CN110875210A - Processing apparatus - Google Patents
Processing apparatus Download PDFInfo
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- CN110875210A CN110875210A CN201810996915.0A CN201810996915A CN110875210A CN 110875210 A CN110875210 A CN 110875210A CN 201810996915 A CN201810996915 A CN 201810996915A CN 110875210 A CN110875210 A CN 110875210A
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- carrier
- moving mechanism
- bracket
- moving
- product
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- 238000012545 processing Methods 0.000 title claims abstract description 48
- 230000007246 mechanism Effects 0.000 claims abstract description 201
- 238000002791 soaking Methods 0.000 claims abstract description 37
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 210000005056 cell body Anatomy 0.000 claims description 15
- 235000012431 wafers Nutrition 0.000 description 40
- 238000000034 method Methods 0.000 description 7
- 239000000969 carrier Substances 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000008569 process Effects 0.000 description 5
- 238000005192 partition Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000012528 membrane Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67769—Storage means
Abstract
The present invention provides a processing apparatus, including: a carrier for placing a product; the soaking mechanism can store liquid and is used for soaking products; the first moving mechanism is movably arranged and has a first working condition that the carrier is at least partially placed into the soaking mechanism and a second working condition that the carrier is taken out of the soaking mechanism; and the second moving mechanism is movably arranged on the first moving mechanism and comprises a supporting and carrying mechanism, and the supporting and carrying mechanism is used for bearing and moving the product so as to put the product into the carrier. By the technical scheme provided by the invention, the incompletely separated film and wafer can be automatically and intensively received and processed, so that the conventional manual processing mode can be replaced, the processing efficiency is improved, and the film can be prevented from being damaged.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a processing device.
Background
After the wafer with the film is subjected to the etching process, the film and the wafer are combined by surface tension, if the etching process is not good in effect, the film and the wafer cannot be completely separated when being separated, and the film and the wafer are collectively called as NG wafer. For films and wafers that are not completely separated, sorting and separation are required. At present, NG wafers are only manually processed in the field, real-time monitoring and manual timely processing are needed in the mode, manual processing efficiency is low, and if the NG wafers are not processed in time, the equipment can only be stopped, so that the capacity of the equipment is limited. Further, although normally separated membranes can be recycled, the membranes are easily damaged by manual handling.
Disclosure of Invention
The invention provides a processing device, which aims to solve the problems that in the prior art, when a film and a wafer which are not completely separated after etching are processed, the efficiency is low and the film is easy to damage.
In order to solve the above problem, the present invention provides a processing apparatus comprising: a carrier for placing a product; the soaking mechanism can store liquid and is used for soaking products; the first moving mechanism is movably arranged and has a first working condition that the carrier is at least partially placed into the soaking mechanism and a second working condition that the carrier is taken out of the soaking mechanism; and the second moving mechanism is movably arranged on the first moving mechanism and comprises a supporting and carrying mechanism, and the supporting and carrying mechanism is used for bearing and moving the product so as to put the product into the carrier.
Further, the carrying mechanism includes: a pallet fork for receiving and carrying a product; the first driving part is provided with a fifth working condition for moving the support fork to the outside of the carrier and a sixth working condition for moving the support fork to the inside of the carrier.
Further, the carrying mechanism further comprises: the first driving part is arranged on the first driving part, and the second driving part is used for driving the supporting fork to move so as to separate a product on the supporting fork from the supporting fork.
Furthermore, the first driving part is used for driving the support fork to vertically move, the second driving part is used for driving the support fork to horizontally move, the carrier comprises a feeding port positioned at the upper part, a first avoiding port positioned on the side surface and a stop part, the stop part is positioned at the first avoiding port, and the stop part is used for stopping the product to separate the product from the support fork; when the first moving mechanism is in the first working condition and the first driving part is in the sixth working condition, the second driving part can drive the supporting fork to move towards the outside of the carrier at the first avoidance port so as to leave the product inside the carrier through the stop part.
Furthermore, the carrier also comprises a bottom plate and a side plate surrounding the edge of the bottom plate, the stop piece is connected with the top surface of the bottom plate, the number of the support forks is two, the two support forks are arranged on the first driving part at intervals, and the interval between the two support forks is greater than the width of the stop piece.
Furthermore, the number of the second moving mechanisms is multiple, the number of the first moving mechanisms is one, and the multiple second moving mechanisms are arranged on the first moving mechanisms side by side; or the number of the second moving mechanisms is multiple, the number of the first moving mechanisms is multiple, and the plurality of the second moving mechanisms and the plurality of the first moving mechanisms are arranged in a one-to-one correspondence manner.
Further, the first moving mechanism includes: the bracket is movably arranged, and the second moving mechanism is arranged on the bracket; the first bracket is arranged on the support, the second moving mechanism is at least partially positioned above the first bracket, and the first bracket is used for bearing the carrier.
Further, the first moving mechanism is located at least partially above the soaking mechanism, and the first moving mechanism further includes: and the support is arranged on the fourth driving part, and the fourth driving part is used for driving the support to vertically move.
Further, the first bracket comprises two supporting arms arranged at intervals, the two supporting arms are used for bearing the carrier together, and the second moving mechanism can place the product into the carrier on the first bracket.
Further, the carrier includes: a base plate; the side plate surrounds the edge of the bottom plate to form an accommodating cavity for placing a product; the layer board sets up on the curb plate, and the layer board is at least partly protrusion in the surface of curb plate, and the layer board is two, and two layer boards are located the both sides that hold the chamber respectively, and two trailing arms are used for the one-to-one to bear the lower surface of two layer boards.
Further, have on bottom plate and/or the curb plate with hold the feed liquor hole of chamber intercommunication, one in trailing arm and the layer board has first locating hole, and another in trailing arm and the layer board has first locating pin, and first locating pin can wear to establish in the first locating hole in order to fix a position the carrier.
Further, the soaking mechanism includes: the liquid storage tank comprises a tank body, wherein a cavity of the tank body is used for storing liquid; the baffle, the baffle is first cell body and second cell body with the cavity interval of box, and liquid in the first cell body can be followed the last border of baffle and spilled over to the second cell body in, and first cell body is arranged in soaking the product in the carrier.
Further, the soaking mechanism further comprises: the bottom of the first groove body is communicated with the pump body through a pipeline, and the second groove body is communicated with the pump body through a pipeline.
Further, the processing apparatus further comprises: and the third moving mechanism is movably arranged and is provided with a third working condition for receiving the carrier on the first moving mechanism and a fourth working condition for conveying the carrier to the outside.
Further, the third moving mechanism includes: the second bracket is movably arranged and used for bearing the carrier; and the fifth driving part is used for driving the second bracket to move towards the direction close to or far away from the first moving mechanism.
Further, the third moving mechanism further includes: and the guide mechanism is used for guiding the second bracket.
Further, one of the carrier and the second bracket is provided with a second positioning hole, and the other of the carrier and the second bracket is provided with a second positioning pin which can penetrate through the second positioning hole to position the carrier.
By applying the technical scheme of the invention, the carrier, the soaking mechanism, the first moving mechanism and the second moving mechanism are arranged in the processing device, and the processing device can be used for processing films and wafers which are not completely separated after etching, so that the films and wafers which are not completely separated can be automatically received and processed in a centralized manner, the existing manual processing mode can be replaced, the processing efficiency is improved, and the films can be prevented from being damaged. Specifically, the carrier can be immersed into the liquid of the soaking mechanism through the first moving mechanism, and the incompletely separated films and wafers can be intensively placed in the carrier through the supporting mechanism in the second moving mechanism, so that the performances of the films and the wafers can be ensured while receiving, and the films and the wafers are prevented from being damaged.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a processing apparatus provided in an embodiment of the invention;
FIG. 2 shows the treatment device of FIG. 1 without a protective cover;
FIG. 3 shows an enlarged view of a portion of the processing apparatus of FIG. 2;
fig. 4 is a schematic structural view of the first moving mechanism and the carrying mechanism in fig. 3;
fig. 5 shows a schematic view of the first moving mechanism of fig. 3 engaged with a carrier;
fig. 6 shows a schematic structural view of the carrier of fig. 3;
FIG. 7 shows a schematic structural view of the steeping mechanism in FIG. 2;
fig. 8 shows a schematic structural view of the third moving mechanism in fig. 2.
Wherein the figures include the following reference numerals:
10. a carrier; 11. a stopper; 12. a base plate; 121. a second positioning hole; 13. a side plate; 14. a support plate; 141. a first positioning hole; 15. a handle; 20. a soaking mechanism; 21. a box body; 22. a partition plate; 23. a first tank body; 24. a second tank body; 25. a liquid inlet pipe; 26. a liquid outlet pipe; 27. a pump body; 30. a first moving mechanism; 31. a support; 32. a first bracket; 321. a bracket arm; 322. a first positioning pin; 33. a fourth driving section; 40. a carrying mechanism; 41. a support fork; 42. a first driving section; 43. a second driving section; 60. a third moving mechanism; 61. a second bracket; 611. a second positioning pin; 62. a fifth driving section; 63. a guide mechanism; 64. a first limit piece; 65. a second limiting member; 66. a connecting plate; 70. a frame; 71. a bearing table; 80. a shield.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
As shown in fig. 1 to 8, an embodiment of the present invention provides a processing apparatus including: a carrier 10 for placing a product; a steeping mechanism 20, the steeping mechanism 20 being capable of storing a liquid, the steeping mechanism 20 being for steeping a product; a first moving mechanism 30 movably disposed, the first moving mechanism 30 having a first operating condition for placing the carrier 10 at least partially into the soaking mechanism 20 and a second operating condition for taking the carrier 10 out of the soaking mechanism 20; and a second moving mechanism movably disposed on the first moving mechanism 30, wherein the second moving mechanism includes a carrying mechanism 40, and the carrying mechanism 40 is used for carrying and moving the product to place the product into the carrier 10.
By applying the technical scheme of the embodiment, the carrier 10, the soaking mechanism 20, the first moving mechanism 30 and the second moving mechanism are arranged in the processing device, and the processing device can be used for processing films and wafers which are not completely separated after etching, so that the films and wafers which are not completely separated can be automatically and intensively received and processed, the existing manual processing mode can be replaced, the processing efficiency is improved, and the films can be prevented from being damaged. Specifically, the carrier 10 can be immersed in the liquid in the soaking mechanism 20 through the first moving mechanism 30, and the incompletely separated films and wafers can be collectively placed in the carrier 10 through the supporting mechanism 40 in the second moving mechanism, so that the films and the wafers can be received while the performances of the films and the wafers are ensured, and the films and the wafers are prevented from being damaged. In the present embodiment, the cradle can be understood as carrying and moving. The present embodiment can put the products into the carrier 10 in a manner of being carried and moved by the carrier mechanism 40.
Specifically, as shown in fig. 4 and 5, the carriage mechanism 40 includes: a fork 41, the fork 41 being adapted to receive and carry a product; the first driving unit 42 is provided with the fork 41, and the first driving unit 42 has a fifth operating mode for moving the fork 41 to the outside of the vehicle 10 and a sixth operating mode for moving the fork 41 to the inside of the vehicle 10. This allows the fork 41 to be moved by the first driving part 42 to the outside of the carrier 10 to receive the product and allows the fork 41 to be moved by the first driving part 42 to the inside of the carrier 10 to put the product into the carrier 10.
In this embodiment, the carrying mechanism 40 further includes: and the second driving part 43, the first driving part 42 is arranged on the second driving part 43, and the second driving part 43 is used for driving the supporting fork 41 to move so as to separate the product on the supporting fork 41 from the supporting fork 41. This allows separation of the products carried on the forks 41 from the forks 41 for insertion into the carrier 10.
Specifically, the first driving portion 42 is configured to drive the supporting fork 41 to vertically move, the second driving portion 43 is configured to drive the supporting fork 41 to horizontally move, the carrier 10 includes a feeding port located at an upper portion, a first avoiding port located at a side surface, and a stop member 11, the stop member 11 is located at the first avoiding port, and the stop member 11 is configured to stop a product to separate the product from the supporting fork 41; when the first moving mechanism 30 is in the first operating condition and the first driving portion 42 is in the sixth operating condition, the second driving portion 43 can drive the supporting fork 41 to move to the outside of the carrier 10 at the first avoiding opening, so as to leave the product inside the carrier 10 through the stop member 11. This places the product into the carrier 10 by the cooperation of the second drive portion 43, the first drive portion 42 and the stopper 11. Since the carrier 10 can be soaked in the soaking mechanism 20, the product placed in the carrier 10 can be soaked in the liquid of the soaking mechanism 20 to maintain the performance of the product.
As shown in fig. 6, the carrier 10 further includes a bottom plate 12 and a side plate 13 surrounding the edge of the bottom plate 12, the stopper 11 is connected to the top surface of the bottom plate 12, two support forks 41 are provided, two support forks 41 are spaced apart from each other on the first driving portion 42, and the spacing between the two support forks 41 is greater than the width of the stopper 11. This arrangement improves the stability of the product by the two forks 41 and the stop member 11 can extend between the two forks 41 to stop the product, thereby disengaging the product from the two forks 41.
In the present embodiment, the second moving mechanism may be provided in plurality, and the first moving mechanism 30 may be provided in one, and the plurality of second moving mechanisms may be provided side by side on the first moving mechanism 30. This allows a single first movement mechanism 30 to transport multiple carriers 10 simultaneously and allows multiple second movement mechanisms to load multiple carriers 10 with products simultaneously. In this embodiment, the second moving mechanism may be provided in plurality, and the first moving mechanism 30 may be provided in plurality, and the plurality of second moving mechanisms may be provided in one-to-one correspondence with the plurality of first moving mechanisms 30. Thus, the first moving mechanisms 30 can be operated individually, for example, one first moving mechanism 30 immerses one carrier 10 in the soaking mechanism 20 to receive the product, and another first moving mechanism 30 removes the carrier 10 filled with the product from the soaking mechanism 20 to output the product.
As shown in fig. 3 to 5, the first moving mechanism 30 includes: a bracket 31 movably provided, the second moving mechanism being provided on the bracket 31; and a first bracket 32 arranged on the support 31, wherein the second moving mechanism is at least partially positioned above the first bracket 32, and the first bracket 32 is used for bearing the carrier 10. Thus, the second moving mechanism can be driven by the bracket 31 to move integrally, and the carrier 10 is carried by the first bracket 32.
In the present embodiment, the first moving mechanism 30 is at least partially located above the soaking mechanism 20, and the first moving mechanism 30 further includes: and a fourth driving part 33, wherein the bracket 31 is arranged on the fourth driving part 33, and the fourth driving part 33 is used for driving the bracket 31 to vertically move. In this way, the fourth driving portion 33 can drive the second moving mechanism to move in the vertical direction, so as to put the carrier 10 on the second moving mechanism into the soaking mechanism 20 or take the carrier out of the soaking mechanism 20.
Specifically, the first bracket 32 includes two supporting arms 321 arranged at intervals, the two supporting arms 321 are used for jointly carrying the carrier 10, and the second moving mechanism can place the product into the carrier 10 on the first bracket 32. In this way, a portion of the vehicle 10 can be supported by the two arms 321, and the gap between the two arms 321 can be used to avoid other portions of the vehicle 10.
In the present embodiment, the carrier 10 includes: a base plate 12; a side plate 13, wherein the side plate 13 surrounds the edge of the bottom plate 12 to form a containing cavity for placing a product; the supporting plates 14 are arranged on the side plates 13, the supporting plates 14 at least partially protrude out of the outer surfaces of the side plates 13, the number of the supporting plates 14 is two, the two supporting plates 14 are respectively located at two sides of the accommodating cavity, and the two supporting arms 321 are used for correspondingly bearing the lower surfaces of the two supporting plates 14 one by one. This arrangement allows the carrier 10 to be supported and moved by the engagement of the two bracket arms 321 with the two pallets 14.
Further, the bottom plate 12 and/or the side plate 13 have liquid inlet holes communicated with the receiving cavity, so that the liquid in the soaking mechanism 20 flows into the receiving cavity of the carrier 10. One of the bracket arm 321 and the support plate 14 has a first positioning hole 141, and the other of the bracket arm 321 and the support plate 14 has a first positioning pin 322, and the first positioning pin 322 can penetrate through the first positioning hole 141 to position the carrier 10. This provides a secure connection between the bracket 321 and the platform 14, preventing the carrier 10 from falling. In the present embodiment, the carrier 10 further includes a handle 15, and the handle 15 is disposed on the supporting plate 14, so that a person can conveniently hold the carrier 10 or use other equipment to transport the carrier 10.
As shown in fig. 7, the steeping mechanism 20 includes: the box body 21, the cavity of the box body 21 is used for storing liquid; baffle 22, baffle 22 are first cell body 23 and second cell body 24 with the cavity interval of box 21, and liquid in the first cell body 23 can overflow to the second cell body 24 from the upper edge of baffle 22 in, and first cell body 23 is arranged in soaking the product in the carrier 10. This allows the carrier 10 to be immersed in the first tank 23 to soak the product with the liquid in the first tank 23, and to overflow into the second tank 24 to collect when there is excess liquid in the first tank 23.
In this embodiment, the height of the lowest point of the upper edge of the partition 22 is lower than the height of the lowest point of the upper edge of the tank 21, so that the excessive liquid overflows from the upper edge of the partition 22 to the second tank 24. Specifically, the upper edge of the partition 22 may be provided in a zigzag shape. The steeping mechanism 20 further comprises: the liquid inlet pipe 25 is communicated with the first groove body 23 in a break-and-break mode; a liquid outlet pipe 26, wherein the liquid outlet pipe 26 can be connected with the second groove body 24 in an on-off mode. The liquid inlet pipe 25 is used for conveying liquid to the first trough body 23, and the liquid outlet pipe 26 is used for discharging excessive liquid in the second trough body 24.
In this embodiment, the soaking mechanism 20 further includes: and the bottom of the first groove body 23 is communicated with the pump body 27 through a pipeline, and the second groove body 24 is communicated with the pump body 27 through a pipeline. When the liquid needs to be replaced or discharged, the liquid in the first tank 23 can be conveyed into the second tank 24 through the pump 27 and then discharged to the outside through the liquid outlet pipe 26 communicated with the second tank 24. Of course, a pipeline may be provided to directly communicate the first tank 23 with the outside, and the first tank may be directly discharged when liquid discharge is required.
In this embodiment, the processing apparatus further includes: and a third moving mechanism 60 movably disposed, wherein the third moving mechanism 60 has a third operating condition for receiving the carrier 10 on the first moving mechanism 30 and a fourth operating condition for delivering the carrier 10 to the outside. Thus, after a certain amount of the film and the wafer are received in the carrier 10, the carrier 10 may be transferred to the outside by the third moving mechanism 60 to separate the film and the wafer.
As shown in fig. 8, the third moving mechanism 60 includes: a second bracket 61, movably disposed, the second bracket 61 being used for carrying the carrier 10; and a fifth driving part 62 for driving the second carriage 61 to move toward or away from the first moving mechanism 30. This makes it possible to bring the second bracket 61 close to the first moving mechanism 30 to convey the carrier 10 to the first moving mechanism 30 or to convey the carrier 10 from the first moving mechanism 30 to the second bracket 61. The vehicle 10 can be carried out or avoided from the first moving mechanism 30 by the second bracket 61 being away from the first moving mechanism 30. In the present embodiment, when the first moving mechanism 30 is located at the second operating condition and the third moving mechanism 60 is located at the third operating condition, the second bracket 61 is located below the carrier 10 on the first moving mechanism 30 to receive the carrier 10.
In the present embodiment, the third moving mechanism 60 further includes: and a guide mechanism 63, wherein the guide mechanism 63 is used for guiding the second bracket 61. The stability of the operation of the second bracket 61 can be ensured by the guiding action of the guide mechanism 63.
In the present embodiment, the fifth driving portion 62 and the guiding mechanism 63 are both located below the second bracket 61, the fifth driving portion 62 is a rodless cylinder, and the guiding mechanism 63 includes a guide rail arranged in parallel with the rodless cylinder. The fifth driving part 62 is provided as a rodless cylinder and a guide rail, so that the operation of the second bracket 61 can be stable and reliable. The fifth driving part 62 may also be provided as a lead screw or other mechanism capable of achieving linear motion. In the present embodiment, the third moving mechanism 60 further includes a connecting plate 66, and the connecting plate 66 is used to connect the second bracket 61 with the rodless cylinder and the guide rail.
In the present embodiment, the second bracket 61 has a first limiting member 64, the fifth driving portion 62 has a second limiting member 65, and the first limiting member 64 and the second limiting member 65 are in stop fit to limit the moving distance of the second bracket 61. This can avoid interference of the second bracket 61 with other parts and can accurately convey the carrier 10 to a desired position.
Specifically, one of the carrier 10 and the second bracket 61 has a second positioning hole 121, and the other of the carrier 10 and the second bracket 61 has a second positioning pin 611, and the second positioning pin 611 can be inserted into the second positioning hole 121 to position the carrier 10. Thus, the carrier 10 and the second bracket 61 can be reliably connected by the cooperation of the second positioning hole 121 and the second positioning pin 611.
As shown in fig. 1 and 2, the processing apparatus further includes: a frame 70, wherein the frame 70 has a bearing table 71, the bearing table 71 has a second avoidance port, the third moving mechanism 60 is disposed on the upper surface of the bearing table 71, the soaking mechanism 20 is located below the second avoidance port, and the first moving mechanism 30 is at least partially located above the second avoidance port; the protective cover 80 covers the rack 70, the first moving mechanism 30 and the third moving mechanism 60 are both located in the protective cover 80, the protective cover 80 is provided with a material taking port, and the material taking port is arranged corresponding to the third moving mechanism 60. The frame 70 may support other components, wherein the carrier 71 may be provided with and support the third moving mechanism 60. The protection cover 80 can protect the first moving mechanism 30, the second moving mechanism and other components, and ensure the operation safety.
To facilitate understanding of the solution of the present embodiment, the following describes the operation of the processing apparatus. The sequence of steps in the operation process is not limited, and can be adjusted according to the needs in actual use.
Loading of empty carrier 10:
the second bracket 61 of the third moving mechanism 60 has 2 stations, one is a manual carrier placing station near the material taking port, and the other is a carrier taking station of the first bracket 32. Initial state: the second bracket 61 of the third moving mechanism 60 is located at the manual carrier placing station, and the support 31 is located at the lowest position.
Step 1: manually placing the carrier 10 on the second bracket 61 of the third moving mechanism 60;
step 2: the rodless cylinder (fifth driving part 62) of the third moving mechanism 60 moves to convey the carrier 10 from the manual carrier placing station to the first bracket 32 carrier taking station;
and step 3: the support 31 is lifted to enable the first bracket 32 to support the supporting plate 14 of the carrier 10, and after the supporting, the first bracket is continuously lifted for a certain height to enable the bottom plate 12 of the carrier 10 to be separated from the second positioning pin 611 on the second bracket 61;
and 4, step 4: the rodless cylinder of the third moving mechanism 60 moves to return the second bracket 61 to the initial position;
and 5: the support 31 is lowered to the lowest position, and the carrier 10 is immersed in the water in the immersing mechanism 20;
at this time, the loading of the NG wafer can be performed after the loading of the carrier 10 is completed.
Unloading of NG wafer laden carriers 10:
initial state: the second bracket 61 of the third moving mechanism 60 is located at the manual carrier placing station, and the support 31 is located at the lowest position.
Step 1: the second bracket 61 that raises the support 31 to make the bottom plate 12 of the carrier 10 higher than the third moving mechanism 60;
step 2: the rodless cylinder of the third moving mechanism 60 moves to move the second bracket 61 from the carrier placing station to the carrier taking station;
and step 3: the support 31 is lowered to drop the base plate 12 of the carrier 10 on the second bracket 61;
and 4, step 4: the carriage 31 continues to descend, disengaging the first bracket 32 from the pallet 14 of the carrier 10;
and 5: the rodless cylinder of the third moving mechanism 60 moves to move the carrier 10 to the manual carrier taking and loading station;
step 6: the person manually removes the carrier 10 from the second bracket 61.
At this time, the unloading of the carriers 10 filled with NG wafers is completed, and empty carriers 10 can be loaded.
NG wafer loading process into carrier 10:
initial state: the bracket 31 is located at the lowest position; the first bracket 32 already holds the carrier 10; the guide rod of the horizontal guide rod cylinder (the second driving part 43) is in an extending state; the guide rod of the vertical guide rod cylinder (the first driving part 42) does not extend; the first tank 23 is filled with water, the water level is lower than the fork 41, and the part of the carrier 10 below the fork 41 is soaked in the water.
Step 1: the manipulator conveys the NG wafer to the upper part of the supporting fork 41 of the supporting and carrying mechanism 40;
step 2: the bracket 31 is lifted, and after the supporting fork 41 contacts the bottom of the NG wafer, the supporting fork is continuously lifted to separate the NG wafer from the manipulator;
and step 3: the manipulator leaves the fork 41;
and 4, step 4: the carriage 31 is lowered to the lowest position;
and 5: the guide rod of the vertical cylinder with the guide rod extends and moves, the supporting fork 41 moves downwards, and the NG wafer is positioned in the carrier 10 and is immersed in water;
step 6: the guide rod of the horizontal cylinder with the guide rod retracts to drive the supporting fork 41 to move towards the direction of the stop part 11 of the carrier 10, the NG wafer is separated from the supporting fork 41 because one side of the NG wafer is stopped by the stop part 11 in the moving process, and the NG wafer slowly moves downwards to fall onto the bottom plate 12 of the carrier 10 due to the resistance of gravity and water;
and 7: the guide rod of the horizontal cylinder with the guide rod extends out, and the guide rod of the vertical cylinder with the guide rod retracts to return to the initial state.
And repeating the steps to load the next NG wafer, wherein the NG wafer is stacked with the previous NG wafer. After NG wafers are stacked to a certain number, unloading of carriers 10 full of NG wafers can be performed, and this number can be set according to the actual requirements of the equipment.
By applying the technical scheme of the invention, the carrier 10, the soaking mechanism 20, the first moving mechanism 30, the second moving mechanism and the third moving mechanism 60 are arranged in the processing device, and the processing device can be used for processing films and wafers which are not completely separated after etching, so that the films and wafers which are not completely separated can be automatically and intensively received and processed, the existing manual processing mode can be replaced, the processing efficiency is improved, and the films can be prevented from being damaged.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In the description of the present invention, it is to be understood that the orientation or positional relationship indicated by the orientation words such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, bottom", etc. are usually based on the orientation or positional relationship shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse description, these orientation words do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be considered as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
Claims (17)
1. A processing apparatus, comprising:
a carrier (10) for placing a product;
a steeping mechanism (20), the steeping mechanism (20) being capable of storing a liquid, the steeping mechanism (20) being for steeping the product;
a first movement mechanism (30) movably arranged, the first movement mechanism (30) having a first condition of placing the carrier (10) at least partially into the soaking mechanism (20) and a second condition of taking the carrier (10) out of the soaking mechanism (20);
a second moving mechanism movably arranged on the first moving mechanism (30), wherein the second moving mechanism comprises a carrying mechanism (40), and the carrying mechanism (40) is used for carrying and moving the product to place the product into the carrier (10).
2. The processing device according to claim 1, wherein the carriage mechanism (40) comprises:
a pallet fork (41), said pallet fork (41) being adapted to receive and carry said product;
the first driving part (42), the support fork (41) is arranged on the first driving part (42), and the first driving part (42) has a fifth working condition that the support fork (41) is moved to the outside of the carrier (10) and a sixth working condition that the support fork (41) is moved to the inside of the carrier (10).
3. The processing device according to claim 2, wherein the carriage mechanism (40) further comprises:
the first driving part (42) is arranged on the second driving part (43), and the second driving part (43) is used for driving the supporting fork (41) to move so as to separate a product on the supporting fork (41) from the supporting fork (41).
4. The processing device according to claim 3, wherein the first driving portion (42) is used for driving the supporting fork (41) to move vertically, the second driving portion (43) is used for driving the supporting fork (41) to move horizontally,
the carrier (10) comprises a feeding port positioned at the upper part, a first avoidance port positioned at the side surface and a stop piece (11), wherein the stop piece (11) is positioned at the first avoidance port, and the stop piece (11) is used for stopping the product so as to separate the product from the supporting fork (41);
the first moving mechanism (30) is in the first working condition, the first driving portion (42) is in the sixth working condition, the second driving portion (43) can drive the supporting fork (41) to move towards the outside of the carrier (10) through the first avoidance port, and the product is left inside the carrier (10) through the stop piece (11).
5. The processing device according to claim 4, wherein the carrier (10) further comprises a bottom plate (12) and a side plate (13) surrounding the edge of the bottom plate (12), the stop member (11) is connected with the top surface of the bottom plate (12), the number of the support forks (41) is two, the two support forks (41) are arranged on the first driving portion (42) at intervals, and the interval between the two support forks (41) is larger than the width of the stop member (11).
6. The processing apparatus according to claim 1,
the number of the second moving mechanisms is multiple, the number of the first moving mechanisms (30) is one, and the second moving mechanisms are arranged on the first moving mechanisms (30) side by side; or the like, or, alternatively,
the number of the second moving mechanisms is multiple, the number of the first moving mechanisms (30) is multiple, and the second moving mechanisms and the first moving mechanisms (30) are arranged in a one-to-one correspondence mode.
7. The processing device according to claim 1, wherein the first moving mechanism (30) comprises:
a bracket (31) movably arranged, the second moving mechanism being arranged on the bracket (31);
a first carriage (32) arranged on the support (31), the second movement mechanism being at least partially located above the first carriage (32), the first carriage (32) being for carrying the vehicle (10).
8. The processing device according to claim 7, wherein the first moving mechanism (30) is located at least partially above the soaking mechanism (20), the first moving mechanism (30) further comprising:
the support (31) is arranged on the fourth driving portion (33), and the fourth driving portion (33) is used for driving the support (31) to vertically move.
9. The handling device according to claim 7, wherein the first carriage (32) comprises two spaced-apart cradles (321), the two cradles (321) being intended to jointly carry the carrier (10), the second movement mechanism being able to place the products in the carrier (10) on the first carriage (32).
10. The processing device according to claim 9, characterized in that the carrier (10) comprises:
a base plate (12);
a side plate (13), wherein the side plate (13) surrounds the edge of the bottom plate (12) to form a containing cavity for placing the product;
the supporting plates (14) are arranged on the side plates (13), at least part of each supporting plate (14) protrudes out of the outer surfaces of the side plates (13), the number of the supporting plates (14) is two, the two supporting plates (14) are respectively located on two sides of the accommodating cavity, and the two supporting arms (321) are used for bearing the lower surfaces of the two supporting plates (14) in a one-to-one correspondence mode.
11. The processing apparatus according to claim 10, wherein the bottom plate (12) and/or the side plate (13) has/have an inlet hole communicating with the receiving cavity, one of the bracket arm (321) and the pallet (14) has a first positioning hole (141), and the other of the bracket arm (321) and the pallet (14) has a first positioning pin (322), wherein the first positioning pin (322) can be inserted into the first positioning hole (141) to position the carrier (10).
12. The processing device according to claim 1, wherein the soaking mechanism (20) comprises:
a tank (21), the cavity of the tank (21) is used for storing liquid;
baffle (22), baffle (22) will the cavity interval of box (21) is first cell body (23) and second cell body (24), liquid in first cell body (23) can be followed the last border of baffle (22) overflows in second cell body (24), first cell body (23) are arranged in soaking the product in carrier (10).
13. The processing apparatus according to claim 12, wherein the soaking mechanism (20) further comprises:
the bottom of the first groove body (23) is communicated with the pump body (27) through a pipeline, and the second groove body (24) is communicated with the pump body (27) through a pipeline.
14. The processing apparatus according to claim 12, characterized in that the processing apparatus further comprises:
the third moving mechanism (60) is movably arranged, and the third moving mechanism (60) is provided with a third working condition for receiving the carrier (10) on the first moving mechanism (30) and a fourth working condition for conveying the carrier (10) to the outside.
15. The processing device according to claim 14, wherein the third moving mechanism (60) comprises:
a second bracket (61) movably arranged, the second bracket (61) being used for carrying the carrier (10);
and a fifth driving unit (62) for driving the second carriage (61) to move in a direction toward or away from the first moving mechanism (30).
16. The processing device according to claim 15, wherein the third moving mechanism (60) further comprises:
a guide mechanism (63), the guide mechanism (63) being used for guiding the second bracket (61).
17. Handling device according to claim 15, wherein one of said carrier (10) and said second bracket (61) has a second positioning hole (121) and the other of said carrier (10) and said second bracket (61) has a second positioning pin (611), said second positioning pin (611) being able to be inserted into said second positioning hole (121) to position said carrier (10).
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CN201810996915.0A CN110875210B (en) | 2018-08-29 | 2018-08-29 | Processing device |
PCT/CN2018/117212 WO2020042395A1 (en) | 2018-08-29 | 2018-11-23 | Processing device |
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CN201810996915.0A CN110875210B (en) | 2018-08-29 | 2018-08-29 | Processing device |
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CN107346753A (en) * | 2016-05-06 | 2017-11-14 | 亿力鑫***科技股份有限公司 | soaking device |
WO2018090574A1 (en) * | 2016-11-21 | 2018-05-24 | 北京北方华创微电子装备有限公司 | Wafer transporting apparatus, processing chamber, mechanical arm, semiconductor apparatus, and wafer transporting method |
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JP2000124285A (en) * | 1998-10-13 | 2000-04-28 | Anelva Corp | Auto-loader and substrate processor using the same |
JP2003151968A (en) * | 2001-11-13 | 2003-05-23 | Dainippon Screen Mfg Co Ltd | Thin-film forming apparatus, film-supplying mechanism, film-accommodating cassette, transfer mechanism and transfer method |
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