CN110823095A - Test fixture and test method for detecting PCBA (printed Circuit Board Assembly) by utilizing infrared correlation - Google Patents
Test fixture and test method for detecting PCBA (printed Circuit Board Assembly) by utilizing infrared correlation Download PDFInfo
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- CN110823095A CN110823095A CN201911136528.0A CN201911136528A CN110823095A CN 110823095 A CN110823095 A CN 110823095A CN 201911136528 A CN201911136528 A CN 201911136528A CN 110823095 A CN110823095 A CN 110823095A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
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Abstract
The invention relates to a test fixture and a test method for detecting PCBA by utilizing infrared correlation, which comprises the following steps: inputting a control signal to the upper jig die to enable an infrared transmitting end of the upper jig die to transmit infrared rays; infrared rays emitted by an infrared emitting end of the upper die of the jig penetrate through the holes in the PCBA; after receiving an infrared signal transmitted by an infrared transmitting end of an upper die of the jig from an infrared receiving end of a lower die of the jig, outputting a linear voltage signal; and judging whether the voltage signal meets a preset condition, if so, placing the PCBA to be tested in the upper jig mould and the lower jig mould in place, and if not, placing the PCBA to be tested in place. The invention has accurate test result, simple operation and sensor cost saving, provides valuable space for test equipment with high requirement on volume due to simple structure, and is convenient and simple to install and erect.
Description
Technical Field
The invention relates to the field of automatic testing, in particular to a testing jig and a testing method for detecting PCBA by utilizing infrared correlation.
Background
Generally, in the traditional manufacturing industry, whether the PCBA board is placed in place is a necessary process, in the process, in order to save manpower, time or hardware resources and improve the testing efficiency, an automatic testing concept is introduced, however, a traditional testing jig for testing whether the PCBA board is placed right needs a mechanical on-site switch, the size is large, the cost is high, the testing jig adopts infrared ray emission and reception, and voltage signals sent by an infrared ray receiving end are processed, so that whether the PCBA is placed right or not is confirmed, the cost of a sensor is saved, the size can be further reduced, space is provided for testing equipment with high requirements on size, and the installation and erection are convenient and simple.
The existing solution has the following disadvantages:
1. the use is unchanged, and a mechanical on-site switch is needed, so that the use is inconvenient;
2. the volume is large, and valuable space is wasted in test equipment with high requirements on the volume;
3. the installation and erection are inconvenient, the structure is complex, the installation steps are very complicated, and the erection is inconvenient.
Disclosure of Invention
The invention aims to solve the technical problems that how to detect a PCBA test board by adopting a test fixture and a detection method for detecting PCBA by infrared correlation can detect the PCBA test board, adopt the emission and the reception of infrared rays, and know whether the test board is placed in place or not by processing a voltage signal sent by an infrared receiving end, the test process does not need to be disassembled and assembled, the operation is simple, and the test result is accurate and correct.
The technical scheme adopted by the invention for solving the technical problems is as follows: a testing jig and a testing method for detecting the PCBA by utilizing infrared correlation are constructed, infrared ray emission and infrared ray reception are adopted, and voltage signals sent by an infrared ray receiving end are processed, so that whether the PCBA is aligned or not is confirmed, the PCBA is in place, and the function of testing whether the PCBA is aligned or not is achieved.
The invention relates to a test fixture for detecting PCBA by utilizing infrared correlation, which comprises: the jig comprises an upper jig die, a lower jig die, an upper jig die infrared transmitting end and a lower jig die infrared receiving end;
the upper jig mould is arranged above the lower jig mould, and the PCBA to be detected is placed on the lower jig mould;
a gap is reserved between the upper jig die and the lower jig die, and the width of the gap is larger than the thickness of the PCBA to be detected;
the jig upper die infrared transmitting end is installed on the jig upper die, and the jig lower die infrared receiving end is installed on the jig lower die.
In the test fixture for detecting the PCBA by utilizing the infrared correlation, the infrared emission ends of the upper mould of the fixture are respectively arranged at the positions of the opposite angles of the upper mould of the fixture.
In the test fixture for detecting PCBA by using infrared correlation, the invention also comprises: and the voltage signal receiving device is connected with the infrared receiving end of the lower jig die and is arranged on the lower jig die.
In the test fixture for detecting PCBA by using infrared correlation, the invention also comprises: and the signal transmitting device is connected with the infrared transmitting end of the upper die of the jig.
In the test fixture for detecting the PCBA by utilizing the infrared correlation, the signal transmitting device is arranged on the upper die of the fixture;
the detection method for detecting the PCBA by utilizing the infrared correlation comprises the following steps:
s1, inputting a control signal to the upper jig die to enable the infrared emission end of the upper jig die to emit infrared rays;
s2 infrared rays emitted by the infrared emitting end of the upper die of the jig penetrate through the holes in the PCBA;
s3, receiving the infrared signal emitted by the infrared emitting end of the upper die of the jig from the infrared receiving end of the lower die of the jig, and outputting a linear voltage signal;
s4, whether the voltage signal meets the preset condition is judged, if yes, the PCBA to be tested in the upper jig mould and the lower jig mould is placed in place, and if not, the PCBA to be tested is not placed in place.
The detection method for detecting the PCBA by utilizing the infrared correlation comprises the following steps: the device comprises an input control module, a signal acquisition module and a judgment processing module.
In the detection method for detecting the PCBA by utilizing the infrared correlation, the input control module inputs a control signal to the infrared emission end of the upper die of the jig, so that the infrared emission end of the upper die of the jig emits infrared rays.
In the detection method for detecting the PCBA by utilizing the infrared correlation, the signal acquisition module is used for acquiring a linear voltage signal from an infrared receiving end of a lower die of the jig, and the linear voltage signal is output after the infrared signal is received by the infrared receiving end of the lower die of the jig.
In the detection method for detecting the PCBA by utilizing the infrared correlation, the judgment processing module is used for judging whether the linear voltage signal meets the preset condition, if so, the PCBA to be tested in the upper jig mould and the lower jig mould is placed in place, and if not, the PCBA to be tested is not placed in place.
The test fixture and the test method for detecting the PCBA by utilizing the infrared correlation have the advantages that the infrared emission and the infrared reception are adopted, the voltage signal sent by the infrared receiving end is processed, so that whether the PCBA is aligned and in place is confirmed, the test result is accurate, the operation is simple, the cost of the sensor is greatly saved, the size can be further reduced, precious space is provided for test equipment with high requirements on the size, and the test fixture and the test method are convenient and simple to install and erect.
Drawings
The invention will be further described with reference to the accompanying drawings and examples, in which:
FIG. 1 is a diagram of a test fixture for detecting PCBA by infrared correlation according to the present invention.
In the figure, 1, an upper jig die; 2. a PCBA board to be tested; 3. an infrared emitting end of the upper die of the jig; 4. holes in the PCBA; 5. a jig lower die; 6. and the infrared receiving end of the lower die of the jig.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, a test fixture for detecting PCBA by infrared correlation includes: the jig comprises an upper jig mould 1, a lower jig mould 5, an upper jig mould infrared transmitting end 3 and a lower jig mould infrared receiving end 6;
the upper jig mould 1 is arranged above the lower jig mould 5, and the PCBA to be detected is placed on the lower jig mould 5;
a gap is reserved between the upper jig mould 1 and the lower jig mould 5, and the width of the gap is larger than the thickness of the PCBA to be detected;
the jig upper die infrared transmitting end 3 is installed on the jig upper die 1, and the jig lower die infrared receiving end 6 is installed on the jig lower die 5.
Furthermore, the jig upper die infrared emission ends 3 are respectively arranged at the positions of the opposite angles of the jig upper die 1.
In the test fixture for detecting the PCBA by using the infrared correlation according to the present invention, the test fixture further includes: and the voltage signal receiving device is connected with the infrared receiving end 6 of the lower jig die and is arranged on the lower jig die 5.
Further, still include: and the signal emitting device is connected with the jig upper die infrared emitting end 3.
Further, the signal emitting device is arranged on the upper die 1 of the jig;
a detection method for detecting PCBA by utilizing infrared correlation comprises the following steps:
s1, inputting a control signal to the upper die 1 of the jig, so that the infrared emitting end of the upper die 1 of the jig emits infrared rays;
s2 infrared rays emitted by the infrared emitting end of the upper die 1 of the jig penetrate through the holes 4 on the PCBA;
s3, receiving the infrared signal emitted by the infrared emitting end 3 of the upper die of the jig from the infrared receiving end 6 of the lower die of the jig, and outputting a linear voltage signal;
s4, whether the voltage signal meets the preset condition is judged, if yes, the PCBA board to be tested 2 in the upper jig mould 1 and the lower jig mould 5 is placed in place, and if not, the PCBA board to be tested 2 is not placed in place.
Further, comprising: the device comprises an input control module, a signal acquisition module and a judgment processing module.
Further, the input control module inputs a control signal to the jig upper die infrared emission end 3, so that the jig upper die infrared emission end 3 emits infrared rays.
Furthermore, the signal obtaining module is configured to obtain a linear voltage signal from the infrared receiving end 6 of the lower mold of the fixture, and the linear voltage signal is output after the infrared receiving end 6 of the lower mold of the fixture receives the infrared signal.
Further, the judgment processing module is used for judging whether the linear voltage signal meets the preset condition, if so, the PCBA board to be tested 2 in the upper jig mould 1 and the lower jig mould 5 is placed in place, and if not, the PCBA board to be tested 2 is not placed in place.
Furthermore, the test fixture and the test method for detecting the PCBA by using the infrared correlation in the embodiment adopt the transmission and the reception of infrared rays, and process and judge the voltage signal sent by the infrared receiving end, so as to confirm whether the PCBA is placed right and in place, the test result is accurate, the operation is simple, the cost of the sensor is saved, and due to the simple structure, a valuable space is provided for the test equipment with high requirements on volume, and the installation and the erection are convenient and simple.
Further, the infrared ray is transmitted through the infrared ray transmitting end 3 on the jig and penetrates through the positioning hole in the PCBA to be detected, the infrared ray is received by the infrared ray receiving end 6 on the lower jig and outputs a linear voltage signal, if the voltage signal is output, the PCBA is placed in place, and if the voltage signal is output, the PCBA is not placed in place.
The invention provides a test fixture and a test method for detecting PCBA by utilizing infrared correlation, which adopt the emission and the reception of infrared rays and process voltage signals sent by an infrared receiving end so as to confirm whether the PCBA is placed right and in place.
Although the present invention has been described with reference to the above embodiments, the scope of the present invention is not limited thereto, and modifications, substitutions and the like of the above members are intended to fall within the scope of the claims of the present invention without departing from the spirit of the present invention.
Claims (10)
1. The utility model provides an utilize infrared correlation to detect PCBA's test fixture which characterized in that includes: the jig comprises an upper jig die, a lower jig die, an upper jig die infrared transmitting end and a lower jig die infrared receiving end;
the upper jig mould is arranged above the lower jig mould, and a PCBA board to be detected is placed on the lower jig mould;
a gap is reserved between the upper jig mould and the lower jig mould, and the width of the gap is larger than the thickness of the PCBA to be detected;
the jig upper die infrared transmitting end is installed on the jig upper die, and the jig lower die infrared receiving end is installed on the jig lower die.
2. The fixture of claim 1, wherein the infrared emitter of the upper mold is disposed at each of opposite corners of the upper mold.
3. The test fixture for detecting PCBA by using infrared correlation as claimed in claim 1, further comprising: and the voltage signal receiving device is connected with the infrared receiving end of the lower jig die and is arranged on the lower jig die.
4. The test fixture for detecting PCBA by using infrared correlation as claimed in claim 1, further comprising: and the signal transmitting device is connected with the infrared transmitting end of the upper die of the jig.
5. The test fixture for detecting PCBA by using infrared correlation as claimed in claim 4, wherein said signal emitting device is mounted on the upper die of said fixture.
6. A detection method for detecting PCBA by utilizing infrared correlation is characterized by comprising the following steps:
s1, inputting a control signal to the upper jig die, so that the infrared emitting end of the upper jig die emits infrared rays;
s2, infrared rays emitted by the infrared emitting end of the upper die of the jig penetrate through the holes in the PCBA;
s3, receiving the infrared signal emitted by the infrared emitting end of the upper die of the jig from the infrared receiving end of the lower die of the jig, and outputting a linear voltage signal;
s4, judging whether the voltage signal meets the preset condition, if yes, placing the PCBA to be tested in the upper jig mould and the lower jig mould in place, and if not, placing the PCBA to be tested in place.
7. A method of detecting PCBA by infrared correlation as claimed in claim 6, comprising: the device comprises an input control module, a signal acquisition module and a judgment processing module.
8. The method as claimed in claim 6, wherein the input control module inputs a control signal to the infrared emitting end of the upper mold of the fixture, so that the infrared emitting end of the upper mold of the fixture emits infrared rays.
9. The method as claimed in claim 6, wherein the signal obtaining module is configured to obtain a linear voltage signal from an infrared receiving end of a lower mold of the fixture, and the linear voltage signal is output after the infrared receiving end of the lower mold of the fixture receives the infrared signal.
10. The method as claimed in claim 6, wherein the determining module is configured to determine whether the linear voltage signal meets a predetermined condition, if so, the PCBA to be tested in the upper jig mold and the lower jig mold is in place, and if not, the PCBA to be tested is not in place.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911136528.0A CN110823095A (en) | 2019-11-19 | 2019-11-19 | Test fixture and test method for detecting PCBA (printed Circuit Board Assembly) by utilizing infrared correlation |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911136528.0A CN110823095A (en) | 2019-11-19 | 2019-11-19 | Test fixture and test method for detecting PCBA (printed Circuit Board Assembly) by utilizing infrared correlation |
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| CN110823095A true CN110823095A (en) | 2020-02-21 |
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| CN201911136528.0A Pending CN110823095A (en) | 2019-11-19 | 2019-11-19 | Test fixture and test method for detecting PCBA (printed Circuit Board Assembly) by utilizing infrared correlation |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112857220A (en) * | 2021-01-13 | 2021-05-28 | 德阳市产品质量监督检验所 | Detection structure of power generation equipment parts |
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| CN102865815A (en) * | 2012-09-24 | 2013-01-09 | 上海功源电子科技有限公司 | Novel positioning compensation method for PCB by single vision camera |
| CN203241044U (en) * | 2013-05-24 | 2013-10-16 | 苏州工业园区世纪福科技有限公司 | Non-contact printing circuit board flattening and detecting device |
| CN103869236A (en) * | 2014-03-31 | 2014-06-18 | 广州华欣电子科技有限公司 | Method and jig for testing infrared touch screen PCBA |
| CN105572562A (en) * | 2015-12-14 | 2016-05-11 | 浪潮电子信息产业股份有限公司 | Method for detecting position offset of PCBA (printed circuit board assembly) |
| CN207396677U (en) * | 2017-10-27 | 2018-05-22 | 深圳市思霖自动化有限公司 | PCBA board detection device |
| CN208338031U (en) * | 2018-06-25 | 2019-01-04 | 光宏光电技术（深圳）有限公司 | Micropore steel mesh high-precision laser alignment device |
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2019
- 2019-11-19 CN CN201911136528.0A patent/CN110823095A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102865815A (en) * | 2012-09-24 | 2013-01-09 | 上海功源电子科技有限公司 | Novel positioning compensation method for PCB by single vision camera |
| CN203241044U (en) * | 2013-05-24 | 2013-10-16 | 苏州工业园区世纪福科技有限公司 | Non-contact printing circuit board flattening and detecting device |
| CN103869236A (en) * | 2014-03-31 | 2014-06-18 | 广州华欣电子科技有限公司 | Method and jig for testing infrared touch screen PCBA |
| CN105572562A (en) * | 2015-12-14 | 2016-05-11 | 浪潮电子信息产业股份有限公司 | Method for detecting position offset of PCBA (printed circuit board assembly) |
| CN207396677U (en) * | 2017-10-27 | 2018-05-22 | 深圳市思霖自动化有限公司 | PCBA board detection device |
| CN208338031U (en) * | 2018-06-25 | 2019-01-04 | 光宏光电技术（深圳）有限公司 | Micropore steel mesh high-precision laser alignment device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN112857220A (en) * | 2021-01-13 | 2021-05-28 | 德阳市产品质量监督检验所 | Detection structure of power generation equipment parts |
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Address after: 518000 the first floor, second floor, third floor, fourth floor and fifth floor of 16 workshops in antuoshan high tech Industrial Park, Shajing street, Bao'an District, Shenzhen City, Guangdong Province Applicant after: Shenzhen Mingxin testing equipment Co., Ltd Address before: Baoan District manhole Street Xinsha road Shenzhen city Guangdong province 518000 security supporting mountain High-tech Industrial Park 16 Applicant before: SHENZHEN MASON TEST EQUIPMENT Co.,Ltd. |
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Application publication date: 20200221 |
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