CN110873667A - Bending performance testing device and bending performance testing method - Google Patents
Bending performance testing device and bending performance testing method Download PDFInfo
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- CN110873667A CN110873667A CN201811004172.0A CN201811004172A CN110873667A CN 110873667 A CN110873667 A CN 110873667A CN 201811004172 A CN201811004172 A CN 201811004172A CN 110873667 A CN110873667 A CN 110873667A
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- 238000005452 bending Methods 0.000 title claims abstract description 166
- 238000012360 testing method Methods 0.000 title claims abstract description 63
- 230000007306 turnover Effects 0.000 claims abstract description 72
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000000523 sample Substances 0.000 claims description 74
- 238000011056 performance test Methods 0.000 claims description 40
- 238000003825 pressing Methods 0.000 claims description 12
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
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- 238000010586 diagram Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/32—Investigating strength properties of solid materials by application of mechanical stress by applying repeated or pulsating forces
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N3/02—Details
- G01N3/04—Chucks
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0001—Type of application of the stress
- G01N2203/0005—Repeated or cyclic
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/0014—Type of force applied
- G01N2203/0023—Bending
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
- G01N2203/02—Details not specific for a particular testing method
- G01N2203/04—Chucks, fixtures, jaws, holders or anvils
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The invention provides a bending performance testing device, which is used for testing the bending performance of a semi-flexible or flexible circuit board and comprises a sample platform, a turnover mechanism, a control system and a bending positioning mechanism, wherein the sample platform is used for fixing one end of the semi-flexible or flexible circuit board, the bending positioning mechanism is fixed on the sample platform, the turnover mechanism is pivoted on the bending positioning mechanism, the turnover mechanism is provided with a turnover clamp for fixing the other end of the semi-flexible or flexible circuit board, the turnover mechanism drives the other end of the semi-flexible or flexible circuit board to turn and bend around the bending positioning mechanism, the turnover clamp is connected with an elastic piece, the elastic piece can adjust the tension of the turnover clamp on the semi-flexible or flexible circuit board, and the control system controls the operation. The semi-flexible or flexible circuit board can be well contacted with the bending positioning mechanism by adjusting the elastic piece, and the contact between the semi-flexible or flexible circuit board and the bending positioning mechanism can be ensured in the overturning process, so that the test result of the bending performance is accurate and effective.
Description
Technical Field
The invention relates to the field of testing, in particular to a device and a method for testing the bending performance of a printed board.
Background
At present, the bending performance test of semi-flexible or flexible circuit boards uses folding and bending resistant samples, the samples are tensioned by hands and bent along a circular mandrel with a certain diameter, then the samples are flattened, and then a universal meter is used for testing whether the lines of the samples are broken or not, and the bending performance condition of the samples is judged by repeating the operation until the lines in the samples are broken. Because no instrument and method for testing the bending performance of the semi-flexible or flexible circuit board exist in the market at present, the manual operation has uneven tensile force, and the authenticity of the bending performance of the semi-flexible or flexible circuit board cannot be evaluated.
Therefore, it is desirable to provide a new testing apparatus or method for testing the bending performance of semi-flexible or flexible circuit boards to solve the above-mentioned problems of manual operation.
Disclosure of Invention
In order to achieve the above object, the present invention firstly provides a bending performance testing apparatus for testing the bending performance of a semi-flexible or flexible circuit board, comprising a sample platform, a turnover mechanism, a control system and a bending positioning mechanism, the sample platform fixes one end of the semi-flexible or flexible circuit board, the bending positioning mechanism is fixed on the sample platform, the turnover mechanism is pivoted with the bending positioning mechanism and is provided with a turnover clamp for fixing the other end of the semi-flexible or flexible circuit board, and the turnover mechanism drives the other end of the semi-flexible or flexible circuit board to turn over and bend around the bending positioning mechanism, the turnover fixture is connected with an elastic piece, the elastic piece can adjust the tension of the turnover fixture on the semi-flexible or flexible circuit board, and the control system controls the operation of the turnover mechanism and records the bending times.
The bending performance testing device is provided with the elastic part on the turnover mechanism, and the elastic part can adjust the tension of the turnover fixture to the semi-flexible or flexible circuit board, namely, the tension value of the turnover fixture to the semi-flexible or flexible circuit board can be larger through adjusting the elastic part, so that the contact between the semi-flexible or flexible circuit board and the bending positioning mechanism can be better, the contact between the semi-flexible or flexible circuit board and the bending positioning mechanism can be ensured in the turnover process of the turnover mechanism, and the test result of the bending performance is accurate and effective.
Further, the sample platform is provided with a fixing clamp, and the fixing clamp is used for fixing one end of the semi-flexible or flexible circuit board. The fixture may be a pressure plate that is secured by bolts to secure the semi-flexible or flexible circuit board to be tested to the sample platform. Furthermore, the sample platform is also provided with a lifting mechanism, the lifting mechanism is connected with the fixing clamp and adjusts the position of the fixing clamp, and the position of the fixing clamp can be adjusted along the vertical direction through the lifting mechanism, so that the semi-flexible or flexible circuit board to be tested can contact with the bending positioning mechanism.
Furthermore, the turnover mechanism is further provided with a turnover arm and a fixed plate fixedly connected with the turnover arm, the turnover arm is pivoted to the bending positioning mechanism and drives the fixed plate to turn around the bending positioning mechanism together, one end of the elastic piece is fixed to the other end of the fixed plate, the turnover arm is pivoted to the bending positioning mechanism and can turn over 0-180 degrees, that is, the semi-flexible or flexible circuit board to be tested, which is fixed to the turnover mechanism, is taken as a base point, and can move from a 180-degree flat state to a 0-degree folded state, and it is needless to say that the semi-flexible or flexible circuit board can be folded in half or can be folded in a staggered manner when being bent.
Furthermore, the middle part of the fixing plate is provided with an accommodating cavity, and the elastic part and the overturning clamp are accommodated in the accommodating cavity. The turnover fixture is provided with a movable plate and a pressing plate which can move in the accommodating cavity, the other end of the elastic piece is fixed on the movable plate, the pressing plate presses and holds the semi-flexible or flexible circuit board and is fixed on the movable plate, and the pressing plate can be fixed on the movable plate through bolts.
Furthermore, the movable plate is provided with a mounting hole, and the other end of the elastic element penetrates through the mounting hole and is fixed on the movable plate, so that the length of the elastic element can be adjusted from the mounting hole to adjust the tension of the overturning clamp on the semi-flexible or flexible circuit board. The movable plate is provided with a limiting groove at the edge of the mounting hole, the other end of the elastic piece is provided with a limiting piece, the limiting piece is clamped in the limiting groove, when the pulling force needs to be adjusted, the limiting piece is pulled to be separated from the limiting groove to move the movable plate, and after adjustment, the limiting piece retracts into the limiting groove to fix the position of the movable plate.
Furthermore, the bending positioning mechanism is provided with a fixing piece fixed on the sample platform and a bending shaft fixed on the fixing piece, and the bending shaft is a cylinder or a sheet. If the semi-flexible or flexible circuit board to be tested is thicker, the bending shaft with a cylindrical structure is preferably adopted, and if the semi-flexible or flexible circuit board to be tested is thinner, the bending shaft with a sheet structure is preferably adopted, so that the semi-flexible or flexible circuit board to be tested can be bent more easily, and the semi-flexible or flexible circuit board to be tested has better contact with the bending positioning mechanism.
Furthermore, the control system comprises a liquid crystal touch screen, an alarm and an emergency stop button, various parameters of the device can be set through the liquid crystal touch screen, and the alarm can detect breakage, alarm and stop. When the emergency stop button is in emergency, the emergency stop button can be quickly pressed to achieve the protection purpose.
The invention also provides a bending performance testing method, which comprises the following steps in sequence:
s1, manufacturing a semi-flexible or flexible circuit board into a bending performance test sample with a plurality of lead wires;
s2, fixing one end, provided with a lead, of the bending performance test sample on a sample platform of the bending performance test device and electrically communicating with a control system, and fixing the other end of the bending performance test sample on a turnover mechanism of the bending performance test device;
s3, adjusting the position of the sample platform to enable the bending performance test sample to be in contact with a bending positioning mechanism in the bending performance test device, and adjusting an elastic piece on the turnover mechanism to enable a tensile value of a turnover fixture on the turnover mechanism to the bending performance test sample to meet the requirement that the bending performance test sample is always in contact with the bending positioning mechanism when being bent;
s4, setting parameters of a control system, starting a test to turn over the turnover mechanism and drive the other end of the bending performance test sample to turn over and bend around the bending positioning mechanism;
s5, the bending performance test sample line is broken, and the control system stops and automatically records the bending times of the bending performance test sample.
According to the bending performance testing method, the contact between the bending performance testing sample and the bending positioning mechanism can be tighter by adjusting the position of the sample platform and adjusting the elastic piece on the turnover mechanism, so that the bending performance testing sample can be always ensured to contact the bending positioning mechanism when being bent, and therefore an effective and accurate bending performance data value can be obtained.
Further, the number of the leads in the step S1 is the same as the number of the probes in the control system, and each of the leads is in contact with each of the corresponding probes in the step S2 to achieve electrical communication between the bending performance test sample and the control system, although the probes may also be fixed on a fixing clamp of the sample platform.
Further, in the step S3, the position of the sample platform is adjusted by the lifting mechanism of the sample platform, so that the bending performance test sample contacts with the bending positioning mechanism.
Drawings
Fig. 1 is a schematic view of an embodiment of a bending performance testing apparatus according to the present invention before adjusting tension.
Fig. 2 is a schematic view of the bending performance testing apparatus of fig. 1 after adjusting the tensile force.
Fig. 3 is a variation of the bending performance testing apparatus of fig. 2.
Fig. 4 is a schematic view of the bending performance testing apparatus of fig. 2 when it is turned over by 90 °.
Fig. 5 is a front view of the bending performance testing apparatus of fig. 4.
Fig. 6 is a top view of the bending performance testing apparatus of fig. 4.
Fig. 7 is a right side view of the bending performance testing apparatus of fig. 4.
Fig. 8 is a sectional view of the bending property testing apparatus of fig. 4.
Fig. 9 is an enlarged view of a circled portion in fig. 1.
FIG. 10 is a schematic view of a sample in the bending property test method of the present invention.
Description of the reference symbols:
1-sample platform 2212-spacing groove
11-lifting mechanism 222-pressing plate
12-stationary clamp 23-spring
2-tilting mechanism 231-limit piece
21-overturning wall 24-fixing block
22-overturning clamp 241-accommodating cavity
221-moving block 3-control system
2211-mounting hole 31-liquid crystal touch screen
32-scram button 42-bending shaft
33-alarm 6-semi-flexible or flexible circuit board
4-bending tool 60-lead wire
41-fixing piece
Detailed Description
The technical solutions of the present invention are further described below with reference to the following detailed description and the accompanying drawings, but the present invention is not limited thereto.
As shown in fig. 1, a bending performance testing apparatus 100 according to an embodiment is used for testing bending performance of a semi-flexible or flexible circuit board 6, and includes a sample platform 1, a turning mechanism 2, a control system 3, and a bending positioning mechanism 4, where the semi-flexible or flexible circuit board 6 is fixed to the sample platform 1 and the turning mechanism 2, the turning mechanism 2 can adjust a tensile force of the semi-flexible or flexible circuit board 6 (as shown in fig. 2, a state diagram of the bending performance testing apparatus after adjusting the tensile force), and drive the semi-flexible or flexible circuit board 6 to turn over and bend around the bending positioning mechanism 4 (as shown in fig. 4 to 8, a state of the semi-flexible or flexible circuit board 6 being bent by 90 °), and the control system 3 controls operation of the turning mechanism 2 and records bending.
As shown in fig. 1 to 8, the sample platform 1 has a lifting mechanism 11 and a fixing clamp 12, the fixing clamp 12 fixes one end of the semi-flexible or flexible circuit board 6, in operation, the fixing clamp 12 may be a pressing plate with a bolt assembly, one end of the semi-flexible or flexible circuit board 6 is fixed to the sample platform 1 through the pressing plate and the bolt assembly, and in order to electrically connect with the control system 3, a probe (not shown) in the control system 3 may be disposed in the sample platform 1 and contact with the semi-flexible or flexible circuit board 6. The lifting mechanism 11 is located below the fixing clamp 12 and connected to the fixing clamp 12, and the lifting mechanism 11 can adjust the position of the fixing clamp 12 along the up-down direction so as to make the semi-flexible or flexible circuit board 6 to be tested contact with the bending and positioning mechanism 4.
Continuing to refer to fig. 1-8, the bending positioning mechanism 4 is fixed to the sample platform 1, the bending positioning mechanism 4 has a fixing member 41 fixed to the sample platform 1 and a bending shaft 42 fixed to the fixing member 41, the bending shaft 42 may be a cylinder (as shown in fig. 1-2 and 4), and the bending shaft 42 of the cylinder is beneficial to the bending performance test of the thicker semi-flexible or flexible circuit board; the bending axis 42 may also be a thin sheet (as shown in fig. 3), and the bending axis 42 of the thin sheet structure facilitates testing of thinner semi-flexible or flexible circuit boards.
Continuing to fig. 1-8, the turnover mechanism 2 has a turnover wall 21, a turnover fixture 22, an elastic member 23, and a fixing block 24. The number of the turning walls 21 is two, and the two turning walls are respectively pivoted to the fixing members 41 on the bending positioning mechanism 4, the turning walls 21 are pivoted to the fixing members 41 and drive the fixing plate 24 to turn around the bending positioning mechanism 4, and the turning angle can be 0-180 °. The fixed block 24 is fixedly connected with the two overturning walls 21, an accommodating cavity 241 is formed in the fixed block 24, and the overturning fixture 22 and the elastic piece 23 are accommodated in the accommodating cavity 241. The reverse clamp 22 fixes the other end of the semi-flexible or flexible circuit board 6, and has a moving plate 221 and a pressing plate 222 that can move in the accommodating cavity 241, the pressing plate 222 presses and holds the other end of the semi-flexible or flexible circuit board 6 and fixes to the moving plate 221, the pressing plate 222 can fix the other end of the semi-flexible or flexible circuit board 6 to the moving plate 221 by other methods such as bolts, and the moving plate 221 is provided with a mounting hole 2211. One end of the elastic member 23 is fixed to the fixed plate 24, and the other end thereof is fixed to the moving plate 221 through the mounting hole 2211. Specifically, as shown in fig. 9, the edge of the mounting hole 2211 of the moving plate 221 is provided with a limit groove 2212, the end of the other end of the elastic member 23 is provided with a limit member 231, the limit member 231 is clamped in the limit groove 2212 to fix the elastic member 23 to the moving plate 221, the elastic member 23 may be a compression spring, and the spring is set to not elastically deform due to the overturning of the overturning wall 21, and only elastically deform when pulled by a large external force, which means that the tensile value of the overturning fixture 2 on the semi-flexible or flexible circuit board 6 is larger by adjusting the elastic member 23, so that the contact between the semi-flexible or flexible circuit board 6 and the bending positioning mechanism 4 is better, the contact between the two is ensured in the overturning process of the overturning mechanism 2, and the test result of the bending performance is accurate and effective.
Continuing to be shown in fig. 1-8, the control system 3 comprises a liquid crystal touch screen 31, an alarm 33 and an emergency stop button 32, various parameters of the device can be set through the liquid crystal touch screen 31, and the alarm 33 can detect breakage, alarm and stop. The emergency stop button 32 is used for protecting the user in case of emergency by quickly pressing the button, and the control system 3 includes a driving source (not shown) for driving the turnover mechanism 2 to turn over, so as to control the operation of the turnover mechanism 2, and meanwhile, the control system 3 is electrically connected to one end of the semi-flexible or flexible circuit board 6, so as to record the number of times of bending.
The bending performance testing method of the present invention can be used for testing by using the above-mentioned bending performance testing device, so that the bending performance testing method of the present invention is further explained by using this device.
A method for testing the bending performance of a semi-flexible or flexible circuit board 6, comprising the steps of:
s1, manufacturing a semi-flexible or flexible circuit board 6 into a bending performance test sample with a plurality of lead wires 60 (shown in figure 10);
s2, fixing one end of the bending performance test sample with the lead 60 on a sample platform 1 of the bending performance test device 100, wherein the lead 60 is in contact with and electrically communicated with a probe in the control system 3, and the other end of the lead 60 is fixed on a turnover mechanism 2 of the bending performance test device 100;
s3, adjusting the position of the sample platform 1 through the lifting mechanism 11 of the sample platform 1 to enable the bending performance test sample to be in contact with the bending positioning mechanism 4, adjusting the elastic part 23 on the turnover mechanism 2 to enable the tension value of the turnover fixture 22 on the turnover mechanism 2 to the bending performance test sample to be capable of meeting the requirement that the bending performance test sample is always in contact with the bending positioning mechanism 4 when being bent, and specifically, pulling out the limiting part 231 of the elastic part 23 from the limiting hole 2212 and pushing the moving block 221 to move in the direction away from the bending positioning mechanism 4 (i.e. moving the moving block 221 from the position in figure 1 to the position in figure 2), and fixing the limiting part 231 in the limiting hole 2212;
s4, setting parameters of the control system 3, starting a test to turn over the turnover mechanism 2 and drive the other end of the bending performance test sample to turn over and bend around the bending positioning mechanism 4, and operating the parameter setting of the control system 3 through the liquid crystal touch screen 31;
s5, when the system 3 to be controlled detects the line fracture of the bending performance test sample, the control system 3 stops and automatically records the bending times of the bending performance test sample, so that the bending performance condition of the sample is evaluated.
Of course, the above description only describes the bending performance testing method of the present invention by this device, but does not limit the protection scope of the bending performance testing method of the present invention. The device that can be used in the bending performance testing method of the present invention is not limited to the bending performance testing device with the specific structure disclosed in fig. 1 to 9, and the testing method thereof should be within the scope of the bending performance testing method of the present invention as long as the testing method does not depart from the spirit of the bending performance testing method of the present invention.
Claims (13)
1. A bending performance testing device is used for testing the bending performance of a semi-flexible or flexible circuit board, it is characterized by comprising a sample platform, a turnover mechanism, a control system and a bending positioning mechanism, wherein the sample platform fixes one end of the semi-flexible or flexible circuit board, the bending positioning mechanism is fixed on the sample platform, the turnover mechanism is pivoted on the bending positioning mechanism, the turnover mechanism is provided with a turnover clamp for fixing the other end of the semi-flexible or flexible circuit board, and the turnover mechanism drives the other end of the semi-flexible or flexible circuit board to turn over and bend around the bending positioning mechanism, the turnover fixture is connected with an elastic piece, the elastic piece can adjust the tension of the turnover fixture on the semi-flexible or flexible circuit board, and the control system controls the operation of the turnover mechanism and records the bending times.
2. The bending property test apparatus according to claim 1, wherein the sample stage has a fixing jig thereon, the fixing jig fixing one end of the semi-flexible or flexible wiring board.
3. The bending performance testing device according to claim 2, wherein the sample platform further comprises a lifting mechanism, and the lifting mechanism is connected with the fixing clamp and adjusts the position of the fixing clamp.
4. The bending performance testing device according to claim 1, wherein the turnover mechanism further comprises a turnover arm and a fixing plate fixedly connected with the turnover arm, the turnover arm is pivoted to the bending positioning mechanism and drives the fixing plate to turn around the bending positioning mechanism, and one end of the elastic member is fixed to the fixing plate and the other end of the elastic member is fixed to the turnover fixture.
5. The bending performance testing device according to claim 4, wherein an accommodating cavity is formed in the middle of the fixing plate, and the elastic member and the overturning fixture are accommodated in the accommodating cavity.
6. The bending performance testing device according to claim 5, wherein the turnover fixture has a moving plate and a pressing plate which can move in the accommodating cavity, the other end of the elastic member is fixed to the moving plate, and the pressing plate presses and holds one end of the semi-flexible or flexible circuit board and is fixed to the moving plate.
7. The bending performance testing device according to claim 6, wherein the moving plate is provided with a mounting hole, and the other end of the elastic member penetrates through the mounting hole and is fixed on the moving plate.
8. The bending performance testing device according to claim 7, wherein the movable plate is provided with a limiting groove at an edge of the mounting hole, and the other end of the elastic member is provided with a limiting member, and the limiting member is clamped in the limiting groove.
9. The bending performance testing apparatus according to claim 1, wherein the bending positioning mechanism has a fixing member fixed to the sample stage, and a bending shaft fixed to the fixing member.
10. The bending performance test apparatus according to claim 9, wherein the bending axis is a cylinder or a sheet.
11. A bending performance testing method is characterized by comprising the following steps in sequence:
s1, manufacturing a semi-flexible or flexible circuit board into a bending performance test sample with a plurality of lead wires;
s2, fixing one end, provided with a lead, of the bending performance test sample on a sample platform of the bending performance test device and electrically communicating with a control system, and fixing the other end of the bending performance test sample on a turnover mechanism of the bending performance test device;
s3, adjusting the position of the sample platform to enable the bending performance test sample to be in contact with a bending positioning mechanism in the bending performance test device, and adjusting an elastic piece on the turnover mechanism to enable a tensile value of a turnover fixture on the turnover mechanism to the bending performance test sample to meet the requirement that the bending performance test sample is always in contact with the bending positioning mechanism when being bent;
s4, setting parameters of a control system, starting a test to turn over the turnover mechanism and drive the other end of the bending performance test sample to turn over and bend around the bending positioning mechanism;
s5, the bending performance test sample line is broken, and the control system stops and automatically records the bending times of the bending performance test sample.
12. The method of claim 11, wherein the number of the leads in step S1 is equal to the number of the probes in the control system, and each of the leads is in contact with each of the probes in step S2 to electrically connect the bending performance test specimen to the control system.
13. The bending performance testing method according to claim 11, wherein the bending performance testing sample is brought into contact with the bending positioning mechanism by adjusting the position of the sample platform by the lifting mechanism of the sample platform in step S3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811004172.0A CN110873667B (en) | 2018-08-30 | Bending performance testing device and bending performance testing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811004172.0A CN110873667B (en) | 2018-08-30 | Bending performance testing device and bending performance testing method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110873667A true CN110873667A (en) | 2020-03-10 |
| CN110873667B CN110873667B (en) | 2024-08-13 |
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| CN112414875A (en) * | 2020-11-10 | 2021-02-26 | 天津富通光缆技术有限公司滨海新区分公司 | Test method and device for evaluating L-direction bending performance of long axis of butterfly-shaped optical cable |
| CN113237776A (en) * | 2021-05-31 | 2021-08-10 | 青岛中和聚氨酯材料有限公司 | Polyurethane high-temperature illumination deformation detection device and detection method thereof |
| CN116337649A (en) * | 2023-05-29 | 2023-06-27 | 云南滇坡机械设备有限公司 | Automobile anti-collision beam bending test device |
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| CN116337649A (en) * | 2023-05-29 | 2023-06-27 | 云南滇坡机械设备有限公司 | Automobile anti-collision beam bending test device |
| CN116337649B (en) * | 2023-05-29 | 2024-04-12 | 苏州首测检测技术有限公司 | Automobile anti-collision beam bending test device |
| CN117330417A (en) * | 2023-10-18 | 2024-01-02 | 响水县宝吉纺织有限公司 | Pulling force fuzzing integrated testing machine for colored spun yarn |
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