CN110831342A - Preparation method of miniLED backlight module - Google Patents
Preparation method of miniLED backlight module Download PDFInfo
- Publication number
- CN110831342A CN110831342A CN201911120349.8A CN201911120349A CN110831342A CN 110831342 A CN110831342 A CN 110831342A CN 201911120349 A CN201911120349 A CN 201911120349A CN 110831342 A CN110831342 A CN 110831342A
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- Prior art keywords
- miniled
- wiring
- trace
- wire
- lamp
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention relates to the technical field of display, and discloses a miniLED backlight module preparation method, wherein the miniLED backlight module comprises a medium substrate, the mounting surface of the medium substrate is provided with a plurality of miniLED lamp mounting areas distributed in an array manner, and the method at least comprises the following steps: printing a first wire and a second wire on the mounting surface of the medium substrate, wherein the first wire and the second wire are formed in each miniLED lamp mounting area; and installing a plurality of miniLED lamps in a miniLED lamp installation area in a one-to-one correspondence mode, wherein in each miniLED lamp, one electrode is electrically connected with the first wiring, and the other electrode is electrically connected with the second wiring. The first wiring and the second wiring are directly formed by printing at the place where the wiring needs to be formed, so that the preparation process is simplified, meanwhile, the first wiring and the second wiring are only printed at the place where the wiring needs to be formed, and the material for forming the wiring is saved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a miniLED backlight module preparation method.
Background
In a miniLED display, a plurality of miniLED lamp arrays are distributed on the surface of a dielectric substrate (usually a flexible circuit board) as a backlight source. The manufacturing process generally comprises the steps of firstly plating copper on the front surface and the back surface of the flexible circuit board, then patterning a copper film layer on the surface of the flexible circuit board by utilizing the processes of etching and the like to form wiring of the miniLED lamp, then soldering tin at the wiring position, positioning the miniLED lamp, and finally electrically connecting the miniLED lamp with the wiring by high-temperature reflow soldering. In the prior art, the copper in the rest areas does not play a role in the final product except for forming the wiring after etching, so that materials are wasted, and the whole manufacturing process is complicated.
Disclosure of Invention
The invention discloses a miniLED backlight module preparation method which is used for simplifying the production process and saving materials in the process of preparing a miniLED backlight module.
In order to achieve the purpose, the invention provides the following technical scheme:
a miniLED backlight module preparation method, the said miniLED backlight module includes the dielectric substrate, the installation surface of the dielectric substrate has a plurality of miniLED lamps installation areas that are distributed in array, said method includes the following step at least:
printing a first wire and a second wire on the mounting surface of the medium substrate, wherein the first wire and the second wire are formed in each miniLED lamp mounting area;
and installing a plurality of miniLED lamps in a miniLED lamp installation area in a one-to-one correspondence mode, wherein in each miniLED lamp, one electrode is electrically connected with the first wiring, and the other electrode is electrically connected with the second wiring.
In a specific embodiment, the printing the first trace and the second trace on the mounting surface of the media substrate specifically includes:
and printing the first wiring and the second wiring by adopting silver paste.
In a specific embodiment, the width of the first trace is greater than or equal to 0.02mm and less than or equal to 0.04 mm;
the width of the second wire is greater than or equal to 0.02mm and less than or equal to 0.04 mm.
In a specific embodiment, the printing the first trace and the second trace on the mounting surface of the media substrate specifically includes:
and printing the first routing wire and the second routing wire by using carbon black.
In a specific embodiment, the media substrate comprises a PET film.
In a specific embodiment, before the step of mounting the miniLED lamps in the miniLED lamp mounting area in a one-to-one correspondence manner, a reflective layer is formed on the mounting surface, and the reflective layer covers the first routing lines and the second routing lines.
In a specific embodiment, the forming a reflective layer on the mounting surface specifically includes:
and printing white ink on the mounting surface to form the reflecting layer.
In a specific embodiment, the mounting the miniLED lamps in the miniLED lamp mounting area in a one-to-one correspondence includes:
and forming conductive adhesive on the mounting surface, wherein the conductive adhesive covers each miniLED lamp mounting area, placing each miniLED lamp in the corresponding miniLED lamp mounting area, and electrically connecting the first routing wire and the second routing wire with the corresponding electrode of the miniLED lamp respectively through the conductive adhesive.
In a specific embodiment, the conductive adhesive is an anisotropic conductive adhesive film;
the first line of will walking with the second is walked the line and is connected with the electrode electricity that miniLED lamp corresponds respectively through conducting resin, specifically includes:
and aligning the two electrodes corresponding to the miniLED lamp with the first wiring and the second wiring in the miniLED lamp mounting area respectively, and hot-pressing the miniLED lamp.
In a specific embodiment, the temperature range when the miniLED lamp is hot-pressed is greater than or equal to 130 ℃ and less than or equal to 160 ℃, and the pressure is greater than or equal to 40Pa and less than or equal to 80 Pa.
In the miniLED backlight module manufacturing method, the first wires and the second wires are firstly formed on the mounting surface of the medium substrate in a printing mode, and the wires (the first wires and the second wires) are formed at the positions of the medium substrate and are directly printed at the positions, instead of firstly plating copper on the front side and the back side of the surface of the medium substrate and then forming the metal wires in an etching mode, the manufacturing method provided by the application is simplified in process and improves the production efficiency; and, because in the miniLED backlight unit preparation method that this application provided, only in the place direct printing that will form first line and second line, do not print in other places, compare to the copper facing condition of medium substrate front among the prior art, saved the material that forms the line, reduced manufacturing cost.
Drawings
Fig. 1 is a miniLED backlight module formed by the method for manufacturing a miniLED backlight module according to the embodiment of the present disclosure;
fig. 2 is a schematic flow chart of a method for manufacturing a miniLED backlight module according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and fig. 2, in the method for manufacturing a miniLED backlight module provided in the embodiment of the present application, the miniLED backlight module includes a dielectric substrate 100, a mounting surface of the dielectric substrate 100 has a plurality of miniLED lamp mounting areas distributed in an array (the area may refer to a position of each miniLED lamp 10 in fig. 1), and the method at least includes the following steps:
s100, printing a first wire 20 and a second wire 30 on the mounting surface of the medium substrate 100, wherein the first wire 20 and the second wire 30 are formed in each miniLED lamp mounting area;
s200, a plurality of miniLED lamps 10 are correspondingly arranged in a miniLED lamp installation area, wherein in each miniLED lamp 10, one electrode is electrically connected with the first wiring 20, and the other electrode is electrically connected with the second wiring 30.
In the miniLED backlight module manufacturing method provided by the embodiment of the application, the first routing 20 and the second routing 30 are formed on the mounting surface of the medium substrate 100 in a printing mode, and the routing (the first routing 20 and the second routing 30) is formed at the position of the medium substrate 100 and is directly printed at the position, instead of plating copper on the front side and the back side of the surface of the medium substrate and forming the metal routing in an etching mode, the manufacturing method provided by the application is simplified in process and improves the production efficiency; and, because in the miniLED backlight unit preparation method that this application provided, only in the place direct printing that will form first line 20 and second line 30, do not print in other places, compare the condition of copper facing to the medium substrate front among the prior art, saved the material that forms the line, reduced manufacturing cost.
Illustratively, in fig. 1, a plurality of miniLED lamps 10 are distributed in an array (it should be noted that, a plurality of points arranged between two miniLED lamps 10 in fig. 1 indicate that one or more miniLED lamps 10 not shown are omitted), the anode 11 of a miniLED lamp 10 is electrically connected to a first trace 20, and the cathode 12 is electrically connected to a second trace 30, more specifically, in fig. 1, the first trace 20 includes a plurality of first longitudinal traces 21 extending in parallel longitudinally, and a first transverse trace 22 extending transversely, wherein each first longitudinal trace 21 electrically connects the anodes 11 in a column of miniLED lamps 10, the first transverse trace 22 electrically connects one end of each first longitudinal trace 21 sequentially, the second trace 30 includes a plurality of second longitudinal traces 31 extending in parallel longitudinally, a second transverse trace 32 extending transversely, and a transverse lead 33 extending transversely, each second longitudinal trace 31 electrically connects the cathodes 12 in a column of miniLED lamps 10, the second horizontal traces 32 electrically connect the same ends of the second vertical traces 31 in sequence, wherein the first horizontal traces 22 and the second horizontal traces 32 are located at two opposite ends of the mounting surface of the dielectric substrate 100 in a one-to-one correspondence manner, and the horizontal leads 33 electrically connect one second vertical trace 31 located at the edge and extend to the vicinity of the end of the first horizontal trace 22, so that the first trace 20 and the second trace 30 are electrically connected to the power supply. As described above, the plurality of first longitudinal traces 21 and the plurality of second longitudinal traces 31 are arranged in a staggered manner, so that short circuit between the first traces 20 and the second traces 30 is avoided, and the first traces 21 and the second traces 31 are printed and formed on the mounting surface of the dielectric substrate 100 at one time, and it is not necessary to print traces on two sides of the dielectric substrate 100 respectively. It should be understood that the above description about the extending tracks of the first trace 20 and the second trace 30 is only an exemplary description as long as it is ensured that at least one first trace 20 and at least one second trace 30 pass through each miniLED lamp mounting region, and in each miniLED lamp mounting region, the first trace 20 is connected with one electrode of the miniLED lamp 10, and the second trace 30 is connected with the other electrode of the miniLED lamp 10. Further, the first wire 20 is not limited to be connected to the positive electrode 11 of the miniLED lamp 10, but may be connected to the negative electrode 12 of the miniLED lamp 10, and accordingly, the second wire 30 is electrically connected to the positive electrode 11 of the miniLED lamp 10.
In a specific embodiment, in step S100, printing the first trace 20 and the second trace 30 on the mounting surface of the dielectric substrate 100 specifically includes:
printing the first trace 20 and the second trace 30 by silver paste; the silver paste is convenient to print, is favorable for improving printing efficiency, has better conductive property, and ensures that the miniLED lamp 10 can both keep good power supply.
In a specific embodiment, when the first trace 20 is printed by using a silver paste, the width of the first trace 20 is greater than or equal to 0.02mm and less than or equal to 0.04mm, for example, 0.02mm, 0.03mm or 0.04mm, and when the width of the first trace 20 is less than 0.02mm, the self-resistance is too large, the printing difficulty is increased, and the first trace is easy to burn out, and when the width of the first trace 20 is greater than 0.04mm, the performances such as impedance are not improved, and the material is wasted;
similarly, when adopting silver thick liquid printing second to walk line 30, the width more than or equal to 0.02mm and less than or equal to 0.04mm of second is walked line 30, for example, can be 0.02mm, 0.03mm or 0.04mm, when second is walked line 30 width and is less than 0.02mm, can lead to self resistance too big, the printing degree of difficulty increases, and burn out easily, when second is walked line 30 width and is greater than 0.04mm, performance such as impedance not only does not promote, still can lead to the waste of material.
In addition to printing the first trace 20 and the second trace 30 by using silver paste, the first trace 20 and the second trace 30 may also be printed by using carbon black, for example, in a specific embodiment, printing the first trace 20 and the second trace 30 on the mounting surface of the dielectric substrate 100 specifically includes:
the first trace 20 and the second trace 30 are printed with carbon black.
And to the selection of medium substrate 100, it can be flexible circuit board, also can be the PET membrane (polyester substrate), because the PET membrane has better toughness, in the process of printing first line 20 of walking and second line 30, not fragile to the PET membrane is lower than flexible circuit board cost, is convenient for reduce in production cost.
In a specific embodiment, before step S200, step S110 may be performed first, that is, a reflective layer is formed on the mounting surface of the dielectric substrate 100, and the reflective layer covers the first trace 20 and the second trace 30, on one hand, the reflective layer is used to reflect light irradiated to the surface of the dielectric substrate 100 to the light emergent direction of the backlight module, which is beneficial to improving image quality, and on the other hand, when the first trace 20 and the second trace 30 are printed by using silver paste, the silver paste may be isolated from the outside air, so as to prevent the silver paste from being oxidized or corroded, and the reflective layer may also provide physical protection for the first trace 20 and the second trace 30, so as to prevent the first trace 20 and the second trace 30 from being scratched and broken.
There are various ways to form the reflective layer, for example, step S110 specifically includes:
white ink is printed on the mounting surface of the media substrate 100 to form the reflective layer. In addition, the reflective film may be formed by forming a dielectric high reflective film having a multilayer thin film structure on the mounting surface of the dielectric substrate 100.
The manner of step S200 may be various, for example, in a specific embodiment, S200 specifically includes:
conductive adhesive is formed on the mounting surface of the dielectric substrate 100, wherein the conductive adhesive covers each miniLED lamp mounting region, each miniLED lamp 10 is placed in the corresponding miniLED lamp mounting region, and the first wiring 20 and the second wiring 30 are electrically connected with the corresponding electrodes of the miniLED lamp 10 respectively through the conductive adhesive.
More specifically, the conductive adhesive is an anisotropic conductive adhesive film;
the first wire 20 and the second wire 30 are electrically connected to the corresponding electrodes of the miniLED lamp 10 through the conductive adhesive, and the method specifically includes:
two electrodes corresponding to the miniLED lamp 10 are aligned with the first wiring 20 and the second wiring 30 in the miniLED lamp mounting area respectively, the miniLED lamp 10 is hot-pressed, the anisotropic conductive adhesive film is electrically conducted at the hot-pressed place, the non-hot-pressed place is not electrically conducted, and short circuit between the anode 11 and the cathode 12 of the miniLED lamp 10 is avoided.
Wherein, the temperature range when the miniLED lamp 10 is hot pressed is greater than or equal to 130 ℃ and less than or equal to 160 ℃, for example, 130 ℃, 140 ℃, 150 ℃ or 160 ℃, and when the temperature is less than 130 ℃ or greater than 160 ℃, the conductivity of the anisotropic conductive adhesive film is poor; the pressure is greater than or equal to 40Pa and less than or equal to 80Pa, for example, 40Pa, 50Pa, 60Pa, 70Pa or 80Pa, and when the pressure is greater than 80Pa or less than 40Pa, the anisotropic conductive film has poor conductivity.
It will be apparent to those skilled in the art that various changes and modifications may be made in the embodiments of the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A miniLED backlight module preparation method, the said miniLED backlight module includes the medium substrate, the installation surface of the medium substrate has a plurality of miniLED lamps installation areas that are distributed in array, characterized by that, the method includes the following step at least:
printing a first wire and a second wire on the mounting surface of the medium substrate, wherein the first wire and the second wire are formed in each miniLED lamp mounting area;
and installing a plurality of miniLED lamps in a miniLED lamp installation area in a one-to-one correspondence mode, wherein in each miniLED lamp, one electrode is electrically connected with the first wiring, and the other electrode is electrically connected with the second wiring.
2. The method according to claim 1, wherein printing the first trace and the second trace on the mounting surface of the dielectric substrate specifically comprises:
and printing the first wiring and the second wiring by adopting silver paste.
3. The method according to claim 2, wherein the width of the first trace is greater than or equal to 0.02mm and less than or equal to 0.04 mm;
the width of the second wire is greater than or equal to 0.02mm and less than or equal to 0.04 mm.
4. The method according to claim 1, wherein printing the first trace and the second trace on the mounting surface of the dielectric substrate specifically comprises:
and printing the first routing wire and the second routing wire by using carbon black.
5. The method of claim 1, wherein the media substrate comprises a PET film.
6. The method according to claim 1, wherein before the step of mounting the plurality of miniLED lamps in the miniLED lamp mounting area in a one-to-one correspondence, a reflective layer is formed on the mounting surface, and the reflective layer covers the first traces and the second traces.
7. The method according to claim 6, wherein the forming of the reflective layer on the mounting surface specifically comprises:
and printing white ink on the mounting surface to form the reflecting layer.
8. The method according to claim 1, wherein the mounting of the miniLED lamps in the miniLED lamp mounting area in a one-to-one correspondence includes:
and forming conductive adhesive on the mounting surface, wherein the conductive adhesive covers each miniLED lamp mounting area, placing each miniLED lamp in the corresponding miniLED lamp mounting area, and electrically connecting the first routing wire and the second routing wire with the corresponding electrode of the miniLED lamp respectively through the conductive adhesive.
9. The method of claim 8, wherein the conductive adhesive is an anisotropic conductive adhesive film;
the first line of will walking with the second is walked the line and is connected with the electrode electricity that miniLED lamp corresponds respectively through conducting resin, specifically includes:
and aligning the two electrodes corresponding to the miniLED lamp with the first wiring and the second wiring in the miniLED lamp mounting area respectively, and hot-pressing the miniLED lamp.
10. The method of claim 9, wherein the temperature range for hot pressing the miniLED lamp is greater than or equal to 130 ℃ and less than or equal to 160 ℃ and the pressure is greater than or equal to 40Pa and less than or equal to 80 Pa.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911120349.8A CN110831342A (en) | 2019-11-15 | 2019-11-15 | Preparation method of miniLED backlight module |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201911120349.8A CN110831342A (en) | 2019-11-15 | 2019-11-15 | Preparation method of miniLED backlight module |
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| CN110831342A true CN110831342A (en) | 2020-02-21 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11411151B2 (en) | 2020-08-18 | 2022-08-09 | Shanghai Tianma Micro-electronics Co., Ltd. | Light emitting panel and display device |
| CN116300214A (en) * | 2023-05-18 | 2023-06-23 | 深圳市瀚达美电子有限公司 | Production process of vehicle-mounted miniLED backlight module |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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Application publication date: 20200221 |