CN110875230B - Electrostatic chuck protection structure, glue filling device and glue filling process - Google Patents
Electrostatic chuck protection structure, glue filling device and glue filling process Download PDFInfo
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- CN110875230B CN110875230B CN201810992501.0A CN201810992501A CN110875230B CN 110875230 B CN110875230 B CN 110875230B CN 201810992501 A CN201810992501 A CN 201810992501A CN 110875230 B CN110875230 B CN 110875230B
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- adhesive
- accommodating cavity
- electrostatic chuck
- protective
- glue
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6831—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using electrostatic chucks
- H01L21/6833—Details of electrostatic chucks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
- B05C5/0208—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work for applying liquid or other fluent material to separate articles
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
- B05D1/265—Extrusion coatings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/32—Processes for applying liquids or other fluent materials using means for protecting parts of a surface not to be coated, e.g. using stencils, resists
- B05D1/322—Removable films used as masks
- B05D1/325—Masking layer made of peelable film
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses an electrostatic chuck protection structure, and relates to a structure for protecting an adhesive on an electrostatic chuck. Its purpose is in order to provide a protection architecture who improves the protective effect to the adhesive linkage. The protective structure is used for protecting the adhesive of the adhesive layer, the electrostatic chuck comprises insulating layers, metal electrodes and a metal base, the metal electrodes and the metal base are clamped between the insulating layers, the metal base is in adhesive connection with the insulating layers through the adhesive layers, the protective structure comprises an accommodating cavity and a protective agent filled in the accommodating cavity, the protective agent forms a protective layer with a certain thickness in the accommodating cavity, the accommodating cavity is located close to the outer edges of the metal base and the insulating layers and is located on one side of the adhesive surface of the metal base and the insulating layers, the height of the accommodating cavity is larger than the thickness of the adhesive layers, an infusion opening is reserved in the outer edges of the adhesive layers, and the protective agent is infused into the accommodating cavity through the infusion opening. The invention greatly improves the protection effect on the adhesive and has high reliability.
Description
Technical Field
The present invention relates to the field of semiconductor processing, and more particularly to a structure for protecting an adhesive on an electrostatic chuck, a process for fabricating the structure, and an apparatus for performing the process.
Background
In semiconductor manufacturing processes, bonding techniques are widely used, such as chip packaging, wafer stacking and connection of functional parts of an electrostatic chuck, where bonding is to connect at least two parts together by an adhesive, and has many advantages compared with welding, soldering and screw connection, such as firm bonding joint, good fatigue resistance, uniform load distribution, and good connection of different materials.
In a semiconductor processing apparatus, an electrostatic chuck including an insulating layer, a metal electrode sandwiched between the insulating layers, and a metal base is disposed in a process apparatus such as PVD, CVD, and Etch. However, if the bonding layer is not protected, the bonding layer is exposed to high-temperature plasma and harsh chemical environment for a long time, and can be peeled off, form particles, pollute the wafer and seriously cause the cracking of the metal base and the insulating layer. In order to avoid the above phenomenon, an adhesive layer protection structure is generally provided on an electrostatic chuck, and a protection layer is generally poured into the adhesive layer, and the conventional patent No. CN 102257608B, entitled chinese patent for an adhesive for bonding a high-temperature electrostatic chuck, is shown in fig. 1, wherein [ see page 3, paragraph 22 of the specification ] the adhesive layer may have a thickness of between about 4 or about 15 mils, and the thickness of the adhesive layer is obviously very thin, which is very disadvantageous for pouring the protection layer into the adhesive layer, and the poured protection layer is also very thin, and is easy to shrink under heat to generate defects, and the protection layer is easy to be damaged in a long-term use process, resulting in a reduction in protection effect.
The existing device for pouring the protective layer into the adhesive layer is not convenient to use; and the protection effect of the poured protective layer is not good by using the glue pouring mode of the existing protective layer pouring process.
Disclosure of Invention
The invention aims to provide a bonding layer protection structure for improving the protection effect of a bonding layer, a glue filling device convenient for filling the protection structure into the bonding layer and a process for filling the glue protection structure by using the glue filling device.
The electrostatic chuck protection structure is used for protecting an adhesive of an adhesive layer, and comprises an insulating layer, a metal electrode and a metal base, wherein the metal electrode and the metal base are clamped between the insulating layer, the metal base and the insulating layer are in adhesive connection through the adhesive layer, the protection structure comprises an accommodating cavity and a protective agent filled in the accommodating cavity, the protective agent forms a protective layer with a certain thickness in the accommodating cavity, the accommodating cavity is positioned close to the outer edges of the metal base and the insulating layer and positioned on one side of the adhesive surface of the metal base and the insulating layer, the height of the accommodating cavity is larger than the thickness of the adhesive layer, an injection opening is reserved in the outer edge of the adhesive layer, and the protective agent is injected into the accommodating cavity through the injection opening.
In the electrostatic chuck protection structure, the accommodating cavity is formed on the metal base;
and/or the accommodating cavity is arranged on the insulating layer.
The electrostatic chuck protection structure of the invention, wherein the thickness of the protection layer is 0.7-2.2 mm.
The electrostatic chuck protection structure comprises a protection layer, a protective layer and a protective agent, wherein the protection layer is a thermosetting colloid protective agent, and the main component of the protective agent is modified epoxy resin.
The electrostatic chuck protection structure of the invention, wherein the vacuum weight loss of the protective agent is less than 0.15%.
The electrostatic chuck protection structure of the invention, wherein the hardness of the protection layer after curing is 80-90D.
The invention relates to a glue filling device, wherein the glue filling device is used for filling a protective layer formed by the protective agent, the glue filling device comprises a rotating part and a glue filling part, the rotating part comprises a rotating table, the rotating table is used for bearing and fixing the electrostatic chuck so as to realize synchronous uniform rotation of the electrostatic chuck along with the rotating table during glue filling, the glue filling part comprises a glue filling part, a pushing part and a glue cylinder, the glue cylinder is used for containing the protective agent, the glue filling part is used for filling the protective agent into the accommodating cavity, the pushing part is used for pushing the protective agent to be filled into the accommodating cavity through the glue filling part, and one end of the pushing part extends into the glue cylinder.
According to the glue pouring device, the electrostatic chuck is fixed on the rotating table through bolts, the electrostatic chuck is provided with a plurality of mounting holes, and the rotating table is provided with a plurality of positioning holes at positions corresponding to the mounting holes.
According to the glue pouring device, the rotating component further comprises a heating device, and the heating device is used for heating and curing the protective layer.
The invention relates to a glue filling process, which comprises a glue filling process performed by using the glue filling device, wherein the glue filling process comprises the following steps:
SP 1: sticking a high-temperature resistant adhesive tape to the non-bonding surface of the bonded object for protection, and reserving a bonding surface;
SP 2: fixedly placing a metal base of the electrostatic chuck on the rotary table, and ensuring that the electrostatic chuck is in the center of the rotary table;
SP 3: uniformly coating an adhesive on an adhesive surface, and attaching the metal base and the insulating layer in an aligned manner to solidify the metal base and the insulating layer to form an adhesive layer;
SP 4: cleaning the adhesive in the accommodating cavity without residual glue visible to naked eyes;
SP 5: the protective agent is mixed evenly after being proportioned to form stable fluid;
SP 6: filling a protective agent into the glue filling device;
SP 7: placing the protective agent in vacuum equipment for room-temperature degassing treatment;
SP 8: starting the rotating platform, adjusting the rotating speed to a certain speed to enable the rotating platform to rotate stably, keeping a certain distance between the glue filling piece and the accommodating cavity, pushing a pushing piece of the glue filling device by hand, uniformly filling the protective agent into the accommodating cavity, and repeating the actions for 2-3 times to complete glue filling;
SP 9: starting a heating function of a rotating platform, and meanwhile, configuring a pressing block above the electrostatic chuck for isothermal solidification;
SP 10: checking the appearance of the protective layer, and repeating the steps SP8 and SP9 to perform glue filling operation;
SP 11: the protective layer was checked for hermeticity.
The glue pouring process of the invention is carried out in an atmospheric environment or a vacuum environment in the step SP 8.
The protective layer is used for protecting the protective layer, the height of the accommodating cavity is larger than the thickness of the adhesive layer, when the accommodating cavity is filled with the protective agent, the thickness of the protective layer is larger than the thickness of the adhesive layer, and therefore the protective effect of the protective layer on the adhesive layer is greatly improved. The glue filling device comprises the rotating table, the electrostatic chuck and the rotating table synchronously rotate at a constant speed, the uniformity of a filled protective layer is realized, the protective effect of the protective layer is improved, and the glue filling component is arranged to facilitate the filling of a protective agent into the accommodating cavity. The pouring protection layer is convenient to use and simple in structure, and the uniformity, the air tightness and the saturation of the poured protection layer are very good, so that the protection effect of the protection layer is improved. The glue filling process implemented by the glue filling device also ensures the uniformity and the air tightness of the protective layer and good saturation, and reduces the sealing defects to the maximum extent, thereby improving the protective effect of the protective layer.
The accommodating cavity can be arranged on the metal base or the insulating layer or both the metal base and the insulating layer according to actual needs; the protective layer is a thermosetting colloid, so that the air tightness of the protective layer is improved, and the protective effect of the protective layer is improved; the electrostatic chuck is fixed on the rotary table through bolts, so that the electrostatic chuck is convenient to assemble, disassemble and maintain on the rotary table; step SP8 is performed in a vacuum environment, which is beneficial to improving the protective effect of the protective layer.
The electrostatic chuck protection structure, the glue filling device and the glue filling process of the present invention will be further described with reference to the accompanying drawings.
Drawings
FIG. 1 is a front view of the prior art;
fig. 2 is a front view of an electrostatic chuck protection structure according to embodiment 1 of the present invention;
fig. 3 is a front view of embodiment 2 of the electrostatic chuck protection structure of the present invention;
fig. 4 is a front view of embodiment 3 of the electrostatic chuck protection structure of the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 4 at A;
FIG. 6 is a view of FIG. 5 without the protectant applied;
fig. 7 is a front view of the glue pouring device of the present invention.
1-electrostatic chuck, 2-metal base, 3-adhesive layer, pouring opening-31, 4-protective layer, 41-protective agent, 5-insulating layer, 6-accommodating cavity, 7-rotating part, 71-rotating table, 72-rotating bracket, 73-caster, 8-glue pouring part, 81-glue pouring part, 82-propelling part, 821-propelling handle and 83-glue barrel.
Detailed Description
Realize adhesive connection through adhesive linkage 3 between metal base 2 and the insulating layer 5 on the electrostatic chuck 1, for avoiding adhesive linkage 3 to expose and lead to bonding failure in the middle of the air, generally protect adhesive linkage 3, adopt the mode that sets up protective layer 4 in the adhesive linkage 3 outside to realize. In the prior art, the protective layer 4 for protecting the adhesive layer 3 on the electrostatic chuck 1 is thin, so that the electrostatic chuck is easy to shrink under the action of heat to generate defects and is easy to corrode. The specific scheme is as follows: as shown in fig. 2-4 in combination with fig. 5 and 6, the protection structure is used for protecting the adhesive of the adhesive layer 3, the electrostatic chuck 1 includes the insulating layer 5, the metal electrode and the metal base 2 clamped between the insulating layer 5, the metal base 2 and the insulating layer 5 are connected by the adhesive layer 3 in an adhesive manner, the protection structure includes an accommodating cavity 6 and a protective agent 41 located in the accommodating cavity 6, the protective agent 41 forms a protective layer 4 with a certain thickness in the accommodating cavity 6, the accommodating cavity 6 is located at a position close to the outer edges of the metal base 2 and the insulating layer 5 and located at one side of the adhesive surface of the metal base 2 and the insulating layer, the height of the accommodating cavity 6 is greater than the thickness of the adhesive layer 3, the outer edge of the adhesive layer 3 is reserved with an injection port 31, and the protective agent 41 is injected into the accommodating cavity 6 through the injection port 31. The height of holding chamber 6 is greater than the thickness of adhesive linkage 3, and holding chamber 6 is used for pouring into protective agent 41 to improve the thickness of protective layer 4, improved the protective effect of protective layer 4 to the adhesive greatly.
Preferably, the opening position of the accommodating cavity 6 may be set on the metal base 2 as shown in fig. 2 in embodiment 1, or on the insulating layer 5 as shown in fig. 3 in embodiment 2, or on both the metal base 2 and the insulating layer 5 as shown in fig. 4 in embodiment 3, according to actual use requirements. Further preferably, the shape and the tooth size of the accommodating cavity 6 can be set to any suitable shape and size according to the actual use requirement or the convenience of the opening.
Preferably, in order to improve the air tightness of the protective layer 4 and improve the protective effect of the protective layer 4, the protective layer 4 is made of thermosetting resin, and the main component of the protective layer 4 is modified epoxy resin.
It is further preferable that the protective layer 4 is too thin to affect its protective effect, and too thick the protective layer 4 affects the use of the electrostatic chuck 1 and wastes resources, and it is preferable that the thickness of the protective layer 4 is 0.7 to 2.2 mm.
Preferably, the vacuum weight loss of the protective layer 4 is less than 0.15%.
Preferably, the protective structure has a hardness of 80-90D after curing.
Preferably, since the protection effect of the protective layer 4 on the adhesive layer 3 is affected by the uniformity of the air tightness and the saturation thereof, an appropriate adhesive pouring device for the protective layer 4 needs to be selected, as shown in fig. 7, the adhesive pouring device includes a rotating member 7 and an adhesive pouring member 8, the rotating member 7 includes a rotating table 71, the rotating table 71 is used for carrying and fixing the electrostatic chuck 1 so as to achieve synchronous uniform rotation of the electrostatic chuck 1 and the rotating table 71 during adhesive pouring, preferably, the rotating table 71 is manually controlled or electrically controlled so as to achieve uniform rotation of the rotating table 7 at a speed of 150- & lt- & gt 300r/min, preferably, the rotating direction is counterclockwise rotation, the adhesive pouring member 8 includes an adhesive pouring member 81, a propelling member 82 and an adhesive cylinder 83, the adhesive cylinder 83 is used for containing the protective agent 41, the adhesive pouring member 81 is used for pouring the protective agent 41 into the accommodating chamber 6, encapsulating piece 81 can be for encapsulating the mouth, and preferably, in for the convenience of encapsulating piece 81 pours into holding chamber 6, encapsulating mouth design is the toper, and encapsulating mouth's size can be set for wantonly according to actual need. The pushing element 82 is used for pushing the protective agent 41 to be poured into the accommodating cavity 6 from the glue pouring element 81, and one end of the pushing element 82 extends into the glue cylinder 83. Specifically, the pushing member 82 includes a pushing rod extending into the glue cylinder 83 and a pushing handle 821 (not shown) located outside the glue cylinder 83.
Further preferably, when the glue is not required to be poured inwards into the accommodating cavity 6, in order to prevent the propelling member from operating under the action of external force, the glue pouring part 8 further comprises a fixing member (not shown in the figure).
Preferably, in order to facilitate the mounting, dismounting and maintenance of the electrostatic chuck 1 on the rotary table 71, the electrostatic chuck 1 is bolted to the rotary table 71, a plurality of mounting holes (not shown) are formed on the electrostatic chuck 1, and a plurality of positioning holes (not shown) are formed on the rotary table 71 at positions corresponding to the mounting holes.
Preferably, the potting member 81 is threadedly connected to the pushing member 82, so as to facilitate assembly, disassembly and maintenance, and also facilitate replacement of the potting member 81.
Preferably, the rotating member 7 further comprises heating means (not shown in the figures) for the heating and curing of the protective layer 4.
Preferably, in order to facilitate the fixing of the rotating platform 71, the rotating member 7 further comprises a rotating bracket 72, and the rotating platform 71 is fixedly mounted on the rotating bracket 72. Further preferably, in order to facilitate the movement of the rotating table 71, a caster 73, such as a universal wheel, is mounted on the bottom of the rotating bracket 72.
The protective layer 4 formed by the protective agent 41 after being filled needs to have good air tightness, full and compact filling and as few as possible sealing defects, so the invention provides a glue filling process by using the glue filling device, and the glue filling process comprises the following steps:
SP 1: sticking a high-temperature resistant adhesive tape to the non-bonding surface of the bonded object for protection, and reserving a bonding surface;
SP 2: fixedly placing the metal base 2 of the electrostatic chuck 1 on the rotating table 71 and ensuring that the electrostatic chuck 1 is at the center of the rotating table 71;
SP 3: uniformly coating an adhesive on the adhesive surface, aligning and attaching the metal base 2 and the insulating layer 5, and curing the metal base 2 and the insulating layer 5 to form an adhesive layer 3;
SP 4: the adhesive in the accommodating cavity 6 is removed completely, and no residual adhesive can be seen by naked eyes;
SP 5: the protective agent 41 is mixed evenly after being proportioned, so that stable fluid is formed;
SP 6: filling the protective agent 41 into a glue filling device;
SP 7: placing the protective agent 41 in vacuum equipment for room-temperature degassing treatment;
SP 8: starting the rotating platform 71, adjusting the rotating speed to a certain speed to enable the rotating platform 71 to rotate stably, keeping a certain distance between the glue filling piece 81 and the accommodating cavity 6, pushing a pushing piece 82 of the glue filling device by hand to uniformly fill the protective agent 41 into the accommodating cavity 6, and repeating the actions for 2-3 times to complete glue filling;
SP 9: starting a heating function of the rotary platform, and meanwhile, configuring a pressing block above the electrostatic chuck 1 for isothermal solidification;
SP 10: the appearance of the protective layer 4 was checked, since the curing was accompanied by volume shrinkage, and the steps SP8 and SP9 were repeated as appropriate to perform the adhesive filling operation;
SP 11: the protective layer 4 was checked for hermeticity.
Preferably, step SP8 may be performed in a vacuum environment in order to obtain better protective properties of the protective layer 4.
The above-described embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.
Claims (10)
1. An electrostatic chuck protection architecture, protection architecture is used for the protection to the adhesive of adhesive linkage (3), electrostatic chuck (1) includes insulating layer (5), presss from both sides metal electrode and metal base (2) between insulating layer (5), metal base (2) with realize adhesive connection through adhesive linkage (3) between insulating layer (5), its characterized in that: the protective structure comprises an accommodating cavity (6) and a protective agent (41) filled in the accommodating cavity (6), wherein the protective agent (41) forms a protective layer (4) with a certain thickness in the accommodating cavity (6), the accommodating cavity (6) is positioned close to the outer edges of the metal base (2) and the insulating layer (5) and is positioned on one side of the bonding surface of the metal base (2) and the insulating layer, the height of the accommodating cavity (6) is greater than the thickness of the bonding layer (3), a filling opening (31) is reserved in the outer edge of the bonding layer (3), and the protective agent (41) is filled into the accommodating cavity (6) through the filling opening (31); static chuck (1) bears and fixes through revolving stage (71) to when realizing the encapsulating static chuck (1) is followed the synchronous uniform velocity of revolving stage (71) rotates, and the encapsulating device includes rotary part (7) and encapsulating part (8), rotary part (7) are including revolving stage (71), encapsulating part (8) will protectant (41) are poured into in holding chamber (6).
2. The electrostatic chuck (1) protection structure according to claim 1, characterized in that: the accommodating cavity (6) is arranged on the metal base (2);
and/or
The accommodating cavity (6) is arranged on the insulating layer (5).
3. The electrostatic chuck (1) protection structure according to claim 1, characterized in that: the thickness of the protective layer (4) is 0.7-2.2 mm.
4. The electrostatic chuck (1) protection structure according to claim 2 or 3, characterized in that: the protective layer (4) is a thermosetting colloid protective agent (41), and the main component of the protective agent (41) is modified epoxy resin.
5. The electrostatic chuck (1) protection structure according to claim 2 or 3, characterized in that: the vacuum weight loss of the protective agent (41) is less than 0.15%.
6. The electrostatic chuck (1) protection structure according to claim 2 or 3, characterized in that: the hardness of the protective layer (4) after curing is 80-90D.
7. The utility model provides a glue filling device which characterized in that: the glue filling device is used for filling the protective layer (4) of any one of the claims 1 to 6, the glue filling component (8) comprises a glue filling piece (81), a pushing piece (82) and a glue cylinder (83), the glue cylinder (83) is used for containing the protective agent (41), the glue filling piece (81) is used for filling the protective agent (41) into the accommodating cavity (6), the pushing piece (82) is used for pushing the protective agent (41) to be filled into the accommodating cavity (6) through the glue filling piece (81), and one end of the pushing piece (82) extends into the glue cylinder (83).
8. The glue filling device of claim 7, wherein: the electrostatic chuck (1) is fixed on the rotary table (71) through bolts, a plurality of mounting holes are formed in the electrostatic chuck (1), and a plurality of positioning holes are formed in the position, corresponding to the mounting holes, of the rotary table (71).
9. The glue filling device of claim 7, wherein: the rotating part (7) further comprises a heating device for heating and curing the protective layer (4).
10. Glue filling process using a glue filling apparatus according to any one of the preceding claims 7-9, characterized in that: the method comprises the following steps:
SP 1: sticking a high-temperature resistant adhesive tape to the non-bonding surface of the bonded object for protection, and reserving a bonding surface;
SP 2: fixedly placing a metal base (2) of the electrostatic chuck (1) on the rotating table (71) and ensuring that the electrostatic chuck (1) is at the center of the rotating table (71);
SP 3: uniformly coating an adhesive on an adhesive surface, aligning and attaching the metal base (2) and the insulating layer (5) to each other, and curing the metal base (2) and the insulating layer (5) to form an adhesive layer (3);
SP 4: the adhesive in the accommodating cavity (6) is removed completely, and no residual adhesive can be seen by naked eyes;
SP 5: the protective agent (41) is mixed evenly after being proportioned to form stable fluid;
SP 6: filling a protective agent (41) into the glue filling device;
SP 7: placing the protective agent (41) in vacuum equipment for room-temperature degassing treatment;
SP 8: starting the rotating platform (71), adjusting the rotating speed to a certain speed to enable the rotating platform (71) to rotate stably, keeping a certain distance between the glue pouring piece (81) and the accommodating cavity (6), pushing a pushing piece (82) of the glue pouring device by hand, uniformly pouring the protective agent (41) into the accommodating cavity (6), and repeating the actions for 2-3 times to finish glue pouring;
SP 9: starting a heating function of a rotating platform, and meanwhile, configuring a pressing block above the electrostatic chuck (1) for isothermal solidification;
SP 10: checking the appearance of the protective layer (4), and repeating the steps SP8 and SP9 to perform glue filling operation;
SP 11: the protective layer (4) is checked for gas tightness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992501.0A CN110875230B (en) | 2018-08-29 | 2018-08-29 | Electrostatic chuck protection structure, glue filling device and glue filling process |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810992501.0A CN110875230B (en) | 2018-08-29 | 2018-08-29 | Electrostatic chuck protection structure, glue filling device and glue filling process |
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| CN110875230A CN110875230A (en) | 2020-03-10 |
| CN110875230B true CN110875230B (en) | 2022-06-14 |
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