CN110858542A - Photoresist processing system - Google Patents
Photoresist processing system Download PDFInfo
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- CN110858542A CN110858542A CN201811023793.3A CN201811023793A CN110858542A CN 110858542 A CN110858542 A CN 110858542A CN 201811023793 A CN201811023793 A CN 201811023793A CN 110858542 A CN110858542 A CN 110858542A
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- magnetic
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- substrate
- holding device
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 127
- 238000012545 processing Methods 0.000 title claims abstract description 47
- 230000005291 magnetic effect Effects 0.000 claims abstract description 124
- 239000000758 substrate Substances 0.000 claims abstract description 62
- 230000000694 effects Effects 0.000 claims abstract description 13
- 238000001914 filtration Methods 0.000 claims description 10
- 238000002347 injection Methods 0.000 claims description 3
- 239000007924 injection Substances 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 2
- 230000008878 coupling Effects 0.000 claims 2
- 238000010168 coupling process Methods 0.000 claims 2
- 238000005859 coupling reaction Methods 0.000 claims 2
- 238000010586 diagram Methods 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 229910004438 SUB2 Inorganic materials 0.000 description 5
- 101100311330 Schizosaccharomyces pombe (strain 972 / ATCC 24843) uap56 gene Proteins 0.000 description 5
- 101150018444 sub2 gene Proteins 0.000 description 5
- 102100036464 Activated RNA polymerase II transcriptional coactivator p15 Human genes 0.000 description 4
- 101000713904 Homo sapiens Activated RNA polymerase II transcriptional coactivator p15 Proteins 0.000 description 4
- 229910004444 SUB1 Inorganic materials 0.000 description 4
- 238000003672 processing method Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000007599 discharging Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 239000003302 ferromagnetic material Substances 0.000 description 2
- 230000005484 gravity Effects 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000002105 nanoparticle Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000005294 ferromagnetic effect Effects 0.000 description 1
- SZVJSHCCFOBDDC-UHFFFAOYSA-N ferrosoferric oxide Chemical compound O=[Fe]O[Fe]O[Fe]=O SZVJSHCCFOBDDC-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
- H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
- H01L21/0272—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers for lift-off processes
Abstract
A photoresist processing system for processing a magnetic photoresist carried by a substrate, wherein the photoresist processing system comprises a holding device and a magnetic device. The holding device is provided with at least one combining area for arranging the substrate; the magnetic device is arranged at a preset position away from the combining area and has a magnetic attraction direction corresponding to the combining area, wherein the magnetic field generated by the magnetic device has a magnetic attraction effect on the magnetic light resistor.
Description
Technical Field
The present invention relates to a photoresist processing system, and more particularly, to a photoresist processing system for lifting photoresist from a substrate.
Background
Conventionally, in many industrial processes, such as semiconductor processes, photoresist (photoresist) is typically used to generate a desired structural pattern, and photoresist is typically used to strip the patterned photoresist from a substrate (substrate) in a subsequent step. However, in the removal process, the undegraded strippers are suspended in the photoresist and drift around, which not only can not be easily recycled, but also easily causes the strippers to be re-attached to the substrate, thereby causing defects in the subsequent process, and thus a photoresist processing system is required to solve the problem.
Disclosure of Invention
It is therefore an objective of the claimed invention to provide a photoresist processing system to solve the above problems.
According to one embodiment of the present disclosure, a photoresist processing system is disclosed for processing magnetic photoresist carried by a substrate. The photoresist processing system includes a holding device and a magnetic device. The holding device is provided with at least one combining area for arranging the substrate; the magnetic device is arranged at a preset position away from the combining area and has a magnetic attraction direction corresponding to the combining area, wherein the magnetic field generated by the magnetic device has a magnetic attraction effect on the magnetic light resistor.
By using the photoresist processing system provided by the invention, the photoresist on the substrate can be effectively lifted off from the substrate, and the photoresist is prevented from being back-stained from the substrate through the magnetic attraction effect of the magnetic device on the photoresist, so that the probability of generating defects in the subsequent process can be greatly reduced, and the problems encountered in the prior art can be solved.
Drawings
Aspects of the present disclosure are best understood from the following detailed description when read with the accompanying drawing figures. It should be noted that the various components are not drawn to scale in accordance with standard practice in the industry. In fact, the dimensions of the various elements may be arbitrarily increased or reduced for clarity of discussion.
FIG. 1 is a schematic diagram of a photoresist processing system according to a first embodiment of the present disclosure.
FIG. 2 is a schematic diagram of a photoresist processing system according to a second embodiment of the present disclosure.
FIGS. 3A-3B are schematic diagrams of photoresist processing systems according to third and fourth embodiments of the present disclosure.
FIGS. 4A-4D are schematic diagrams of a magnetic device according to an embodiment of the present disclosure.
FIG. 5 is a schematic diagram of a magnetic device structure and a substrate displacement direction according to an embodiment of the present disclosure.
FIG. 6 is a schematic diagram of a photoresist processing system according to a fifth embodiment of the present disclosure.
FIG. 7 is a schematic view of a circulation device according to an embodiment of the present disclosure.
FIG. 8 is a schematic diagram of a circulation device according to another embodiment of the present disclosure.
FIG. 9 is a flow chart of a photoresist processing method according to an embodiment of the present disclosure.
Detailed Description
The following disclosure provides many different embodiments, or examples, for implementing different components of the disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. Of course, these are merely examples and are not intended to be limiting. For example, formation of a first member over or on a second member in the following description may include embodiments in which the first and second members are formed in direct contact, and may also include embodiments in which additional members may be formed between the first and second members, such that the first and second members may not be in direct contact. In addition, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Moreover, for convenience in description, spatially relative terms, such as "below," "under," "over," "up," and the like, may be used herein to describe one element or component's relationship to another element(s) or component(s), as illustrated in the figures. Spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. The device may be otherwise oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
Notwithstanding that the numerical ranges and parameters setting forth the broad scope of the disclosure are approximations, the numerical values set forth in the specific examples are reported as precisely as possible. Any numerical value, however, inherently contains certain errors necessarily resulting from the standard deviation found in their respective testing measurements. Further, as used herein, the term "about" generally means within 10%, 5%, 1%, or 0.5% of a given value or range. Alternatively, the term "about" means within an acceptable standard error of the mean as considered by a person of ordinary skill in the art. Except in the operating/working examples, or unless otherwise expressly specified, all numerical ranges, amounts, values, and percentages such as for amounts of materials, durations of time, temperatures, operating conditions, ratios of amounts, and the like, disclosed herein are to be understood as modified in all instances by the term "about". Accordingly, unless indicated to the contrary, the numerical parameters set forth in the present disclosure and attached claims are approximations that may vary depending upon the desired properties. At the very least, each numerical parameter should at least be construed in light of the number of reported significant digits and by applying ordinary rounding techniques. Ranges may be expressed herein as from one end point to the other end point or between the two end points. All ranges disclosed herein are inclusive of the endpoints, unless otherwise specified.
Fig. 1 is a schematic view of a photoresist processing system 100 according to a first embodiment of the disclosure, and as shown in fig. 1, the photoresist processing system 100 includes a holding device 110 and a magnetic device 120, in this embodiment, the holding device 110 may be a tank or a chamber having a carrier disposed therein. The holding device 110 has a bonding area (not shown), which may be located at the bottom of the trough body, on the carrier plate of the chamber, or other suitable positions, but not limited thereto. The bonding region is used to place a chamber (or a groove) of a substrate SUB with magnetic photoresist, that is, the substrate SUB can be placed at the bottom or other position of the holding device 110 through the bonding region, and the holding device 110 can be injected with photoresist-removing agent ST to assist in lifting the patterned photoresist PR carried on the substrate SUB away from the substrate SUB, wherein the photoresist PR is doped with magnetic material such as iron-nickel alloy nanoparticles, ferroferric oxide nanoparticles or other materials capable of magnetic action. The magnetic device 120 is disposed at a position away from the holding device 110, or more specifically, from the substrate SUB, and may include a permanent magnet or an electromagnet to generate a magnetic field having a magnetic attraction effect on the photoresist doped with the magnetic substance. As shown in fig. 1, the magnetic field generated by the magnetic device 120 generates an upward attraction force on the photoresist PR, so that the photoresist stripper ST first degrades a portion of the photoresist PR, and then the magnetic attraction effect of the magnetic device 120 on the photoresist PR is matched to effectively lift off (lift-off) the photoresist PR on the substrate SUB and in the photoresist stripper ST from the substrate SUB, thereby effectively solving the problems in the prior art. It should be noted that the present disclosure does not limit the distance between the magnetic device and the holding device 110. The disclosure does not limit the holding device 110 to be a chamber (or a tank) and the way the holding device 110 holds the substrate SUB, for example, the holding device 110 may be a plate or a pedestal, and may hold the substrate SUB by adsorption, snap ring, magnetic force, etc. In addition, in some embodiments, the photoresist processing system 100 of the present disclosure is not limited to using the photoresist ST, i.e., the photoresist processing system 100 can prevent the photoresist PR from being pulled away from the substrate SUB by the magnetic attraction of the magnetic device 120 to the photoresist PR.
Referring to fig. 2, fig. 2 is a schematic view of a second embodiment of the photoresist processing system 100 according to the present disclosure, as described above, the holding device 110 is a plate or a pedestal for holding the substrate SUB, and the magnetic device 120 carries the photoresist PR away from the substrate SUB through a magnetic attraction effect on the photoresist PR. In other words, the variations in the design of the magnetic device 120 to remove the magnetic material-doped photoresist PR from the substrate SUB are all within the scope of the present disclosure. In addition to the above-mentioned use of the photoresist ST and the magnetic attraction effect generated by the magnetic device 120 to effectively remove the photoresist PR from the substrate SUB, the holding device 110 may further have a carrying unit (not shown) for carrying and moving the substrate SUB relative to the magnetic device 120 through the bonding region. The transport unit may include mechanical structures (e.g., pulleys, conveyor belts, rollers, clamps, vacuum suction, electrostatic suction, etc.) to properly move the substrate SUB to smoothly carry the photoresist PR away from the substrate SUB to prevent the photoresist PR from being re-stained when the photoresist PR is degraded by the photoresist stripper ST and the magnetic force is applied to the photoresist PR by the magnetic device 120. Similarly, the holding device 110 may further include a vibration device (not shown) to vibrate the photoresist PR to peel off the substrate SUB when the photoresist PR is degraded by the photoresist stripper ST and the magnetic force is generated on the photoresist PR by the magnetic device 120. The vibration device can assist the magnetic photoresist to strip from the substrate by ultrasonic vibration, vibration of the holding device or shaking of the substrate.
It should be noted that, according to different mechanical structures, the direction and angle of the holding device 110 for holding the substrate SUB may also be changed. Fig. 3A is a schematic diagram of a third embodiment of a photoresist processing system 100 according to the present disclosure, in which a surface of a substrate SUB held by a holding device 110, on which a photoresist PR is carried, faces downward and is opposite to a magnetic device 120, so that the photoresist PR can be efficiently lifted off the substrate SUB through gravity in addition to the removal of the downward magnetic force generated by the photoresist ST and the magnetic device 120 on the photoresist PR. Fig. 3B is a schematic diagram of a fourth embodiment of the photoresist processing system 100 according to the present disclosure, in this embodiment, the holding device 110 includes two combining areas (not shown) for holding the substrates SUB1 and SUB2 simultaneously, wherein the substrates SUB1 and SUB2 both carry the magnetic photoresist PR, and as described in the embodiments of fig. 1 and 3A, the magnetic attraction direction of the magnetic device 120 to the photoresist PR on the substrate SUB1 is upward, the magnetic attraction direction of the magnetic device 120 to the photoresist PR on the substrate SUB2 is downward, and the photoresist PR on the substrate SUB2 is attracted by gravity to lift the photoresist PR off more efficiently. It should be apparent that while the photoresist processing system 100 may also include multiple magnetic devices 120 for processing photoresist PR on multiple substrates to improve processing efficiency, one of ordinary skill in the art can readily appreciate embodiments in which multiple magnetic devices perform photoresist stripping on multiple substrates, and the detailed description is omitted herein for brevity.
FIGS. 4A-4D are schematic diagrams of a magnetic device 120 according to an embodiment of the present disclosure. In fig. 4A, the magnetic device 120 is a plate structure, wherein the plate structure includes a permanent magnet or an electromagnet, or the plate structure is implemented by a ferromagnetic material to generate a magnetic field for the photoresist PR to bring the photoresist PR away from the substrate SUB to avoid the photoresist PR from being back-stained; fig. 4B is similar to the embodiment shown in fig. 4A, in that the magnetic device 120 is also a flat plate structure and includes a permanent magnet or an electromagnet to generate a magnetic field for the photo resistor PR, but the magnetic device 120 shown in fig. 4B includes a plurality of holes (e.g., the holes HL shown in the figure) arranged in an array; in FIG. 4C, the magnetic device 120 includes a plurality of magnetic units 120_1-120_ n disposed in parallel and spaced apart from each other, where n is a positive integer greater than 1, and each of the magnetic units 120_1-120_ n includes a permanent magnet or an electromagnet, or each of the magnetic units is implemented by a ferromagnetic material; the magnetic device 120 shown in FIG. 4D is based on the structure of FIG. 4C, and a plurality of magnetic units 200_1-200_ m are additionally disposed on the magnetic units 120_1-120_ n, wherein m is also a positive integer greater than 1, and the magnetic units 120_1-120_ n and the magnetic units 200_1-200_ m are criss-cross with each other, i.e., the magnetic device 120 comprises two layers of structures stacked on each other. It is to be appreciated that the magnetic device 120 may also include multiple layers stacked on top of each other to more efficiently lift off the photoresist PR. In addition, the present invention is not limited to the stacking angle and the interleaving manner between each layer of the magnetic device 120 when the layer of the magnetic device includes a plurality of layers. These design variations are intended to fall within the scope of the present invention.
Fig. 5 is a schematic diagram of the structure of the magnetic device 120 and the displacement direction of the substrate SUB according to an embodiment of the present disclosure, as described above, the holding device 110 may further move the substrate SUB to lift the photoresist PR from the substrate SUB more efficiently, and in an embodiment of the present disclosure, the length of the magnetic device 120 in a direction (x direction shown in fig. 5) perpendicular to the movement direction (y direction shown in fig. 5) of the substrate SUB is longer than the length of the substrate SUB in x direction to ensure that the photoresist PR on the substrate SUB can be lifted effectively in a wider range. However, this is not a limitation of the present disclosure.
Fig. 6 is a schematic diagram of a photoresist processing system 600 according to a fifth embodiment of the present disclosure, the photoresist processing system 600 shown in fig. 6 is similar to the photoresist processing system 100 shown in fig. 1, and the holding device 110 in the photoresist processing system 600 further comprises an injection port 620 and an outflow port 630 for injecting or discharging the photoresist-removed ST into or out of the holding device 110. In addition, the photoresist processing system 600 further comprises a circulation device 610, wherein the circulation device 610 is connected between the inlet 620 and the outlet 630, so that the photoresist stripper ST discharged through the outlet 630 is injected into the holding device 110 through the inlet 620 again through the circulation device 610. In this embodiment, the circulation device 610 may further include a filtering device 640 for filtering the photoresist PR in the photoresist stripper ST to effectively prevent the photoresist PR injected into the holding device 110 again from including the photoresist PR and re-wetting the substrate SUB. In this embodiment, the filtering device 640 may include a magnetic element such as a permanent magnet or an electromagnet, or the filtering device 640 may be implemented by a ferromagnetic substance. It should be noted that the disclosure does not limit the position of the filtering device 640 in the circulating device 610, and does not limit the shape and size of the circulating device 610 and the filtering device 640.
Fig. 7 is a schematic view of a circulation device 610 according to an embodiment of the disclosure, as shown in fig. 7, the photoresist stripper ST discharged from the holding device 110 from the outlet 630 is injected into the holding device 110 through the inlet 620 again according to the arrow direction, and the filter 640 magnetically attracts the photoresist PR in the photoresist stripper ST, so that the photoresist PR in the photoresist ST can be effectively attracted by the filter 640, thereby preventing the photoresist ST re-injected into the holding device 110 from generating defects on the substrate SUB. In this embodiment, the circulation device 610 may further include a discharge port 650 for discharging the photoresist PR adsorbed by the filter device 640 through the magnetic attraction effect out of the circulation device 610 through the discharge port 650.
Fig. 8 is a schematic view of a circulation device 610 according to another embodiment of the present disclosure, similar to the embodiment illustrated in fig. 7, except that the position of the filtering device 640 in fig. 8 is different in the circulation device 610, and a person skilled in the art can easily understand the embodiment of fig. 8 after reading the above paragraphs, so that the detailed description is omitted for brevity.
Fig. 9 is a flow chart of a method 900 of photoresist processing according to an embodiment of the present disclosure, which need not be performed in exactly the same step as the method 900 of fig. 9, provided that substantially the same results are achieved. The photoresist processing method 900 can be summarized as follows:
step 902: the substrate SUB is placed in the holding device 110.
Step 904: a photoresist stripper ST is implanted in the holding device 110.
Step 906: the magnetic device 120 is utilized to generate a magnetic field to generate a magnetic attraction effect on the photoresist PR doped with magnetic material carried by the substrate SUB.
After reading the above paragraphs, those skilled in the art should readily understand the method flowchart shown in FIG. 9, and the detailed description is omitted here for brevity.
Some embodiments of the present disclosure provide a photoresist processing system for processing a magnetic photoresist carried by a substrate, the photoresist processing system comprising a holding device and a magnetic device. The holding device is used for holding the substrate; the magnetic device is placed at a specific position away from the holding device, wherein the magnetic field generated by the magnetic device has a magnetic attraction effect on the photoresist.
Some embodiments of the present disclosure provide a photoresist processing method for processing a magnetic photoresist carried on a substrate, the method comprising generating a magnetic field by a magnetic device to generate a magnetic attraction effect on the photoresist.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
[ notation ] to show
100 photoresist processing system
110 holding device
120 magnetic device
120_1-120_ n, 200_1-200_ m magnetic cells
610 circulation device
620 injection port
630 flow outlet
640 Filter device
650 discharge port
900 photo-resistance processing method
902 step 906
HL hole
PR magnetic photoresist
ST Photoresist remover
SUB, SUB1, SUB2 substrate
Claims (10)
1. A photoresist processing system for processing magnetic photoresist carried by a substrate, comprising:
a holding device having at least one bonding area for disposing the substrate; and
a magnetic device disposed at a predetermined position away from the combining region, the magnetic device having a magnetic attraction direction corresponding to the combining region, wherein the magnetic field generated by the magnetic device has a magnetic attraction effect on the magnetic photoresist.
2. The photoresist processing system of claim 1, wherein the holder has two of the coupling areas, the magnetic device has two corresponding magnetic attraction directions, and the two magnetic attraction directions respectively correspond to the two corresponding coupling areas along a first direction and a second direction different from each other.
3. The system of claim 1, wherein the holder further comprises a transport unit for carrying the substrate and moving the substrate relative to the magnetic device through the bonding region.
4. The photoresist processing system of claim 1, wherein the magnetic device comprises a plurality of magnetic units, the magnetic units being spaced apart.
5. The photoresist processing system of claim 1, wherein the magnetic units comprise a first magnetic unit and a second magnetic unit stacked on top of each other, and the first magnetic unit and the second magnetic unit are interleaved.
6. The photoresist processing system of claim 1, wherein the magnetic device comprises a plurality of holes arranged in an array.
7. The photoresist processing system of claim 1, wherein the holding device is a tank comprising an inlet and an outlet, and a photoresist stripper is injected into the tank through the inlet and flows out of the tank through the outlet.
8. The photoresist processing system of claim 7 further comprising:
a filtering device connected to the outflow port for filtering the magnetic photoresist in the photoresist remover flowing out of the tank body: and
a circulating device connected between the injection port and the outflow port for injecting the filtered photoresist removing agent into the tank body.
9. The photoresist processing system of claim 8, wherein the filtering device comprises a magnetic element, the magnetic field generated by the magnetic element having the magnetic attraction effect on the magnetic photoresist.
10. The system of claim 1, further comprising an oscillating device coupled to the holding device for driving the magnetic photoresist to strip from the substrate.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107129593 | 2018-08-24 | ||
| TW107129593A TWI688828B (en) | 2018-08-24 | 2018-08-24 | Photoresist processing system |
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| CN110858542A true CN110858542A (en) | 2020-03-03 |
| CN110858542B CN110858542B (en) | 2022-06-14 |
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| TW (1) | TWI688828B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN110858542B (en) | 2022-06-14 |
| TWI688828B (en) | 2020-03-21 |
| TW202009604A (en) | 2020-03-01 |
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