CN110870051A - 用于在真空中拾放电子部件的工艺 - Google Patents

用于在真空中拾放电子部件的工艺 Download PDF

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CN110870051A
CN110870051A CN201880046083.4A CN201880046083A CN110870051A CN 110870051 A CN110870051 A CN 110870051A CN 201880046083 A CN201880046083 A CN 201880046083A CN 110870051 A CN110870051 A CN 110870051A
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迈克尔·斯克鲁格斯
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Abstract

在其中切割有对位孔的片材被安装到托盘的表面上，使得所述片材的对位孔被衬套的外径保持拉紧，同时在多个制造工艺中，由对位销使用所述衬套的内径销轴以提供对所述片材的对位。一种制造工艺用于在拾放操作期间将电路阵列放置在具有粘合剂的片材上，在所述拾放操作中，在对所述电路阵列的放置期间使用真空以使粘合层与所述电路阵列之间的气泡最少。

Description

用于在真空中拾放电子部件的工艺
技术领域
本申请属于涉及薄柔性片材的制造工艺领域，并且更具体地，涉及对具有包含在薄正面片材和薄背面片材内的电子部件的卡的制造。
背景技术
现如今，所制造的***、借记卡和签帐卡通常包括EMV芯片，并且需要能够高效地制造具有仍符合卡发行组织所要求的严格质量控制标准的电子部件的此类卡。
发明内容
本发明总体上涉及一种用于制造层压制品的工艺，其中，将其中切割有对位孔的片材安装到托盘的表面上，使得对位孔被衬套的外径保持拉紧，同时在多个加工步骤期间或在多个加工站处，由对位销使用衬套的内径销轴以提供对片材的对位。一个加工站是将电路阵列放置在具有粘合剂的片材上的拾放步骤，并且在对该电路阵列的放置期间使用真空以使粘合层与电路阵列之间的气泡最少。
因此，本发明的主要目的是提供一种用于制品的改进的制造工艺，在该工艺中，将电路阵列安装到薄柔性片材上。
对于本领域技术人员来说，结合下文阐述的附图和具体实施方式，本发明的这个及进一步的目的和优点将是显而易见的。
附图说明
图1A展示了可用于本发明的托盘，而图1B是图1A的横截面视图。
图2展示了被安装到图1的托盘的薄片材，其中，电路阵列被放置在该片材的顶部上，而图2A是图2的横截面。
图3展示了来自图2的电路阵列。
图4A至图4E展示了拾取操作的步骤，而图5A至图5F展示了放置操作的步骤，这两种操作都是拾取电路阵列并且将其放置在片材的顶部上的步骤的一部分，图2中展示了这两种操作的结果。
具体实施方式
本发明涉及制造工艺，并且在特别优选的实施例中，涉及能够制造满足各种认证标准的卡(诸如必须满足ISO/IEC 7810识别卡.物理特性的识别卡)的制造工艺。另外，具有磁条的卡必须满足ISO/IEC 7811的部分；用于金融交易的卡必须满足ISO/IEC 7813，具有集成电路的带触点的卡必须满足ISO/IEC 7816-1，并且邻近卡必须满足ISO/IEC 14443-1。所有这些卡都可以根据本发明的工艺来制造，本发明的工艺还适用于任何其他工艺，在这些工艺中，至少一个薄片材(例如3mil的片材)被用作在多个加工步骤期间制品被构建在其上的层，并且片材在各种加工步骤之间移动，在这些加工步骤中，精确对准对于工艺控制非常关键。因此，本发明还可用于制造层压芯，所述层压芯然后可以用在用于制造刚刚描述的卡的单独制造操作中。
根据本发明，通过位于托盘中的至少两个(并且优选为4个)衬套的外径来拉紧一个或多个薄片材。在整个工艺中都使用衬套来使片材对位，而不必再访问片材的对位孔。在后续步骤中，衬套的内径在各个组装步骤中用于接纳对位销，从而确保片材的正确对位。片材保持在托盘上，直到诸如卡等各个制品被从阵列上切下。使用衬套的内径还允许进行非常精确的对位，因为其不同于片材上的孔，不会发生变化或变得宽松。
现在将通过参考用于制造具有正面、背面和必须放置在卡的至少一个面上的嵌入式电子器件的支付卡等的特别优选的实施例来描述本发明。用于制造这种卡的工艺可以通常被描述为具有以下步骤或操作：
步骤1：预先印刷的顶部片材和底部片材(通常为3mm厚)被在片材上切割出对位孔、以及电子器件所需的任何孔。每个片材都在其中具有一个或多个(例如，6个)卡阵列。
步骤2：通过位于托盘中的至少两个(并且优选为4个)衬套的外径来拉紧每个片材。在其余工艺步骤中始终使用衬套来使片材对位，而不必再访问片材的对位孔。在后续步骤中，衬套的内径在各个组装步骤中用于接纳对位销，从而确保片材的正确对位。片材保持在托盘上，直到各个卡被从阵列上切下。
步骤3：将具有背面片材的托盘移至站，在该站处，UV粘合剂被丝网印刷到顶部片材的背面上。UV粘合剂可以被湿气固化或热固化。湿气固化粘合剂将立即开始固化，并仅由空气中的湿气继续进行固化。
步骤4：使来自步骤3的托盘经受发起初步聚合以使粘合剂粘结的UV处理。
步骤5：将来自步骤4的托盘移至拾放站。将其上由所有电子器件完全填满的柔性电路板放置在顶部片材的背面上的粘结粘合剂上。UV粘合剂开始湿气固化。随着将片材移至步骤6而加热该片材，以帮助粘合剂热固化。
步骤6：将来自步骤5的托盘移至注塑模制站中，在该站中，将具有底部片材的托盘放置在顶部片材的顶部上，并将塑料内层注塑模制在这两个片材之间。
步骤7：现在切割片材以使卡或层压芯可用于后续卡制造。该切割可以通过冲模或激光切割来完成。
前述工艺流程中的关键点在于，一旦底部(或顶部)片材被切割有进入其中的对位孔，该孔就将被使用一次(并且仅一次)以将片材定位抵靠在托盘上，并且此后，这样的对位将维持恒定，同时进一步的对位将通过使用衬套的内径来实现。由于衬套被物理且刚性地固定到托盘，因此可以在步骤或操作之间物理地移动在其上已经放置了片材的托盘，并且由于衬套相对于托盘的对位以及片材中的孔相对于衬套的对位不会发生变化，因此可以维持非常精确的对位。这还意味着在制造期间放置在片材上的物品(诸如，电子器件)的位置不会改变，因为片材由通过衬套拉伸的其对位孔来维持拉紧。
现在将关于已经识别的某些步骤以及结合某些这类步骤执行的操作来更详细地描述本发明。然而，首先值得注意的是，给定的片材最适用于加工物品阵列，而不是仅加工单个物品，并且结合卡的制造，在行业内常见的是加工具有六个物品的阵列。还值得注意的是，虽然以下描述将描述使用具有六个物品的一个阵列，但是可以在单个托盘上一起加工多个阵列以提高来自单个生产线的产量。因此，使用具有六个物品的单个阵列旨在是说明性的而非限制性的。
图1A和图1B展示了具有四个衬套2和用于进行工具加工的开口3的托盘1，所述衬套中的每一个具有外径2OD和内径2ID。如图1B中所展示的，每个衬套2被托盘1刚性地固持并且伸出到托盘1的顶部表面4上方。
图2A和图2B展示了通过每个衬套2的外径2OD拉紧(其在步骤2中完成)的片材10、以及安装到片材10上(在步骤5中完成)的电路阵列11。在图3中展示了电路阵列11本身，其中，未展示出各个部件，而为了便于理解，各个部件被展示为卡尺寸的轮廓，因为各个部件本身可以变化，并且关键在于，在拾放步骤5中将完全填满的电路阵列11安装到片材10上，现在将更详细地描述该拾放步骤。
在拾放步骤5中，必须将电路阵列11精确地放置在片材10的顶部上，并且已经发现，在结合该步骤的放置部分使用真空室时会获得优异的结果。该相同的工艺步骤可以用在其他工艺中，其中，重要的是，使位于电子部件与其上固定有电子部件的片材之间的气泡最少。
图4A至图4E展示了如何将电路阵列11加载到拾取头上，其是拾放步骤5中的拾取部分。
在图4A中，电路阵列11位于拾取头25下方的电路***嵌套21上。电路***嵌套21具有两个电路定位销22，这些电路定位销是伸出的，并且固持电路阵列11中的定位孔12和13(见图3)。拾取头25具有两个可伸缩的导销26。
在图4B中，拾取头25已经落下。
在图4C中，拾取头导销26已经伸出到电路***嵌套中、并且到拾取头导孔14和15中(见图3)。
应当注意的是，虽然电路定位孔13和拾取头导孔15在本说明书中被标记并描述为孔，但是实际上在特别优选的实施例中其为如图3中所示出的槽。
在图4D中，电路定位销22被缩回。
在图4E中，将拾取头25向上提升离开电路***嵌套21，其中，电路阵列11附接至该拾取头。
一旦电路阵列11附接至拾取头25，拾放步骤5的拾取部分就完成了，并且然后将该电路阵列放置在片材10的顶部上(这在图5A至图5F中进行了展示)。拾取头25与片材10之间的对位通过使用衬套2(未示出)来维持。图5A至图5F包括通过步骤3添加的粘合层18，该粘合层还在步骤4中经受了UV处理。应当注意的是，该工艺不限于其中施加了UV固化粘合剂的应用，并且仅结合特别优选的制造工艺来描述此类步骤。
在图5A中，拾取头25位于片材10(被定位在托盘1上)上方，并且真空室30在上方。拾取头导销26仍然是伸出的。
在图5B中，拾取头25向下移至中间位置，在该中间位置中，拾取头导销26与片材10接触。
在图5C中，真空室30下落到片材10的顶部上，从而覆盖拾取头25，以便与在托盘1的开口3中形成的砧座5配合，并且然后通过排气管101移除腔室30内部的空气以产生真空。真空有助于使在后续步骤中在片材10与电路阵列11之间产生的气泡最少，并且出于本发明的目的，真空不被定义为绝对没有物质的空无空间，而是被定义为通过人造装置(诸如，气泵)部分地排出气体的空间。
在图5D中，拾取头25完全落下，使得电路阵列11与粘合剂18接触。
在图5E中，拾取头25向上移动(同时仍然存在真空)，将电路阵列11留在粘合剂18上，并且然后使空气进入真空。
在图5F中，真空室30上升以除去真空。
虽然本文已经参考某些优选实施例对本发明进行了描述，但是这些实施例仅通过示例并且不限制本发明的范围的方式进行了呈现。例如，尽管前述描述阐述了可用于制造卡的优选实施例，但是该工艺不仅限于制造卡，还适用于任何工艺，在这些工艺中，将聚氨酯注入具有电子部件的由材料(其可以是塑料、金属、或一些其他物质、或此类成分的组合)组成的两个非常薄的片材之间，并且希望聚氨酯在片材之间完全固化，以形成使任何气泡最少的复合模制产品，本发明也不限于具有塑料片材的卡，因为根据本发明制造的卡可以具有塑料、金属或塑料和金属的组合(以及可能的其他类型的材料)的顶部片材和底部片材。对于受益于本披露的本领域技术人员来说，本发明的附加实施例将是显而易见的。不脱离本文披露的发明构思的情况下，在替代实施例中的进行进一步修改也是可能的。
因此，对于本领域技术人员而言将很容易显而易见的是，在不脱离所披露的发明的精神和范围的情况下，可以很容易对本文所描述的实际构思做出仍进一步的改变和修改。
因此，对于本领域技术人员而言将很容易显而易见的是，在不脱离所披露的发明的精神和范围的情况下，可以很容易对本文所描述的实际构思做出仍进一步的改变和修改。

Claims (15)

1.一种用于制造层压制品的工艺，包括以下步骤：
在片材中切割出多个对位孔，所述片材包含用于多个层压制品的一个或多个外层阵列；
将所述片材安装到托盘的表面上，所述托盘具有从所述表面向外伸出的多个衬套，所述多个衬套中的每个衬套具有外径和内销轴，其中，所述片材被安装到所述可移动托盘上，使得所述多个对位孔中的每个对位孔被所述多个衬套之一的外径保持拉紧；以及
将所述片材被安装到其表面的所述托盘移动通过多个加工站，在所述多个加工站中，在不从所述多个衬套中移除所述多个对位孔的情况下执行多个操作，以创建多个层压制品；
其中，所述多个衬套的所述内销轴用于在所述多个操作期间接纳多个对位销，以在所述多个操作期间提供对所述片材的对位。
2.如权利要求1所述的工艺，其中，所述多个孔包括四个孔。
3.如权利要求1所述的工艺，其中，所述层压制品为支付卡。
4.如权利要求3所述的工艺，其中，所述支付卡被制造成符合金融卡标准。
5.如权利要求4所述的工艺，其中，阵列包括六个外层。
6.如权利要求1所述的工艺，其中，所述多个操作包括：
将至少一个电子部件固定到所述阵列中的所述外层中的每个外层；
将聚氨酯材料注入包含所述片材的模具中；以及
将所述多个层压制品中的每个层压制品从所述片材中分离。
7.如权利要求6所述的工艺，其中，将至少一个电子部件固定到所述阵列中所述外层中的每个外层的操作包括以下步骤：
将粘合剂施加到所述片材的顶面；以及
将完全填满的柔性电路施加到所述片材的顶面。
8.如权利要求6所述的工艺，其中，所述多个操作包括将第二片材添加到所述模具，所述第二片材包含用于多个层压制品的至少一个第二外层阵列。
9.如权利要求1所述的工艺，其中，所述多个操作之一包括拾放操作，在所述拾放操作中，在真空室中将至少一个电子部件安装到所述片材上，在将所述电子部件安装到所述片材上之前已经在所述真空室中产生了部分真空。
10.如权利要求9所述的工艺，其中，拾放操作包括以下步骤：
将所述片材定位在拾取头下方的表面上，所述拾取头经由多个拾取头导销固持至少一个电子部件，所述多个拾取头导销从所述拾取头朝向所述片材向外伸出；
将所述拾取头朝向所述片材向下移动，使得所述拾取头导销与在所述片材中形成的多个拾取头孔接触；
利用真空室覆盖所述拾取头和所述片材，并且然后从所述真空室中除去空气以产生真空；
将所述拾取头朝向所述片材下降，使得所述至少一个电子部件与所述片材接触，同时在所述真空室中仍然存在真空；
在所述至少一个电子部件保持与所述片材接触的同时，将所述拾取头升起离开所述片材，同时真空室中仍存在真空；以及
移除所述真空室。
11.如权利要求10所述的工艺，其中，所述片材在顶表面上具有粘合剂，所述顶表面与所述至少一个电子部件接触。
12.如权利要求10所述的工艺，其中，所述多个拾取头孔具有槽构型。
13.一种用于制造支付卡的工艺，包括以下步骤：
在片材中切割出四个对位孔，所述片材包含用于多个支付卡的外层阵列；
将所述片材安装到托盘的表面上，所述托盘具有从所述表面向外伸出的四个衬套，所述衬套中的每个衬套具有外径和内销轴，其中，所述片材被安装到所述可移动托盘上，使得每个对位孔被衬套之一的外径保持拉紧；以及
将所述片材被安装到其表面的所述托盘移动通过多个加工站，在所述多个加工站中，在不从所述衬套中移除所述对位孔的情况下执行多个操作，其中，通过使用由所述四个衬套中的两个或更多个衬套接纳的多个对位销来维持在所述多个操作期间对所述片材的对位；
其中，所述多个操作包括：
将UV固化粘合剂施加到所述片材的顶表面；
使所述片材的顶表面经受UV处理；
将完全填满的柔性电路板添加到所述外层阵列中的每一个外层的顶表面上；
将聚氨酯混合物注入模具中以形成层压阵列，所述模具包含所述片材和第二片材，所述第二片材包含用于所述多个支付卡的第二外层阵列；以及
将所述多个支付卡中的每个支付卡从所述层压阵列中分离。
14.如权利要求13所述的工艺，其中，所述托盘在以下步骤之间物理地移动：将所述片材安装到所述托盘的第一步骤与将所述UV固化粘合剂施加到所述片材的顶表面的第二步骤之间、在所述第二步骤与添加所述完全填满的柔性电路板的第三步骤之间、在所述第三步骤与形成所述层压阵列的第四步骤之间、以及在所述第四步骤与将所述多个支付卡从所述层压阵列中分离的第五步骤之间。
15.一种用于制造制品的工艺，包括以下步骤：
经由在片材内构型的多个对位孔将所述片材安装到表面上，所述片材包含用于多个层压制品的一个或多个外层阵列，所述对位孔由在所述表面上构型的多个衬套保持拉紧；
将所述表面定位在拾取头下方，所述拾取头经由多个拾取头导销固持至少一个电子部件，所述多个拾取头导销从所述拾取头朝向所述片材向外伸出；
将所述拾取头朝向所述片材向下移动，使得所述拾取头导销与在所述片材中形成的多个拾取头孔接触；
利用真空室覆盖所述拾取头和所述片材，并且然后从所述真空室中除去空气以产生真空；
将所述拾取头朝向所述片材下降，使得所述至少一个电子部件与所述片材接触，同时在所述真空室中仍然存在真空；
在所述至少一个电子部件保持与所述片材接触的同时，将所述拾取头升起离开所述片材，同时真空室中仍存在真空；以及
移除所述真空室。
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