CN110843274A - Shell of electronic equipment, manufacturing method of shell and electronic equipment - Google Patents
Shell of electronic equipment, manufacturing method of shell and electronic equipment Download PDFInfo
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- CN110843274A CN110843274A CN201911205744.6A CN201911205744A CN110843274A CN 110843274 A CN110843274 A CN 110843274A CN 201911205744 A CN201911205744 A CN 201911205744A CN 110843274 A CN110843274 A CN 110843274A
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- glass fiber
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- epoxy resin
- shell
- reinforcing layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/12—Layered products comprising a layer of synthetic resin next to a fibrous or filamentary layer
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/047—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material made of fibres or filaments
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/18—Telephone sets specially adapted for use in ships, mines, or other places exposed to adverse environment
- H04M1/185—Improving the rigidity of the casing or resistance to shocks
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
Abstract
The application provides a shell of electronic equipment, a manufacturing method of the shell and the electronic equipment. The shell of the electronic device comprises a ceramic shell body and a reinforcing layer which are arranged in a laminated mode, the material forming the reinforcing layer comprises glass fiber and epoxy resin, the weight of the shell is smaller than 30g, and the falling ball height of 30g of falling balls is not smaller than 55 cm. The application provides an electronic equipment's casing has ceramic material's high rigidity and outward appearance effect, and the enhancement layer that glass fiber and epoxy formed can strengthen the ceramic housing body to make ceramic housing's toughness better, can also realize the lightweight design trend of casing when guaranteeing ceramic housing high impact strength.
Description
Technical Field
The application relates to the technical field of manufacturing of shells of electronic equipment, in particular to a shell of electronic equipment, a manufacturing method of the shell and the electronic equipment.
Background
In the two-dimensional (2D), two-dimensional semi-dimensional (2.5D) or three-dimensional (3D) ceramic mobile phone rear covers in the present stage, generally, zirconia ceramic powder is uniformly mixed with inorganic additives, organic additives and the like, and then the mobile phone rear cover made of ceramic materials with the thickness of more than 0.5mm can be manufactured through the procedures of molding, glue removing, sintering, flat grinding, numerical control machining (CNC), polishing, film coating and the like. However, the zirconia ceramic has a density of 6.0g/cm3Much higher than the density of aluminum alloy by 2.7g/cm3The density of the glass is 2.4g/cm3And the density of the PC + PMMA plastic is 1.1g/cm3The weight of the ceramic rear cover is obviously higher than that of the three materials under the condition of the same thickness, so that the ceramic rear cover is not beneficial to light weight.
Disclosure of Invention
An object of the embodiments of the present invention is to provide a ceramic housing assembly with light weight, small weight, and high impact strength, a method for manufacturing the ceramic housing assembly, and an electronic device using the ceramic housing assembly, which at least solve the above problems in the prior art, and achieve a design of a ceramic rear cover with both high strength and light weight.
In a first aspect of embodiments of the present application, a housing of an electronic device is provided.
According to the embodiment of the application, the shell of the electronic device comprises a ceramic shell body and a reinforcing layer which are arranged in a laminated mode, the material forming the reinforcing layer comprises glass fiber and epoxy resin, the weight of the shell is less than 30g, and the height of the falling ball of 30g is not less than 55 cm.
The electronic equipment's of this application embodiment casing has ceramic material's high rigidity and outward appearance effect, and the enhancement layer that glass fiber and epoxy formed can strengthen the ceramic housing body to make ceramic housing's toughness better, can also realize the lightweight design trend of casing when guaranteeing ceramic housing high impact strength.
In a second aspect of the present application, a method of making a housing for an electronic device is presented.
According to an embodiment of the application, the method comprises: attaching a material of a reinforcing layer into one side surface of the ceramic shell body, wherein the material of the reinforcing layer comprises glass fiber and epoxy resin; and heating the attached ceramic shell body to obtain the shell, wherein the weight of the shell is less than 30g, and the falling ball resistance height of 30g of falling balls is not less than 55 cm.
By adopting the manufacturing method of the embodiment of the application, the reinforcing layer consisting of the glass fiber and the epoxy resin can be attached to the inner surface of the ceramic shell body, so that the ceramic shell component with high hardness, high impact strength and lighter weight can be obtained, and the manufacturing method has the advantages of rich toughening raw materials, simple process or convenience in batch production.
In a third aspect of the present application, an electronic device is presented.
According to an embodiment of the present application, the electronic device includes: the shell comprises a ceramic shell body and a reinforcing layer which are arranged in a laminated mode, and the material forming the reinforcing layer comprises glass fiber and epoxy resin; a display device coupled to the housing.
The electronic equipment of this application embodiment, its casing have ceramic outward appearance, high strength, high impact strength and weight are lighter to make this electronic equipment's dropproof performance better, and then make this electronic equipment's life longer. It will be appreciated by those skilled in the art that the features and advantages described above with respect to the housing of the electronic device, which are not described in detail herein, still apply to the electronic device.
Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic cross-sectional structural view of a housing of an electronic device according to an embodiment of the present application;
fig. 2 is a schematic cross-sectional structural view of a housing of an electronic device according to another embodiment of the present application;
fig. 3 is a schematic cross-sectional structural view of a housing of an electronic device according to another embodiment of the present application;
FIG. 4 is a schematic cross-sectional view of a housing of an electronic device according to another embodiment of the present application;
FIG. 5 is a schematic flow chart diagram illustrating a method of fabricating a housing for an electronic device according to one embodiment of the present application;
fig. 6 is an external view of an electronic device according to an embodiment of the present application.
Reference numerals
100 ceramic shell body
200 enhancement layer
210 glass fiber board
220 epoxy resin adhesive layer
230 glass fiber cloth
10 casing
20 display device
1 electronic device
Detailed Description
The following examples are presented in detail and are not to be construed as limiting the present application, as those skilled in the art will appreciate. Unless otherwise indicated, specific techniques or conditions are not explicitly described in the following examples, and those skilled in the art may follow techniques or conditions commonly employed in the art or in accordance with the product specifications.
In one aspect of an embodiment of the present application, a housing of an electronic device is presented.
According to an embodiment of the present application, referring to fig. 1, a housing 10 includes a ceramic housing body 100 and a reinforcement layer 200 which are stacked, wherein a material forming the reinforcement layer 200 includes glass fiber and epoxy resin, and a weight of the housing is less than 30g and a ball drop height of 30g is not less than 55 cm.
The inventor of the application finds that the thickness of the mobile phone rear cover made of conventional ceramic materials generally needs to be larger than 0.5mm, because the ceramic is a brittle material, pores in the ceramic cannot be completely eliminated in the sintering process, and more tiny pits and scratches are left on the surface of the ceramic by machining, the pores in the ceramic, the pits and the scratches on the surface can be often used as crack initiation sources, when the ceramic is impacted by external force, cracks are easily generated from the places, and when the impact of the external force is large enough or the ceramic is thin, the cracks easily penetrate through the whole ceramic rear cover to cause fracture. Therefore, if the thickness of the rear cover of the 3D ceramic mobile phone is less than 0.5mm, the ceramic rear cover is subjected to a ball drop test by using 30g of steel balls, and the ball drop resistance height of the rear cover is difficult to exceed 80 cm.
Therefore, the inventor forms the reinforcing layer 200 on the inner cavity surface of the ceramic shell body 100 by a vacuum hot-pressing and attaching method, the glass fiber in the reinforcing layer 200 can reinforce the ceramic shell, the cured epoxy resin can toughen the ceramic shell, and the anti-falling ball height of 30g of falling balls of the shell is not less than 55cm, so that the weight of the shell is lighter and the weight of each shell is less than 30g while the high strength of the ceramic shell is ensured, the ceramic hand feeling and the appearance effect of the ceramic shell such as jade are not influenced, and the lightweight design of the ceramic shell is further realized.
In some embodiments of the present invention, the thickness of the ceramic case body 100 may be 0.1 to 0.4mm, and the thickness of the reinforcement layer 200 may be 0.1 to 0.3mm, so that the ball drop strength of the ceramic case body 100 with the above thickness may be higher by using the reinforcement layer 200 with the above thickness, so that the impact strength of the case may be increased while the thickness of the ceramic case body 100 is reduced.
In some embodiments of the present invention, the thickness of the ceramic shell body 100 may be 0.2-0.3 mm, and the thickness of the reinforcing layer 200 may be 0.1-0.2 mm, so that the weight of the shell is less than 30g, but the height of 30g of falling balls against falling balls is not less than 55cm, and compared with the ceramic as thin as 0.3mm, the weight is lighter by more than 5g and the height of 30g of falling balls against falling balls is more than 25 cm. It should be noted that the falling ball resistance height of 30g of falling balls specifically refers to the highest height of the shell, which is not cracked when 30g of steel balls fall in a falling ball test, and represents the impact strength of the shell.
In some specific examples, referring to fig. 2, the reinforcing layer 200 may be formed of a glass fiber plate 210, and a cured epoxy resin adhesive layer 220 is disposed between the glass fiber plate 210 and the ceramic housing body 100, so that the fully cured glass fiber plate 210 is preheated and then subjected to a hot bending process, an epoxy resin adhesive is sprayed on one surface of the glass fiber plate 210, and then the 3D glass fiber plate 210 which is heated and formed with the epoxy resin adhesive is bonded to the 3D ceramic housing body 100 and then heated and cured, thereby obtaining the ceramic housing with the glass fiber plate 210 and the cured epoxy resin adhesive layer 220 bonded to the inner cavity surface.
In other specific examples, referring to fig. 3, the reinforcing layer 200 may be formed by a cured glass fiber board 210, and the content of the glass fiber in the glass fiber board 210 may be 30-70 v/v%, and the content of the epoxy resin may be 70-30 v/v%, so that after the semi-cured glass fiber board 210 is preheated, the softened glass fiber board 210 is attached to the inner cavity surface of the 3D ceramic housing body 100, and then after the heating and curing, the ceramic housing with the glass fiber board 210 attached to the inner cavity surface can be directly obtained.
In another specific example, referring to fig. 4, the reinforcing layer 200 may be a cured epoxy resin layer 220, and the epoxy resin layer 220 wraps the glass fiber cloth 230, such that the glass fiber cloth 230 is first impregnated with the epoxy resin or the glass fiber cloth 230 is coated with the epoxy resin, then the glass fiber cloth 230 is attached to the ceramic housing body 100, and then heated and cured, so that the ceramic housing with the inner cavity surface attached with the epoxy resin layer 220 and wrapping the glass fiber cloth 230 is obtained. Specifically, the thickness of the glass fiber cloth 230 may be 0.1 to 0.2mm, and the thickness of the ceramic shell body 100 may be 0.3mm, so that the weight of the shell may not be greater than 26g and the anti-falling height of 30g of falling balls may not be less than 75 cm.
The application provides a carry out the technical scheme of reinforcement with glass fiber lid behind 3D pottery cell-phone, under the prerequisite that does not influence the whole thickness of casing and intensity, through the lightweight of attenuate ceramic thickness realization casing, make the weight of casing reduce to 21 ~ 28g by 35g, and do not influence the ceramic warm and moist outward appearance and feel like jade, simultaneously, the 30g of casing ball that falls highly improves to 55 ~ 85cm of anti falling the ball.
In summary, according to the embodiments of the present application, a housing of an electronic device is provided, which has high hardness and an appearance effect of a ceramic material, and a reinforcement layer formed by glass fibers and epoxy resin can reinforce a ceramic housing body, so that the ceramic housing has better toughness, and the ceramic housing can achieve a design trend of lightweight while ensuring high impact strength.
In another aspect of an embodiment of the present application, a method of making a housing for an electronic device is presented. According to an embodiment of the present application, referring to fig. 5, the manufacturing method includes:
s100: and fitting the material of the reinforcing layer into one side surface of the ceramic shell body.
In this step, a material of a reinforcing layer is attached to one side surface of the ceramic case body, wherein the material of the reinforcing layer includes glass fiber and epoxy resin. According to the embodiment of this application, the concrete mode of laminating technical personnel in the field can carry out corresponding selection according to the concrete material kind of enhancement layer, specifically for example can utilize rubber or silica gel profile modeling mould to exert directional pressure to glass fiber material, so, the profile modeling mould of rubber or silica gel takes place to deform under the pressure effect to exert even pressure to each angle of glass fiber material, thereby be favorable to guaranteeing that glass fiber material is laminated on the 3D ceramic housing body uniformly. In addition, the surface of the rubber or silica gel copying mold can be pasted with release paper or coated with a release agent to prevent the epoxy resin from being adhered to the mold; the pressure of the directional pressure can be 10-100 kg/cm2And after the glass fiber material is uniformly laminated with the ceramic under pressure, bubbles can be extruded.
In some embodiments of the present invention, the material of the reinforcing layer may be selected from glass fiber board, such as commercially available fully cured glass fiber board, the thickness of which may be 0.1-0.3 mm, and the content of glass fiber in the glass fiber board is 30-70 v/v%, and the content of epoxy resin in the glass fiber board is 70-30 v/v%, and step S100 may include: s110, carrying out preheating treatment on the glass fiber board, wherein the preheating treatment is carried out at the temperature of 120-200 ℃ for 5-30S, subsequent hot bending treatment of the fully-cured glass fiber board is facilitated, and a layer of epoxy resin adhesive with the thickness of about 0.1mm is sprayed on the surface of one side of the glass fiber board; s120, attaching the surface of the glass fiber plate with the epoxy resin glue to the surface of a 3D ceramic shell body with the thickness of 0.1-0.4 mm. Therefore, the bonding method of the fully cured glass fiber board has the advantages that the glass fiber board is rich in source and easy to store, but the process is complex, the glass fiber board needs to be subjected to hot bending, and epoxy resin needs to be coated.
In other embodiments of the present invention, a material of the reinforcement layer may also be selected from a semi-cured glass fiber board, such as a commercially available semi-cured glass fiber board, and a content of glass fibers in the glass fiber board is also 30-70 v/v%, and a content of epoxy resin is also 70-30 v/v%, if the content of glass fibers is less than 30 v/v%, a reinforcement effect of the reinforcement layer cannot be ensured, and if the content of glass fibers is more than 70 v/v%, the content of epoxy resin is less than 30 v/v%, and a bonding strength cannot be ensured; and step S100 may also include: s130, preheating the glass fiber board, wherein the temperature of the preheating treatment is 100-180 ℃ and the time is 5-30S, so that the semi-cured glass fiber board can be softened; s140 attaches the glass fiber plate to the surface of the ceramic case body, so that the reinforcing layer including the glass fiber and the epoxy resin can be directly attached to the inner cavity surface of the 3D ceramic case body. Therefore, the method for bonding the semi-cured glass fiber board has the advantages of simple process, no need of additionally spraying epoxy resin on the semi-cured glass fiber board, convenience in batch production, and difficulty in long-term storage due to the fact that the semi-cured glass fiber board needs to be stored at low temperature.
In other embodiments of the invention, the material of the reinforcing layer may also be a fiber cloth, specifically, for example, a commercially available glass fiber cloth with a thickness of 0.1-0.3 mm, and the fiber cloth is impregnated with an epoxy resin, or one side surface of the fiber cloth is sprayed with an epoxy resin, so that the fiber cloth with flexibility can be directly attached to the inner cavity surface of the 3D ceramic housing body. Therefore, the method for directly laminating the glass fiber cloth has the advantages that the glass fiber cloth can be well laminated with the ceramic, bubbles between the glass fiber cloth and the ceramic shell body are few, and glue overflowing is caused at the edge of the glass fiber cloth and the ceramic shell body, so that glue cleaning treatment is required subsequently.
S200: and heating the attached ceramic shell body to obtain the shell.
In this step, the ceramic case body bonded in step S100 is subjected to a heat treatment to obtain a case, and the weight of the case is less than 30g and the drop-resistant height of 30g of dropped balls is not less than 55 cm. According to the embodiment of the invention, the temperature of the heating treatment can be 140-200 ℃, and the time can be 1-3 hours, so that the epoxy resin in the reinforcing layer can be fully cured and shaped, the effect of reinforcing and toughening the shell is better, and the impact resistance of the shell is higher.
In some embodiments of the present invention, the initial pressure of the heat treatment may be 1 to 5kg/cm for the epoxy resin and fiber cloth impregnated or sprayed thereon2The heating temperature is 80-120 ℃, the heat preservation and pressure maintaining time is 30-120 s, and after the epoxy resin is slightly cured, the pressure and the temperature are respectively increased to 10-100 kg/cm2And 140-200 ℃ and preserving heat for 1-3 hours, so that the glass fiber cloth can be attached to the ceramic, and the sectional heating and pressurizing mode is used for preventing the epoxy resin from being extruded out of the gap between the glass fiber cloth and the ceramic shell body due to the fact that the pressure is too high at the beginning.
In some embodiments of the invention, in addition to the method of directional pressurization and adhesion and heating and curing by using a rubber or silica gel profiling mold, the material of the reinforcement layer can be placed on the inner cavity surface of the 3D ceramic shell body, and then the material is placed into a high-temperature plastic bag and vacuumized to 50-200 Pa, and then the plastic bag is placed into an autoclave for vacuum hot-pressing treatment. Wherein, the temperature of the vacuum hot pressing treatment can be 140-200 ℃, the air pressure is 0.5-1.5 MPa, and the heat preservation time is 1-3 h, and the gas can be air or nitrogen. So, the benefit of using the autoclave lies in high temperature high-pressure gas, applys more even pressure to each angle of casing through the plastic bag, can guarantee that glass fiber material and ceramic housing body reach 100%'s laminating, and between the two bubble-free, the enhancement layer does not have the fold more.
In summary, according to the embodiments of the present disclosure, a manufacturing method is provided, in which a reinforcement layer made of glass fiber and epoxy resin is attached to an inner surface of a ceramic case body, so that a ceramic case assembly with high hardness, high impact strength and lighter weight can be obtained, and the manufacturing method has the advantages of abundant toughening raw materials, simple process or convenience for mass production.
In another aspect of an embodiment of the present application, an electronic device is provided.
According to an embodiment of the present application, referring to fig. 6, the electronic apparatus 1 includes a housing 10 and a display device 20; the shell comprises a ceramic shell body and a reinforcing layer which are arranged in a laminated mode, and the material forming the reinforcing layer comprises glass fiber and epoxy resin; and the display device 20 is connected to the housing 10.
According to the embodiment of the present invention, the specific type of the electronic device is not particularly limited, such as a mobile phone, a tablet computer, a smart watch, and the like, and those skilled in the art may select the electronic device according to the specific application of the electronic device, which is not described herein again. It should be noted that the electronic device includes other necessary components and structures besides the housing and the display device, for example, a mobile phone, specifically, such as a processor, a memory, a battery, a circuit board, a camera, etc., and those skilled in the art can design and supplement the electronic device accordingly according to the specific type of the electronic device, and details are not described herein.
In summary, according to the embodiments of the present application, an electronic device is provided, in which a housing has a ceramic appearance, high strength, high impact strength, and lighter weight, so that the electronic device has better anti-falling performance, and the electronic device has a longer service life. It will be appreciated by those skilled in the art that the features and advantages described above with respect to the housing of the electronic device, which are not described in detail herein, still apply to the electronic device.
The invention will now be described with reference to specific examples, which are intended to be illustrative only and not to be limiting in any way.
Comparative example 1
In this comparative example, ball drop tests were performed on ceramic case bodies of 0.2mm, 0.3mm and 0.5mm thickness, respectively. Specifically, 30g of the steel ball is dropped from a predetermined height and hit on the test sample, and the highest height at which the sample does not crack is the ball drop resistance height of 30g of the dropped ball.
The results of the ball drop test of this comparative example are shown in table 1.
Example 1
In this embodiment, a housing of an electronic device is fabricated, wherein the material of the reinforcing layer is selected from a commercially available fully-cured glass fiber board. The method comprises the following specific steps:
(1) selecting a commercial fully-cured glass fiber board with the thickness of 0.1 or 0.2mm and the glass fiber content of 30-70%;
(2) preheating a glass fiber plate at 120-200 ℃ for 5-30 s, and then hot-bending the glass fiber plate into a 3D shape matched with a ceramic shell body by using a mold; then spraying a layer of epoxy resin glue with the thickness of about 0.1mm on one surface of the 3D glass fiber board;
(3) the method comprises the steps of well attaching a 3D glass fiber board and a 3D ceramic shell body with the thickness of 0.1mm or 0.2mm, and applying unidirectional pressure to the glass fiber board by utilizing a rubber or silica gel profiling mold, wherein the pressure can be 10-100 kg/cm2(ii) a Uniformly attaching the glass fiber board to the ceramic shell body, extruding bubbles, heating the glass fiber board and the ceramic at the heating temperature of 140-200 ℃ for 1-3 h, and curing the sprayed epoxy resin to attach the glass fiber board to the ceramic;
(4) or replacing the step (3), placing the 3D glass fiber plate coated with the epoxy resin and the 3D ceramic shell body into a high-temperature-resistant plastic bag, vacuumizing to 50-200 Pa by using a vacuum packaging machine, then placing the plastic bag into an autoclave, wherein the temperature of the autoclave is 140-200 ℃, the heat preservation time is 1-3 h, the air pressure is 0.5-1.5 MPa, and the gas is air or nitrogen.
The results of the ball drop test for the 4 cases of this example are shown in table 1. Examples 1-1 to 1-3 are directed pressurization and heat curing, and examples 1-4 are vacuum heat treatment using a heating tank.
Example 2
In this example, a housing of an electronic device was fabricated, wherein the material of the reinforcing layer was selected from commercially available semi-fully cured glass fiber board. The method comprises the following specific steps:
(1) selecting a commercially available semi-cured glass fiber board with the thickness of 0.1 or 0.2mm and the glass fiber content of 30-70%;
(2) firstly, placing a semi-cured glass fiber board in an inner cavity of a 3D ceramic shell body with the thickness of 0.1mm or 0.2mm, and preheating materials at the temperature of 100-180 ℃ for 5-30 s;
(3) applying unidirectional pressure to the glass fiber board by using a rubber or silica gel profiling mold, wherein the pressure can be 10-100 kg/cm2(ii) a After the glass fiber board is uniformly attached to the ceramic shell body, extruding bubbles, heating the glass fiber board and the ceramic at the heating temperature of 140-200 ℃ for 1-3 h, and curing the epoxy resin to realize the attachment of the glass fiber board and the ceramic;
(4) or replacing the step (3), placing the softened semi-cured glass fiber board and the 3D ceramic shell body into a high-temperature-resistant plastic bag, vacuumizing to 50-200 Pa by using a vacuum packaging machine, then placing the plastic bag into an autoclave, wherein the temperature of the autoclave is 140-200 ℃, the heat preservation time is 1-3 h, the air pressure is 0.5-1.5 MPa, and the gas is air or nitrogen.
The results of the ball drop test for the 4 cases of this example are shown in table 1. Examples 2-1 to 2-3 are directed pressurization and heat curing, and examples 2-4 are vacuum heat treatment using a heating tank.
Example 3
In this embodiment, a housing of an electronic device is manufactured, wherein the material of the reinforcing layer is commercially available glass fiber cloth. The method comprises the following specific steps:
(1) selecting commercially available glass fiber cloth with the thickness of 0.1 or 0.2mm, and pre-soaking the glass fiber cloth with epoxy resin or coating the glass fiber cloth with the epoxy resin, wherein the content of glass fiber is 30-70%;
(2) firstly, placing glass fiber cloth impregnated or coated with epoxy resin in an inner cavity of a 3D ceramic shell body with the thickness of 0.1mm or 0.2 mm;
(3) applying unidirectional pressure to the glass fiber board by using a rubber or silica gel profiling mold, wherein the pressure can be 10-100 kg/cm2(ii) a The glass fiber plate and the ceramic shell body are uniformAfter the bonding, extruding bubbles, and heating the glass fiber plate and the ceramic at the initial pressure of 1-5 kg/cm2Heating at 80-120 ℃, keeping the temperature and the pressure for 30-120 s, and respectively increasing the pressure and the temperature to 10-100 kg/cm after the epoxy resin is slightly cured2And at the temperature of 140-200 ℃, the heat preservation time is 1-3 h, and the bonding of the glass fiber cloth and the ceramic is realized;
(4) or replacing the step (3), placing the softened semi-cured glass fiber board and the 3D ceramic shell body into a high-temperature-resistant plastic bag, vacuumizing to 50-200 Pa by using a vacuum packaging machine, then placing the plastic bag into an autoclave, wherein the temperature of the autoclave is 140-200 ℃, the heat preservation time is 1-3 h, the air pressure is 0.5-1.5 MPa, and the gas is air or nitrogen.
The results of the ball drop test for the 4 cases of this example are shown in table 1. Examples 3-1 to 3-3 are directed pressurization and heat curing, and examples 3-4 are vacuum heat treatment using a heating tank.
Summary of the invention
The results of the ball drop test of examples 1 to 3 and comparative example 1 are summarized in Table 1. As can be seen from Table 1, in the comparative example, the weight of the ceramic case body having a thickness of 0.2mm was 20g but the ball drop height of 30g was only 10cm, the weight of the ceramic case body having a thickness of 0.3mm was 25g but the ball drop height of 30g was 30cm, and the weight of the ceramic case body having a thickness of 0.5mm was 35g and the ball drop height of 30g reached 80 cm. The weight of the shell in the embodiments 1-3 is lighter than 30g, and the height of 30g of anti-falling balls reaches more than 55 cm; in example 3, the combination of the glass fiber board and the epoxy resin is adopted, a ceramic casing body with a thickness of 0.3mm is selected, the weight of the casing is not more than 26g, the 30g ball drop resistance height reaches 75-85 cm, the impact strength of the casing is equivalent to that of the ceramic casing body with the thickness of 0.5mm, but the weight of the casing is lighter than that of the ceramic casing body with the thickness of 0.5mm by more than 10 g.
TABLE 1 falling ball test results for each example and comparative example
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (15)
1. A shell of an electronic device is characterized by comprising a ceramic shell body and a reinforcing layer which are arranged in a laminated mode, wherein the material forming the reinforcing layer comprises glass fiber and epoxy resin, the weight of the shell is less than 30g, and the ball falling resistance height of 30g of falling balls is not less than 55 cm.
2. The case of claim 1, wherein the ceramic case body has a thickness of 0.1 to 0.4mm, and the reinforcement layer has a thickness of 0.1 to 0.3 mm.
3. The case according to claim 2, wherein the ceramic case body has a thickness of 0.2 to 0.3mm, and the reinforcement layer has a thickness of 0.1 to 0.2 mm.
4. The housing of claim 1, wherein the reinforcement layer is formed from a fiberglass panel, and a cured epoxy glue layer is disposed between the fiberglass panel and the ceramic housing body.
5. The casing of claim 1, wherein the reinforcing layer is formed of a cured glass fiber board, and the glass fiber board contains 30-70 v/v% of glass fiber and 70-30 v/v% of epoxy resin.
6. The housing of claim 1, wherein the reinforcing layer is a cured epoxy layer, and the epoxy layer wraps the fiberglass cloth.
7. The casing of claim 6, wherein the glass cloth has a thickness of 0.1 to 0.2mm, the ceramic casing body has a thickness of 0.3mm, and the casing has a weight of not more than 26g and a ball drop height of not less than 75cm for 30g of ball drops.
8. A method of making a housing for an electronic device, comprising:
attaching a material of a reinforcing layer into one side surface of the ceramic shell body, wherein the material of the reinforcing layer comprises glass fiber and epoxy resin;
and heating the attached ceramic shell body to obtain the shell, wherein the weight of the shell is less than 30g, and the falling ball resistance height of 30g of falling balls is not less than 55 cm.
9. The method of claim 8, wherein the material of the reinforcing layer is a fiberglass sheet, and the step of conforming includes:
preheating the glass fiber board, and spraying a layer of epoxy resin glue on the surface of one side of the glass fiber board;
and adhering the surface of the glass fiber board with the epoxy resin glue to the surface of the ceramic shell body.
10. The method according to claim 8, wherein the material of the reinforcement layer is a semi-cured glass fiber board, the glass fiber board contains 30-70 v/v% of glass fiber and 70-30 v/v% of epoxy resin, and the step of attaching comprises:
preheating the glass fiber board;
and attaching the glass fiber board to the surface of the ceramic shell body.
11. The method of claim 8, wherein the material of the reinforcement layer is a fiber cloth, the fiber cloth is impregnated with epoxy resin, or one side surface of the fiber cloth is sprayed with epoxy resin.
12. The method according to any one of claims 9 to 11, wherein the adhering mode adopts a rubber or silica gel profiling mold for directional adhering, and the adhering pressure is 10 to 100kg/cm2。
13. The method according to any one of claims 9 to 11, wherein the bonding and the heating are performed by vacuum autoclave processing of the vacuum-packed ceramic case body at a temperature of 140 to 200 degrees celsius for 1 to 3 hours and at a pressure of 0.5 to 1.5 MPa.
14. The method according to claim 8, wherein the heat treatment is performed at a temperature of 140 to 200 ℃ for 1 to 3 hours.
15. An electronic device, comprising:
the shell comprises a ceramic shell body and a reinforcing layer which are arranged in a laminated mode, and the material forming the reinforcing layer comprises glass fiber and epoxy resin;
a display device coupled to the housing.
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| CN201911205744.6A CN110843274A (en) | 2019-11-29 | 2019-11-29 | Shell of electronic equipment, manufacturing method of shell and electronic equipment |
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| CN111716853A (en) * | 2020-06-22 | 2020-09-29 | 株洲时代新材料科技股份有限公司 | Wear-resistant heat-insulating composite material and preparation method thereof |
| CN112428629A (en) * | 2020-11-13 | 2021-03-02 | Oppo广东移动通信有限公司 | Shell assembly, preparation method and electronic equipment |
| WO2021047659A1 (en) * | 2019-09-12 | 2021-03-18 | 华为技术有限公司 | Middle frame, rear cover and preparation method therefor, and electronic device |
| CN113347816A (en) * | 2021-05-31 | 2021-09-03 | Oppo广东移动通信有限公司 | Shell, preparation method thereof and electronic equipment |
| CN113573521A (en) * | 2021-07-21 | 2021-10-29 | Oppo广东移动通信有限公司 | Shell assembly, manufacturing method thereof and electronic equipment |
| CN114095597A (en) * | 2020-08-24 | 2022-02-25 | Oppo广东移动通信有限公司 | Ceramic composite material, manufacturing method thereof, shell of electronic equipment and electronic equipment |
| CN115366497A (en) * | 2022-08-15 | 2022-11-22 | Oppo广东移动通信有限公司 | Electronic equipment, shell and preparation method thereof |
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| CN116075092A (en) * | 2023-01-28 | 2023-05-05 | 荣耀终端有限公司 | Rear cover of electronic equipment, manufacturing method of rear cover and electronic equipment |
| CN116744589A (en) * | 2022-09-15 | 2023-09-12 | 荣耀终端有限公司 | Shell structure, manufacturing method thereof and electronic equipment |
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| WO2021047659A1 (en) * | 2019-09-12 | 2021-03-18 | 华为技术有限公司 | Middle frame, rear cover and preparation method therefor, and electronic device |
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| WO2022252726A1 (en) * | 2021-05-31 | 2022-12-08 | Oppo广东移动通信有限公司 | Housing and preparation method therefor, and electronic device |
| CN113573521A (en) * | 2021-07-21 | 2021-10-29 | Oppo广东移动通信有限公司 | Shell assembly, manufacturing method thereof and electronic equipment |
| CN117201647A (en) * | 2022-05-30 | 2023-12-08 | 荣耀终端有限公司 | 5D ceramic shell structure and 5D ceramic processing technique |
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| CN115384132A (en) * | 2022-08-15 | 2022-11-25 | Oppo广东移动通信有限公司 | Shell, preparation method and electronic equipment |
| CN116744589A (en) * | 2022-09-15 | 2023-09-12 | 荣耀终端有限公司 | Shell structure, manufacturing method thereof and electronic equipment |
| CN116075092A (en) * | 2023-01-28 | 2023-05-05 | 荣耀终端有限公司 | Rear cover of electronic equipment, manufacturing method of rear cover and electronic equipment |
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Application publication date: 20200228 |