CN110868844A - Low-frequency shielding heat-conducting composite structure - Google Patents

Low-frequency shielding heat-conducting composite structure Download PDF

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Publication number
CN110868844A
CN110868844A CN201911306183.9A CN201911306183A CN110868844A CN 110868844 A CN110868844 A CN 110868844A CN 201911306183 A CN201911306183 A CN 201911306183A CN 110868844 A CN110868844 A CN 110868844A
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CN
China
Prior art keywords
layer
frequency shielding
low
composite structure
oxide
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Pending
Application number
CN201911306183.9A
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Chinese (zh)
Inventor
唐春峰
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Hington (changzhou) New Material Technology Co Ltd
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Hington (changzhou) New Material Technology Co Ltd
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Priority to CN201911306183.9A priority Critical patent/CN110868844A/en
Publication of CN110868844A publication Critical patent/CN110868844A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/06—Interconnection of layers permitting easy separation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29—Laminated material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/122—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present only on one side of the carrier, e.g. single-sided adhesive tape
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2400/00—Presence of inorganic and organic materials
    • C09J2400/10—Presence of inorganic materials
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2463/00—Presence of epoxy resin

Abstract

The invention discloses a low-frequency shielding heat-conducting composite structure which comprises a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are sequentially arranged, wherein the layers are sequentially bonded together; wherein the low frequency shielding layer is made of permalloy, ferrite sheet or ferrite polymer. The structure and the material thereof disclosed by the invention can effectively reduce the heat of a heat source, shield low-frequency signals or electromagnetic interference and ensure the stable operation of electronic products.

Description

Low-frequency shielding heat-conducting composite structure
Technical Field
The invention relates to a shielding heat conduction material, in particular to a low-frequency shielding heat conduction composite structure.
Background
With the development of the electronic industry and the high application of electronic equipment, electromagnetic radiation is considered as the fourth major public nuisance following water pollution, noise pollution and air pollution, and the electromagnetic interference caused by the electromagnetic radiation not only affects the normal life of people, but also increasingly threatens the military confidentiality of the country. Especially in the modernized battlefield of soft killer weapons, electromagnetic wave emergence, when the electromagnetic wave penetrates sensitive devices of military equipment, the radar of the opposite side is lost, a radio communication command system fails, missiles and artillery weapons are out of control. The electromagnetic weapon with extremely high destructive power can become an important operation means on a future battlefield, so that the research on high-performance electromagnetic shielding materials to improve the protection capability of various weapon platforms is an important task in the military field of all countries. In addition, electromagnetic radiation also presents a serious challenge to the health of people. Electromagnetic waves emitted by various communication devices, networks and household appliances can induce various diseases, such as insufficient sleep, dizziness and vomiting, and can even induce cancer and cardiovascular diseases seriously. Therefore, research and development of electromagnetic shielding materials are important methods for controlling electromagnetic environments in recent years.
The common electromagnetic shielding materials comprise metal materials, polymer composite materials and the like, the metal materials can be used as main electromagnetic shielding materials because the metal materials have good electrical conductivity (copper, aluminum, nickel and the like) and high magnetic conductivity (permalloy, iron-silicon alloy and the like), and when electromagnetic energy flows through the metal materials, the main shielding mechanisms of the metal materials are reflection attenuation R and absorption attenuation A, the electromagnetic waves can be effectively reflected and absorbed, the electromagnetic energy is attenuated, and therefore a good shielding effect is achieved. Most polymer materials have poorer electrical conductivity than metals, which greatly reduces the electromagnetic shielding effectiveness of the polymer materials.
At present, most of shielding heat-conducting composite materials are developed around good-conductor high-heat-conducting metals, and the materials have good shielding effect on high-frequency electromagnetic wave energy, but have no shielding effect on low-frequency magnetic fields. Therefore, it is highly desirable to develop a low frequency shielding composite material to solve the current problems.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a low-frequency shielding heat-conducting composite structure.
The invention discloses a low-frequency shielding heat-conducting composite structure which comprises a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are sequentially arranged, wherein the layers are sequentially bonded together;
the low frequency shielding layer is made of permalloy, ferrite sheets or ferrite polymer.
As a further improvement of the embodiment of the invention, the low-frequency shielding and heat conducting composite structure comprises a single-sided release layer, a first acrylic adhesive layer, a first film layer, a second acrylic adhesive layer, a graphite layer, a third acrylic adhesive layer, a second film layer, a fourth acrylic adhesive layer, a low-frequency shielding layer and a protective film layer which are sequentially attached.
As a further improvement of an embodiment of the present invention, the graphite layer is made of an artificial graphite sheet or a natural graphite sheet.
As a further refinement of an embodiment of the invention, the thickness of the graphite layer is selected in the range from 0.01 to 0.3 mm.
As a further refinement of an embodiment of the invention, the thickness of the graphite layer is selected in the range from 0.01 to 0.1 mm.
As a further improvement of the embodiment of the present invention, the thickness of the low frequency shielding layer is selected from the range of 0.01 to 0.2 mm.
As a further improvement of the embodiment of the present invention, the thickness of the low frequency shielding layer is selected from the range of 0.01 to 0.1 mm.
As a further improvement of the embodiment of the invention, the ferrite sheet is formed by sintering one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide and strontium oxide.
As a further improvement of the embodiment of the invention, the ferrite polymer comprises a filler and a polymer, the filler is configured by one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide and strontium oxide, and the filler and the polymer are formed by banburying, calendaring, curing and forming.
As a further improvement of the embodiment of the present invention, the polymer is one selected from the group consisting of PE resin, PP resin, acrylic resin, urethane resin, silicone rubber, and epoxy resin.
As a further improvement of the embodiment of the present invention, the layers are formed into a continuous compact layered structure in a film or sheet shape by extrusion or a processing method in which coating and extrusion are applied together.
As a further improvement of the embodiment of the present invention, the adhesive selected for bonding is selected from a polyurethane type hot melt adhesive, a polyurethane type solvent adhesive or an epoxy resin adhesive.
The low-frequency shielding heat-conducting composite structure disclosed by the invention can effectively reduce the heat of a heat source, and simultaneously shields low-frequency signals or electromagnetic interference, thereby ensuring the stable operation of electronic products.
Drawings
FIG. 1 is a schematic structural diagram of a low frequency shielding composite of the present invention;
the examples in the figures are represented as:
1-single-sided release layer; 2-a first acrylic adhesive layer; 3-a first thin film layer; 4-a second acrylic adhesive layer; 5-a graphite layer; 6-third acrylic adhesive layer; 7-a second film layer; 8-fourth acrylic adhesive layer; 9-a low frequency shielding layer; 10-protective film layer.
Detailed Description
The invention discloses a low-frequency shielding heat-conducting composite structure which comprises a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are sequentially arranged, wherein the layers are sequentially bonded together;
the low frequency shielding layer is made of iron oxide, and in other alternative embodiments, may be made of permalloy, other ferrite sheets, or ferrite polymer. Other ferrite pieces can be prepared by sintering one or more of nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide and strontium oxide.
In the embodiment of the present invention, as shown in fig. 1, the bonding structure of the low-frequency shielding and heat conducting composite structure includes a single-sided release layer, a first acrylic adhesive layer, a first thin film layer, a second acrylic adhesive layer, a graphite layer, a third acrylic adhesive layer, a second thin film layer, a fourth acrylic adhesive layer, a low-frequency shielding layer, and a protection film layer, which are sequentially attached to each other.
Wherein, the graphite layer is prepared by artificial graphite flakes, or natural graphite flakes can be selected for preparation; the graphite layers have a thickness of 0.1 and in other alternative embodiments, the thickness is selected from the range of 0.01 to 0.3 mm.
In an embodiment of the invention, the thickness of the low frequency shielding layer is 0.1mm, and the thickness range is selected from 0.01-0.2mm, and more preferably, from 0.01-0.1 mm.
The ferrite polymer comprises a filler and a polymer, wherein the filler is prepared from one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide and strontium oxide, and the filler and the polymer are subjected to banburying, calendaring, curing and forming.
The polymer is selected from one of PE resin, PP resin, acrylic resin, polyurethane resin, silicon rubber and epoxy resin.
Each layer is a continuous compact laminated structure formed by extrusion or a processing mode of coating and extrusion, and is in a film shape or a sheet shape.
The adhesive selected for bonding is selected from polyurethane type hot melt adhesive, polyurethane type solvent adhesive or epoxy resin adhesive.
The low-frequency shielding heat-conducting composite structure disclosed by the invention can effectively reduce the heat of a heat source, and simultaneously shields low-frequency signals or electromagnetic interference, thereby ensuring the stable operation of electronic products.

Claims (10)

1. A low-frequency shielding heat-conducting composite structure is characterized by comprising a single-sided release layer, a graphite layer, a low-frequency shielding layer and a protective film layer which are sequentially arranged, wherein the layers are sequentially bonded together;
the low frequency shielding layer is made of permalloy, ferrite sheets or ferrite polymer.
2. The low-frequency shielding and heat conducting composite structure as claimed in claim 1, comprising a single-sided release layer, a first acrylic adhesive layer, a first film layer, a second acrylic adhesive layer, a graphite layer, a third acrylic adhesive layer, a second film layer, a fourth acrylic adhesive layer, a low-frequency shielding layer and a protective film layer, which are sequentially attached.
3. The low frequency shielding thermally conductive composite structure of claim 1 or 2, wherein the graphite layer is made of artificial graphite sheet or natural graphite sheet.
4. The low frequency shielding thermally conductive composite structure of claim 3, wherein said graphite layer has a thickness selected from the range of 0.01-0.3 mm.
5. The low frequency shielding thermally conductive composite structure of claim 4, wherein the graphite layer has a thickness selected from the range of 0.01-0.1 mm.
6. The low frequency shielding thermally conductive composite structure of claim 1 or 2, wherein the thickness of the low frequency shielding layer is selected from the range of 0.01-0.2 mm.
7. The low frequency shielding thermally conductive composite structure of claim 6, wherein said low frequency shielding layer has a thickness selected from the range of 0.01-0.1 mm.
8. The low frequency shielding and heat conducting composite structure of claim 1, wherein the ferrite sheet is sintered from one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide, and strontium oxide.
9. The low-frequency shielding and heat conducting composite structure as claimed in claim 1, wherein the ferrite polymer comprises a filler and a polymer, the filler is configured by one or more of iron oxide, nickel oxide, zinc oxide, manganese oxide, magnesium oxide, barium oxide and strontium oxide, and the filler and the polymer are formed by banburying, rolling, curing and forming.
10. The low frequency shielding thermally conductive composite structure of claim 9, wherein said polymer is selected from one of PE resin, PP resin, acrylic resin, urethane resin, silicone rubber, and epoxy resin.
CN201911306183.9A 2019-12-17 2019-12-17 Low-frequency shielding heat-conducting composite structure Pending CN110868844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201911306183.9A CN110868844A (en) 2019-12-17 2019-12-17 Low-frequency shielding heat-conducting composite structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201911306183.9A CN110868844A (en) 2019-12-17 2019-12-17 Low-frequency shielding heat-conducting composite structure

Publications (1)

Publication Number Publication Date
CN110868844A true CN110868844A (en) 2020-03-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN201911306183.9A Pending CN110868844A (en) 2019-12-17 2019-12-17 Low-frequency shielding heat-conducting composite structure

Country Status (1)

Country Link
CN (1) CN110868844A (en)

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