improved, and the moisture resistance of the LED support is further improved.
It should be understood that, alternatively, the insulating protrusions disposed on the insulating isolation belt may also be disposed to contact with the at least one substrate and the enclosure body simultaneously, so that the mechanical force applied to the insulating isolation belt is partially transmitted to the enclosure body and the at least one substrate, thereby improving the overall strength, reliability and moisture resistance of the LED support to the greatest extent.
In an example of the present implementation, in order to further enhance the strength of the insulating isolation belt, the front surface of the insulating isolation belt may be set higher than the front surfaces of the positive electrode substrate and the negative electrode substrate, and the specific height may be flexibly set according to the requirement.
In an example of the embodiment, the insulating protrusion disposed on the insulating isolation strip and the insulating isolation strip may be integrally formed or may be separately formed, and specifically, may be flexibly set according to a specific process and a requirement.
In an example of the present embodiment, the insulating protrusion disposed on the insulating isolation strip and the insulating isolation strip may be made of the same material, but may be different in some examples.
The specific shape and structure of the insulating protrusion in this embodiment can be flexibly set, for example, the insulating protrusion can be set to be hemispherical, or semicircular pie, or the like, and certainly, the insulating protrusion can also be spherical or semicircular pie with less than half or more than half; at this time, the profile of the vertical section of the insulating protrusion along the height direction may be an arc-shaped profile, or the profile of the vertical section of the insulating protrusion along the height direction may be a profile composed of an upper horizontal side, a lower horizontal side, and an arc-shaped section located between the upper horizontal side and the lower horizontal side. Of course, the insulation protrusion in the embodiment may also be set to be square or other regular shapes, and of course, may also be set to be irregular shapes, and specifically, may be flexibly set according to specific application scenarios.
In the embodiment, the insulating bulge is arranged at least one end of the front surface of the insulating isolation belt and can be simultaneously contacted with at least one substrate or the enclosing wall body, so that the material component of the insulating isolation belt is increased, the integral component occupied by the insulating isolation belt in the support is increased, the integral strength of the insulating isolation belt is improved, meanwhile, part of mechanical force borne by the insulating isolation belt can be transmitted to the enclosing wall body and the at least one substrate, and the integral strength, reliability and moisture resistance of the LED support are improved to the maximum extent; meanwhile, the contact area of the insulating isolation belt with the substrate and the surrounding wall body is increased, and the air tightness of the support is improved.
Example five:
referring to fig. 1-1 to 1-2, in a conventional LED support, an insulating isolation strip between an anode substrate and a cathode substrate is a long side of the support, and is parallel to the anode substrate and the cathode substrate; and the insulating isolation belt is a fragile insulating material, and the width of the insulating isolation belt is narrow, so that the insulating isolation belt is easy to break, and the overall strength and reliability of the LED support are reduced.
To solve the problem, the embodiment further provides an LED support with a novel structure, where two long sides of the LED support opposite to the cross-sectional profile of the insulating isolation strip are arc-shaped sides, or curved sides with at least one bend, or broken line sides with at least one bend, or inclined sides with an included angle greater than or equal to 10 ° and smaller than 90 ° with the short side of the negative electrode substrate, so that when the isolation strip is stressed, a part of the mechanical force applied to the isolation strip can be transmitted to the positive electrode substrate, the negative electrode substrate and the enclosing wall, thereby increasing the strength of the insulating isolation strip.
Optionally, in this embodiment, two long sides of the insulating isolation strip, which have opposite cross-sectional profiles, may be parallel or may be set to be non-parallel, and specifically, may be flexibly set according to requirements; for ease of understanding, the present embodiment will be described below with two examples of parallel arrangement and non-parallel arrangement, respectively.
Example of parallel arrangement:
referring to fig. 4-1, 50 is a surrounding wall, 51 is a positive substrate, 52 is a negative substrate, and 53 is an insulating isolation region. In fig. 4-1, the broken line is a short side of the negative electrode substrate 52. In fig. 4-1, the two long sides of the cross-sectional profile of the insulating isolation strip 53 are oblique sides having an included angle a of 10 ° or more and less than 90 ° with the short side of the negative electrode substrate, and the value of the included angle a can be flexibly set according to at least one of the strength requirement of a specific application scenario, the material adopted by the insulating isolation strip, the forming process, and the like. For example, in an example, the included angle a may be 75 ° to 85 °, for example, specifically 75 °, 78 °, 80 °, 83 °,85 °, and the like, so that when the insulating isolation strip 53 is subjected to a mechanical force, a part of the mechanical force can be transmitted to the positive substrate 51, the negative substrate 52, and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53, and further improving the overall strength and reliability of the LED support.
In this embodiment, the two opposite long sides of the cross-sectional profile of the insulating isolation strip 53 may be arc-shaped sides in addition to the oblique sides. For example, as shown in fig. 4-2, two long sides of the cross-sectional profile of the insulating isolation strip 53 are two arc sides parallel to each other, and the two arc sides are also arranged so that when mechanical force is applied to the insulating isolation strip 53, a part of the mechanical force applied to the insulating isolation strip 53 is transmitted to the positive substrate 51, the negative substrate 52 and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53.
The two opposite long sides of the cross-sectional profile of the insulating isolation strip 53 in this embodiment may be curved sides in addition to the oblique sides and the arc-shaped sides. For example, as shown in fig. 4-3, two long sides of the cross-sectional profile of the insulating isolation strip 53 are two parallel curved sides, and the curved sides are also arranged such that when a mechanical force is applied to the insulating isolation strip 53, a part of the mechanical force applied to the insulating isolation strip 53 is transmitted to the positive substrate 51, the negative substrate 52 and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53. The number of the curved sides other than the bending points in the present embodiment can be flexibly set, for example, the curved sides shown in fig. 4-5 can be used in addition to the curved sides shown in fig. 4-3, and of course, other forms of curved sides can be used.
In this embodiment, the two opposite long sides of the cross-sectional profile of the insulating isolation strip 53 may be a polygonal line side having at least one bend, in addition to the oblique side, the arc side and the curved side. For example, as shown in fig. 4-4, two long sides of the insulating isolation strip 53, which are opposite to each other in cross-sectional profile, are two fold lines parallel to each other, and the fold lines are arranged such that when mechanical force is applied to the insulating isolation strip 53, a part of the mechanical force applied to the insulating isolation strip 53 is transmitted to the positive substrate 51, the negative substrate 52 and the enclosure body 50, thereby improving the strength of the insulating isolation strip 53. The number of the folding line edges in the present embodiment other than the number of the bending points can be flexibly set, for example, the folding line edges shown in fig. 4-6 can be used in addition to the folding line edges shown in fig. 4-4, and of course, other types of folding line edges can also be used.
Non-parallel setup example:
referring to fig. 5-1, 60 is a surrounding wall, 61 is a positive substrate, 62 is a negative substrate, and 63 is an insulating isolation region. In fig. 5-1, two long sides of the insulating isolation strip 63 opposite to each other in cross-sectional profile are inclined sides having an included angle of 10 ° or more and less than 90 ° with the short side of the negative substrate 62, and the two inclined sides are not parallel to each other, so that when the insulating isolation strip 63 is subjected to a mechanical force, a part of the mechanical force can be transmitted to the positive substrate 61, the negative substrate 62 and the surrounding wall body 60, thereby enhancing the strength of the insulating isolation strip 63 and further enhancing the overall strength and reliability of the LED support.
The two opposite long sides of the cross-sectional profile of the insulating isolation strip 63 in this embodiment may be arc-shaped sides in addition to the oblique sides. For example, as shown in fig. 5-2, two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel arc-shaped sides, and the non-parallel arc-shaped sides are also arranged such that when the insulating isolation strip 63 is subjected to a mechanical force, a part of the mechanical force is transmitted to the positive electrode substrate 61, the negative electrode substrate 62 and the enclosing wall body 60, thereby enhancing the strength of the insulating isolation strip 63.
The two opposite long sides of the cross-sectional profile of the insulating isolation strip 63 in this embodiment may be curved sides in addition to the oblique sides and the curved sides. For example, as shown in fig. 5-3, two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel curved sides, and the two non-parallel curved sides are also arranged so that when the insulating isolation strip 63 is subjected to a mechanical force, a part of the mechanical force is transmitted to the positive substrate 61, the negative substrate 62 and the enclosure body 60, thereby enhancing the strength of the insulating isolation strip 63.
In this embodiment, the two opposite long sides of the cross-sectional profile of the insulating isolation belt 63 may be a polygonal line side having at least one bend, in addition to the oblique side, the arc side and the curved side. For example, as shown in fig. 5-4, two long sides of the cross-sectional profile of the insulating isolation strip 63 are two non-parallel fold lines, and the two non-parallel fold lines can also be arranged to transmit a part of mechanical force received by the insulating isolation strip 63 to the positive substrate 61, the negative substrate 62 and the enclosure body 60 when the insulating isolation strip 63 is subjected to mechanical force, so as to improve the strength of the insulating isolation strip 63.
In another example of the embodiment, in order to further improve the strength of the insulating isolation belt, the front surface of the insulating isolation belt can be arranged to be higher than the front surfaces of the positive electrode substrate and the negative electrode substrate; and the raised part can also cross over the positive electrode substrate and the negative electrode substrate so as to further improve the strength of the insulating isolation belt.
Two relative long limits of insulating median cross section profile set up to the arc limit in this embodiment, or the curve limit, or broken line limit, or for the contained angle more than or equal to 10 between the minor face with the negative pole base plate, be less than 90 hypotenuses, when the median atress, can give positive pole base plate, negative pole base plate and enclosure on the wall body with the mechanical force transmission part that receives, consequently can increase the intensity of insulating median, promote the overall strength and the reliability of LED that LED support and utilized this support to make.
Example six:
the present embodiment provides an LED, including the LED support shown in the above embodiments, and further having at least one LED chip, where the LED chip is disposed on the positive substrate and/or the negative substrate, and a positive pin and a negative pin of the LED chip are electrically connected to the positive substrate and the negative substrate, respectively, it should be understood that the LED chip in this embodiment may be a flip LED chip, and may also be a forward LED chip, and the manner of electrically connecting the positive pin and the negative pin of the LED chip to the positive substrate and the negative substrate respectively includes but is not limited to: by conductive wire, conductive glue or other forms of conductive material.
It should be understood that the colors of the LED lights presented to the user according to the present embodiment can be flexibly set according to the actual needs and application scenarios. What color the LED emits and appears can be flexibly controlled by, but not limited to, the following factors: the color of the light emitted by the LED chip itself, whether the LED includes a luminescence conversion layer, the type of luminescence conversion layer when the LED includes a luminescence conversion layer.
In an example of the embodiment, the LED may further include a lens adhesive layer or a diffusion adhesive layer disposed on the LED chip (when the light emitting conversion adhesive layer is disposed on the LED chip, the light emitting conversion adhesive layer is disposed on the light emitting conversion adhesive layer).
It should be understood that, in an example, the luminescence conversion glue layer may be a phosphor glue layer containing phosphor, or may be a colloid containing quantum dot photo-induced material, or other luminescence conversion glue or film capable of realizing luminescence conversion, and may also include diffusing powder or silicon powder, etc. as required; the light emitting conversion glue layer, the lens glue layer or the diffusion glue layer formed on the LED chip in this embodiment includes, but is not limited to, dispensing, molding, spraying, pasting, and the like.
For example, the luminescence conversion layer may include a phosphor paste layer, a phosphor film, or a quantum dot QD film; the phosphor glue layer and the phosphor film can be made of inorganic phosphor, and can be inorganic phosphor doped with rare earth elements, wherein the inorganic phosphor includes but is not limited to at least one of silicate, aluminate, phosphate, nitride and fluoride phosphor.
For another example, the quantum dot QD film may be fabricated using quantum dot phosphors; quantum dot phosphors include, but are not limited to, at least one of BaS, AgInS2, NaCl, Fe2O3, In2O3, InAs, InN, InP, CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, GaAs, GaN, GaS, GaSe, InGaAs, MgSe, MgS, MgTe, PbS, PbSe, PbTe, Cd (SxSe1-x), BaTiO3, PbZrO3, CsPbCl3, CsPbBr3, CsPbI 3.
In this embodiment, the type of light emitted by the LED chip itself may be visible light, or ultraviolet light or infrared light invisible to the naked eye; when the type of light emitted by the LED chip itself is ultraviolet light or infrared light invisible to the naked eye, a light emitting conversion layer may be disposed on the LED chip to convert the invisible light to visible light, so that the light emitted from the LED is visible to the user. For example, when the light emitted from the LED chip itself is ultraviolet light, if the LED is supposed to display white light visible to the user, the light conversion layer may be made by mixing red, green, and blue phosphors.
The present embodiment also provides a light emitting device including the LED exemplified in the above embodiment. The light emitting device in this embodiment may be a lighting device, an optical signal indicating device, a light supplementing device, or a backlight device. When the lighting device is used, the lighting device can be specifically applied to various fields, such as a table lamp, a fluorescent lamp, a ceiling lamp, a down lamp, a street lamp, a projection lamp and the like in daily life, a high beam lamp, a dipped beam lamp, an atmosphere lamp and the like in an automobile, an operation lamp, a low electromagnetic lighting lamp and a lighting lamp of various medical instruments in medical use, and various colored lamps, landscape lighting lamps, advertisement lamps and the like in the field of decoration; when the light signal indicating device is used, the light signal indicating device can be applied to various fields, such as signal indicating lamps in the traffic field, various signal state indicating lamps on communication equipment in the communication field, various indicating lamps on vehicles and the like; when the device is a light supplement device, the device can be a light supplement lamp in the photographic field, such as a flash lamp and a light supplement lamp, and can also be a plant light supplement lamp for supplementing light to plants in the agricultural field; in the case of the backlight device, the backlight device may be applied to various backlight fields, for example, a display, a television, a mobile terminal such as a mobile phone, and an advertisement machine.
It should be understood that the above applications are only a few of the applications exemplified by the present embodiment, and that the application of LEDs is not limited to the above exemplified fields.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (15)
1. A high-reliability LED bracket is characterized by comprising a positive electrode substrate, a negative electrode substrate and an insulating isolation strip, wherein the insulating isolation strip is positioned between the positive electrode substrate and the negative electrode substrate and used for insulating and isolating the positive electrode substrate and the negative electrode substrate; in the positive electrode substrate and the negative electrode substrate, at least one target side surface is arranged on at least one side surface of the substrate, the surface path value of the target side surface along the height direction is larger than the side surface height value of the target side surface, and the target side surface is a non-plane surface.
2. The high reliability LED mount according to claim 1, wherein the target side is provided in both of the sides of the positive electrode substrate and the negative electrode substrate.
3. The high-reliability LED support according to claim 2, wherein at least one of the side surfaces of the positive electrode substrate and the negative electrode substrate that is in contact with the enclosure body has the target side surface;
and/or the presence of a gas in the gas,
and the side surfaces of the positive electrode substrate and the negative electrode substrate, which are contacted with the insulating isolation belt, are the target side surfaces.
4. The high reliability LED mount according to claim 2, wherein the positive electrode substrate and the negative electrode substrate have a front surface width larger than a back surface width.
5. The high reliability LED support of any of claims 1-4, wherein the target side is curved.
6. The high reliability LED mount of claim 5 wherein the target side surface is curved.
7. The high reliability LED support of any one of claims 1-4, wherein the target side is a combined surface comprising at least two of a flat surface, a sloped surface, and an arc surface.
8. The high reliability LED mount according to claim 7, wherein the target side is a step combination surface including at least two of a flat surface, a slope surface, and an arc surface.
9. The high reliability LED mount according to claim 7, wherein the step combination face is composed of a horizontal plane and a vertical plane, and an arc-shaped face connecting between the horizontal plane and the vertical plane.
10. The high reliability LED support of any one of claims 1-4, wherein the front side of the insulating isolation strip is provided with an insulating protrusion at least at one end.
11. The high reliability LED mount according to claim 10, wherein the insulating projection spans over a front surface of the positive electrode substrate and/or the negative electrode substrate;
and/or the presence of a gas in the gas,
the functional areas of the anode substrate and the cathode substrate are positioned at the bottom of a reflection cavity formed by the wall body, the insulation bulge is in direct contact with the inner side surface of the reflection cavity, and the height of the insulation bulge is smaller than that of the inner side surface of the reflection cavity.
12. The high-reliability LED bracket as claimed in any one of claims 1 to 4, wherein two opposite long sides of the cross-sectional profile of the insulating isolation strip are arc-shaped sides, or are curved sides with at least one bend, or are broken line sides with at least one bend, or are inclined sides with an included angle of 10 degrees or more and less than 90 degrees with the short sides of the negative electrode substrate.
13. The high reliability LED mount according to claim 12, wherein the insulating spacer has a cross-sectional profile with two opposing long sides parallel.
14. An LED, comprising the high-reliability LED support according to any one of claims 1 to 13 and at least one LED chip, wherein the LED chip is disposed on the positive substrate and/or the negative substrate, and a positive pin and a negative pin of the LED chip are electrically connected to the positive substrate and the negative substrate, respectively.
15. A lighting device comprising the LED of claim 14, wherein the lighting device is a lighting device, a light signal indicating device, a light supplementing device, or a backlight device.
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| CN201811006238.XA CN110875414A (en) | 2018-08-30 | 2018-08-30 | High-reliability LED support, LED and light-emitting device |
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Application publication date: 20200310 |