CN110828640B - Portable 3D-LED module and packaging method thereof - Google Patents
Portable 3D-LED module and packaging method thereof Download PDFInfo
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- CN110828640B CN110828640B CN201911117038.6A CN201911117038A CN110828640B CN 110828640 B CN110828640 B CN 110828640B CN 201911117038 A CN201911117038 A CN 201911117038A CN 110828640 B CN110828640 B CN 110828640B
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- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 16
- 238000000889 atomisation Methods 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 239000000463 material Substances 0.000 claims abstract description 11
- 238000009966 trimming Methods 0.000 claims abstract description 8
- 238000005520 cutting process Methods 0.000 claims abstract description 6
- 210000004379 membrane Anatomy 0.000 claims description 8
- 239000012528 membrane Substances 0.000 claims description 8
- 239000003292 glue Substances 0.000 claims description 7
- 210000002469 basement membrane Anatomy 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 6
- 239000011265 semifinished product Substances 0.000 claims description 6
- 239000011521 glass Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 3
- 239000003795 chemical substances by application Substances 0.000 claims description 3
- 238000005538 encapsulation Methods 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 230000005540 biological transmission Effects 0.000 claims 1
- 238000001723 curing Methods 0.000 abstract description 8
- 230000008569 process Effects 0.000 abstract description 7
- 238000007789 sealing Methods 0.000 abstract description 6
- 239000011324 bead Substances 0.000 abstract description 5
- 238000004026 adhesive bonding Methods 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000012423 maintenance Methods 0.000 abstract description 3
- 239000000047 product Substances 0.000 description 4
- 238000005253 cladding Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000010287 polarization Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 210000004556 brain Anatomy 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 238000012958 reprocessing Methods 0.000 description 1
- 229920006302 stretch film Polymers 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/54—Encapsulations having a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Led Device Packages (AREA)
Abstract
A portable 3D-LED module comprises an LED module, a 3D atomization film, a light-transmitting substrate and a stretching film, wherein the 3D atomization film is attached to the LED module after being attached to the light-transmitting substrate; the stretching film is coated on the light-transmitting substrate and is coated on the side face of the LED module through the folded edges attached to the LED module, the 3D atomization film and the side edge of the light-transmitting substrate. The invention saves the technological processes of gluing, sealing, curing, trimming and the like, greatly simplifies the technological process, and has higher efficiency and lower material cost; the module lamp beads can be directly repaired by cutting off the stretching film from the side surface, so that the operation is convenient and the maintenance is convenient; the packaging mode is not limited to a single box body, and a plurality of box bodies can be molded at one time, so that the mass production efficiency is improved; the thickness of the stretchable film is uniform, the final abutted seam of the portable 3D-LED module can be controlled to be below 0.1mm, the display effect of the product is not influenced, and the appearance performance reaches the standard.
Description
Technical Field
The invention relates to the field of stereoscopic display, in particular to a portable 3D-LED module which can directly cut off a stretched film on the side edge so as to repair a lamp bead, and is convenient to operate and convenient and fast to maintain; the invention also provides a packaging method of the portable 3D-LED module, which saves the technological processes of gluing, leveling, curing, trimming and the like, improves the efficiency and lowers the cost.
Background
The polarized stereo display is a 3D display method which utilizes the principle that light has 'vibration direction' to realize the decomposition of original image and stereo imaging, and mainly adopts the mode that adjacent rows, columns or even-odd stagger are arranged on a display device, and a left-handed polarized film and a right-handed polarized film are locally arranged, so that two pictures with different polarization directions are conveyed to a viewer, and when the pictures pass through polarized glasses, each lens of the polarized glasses can only receive the pictures with one polarization direction, so that the left eye and the right eye of a person can receive two groups of pictures, and then the pictures are synthesized into stereo images through the brain.
At present, the LED-3D module is firstly sealed and leveled up, glue adopted for sealing and leveling is generally mixed by glue A and glue B according to a certain proportion and then is sealed and leveled up or is sealed and leveled up by adopting Si glue alone, and the sealing and leveling completely covers the lamp beads exposed outside the surface of the LED module. Meanwhile, the traditional LED-3D module manufacturing process generally comprises the steps of sealing the LED module flat, attaching the sealed flat LED module to the 3D film, and trimming the attached LED module.
The invention is specially provided for the purpose.
Disclosure of Invention
The present invention provides a method for packaging a portable 3D-LED module, which is described in detail below.
A portable 3D-LED module comprises an LED module, a 3D atomization film, a light-transmitting substrate and a stretching film, wherein the 3D atomization film is tightly attached to the LED module, and the light-transmitting substrate is arranged on the 3D atomization film; the stretching film is coated on the light-transmitting substrate and is coated on the side face of the LED module through the folded edges attached to the LED module, the 3D atomization film and the side edge of the light-transmitting substrate.
Further, the stretched film is a film having no retardation compensation function.
The stretched film is a light-transmitting material with good stretching performance.
The stretched film is made of a film material with a single side and low viscosity.
The thickness of the stretched film is preferably less than or equal to 0.05mm so as to meet the requirement of seam splicing;
a packaging method of a portable 3D-LED module utilizes a packaging device, comprising the following steps:
the shell is wrapped outside, and a closed space is formed inside the shell;
the frame-shaped carrier plate drives the stretching film to vertically move downwards under the driving of external driving force;
a vacuum pump for vacuumizing the interior of the housing;
the edge trimmer is used for trimming the stretched film;
the packaging method comprises the following steps:
s1, preparing a 3D atomization film, and aligning and attaching the 3D atomization film and the light-transmitting substrate for later use;
s2, fixing the LED module 1 on a frame-shaped carrier plate platform, and horizontally placing the 3D atomization film and the light-transmitting substrate which are bonded and aligned in the S1 above the LED module 1 for calibration and alignment;
s3, pre-fixing the stretched film 4 above the frame-shaped carrier plate platform 1;
s4, the frame-shaped carrier plate platform is driven downwards to drive the stretched film 4 to act downwards on the surface of the light-transmitting substrate 3 to form an outer frame prototype;
s5, starting a vacuum machine, and carrying out vacuumizing treatment and defoaming treatment on the inner space of the shell;
and S6, lifting the frame-shaped carrier plate upwards, and moving the edge trimmer to the side face of the LED-3D module to cut off the redundant stretched film to obtain the LED-3D module. The step S1 relates to the preparation of the 3D atomization film, including the following steps;
s11, preparing a 1/2 phase difference lattice film, laminating a base film and a 1/2 phase difference compensation film, cutting the surface of the 1/2 phase difference compensation film, and stripping the ineffective 1/2 phase difference film to prepare a 1/2 phase difference lattice film;
s12, separating a basement membrane, laminating the circular polarizer and the 1/2 phase difference lattice membrane, and separating and removing the basement membrane for later use;
s13, filling, jointing and curing, namely filling, jointing and curing the prepared AG transparent haze film obtained in the step S12 with UV glue to obtain a semi-finished product 3D atomization film;
s14, preparing a 3D atomization film, and bonding the semi-finished product 3D atomization film obtained in the step S13 and the light-transmitting substrate through LOCA or OCA to obtain the product.
The light-transmitting substrate is made of a material with good light transmittance, such as a PC board, a glass board, an acrylic board or a TAC board.
Has the advantages that: compared with the prior art, the invention saves the technological processes of gluing, sealing, curing, trimming and the like, greatly simplifies the technological process, and has higher efficiency and lower material cost; the module lamp beads can be directly repaired by cutting off the stretching film from the side surface, so that the operation is convenient and the maintenance is convenient; the encapsulation mode is not limited to single box, also can a plurality of box one shot forming, improves volume production efficiency. The thickness of the stretchable film is uniform, the final abutted seam of the portable 3D-LED module can be controlled to be below 0.1mm, the display effect of the product is not influenced, and the appearance performance reaches the standard.
Drawings
FIG. 1: the invention discloses a structural schematic diagram of a 3D-LED module.
In the figure: LED module 1, 3D atomizing membrane 2, printing opacity base plate 3, tensile film 4, hem 5.
Detailed Description
A specific embodiment of the present invention will be described in detail with reference to fig. 1.
The utility model provides a portable 3D-LED module, includes LED module 1, 3D atomizing membrane 2, printing opacity base plate 3 and tensile film 4, 3D atomizing membrane 2 is attached to on LED module 1, and printing opacity base plate 3 sets up on 3D atomizing membrane 2, tensile film 4 cladding is on printing opacity base plate 3, tensile film 4 through laminate in LED module 1, 3D atomizing membrane 2, 5 cladding to LED module 1 of hem of 3 sides of printing opacity base plate.
Above the portable 3D-LED module that provides, when the lamp appears dying in a large tracts of land or contact failure in module lamp pearl, can directly cut open tensile film 4 through the side, and then carry out the reprocessing of lamp pearl, convenient operation, it is convenient to maintain.
The invention also provides a packaging method of the portable 3D-LED module, and the method utilizes a packaging device, which comprises the following steps:
the shell is wrapped outside, and a closed space is formed inside the shell;
the frame-shaped carrier plate drives the stretching film to vertically move downwards under the driving of external driving force;
a vacuum pump for vacuumizing the interior of the housing;
the edge trimmer is used for trimming the stretched film 4;
the packaging method comprises the following steps:
s1, preparing a 3D atomization film, and attaching the 3D atomization film to the light-transmitting substrate for later use;
s2, fixing the LED module 1 on a frame-shaped carrier plate platform, and then flatly placing the 3D atomization film and the transparent substrate 3 which are well attached and aligned above the LED module 1 for calibration and alignment;
s3, pre-fixing the stretched film 4 above the frame-shaped carrier plate platform 1;
s4, the frame-shaped carrier plate platform is driven downwards to drive the stretched film 4 to act downwards on the surface of the light-transmitting substrate 3 to form an outer frame prototype;
s5, starting a vacuum machine, and carrying out vacuumizing treatment and defoaming treatment on the inner space of the shell;
s6, the frame-shaped carrier plate is lifted upwards, the edge trimmer is moved to the side face of the LED-3D module to cut off the redundant stretched film, and the 3D-LED module in the shape of an outer package shown in the figure 1 is formed;
preferably, the stretched film 4 is a film having no retardation compensation function, and the stretched film 4 further preferably has a light-transmitting material having good stretching property; still further, the stretch film is made of a film material with a single side and low viscosity. Furthermore, the thickness of the stretching film is preferably less than or equal to 0.05mm so as to ensure the requirement of seam splicing.
The preparation of the 3D atomization film comprises the following steps;
s11, preparing a 1/2 phase difference lattice film, laminating a base film and a 1/2 phase difference compensation film, cutting the surface of the 1/2 phase difference compensation film, and stripping the ineffective 1/2 phase difference film to prepare a 1/2 phase difference lattice film;
s12, separating a basement membrane, laminating the circular polarizer and the 1/2 phase difference lattice membrane, and separating and removing the basement membrane for later use;
s13, filling, jointing and curing, namely filling, jointing and curing the prepared AG transparent haze film obtained in the step S12 with UV glue to obtain a semi-finished product 3D atomization film;
s14, preparing a 3D atomization film, and attaching the semi-finished product 3D atomization film obtained in the step S13 and the transparent carrier substrate through LOCA or OCA to obtain the product.
The light-transmitting substrate can be a material with good light transmittance, such as a PC plate, a glass plate, an acrylic plate, a TAC plate and the like.
Compared with the prior art, the invention saves the technological processes of gluing, sealing, curing, trimming and the like, greatly simplifies the technological process, and has higher efficiency and lower material cost; the module lamp beads can be directly repaired by cutting off the stretching film from the side surface, so that the operation is convenient and the maintenance is convenient; the encapsulation mode is not limited to single box, also can a plurality of box one shot forming, improves volume production efficiency. The thickness of the stretchable film is uniform, the final abutted seam of the portable 3D-LED module can be controlled to be below 0.1mm, the display effect of the product is not influenced, and the appearance performance reaches the standard.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (7)
1. A portable 3D-LED module comprises an LED module, a 3D atomization film, a light-transmitting substrate and a stretching film, wherein the 3D atomization film is attached to the LED module after being attached to the light-transmitting substrate; the method is characterized in that: the stretching film is coated on the light-transmitting substrate and is coated on the side face of the LED module through the folded edges attached to the LED module, the 3D atomization film and the side edge of the light-transmitting substrate; the stretched film is made of a film material with low viscosity on one side, and the thickness of the stretched film is not more than 0.05 mm.
2. The portable 3D-LED module according to claim 1, wherein: the stretched film is a film having no retardation compensation function.
3. A portable 3D-LED module according to any of claims 1-2, wherein: the stretched film is a light-transmitting material with good stretching performance.
4. A packaging method of a portable 3D-LED module utilizes a packaging device, comprising the following steps:
the shell is wrapped outside, and a closed space is formed inside the shell;
the frame-shaped carrier plate drives the stretching film to move in the vertical direction under the driving of external driving force;
a vacuum pump for vacuumizing the interior of the housing;
the edge trimmer is used for trimming the stretched film;
the method is characterized in that: the packaging method comprises the following steps of,
s1, preparing a 3D atomization film, and attaching the 3D atomization film to the light-transmitting substrate for later use;
s2, fixing the LED module 1 on a frame-shaped carrier plate platform, and then flatly placing the 3D atomization film above the LED module 1 for calibration and alignment;
s3, pre-fixing the stretched film 4 above the frame-shaped carrier plate platform 1;
s4, the frame-shaped support plate platform is driven downwards to drive the stretched film 4 to act downwards on the surface of the 3D film to form an outer frame prototype;
s5, starting a vacuum machine, and carrying out vacuumizing treatment and defoaming treatment on the inner space of the shell;
and S6, lifting the frame-shaped carrier plate upwards, and moving the edge trimmer to the side face of the LED-3D module to cut off the redundant stretched film to obtain the LED-3D module.
5. The encapsulation method according to claim 4, wherein the step S1 relates to the preparation of the 3D atomized film, comprising the steps of;
s11, preparing a 1/2 phase difference lattice film, laminating a base film and a 1/2 phase difference compensation film, cutting the surface of the 1/2 phase difference compensation film, and stripping the ineffective 1/2 phase difference film to prepare a 1/2 phase difference lattice film;
s12, separating a basement membrane, laminating the circular polarizer and the 1/2 phase difference lattice membrane, and separating and removing the basement membrane for later use;
s13, filling, jointing and curing, namely filling, jointing and curing the prepared AG transparent haze film obtained in the step S12 with UV glue to obtain a semi-finished product 3D atomization film;
s14, preparing a 3D atomization film, and attaching the semi-finished product 3D atomization film obtained in the step S13 to the substrate through LOCA or OCA to obtain the substrate.
6. The method of packaging of claim 5, wherein: the light transmission of the light-transmitting substrate is more than 90%.
7. The method of packaging of claim 6, wherein: the light-transmitting substrate is a PC plate, a glass plate, an acrylic plate or a TAC plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201911117038.6A CN110828640B (en) | 2019-11-15 | 2019-11-15 | Portable 3D-LED module and packaging method thereof |
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| CN201911117038.6A CN110828640B (en) | 2019-11-15 | 2019-11-15 | Portable 3D-LED module and packaging method thereof |
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| CN110828640A CN110828640A (en) | 2020-02-21 |
| CN110828640B true CN110828640B (en) | 2020-09-04 |
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| CN111589669A (en) * | 2020-06-18 | 2020-08-28 | 深圳市洲明科技股份有限公司 | LED display module lamp seam glue pouring method and system |
| CN117656495B (en) * | 2024-01-30 | 2024-04-19 | 四川辰宇微视科技有限公司 | Device and method for sticking film on OLED display screen of direct-coupling fusion camera |
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| US20100276712A1 (en) * | 2009-11-03 | 2010-11-04 | Alexander Shaikevitch | Light emitting diode with thin multilayer phosphor film |
| CN105006510B (en) * | 2015-07-29 | 2017-06-06 | 鸿利智汇集团股份有限公司 | A kind of method for packing of CSP LED |
| CN110286498B (en) * | 2019-07-25 | 2021-03-02 | 宁波维真显示科技股份有限公司 | 3D-LED module preparation device and method |
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Effective date of registration: 20210916 Address after: 315100 floor 3, building 3, No. 789, Xiaying North Road, Panhuo street, Yinzhou District, Ningbo City, Zhejiang Province Patentee after: NINGBO VISION DISPLAY TECHNOLOGY Co.,Ltd. Address before: 334000 Xingye Avenue, Shangrao economic and Technological Development Zone, Jiangxi Province Patentee before: Jiangxi Weizhen Display Technology Co.,Ltd. |
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