CN110816072A

CN110816072A - Low particle gas enclosure system and method

Info

Publication number: CN110816072A
Application number: CN201911241814.3A
Authority: CN
Inventors: J.莫克; A.S-K.高; E.弗龙斯基; S.阿尔德森; A.斯特帕诺夫
Original assignee: Kateeva Inc
Current assignee: Kedihua Display Technology Shaoxing Co ltd
Priority date: 2013-06-10
Filing date: 2014-05-12
Publication date: 2020-02-21
Anticipated expiration: 2034-05-12
Also published as: CN108162606B; CN110816072B; CN108162606A; JP2023138525A; EP3007900A1; JP6378327B2; JP2022058335A; KR20160019485A; KR102342098B1; JP2018206777A; KR20200111834A; KR20210156864A; JP7351543B2; JP2020123574A; KR20190014589A; KR101946694B1; EP3007900A4; JP2016529649A; KR20230065385A; CN105431294B

Abstract

The invention relates to a system comprising: a gas enclosure defining an interior; a printing system positioned in an interior of the gas enclosure, the printing system comprising a printhead assembly; a substrate support device positioned in the interior of the gas enclosure, the substrate support device for supporting a substrate to be printed; a conduit system defining an opening positioned to receive a service bundle routed from the conduit system into an interior of the gas enclosure; and a seal cover mechanism having an open position and a closed position to open and close the opening, respectively, in the closed position the seal cover mechanism being capable of sealing the opening.

Description

Low particle gas enclosure system and method

The application is a divisional application submitted for a single defect indicated in a second review comment notice (a letter serial number 2019092702159030) issued by the national intellectual property office in 2019 on day 10 and 08.

Cross-referencing of related cases

This application claims the benefit of U.S. provisional application No. 61/833,398 filed on 10/6/2013. This application claims the benefit of U.S. provisional application No. 61/911,934 filed on 12, 4, 2013. This application claims the benefit of U.S. provisional application No. 61/925,578 filed on 9/1/2014. This application claims the benefit of U.S. provisional application No. 61/983,417 filed on 23/4/2014. The present application continues as part of U.S. application No. 14/205,340 filed on 11/3/2014. U.S. application No. 14/205,340 filed on 11/3/2014 was filed on 13/3/2013 and part of U.S. application No. 13/802,304 published on 15/8/2013 as US 2013/0206058 continued. U.S. application No. 13/802,304 continues as part of U.S. application No. 13/720,830 filed on 12/19/2012; and published as US2013/0252533 on day 26, 9 months 2013. U.S. application No. 13/720,830 claims the benefit of U.S. provisional application No. 61/579,233 filed on 22/12/2011. U.S. application No. 13/720,830, filed on 12/19/2012, is a partial continuation of U.S. application No. 12/652,040, filed on 5/2010 on 1/5/2013 and published on 26/2013 on US 8,383,202, U.S. application No. 12/652,040, a partial continuation of U.S. application No. 12/139.391, filed on 13/2008 on 6/13 and published on US 2008/0311307 on 18/2008. U.S. application No. 12/652,040 also claims the benefit of U.S. provisional application No. 61/142,575 filed on 5.1.2009. All cross-referenced applications listed herein are incorporated by reference in their entirety.

Technical Field

The present teachings relate to various embodiments of a gas enclosure system having an inert, substantially low-particle environment for fabricating OLED panels on a variety of substrate sizes and substrate materials.

Background

Interest in the potential of Organic Light Emitting Diode (OLED) display technology is driven by the attributes of OLED display technology, including the exhibition of display panels with highly saturated colors, high contrast, ultra-thin, fast response, and energy efficient. Furthermore, a variety of substrate materials including flexible polymer materials can be used in the fabrication of OLED display technologies. Although the presentation of displays for small screen applications, primarily for cell phones, serves to emphasize the potential of this technology, challenges remain in scaling large volume manufacturing across a range of substrate panels at high yield (highyield).

With respect to scaling of panels, Gen 5.5 substrates have dimensions of about 130cm X150 cm and are capable of producing about eight 26 "flat panel displays. In contrast, larger format substrates can include mother glass substrate sizes using Gen 7.5 and Gen 8.5. The Gen 7.5 mother glass has dimensions of about 195cm x 225cm and can be cut into eight 42 "or six 47" flat panel displays per substrate. The mother glass used in Gen8.5 is about 220cm x 250cm and can be cut into six 55 "or eight 46" flat panel displays per substrate. One indication of the challenges that still exist in expanding OLED display manufacturing to larger panels is: the high volume production of OLED displays with high yield on substrates larger than Gen 5.5 substrates has proven to be largely challenging.

In principle, OLED devices can be manufactured by printing various organic thin films and other materials on a substrate using an OLED printing system. Such organic materials can be susceptible to damage by oxidation and other chemical processes. Housing OLED printing systems in a manner that can be scaled for various substrate sizes and can be accomplished in an inert, substantially low-particle printing environment can present a variety of engineering challenges. Manufacturing tools for high throughput large format substrate printing (e.g., printing of Gen 7.5 and Gen8.5 substrates) require considerable facilities. Therefore, maintaining large facilities under an inert atmosphere (inert atmosphere), requiring gas purging to remove reactive atmospheric species such as water vapor and oxygen, and organic solvent vapors, and maintaining a substantially low-particle printing environment have proven to be significantly challenging.

Therefore, challenges remain in mass manufacturing to extend OLED display technology across a range of substrate panels with high yield. Accordingly, there is a need for various embodiments of gas enclosure systems of the present teachings that can house OLED printing systems in inert, substantially low-particle environments, and that can be easily scaled for fabricating OLED panels on a variety of substrate sizes and substrate materials. In addition, various gas enclosure systems of the present teachings can provide convenient access (ready access) to the OLED printing system from the outside during processing, as well as convenient access to the inside for maintenance with minimal downtime.

Drawings

A better understanding of the features and advantages of the present disclosure will be obtained by reference to the accompanying drawings, which are intended to illustrate, and not to limit, the present teachings.

FIG. 1 is a right, front perspective view of a gas enclosure assembly according to various embodiments of the present teachings.

FIG. 2 depicts an exploded view of a gas enclosure assembly according to various embodiments of the present teachings.

Fig. 3 is a front exploded perspective view of a frame member assembly depicting various panel frame sections and section panels according to various embodiments of the present teachings.

Fig. 4A-4C are schematic top views of various embodiments of a gasket seal for forming a joint.

Figures 5A and 5B are various perspective views depicting the sealing of the frame member of various embodiments of a gas enclosure assembly according to the present teachings.

Fig. 6A and 6B are various views of a seal involving a section panel for receiving an easily removable service window according to various embodiments of a gas enclosure assembly according to the present teachings.

Fig. 7A and 7B are enlarged perspective cutaway views relating to seals for receiving a section panel of an inset panel or window panel according to various embodiments of the present teachings.

FIG. 8 is a view of various embodiments of a gas enclosure system according to the present teachings including a ceiling for a lighting system.

FIG. 9 is a front perspective view of a gas enclosure assembly according to various embodiments of the present teachings.

Figure 10A depicts an exploded view of various embodiments of a gas enclosure assembly and associated printing as depicted in figure 9, in accordance with various embodiments of the present teachings. Fig. 10B depicts an expanded iso perspective of the printing system depicted in fig. 10A. Fig. 10C shows an expanded iso perspective view of the auxiliary enclosure depicted in fig. 10A.

FIG. 11 depicts a perspective view of a flotation stage according to various embodiments of the present teachings.

FIG. 12 is a schematic view of various embodiments of a gas enclosure assembly and associated system components of the present teachings.

Figure 13 is a schematic diagram of various embodiments of a gas enclosure assembly and associated system components of the present teachings.

FIG. 14 is a schematic view of a gas enclosure system according to various embodiments of the present teachings.

FIG. 15 is a schematic view of a gas enclosure system according to various embodiments of the present teachings.

FIG. 16 is a transparent interior front perspective view of a gas enclosure assembly depicting a ductwork installed in the interior of the gas enclosure assembly in accordance with various embodiments of the present teachings.

FIG. 17 is a transparent interior top perspective view of a gas enclosure assembly depicting a ductwork installed in the interior of the gas enclosure assembly in accordance with various embodiments of the present teachings.

FIG. 18 is a transparent interior bottom perspective view of a gas enclosure assembly depicting a ductwork installed in the interior of the gas enclosure assembly in accordance with various embodiments of the present teachings.

Figure 19A is a schematic diagram illustrating a service bundle (service bundle) according to various embodiments of the present teachings. FIG. 19B depicts gas swept through a service beam supplied through various embodiments of a duct system according to the present teachings.

FIG. 20 is a schematic diagram showing how reactive species (A) that are occluded in dead-space (dead-space) of service beams are actively scrubbed from inert gas (B) that is swept through the pipes through which the beams are routed.

Figure 21A is a transparent interior perspective view of cables and conduits routed through the conduit system of various embodiments of the gas enclosure system according to the present teachings. FIG. 21B is an enlarged view of the opening shown in FIG. 21A showing details of a cover for closing over the opening in accordance with various embodiments of the gas enclosure system of the present teachings.

Figure 22 is a schematic side cross-sectional view of a gas enclosure system depicting an embodiment of gas circulation through a gas enclosure assembly according to various embodiments of the present teachings.

Figure 23 is a schematic side cross-sectional view of a gas enclosure system depicting an embodiment of gas circulation through a gas enclosure assembly according to various embodiments of the present teachings.

Figure 24 is a schematic front cross-sectional view of a gas enclosure depicting an embodiment of gas circulation through a gas enclosure assembly according to various embodiments of the present teachings.

FIG. 25 is a schematic cross-sectional view of a gas enclosure assembly having system components according to various embodiments of the present teachings.

Figure 26 is a perspective view of a printing system depicting various embodiments of the particle control system of the present teachings that can include a low particle X-axis motion system and a service bundle housing exhaust system.

Fig. 27A and 27B are cross-sectional views of a low-particle X-axis motion system, according to various embodiments of the present teachings.

Figures 28A and 28B are various perspective views of a service bundle housing drain system for a printing system according to various embodiments of the present teachings.

Figure 29A is a schematic diagram of a service bundle housing exhaust system according to various embodiments of the present teachings. 29B, 29C, and 29D are schematic diagrams of various embodiments of opening a drain port to a service bundle housing according to various embodiments of the present teachings.

Fig. 30A and 30B are schematic diagrams of gas enclosure systems depicting embodiments of gas circulation and particle collection around a printhead assembly in a gas enclosure assembly according to various embodiments of the present teachings.

Fig. 31A and 31B are schematic diagrams of gas enclosure systems depicting embodiments of gas circulation and particle collection around a printhead assembly in a gas enclosure assembly according to various embodiments of the present teachings.

Fig. 32A and 32B are schematic diagrams of gas enclosure systems depicting embodiments of gas circulation and particle collection around a printhead assembly in a gas enclosure assembly according to various embodiments of the present teachings.

Fig. 33 is an embodiment of a portable airborne particle counting device according to the present teachings.

FIG. 34 is a schematic diagram of the operating principle of various portable airborne particle counting devices based on scattering of electromagnetic radiation.

Figure 35 is a schematic diagram depicting various areas where a portable airborne particle counting apparatus can be located in various printing systems of the present teachings.

Figure 36 is an iso perspective view of a portable airborne particle counting apparatus positioned proximate to a substrate support apparatus according to various embodiments of the present teachings.

Fig. 37A and 37B are graphs depicting long-term test results of particle counting in various embodiments of gas enclosure systems of the present teachings.

Fig. 38 is a graph depicting the results of a recovery test (recovery test) of particle counts before and after the opening of a window of a gas enclosure system.

FIG. 39 is a schematic diagram of the operating principles of various particle detection devices for on-substrate particle detection based on scattering of electromagnetic radiation.

FIG. 40 is an iso perspective view of the placement of a test substrate proximate a print zone according to various embodiments of the present teachings.

FIG. 41 is a perspective iso view of the placement of a substrate proximate to a print zone in a camera-mounted printing system according to various embodiments of the present teachings.

Detailed Description

The present teachings disclose various embodiments of a gas enclosure assembly capable of housing an OLED printing system. Various embodiments of the gas enclosure assembly can be sealably constructed and integrated with various components providing particle control systems, gas circulation and filtration systems, gas purification systems, and the like, to form various embodiments of the gas enclosure system that can maintain an inert gas environment that is substantially low-particle to the process requiring such an environment.

Manufacturing tools that can in principle allow printing of a variety of substrate sizes including large format substrate sizes can require considerable equipment for housing such OLED manufacturing tools. Therefore, maintaining the entire large plant under an inert atmosphere poses engineering challenges, such as continuous purging of large quantities of inert gas. The inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions in accordance with the present teachings. Some common non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. In addition, large equipment that provides a substantially air-tight seal to prevent contamination by various reactive atmospheric gases, such as water vapor and oxygen, as well as organic solvent vapors generated from various printing processes, also present engineering challenges. According to the present teachings, the OLED printing apparatus will maintain the level of each of the various reactive species including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapor at 100ppm or less, for example, at 10ppm or less, at 1.0ppm or less, or at 0.1ppm or less.

Continuous maintenance of large equipment requiring an inert environment presents additional challenges. For example, manufacturing equipment can require substantial lengths of various service bundles that can be operatively connected from various systems and components to provide the optical, electrical, mechanical, and fluidic connections required to operate, for example, but not limited to, printing systems. Service bundles can include optical cables, electrical cables, wires, conduits, and the like, as non-limiting examples, in accordance with the present teachings. Various embodiments of service bundles according to the present teachings can have a significant total dead volume (dead volume) due to the significant amount of void space created by bundling various cables, wires, pipes, etc. together in the service bundle. The total dead volume caused by the significant amount of void space in the service beam can result in the retention of a significant volume of the reactive gas species occluded therein. Such a substantial volume of occluded reactive gas species can present challenges for effectively sealing the gas into specifications regarding the levels of reactive atmospheric constituents (e.g., oxygen and water vapor) as well as organic vapors. Furthermore, such a service bundle used in the operation of the printing system can be a continuous source of particulate matter.

In this regard, providing and maintaining a substantially inert and low particle environment in an OLED manufacturing facility provides additional challenges not presented by processes that can be accomplished, for example, under atmospheric conditions in an open air, high flow laminar flow filter hood. Accordingly, various embodiments of the systems and methods of the present teachings address the challenges presented by OLED printing for OED substrates of various sizes and materials in an inert, substantially low-particle environment.

With respect to maintaining a substantially low particle environment, various embodiments of the gas circulation and filtration system can be designed to provide a low particle inert gas environment for airborne particles that meets the standards of International organization for standardization (ISO) 14644-1:1999 "Cleanrooms and associated controlled environments-Part 1: Classification of air research" as specified by Class 1-Class 5. However, controlling airborne particulate matter alone is not sufficient to provide a low particulate environment proximate to the substrate during, for example, but not limited to, printing processes, because particles generated proximate to the substrate during such processes can accumulate on the substrate surface before they can skim the gas circulation and filtration system.

Thus, various embodiments of the gas enclosure system of the present teachings can have a particle control system that can include components in addition to the gas circulation and filtration system that can provide a low particle zone proximate to the substrate during processing in the printing step. According to various embodiments of the gas enclosure systems of the present teachings, the particle control system for various embodiments of the gas enclosure systems of the present teachings can include a gas circulation and filtration system, a low particle generation X-axis linear bearing system for moving the printhead assembly relative to the substrate, a service beam housing exhaust system, and a printhead assembly exhaust system. In this regard, in addition to the circulation and filtration system for maintaining a substantially low particulate specification of airborne particulate matter, various embodiments of the gas enclosure system of the present teachings can also have a particulate control system that can include additional components for maintaining a substantially low particulate specification of particulate matter deposited on the substrate.

Various embodiments of the systems and methods of the present teachings are capable of maintaining a substantially low-particle environment that provides an average on-substrate distribution of particles of a particular size range of interest that does not exceed a deposition rate specification on a substrate. An on-substrate deposition rate specification can be set for each of the particle size ranges of interest between about 0.1 μm and greater to about 10 μm and greater. In various embodiments of the systems and methods of the present teachings, the particle deposition rate specification on the substrate can be expressed as a number limit of particles deposited per minute per square meter of substrate for each of the target particle size ranges.

Various embodiments of particle deposition rate specifications on a substrate can easily convert from a limit on the number of particles deposited per minute per square meter of substrate to a limit on the number of particles deposited per minute per substrate for each of the target particle size ranges. Such a conversion can be readily accomplished by, for example, a known relationship between a substrate of a particular generation size and a substrate of a corresponding area of that generation. For example, table 1 below summarizes the aspect ratios and areas of some substrates of known dimensions. It should be understood that slight variations in aspect ratio (and therefore size) can be seen from manufacturer to manufacturer. However, regardless of this variation, conversion factors for a substrate of a particular generation size and area in square meters can be obtained for any of a variety of generation sizes of substrates.

Table 1: correlation between area and substrate size

Generation ID	X (mm)	Y (mm)	Area (m)²)
				Gen 3.0	550	650	0.36
Gen 3.5	610	720	0.44
				Gen 3.5	620	750	0.47
Gen 4	680	880	0.60
				Gen 4	730	920	0.67
Gen 5	1100	1250	1.38
				Gen 5	1100	1300	1.43
Gen 5.5	1300	1500	1.95
				Gen 6	1500	1850	2.78
Gen 7.5	1950	2250	4.39
				Gen 8	2160	2400	5.18
Gen 8	2160	2460	5.31
				Gen 8.5	2200	2500	5.50
Gen 9	2400	2800	6.72
				Gen 10	2850	3050	8.69

Furthermore, the particle deposition rate specification on a substrate expressed as a limit on the number of particles deposited per square meter of substrate per minute can be easily converted into any of a variety of units of time expression. It will be readily appreciated that the particle deposition rate specification on a substrate normalized to minutes can be readily converted to any other temporal expression by a known temporal relationship, such as, but not limited to, for example, seconds, hours, days, etc. Further, a time unit specifically related to the processing can be used. For example, a print cycle can be associated with a unit of time. For various embodiments of a gas enclosure system according to the present teachings, a print cycle can be a period of time, namely: wherein the substrate is moved into the gas enclosure system for printing and subsequently removed from the gas enclosure system after printing is complete. For various embodiments of a gas enclosure system according to the present teachings, a print cycle can be a period of time, namely: the ink droplets from the beginning of alignment of the substrate relative to the printhead assembly to the last ejection are transferred onto the substrate. In the art of processing, the total average cycle time or TACT can be an expression of a unit of time for a particular process cycle. According to various embodiments of systems and methods of the present teachings, TACT for a print cycle can be about 30 seconds. For various embodiments of the systems and methods of the present teachings, TACT for a print cycle can be about 60 seconds. In various embodiments of the systems and methods of the present teachings, TACT for a print cycle can be about 90 seconds. For various embodiments of the systems and methods of the present teachings, TACT for a print cycle can be about 120 seconds. In various embodiments of the systems and methods of the present teachings, TACT for a print cycle can be about 300 seconds.

A significant number of variables can influence the development of a general model that can properly calculate, for example, an approximation of the rate of particle settling (fallout rate) on a surface (e.g., substrate) for any particular manufacturing system, relative to airborne particulate matter and particle deposition within the system. Variables such as the size of the particles, the distribution of particles of a particular size, the surface area of the substrate, and the exposure time of the substrate within the system can vary depending on the various manufacturing systems. For example, the size of the particles and the distribution of particles of a particular size can be greatly influenced by the source and location of the particle generating components in various manufacturing systems. Calculations based on various embodiments of the gas enclosure system of the present teachings indicate that without the various particle control systems of the present teachings, the deposition on a substrate of particulate matter per square meter of substrate per print cycle can be between more than about 1 million and up to about 1 million particles for particles in the size range of 0.1 μm and greater. Such calculations indicate that deposition of particulate matter on a substrate per print cycle per square meter of substrate can be between more than about 1000 particles to about more than about 10,000 particles for particles in the size range of about 2 μm and larger without the various particle control systems of the present teachings.

Various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 10 μm in size. Various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 5 μm in size. In various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 2 μm in size. In various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 1 μm in size. Various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 1000 particles per square meter of substrate per minute for particles greater than or equal to 0.5 μm in size. For various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 1000 particles per square meter of substrate per minute for particles greater than or equal to 0.3 μm in size. Various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 1000 particles per square meter of substrate per minute for particles greater than or equal to 0.1 μm in size.

As previously discussed herein, it has proven quite challenging to manufacture OLED displays in high volume with high yield on substrates larger than Gen 5.5 substrates. To more clearly appreciate the substrate sizes that can be used in the manufacture of various OLED devices, parent glass substrate sizes in each generation have undergone evolution from the beginning of approximately 90 s for flat panel displays manufactured by techniques other than OLED printing. The first generation parent glass substrate designated Gen1 was approximately 30cm x 40cm, and therefore, 15 "panels could be produced. In the middle of the approximately 90 s, the prior art for producing flat panel displays has evolved to Gen 3.5 mother glass substrate sizes with dimensions of approximately 60cm x 72 cm. In contrast, Gen 5.5 substrates have dimensions of about 130cm X150 cm.

As the generation progressed, Gen 7.5 and Gen8.5 mother glass sizes were used in the production of manufacturing processes other than OLED printing. Gen 7.5 mother glass has dimensions of about 195cm x 225cm and can be cut into flat panels of eight 42 "or six 47" per substrate. The parent glass used in Gen8.5 is about 220cm x 250cm and can be cut into six 55 "or eight 46" flat panels per substrate. Promise for qualities such as truer color, higher contrast, thinness, flexibility, transparency, and energy efficiency has been achieved with OLED flat panel displays, while OLED fabrication is effectively limited to Gen 3.5 and smaller. Currently, OLED printing is believed to break this limitation and enable the best fabrication techniques for OLED panel fabrication not only for Gen 3.5 and smaller mother glass sizes, but also at the largest mother glass sizes (e.g., Gen 5.5, Gen 7.5, and Gen 8.5). One of the features of OLED panel display technology includes the ability to use a variety of substrate materials, such as, but not limited to, a variety of glass substrate materials and a variety of polymer substrate materials. In this respect, the dimensions recited by the term for using a glass-based substrate can be applied to substrates of any material suitable for use in OLED printing.

It is contemplated that a wide variety of ink formulations can be printed within the inert, substantially low-particle environment of the various embodiments of the gas enclosure system of the present teachings. During the manufacture of OLED displays, OLED pixels can be formed to include OLED film stacks (film stacks) that can emit light of a particular peak wavelength when a voltage is applied. The OLED film stack structure can include a Hole Injection Layer (HIL), a Hole Transport Layer (HTL), an Emission Layer (EL), an Electron Transport Layer (ETL), and an Electron Injection Layer (EIL) between an anode and a cathode. In some embodiments of the OLED film stack structure, an Electron Transport Layer (ETL) can be combined with an Electron Injection Layer (EIL) to form an ETL/EIL layer. In accordance with the present teachings, various ink formulations for the EL of the various color pixel EL films of the OLED film stack can be printed using inkjet printing. Further, for example, but not limited to, the HIL, HTL, EML, and ETL/EIL layers can have ink formulations that can be printed using inkjet printing.

It is also contemplated that the organic encapsulation layer can be printed on the OLED panel using inkjet printing. It is contemplated that the organic encapsulation layer can be printed using inkjet printing as inkjet printing can provide several advantages. First, the scope of vacuum processing operations can be eliminated, since the inkjet-based fabrication can be performed at atmospheric pressure. Furthermore, during the inkjet printing process, the organic encapsulation layer can be localized to cover portions of the OLED substrate above and near the active region (active region) to effectively encapsulate the active region, including the sides of the active region. Targeted patterning using inkjet printing results in the elimination of material waste, as well as the additional processing typically required to achieve patterning of organic layers. The encapsulated ink can include a polymer, including: for example, but not limited to, acrylic, acrylate, urethane or other materials, as well as copolymers and mixtures thereof, which can be cured using heat treatment (e.g., baking), UV irradiation, and combinations thereof.

With respect to OLED printing, maintaining substantially low levels of reactive species, such as, but not limited to, atmospheric constituents (e.g., oxygen and water vapor) and various organic solvent vapors used in OLED inks, in accordance with the present teachings, has been found to correlate to providing OLED flat panel displays that meet the requisite lifetime (life) specifications. Lifetime specifications are of particular importance for OLED panel technology, as this is directly linked to the durability of the display product; for all panel technologies, it has been challenging for OLED panel technologies to comply with the product specifications. To provide a panel that meets the requisite life specifications, the level of each of the reactive species, e.g., water vapor, oxygen, and organic solvent vapor, can be maintained at 100ppm or less, e.g., 10ppm or less, 1.0ppm or less, or 0.1ppm or less, using various embodiments of the gas enclosure system of the present teachings.

The need to print an OLED panel in an apparatus that: wherein the level of each of the reactive species, e.g., water vapor, oxygen, and organic solvent vapor, can be maintained at 100ppm or less, e.g., 10ppm or less, 1.0ppm or less, or 0.1ppm or less. The data summarized on table 2 was generated from the testing of each of the test samples (test coupon) comprising the organic thin film composition of each of red, green and blue fabricated in a large pixel, spin-on device format (format). Such test specimens are substantially easier to manufacture and test for the purpose of rapid evaluation of various formulations (formulations) and procedures. Although the test specimen test should not be confused with the life test of the printed panel, it can indicate the effect of various formulations and processes on life. The results shown in the table below represent the variation of process steps in the manufacture of test samples, where only the spin-on environment varied for test samples manufactured in a nitrogen environment with less than 1ppm of reactive species, as compared to test samples similarly manufactured in air rather than in a nitrogen environment.

By examining the data in table 2 for test samples made under different processing environments, particularly in the case of red and blue, it is apparent that printing in an environment effective to reduce exposure of organic thin film components to reactive species can have a considerable impact on the stability (and therefore lifetime) of various ELs.

Table 2: effect of inert gas treatment on the lifetime of OLED panels

Furthermore, maintaining a substantially low particle environment is of particular importance for OLED printing, since even very small particles can cause visible defects on the OLED panel. In this regard, the systems and methods of the present teachings provide for maintaining a low level of each of the reactive species, e.g., water vapor, oxygen, and organic solvent vapor, and additionally provide for maintaining a substantially low particle environment for high quality OLED panel fabrication. Various embodiments of the gas enclosure system can have a particle control system that can include components in addition to the gas circulation and filtration system that provide a low particle region proximate to the substrate during processing in the printing step.

Various embodiments of the gas enclosure system of the present teachings can have a particle control system that provides a low particle zone proximate to the substrate, for which various particle generating components proximate to the substrate can be included and exhausted to prevent particles from accumulating on the substrate during the printing process. In various embodiments of the gas enclosure system, the particle control system can include a gas circulation and filtration system for maintaining airborne particle levels within the gas enclosure system and proximate to the substrate that comply with standards specified by International organization for standardization (ISO) 14644-1:1999, such as Class 1-5. Various embodiments of the particulate control system can include a gas circulation and filtration system in fluid communication with an already included particulate generation component, such that such particulate inclusion component can be discharged into the gas circulation and filtration system. For various embodiments of particulate control systems, already included particulate producing components can be discharged into dead space, making such particulate matter inaccessible to recirculation within the gas enclosure system. Various embodiments of the gas enclosure system of the present teachings can have a particle control system for which various components can be inherently low particle generation, thereby preventing particle accumulation on a substrate during a printing process. Various components of the particle control system of the present teachings can utilize the inclusion and discharge of particle generating components, as well as the selection of components with inherently low particle generation, to provide a low particle region proximate to the substrate.

For various embodiments of the low-particle gas enclosure system of the present teachings, maintaining a substantially low-particle environment in an enclosed system, such as an enclosed OLED printing system, provides additional challenges not presented with respect to particle reduction for processes that can be completed under atmospheric conditions (e.g., under open-air, high flow laminar flow filtration enclosures). Various embodiments of the gas enclosure system are capable of providing a substantially low-particle environment, such as, but not limited to: 1) by eliminating areas near the substrate where particulate matter can collect; 2) by containing and discharging particle generating components, e.g., service bundles that can include bundled cables, wires, and pipes, etc., as well as various devices, assemblies, and systems within various embodiments of the particle control system of the present teachings, e.g., utilizing components such as fans or linear motion systems using friction bearings; and 3) pneumatically operated components produced by using a variety of inherently low particle generation, such as, but not limited to, substrate floatation tables, air bearings, and pneumatically operated robots, among others. According to various embodiments of the gas enclosure system of the present teachings, the substantially low-particle environment can include a particle control system including means for providing a low-particle region proximate to the substrate during printing.

As will be discussed in more detail later herein, directly controlling particle generation proximate to the substrate to provide a low particle region proximate to the substrate can be performed by including a particle generating element, by using a low particle generating component, and by a combination of including a particle generating member and using a low particle generating component. Accordingly, various embodiments of the gas enclosure system can have a particle control system that can include a gas circulation and filtration system, a service beam housing exhaust system, and a printhead assembly exhaust system in fluid communication with a low particle generation X-axis linear bearing system for moving the printhead assembly relative to the substrate. For various embodiments of the service bundle housing exhaust system and the printhead assembly exhaust system, particles contained in such systems can be exhausted into a gas circulation and filtration system. In various embodiments of the service bundle housing exhaust system and the printhead assembly exhaust system, particles contained in such systems can be exhausted into dead spaces, thereby allowing such exhaust of the particulate matter into dead spaces that are inaccessible to circulation within the gas enclosure system.

In addition, system validation and continuous system monitoring can be performed for both airborne and on-substrate particle monitoring. The determination of airborne particulate matter can be performed as a quality check for various embodiments of the gas enclosure system prior to the printing process using, for example, a portable particle counting device. In various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed in situ as a continuous quality check while printing the substrate. For various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed in situ as a quality check before and additionally while printing the substrate. The determination of the on-substrate distribution of particulate matter on the substrate can be performed for various embodiments of the gas enclosure system, for system verification, using, for example, a test substrate prior to printing the substrate. In various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed in situ as a continuous quality check while printing the substrate, for example, using a camera assembly mounted on an X-axis carriage assembly. For various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed for system verification prior to printing the substrate, and additionally in situ while printing the substrate.

Various embodiments of the gas enclosure system can have a particle control system that can maintain a substantially low-particle environment that provides a specification of particles on a substrate for particles between about 0.1 μm or more and about 10 μm or more. Various embodiments of the on-substrate particle specification can be easily converted from an average on-substrate particle distribution per minute per square meter of substrate to an average on-substrate particle distribution per minute per substrate for each of the target particle size ranges. As previously discussed herein, such a conversion can be readily accomplished by a known relationship between substrates, such as a relationship between a substrate of a particular generation-sized (generation-sized) and the corresponding area of the generation of substrates. Furthermore, the average substrate-on-substrate particle distribution per minute per square meter of substrate can be easily converted into any of a variety of unit time expressions. For example, in addition to switching between standard time units such as seconds, minutes, and days, time units specifically related to the process can be used. For example, as previously discussed herein, a print cycle can be associated with a unit of time.

Further, it is contemplated that the gas enclosure system will have properties including: for example, but not limited to, a gas enclosure assembly that can be easily scaled to provide an optimized workspace for an OLED printing system while providing a minimized amount of inert gas, and additionally provide convenient access to the OLED printing system from the outside during processing while providing access to the inside for maintenance with minimal downtime. In this regard, various embodiments of a gas enclosure assembly having utility for various air sensitive processes requiring an inert environment can include a plurality of wall and ceiling frame members that can be sealed together. In some embodiments, the plurality of wall and roof frame members can be fastened together using reusable fasteners, such as bolts and threaded holes. For various embodiments of a gas enclosure assembly according to the present teachings, a plurality of frame members, each frame member comprising a plurality of panel frame segments, can be configured to define a gas enclosure frame assembly. Various embodiments of the gas enclosure assembly can include an auxiliary enclosure configured as a section of the gas enclosure assembly that can be sealably isolated from a working volume of a gas enclosure system, such as a printing system enclosure. This physical isolation of the auxiliary enclosure from, for example, the printing system enclosure can enable various processes, such as, but not limited to, various maintenance processes on the printhead assembly, to be performed with little or no interruption to the printing process, thereby minimizing or eliminating downtime of the gas enclosure system.

The gas enclosure assembly of the present teachings can be designed to accommodate a printing system, such as an OLED printing system, in a manner that can minimize the volume of the enclosure surrounding the system. Various embodiments of the gas enclosure assembly can be configured in the following manner, namely: the internal volume of the gas enclosure assembly is minimized and the working space is optimized at the same time to accommodate the various footprints (focprintings) of the various OLED printing systems. OLED printing systems according to various embodiments of gas enclosure systems of the present teachings can include, for example: a granite base; a movable beam capable of supporting the OLED printing device; one or more devices and apparatuses that operate from various embodiments of pressurized inert gas recirculation systems, such as substrate floatation tables (floatation tables), air bearings, rails, tracks; an inkjet printer system for depositing an OLED film forming material onto a substrate, comprising an OLED ink supply subsystem and an inkjet print head; one or more robots, etc. Various embodiments of OLED printing systems can have a variety of footprints and form factors (form factors) in view of the variety of components that can comprise the OLED printing system. Various embodiments of the gas enclosure assembly so configured additionally provide convenient access to the interior of the gas enclosure assembly from the outside during processing and provide easy access to the interior for maintenance while minimizing downtime. In this regard, various embodiments of a gas enclosure assembly according to the present teachings can be contoured with respect to various footprints of various OLED printing systems. According to various embodiments, once the contoured frame members are configured to form a gas enclosure frame assembly, various types of panels may be sealably installed in a plurality of panel segments comprising the frame members to complete installation of the gas enclosure assembly. In various embodiments of the gas enclosure assembly, a plurality of frame members, including, for example, but not limited to, a plurality of wall frame members and at least one top panel frame member, and a plurality of panels for installation in the panel frame sections, can be fabricated at one or more locations and subsequently built at another location. Furthermore, given the transportable nature of the components used to construct the gas enclosure assemblies of the present teachings, the various embodiments of the gas enclosure assemblies can be repeatedly installed and removed through a cycle of build and deconstruction.

To ensure that the gas enclosure is hermetically sealed, various embodiments of the gas enclosure assembly of the present teachings provide for coupling each frame member to provide a frame seal. The interior can be adequately sealed, e.g., hermetically sealed, by a tight-fitting intersection (light-fitting interaction) between the various frame members including gaskets or other seals. Once fully constructed, the sealed gas enclosure assembly can include an interior and a plurality of interior corner edges, at least one interior corner edge being disposed at an intersection of each frame member with an adjacent frame member. One or more of the frame members, for example at least half of the frame members, can include one or more compressible pads secured along one or more respective edges thereof. The one or more compressible pads can be configured to create a hermetically sealed gas enclosure assembly once the plurality of frame members are coupled together and the hermetic panel is installed. The sealed gas enclosure assembly can be formed with the corner edges of the frame member sealed by a plurality of compressible gaskets. For each frame member, for example, but not limited to, an interior wall frame surface, a top wall frame surface, an upright sidewall frame surface, a bottom wall frame surface, and combinations thereof, can be provided with one or more compressible pads.

For the various embodiments of the gas enclosure assembly, each frame member can include a plurality of sections that are framed (framed) and manufactured to receive any of a plurality of panel types that can be sealably mounted in each section to provide a gas-tight panel seal for each panel. In various embodiments of the gas enclosure assembly of the present teachings, each section frame can have a section frame gasket that ensures with selected fasteners that each panel mounted in each section frame can provide a gas-tight seal for each panel, and thus for a fully constructed gas enclosure. In various embodiments, the gas enclosure assembly can have one or more window panels or service windows in each wall panel; wherein each window panel or service window can have at least one glove port (gloveport). During assembly of the gas enclosure assembly, each glove port can have a glove attached so that the glove can extend into the interior. According to various embodiments, each glove port can have hardware for mounting a glove, wherein such hardware utilizes a gasket seal around each glove port that provides a hermetic seal to minimize leakage or molecular diffusion through the glove port. For the various embodiments of the gas closure assembly of the present teachings, the hardware is also designed to provide end users with the convenience of closing and opening a glove port.

Various embodiments of a gas enclosure system according to the present teachings can include a gas enclosure assembly formed from a plurality of frame members and panel sections, and gas circulation, filtration and purification components. For various embodiments of the gas enclosure system, the piping system may be installed during the assembly process. According to various embodiments of the present teachings, the piping system can be installed within a gas containment frame assembly that has been constructed from a plurality of frame members. In various embodiments, the piping system can be installed on the plurality of frame members before they are coupled to form the gas enclosure frame assembly. The ductwork for the various embodiments of the gas enclosure system can be configured such that substantially all of the gas introduced into the ductwork from one or more ductwork inlets moves through the various embodiments of the gas filtration loop (gas filtration loop) in order to remove particulate matter inside the gas enclosure system. Further, the piping system of various embodiments of the gas enclosure system can be configured to separate the inlet and outlet of the gas purification circuit external to the gas enclosure assembly from the gas filtration circuit internal to the gas enclosure assembly. According to various embodiments of the gas enclosure system of the present teachings, the gas circulation and filtration system can be in fluid communication with a component such as, but not limited to, a particulate control system. For various embodiments of the gas enclosure assembly, the gas circulation and filtration system can be in fluid communication with the service bundle housing exhaust system. For various embodiments of the gas enclosure assembly, the gas circulation and filtration system can be in fluid communication with the printhead assembly exhaust system. In various embodiments of the gas enclosure system, various components of the particle control system in fluid communication with the gas circulation and filtration system can provide a low particle zone proximate to a substrate located in the printing system.

For example, the gas enclosure system can have a gas circulation and filtration system inside the gas enclosure assembly. Such an interior filtration system can have a plurality of fan filter units within the interior and can be configured to provide laminar flow of gas within the interior. The laminar flow can be in a direction from the top of the interior to the bottom of the interior, or in any other direction. While the flow of gas produced by the circulation system need not be laminar, laminar flow of gas can be used to ensure that the gas is turned inside out and intact. Laminar flow of gas can also be used to minimize turbulence, which is undesirable because it can cause particles in the environment to accumulate in such turbulent areas, thereby preventing the filtration system from removing those particles from the environment. Furthermore, in order to maintain a desired temperature in the interior, a thermal conditioning system utilizing a plurality of heat exchangers can be provided, for example operating with, adjacent to or used in conjunction with a fan or another gas circulation device. The gas purification circuit can be configured to circulate gas from within the interior of the gas enclosure assembly through at least one gas purification component external to the enclosure. In this regard, the circulating and filtering system inside the gas enclosure assembly in combination with the gas purification loop outside the gas enclosure assembly can provide continuous circulation of substantially low particle inert gas with substantially low levels of reactive species throughout the gas enclosure system. Various embodiments of a gas enclosure system with a gas purification system can be configured to maintain very low levels of undesirable components, such as organic solvents and their vapors, as well as water, water vapor, oxygen, and the like.

In addition to providing gas circulation, filtration and purification components, the ductwork can be sized and shaped to accommodate at least one service bundle therein. Service bundles according to the present teachings can include, for example, but not limited to, optical cables, electrical cables, wires, and various fluid-containing conduits, among others. Various embodiments of a service bundle of the present teachings can have a substantial dead volume created by void spaces formed between components of the service bundle. Large dead volume that can be created in bundles of various optical cables, electrical cables, wires, and fluid-containing conduits can have large volumes of reactive atmospheric species trapped in the void space, such as water, water vapor, oxygen, and the like. Such large volumes of occluded reactive atmospheric species may be difficult to remove quickly through a purification system. Furthermore, such a service bundle is a source of identification of particulate matter. In some embodiments, any combination of cables, electrical wires and wire bundles, and conduits containing fluids can be substantially disposed within the conduit system, and can be operatively associated with at least one of an optical system, an electrical system, a mechanical system, and a cooling system, respectively, housed within the interior of the gas enclosure system. Since the gas circulation, filtration and purification components can be configured such that substantially all of the circulated inert gas is introduced through the ductwork, both particulate matter originating from such bundles and atmospheric constituents trapped in the dead volume of the various bundled materials can be effectively removed by having such bundled components substantially contained within the ductwork.

Various embodiments of a gas enclosure system according to the present teachings can include a gas enclosure assembly formed from a plurality of frame members and panel sections, as well as particle control systems, gas circulation, filtration, and purification components, and additionally include various embodiments of a pressurized inert gas recirculation system. Such pressurized inert gas recirculation systems can be used in the operation of OLED printing systems for various pneumatically driven devices and apparatuses, as will be discussed in greater detail subsequently herein.

In accordance with the present teachings, several engineering challenges are addressed to provide various embodiments of a pressurized inert gas recirculation system in a gas enclosure system. First, under typical operation of a gas enclosure system without a pressurized inert gas recirculation system, the gas enclosure system can be maintained at a slightly positive internal pressure relative to the external pressure in order to prevent external gas or air from entering the interior in the event of any leak in the gas enclosure system. For example, under typical operation, for various embodiments of the gas enclosure system of the present teachings, the interior of the gas enclosure system can be maintained at a pressure of, for example, at least 2mbarg, for example, at least 4mbarg, at least 6mbarg, at least 8mbarg, or higher, relative to the surrounding atmosphere outside the enclosure system. Maintaining a pressurized inert gas recirculation system within a gas enclosure system can be challenging because it exhibits a dynamic and continuous equilibrium behavior for maintaining a slightly positive internal pressure of the gas enclosure system while continuously introducing pressurized gas into the gas enclosure system. Further, for various gas enclosure assemblies and systems of the present teachings, the variable requirements of various devices and equipment can produce irregular pressure distributions. Maintaining the dynamic pressure balance of the gas enclosure system under such conditions, which is kept at a slightly positive pressure relative to the external environment, can provide the integrity of the OLED printing process on a continuous basis.

For various embodiments of the gas enclosure system, the pressurized inert gas recirculation system according to the present teachings can include various embodiments of a pressurized inert gas circuit that can utilize at least one of a compressor, accumulator, and blower, and combinations thereof. Various embodiments of pressurized inert gas recirculation systems, including various embodiments of pressurized inert gas circuits, can have a specially designed pressure control bypass circuit that can provide the internal pressure of the inert gas in the gas enclosure system of the present teachings at a stable, defined value. In various embodiments of the gas enclosure system, the pressurized inert gas recirculation system can be configured to recirculate the pressurized inert gas via the pressure control bypass loop when the pressure of the inert gas in the accumulator of the pressurized inert gas loop exceeds a predetermined threshold pressure. For example, the threshold pressure can be in a range from between about 25psig to about 200psig, or, more specifically, in a range from between about 75psig to about 125psig, or, more specifically, in a range from between about 90psig to about 95 psig. In this regard, the gas enclosure system of the present teachings having a pressurized inert gas recirculation system with various embodiments of a specifically designed pressure control bypass loop is capable of maintaining equilibrium with the pressurized inert gas recirculation system in a hermetically sealed gas enclosure.

In accordance with the present teachings, various devices and apparatus can be disposed within the interior and in fluid communication with various embodiments of a pressurized inert gas recirculation system having various pressurized inert gas circuits that can utilize a variety of pressurized gas sources, such as at least one of a compressor, a blower, and combinations thereof. For the various embodiments of the gas enclosure and system of the present teachings, the use of various pneumatically operated devices and apparatus can provide low particle generation performance, as well as low maintenance costs. Exemplary devices and apparatus that can be disposed within the interior of the gas enclosure system and in fluid communication with the various pressurized inert gas circuits can include, for example and without limitation, one or more of a pneumatic robot, a substrate floatation table, an air bearing, an air bushing, a compressed gas tool, a pneumatic actuator, and combinations thereof. A substrate floatation table and air bearings can be used to operate aspects of the OLED printing system of the various embodiments of the gas enclosure system according to the present teachings. For example, a substrate floatation table utilizing air bearing technology can be used to transport the substrate to a position in the print head chamber and to support the substrate during the OLED printing process.

FIG. 1A is a right, front perspective view of a gas enclosure assembly 100 according to various embodiments of the present teachings. The gas enclosure assembly 100 can be integrated with various components to provide various embodiments of the gas enclosure system of the present teachings. The gas enclosure system of the present teachings can comprise: one or more gases for maintaining an inert environment within the interior of the gas enclosure assembly; and means for maintaining a substantially low-particle environment. By way of non-limiting example, various embodiments of the gas enclosure system can have a particulate control system that can include a gas circulation and filtration system, and a purification component for removing reactive species from the recirculated inert gas, and can have various embodiments of a pressurized inert gas recirculation system. As such, various embodiments of the gas enclosure systems of the present teachings can be useful in maintaining an inert, substantially low-particle atmosphere in the interior.

For example, fig. 1B is a left front perspective view of various embodiments of a gas enclosure system 500. Fig. 1B depicts a gas enclosure system 500, which can include various embodiments of the gas enclosure assembly 100. The gas enclosure system 500 can have a load-locked inlet chamber 1110, the inlet chamber 1110 can have an inlet door 1112. Gas enclosure system 500 of fig. 1B can include a gas purging system 3130 for providing gas enclosure assembly 100 with a constant supply of inert gas having substantially low levels of reactive atmospheric species, such as water vapor and oxygen, and organic solvent vapor from the OLED printing process. The inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions in accordance with the present teachings. Some common non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. Various embodiments of gas purification systems according to the present teachings, such as gas purification system 3130 of fig. 1B, can maintain the level of each of the various reactive species, including various reactive atmospheric gases, such as water vapor and oxygen, and the level of organic solvent vapor at 100ppm or less, such as 10ppm or less, 1.0ppm or less, or 0.1ppm or less.

The gas enclosure system 500 of FIG. 1B can also have a controller system 1130 for system control functions. For example, the system controller 1130 can include one or more processor circuits (not shown) in communication with one or more memory circuits (not shown). The system controller 1130 can also communicate with the load-lock inlet chamber 1110, outlet chamber (not shown), and ultimately the printing nozzles of the OLED printing system, which can be housed in the gas enclosure system 500. In this manner, the system controller 1130 can coordinate the opening of the door 1112 in, for example, a load-lock inlet chamber 1110 to allow substrates to enter the gas enclosure system 500. The system controller 1130 can control various system functions, such as controlling the dispensing of ink to the print nozzles of an OLED printing system. The gas enclosure system 500 of fig. 1B is configured to contain and protect air-sensitive processes, such as printing of multiple inks useful for creating OLED stacks (stacks) using industrial printing systems. Examples of atmospheric gases that react with OLED inks include water vapor and oxygen, as well as a variety of organic vapors from, for example, organic solvents used as carriers for various OLED inks. As previously discussed herein, the gas enclosure assembly 100 can be configured to maintain a sealed atmosphere and allow the components or printing system to operate efficiently, while the gas enclosure system 500 can provide all of the components necessary to maintain an inert environment. Further, the gas enclosure system 500 can have a particle control system that provides a low particle zone proximate to the substrate, which can include, as non-limiting examples: such as gas circulation and filtration systems, low particle generation X-axis linear bearing systems for moving the printhead assembly relative to the substrate, service beam housing exhaust systems, and printhead assembly exhaust systems.

As depicted in fig. 1A, various embodiments of the gas enclosure assembly 100 can include the following component parts, namely: including a front or first wall panel 210', a left or second wall panel (not shown), a right or third wall panel 230', a rear or fourth wall panel (not shown), and a top panel 250', the gas enclosure assembly can be attached to a tray (pan) 204 that rests on a base (not shown). As will be discussed in greater detail later herein, various embodiments of the gas enclosure assembly 100 of fig. 1A can be constructed from a front wall frame or first wall frame 210, a left wall frame or second wall frame (not shown), a right wall frame or third wall frame 230, a rear wall panel or fourth wall panel (not shown), and a ceiling frame 250. Various embodiments of the ceiling frame 250 can include a blower filter unit cover 103 and first ceiling frame duct 105 and first ceiling frame duct 107. In accordance with embodiments of the present teachings, various types of section panels may be installed in any of a plurality of panel sections including frame members. In various embodiments of the gas closure 100 of fig. 1, the sheet metal panel section 109 can be welded into the frame member during construction of the frame. For various embodiments of the gas enclosure assembly 100, various types of section panels that can be repeatedly installed and removed through a cycle of build and deconstruction of the gas enclosure assembly can include: the inset panel 110, as indicated for the wall panel 210'; as well as a window panel 120 and an easily removable service window 130, as indicated for wall panel 230'.

While the easily removable service window 130 can provide convenient access to the interior of the closure 100, any panel that is removable can be used to provide access to the interior of the gas enclosure system for maintenance and periodic service purposes. This access for service or repair is distinguished from access provided by panels such as window panel 120 and easily removable service window 130, which can provide end user glove access (glove access) to the interior of the gas enclosure assembly during use from the exterior of the gas enclosure assembly. For example, as shown for panel 230 in fig. 1A, any glove, such as glove 142, attached to glove port 140 can provide end user access to the interior during use of the gas enclosure system.

FIG. 2 depicts an exploded view of various embodiments of a gas enclosure assembly as depicted in FIG. 1A. Various embodiments of the gas enclosure assembly can have a plurality of wall panels, including an exterior perspective view of the front wall panel 210', an exterior perspective view of the left wall panel 220', an interior perspective view of the right wall panel 230', an interior perspective view of the rear wall panel 240', and a top perspective view of the top panel 250', which can be attached to the tray 204 disposed on the base 202, as shown in fig. 1A. An OLED printing system, the printing process of which is known to be sensitive to atmospheric conditions, can be mounted over the tray 204. According to the present teachings, the gas enclosure assembly can be constructed from frame members, such as wall frame 210 of wall panel 210', wall frame 220 of wall panel 220', wall frame 230 of wall panel 230', wall frame 240 of wall panel 240', and ceiling frame 250 of ceiling panel 250', into which a plurality of segment panels can then be installed. In this regard, it may be desirable to streamline the design of segment panels that can be repeatedly installed and removed through a cycle of construction and deconstruction of various embodiments of the gas enclosure assembly of the present teachings. Furthermore, forming the profile of gas enclosure assembly 100 can be done to accommodate the footprint of various embodiments of an OLED printing system, in order to minimize the volume of inert gas required in the gas enclosure assembly, as well as to provide convenient access to the end user during use of the gas enclosure assembly as well as during maintenance.

Using front wall panel 210 'and left wall panel 220' as examples, various embodiments of the frame member can have a sheet metal panel section 109 that is welded into the frame member during construction of the frame member. The inset panel 110, the window panel 120, and the easily removable service window 130 can be installed in each of the wall frame members and can be repeatedly installed and removed through a cycle of build and deconstruction of the gas enclosure assembly 100 of fig. 2. As can be seen, in the example of wall panel 210 'and wall panel 220', the wall panel can have a window panel 120 adjacent to the easily removable service window 130. Similarly, as depicted in the example of rear wall panel 240', the wall panel can have a window panel, such as window panel 125, with two adjacent glove ports 140. For the various embodiments of wall frame members according to the present teachings, and as seen for gas enclosure assembly 100 of fig. 1A, such an arrangement of gloves provides easy access to component parts within the enclosed system from outside of the gas enclosure. Thus, various embodiments of the gas enclosure can provide two or more glove ports, enabling an end user to extend left and right gloves into the interior and manipulate one or more items within the interior without disturbing the composition of the gas atmosphere within the interior. For example, any of the window panels 120 and service windows 130 can be positioned to facilitate access to the adjustable components within the interior of the gas enclosure assembly from the exterior of the gas enclosure assembly. According to various embodiments of window panels, such as window panel 120 and service window 130, such windows may not include a glove port and glove port assembly when an end user is not instructed to access through a glove port glove.

As depicted in fig. 2, various embodiments of wall and ceiling panels can have multiple inset panels 110. As can be seen in fig. 2, the inset panel can have a variety of shapes and aspect ratios. In addition to the inset panels, the ceiling panel 250' can also have a fan filter unit cover 103 and first and second ceiling frame conduits 105, 107 that mount, bolt, screw, secure, or otherwise secure to the ceiling frame 250. As will be discussed in greater detail later herein, a duct system in fluid communication with the duct 107 of the ceiling panel 250' can be installed within the interior of the gas enclosure assembly. According to the present teachings, the piping system can be part of a gas circulation system inside the gas enclosure assembly and separate the fluid flow exiting the gas enclosure assembly for circulation through at least one gas purification component outside the gas enclosure assembly.

Fig. 3 is a front exploded perspective view of the frame member assembly 200, wherein the wall frame 220 can be configured to include a complete complement of panels. Although not limited to the design shown, using the wall frame 220, the frame member assembly 200 can be used as an example for various embodiments of frame member assemblies according to the present teachings. Various embodiments of frame member assemblies can include various frame members and section panels mounted in various frame panel sections of the various frame members according to the present teachings.

According to various embodiments of various frame member assemblies of the present teachings, the frame member assembly 200 can include a frame member, such as a wall frame 220. For various embodiments of a gas enclosure assembly, such as gas enclosure assembly 100 of fig. 1A, a process that may utilize equipment housed in such a gas enclosure assembly may require not only a hermetically sealed enclosure that provides an inert environment, but also an environment that is substantially free of particulate matter. In this regard, frame members according to the present teachings may utilize various sizes of metal tube materials to construct various embodiments of the frame. Such metal tube materials meet desired material properties including, but not limited to, high-integrity materials that will not degrade to produce particulate matter, and frame members that are high strength but optimally weight, thereby providing convenient transportation, construction and deconstruction of gas enclosure assemblies including various frame members and panel sections from one location to another. Any material that meets these requirements can be used to create various frame members according to the present teachings.

For example, various embodiments of frame members according to the present teachings, such as frame member assembly 200, can be constructed from extruded metal tubing. According to various embodiments of the frame member, aluminum, steel, and various metal composite materials may be used to construct the frame member. In various embodiments, metal tubes having dimensions such as, but not limited to, 2 "wide X2" high, 4 "wide X2" high, and 4 "wide X4" high, and having wall thicknesses of 1/8 "through 1/4" can be used to construct various embodiments of frame members in accordance with the present teachings. Furthermore, a variety of reinforced fiber polymer composites are available in a variety of tubes or other forms having the following material properties, namely: the material properties include, but are not limited to, high integrity materials that will not degrade to produce particulate matter, and to produce frame members having high strength but optimal weight to provide convenient transport, construction and deconstruction from one location to another.

For constructing various frame members from various sizes of metal tube material, it is contemplated that various embodiments of welding can be performed to create frame welds. In addition, construction of various frame members from various sizes of build material can be accomplished using suitable industrial adhesives. It is contemplated that the construction of the various frame members should be accomplished in the following manner: a leakage path through the frame member will not be inherently created. In this regard, the construction of the various frame members can be accomplished using any of the following methods, namely: for various embodiments of the gas enclosure assembly, the method does not inherently create a leak path through the frame member. In addition, various embodiments of frame members according to the present teachings, such as the wall frame 220 of FIG. 2, may also be painted or coated. For various embodiments of frame members made of, for example, metal tube materials that are susceptible to oxidation, wherein the material formed at the surface may generate particulate matter, painting or coating to prevent formation of particulate matter or other surface treatments such as anodization can be performed.

A frame member assembly, such as the frame member assembly 200 of fig. 3, can have a frame member, such as a wall frame 220. The wall frame 220 can have: a top 226, a top wall frame bulkhead 227 being securable on said top 226; and a bottom 228, a bottom wall frame partition 229 can be fastened to the bottom 228. As will be discussed in greater detail later herein, the baffles mounted on the surface of the frame member are part of a gasket sealing system that, in combination with the gasket seals of the panels mounted in the frame member sections, provide a hermetic seal of various embodiments of the gas enclosure assembly according to the present teachings. A frame member, such as the wall frame 220 of the frame member assembly 200 of fig. 3, can have several panel frame sections, wherein each section can be manufactured to receive various types of panels, such as, but not limited to, the inset panel 110, the window panel 120, and the easily removable service window 130. Various types of panel sections can be formed in the construction of the frame members. Various types of panel segments can include, for example, but are not limited to: an inset panel section 10 for receiving an inset panel 110; a window panel section 20 for receiving a window panel 120; and a service window panel section 30 for receiving an easily removable service window 130.

Each type of panel section can have a panel section frame to receive a panel, and it can be provided that each panel can be sealably secured into each panel section according to the present teachings for constructing a hermetically sealed gas enclosure assembly. For example, in fig. 3, which depicts a frame assembly according to the present teachings, inset panel section 10 is shown with frame 12, window panel section 20 is shown with frame 22, and service window panel section 30 is shown with frame 32. For the various embodiments of the wall frame assembly of the present teachings, the various panel section frames can be sheet metal material that is welded into the panel section with a continuous weld to provide a hermetic seal. For the various embodiments of the wall frame assembly, the various panel section frames can be made from a variety of sheets, including build materials selected from reinforced fiber polymer composites that can be installed in the panel sections using suitable industrial adhesives. As will be discussed in more detail with respect to sealing in the subsequent teachings, each panel section frame can have a compressible gasket disposed thereon to ensure that an airtight seal can be formed for each panel mounted and secured in each panel section. In addition to the panel section frame, each frame member section can also have hardware associated with positioning and securely fastening the panel in the panel section.

Various embodiments of the inset panel 110 and the panel frame 122 for the window panel 120 can be constructed from sheet metal material, such as, but not limited to, aluminum, various alloys of aluminum, and stainless steel. The properties for the panel material can be the same as the properties for the structural material making up the various embodiments of the frame member. In this regard, materials having properties specific to various panel members include, but are not limited to, high integrity materials that will not degrade to produce particulate matter, and panels that are produced with high strength but are optimized for weight so as to provide convenient transport, construction and deconstruction from one location to another. Various embodiments, such as honeycomb core sheet material, can have the necessary attributes for use as a panel material for the inset panel 110 and panel frame 122 used to construct the window panel 120. The honeycomb core sheet can be made from a variety of materials; can be metallic, as well as metal composites and polymers, and honeycomb core sheets of polymer composites. Various embodiments of the removable panel when made of a metallic material can have a ground connection included in the panel to ensure that the entire structure is grounded when the gas enclosure assembly is constructed.

Given the transportable nature of the components used to construct the gas enclosure assembly of the present teachings, any of the various embodiments of the section panels of the present teachings can be repeatedly installed and removed during the use of the gas enclosure system to provide access to the interior of the gas enclosure assembly.

For example, the panel section 30 for receiving the easily removable service window panel 130 can have a set of four spacers, one of which is indicated as the window guide spacer 34. Further, the panel section 30 configured to receive the easily removable service window panel 130 can have a set of four clamping jaws (clamping jaws) 36, the clamping jaws 36 can be used to clamp the service window 130 into the service window panel section 30 using a set of four reaction toggle clamps (toggle clamps) 136, the toggle clamps 136 mounted on the service window frame 132 for each of the easily removable service windows 130. In addition, two of each window handle 138 can be mounted on an easily removable service window frame 132 to provide an end user with the convenience of removing and installing service windows 130. The number, type and placement layout of the removable service window handles can be changed. Further, the service window panel section 30 for receiving the easily removable service window panel 130 can have at least two window clips 35, the window clips 35 being selectively installed in each service window panel section 30. Although depicted as being in the top and bottom of each of the service window panel sections 30, the at least two window clips can be mounted in any manner for securing the service window 130 in the panel section frame 32. Tools can be used to remove and install the window clip 35 to allow removal and reinstallation of the service window 130.

The reaction toggle clamp 136 of the service window 130 and the hardware mounted on the panel section 30, including the clamping jaw 36, the window guide spacer 34 and the window clamp 35, can be constructed of any suitable material and combination of materials. For example, one or more such elements can comprise at least one metal, at least one ceramic, at least one plastic, and combinations thereof. The removable service window handle 138 can be constructed of any suitable material and combination of materials. For example, one or more such elements can comprise at least one metal, at least one ceramic, at least one plastic, at least one rubber, and combinations thereof. The closure window, such as window 124 of window panel 120 or window 134 of service window 130, can comprise any suitable material and combination of materials. According to various embodiments of the gas enclosure assembly of the present teachings, the enclosure window can comprise a transparent and translucent material. In various embodiments of the gas enclosure assembly, the enclosure window can comprise: silica gel matrix materials such as, but not limited to, glass and quartz; and various types of polymer-based materials, such as, for example and without limitation, various types of polycarbonates, acrylic, and vinyl. The transparent and translucent properties of various composite materials and combinations thereof are desirable properties for exemplary window materials in accordance with the systems and methods of the present teachings.

As will be discussed in the following teachings with respect to fig. 8-9, the wall and ceiling framing member seal in conjunction with the gas-tight section panel frame seal provide various embodiments of a gas enclosure assembly that provides a gas-tight seal for air-sensitive processes that require an inert environment. Components of the gas enclosure system that help provide a substantially low concentration of reactive species and a substantially low particle environment can include, but are not limited to: a hermetically sealed gas enclosure assembly; and a highly efficient gas circulation and particle filtration system comprising a piping system. Providing an effective hermetic seal for a gas enclosure assembly can be challenging; especially in the case of three frame members that come together to form a three-sided joint. Thus, three-sided joint sealing presents a particularly difficult challenge for providing an easily installable hermetic seal for a gas closure assembly that can be assembled and disassembled through a cycle of build and deconstruction.

In this regard, various embodiments of a gas enclosure assembly according to the present teachings provide a gas-tight seal of a fully constructed gas enclosure system through an effective gasket seal to the joint, as well as providing an effective gasket seal around the load bearing building element. Unlike conventional joint seals, the joint seal according to the present teachings: 1) uniform parallel alignment (uniform parallel alignment) of adjacent liner segments from orthogonally oriented liner lengths is included at the top and bottom terminal frame coupling joints coupling the three frame members, thereby avoiding corner seam alignment and sealing; 2) providing an abutment length that forms across the entire width of the joint, thereby increasing the sealing contact area of the three-sided coupling joint; 3) designed with a spacer that provides a uniform compressive force across all vertical and horizontal and top and bottom three-sided gasket seals. Further, the choice of gasket material can affect the effectiveness of providing a hermetic seal, as will be discussed later herein.

Fig. 4A-4C are schematic top views depicting a comparison of a conventional three-face joint seal with a three-face joint seal according to the present teachings. According to various embodiments of the gas enclosure assembly of the present teachings, there can be, for example, but not limited to, at least four wall frame members, a top panel frame member, and a tray that can be coupled to form a gas enclosure assembly, thereby creating a plurality of vertical, horizontal, and three-sided joints that require a gas-tight seal. In fig. 4A, a schematic top view of a conventional three-sided gasket seal formed by a first gasket I oriented orthogonally to gasket II in the X-Y plane is shown. As shown in FIG. 4A, the seam formed by the orthogonal orientation in the X-Y plane has a contact length W between two segments defined by the width dimension of the liner₁. Further, the end portion of pad III can abut pad I and pad II, as shown in phantom, which is a pad oriented orthogonal to both pad I and pad II in the vertical direction. In fig. 4B, a schematic top view of a conventional three-sided joint gasket seal is shown formed by a first gasket length I orthogonal to a second gasket length II and having a 45 ° sided seam joining the two lengths, wherein the seam has a contact length W between the two segments that is greater than the width of the gasket material₂. Similar to the configuration of fig. 4A, the end of pad III that is orthogonal to both pad I and pad II in the vertical direction can abut pad I and pad II, as shown in phantom. Assuming that the width of the pad is the same in fig. 4A and 4B, the contact length W of fig. 4B₂Contact length W greater than FIG. 4A₁。

Fig. 4C is a schematic top view of a three-sided gasket seal according to the present teachings. The first pad length I can have a pad segment I 'formed orthogonal to the direction of the pad length I, wherein the pad segment I' has a length that is: the length can be approximately the width dimension of the coupled structural components, for example, a 4 "wide X2" high or a 4 "wide X4" high metal tube used to form various wall frame members of the gas enclosure assembly of the present teachings.Pad II is orthogonal to pad I in the X-Y plane and has a pad segment II 'that has an overlap length with pad segment I' of about the width of the coupled structural component. The width of the pad sections I 'and II' is the width of the compressible pad material selected. Pad III is oriented orthogonal to both pad I and pad II in the vertical direction. The gasket section III' is the end of the gasket III. The liner section III 'is formed from a liner section III' oriented orthogonal to the vertical length of the liner III. The liner section III ' can be formed such that it has approximately the same length as liner sections I ' and II ' and has a width that is the thickness of the compressible liner material selected. In this regard, the contact length W of the three aligned segments shown in FIG. 4C₃Greater than correspondingly having a contact length W₁And W₂The contact length of a conventional delta joint seal shown in fig. 4A or fig. 4B.

In this regard, a three-sided joint gasket seal according to the present teachings produces a uniform parallel alignment of gasket segments at the terminal coupling joint from otherwise orthogonally aligned gaskets (as shown in the case of fig. 4A and 4B). This uniform parallel alignment of the three-sided gasket seal segments provides for the application of a uniform lateral sealing force across the segments to promote an air-tight three-sided joint seal at the top and bottom corners of the joint formed by the wall frame members. Further, each of the uniformly aligned gasket segments for each three-sided joint seal is selected to be about the width of the coupled structural member, thereby providing a maximum contact length of the uniformly aligned segments. Moreover, the splice seal according to the present teachings is designed with a septum that provides a uniform compressive force across all vertical, horizontal, and three-sided gasket seals that make up the splice. It is believed that the width of the gasket material selected for the conventional three-sided seal given for the example of fig. 6A and 6B can be at least the width of the coupled structural components.

The exploded perspective view of fig. 5A depicts the seal assembly 300 according to the present teachings before all frame members are coupled such that the cushion is depicted in an uncompressed state. In fig. 5A, a plurality of wall frame members, such as wall frame 310, wall frame 350, and ceiling frame 370, can be sealably coupled by the various components of the gas enclosure assembly in a first step of constructing the gas enclosure. The frame member seal according to the present teachings is a substantial part of providing: providing a gas enclosure assembly that is hermetically sealed once fully constructed; and providing a seal that can be implemented through a cycle of build and deconstruction of the gas enclosure assembly. While the examples given in the following teachings with respect to fig. 7A-7B are directed to sealing of a portion of a gas enclosure assembly, such teachings are also applicable to the entirety of any gas enclosure assembly of the present teachings.

The first wall frame 310 depicted in fig. 5A can have: an inner side 311 on which a partition 312 is mounted; a vertical side 314; and a top surface 315 on which a diaphragm 316 is mounted. The first wall frame 310 can have a first gasket 320 disposed in and adhered to the space formed by the barrier 312. The gap 302 remaining after the first gasket 320 is disposed in the space formed by the separator 312 and adhered to the space can extend the vertical length of the first gasket 320, as shown in fig. 5A. As depicted in fig. 5A, the compliant pad 320 can be disposed in and adhered to the space formed by the bulkhead 312, and can have a vertical pad length 321, a curvilinear pad length (curviliner gasketlength) 323, and a pad length 325, the pad length 325 forming 90 ° on the inner frame member 311 in a plane with the vertical pad length 321 and terminating at the vertical side 314 of the wall frame 310. In fig. 5A, the first wall frame 310 can have a top surface 315, a partition 316 mounted on the top surface 315, forming a space on the surface 315, on which surface 315A second gasket 340 is disposed in and adhered to the space proximate an inner edge 317 of the wall frame 310. The gap 304 remaining after the second gasket 340 is disposed in the space formed by the partition 316 and adhered to the space can extend the horizontal length of the second gasket 340, as shown in fig. 5A. Further, as shown in phantom, the length 345 of the spacer 340 is uniformly parallel and continuously aligned with the length 325 of the spacer 320.

The second wall frame 350 depicted in fig. 5A can have outer frame sides 353, vertical sides 354, and a top surface 355 on which the partitions 356 are mounted. The second wall frame 350 can have a first gasket 360 disposed in and adhered to the space formed by the partition 356. The gap 306 remaining after the first gasket 360 is disposed in the space formed by the partition 356 and adhered to the space can extend the horizontal length of the first gasket 360, as shown in fig. 5A. As depicted in fig. 5A, the compliant pad 360 can have a horizontal length 361, a curvilinear length 363, and a length 365, the length 365 forming 90 ° in a plane on the top surface 355 and terminating at the outer frame member 353.

As shown in the exploded perspective view of fig. 5A, the inner frame member 311 of the wall frame 310 can be coupled to the vertical side 354 of the wall frame 350 to form one build interface of the gas enclosure frame assembly. With respect to the sealing of the built-up joint so formed, in various embodiments of the gasket seal, the length 325 of the gasket 320, the length 365 of the gasket 360, and the length 345 of the gasket 340 are all continuously and uniformly aligned at the terminal coupling joint of the wall frame member according to the present teachings as depicted in fig. 5A. Moreover, as will be discussed in greater detail later herein, various embodiments of the separator of the present teachings can provide a uniform compression of between about 20% to about 40% deformation (deflections) of the compressible gasket material used to hermetically seal various embodiments of the gas enclosure assembly of the present teachings.

Fig. 5B depicts the seal assembly 300 according to the present teachings after all frame members are coupled such that the cushion is depicted in a compressed state. FIG. 5B is a perspective view showing details of a three-sided joined corner seal formed at the top terminal end coupling joint between the first wall frame 310, the second wall frame 350 and the roof frame 370; this is shown in a transparent interior view. As shown in fig. 5B, the gasket space defined by the spacer can be determined to a width such that when joining the wall frame 310, the wall frame 350, and the ceiling frame 370 shown in the transparent interior view, a uniform compression of deformation of between about 20% to about 40% of the compressible gasket material used to form the vertical, horizontal, and three-sided gasket seals ensures that the gasket seals at all surfaces of the joint seal of the wall frame members can provide a hermetic seal. In addition, the

pad gaps

302, 304, and 306 (not shown) are sized such that each pad is capable of filling the pad gap according to an optimal compression of the compressible pad material at a deformation of between about 20% and about 40%, as shown for pad 340 and pad 360 in fig. 5B. As such, in addition to providing uniform compression by defining the space in which each gasket is disposed and adhered, the various embodiments of the separator plate designed to provide a gap also ensure that each compressed gasket is able to conform within the space defined by the separator plate without wrinkling or bulging or otherwise becoming irregularly formed in the compressed state in a manner that can create a leak path.

In accordance with various embodiments of the gas enclosure assembly of the present teachings, various types of section panels can be sealed using a compressible gasket material disposed on each of the panel section frames. In sealing combination with the frame member gasket, the location and material of the compressible gasket used to form the seal between the various section panels and the panel section frame can provide a hermetically sealed gas enclosure assembly with little or no gas leakage. Furthermore, the seal design for all types of panels, such as the inset panel 110, the window panel 120, and the easily removable service window 130 of fig. 3, can provide a durable panel seal after repeated removal and installation of such panels, which may be required in order to access the interior of the gas enclosure assembly, e.g., for maintenance.

For example, FIG. 6A is an exploded view depicting the service window panel section 30 and the easily removable service window 130. As previously discussed herein, the service window panel section 30 can be manufactured to receive an easily removable service window 130. For various embodiments of the gas enclosure assembly, a panel section, such as a removable service panel section 30, can have a panel section frame 32 and a compressible liner 38 disposed on the panel section frame 32. In various embodiments, the hardware associated with securing the easily removable service window 130 in the removable service window panel section 30 can provide ease of installation and reinstallation for the end user, while at the same time ensuring that a hermetic seal is maintained when the easily removable service window 130 is installed and reinstalled in the panel section 30 as needed by the end user with direct access to the interior of the gas enclosure assembly. The easily removable service window 130 can include a rigid window frame 132 that can be constructed from, for example, but not limited to, a metal tube material as described for constructing any frame member of the present teachings. The service window 130 can utilize quick fastening hardware, such as, but not limited to, a reverse-acting toggle clamp 136, to provide the end user with convenient removal and reinstallation of the service window 130.

As shown in the front view of the removable service window panel section 30 of fig. 6A, the easily removable service window 130 can have a set of four toggle clamps 136 secured to the window frame 132. The service window 130 can be positioned into the panel section frame 30 at a defined distance to ensure proper compression force against the gasket 38. As shown in fig. 6B, a set of four window guide spacers 34 is used, one of which can be mounted in each corner of the panel section 30 in order to position the service window 130 in the panel section 30. Each of the set of clamping jaws 36 can be configured to receive a reaction toggle clamp 136 of an easily removable service window 136. According to various embodiments of the hermetic sealing of the service window 130 for cycles through installation and removal, the mechanical strength of the service window frame 132 in combination with the combination of the defined positions of the service window 130 relative to the compressible gasket 38 provided by the set of window guide spacers 34 can ensure that once the service window 130 is secured in place, for example, but not limited to, using a reaction toggle clamp 136 secured in the respective clamping jaw 36, the service window frame 132 can provide a uniform force on the panel section frame 32 with the defined compression set by the set of window guide spacers 34. The set of window guide spacers 34 are positioned such that the compressive force of the window 130 against the pad 38 deforms the compressible pad 38 by between about 20% and about 40%. In this regard, the construction of the service window 130 and the manufacture of the panel section 30 provides a hermetic seal of the service window 130 within the panel section 30. As previously discussed herein, the window clip 35 can be installed into the panel section 30 after the service window 130 is secured into the panel section 30, and removed when the service window 130 needs to be removed.

Reaction toggle clamp 136 can be secured to easily removable service window frame 132 using any suitable means and combination of means. Examples of suitable securing means that can be used include: at least one binder such as, but not limited to, epoxy or cement; at least one bolt; at least one screw; at least one other fastener; at least one slot; at least one track; at least one weld; and combinations thereof. The reaction toggle clamp 136 can be connected directly to the removable service window frame 132 or indirectly through an adapter plate. Reaction toggle clamp 136, clamping jaw 36, window guide spacer 34, and window clamp 35 can be constructed of any suitable material and combination of materials. For example, one or more such elements can comprise at least one metal, at least one ceramic, at least one plastic, and combinations thereof.

In addition to sealing an easily removable service window, a hermetic seal can also be provided for the inset panel and the window panel. Other types of section panels that can be repeatedly installed and removed in a panel section include, for example, but are not limited to, an inset panel 110 and a window panel 120, as shown in fig. 3. As can be seen in fig. 3, the panel frame 122 of the window panel 120 is constructed similarly to the inset panel 110. As such, the manufacture of the panel sections for receiving the inset panel and the window panel can be the same according to various embodiments of the gas enclosure assembly. In this respect, the sealing of the inset panel and the window panel can be implemented using the same principles.

Referring to fig. 7A and 7B, and in accordance with various embodiments of the present teachings, any panel of a gas enclosure, such as the gas enclosure assembly 100 of fig. 1, can include one or more inset panel segments 10, which inset panel segments 10 can have a frame 12 configured to receive a corresponding inset panel 110. Fig. 7A is a perspective view indicating an enlarged portion shown in fig. 7B. In fig. 7A, the inset panel 110 is depicted as being positioned relative to the inset frame 12. As can be seen in fig. 7B, the inset panel 110 is secured to the frame 12, wherein the frame 12 can be constructed, for example, from metal. In some embodiments, the metal can include aluminum, steel, copper, stainless steel, chromium, alloys, combinations thereof, and the like. A plurality of blind tapped holes (blind tapped holes) 14 can be formed in the insertion panel section frame 12. The panel section frame 12 is configured to include a cushion 16 between the infill panel 110 and the frame 12, and a compressible cushion 18 can be disposed in the frame 12. The blind threaded hole 14 can be a blind threaded hole of the M5 variety (variety). The screw 15 can be received by the blind threaded hole 14 to compress the gasket 16 embedded between the panel 110 and the frame 12. Once secured in place against the gasket 16, the inset panel 110 forms an airtight seal within the inset panel section 10. As previously discussed herein, such panel seals can be implemented for a variety of section panels, including but not limited to inset panel 110 and window panel 120, as shown in fig. 3.

According to various embodiments of compressible gaskets in accordance with the present teachings, the compressible gasket material used for the framing member seal and the panel seal can be selected from any of a variety of compressible polymeric materials, such as, but not limited to, a class of closed cell polymeric materials, also known in the art as sponge rubber materials (expanded rubber materials) or expanded polymeric materials (expanded polymer materials). Briefly, closed cell polymers are prepared in such a way that the gas is enclosed in discrete units; wherein each discrete unit is enclosed by a polymeric material. Properties of compressible closed cell polymer gasket materials that are desirable for use in hermetic sealing of frame and panel components include, but are not limited to: they are robust to chemical attack by a wide range of chemical species, have excellent moisture resistance, are elastic over a wide temperature range, and they resist permanent compression set. In general, closed cell polymeric materials have higher dimensional stability, lower coefficient of moisture absorption, and higher strength than open cell polymeric materials. Various types of polymeric materials that can be made into closed cell polymeric materials include, for example, but are not limited to, silicone, neoprene, ethylene propylene diene terpolymer (EPT); polymers and composites made using Ethylene Propylene Diene Monomer (EPDM), vinyl nitrile, Styrene Butadiene Rubber (SBR), as well as various copolymers and blends thereof.

The desired material properties of the closed cell polymer are maintained only when the unit comprising the bulk material remains intact during use. In this regard, the use of such materials in a manner that may exceed material specifications set for closed cell polymers, such as exceeding specifications for use within a specified temperature or compression range, may cause degradation of the gasket seal. In various embodiments of closed cell polymer gaskets for sealing frame members and section panels in frame panel sections, the compression of such materials should not exceed between about 50% to about 70% deformation, and for optimum performance can be between about 20% to about 40% deformation.

In addition to closed-cell compressible gasket materials, another example of a class of compressible gasket materials having desirable properties for use in constructing embodiments of gas enclosure assemblies according to the present teachings includes a class of hollow extruded compressible gasket materials. Hollow extruded gasket materials, as a class of materials, have desirable properties including, but not limited to: they are robust to chemical attack by a wide range of chemical species, have excellent moisture resistance, are elastic over a wide temperature range, and they resist permanent compression set. Such a hollow extruded compressible gasket material can have a variety of form factors such as, but not limited to, U-shaped cells, D-shaped cells, square cells, rectangular cells, and any of a variety of custom form factors for hollow extruded gasket materials. Various hollow extruded gasket materials can be made from the polymeric materials used for closed cell compressible gasket manufacture. For example, but not limiting of, various embodiments of the hollow extrusion gasket can be made of: silicone, neoprene, ethylene propylene diene terpolymer (EPT); polymers and composites made using Ethylene Propylene Diene Monomer (EPDM), vinyl nitrile, Styrene Butadiene Rubber (SBR), as well as various copolymers and blends thereof. The compression of such hollow cell gasket material should not exceed about 50% deformation in order to maintain the desired properties. While a class of closed cell compressible gasket materials and a class of hollow extruded compressible gasket materials have been given as examples, any compressible gasket material having desirable properties can be used for sealing structure components, such as various wall and roof frame members, and sealing various panels in panel section frames, as provided by the present teachings.

FIG. 8 is a bottom view of various embodiments of a ceiling panel of the present teachings, such as ceiling panel 250' of gas enclosure assembly 100 of FIG. 1A. According to various embodiments of the present teachings directed to the assembly of a gas enclosure, a lighting device can be mounted on an interior top surface of a ceiling panel, such as ceiling panel 250' of gas enclosure assembly 100 of fig. 1A. As depicted in fig. 8, the top plate frame 250 having an interior portion 251 can have a lighting device mounted on the interior portion of various frame members. For example, the roof frame 250 can have two roof frame sections 40, the two roof frame sections 40 having two roof frame beams 42 and 44 in common. Each roof frame section 40 can have: a first side 41 located toward the interior of the top plate frame 250; and a second side 43 positioned toward the outside of the top plate frame 250. For various embodiments according to the present teachings that provide a lighting arrangement for a gas enclosure, multiple pairs of lighting elements 46 can be installed. Each pair of lighting elements 46 can include a first lighting element 45 proximate the first side 41 and a second lighting element 47 proximate the second side 43 of the roof frame section 40. The number, positioning, and grouping of lighting elements shown in fig. 8 are exemplary. The number and grouping of lighting elements can be varied in any desired or suitable manner. In various embodiments, the lighting elements can be flush-mounted, while in other embodiments can be mounted such that they can be moved to a variety of positions and angles. The placement layout of the lighting elements is not limited to the top panel ceiling 433 but can additionally or alternatively be positioned on any other interior, exterior, and combination of surfaces of the gas enclosure assembly 100 shown in fig. 1A.

The various lighting elements can include any number, type, or combination of lamps, such as halogen lamps, white light lamps, incandescent lamps, arc lamps, or devices (LEDs). For example, each lighting element can include from 1 LED to about 100 LEDs, from about 10 LEDs to about 50 LEDs, or greater than 100 LEDs. The LED or other illumination device can emit any color or combination of colors in the color spectrum, outside the color spectrum, or a combination thereof. According to various embodiments of a gas enclosure assembly for inkjet printing of OLED materials, the wavelength of light for a lighting device installed in the gas enclosure assembly can be specifically selected to avoid material degradation during processing, since some materials are sensitive to light of some wavelengths. For example, 4X cool white LEDs can be used, 4X yellow LEDs can also be used, or any combination thereof. An example of a 4X cold white LED is LF1B-D4S-2THWW4 available from IDEC Corporation of Sunnyvale, california. An example of a 4X yellow LED that can be used is LF1B-D4S-2SHY6, also available from IDEC Corporation. The LEDs or other lighting elements can be positioned on the interior portion 251 of the ceiling frame 250 or on another surface of the gas enclosure assembly, or suspended from anywhere on the interior portion 251 or on another surface of the gas enclosure assembly. The lighting element is not limited to LEDs. Any suitable lighting element or combination of lighting elements can be used. Fig. 9 is a diagram of IDEC LED spectra (light spectra), and shows: an X-axis corresponding to the intensity when the peak intensity is 100%; and a Y-axis, corresponding to wavelength, in nanometers. Spectra for LF1B yellow type, yellow fluorescent lamp, LF1B white type LED, LF1B cold white type LED and LF1B red type LED are shown. Other spectra and combinations of spectra can be used according to various embodiments of the present teachings.

Reviewing the various embodiments of a gas enclosure assembly constructed in a manner minimizes the internal volume of the gas enclosure assembly and, at the same time, optimizes the workspace to accommodate the various footprints of the various OLED printing systems. Various embodiments of the gas enclosure assembly so configured additionally provide convenient access to the interior of the gas enclosure assembly from the outside during processing, and easy access to the interior for maintenance while minimizing downtime. In this regard, various embodiments of a gas enclosure assembly according to the present teachings can be shaped (contourr) with respect to various footprints of various OLED printing systems.

In accordance with the systems and methods of the present teachings, the frame member configurations, panel configurations, frame and panel seals, and configurations of gas closures such as gas closure 100 of FIG. 1A, can be adapted for use with gas closures of various sizes and designs. Various embodiments of the gas enclosure assembly can have various frame members configured to provide a profile for the gas enclosure assembly. Various embodiments of the gas enclosure assembly of the present teachings can accommodate an OLED printing system while optimizing the working space to minimize inert gas volumes and also allow for convenient access to the OLED printing system from the outside during processing. In this regard, the various gas enclosure assemblies of the present teachings can vary in profile topology and volume. As a non-limiting example, various embodiments of a shaped (contoured) gas closure according to the present teachings can have about 6m³To about 95m³For receiving various embodiments of printing systems capable of printing substrate sizes from Gen 3.5 to Gen 10. As another non-limiting example, various embodiments of shaped gas closures according to the present teachings can have about 15m³To about 30m³For receiving various embodiments of printing systems capable of printing substrate sizes, e.g., Gen 5.5 to Gen 8.5. Such embodiments of the shaped gas closure can be between about 30% and about 70% savings in volume compared to non-shaped closures having non-shaped dimensions of width, length, and height.

The gas enclosure assembly 1000 of fig. 9 can have all of the features listed in the present teachings for the exemplary gas enclosure assembly 100 of fig. 1A. For example, but not limiting of, the gas enclosure assembly 1000 can utilize a seal according to the present teachings that provides a hermetically sealed enclosure through a cycle of build and deconstruction. Various embodiments of gas enclosure systems based on the gas enclosure assembly 1000 can have a gas purification system that can maintain the level of each of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors at 100ppm or less, for example, 10ppm or less, 1.0ppm or less, or 0.1ppm or less.

Moreover, as will be discussed in greater detail subsequently herein, various embodiments of gas enclosure systems based on, for example, but not limited to, gas enclosure assembly 100 of fig. 1A and gas enclosure assembly 1000 of fig. 9 can have circulation and filtration systems that can provide a laminar flow environment that can minimize turbulent flow and can produce a substantially low particle environment by maintaining airborne particle levels in compliance with international organization for standardization (ISO) standards 14644-1:1999 as defined by classes 1 through 5. Prior to the printing process, the determination of airborne particulate matter can be performed for various embodiments of the gas enclosure system using, for example, a portable particle counting device for system verification. In various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed in situ as a continuous quality check while printing the substrate. For various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed prior to printing the substrate for system verification, and additionally in situ while printing the substrate.

Further, for various embodiments of the gas enclosure system of the present teachings, the substantially low-particle environment can provide a substantially low-particle substrate surface. Modeling of various embodiments of a gas enclosure system based on the present teachings shows that deposition on a substrate per print cycle of more than about 1 million up to about 1 million particles per square meter of substrate can be between more than about 1 million and up to about 1 million for particles in a size range of 0.1 μm and greater without various particle control systems of the present teachings. Such calculations indicate that deposition on the substrate per print cycle per square meter of substrate can be between more than about 1000 to more than about 10,000 particles for particles in the size range of about 2 μm and larger without the various particle control systems of the present teachings. The determination of the on-substrate distribution of particulate matter on the substrate can be performed for various embodiments of the gas enclosure system using, for example, a test substrate prior to printing the substrate for system verification. In various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed in situ as a continuous quality check while printing the substrate. For various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed for system verification prior to printing the substrate, and additionally in situ while printing the substrate.

Various embodiments of the gas enclosure system can have a particle control system that can maintain a substantially low-particle environment that provides on-substrate particle specification for particles between about 0.1 μm or more and about 10 μm or more. Various embodiments of the on-substrate particle specification can be easily converted from an average on-substrate particle distribution per minute per square meter of substrate to an average on-substrate particle distribution per minute per substrate for each of the target particle size ranges. As previously discussed herein, such conversion can be readily accomplished by a known relationship between the substrate and the corresponding area for that generation of substrate, e.g., a substrate of a particular generation size. Furthermore, the average substrate-on-substrate particle distribution per minute per square meter of substrate can be easily converted into any of a variety of unit time expressions. For example, in addition to the conversion between standard time units such as seconds, minutes, and days, time units specifically related to the process can be used. For example, as previously discussed herein, a print cycle can be associated with a unit of time.

FIG. 9 depicts a perspective view of a gas enclosure assembly 1000 of various embodiments of gas enclosure assemblies according to the present teachings. The gas enclosure assembly 1000 can include a front panel assembly 1200', a middle panel assembly 1300', and a rear panel assembly 1400 '. The front panel assembly 1200' can include: a front roof panel assembly 1260'; front wall panel assembly 1240' which can have an opening 1242 for receiving a substrate; and a front base panel assembly 1220'. Rear panel assembly 1400 'can include a rear roof panel assembly 1460', a rear wall panel assembly 1440', and a rear base panel assembly 1420'. Middle panel assembly 1300' can include a first middle closure panel assembly 1340', a middle wall and roof panel assembly 1360', and second middle closure panel assembly 1380' and a middle base panel assembly 1320 '.

In addition, the middle panel assembly 1300 'can include a first print head management system auxiliary panel assembly 1330' and a second print head management system auxiliary panel assembly (not shown). As previously discussed herein, various embodiments of an auxiliary enclosure configured as a section of a gas enclosure assembly can be sealably isolated from a working volume of a gas enclosure system. This physical isolation of the auxiliary enclosure from, for example, the printing system enclosure can enable various processes, such as, but not limited to, various maintenance processes on the printhead assembly, to be performed with little or no interruption to the printing process, thereby minimizing or eliminating downtime of the gas enclosure system.

As depicted in fig. 10A, gas enclosure assembly 1000 can include a front base panel assembly 1220', a middle base panel assembly 1320', and a rear base panel assembly 1420', which when fully constructed form a continuous base or tray on which OLED printing system 2000 can be mounted. In a similar manner as described for gas enclosure assembly 100 of fig. 1A, the various frame members and panels comprising front panel assembly 1200', middle panel assembly 1300', and rear panel assembly 1400' of gas enclosure assembly 1000 can be coupled around OLED printing system 2000 to form a printing system enclosure. Thus, a fully constructed gas enclosure assembly, such as gas enclosure assembly 1000, when integrated with various environmental control systems, can form various embodiments of a gas enclosure system, including various embodiments of OLED printing system 2000. In accordance with various embodiments of the gas enclosure system of the present teachings as previously described, the environmental control of the interior volume defined by the gas enclosure assembly can include: controlling the lighting device, for example, by the number and placement layout of the lamps of a particular wavelength; controlling particulate matter using various embodiments of a particulate control system; various embodiments of a gas purification system are used to control reactive gas species; and temperature control of the gas enclosure assembly using various embodiments of the thermal control system.

An OLED inkjet printing system, such as OLED printing system 2000 of fig. 10A, shown in an expanded view in fig. 10B, can include several devices and apparatuses that allow reliable placement of ink droplets onto specific locations on a substrate. These devices and apparatuses can include, but are not limited to, a printhead assembly, an ink delivery system, a motion system for providing relative motion between the printhead assembly and a substrate, a substrate support apparatus, a substrate loading and unloading system, and a printhead management system.

The printhead assembly can include at least one inkjet head, wherein at least one orifice can eject droplets of ink at a controlled rate, speed, and size. The inkjet head is fed by an ink supply system that provides ink to the inkjet head. As shown in the expanded view of fig. 10B, OLED inkjet printing system 2000 can have a substrate, such as substrate 2050, which can be supported by a substrate support device, such as a chuck, such as, but not limited to, a vacuum chuck, a substrate float chuck having a pressure port, and a substrate float chuck having a vacuum and a pressure port. In various embodiments of the systems and methods of the present teachings, the substrate support apparatus can be a substrate floatation table. As will be discussed in greater detail later herein, the substrate floatation table 2200 of fig. 10B can be used to support a substrate 2050 and, in conjunction with a Y-axis motion system, can be part of a substrate transport system that provides frictionless transport of the substrate 2050. The Y-axis motion system of the present teachings can include a first Y-axis track 2351 and a second Y-axis track 2352, which can include a clamping system (not shown) for holding a substrate. The Y-axis motion can be provided by a linear air bearing or a linear mechanical system. Substrate floatation table 2200 of OLED inkjet printing system 2000 shown in fig. 10A and 10B can define the travel of substrate 2050 through gas enclosure assembly 1000 of fig. 9 during a printing process.

Printing requires relative motion between the printhead assembly and the substrate. This is achieved using a motion system, typically a gantry (gantry) or split axis (split axis) XYZ system. The printhead assembly can be moved over a stationary substrate (gantry), or in the case of a split-axis configuration, both the printhead and the substrate can be moved. In another embodiment, the printhead assembly can be substantially stationary; for example, fixed along X and Y axes, and the substrate is capable of movement relative to the printhead along the X and Y axes, while Z axis motion is provided by a substrate support apparatus or by a Z axis motion system associated with the printhead assembly. As the printhead moves relative to the substrate, droplets of ink are ejected at the correct time to be deposited at the desired location on the substrate. The substrate can be inserted into and removed from the printer using a substrate loading and unloading system. Depending on the configuration of the printer, this can be achieved with a mechanical conveyor, a substrate floatation table with a transport assembly, or a substrate transfer robot with an end effector. The print head management system can include several subsystems that allow: measurement tasks such as checking nozzle firing, and measuring drop volume, velocity, and trajectory from each nozzle in the printhead; and maintenance tasks such as wiping or suctioning off excess ink from the inkjet nozzle surfaces, priming and purging the printhead by ejecting ink from the ink supply through the printhead and into a waste pan, and replacing the printhead. In view of the variety of components that can include an OLED printing system, various embodiments of the OLED printing system can have a variety of footprints and form factors.

With respect to fig. 10B, printing system base 2100 can include a first riser (riser) (not visible) and a second riser 2122 on which beams 2130 are mounted. For the various embodiments of the OLED printing system 2000, the beam 2130 can support a first X-axis carriage assembly 2301 and a second X-axis carriage assembly 2302, which first X-axis carriage assembly 2301 and second X-axis carriage assembly 2302 can control the movement of the first print head assembly 2501 and second print head assembly 2502, respectively, across the beam 2130. For the various embodiments of the printing system 2000, the first X-axis carriage assembly 2301 and the second X-axis carriage assembly 2302 can utilize a linear air bearing motion system that is inherently low particle generation. According to various embodiments of a printing system of the present teachings, an X-axis carriage can have a Z-axis moving plate mounted thereon. In fig. 10B, the first X-axis carriage assembly 2301 is depicted with a first Z-axis moving plate 2310, while the second X-axis carriage assembly 2302 is depicted with a second Z-axis moving plate 2312. Although fig. 10B depicts two carriage assemblies and two printhead assemblies, there can be a single carriage assembly and a single printhead assembly for various embodiments of OLED inkjet printing system 2000. For example, either of the first printhead assembly 2501 and the second printhead assembly 2502 can be mounted X, Z on a shaft carriage assembly, while a camera system for inspecting features of the substrate 2050 can be mounted on the second X, Z shaft carriage assembly. Various embodiments of the OLED inkjet printing system 2000 can have a single printhead assembly, for example, either of the first printhead assembly 2501 and the second printhead assembly 2502 can be mounted on X, Z spindle carriage assemblies, while uv lamps used to cure encapsulating layers printed on the substrate 2050 can be mounted on the second X, Z spindle carriage assembly. For various embodiments of OLED inkjet printing system 2000, there can be a single printhead assembly, for example, either of first printhead assembly 2501 and second printhead assembly 2502 can be mounted on X, Z spindle carriage assemblies, while a heat source for curing an encapsulation layer printed on substrate 2050 can be mounted on a second carriage assembly.

In fig. 10B, a first X, Z shaft carriage assembly 2301 can be used to position a first printhead assembly 2501, which can be mounted on a first Z-axis moving plate 2310 above a base plate 2050, the base plate 2050 being shown supported on a base plate floatation table 2200. The second X, Z axle carriage assembly 2302 with the second Z-axis moving plate 2312 can be similarly configured to control the X-Z axis movement of the second printhead assembly 2502 relative to the base plate 2050. Each printhead assembly, such as first printhead assembly 2501 and second printhead assembly 2502 of fig. 10B, can have multiple printheads mounted in at least one printhead device, as depicted for first printhead assembly 2501 in the partial view depicting multiple printheads 2505. The print head arrangement can include, for example, but not limited to, fluidic and electronic connections to at least one print head; each printhead has a plurality of nozzles or orifices capable of ejecting ink at a controlled rate, speed and size. For various embodiments of printing system 2000, the print head assembly can include between about 1 to about 60 print head devices, wherein each print head device can have between about 1 to about 30 print heads per print head device. For example, a print head of an industrial inkjet head can have between about 16 to about 2048 nozzles that can discharge a drop volume of between about 0.1pL to about 200 pL.

According to various embodiments of the gas enclosure system of the present teachings, the first and second

printhead management systems

2701 and 2702 can be housed in an auxiliary enclosure that can be isolated from the printing system enclosure during the printing process to perform various measurement and maintenance tasks with little or no interruption to the printing process, taking into account the absolute number of printhead devices and printheads. As can be seen in fig. 10B, the first printhead assembly 2501 can be seen positioned relative to the first printhead management system 2701 in order to conveniently perform various measurement and maintenance procedures that can be performed by the first printhead

management system devices

2707, 2709, and 2711.

Devices

2707, 2709, and 2011 can be any of a variety of subsystems or modules for performing various printhead management functions. For example,

devices

2707, 2709, and 2011 can be any of a drop measurement module, a print head replacement module, a purge basin module, and an ink absorption module.

Fig. 10C depicts an expanded view of a first printhead management system 2701 housed within a first printhead management system auxiliary panel assembly 1330' in accordance with various embodiments of gas enclosure assemblies and systems of the present teachings. As depicted in fig. 10C, the auxiliary panel assembly 1330' is shown in cross-section to more clearly see the details of the first printhead management system 2701. In accordance with various embodiments of print head management systems of the present teachings, such as the first print head management system 2701 of fig. 10C, and the like, the

devices

2707, 2709, and 2011 can be a variety of subsystems or modules for performing various functions. For example,

devices

2707, 2709, and 2011 can be drop measurement modules, printhead purge basin modules, and ink absorption modules. As depicted in fig. 10C, printhead replacement module 2713 can provide a location for docking at least one printhead device 2505. In various embodiments of the first print head management system 2701, the first print head management system auxiliary panel assembly 1330' can be enabled to maintain the same environmental specifications that the gas enclosure assembly 1000 (see fig. 19) maintains. The first printhead management system auxiliary panel assembly 1330' can have a handle (handler) 2530 positioned for performing tasks associated with various printhead management programs. For example, each subsystem can have various parts that are consumable in nature and require replacement, such as replacement of blotters, ink, and waste reservoirs. The various consumable parts can be packaged for convenient insertion in a fully automated mode, for example using a handle. As a non-limiting example, the blotter paper can be packaged in a cartridge (cartridge) style that can be easily inserted into the blotting module for use. As another non-limiting example, ink can be packaged in replaceable reservoirs, and in the style of ink cartridges used in printing systems. The various embodiments of the waste reservoir can be packaged in a cartridge format that can be easily inserted into the wash basin module for use. In addition, portions of various components of the printing system subject to constant use may need to be replaced periodically. During the printing process, emergency management (emergency management) of the print head assembly may be required, such as, but not limited to, swapping print head devices or print heads. The print head replacement module can have multiple parts, such as a print head device or print head, that can be easily inserted into the print head assembly for use. A drop measurement module for checking nozzle firing and measurements based on optical detection of drop volume, velocity and trajectory from each nozzle can have sources and detectors that may need to be replaced periodically after use. Various consumables and high-use portions can be packaged for convenient insertion in a fully automated mode, for example, using a handle. The handle 2530 can have an end effector 2536 mounted to an arm 2534. Various embodiments of end effector configurations can be used, for example, knife end effectors, clamp end effectors, and gripper end effectors. Various embodiments of the end effector can include mechanical gripping and clamping, as well as pneumatic or vacuum assisted components to actuate portions of the end effector or otherwise hold the print head device or print heads from the print head device.

Regarding replacement of a print head device or print head, the print head replacement module 2713 of the print head management system 2701 of fig. 10C can include: a docking station for a print head arrangement having at least one print head; and a reservoir for the print head. Since each print head assembly (see fig. 10B) can include between about 1 to about 60 print head devices, and since each print head device can have between about 1 to about 30 print heads, various embodiments of the printing system of the present teachings can have between about 1 to about 1800 print heads. In various embodiments of printhead replacement module 2713, each printhead mounted to the printhead device can be maintained in an operable state when the printhead device is docked, without use in the printing system. For example, each printhead on each printhead device can be connected to an ink supply and electrical connection when placed in a docking station. Electrical power can be supplied to each print head on each print head arrangement so that a periodic firing pulse can be applied to each nozzle of each print head when docked in order to ensure that the nozzles remain primed and do not clog. Handle 2530 of fig. 10C can be positioned proximate to printhead assembly 2500. Printhead assembly 2500 can interface over a first printhead management system auxiliary panel assembly 1330', as depicted in fig. 10C. During a procedure for exchanging print heads, handle 2530 can remove a target portion, i.e., a print head or a print head device having at least one print head, from print head assembly 2500. Handle 2530 can retrieve replacement parts, such as a print head device or print head, from print head replacement module 2713 and complete the replacement process. The removed portion can be placed in print head replacement module 2713 for retrieval.

With respect to various embodiments of a gas enclosure assembly having an auxiliary enclosure that is capable of enclosing and sealably isolating a first working volume, such as a printing system enclosure, reference is again made to fig. 10A. As depicted in fig. 10B, there can be four isolators on the OLED printing system 2000, namely a first isolator set 2110 (second not shown, on the opposite side) and a second isolator set 2112 (second not shown, on the opposite side) that support the substrate floatation table 2200 of the OLED printing system 2000. For the gas enclosure assembly 1000 of fig. 10A, the first and

second isolator groups

2110, 2112 can be installed in each of the respective isolator wall panels, such as the first and second isolator wall panels 1325', 1327' of the middle base panel assembly 1320 '. For the gas enclosure assembly 1000 of fig. 10A, the middle base assembly 1320' can include: a first printhead management system auxiliary panel assembly 1330'; and a second printhead management system auxiliary panel assembly 1370'. Fig. 10A of the gas enclosure assembly 1000 depicts a first printhead management system auxiliary panel assembly 1330', which can include a first rear wall panel assembly 1338'. Similarly, a second print head management system auxiliary panel assembly 1370 'is also depicted, which can include a second rear wall panel assembly 1378'. The first rear wall panel assembly 1338' of the first print head management system auxiliary panel assembly 1330' can be constructed in a similar manner as shown for the second rear wall panel assembly 1378 '. The second rear wall panel assembly 1378 'of the second printhead management system auxiliary panel assembly 1370' can be constructed from a second rear wall frame assembly 1378, the second rear wall frame assembly 1378 having a second seal support panel 1375 sealably mounted to the second rear wall frame assembly 1378. The second seal support panel 1375 can have a second passageway 1365 proximate a second end (not shown) of the base 2100. Second seal 1367 can be mounted on second seal support panel 1375 around second passage 1365. A first seal can be similarly positioned and installed around the first pathway for the first printhead management system auxiliary panel assembly 1330'. Each passage in auxiliary panel assembly 1330 'and auxiliary panel assembly 1370' can accommodate passage therethrough of each maintenance system platform, e.g., first maintenance system platform 2703 and second maintenance system platform 2704 of fig. 10B. As will be discussed in more detail later herein, in order to sealably isolate auxiliary panel assembly 1330 'from auxiliary panel assembly 1370', a passageway, such as second passageway 1365 of fig. 10A, must be sealable. It is contemplated that various seals, such as inflatable seals, bellows seals, and lip seals, can be used to seal a passageway, such as the second passageway 1365 of fig. 10A, around a maintenance platform secured to the printing system base.

The first and second printhead management system auxiliary panel assemblies 1330', 1370' can include first and second

printhead assembly openings

1342, 1382, respectively, of the first and second floor panel assemblies 1341', 1381', respectively. A first floor panel assembly 1341' is depicted in fig. 10A as part of the first middle closure panel assembly 1340' of the middle panel assembly 1300 '. The first floor panel assembly 1341' is the same panel assembly as both the first mid-enclosure panel assembly 1340' and the first printhead management system auxiliary panel assembly 1330 '. Second floor panel assembly 1381' is depicted in fig. 10A as part of second mid-enclosure panel assembly 1380' of mid-panel assembly 1300 '. Second floor panel assembly 1381' is a panel assembly identical to both second mid-enclosure panel assembly 1380' and second printhead management system auxiliary panel assembly 1370 '.

As previously discussed herein, the first printhead assembly 2501 can be housed in a first printhead assembly enclosure 2503 and the second printhead assembly 2502 can be housed in a second printhead assembly enclosure 2504. In accordance with the systems and methods of the present teachings, the first and second

printhead assembly enclosures

2503, 2504 can have openings at the bottom that can have edges (not shown) so that various printhead assemblies can be positioned for printing during the printing process. Further, the first and second

printhead assembly enclosures

2503, 2504 forming part of the housing can be configured as previously described for the various panel assemblies, such that the frame assembly members and panels can provide a hermetically sealed enclosure.

Compressible pads such as those previously described for hermetic sealing of various frame members can be secured around each of the first printhead assembly opening 1342 and the second printhead assembly opening 1382, or alternatively around the edges of the first printhead assembly enclosure 2503 and the second printhead assembly enclosure 2504.

As depicted in fig. 10A, first printhead assembly docking pad 1345 and second printhead assembly docking pad 1385 can be secured about first printhead assembly opening 1342 and second printhead assembly opening 1382, respectively. During various printhead measurement and maintenance procedures, the first and

second printhead assemblies

2501 and 2502 can be positioned over the first and second

printhead assembly openings

1342 and 1382, respectively, of the first and second floor panel assemblies 1341 'and 1381', respectively, by the first and second X, Z and X, Z

axle carriage assemblies

2301 and 2302, respectively. In this regard, for various printhead measurement and maintenance procedures, the first and

second printhead assemblies

2501, 2502 can be positioned over the first and second

printhead assembly openings

1342, 1382 of the first and second floor panel assemblies 1341', 1381', respectively, without covering or sealing the first and second

printhead assembly openings

1342, 1382. First X, Z and second X, Z

axle carriage assemblies

2301 and 2302 are capable of interfacing with first print head assembly enclosure 2503 and second print head assembly enclosure 2504 using first and second print head management system auxiliary panel assemblies 1330 'and 1370', respectively. Such docking may effectively close first printhead assembly opening 1342 and second printhead assembly opening 1382 without sealing first printhead assembly opening 1342 and second printhead assembly opening 1382 during various printhead measurement and maintenance procedures. For various print head measurement and maintenance procedures, the interfacing can include forming a gasket seal between the print head assembly enclosure and each of the print head management system panel assemblies. In combination with sealably closable passageways, such as the second passageway 1365 and complementary first passageway of fig. 10A, when the first and second

printhead assembly enclosures

2503, 2504 interface with the first and second printhead management system auxiliary panel assemblies 1330', 1370' to sealably close the first and second

printhead assembly openings

1342, 1382, the resulting combination is hermetically sealed.

Further, in accordance with the present teachings, the auxiliary enclosure can be isolated from another internal enclosed volume, such as a printing system enclosure, and the exterior of the gas enclosure assembly by using structural closures to sealably close off passages, such as first printhead assembly opening 1342 and second printhead assembly opening 1382 of fig. 10A. In accordance with the present teachings, the structural closure can include a variety of sealable covers for openings or passageways, including non-limiting examples of closure panel openings or passageways. According to the systems and methods of the present teachings, the door can be any structural closure that can be used to reversibly cover or reversibly, sealably close any opening or passageway using pneumatic, hydraulic, electrical or manual actuation. As such, the first printhead assembly opening 1342 and the second printhead assembly opening 1382 of fig. 10A can be reversibly covered or reversibly, sealably closed using a door.

In the expanded view of the OLED printing system 2000 of fig. 10B, various embodiments of the printing system can include a substrate flotation stage 2200 supported by a substrate flotation stage base 2220. The substrate flotation table base 2220 can be mounted on the printing system base 2100. Substrate flotation station 2200 of the OLED printing system can support substrate 2050 and define a stroke during printing of the OLED substrate in which substrate 2050 can move through gas enclosure assembly 1000. The Y-axis motion system of the present teachings can include a first Y-axis track 2351 and a second Y-axis track 2352, which can include a clamping system (not shown) for holding a substrate. The Y-axis motion can be provided by a linear air bearing or a linear mechanical system. In this regard, in conjunction with the motion system of the Y-axis motion system as depicted in fig. 10B, the substrate flotation station 2200 can provide frictionless transport of the substrate 2050 through the printing system.

Figure 11 depicts a flotation stage for frictionless support of a load, such as the substrate 2050 of figure 10B, in conjunction with a transport system for stable transport of the load, according to various embodiments of the present teachings. Various embodiments of a flotation stage can be used in any of the various embodiments of the gas enclosure system of the present teachings. As previously discussed herein, various embodiments of the gas enclosure systems of the present teachings are capable of processing a range of sizes from less than Gen 3.5 substrates having dimensions of about 61cm x 72cm, as well as a range of larger generation size OLED flat panel display substrates. It is contemplated that various embodiments of the gas enclosure system can process substrates of Gen 5.5 size having dimensions of about 130cm X150 cm and substrates of Gen 7.5 having dimensions of about 195cm X225 cm, and can be cut into eight 42 "or six 47" flat panels of substrates each and larger. The substrates of Gen8.5 are about 220cm x 250cm and can be cut into six 55 "or eight 46" flat panels per substrate. However, substrate sub-generation sizes are continually advancing, such that currently available Gen10 substrates having dimensions of about 285cm x 305cm do not appear to be the final generation substrate size. Furthermore, the dimensions recited by the term resulting from the use of a glass-based substrate can also be applied to substrates of any material suitable for use in OLED printing. For various embodiments of OLED inkjet printing systems, a variety of substrate materials can be used for substrate 2050, such as, but not limited to, a variety of glass substrate materials, as well as a variety of polymer substrate materials. Accordingly, in various embodiments of the gas enclosure system of the present teachings, there are a variety of substrate sizes and materials that require stable transport during printing.

As depicted in fig. 11, a substrate flotation stage 2200 in accordance with various embodiments of the present teachings can have a flotation stage base 2220 for supporting multiple flotation stage zones. The substrate flotation stage 2200 can have a region 2210 where both pressure and vacuum can be applied through a plurality of ports. Such a region with both pressure and vacuum control can effectively provide a fluidic spring between the region 2210 and a substrate (not shown). The region 2210 with both pressure and vacuum control is a fluid spring with bi-directional stiffness. The gap that exists between the load and the surface of the table is called the fly height. An area, such as the area 2210 of the substrate flotation table 2200 of fig. 11, that uses multiple pressure and vacuum ports to create a fluid spring with bi-directional stiffness can provide a controllable levitation height for a load, such as a substrate.

Proximate to the area 2210 are first and

second transition areas

2211 and 2212, respectively, and subsequently proximate to the first and

second transition areas

2211 and 2212, respectively, are pressure-only

areas

2213 and 2214. In the transition region, the ratio of pressure nozzles to vacuum nozzles gradually increases toward the pressure-only region to provide a gradual transition from region 2210 to

regions

2213 and 2214. For various embodiments of a substrate floatation table, for example, as depicted in fig. 11, only

pressure areas

2213, 2214 are depicted as including a track structure. For various embodiments of a substrate floatation table, only pressure regions, such as pressure-only

regions

2213, 2214 of fig. 11, can comprise a continuous sheet, such as the continuous sheet depicted for pressure-vacuum region 2210 of fig. 11.

For various embodiments of a flotation stage as depicted in fig. 11, there can be a substantially uniform height between the pressure-vacuum region, the transition region, and the pressure-only region, such that, within tolerance, the three regions lie substantially in one plane and can vary in length. For example, but not limiting of, to provide a sense of scale and proportion, for various embodiments of the flotation stage of the present teachings, the transition zone can be about 400mm, while the pressure-only zone can be about 2.5m, and the pressure-vacuum zone can be about 800 mm. In fig. 11, only

pressure areas

2213 and 2214 do not provide a fluid spring with bi-directional stiffness, and therefore, do not provide the control that area 2210 can provide. Thus, the levitation height of the load can be generally larger above the pressure-only zone than the levitation height of the substrate above the pressure-vacuum zone, in order to allow sufficient height so that the load will not collide with the flotation table in the pressure-only zone. For example, without limitation, it may be desirable for an OLED panel substrate to have a fly height of between about 150 μ to about 300 μ over only pressure regions, such as

regions

2213 and 2214, and then between about 30 μ to about 50 μ over pressure-vacuum regions, such as region 2210.

In addition to the gas circulation and filtration system for maintaining a controlled gas enclosure environment, various embodiments of the gas enclosure system of the present teachings can utilize a variety of devices, apparatuses, and systems. For example, in addition to a gas circulation and filtration system for providing a thorough and complete inversion of gas in the interior of the gas enclosure, a thermal conditioning system utilizing multiple heat exchangers can be provided to maintain a desired temperature in the interior of the gas enclosure. For example, a plurality of heat exchangers can be provided, operating with, adjacent to, or used in conjunction with a fan or another gas circulation device. The gas purification circuit can be configured to circulate gas from within the interior of the gas enclosure assembly through at least one gas purification component external to the enclosure. In this regard, the circulation and filtration system inside the gas enclosure assembly in combination with the gas purification loop outside the gas enclosure assembly can provide continuous circulation of substantially low-particle inert gas having substantially low levels of reactive species throughout the gas enclosure system. The inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions in accordance with the present teachings. Some common non-limiting examples of inert gases can include nitrogen, any of the noble gases, and any combination thereof. Various embodiments of a gas enclosure system with a gas purification system can be configured to maintain very low levels of undesirable components, such as organic solvents and their vapors as well as water, water vapor, oxygen, and the like. Such embodiments of the gas enclosure system can maintain the level of each of the various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, as well as organic solvent vapors, at 100ppm or less, for example, 10ppm or less, 1.0ppm or less, or 0.1ppm or less.

Fig. 12 is a schematic diagram showing a gas enclosure system 501. Various embodiments of gas enclosure system 501 according to the present teachings can include a gas enclosure assembly 1101 for housing a printing system, a gas purification loop 3130 in fluid communication with gas enclosure assembly 1101, and at least one thermal regulation system 3140. Furthermore, various embodiments of the gas enclosure system 501 can have a pressurized inert gas recirculation system 3000 that can supply inert gas for operating various devices, such as substrate floatation tables for OLED printing systems and the like. Various embodiments of the pressurized inert gas recirculation system 3000 can utilize compressors, blowers, and a combination of both as a source for various embodiments of the pressurized inert gas recirculation system 3000, as will be discussed in greater detail subsequently herein. Further, the gas enclosure system 501 can have a circulation and filtration system (not shown) inside the gas enclosure system 501.

As depicted in fig. 12, for various embodiments of gas enclosure assemblies according to the present teachings, the design of the piping system enables the inert gas circulating through gas purification loop 3130 to be separated from the continuous filtration and inert gas circulating internally for various embodiments of the gas enclosure assembly. Gas purification loop 3130 includes an outlet line 3131 from gas enclosure assembly 1101 to solvent removal component 3132 and then to gas purification system 3134. Inert gas purged with solvents such as oxygen and water vapor and other reactive gas species is then returned to gas enclosure assembly 1101 through inlet line 3133. Gas purification loop 3130 may also include appropriate tubing and connections and sensors, such as oxygen, water vapor and solvent vapor sensors. A gas circulation unit, such as a fan, blower or motor, can be provided separately or integrated, for example, in gas purification system 3134, to circulate gas through gas purification loop 3130. According to various embodiments of the gas enclosure assembly, although solvent removal system 3132 and gas purification system 3134 are shown as separate units in the schematic shown in fig. 12, solvent removal system 3132 and gas purification system 3134 can be housed together as a single purification unit.

Gas purification loop 3130 of fig. 12 can have solvent removal system 3132 placed upstream of gas purification system 3134, such that inert gas circulating from gas enclosure assembly 1101 passes through solvent removal system 3132 via outlet line 3131. According to various embodiments, solvent removal system 3132 may be a solvent capture system based on adsorbing solvent vapors from an inert gas passing through solvent removal system 3132 of fig. 12. For example, but not limited to, one or more beds of adsorbents such as activated carbon, molecular sieves, etc., can effectively remove a variety of organic solvent vapors. For various embodiments of a gas enclosure system, cold trap technology may be used in solvent removal system 3132 to remove solvent vapors. As previously discussed herein, for various embodiments of a gas enclosure system according to the present teachings, sensors such as oxygen, water vapor, and solvent vapor sensors may be used to monitor the effective removal of such species from an inert gas continuously circulated through the gas enclosure system, such as gas enclosure system 501 of fig. 12. Various embodiments of the solvent removal system can indicate when a sorbent, such as activated carbon, molecular sieve, or the like, has reached saturation, enabling regeneration or replacement of one or more beds of the sorbent. Regeneration of the molecular sieve can involve heating the molecular sieve, contacting the molecular sieve with a forming gas (forming gas), combinations thereof, and the like. Molecular sieves configured to trap various species including oxygen, water vapor, and solvents can be regenerated by heating and exposing to a forming gas including hydrogen, for example, a forming gas including about 96% nitrogen and 4% hydrogen, where the percentages are volume or weight percentages. Physical regeneration of activated carbon can be accomplished using a similar procedure of heating under an inert environment.

Any suitable gas purification system can be used for gas purification system 3134 of gas purification loop 3130 of fig. 12. Gas purification systems such as those available from MBRAUN inc, Statham, new hampshire, or innovative technology of Amesbury, massachusetts, may be useful for integration into various embodiments of a gas enclosure assembly in accordance with the present teachings. The gas purging system 3134 can be used to purge one or more inert gases in the gas enclosure system 501, for example, to purge the entire atmosphere within the gas enclosure assembly. As previously discussed herein, to circulate gas through gas purification loop 3130, gas purification system 3134 can have a gas circulation unit, such as a fan, blower, or motor, etc. In this regard, the gas purification system can be selected according to a volume of the enclosure, which can define a volumetric flow rate for moving the inert gas through the gas purification system. For a volume of up to about 4m³Various embodiments of the gas enclosure system of the gas enclosure assembly of (1), can use a gas enclosure system capable of moving about 84m³Gas purification system of/h. For a volume of up to about 10m³Various embodiments of the gas enclosure system of the gas enclosure assembly of (1), can use a gas enclosure capable of moving about 155m³Gas purification system of/h. For a wave having a wave length of about 52-114m³In between, various embodiments of the gas enclosure assembly of the volume, more than one gas purification system may be used.

Any suitable gas filtration or purification device can be included in gas purification system 3134 of the present teachings. In some embodiments, the gas purification system can include two parallel purification devices, such that one of the devices can be taken offline for maintenance and the other device can be used to continue system operation without interruption. In some embodiments, for example, the gas purification system can include one or more molecular sieves. In some embodiments, the gas purification system can include at least a first molecular sieve and a second molecular sieve, such that when one of the molecular sieves becomes impurity saturated or otherwise deemed to be not operating sufficiently efficiently, the system can switch to the other molecular sieve while regenerating the saturated or non-efficient molecular sieve. The control unit can be configured to determine the operating efficiency of each molecular sieve, to switch between operation of different molecular sieves, to regenerate one or more molecular sieves, or to a combination thereof. As previously discussed herein, the molecular sieve may be regenerated and reused.

The thermal conditioning system 3140 of fig. 12 can include at least one cooler 3142, which can have a fluid outlet line 3141 for circulating coolant into the gas enclosure assembly and a fluid inlet line 3143 for returning coolant to the cooler. At least one fluid cooler 3142 can be provided for cooling the atmosphere within the gas enclosure system 501. For the various embodiments of the gas enclosure system of the present teachings, the fluid cooler 3142 delivers the cooled fluid to a heat exchanger within the enclosure where the inert gas is passed through a filtration system inside the enclosure. At least one fluid cooler can also be provided with gas enclosure system 501 to cool heat released from equipment enclosed within gas enclosure system 501. For example, but not limiting of, at least one fluid cooler can also be provided for gas enclosure system 501 to cool heat released from the OLED printing system. The thermal regulation system 3140 can include a thermal exchange or Peltier (Peltier) device and can have various cooling capabilities. For example, for various embodiments of the gas enclosure system, the cooler can provide a cooling capacity of from about 2kW to about 20 kW. Various embodiments of the gas enclosure system can have multiple fluid coolers capable of cooling one or more fluids. In some embodiments, the fluid cooler can utilize several fluids as coolants, such as, but not limited to, water as a heat exchange fluid, antifreeze, refrigerant, and combinations thereof. Suitable leak-free, locking connections can be used in connecting associated piping and system components.

As previously discussed herein, the present teachings disclose various embodiments of a gas enclosure system that can include a printing system enclosure defining a first volume and an auxiliary enclosure defining a second volume. Various embodiments of the gas enclosure system can have an auxiliary enclosure that can be sealably configured as a section of the gas enclosure assembly. According to the systems and methods of the present teachings, the auxiliary enclosure can be sealably isolated from the printing system enclosure and can be open to an environment external to the gas enclosure assembly without exposing the printing system enclosure to the external environment. This physical isolation of the secondary enclosure, which performs, for example and without limitation, various print head management procedures, can be accomplished to eliminate or minimize exposure of the printing system enclosure to contaminants, such as air and water vapor and various organic vapors and particulate contaminants, among others. Various printhead management procedures, which can include measurement and maintenance procedures for the printhead assembly, can be accomplished with little or no interruption to the printing process, thereby minimizing or eliminating downtime of the gas enclosure system.

For various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 1% of the enclosed volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 2% of the enclosed volume of the gas enclosure system. For various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 5% of the enclosed volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 10% of the enclosed volume of the gas enclosure system. In various embodiments of the systems and methods of the present teachings, the auxiliary enclosure can be less than or equal to about 20% of the enclosed volume of the gas enclosure system. Isolating the auxiliary enclosure from the working volume of the gas enclosure can prevent contamination of the entire volume of the gas enclosure if the auxiliary enclosure is indicated to be open to the ambient environment containing the reactive gas for performing, for example, a maintenance procedure. Furthermore, given the relatively small volume of the auxiliary enclosure compared to the printing system enclosure portion of the gas enclosure, the recovery time of the auxiliary enclosure can be significantly less than the recovery time of the entire printing system enclosure.

For a gas enclosure system having a printing system enclosure defining a first volume and an auxiliary enclosure defining a second volume, both volumes can be easily integrated with gas circulation, filtration and purging components to form a gas enclosure system that is capable of maintaining an inert, substantially low-particle environment for processes requiring such an environment with little or no interruption of the printing process. According to various systems and methods of the present teachings, a printing system enclosure can be introduced to a decontamination system that is capable of removing contamination at a sufficiently low contamination level before it can affect the printing process. The various embodiments of the auxiliary enclosure can be a much smaller volume of the total volume of the gas enclosure assembly and can be easily integrated with the gas circulation, filtration and purging components to form an auxiliary enclosure system that can quickly restore an inert, low particle environment after exposure to the external environment, thereby providing a printing process with little or no interruption.

In accordance with the systems and methods of the present teachings, various embodiments of printing system enclosures and auxiliary enclosures configured as sections of a gas enclosure assembly can be configured in a manner that provides for individually functioning frame member assembly sections. In addition to having all of the elements disclosed, as a non-limiting example, for

gas enclosure systems

500 and 501, gas enclosure system 502 of FIG. 13 can have first gas enclosure assembly segments 1101-S1 defining a first volume of gas enclosure assembly 1101 and second gas enclosure assembly segments 1101-S2 defining a second volume of gas enclosure assembly 1101. If all valves V are₁、V₂、V₃And V₄Are open, gas purification loop 3130 operates substantially as previously described for gas enclosure assembly and system 1101 of fig. 12. At V₃And V₄With closed, only the first gas enclosure assembly segments 1101-S1 are in fluid communication with gas purification circuit 3130. For example, but not limiting of, this valve state may be used when second gas enclosure assembly segments 1101-S2 are sealably closed, and thus isolated from first gas enclosure assembly segments 1101-S1, during various measurement and maintenance procedures that require second gas enclosure assembly segments 1101-S2 to be open to the atmosphere. In thatV₁And V₂With closed, only second gas enclosure assembly segments 1101-S2 are in fluid communication with gas purification circuit 3130. For example, but not limiting of, this valve state may be used during the recovery of the second gas enclosure assembly segments 1101-S2 after the segments have been opened to the atmosphere. As previously discussed herein with respect to fig. 12 for the present teachings, the need for gas purification circuit 3130 is specified with respect to the total volume of gas enclosure assembly 1101. Thus, by utilizing the resources of the gas purification system for the recovery of gas enclosure assembly segments, such as second gas enclosure assembly segments 1101-S2 or the like, which second gas enclosure assembly segments 1101-S2 are depicted as being significantly smaller in volume than the total volume of gas enclosure 1101 for gas enclosure 502 of FIG. 13, recovery times can be greatly reduced.

Furthermore, the various embodiments of the auxiliary enclosure can be easily integrated with a set of dedicated climate conditioning system components, such as lighting, gas circulation and filtration, gas purification, and thermostatic components, etc. In this regard, various embodiments of a gas enclosure system including an auxiliary enclosure that can be sealably isolated as a section of the gas enclosure assembly can have a controlled environment disposed to coincide with a first volume defined by the gas enclosure assembly housing the printing system. Further, various embodiments of a gas enclosure system including an auxiliary enclosure that can be sealably isolated as a section of the gas enclosure assembly can have a controlled environment that is disposed differently than a controlled environment of a first volume defined by the gas enclosure assembly housing the printing system.

Recall that the various embodiments of the gas enclosure assembly utilized in embodiments of the gas enclosure system of the present teachings can be configured in a manner shaped as follows, namely: the internal volume of the gas enclosure assembly is minimized and at the same time the working volume for accommodating the various footprints of the design of the OLED printing system is optimized. For example, for various embodiments of the gas enclosure assembly of the present teachings covering substrate dimensions, e.g., from Gen 3.5 to Gen10, compositions in accordance with the present teachingsVarious embodiments of the gas enclosure assembly of the shape can have a thickness of between about 6m³To about 95m³The gas enclosed volume in between. Various embodiments of a shaped gas enclosure assembly according to the present teachings can have, for example, but not limited to, between about 15m³To about 30m³Gas enclosed volume in between, which may be useful for OLED printing of substrate sizes of, for example, Gen 5.5 to Gen 8.5. Various embodiments of the auxiliary enclosure can be configured as a section of a gas enclosure assembly and can be easily integrated with gas circulation and filtration and purification components to form a gas enclosure system that can maintain an inert, substantially low-particle environment for processes requiring such an environment.

As shown in fig. 12 and 13, various embodiments of the gas enclosure system can include a pressurized inert gas recirculation system 3000. Various embodiments of the pressurized inert gas recirculation loop can utilize compressors, blowers, and combinations thereof.

For example, as shown in fig. 14 and 15, various embodiments of the gas enclosure system 503 and the gas enclosure system 504 can have an external gas loop 3200 for integrating and controlling an inert gas source 3201 and a Clean Dry Air (CDA) source 3203 used in aspects of the operation of the gas enclosure system 503 and the gas enclosure system 504. Gas enclosure system 503 and gas enclosure system 504 can also include various embodiments of internal particle filtration and gas circulation systems, as well as various embodiments of external gas purification systems, as previously described. These embodiments of the gas enclosure system can include a gas purification system for purifying various reactive species from an inert gas. Some common non-limiting examples of inert gases can include nitrogen, any noble gas, and any combination thereof. Various embodiments of gas purification systems according to the present teachings are capable of maintaining the level of each of various reactive species, including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapor, at 100ppm or less, for example, 10ppm or less, 1.0ppm or less, or 0.1ppm or less. In addition to the external loop 3200 for integrating (or integrating) and controlling the inert gas source 3201 and the CDA source 3203, the gas enclosure system 503 and the gas enclosure system 504 can have a compressor loop 3250, the compressor loop 3250 can supply an inert gas for operating various devices and equipment that can be disposed in the interior of the gas enclosure system 503 and the gas enclosure system 504.

Compressor loop 3250 of fig. 14 can include a compressor 3262, a first accumulator 3264, and a second accumulator 3268 configured to be in fluid communication. Compressor 3262 can be configured to compress the inert gas exiting from gas enclosure assembly 1101 to a desired pressure. The inlet side of compressor loop 3250 can be in fluid communication with gas enclosure assembly 1101 via gas enclosure assembly outlet 3252 through conduit 3254, said conduit 3254 having a valve 3256 and a check valve 3258. Compressor loop 3250 can be in fluid communication with gas enclosure assembly 1101 on the outlet side of compressor loop 3250 via external gas loop 3200. Accumulator 3264 can be disposed between compressor 3262 and the junction of compressor loop 3250 and external gas loop 3200, and can be configured to generate a pressure of 5psig or greater. A second accumulator 3268 can be in the compressor loop 3250 for damping fluctuations due to compressor piston cycles of about 60 Hz. For various embodiments of compressor loop 3250, first accumulator 3264 can have a capacity of between about 80 gallons and about 160 gallons, while second accumulator can have a capacity of between about 30 gallons and about 60 gallons. According to various embodiments of the gas enclosure system 503, the compressor 3262 can be a zero entry compressor (zero entry compressor). Various types of zero-entry compressors can operate without leaking atmospheric gas into the various embodiments of the gas enclosure system of the present teachings. For example, various embodiments of the zero entry compressor can be run continuously during an OLED printing process using various devices and equipment that require compressed inert gas.

Accumulator 3264 can be configured to receive and accumulate compressed inert gas from compressor 3262. Accumulator 3264 can supply compressed inert gas in gas enclosure assembly 1101 as needed. For example, the accumulator 3264 can provide gas to maintain pressure of various components of the gas enclosure assembly 1101, such as, but not limited to, one or more of a pneumatic robot, a substrate floatation table, an air bearing, an air bushing, a compressed gas tool, a pneumatic actuator, and combinations thereof. As shown in fig. 14 for gas enclosure system 503, gas enclosure assembly 1101 can have OLED printing system 2000 enclosed therein. As schematically depicted in fig. 14, the inkjet printing system 2000 can be supported by a printing system base 2100, which printing system base 2100 can be a granite table. The printing system base 2100 is capable of supporting a substrate support device such as, for example, a chuck, such as, but not limited to, a vacuum chuck, a substrate float chuck having a pressure port, and a substrate float chuck having a vacuum and a pressure port. In various embodiments of the present teachings, the substrate support apparatus can be a substrate floatation table, such as substrate floatation table 2200 shown in fig. 14, or the like. The substrate flotation stage 2200 can be used for frictionless support of the substrate. In addition to low particle generation flotation stations, the printing system 2000 can have a Y-axis motion system with air bushings for frictionless Y-axis transport of substrates. In addition, the printing system 2000 can also have at least one X, Z shaft carriage assembly with motion control provided by a low particle generation X-axis air bearing assembly. Various components of low particle generating motion systems, such as X-axis air bearing assemblies and the like, can be used in place of, for example, various particle generating linear mechanical bearing systems. For various embodiments of the gas enclosure and system of the present teachings, the use of a variety of pneumatically operated devices and apparatus can provide low particle generation performance, as well as low maintenance costs. Compressor loop 3250 can be configured to continuously supply pressurized inert gas to various devices and equipment of gas enclosure system 503. In addition to the supply of pressurized inert gas, substrate floatation table 2200 of inkjet printing system 2000 utilizing air bearing technology also utilizes vacuum system 3270, which vacuum system 3270 communicates with gas enclosure assembly 1101 through conduit 3272 when valve 3274 is in an open position.

A pressurized inert gas recirculation system according to the present teachings can have a pressure controlled bypass loop 3260, as shown in fig. 14 for compressor loop 3250, said bypass loop 3260 for compensating for variable demand of pressurized gas during use, thereby providing dynamic balancing for various embodiments of a gas enclosure system of the present teachings. For various embodiments of a gas enclosure system according to the present teachings, the bypass loop can maintain a constant pressure in accumulator 3264 without disrupting or changing the pressure in enclosure 1101. The bypass loop 3260 can have a first bypass inlet valve 3261 on the inlet side of the bypass loop, said first bypass inlet valve 3261 being closed unless the bypass loop 3260 is used. The bypass loop 3260 can also have a back pressure regulator 3266, which can be used 3266 when the second valve 3263 is closed. Bypass loop 3260 can have a second accumulator 3268 disposed at an outlet side of bypass loop 3260. For embodiments of compressor loop 3250 that utilize a zero-entry compressor, bypass loop 3260 can compensate for small excursions in pressure that can occur over time during use of the gas enclosure system. Bypass loop 3260 can be in fluid communication with compressor loop 3250 on an inlet side of bypass loop 3260 when bypass inlet valve 3261 is in an open position. When bypass inlet valve 3261 is open, inert gas diverted through bypass loop 3260 can be recycled to the compressor if inert gas from compressor loop 3250 is not required within the interior of gas enclosure assembly 1101. Compressor loop 3250 is configured to bypass inert gas through bypass loop 3260 when the pressure of inert gas in accumulator 3264 exceeds a predetermined threshold pressure. The predetermined threshold pressure of accumulator 3264 can be from between about 25psig to about 200psig at a flow rate of at least about 1 cubic foot per minute (cfm), or from between about 50psig to about 150psig at a flow rate of at least about 1 cubic foot per minute (cfm), or from between about 75psig to about 125psig at a flow rate of at least about 1 cubic foot per minute (cfm), or between about 90psig to about 95psig at a flow rate of at least about 1 cubic foot per minute (cfm).

Various embodiments of compressor loop 3250 can utilize a variety of compressors other than a zero-entry compressor, such as a variable speed compressor or a compressor that can be controlled to be in an on or off state, among others. As previously discussed herein, the zero-entry compressor ensures that no atmospheric reactive species can be introduced into the gas enclosure system. Thus, any compressor configuration that prevents the introduction of atmospheric reactive species into the gas enclosure system can be used for compressor loop 3250. According to various embodiments, the compressor 3262 of the gas enclosure system 503 can be housed in a housing that is, for example, but not limited to, hermetically sealed. The housing interior can be configured to be in fluid communication with a source of inert gas, such as the same inert gas that forms the inert atmosphere for the gas enclosure assembly 1101. For various embodiments of compressor loop 3250, compressor 3262 can be controlled at a constant speed to maintain a constant pressure. In other embodiments of compressor loop 3250 that do not utilize a zero-entry compressor, compressor 3262 can be turned off when a maximum threshold pressure is reached and turned on when a minimum threshold pressure is reached.

In fig. 15 for gas enclosure system 504, blower loop 3280 utilizing vacuum blower 3290 for operation of substrate floatation table 2200 of inkjet printing system 2000 housed in gas enclosure assembly 1101 is shown. As previously discussed herein with respect to compressor loop 3250, blower loop 3280 can be configured to continuously supply pressurized inert gas to substrate floatation table 2200 of printing system 2000.

Various embodiments of the gas enclosure system that can utilize a pressurized inert gas recirculation system can have various circuits that utilize multiple sources of pressurized gas, such as at least one of a compressor, a blower, and combinations thereof. In fig. 15 for gas enclosure system 504, compressor loop 3250 can be in fluid communication with external gas loop 3200, which external gas loop 3200 can be used to supply inert gas to high consumption manifold 3225 as well as low consumption manifold 3215. For the various embodiments of a gas enclosure system according to the present teachings as shown in fig. 15 for gas enclosure system 504, high consumption manifold 3225 can be used to supply inert gas to various devices and equipment, such as, but not limited to, one or more of a baseplate flotation table, a pneumatic robot, an air bearing, an air bushing, and a compressed gas tool, and combinations thereof. For various embodiments of a gas enclosure system according to the present teachings, low-consumption manifold 3215 can be used to supply inert gas to various equipment and devices, such as, but not limited to, one or more of isolators and pneumatic actuators, and combinations thereof.

For the various embodiments of the gas enclosure system 504 of fig. 15, blower loop 3280 can be used to supply pressurized inert gas to the various embodiments of the substrate flotation stage 2200, while compressor loop 3250, which is in fluid communication with external gas loop 3200, can be used to supply pressurized inert gas to one or more of, for example, but not limited to, a pneumatic robot, an air bearing, an air bushing, and a compressed gas tool, and combinations thereof. In addition to the supply of pressurized inert gas, substrate floatation table 2200 of OLED inkjet printing system 2000 utilizing air bearing technology also utilizes vacuum blower 3290, which vacuum blower 3290 communicates with gas enclosure assembly 1101 through conduit 3292 when valve 3294 is in an open position. Housing 3282 of blower loop 3280 can maintain: a first blower 3284 for supplying a source of a pressurized inert gas to substrate floatation table 2200; and a second blower 3290 as a vacuum source for the substrate flotation stage 2200, the substrate flotation stage 2200 being housed in an inert gas environment in the gas enclosure assembly 1101. Properties that can make blowers suitable for use as a source of pressurized inert gas or vacuum for various embodiments of substrate floatation tables include: for example, but not limited to, they have high reliability, thereby making them low maintenance cost; with variable speed control; and with a wide range of flow volumes, various embodiments can provide approximately 100m³H to about 2,500m³Flow rate between/h. In addition, various embodiments of blower loop 3280 can also have a first isolation valve 3283 at an inlet end of blower loop 3280, and a check valve 3285 and a second isolation valve 3287 at an outlet end of blower loop 3280. Various embodiments of blower loop 3280 can have: adjustable valve 3286, which can be, for example but not limited to, a gate valve, butterflyA valve, needle valve or ball valve; and a heat exchanger 3288 for maintaining the inert gas from blower loop 3280 to substrate floatation table 2200 at a defined temperature.

Fig. 15 depicts an external gas loop 3200, also shown in fig. 14, for integrating (or integrating) and controlling an inert gas source 3201 and a Clean Dry Air (CDA) source 3203 used in aspects of the operation of the gas enclosure system 503 of fig. 14 and the gas enclosure system 504 of fig. 15. The external gas loop 3200 of fig. 14 and 15 can comprise at least four mechanical valves. These valves include a first mechanical valve 3202, a second mechanical valve 3204, a third mechanical valve 3206, and a fourth mechanical valve 3208. These various valves are located in various lines at locations that allow control of both the inert gas source and the air source, such as Clean Dry Air (CDA). The inert gas may be any gas that does not undergo a chemical reaction under a defined set of conditions in accordance with the present teachings. Some common non-limiting examples of inert gases can include any of nitrogen, noble gases, and any combination thereof. A housing inert gas line 3210 extends from the housing inert gas source 3201. Housing inert gas line 3210 continues to extend linearly as low consumption manifold line 3212, said low consumption manifold line 3212 being in fluid communication with low consumption manifold 3215. A cross-line first segment 3214 extends from a first flow junction 3216, the first flow junction 3216 being located at the intersection of the containment inert gas line 3210, the low-consumption manifold line 3212 and the cross-line first segment 3214. The cross-pipe first segment 3214 extends to a second flow junction 3218. A compressor inert gas line 3220 extends from accumulator 3264 of compressor loop 3250 and terminates at second flow junction 3218. CDA line 3222 extends from CDA source 3203 and continues as a high consumption manifold line 3224, with high consumption manifold line 3224 being in fluid communication with high consumption manifold 3225. A third flow junction 3226 is located at the intersection of cross-over conduit second section 3228, clean dry air conduit 3222, and high consumption manifold conduit 3224. Cross-line second section 3228 extends from second flow junction 3218 to third flow junction 3226. During maintenance, the various components that are highly depleted can be supplied with CDA by way of high depletion manifold 3225. The use of

valves

3204, 3208, and 3230 to isolate the compressor can prevent reactive species, such as oxygen and water vapor, from contaminating the inert gas within the compressor and accumulator.

The continuous circulation and filtering of the inert gas of the various embodiments of the gas enclosure assembly is part of a particle control system that is capable of providing an environment that maintains substantially low particles within the various embodiments of the gas enclosure system. Various embodiments of the gas circulation and filtration system can be designed to provide a low particle environment of airborne particles that meets the standards as specified in classes 1 through 5 of the International organization for standardization (ISO) 14644-1:1999 "Cleanrooms and associated controlled environments-Part 1: Classification of air solids". In addition, various components of the particulate control system are capable of discharging particulate matter into the gas circulation and filtration system in order to maintain a low particulate zone proximate to the substrate. The determination of airborne particulate matter for system verification can be performed for various embodiments of a gas enclosure system using, for example, a portable particle counting device prior to the printing process. In various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed in situ as a continuous quality check while printing the substrate. For various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed prior to printing the substrate for system verification, and additionally in situ while printing the substrate.

Various embodiments of gas circulation and filtration systems are depicted in fig. 16-18. According to various embodiments of the gas circulation and filtration system of the present teachings, the piping system can be installed in an interior portion formed by joining wall and ceiling frame members. For various embodiments of the gas enclosure assembly, the piping system may be installed during the construction process. According to various embodiments of the present teachings, the piping system may be installed within a gas enclosure frame assembly that is constructed from a plurality of frame members. In various embodiments, the piping system can be installed on a plurality of frame members prior to the plurality of frame members being coupled to form the gas enclosure frame assembly. The ductwork for the various embodiments of the gas enclosure system can be configured such that substantially all of the gas introduced into the ductwork from one or more ductwork inlets moves through the various embodiments of the gas filtration circuit in order to remove particulate matter inside the gas enclosure assembly. Furthermore, the piping system of the various embodiments of the gas enclosure system can be configured to separate the inlet and outlet of the gas purification circuit outside the gas enclosure assembly from the gas filtration circuit used to remove particulate matter inside the gas enclosure assembly. Various embodiments of ductwork according to the present teachings can be fabricated from sheet metal, such as, but not limited to, aluminum sheet having a thickness of about 80 mils.

Fig. 16 depicts a front right transparent interior perspective view of a circulation and filtration system 1500, which circulation and filtration system 1500 can include a ductwork assembly 1501 of a gas enclosure assembly 100 and a fan filter unit assembly 1502. The closure ductwork assembly 1501 can have a front wall panel ductwork assembly 1510. As shown, front wall panel duct system assembly 1510 can have a front wall panel inlet duct 1512, a first front wall panel riser (riser) 1514, and a second front wall panel riser 1516, both of which first front wall panel riser 1514 and second front wall panel riser 1516 are in fluid communication with front wall panel inlet duct 1512. The first front wall panel standpipe 1514 is shown having an outlet 1515 which is sealably engaged with the ceiling duct 1505 of the fan filter unit cover 103. In a similar manner, a second front wall panel standpipe 1516 is shown having an outlet 1517 that is sealably engaged with the ceiling duct 1507 of the fan filter unit cover 103. In this regard, front wall panel duct system assembly 1510 provides for circulating an inert gas from the bottom through each front

wall panel standpipe

1514 and 1516 within the gas enclosure system using front wall panel inlet duct 1512 and conveying air through

outlets

1505 and 1507, respectively, such that the air can be filtered through, for example, fan filter unit 1552 of fan filter unit assembly 1502. Adjacent to fan filter unit 1552 is a heat exchanger 1562 that is part of a thermal regulation system capable of maintaining the inert gas circulating through gas enclosure assembly 100 at a desired temperature.

Right wall panel piping assembly 1530 can have right wall panel inlet piping 1532 in fluid communication with right wall panel upper piping 1538 through right wall panel first riser 1534 and right wall panel second riser 1536. The right-wall panel upper tube 1538 can have a first tube inlet end 1535 and a second tube outlet end 1537, the second tube outlet end 1537 being in fluid communication with a rear-wall panel upper tube 1546 of the rear-wall tube system assembly 1540. The left wall panel piping assembly 1520 can have the same components as described for the right wall panel assembly 1530 with the left wall panel inlet pipe 1522 in fluid communication with the left wall panel upper pipe (not shown) through the first left wall panel riser 1524 and the first left wall panel riser 1524 being evident in fig. 16. Rear wall panel duct system assembly 1540 can have a rear wall panel inlet duct 1542 in fluid communication with left wall panel assembly 1520 and right wall panel assembly 1530. Additionally, rear wall panel duct system assembly 1540 can have a rear wall panel bottom duct 1544, which can have a rear wall panel first inlet 1541 and a rear wall panel second inlet 1543. Rear wall panel bottom duct 1544 can be in fluid communication with rear wall panel upper duct 1546 via a first bulkhead (bulkhead) 1547 and a second bulkhead 1549, the structure of which can be used, for example, but not limited to, providing services from the exterior of gas enclosure assembly 100 into the interior. Service bundles according to the present teachings can include, for example, but are not limited to, optical cables, electrical cables, wires, pipes, and the like. Recall that a manufacturing facility may require a substantial length of various service bundles that can be operatively connected from various systems and components to provide the optical, electrical, mechanical, and fluidic connections required to operate the printing system. Duct opening 1533 provides for removal of at least one service bundle from rear wall panel upper duct 1546, which can pass through rear wall panel upper duct 1546 via partition 1549. The

partitions

1547 and 1549 can be hermetically sealed on the outside using removable inset panels, as previously described. The rear wall panel upper duct is in fluid communication with, for example and without limitation, a fan filter unit 1554 via a vent 545, a corner of which vent 545 is shown in fig. 16. In this regard, left wall panel piping assembly 1520, right wall panel piping assembly 1530, and rear wall panel piping assembly 1540 provide for bottom circulation of inert gas within the gas enclosure assembly, utilizing wall

panel inlet conduits

1522, 1532, and 1542, respectively, and rear panel lower conduit 1544, said rear panel lower conduit 1544 being in fluid communication with vent 1545 through various risers, conduits, partition passageways, etc., as previously described. Thus, air can be filtered by, for example, fan filter unit 1554 of fan filter unit assembly 1502 of recirculation and filtration system 1500. Adjacent to fan filter unit 1554 is a heat exchanger 1564 that is part of a thermal regulation system capable of maintaining the inert gas circulating through gas enclosure assembly 100 at a desired temperature. As will be discussed in greater detail later herein, the number, size, and shape of fan filter units of a fan filter unit assembly, such as fan filter unit assembly 1502 including

fan filter units

1552 and 1554 of recirculation and filtration system 1500, can be selected based on the physical location of the substrate in the printing system during processing. The number, size, and shape of the fan filter units of the fan filter unit assembly selected relative to the physical travel of the substrate can be an element of the low particle gas enclosure system that can provide a low particle zone proximate the substrate during the substrate manufacturing process.

In fig. 16, the cable is shown being fed through opening 1533. As will be discussed in greater detail later herein, various embodiments of the gas enclosure assembly of the present teachings provide for passing a service bundle through a piping system. To eliminate the leakage path formed around such a service bundle, various methods for sealing different sizes of cables, wires and tubes in the service bundle using satisfactory materials can be used. Also shown in fig. 16 for the closure ducting assembly 1501 are conduits I and II, which are shown as part of the fan filter unit cover 103. Conduit I provides an outlet for the inert gas to the external gas purification system, while conduit II provides a return for the purified inert gas to the circulation and filtration loop inside the gas enclosure assembly 100.

In fig. 17, a top transparent interior perspective view of a closure ductwork assembly 1501 is shown. The symmetry of the left wall panel ductwork assembly 1520 and the right wall panel ductwork assembly 1530 can be seen. For right wall panel piping assembly 1530, right wall panel inlet piping 1532 is in fluid communication with right wall panel upper piping 1538 through right wall panel first riser 1534 and right wall panel second riser 1536. The right-wall panel upper tube 1538 can have a first tube inlet end 1535 and a second tube outlet end 1537, the second tube outlet end 1537 being in fluid communication with a rear-wall panel upper tube 1546 of the rear-wall tube system assembly 1540. Similarly, left wall panel piping assembly 1520 can have a left wall panel inlet pipe 1522 that is in fluid communication with a left wall panel upper pipe 1528 through a left wall panel first riser 1524 and a left wall panel second riser 1526. The left wall panel upper pipe 1528 may have a first pipe inlet end 1525 and a second pipe outlet end 1527, the second pipe outlet end 1527 being in fluid communication with a rear wall panel upper pipe 1546 of the rear wall piping system assembly 1540. Additionally, the rear wall panel piping assembly can also have a rear wall panel inlet duct 1542 in fluid communication with the left wall panel assembly 1520 and the right wall panel assembly 1530. Additionally, rear wall panel duct system assembly 1540 can also have a rear wall panel bottom duct 1544, which can have a rear wall panel first inlet 1541 and a rear wall panel second inlet 1543. Rear wall panel bottom duct 1544 is fluidly communicable with rear wall panel upper duct 1546 via first and

second partitions

1547, 1549. The ductwork assembly 1501 as shown in fig. 16 and 17 can provide inert gas: efficient circulation from front wall panel ductwork assembly 1510, which circulates inert gas from front wall panel inlet duct 1512 to

ceiling panel ducts

1505 and 1507 via front

wall panel outlets

1515 and 1517, respectively; and efficient circulation from left wall panel assembly 1520, right wall panel assembly 1530, and rear wall panel ductwork assembly 1540, which circulates air from

inlet ducts

1522, 1532, and 1542, respectively, to vent 1545. Once the inert gas is discharged into the enclosed area under the fan filter unit cover 103 of the enclosure 100 via the

ceiling panel conduits

1505 and 1507 and vent 1545, the inert gas so discharged can be filtered by the

fan filter units

1552 and 1554 of the fan filter unit assembly 1502. In addition, the circulated inert gas can also be maintained at a desired temperature by

heat exchangers

1562 and 1564, which

heat exchangers

1562 and 1564 are part of the thermal regulation system.

FIG. 18 is a bottom transparent inside view of a closure ductwork assembly 1501. Inlet ductwork assembly 1509 includes front wall panel inlet duct 1512, left wall panel inlet duct 1522, right wall panel inlet duct 1532, and rear wall panel inlet duct 1542, which are in fluid communication with one another. As previously discussed herein, conduit I provides an outlet for the inert gas to the external gas purification system, while conduit II provides a return for the purified inert gas to the circulation and filtration loop inside the gas enclosure assembly 100.

For each inlet duct included in inlet ductwork assembly 1509, there are uniformly distributed distinct openings on the bottom of each duct, and for purposes of the present teachings, particularly sets of such openings are highlighted as openings 1511 of front wall panel inlet duct 1512, openings 1521 of left wall panel inlet duct 1522, openings 1531 of right wall panel inlet duct 1532, and openings 1541 of right wall panel inlet duct 1542. This distinct opening at the bottom of each inlet duct provides for efficient absorption of the inert gas within the enclosure 100 for continuous circulation and filtration. The continuous circulation and filtering of the inert gas of the various embodiments of the gas enclosure assembly is part of a particulate control system that is capable of providing an environment that maintains substantially low particulates within the various embodiments of the gas enclosure system. Various embodiments of the gas circulation and filtration system can be designed to provide a low particulate environment for maintaining airborne particulate levels that comply with standards specified by International organization for standardization (ISO) 14644-1:1999, as defined by classes 1 through 5. Further, a service bundle, which can include cables, wires, pipes, and the like bundled together, can serve as a source of particulate matter. Thus, having a service bundle supplied through the piping system can contain an identified source of particulate within the piping system, and can discharge the particulate matter through the circulation and filtration system.

Various embodiments of the gas enclosure system can have a particle control system that can maintain a substantially low-particle environment that provides a particle specification on a substrate for particles between about 0.1 μm or more and about 10 μm or more. Various embodiments of the on-substrate particle specification can be easily converted from an average on-substrate particle distribution per minute per square meter of substrate to an average on-substrate particle distribution per minute per substrate for each of the target particle size ranges. As previously discussed herein, such conversion can be readily accomplished by a known relationship between a substrate, such as a substrate of a particular generation size, and the corresponding area of that generation of substrate. Furthermore, the average substrate-on-substrate particle distribution per minute per square meter of substrate can be easily converted into any of a variety of unit time expressions. For example, in addition to the conversion between standard time units such as seconds, minutes, and days, time units specifically related to the process can be used. For example, as previously discussed herein, a print cycle can be associated with a unit of time.

Manufacturing equipment may require a relatively long bundle of various services that can be operatively connected from various equipment and systems to provide, for example, the optical, electrical, mechanical, and fluidic connections required to operate a printing system. Service bundles according to the present teachings can include, for example, but are not limited to, optical cables, electrical cables, wires, pipes, and the like. Various embodiments of service bundles according to the present teachings can have a substantial total dead volume as a result of the large amount of void space created by bundling various cables, wires, pipes, and the like together in a service bundle. The total dead volume caused by the large amount of void space in the service beam can result in a large amount of reactive gas species remaining occluded therein. Such a fairly large source of reactive atmospheric gas can significantly increase the recovery time of the gas enclosure assembly, for example, after maintenance.

Thus, in addition to providing components of the particle control system, providing a service beam through the piping system can reduce the recovery time of the gas enclosure assembly relative to the reactive species, thereby more quickly bringing the gas enclosure assembly back within specification for performing air sensitive processes. Various embodiments of the gas enclosure systems of the present teachings useful for printing OLED devices, each of the various reactive species including various reactive atmospheric gases such as water vapor and oxygen, and organic solvent vapors, can be maintained at 100ppm or less, for example, 10ppm or less, 1.0ppm or less, or 0.1ppm or less.

To understand how a cable fed through a conduit system can result in reducing the time it takes to purge occluded reactive atmospheric gases from dead volumes created by void spaces in a service bundle created by bundling various optical cables, electrical cables, wires, and fluid conduits, etc., reference is made to fig. 19A, 19B, and 20. Fig. 19A depicts an expanded view of a service bundle I, which can be a bundle (bundle) that can include conduits, such as conduit a, which can be used, for example, to deliver various inks, solvents, etc. to a printing system, such as printing system 2000 of fig. 10A. The service bundle I of fig. 19A can additionally include electrical wires, such as electrical wires B, or cables, such as cable C, which can be coaxial cables or fiber optic cables. Such pipes, wires and cables included in the service bundle can be routed from the outside to the inside to connect to various devices and equipment including the OLED printing system. As seen in the shaded area of fig. 19A, void space in the service bundle can create a considerable dead volume D. In the schematic perspective view of fig. 19B, the inert gas III can continuously sweep the service beam I as it is fed through the duct II. The expanded cross-sectional view of fig. 20 depicts how the inert gas continuously swept through bundled tubes, wires and cables can effectively increase the removal rate of occluded reactive species from the dead volume formed in the service bundle. The diffusivity of reactive species a out of the dead volume, indicated by the total area occupied by species a in figure 20, is inversely proportional to the concentration of reactive species outside the dead volume, indicated by the total area occupied by inert gas species B in figure 20. That is, if the concentration of the reactive species is higher in the volume just outside the dead volume, the diffusivity decreases. If the concentration of reactive species in such a region is continuously reduced from a volume just outside the dead volume by the flow of inert gas and then by mass action, the rate of diffusion of reactive species from the dead volume increases. Furthermore, by the same principle, inert gas can diffuse into the dead volume as occluded reactive species are effectively removed from those spaces.

Figure 21A is a perspective view of the rear corner of various embodiments of the gas enclosure assembly 101 with a transparent interior view through the return conduit 1605 into the interior of the gas enclosure assembly 101. For various embodiments of the gas enclosure assembly 101, the back wall panel 1640 can have an inset panel 1610 configured to provide access to, for example, an electrical bulkhead. The service bundle can be fed through a bulkhead into a cable routing duct, such as duct 1632 shown in right wall panel 1630, for which the removable insert panel has been removed to show the service bundle routed into the first service bundle duct inlet 636. From there, the service bundle can be fed into the interior of the gas enclosure assembly 101 and is shown in a transparent interior view through the return conduit 1605 in the interior of the gas enclosure assembly 101. Various embodiments of a gas enclosure assembly for service beam routing can have more than one service beam inlet, such as that shown in fig. 21A, which depicts a first service beam conduit inlet 1634 and a second service beam conduit inlet 1636 for yet another service beam. Fig. 21B depicts an expanded view of the first service bundle conduit entry 1634 for a cable, wire, and conduit bundle. The first service bundle conduit inlet 1634 can have an opening 1631 designed to form a seal with the sliding cover 1633. In various embodiments, the opening 1631 can accommodate flexible sealing modules, such as those provided by the Roxtec Company for cable entry sealing, which can accommodate various diameters of cables, wires, and tubing, etc. in a service bundle. Alternatively, the top 1635 of the sliding cover 1633 and the upper portion 1637 of the opening 1631 may have a desired material disposed on each surface such that the desired material is capable of forming a seal around cables, wires, tubes, etc. of various sizes in a service bundle supplied through an inlet, such as the first service bundle conduit inlet 1634.

As depicted in fig. 22 and 23, the one or more fan filter units can be configured to provide a substantially laminar flow of gas through the interior of the gas enclosure assembly. According to various embodiments of a circulation and filtration system for a gas enclosure assembly of the present teachings, one or more blower units are disposed adjacent a first interior surface of the gas enclosure assembly and one or more ductwork inlets are disposed adjacent an opposing second interior surface of the gas enclosure assembly. For example, the gas enclosure assembly can include an interior ceiling and a bottom interior perimeter, the one or more fan units can be disposed adjacent the interior ceiling, and the one or more ductwork inlets can include a plurality of inlet openings disposed adjacent the bottom interior perimeter as part of the ductwork, as shown in fig. 16-18.

FIG. 22 is a cross-sectional view taken along the length of gas enclosure system 505, in accordance with various embodiments of the present teachings. Gas enclosure system 505 of fig. 22 can include a gas enclosure assembly 1100 capable of housing an OLED inkjet printing system 2001 as well as a circulation and filtration system 1500, a gas purification system 3130 (fig. 12 and 13), and a thermal regulation system 3140. The circulation and filtration system 1500 can include a ductwork assembly 1501 and a fan filter unit assembly 1502. The thermal conditioning system 3140 can include a fluid cooler 3142 in fluid communication with a cooler outlet line 3141 and with a cooler inlet line 3143. The cooled fluid can exit the fluid cooler 3142, flow through the cooler outlet line 3141 and be delivered to a heat exchanger, which can be positioned proximate to each of a plurality of fan filter units, as shown in fig. 22 for various embodiments of the gas enclosure system. Fluid can be returned from the heat exchanger near the fan filter unit to the cooler 3142 through the cooler inlet line 3143 to be maintained at a constant desired temperature. As previously discussed herein, the cooler outlet line 3141 and the cooler inlet line 3143 are in fluid communication with a plurality of heat exchangers including a first heat exchanger 1562, a second heat exchanger 1564, and a third heat exchanger 1566. According to various embodiments of the gas enclosure system 505 as shown in fig. 22, the first heat exchanger 1562, the second heat exchanger 1564, and the third heat exchanger 1566 are in thermal communication with a first fan filter unit 1552, a second fan filter unit 1554, and a third fan filter unit 1556, respectively, of the fan filter unit assembly 1502 of the recirculation and filtration system 1500.

In fig. 22, a number of arrows depict the gas flow in the circulation and filtration system 1500 that provides low particle filtered air within the gas enclosure assembly 1100. In fig. 22, the ductwork assembly 1501 can include a first ductwork conduit 1573 and a second ductwork conduit 1574 as depicted in the simplified schematic of fig. 22. The first ductwork conduit 1573 can receive gas through a first ductwork inlet 1571, and the gas can exit through a first ductwork outlet 1575. Similarly, the second ductwork conduit 1574 can receive gas through a second ductwork inlet 1572, which exits through a second ductwork outlet 1576. Furthermore, as shown in fig. 22, ductwork assembly 1501 separates inert gas that is recirculated through the interior of fan filter unit assembly 1502 by means of an effectively defined space 1580, which space 1580 can be in fluid communication with a gas purification system 3130 via a gas purification outlet line 3131 and a gas purification inlet line 3133. Such a circulation system, including the various embodiments of the ductwork as described with respect to fig. 16-18, provides a substantially laminar flow that minimizes turbulence, promotes circulation, tumbling, and filtering of the particulate matter of the atmosphere in the interior of the enclosure, and provides circulation through a gas purification system external to the gas enclosure assembly.

FIG. 23 is a cross-sectional view taken along the length of gas enclosure system 506 in accordance with various embodiments of gas enclosure systems in accordance with the present teachings. As with gas enclosure system 505 of fig. 22, gas enclosure system 506 of fig. 23 can include a gas enclosure assembly 1100, which gas enclosure assembly 1100 can house an OLED inkjet printing system 2001, as well as a circulation and filtration system 1500, a gas purification system 3130 (fig. 15), and a thermal regulation system 3140. The circulation and filtration system 1500 can include a ductwork assembly 1501 and a fan filter unit assembly 1502. For various embodiments of the gas enclosure system 506, the thermal conditioning system 3140 can be in fluid communication with a plurality of heat exchangers, such as a first heat exchanger 1562 and a second heat exchanger 1564, as depicted in fig. 23, the thermal conditioning system 3140 can include a fluid cooler 3142, the fluid cooler 3142 being in fluid communication with a cooler outlet line 3141 and with a cooler inlet line 3143. According to various embodiments of the gas enclosure system 506 as shown in fig. 22, various heat exchangers, such as the first heat exchanger 1562 and the second heat exchanger 1564, can be in thermal communication with the circulating inert gas by being positioned proximate to the conduit outlets, such as the first conduit system outlet 1575 and the second conduit system outlet 1576 of the conduit system assembly 1501. In this regard, the inert gas returned for filtering from the duct inlets, such as the first and second

duct system inlets

1571 and 1572 of the duct system assembly 1501, can be thermally conditioned prior to being circulated through the first, second and third

fan filter units

1552, 1554, 1556, respectively, of the fan filter unit assembly 1502 of fig. 23, for example.

As can be seen from the arrows in fig. 22 and 23 showing the direction of inert gas circulation through the enclosure, the fan filter unit can be configured to provide a substantially laminar flow from the top down towards the bottom of the enclosure. Fan filter units such as available from Flanders Corporation of washington, north carolina or envirco Corporation of sandford, north carolina may be useful for integration into various embodiments of gas enclosure assemblies in accordance with the present teachings. Various embodiments of fan filter units are capable of exchanging between about 350 cubic feet per minute (CFM) to about 700 CFM of inert gas passing through each unit. As shown in fig. 22 and 23, since the fan filter units are arranged in parallel rather than in series, the amount of inert gas that can be exchanged in a system comprising a plurality of fan filter units is proportional to the number of units used.

Near the bottom of the enclosure, the airflow is directed to a plurality of ductwork inlets, schematically indicated in fig. 22 and 23 as first and

second ductwork inlets

1571, 1572 of the ductwork assembly 1501. As previously discussed herein with respect to fig. 16-18, positioning the conduit inlet substantially at the bottom of the enclosure and flowing gas downward from the upper fan filter unit facilitates good turnover of the atmosphere within the enclosure and promotes complete turnover and movement of the entire atmosphere through the gas purification system used in conjunction with the enclosure. By using the circulation and filtration system 1500 to circulate the atmosphere through the piping system and promote laminar flow and complete turnover of the atmosphere in the enclosure, the level of each of the reactive species, e.g., water and oxygen, and the level of each solvent can be maintained at 100ppm or less, e.g., 1ppm or less, e.g., 0.1ppm or less, in various embodiments of the gas enclosure assembly, which piping system assembly 1501 separates the inert gas flow for circulation through the gas purification loop 3130.

Fig. 24 is a front schematic view of a gas enclosure system 507, which can be a front schematic view of the gas enclosure system 505 of fig. 22. In fig. 24, more details of the printing system 2001 can be seen, the printing system 2001 being depicted enclosed within the gas enclosure system 507. Various embodiments of gas enclosure systems of the present teachings having particle control systems can provide a low particle zone proximate a substrate, such as substrate 2050 of fig. 24, which can be supported by substrate support apparatus 2200. The substrate support apparatus 2200 of the printing system 2001 for various embodiments of printing systems can be a chuck or a flotation stage. As previously discussed herein, various embodiments of a gas circulation and filtration system according to the present teachings can include: a ductwork assembly, such as ductwork assembly 1501 of FIG. 24; and a fan filter unit assembly, such as fan filter unit assembly 1502, which can have a plurality of fan filter units, in which fan filter unit 1552 is shown in a front schematic view in fig. 24. The gas flow indicated by the arrows depicts a laminar flow of filtered gas proximate the substrate 2050. It is recalled that a laminar flow environment can minimize turbulence and can produce a substantially low particle environment that can maintain airborne particle levels that meet the standards set forth in international organization for standardization (ISO) 14644-1:1999, as defined by classes 1 through 5.

As will be discussed in greater detail later herein, for various embodiments of the gas enclosure system of the present teachings, an effective gas circulation and filtration system can be part of the particulate control system. However, various particle control systems of the present teachings also prevent particle generation near the substrate during the printing process. As depicted in fig. 24 for the gas enclosure assembly 1100 of the gas enclosure system 507, the substrate 2050 can be proximate to various components of the printing system 2001, which can generate particles. For example, the X, Z carriage assembly 2300 can include components, such as a linear bearing system, capable of generating particles. The service bundle housing 2410 can contain a particle-producing service bundle operatively connected from various equipment and systems to a gas enclosure system including a printing system. Various embodiments of service bundles can include bundled optical cables, electrical cables, wires and conduits, etc. for providing optical, electrical, mechanical and fluid functionality to various components and systems disposed within the interior of a gas enclosure system.

The gas enclosure system of the present teachings can have various components that provide a particle control system. Various embodiments of the particulate control system can include a gas circulation and filtration system in fluid communication with the already-included particulate generation component such that such particulate-included component can be discharged into the gas circulation and filtration system. For various embodiments of the particulate control system, it is possible to discharge the already contained particulate generating components into dead space, thereby preventing such particulate matter from entering the recirculation within the gas enclosure system. Various embodiments of the gas enclosure system of the present teachings can have a particle control system, for which various components can be inherently low particle generation, thereby preventing particles from accumulating on the substrate during the printing process. Various components of the particle control system of the present teachings can utilize containment and venting of particle generation components, as well as selection of components for intrinsic low particle generation to provide a low particle region proximate to the substrate.

According to various embodiments of a gas enclosure system for an OLED printing system, the number of fan filter units can be selected according to the physical location of a substrate in the printing system during processing. Thus, the number of fan filter units can vary depending on the travel of the substrate through the gas enclosure system. For example, fig. 25 is a cross-sectional view taken along the length of gas enclosure system 508, which gas enclosure system 508 is a similar gas enclosure system as depicted in fig. 9. Gas enclosure system 508 can include a gas enclosure assembly 1100, the gas enclosure assembly 1100 housing an OLED inkjet printing system 2001 supported on a gas enclosure assembly base 1320. The substrate flotation station 2200 of the OLED printing system defines a stroke that enables the substrate to be moved through the gas enclosure system 508 during processing of the substrate. Accordingly, the fan filter unit assembly 1502 of the gas enclosure system 508 has an appropriate number of fan filter units, shown as 1551 and 1555, corresponding to the physical travel of the substrate through the inkjet printing system 2001 during processing. Furthermore, the schematic cross-sectional view of fig. 25 depicts the outline of various embodiments of a gas enclosure, which can effectively reduce the volume of inert gas required during the OLED printing process, and at the same time provide convenient access to the interior of the gas enclosure assembly 1100, either remotely during processing, for example using gloves mounted in various glove ports, or directly through various removable panels in the case of maintenance operations.

FIG. 26 depicts a printing system 2002 of various embodiments of printing systems according to the present teachings. Printing system 2002 can have many features as previously described for printing system 2000 of fig. 10B. The printing system 2002 can be supported by the printing system base 2101. Orthogonal to and mounted on printing system base 2101 can be a first riser 2120 and a second riser 2122 on which beam 2130 can be mounted. For various embodiments of the inkjet printing system 2002, the beam 2130 can support at least one X-axis carriage assembly 2300, the at least one X-axis carriage assembly 2300 being movable in an X-axis direction relative to the substrate support apparatus 2250 by a service beam carrier run (carrier run) 2401. As will be discussed in greater detail later herein, for various embodiments of the printing system 2002, the X-axis carriage assembly 2300 is capable of utilizing a linear air bearing motion system that is inherently low in particle generation. According to various embodiments of a printing system of the present teachings, an X-axis carriage can have a Z-axis moving plate mounted thereon. In fig. 26, the X-axis carriage assembly 2300 is depicted with a first Z-axis moving plate 2315. In various embodiments of printing system 2002, a second X-axis carriage assembly can be mounted on beam 2130, which can also have a Z-axis moving plate mounted thereon. In this regard, similar to printing system 2000 of fig. 10B, for various embodiments of OLED inkjet printing system 2002, there can be two carriage assemblies each having a print head assembly, such as print head assembly 2500 of fig. 26, and a second print head assembly mounted on a second X, Z spindle carriage assembly (not shown). In various embodiments of the printing system 2002, a first printhead assembly, such as the printhead assembly 2500 of fig. 26, can be mounted on a first X, Z shaft carriage assembly, and a camera system for inspecting features of the substrate 2050 can be mounted on a second X, Z shaft carriage assembly (not shown). In various embodiments of the printing system 2002 of fig. 26, a printhead assembly, such as the printhead assembly 2500 of fig. 26, can be mounted X, Z on a spool carriage assembly, and a uv lamp or heat source for curing an encapsulation layer printed on the substrate 2050 can be mounted on a second X, Z spool carriage assembly (not shown).

According to various embodiments of the printing system 2002, the substrate support apparatus 2250 can be a flotation stage, similar to the flotation stage 2200 of the printing system 2000 of fig. 10B, in which the substrate can be contained in the X, Y plane and the flotation stage can be used to fix a stable Z-axis suspension height. In various embodiments of the printing system 2002, the substrate support device 2250 can be a chuck. In various embodiments of the printing system 2002, the chuck can have a top surface 2252 for mounting the substrate. In various embodiments of the printing system 2002, the top surface 2252 can support a top plate, which can be replaceable, enabling easy interchangeability between different substrate sizes and types. In various embodiments of the printing system 2002, the top plate can accommodate multiple substrates of different sizes and types. In various embodiments of the printing system 2002, which can utilize a chuck as a substrate support device, the substrate can be securely held on the chuck during the printing process using vacuum, magnetic, or mechanical methods known in the art. The precision XYZ motion system can have various components for positioning a substrate mounted on the substrate support apparatus 2250 relative to the printhead assembly 2500, which can include a Y-axis motion assembly 2355, and X, Z carriage assembly 2300. The substrate support apparatus 2250 may be mounted on the Y-axis motion assembly 2355 and may be movable on a rail system 2360 using a linear bearing system such as, but not limited to, utilizing mechanical bearings or air bearings. For various embodiments of the gas enclosure system, the air bearing motion system helps to facilitate frictionless transport of a substrate placed on the substrate support apparatus 2250 in the Y-axis direction. Y-axis motion system 2355 can also optionally use dual rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system. Other accurate XYZ motion systems can also be used in accordance with the present teachings, such as, but not limited to, various embodiments of a 3-axis gantry system. For example, various embodiments of a 3-axis gantry system can have a X, Z carriage assembly mounted on the gantry beam for precision X, Z axis movement, wherein the gantry can move precisely in the Y-axis direction.

In addition to the gas circulation and filtration system for maintaining a low particle environment within the gas enclosure system, various embodiments of the printing system, such as the printing system 2000 of fig. 10B and the printing system 2002 of fig. 26, can also have additional components integrated into the gas enclosure system that prevent particle generation near the substrate during the printing process. For example, the printing system 2000 of fig. 10B and the printing system 2002 of fig. 26 can have an inherently low particle generation X-axis motion system in which the X, Z carriage assembly 2300 can be mounted and positioned on the beam 2130 using the linear air bearing system 2320. In addition, printing system 2000 of fig. 10B and printing system 2002 of fig. 26 can also have a service bundle housing discharge system 2400 for containing and discharging particles generated from a service bundle.

According to the present teachings, the service bundle can include optical cables, electrical cables, wires, pipes, and the like, as non-limiting examples. Various embodiments of service bundles of the present teachings can be operatively connected to various devices and apparatuses in a gas enclosure system to provide the optical, electrical, mechanical, and fluidic connections required in the operation of various devices and apparatuses associated with, for example, but not limited to, a printing system. Given the size and complexity of the various service bundles, various motion systems typically require a service bundle carrier to manage the service bundle as it moves with the motion system. For various embodiments of the gas enclosure system of the present teachings, the service bundle carrier can be a flexible tape for tying bundles of cables, wires, pipes, and the like together at regular intervals. For the various embodiments of the gas enclosure system of the present teachings, the service bundle carrier can be a sheath or cover capable of covering the bundle of cables, wires, pipes, etc. of the service bundle. In various embodiments of the gas enclosure system of the present teachings, the service bundle carrier can be molded with a bundle of cables, wires, pipes, etc. of the service bundle. In various embodiments, the service bundle carrier can be a segmented or flexible chain capable of supporting and carrying a bundle of cables, wires, pipes, and the like.

According to various embodiments of a gas enclosure system of the present teachings, a service bundle housing, which can include a service bundle managed using a service bundle carrier, can contain particulate matter generated from the service bundle and the service bundle carrier within the service bundle housing. Further, as will be discussed in greater detail later herein, as the service bundle carrier moves within the service bundle housing, the movement of the service bundle carrier can compress the volume of air in a pistonic manner, thereby creating a positive pressure differential between the internal service bundle housing and the ambient environment external to the service bundle housing that can allow particulate matter formed by the particle generating components associated with the service bundle carrier to exit through an opening formed by, for example, a carrier run line. Such particulate matter in close proximity to the substrate has a considerable potential to contaminate the surface of the substrate before being swept away into the circulation and filtration system. Thus, the service bundle housing venting system can be a component of various embodiments of a particle control system of a gas enclosure system that can contain and vent a service bundle housing in order to ensure a substantially low particle printing environment.

As shown in fig. 26, and as indicated by the dashed lines, the service bundle housing 2410 and the service bundle housing exhaust plenum 2420 can be a single component for various embodiments of the service bundle housing exhaust system 2400. For such embodiments, the service bundle housing exhaust system 2400 can ensure that a positive pressure differential between the inlet and outlet portions of the service bundle housing can be maintained in order to exhaust particles generated in the service bundle housing 2410 through the service bundle housing exhaust plenum first conduit 2422 and the service bundle housing exhaust plenum second conduit 2424 into the gas circulation and filtration system. Alternatively, for various embodiments, the service bundle housing exhaust system 2400 can include a service bundle housing exhaust plenum 2420 that can be mounted to and in fluid communication with the service bundle housing 2410. The service bundle housing 2410 can contain particulates produced by a service bundle, which can include bundled optical cables, electrical cables, wires, and tubing, among others. Various embodiments of the service bundle of the present teachings can provide a gas enclosure system that can include a printing system having at least one of optical, electrical, mechanical, and fluidic functions for various components and systems disposed within an interior of the gas enclosure. For various embodiments of the printing system 2002, the service bundle housing exhaust system 2400 can ensure that a positive pressure differential between the inlet and outlet portions of the service bundle housing can be maintained in order to exhaust the particles contained in the service bundle housing 2410 into the service bundle housing exhaust plenum 2420. The service bundle housing exhaust plenum 2420 can be in fluid communication with a gas circulation and filtration system through a service bundle housing exhaust plenum first conduit 2422 and a service bundle housing exhaust plenum second conduit 2424. Alternatively, the service bundle housing exhaust plenum first conduit 2422 and the service bundle housing exhaust plenum second conduit 2424 can be fitted with flexible exhaust hoses such that particles contained by the service bundle housing can be exhausted through the service bundle housing exhaust plenum and directed into the targeted dead space via the flexible exhaust hoses.

Furthermore, in addition to maintaining a positive pressure differential between the inlet portion and the outlet portion of the service bundle housing exhaust system, a relatively neutral or negative pressure differential can be further maintained between the interior of the service bundle housing exhaust system and the ambient environment for various embodiments of the service bundle housing exhaust system. Such a relatively neutral or negative pressure differential that can be maintained between the interior of the service bundle housing exhaust system and the ambient environment can prevent particles from leaking from the service bundle housing exhaust system through cracks, seams, etc. Leakage of particles immediately adjacent to the substrate through cracks, seams, etc. has a considerable potential to contaminate the surface of the substrate before being swept away into the circulation and filtration system.

Fig. 27A depicts a side cross-sectional view of a low particle generation X-axis motion system 2320, in accordance with various embodiments of the present teachings. In fig. 27A, a low particle generation X-axis motion system 2320 is depicted having a relationship to the service bundle housing exhaust system 2400, which can have a service bundle housing 2410 and a service bundle housing exhaust plenum 2420, as shown in fig. 27A, the service bundle housing exhaust plenum 2420 in fluid communication with the service bundle housing exhaust plenum first conduit 2422. The printing system 2002 can include a base 2101 on which a substrate support apparatus 2250 can be mounted on the base 2101. X, Z the carriage assembly 2300 can be mounted to a beam 2130. As can be seen in the cross-sectional view presented in fig. 27A, the X-axis motion system 2320 can be a linear air bearing motion system that is inherently low in particle generation. The X-axis motion system 2320 can include a plurality of air bearing disks (puck) 2330 and a brushless linear motor 2340. The service bundle carrier 2430 can be mounted X, Z to the carriage assembly 2300 and can be housed in a service bundle housing 2410. As depicted in fig. 27A, the service bundle housing exhaust plenum 2420 can be in fluid communication with the service bundle housing 2410, as well as with a gas circulation and filtration system through a piping system, such as the service bundle housing exhaust plenum first conduit 2422. In this regard, the service bundle housing 2410 can discharge particles generated from various embodiments of the service bundle. A service bundle according to the present teachings can be a bundle that can include, for example, but not limited to, optical cables, electrical cables, wires, and pipes, etc., that can be managed using various embodiments of the service bundle carrier 2430. Various embodiments of the service bundle of the present teachings can be operatively connected to a printing system to provide various optical, electrical, mechanical, and fluidic connections required to operate, for example, but not limited to, the printing system. For various embodiments of the gas enclosure of the present teachings, a service bundle carrier, such as service bundle carrier 2430, can be supported by the service bundle housing bottom side 2404. For various embodiments of the gas enclosure of the present teachings, a service bundle carrier, such as service bundle carrier 2430, can be supported by a tray or rack.

Fig. 27B is an expanded view of fig. 27A, depicting the low particle generation X-axis motion system 2320 of the printing system 2002 in more detail. A plurality of air bearing discs 2330 can be mounted X, Z to the inner surface of the shaft carriage assembly 2300. In this regard, various embodiments of the low particle generation X-axis motion system 2320 can provide for frictionless travel of the X, Z axle carriage assembly 2300 on the beam 2130. In fig. 27A, a first disc 2332 and a second disc 2334 are shown adjacent to a first side 2132 of a beam 2130. The third disc 2336 of fig. 27B can be proximate to the top surface 2133 of the beam 2130 and the fourth disc 2338 can be proximate to the second side 2134 of the beam 2130. The brushless linear motor can include: x, Z axle carriage assembly track 2342, which can be mounted on beam 2130; and a linear motor winding 2344 that can be mounted X, Z to the shaft carriage assembly 2300. An encoder readhead 2346 can be associated with the linear motor windings 2344 for positioning the linear motor 2340. In various embodiments of brushless linear motor 2340, encoder read head 2346 can be an optical encoder. As will be discussed in more detail later herein, various embodiments of the low-particle X-axis motion system 2320 utilizing a frictionless air bearing disk can be integrated with various embodiments of a compressor circuit, as shown and described with respect to fig. 33 and 34. Finally, as shown in fig. 27B, the service bundle housing exhaust system 2400 can include a service bundle housing 2410, the service bundle housing 2410 can house a service bundle carrier 2430. Service bundle housing exhaust system 2400 can contain and exhaust particles from a service bundle housing 2410, which can be generated from a service bundle, which can be managed using a service bundle carrier, such as service bundle carrier 2430.

Fig. 28A is a front perspective view of a printing system 2003, the printing system 2003 being shown with a service bundle housing exhaust system 2400 mounted over beams 2130. Various embodiments of printing system 2003 can have many features as previously described for printing system 2000 of fig. 10B and printing system 2002 of fig. 26. For example, the printing system 2003 can be supported by the printing system base 2101. Orthogonal to and mounted on printing system base 2101 can be a first riser 2120 and a second riser 2122 on which beam 2130 can be mounted. For various embodiments of the inkjet printing system 2003, the beam 2130 can support at least one X-axis carriage assembly 2300, the at least one X-axis carriage assembly 2300 being movable in the X-axis direction relative to the substrate support apparatus 2250 by a service beam carrier run 2401. According to various embodiments of the printing system of the present teachings, the X-axis carriage 2300 can have a Z-axis moving plate 2310 mounted thereon. In this regard, various embodiments of the carriage assembly 2300 can provide precise X, Z positioning of the printhead assembly 2500 relative to the substrate support apparatus 2250. In various embodiments of printing system 2003, a second X-axis carriage assembly can be mounted on beam 2130, which can have a Z-axis moving plate mounted thereon. For embodiments of the printing system 2003 having two X-axis carriage assemblies, a printhead assembly can be mounted on each X, Z axis carriage, or as described for the printing system 2000 of fig. 10B and the printing system 2002 of fig. 26, various other devices such as, for example, a camera, a uv lamp, and a heat source can be mounted on the two X, Z axis carriage assemblies. According to various embodiments of the printing system 2003, the substrate support apparatus 2250 for supporting the substrate can be a flotation table, similar to the flotation table 2200 of the printing system 2000 of fig. 10B, or it can be a chuck, as previously described with respect to the printing system 2002 of fig. 26. The printing system 2003 of fig. 28A can have an inherently low particle generation X-axis motion system in which the X, Z carriage assembly 2300 can be mounted and positioned on the beam 2130 using an air bearing linear slide assembly. For various printing systems of the present teachings, the air bearing linear slide assembly can encircle the entirety of the beam 2130, allowing the X, Z carriage assembly 2300 to move frictionless on the beam 2130, as well as providing a three point mount that can maintain the accuracy of travel of the X, Z carriage assembly 2300, as well as being resistant to deflection.

For precise movement of the substrate relative to the printhead assembly, various embodiments of the printing system 2003 of fig. 28A can have a precise XYZ motion system that can include a Y-axis motion assembly 2355 in addition to the X, Z carriage assembly 2300. The substrate support apparatus 2250 may be mounted on the Y-axis motion assembly 2355 and may be movable on a rail system 2360 using, for example and without limitation, a linear bearing system that utilizes mechanical bearings or air bearings. For various embodiments of the gas enclosure system, the air bearing motion system helps to facilitate frictionless transport of a substrate placed on the substrate support apparatus 2250 in the Y-axis direction. Y-axis motion system 2355 can also optionally use dual rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system. Other accurate XYZ motion systems can also be used in accordance with the present teachings, such as, but not limited to, various embodiments of a 3-axis gantry system. For example, various embodiments of a 3-axis gantry system can have a X, Z carriage assembly mounted on the gantry beam for precision X, Z axis movement, wherein the gantry can be moved precisely in the Y-axis direction.

As depicted in fig. 28A, for various embodiments of printing system 2003, service bundle housing exhaust system 2400 can be mounted over beams 2130. The service bundle housing exhaust system 2400 can include a service bundle housing exhaust plenum 2420 that can be mounted to and in fluid communication with a service bundle housing 2410. The service bundle housing 2410 can contain particulates produced by a service bundle, which can include bundled optical cables, electrical cables, wires, and tubing. Various embodiments of the service bundle of the present teachings can provide a gas enclosure system including a printing system having at least one of optical, electrical, mechanical, and fluidic functions for various components and systems disposed within an interior. For various embodiments of the printing system 2003, the service bundle housing exhaust system 2400 can ensure that a positive pressure differential between the inlet and outlet portions of the service bundle housing exhaust system can be maintained in order to exhaust the particles contained in the service bundle housing 2410 into the service bundle housing exhaust plenum 2420. The service bundle housing exhaust plenum 2420 can be in fluid communication with a gas circulation and filtration system through a service bundle housing exhaust plenum first conduit 2422 and a service bundle housing exhaust plenum second conduit 2424. Alternatively, the service bundle housing exhaust plenum first conduit 2422 and the service bundle housing exhaust plenum second conduit 2424 can be fitted with flexible exhaust hoses such that particles contained by the service bundle housing can be exhausted through the service bundle housing exhaust plenum and directed into the targeted dead space via the flexible exhaust hoses.

For various embodiments of the service bundle housing exhaust system, in addition to maintaining a positive pressure differential between the inlet portion and the outlet portion of the service bundle housing exhaust system, a relatively neutral or negative pressure differential can be further maintained between the interior of the service bundle housing exhaust system and the ambient environment. This relatively neutral or negative pressure differential that can be maintained between the interior of the service bundle housing exhaust system and the ambient environment can prevent particles from leaking from the service bundle housing exhaust system through cracks, seams, etc. Leakage of particles immediately adjacent to the substrate through cracks, seams, etc. has a considerable potential to contaminate the surface of the substrate before being swept away into the circulation and filtration system.

Fig. 28B depicts an expanded partial cross-sectional front perspective view of the printing system 2003. In fig. 28B, X, Z carriage assembly 2300 is shown that can utilize an air bearing linear slide assembly to position the carriage of X, Z carriage assembly 2300 on beam 2130. X, Z, the movement of the carriage assembly 2300 moves the service beam carrier in the X-axis direction a distance defined by the travel path 2401. The service bundle carrier run line 2401 is an opening that allows movement of optical cables, electrical cables, wires, and conduits, etc. bundled into a service bundle housed in a service bundle housing 2410 and capable of being connected to, for example, but not limited to, a printhead assembly 2500. Given the size and complexity of the various service bundles, various motion systems typically require a service bundle carrier to manage the service bundles as they move with the motion system. In this regard, the service bundle carrier 2430 is shown housed in the service bundle housing 2410 of fig. 28B. During printing, movement of the service beam, which can include cables, wires, and conduits, etc., as well as movement of the service beam carrier itself, can generate particulate matter proximate to the substrate located beneath the service beam housing as the carriage assembly moves to precisely position the printhead assembly in the X-axis direction relative to the substrate located beneath it. Further, as the service bundle carrier moves within the service bundle housing, the movement of the service bundle carrier can compress the volume of air in a pistonic manner, thereby generating a positive pressure that can allow particulate matter formed by particle generation components associated with the service bundle carrier to exit through, for example, the carrier travel line 2401. Such particulate matter in close proximity to the substrate has a considerable potential to contaminate the surface of the substrate before being swept away into the circulation and filtration system. Thus, the service bundle housing exhaust system can be a component of various embodiments of a particle control system of a gas enclosure system that can ensure a substantially low particle printing environment.

In fig. 28B, the service bundle housing top surface 2402 is shown with a set of grooves 2414, forming a grooved top surface. For the various embodiments of service bundle housing exhaust system 2400 of fig. 28B, two requirements for such a system for ensuring that particulate matter formed by the particulate generating components associated with the service bundle carrier is swept into the circulation and filtration system are: 1) the discharge flow rate through the service bundle housing discharge system should be greater than the volume change on the gas compression side of the service bundle carrier as it moves in the service bundle housing; and 2) there should be a constant discharge flow evenly distributed to effectively sweep the service bundle housing volume. The various embodiments of the service bundle housing exhaust system of the present teachings ensure that both requirements are met.

For example, as depicted in fig. 29A, various embodiments of a service bundle housing drainage system can include a service bundle housing 2410, which service bundle housing 2410 can be used to house a service bundle carrier 2430. In fig. 29A, service bundle carrier 2430 is depicted as a segmented flexible chain-type service bundle carrier, and various other types of service bundle carriers that can be used can behave similarly, thereby requiring the use of various embodiments of the service bundle housing drainage system of the present teachings. Service bundle carrier run 2401 is an opening capable of allowing particulate matter formed by particle generation components associated with the service bundle carrier to exit the service bundle housing due to positive pressure generated by movement of the service bundle carrier. The service bundle housing exhaust plenum 2420 can be maintained at a positive pressure that can ensure that particle generating components associated with the service bundle carriers can be exhausted through the service bundle housing exhaust plenum first conduit 2422 and the service bundle housing exhaust plenum second conduit 2424 and into the circulation and filtration system. A set of service bundle housing slots 2412 formed in the service bundle housing top surface 2402 as shown in fig. 29A can ensure even distribution of constant exhaust flow to effectively sweep the volume of the service bundle housing 2410.

Although the service bundle housing slots 2412 are shown in fig. 29A as being formed on the service bundle housing top side 2402, it can be appreciated that a set of slots can be positioned on various surfaces of the service bundle housing, as depicted in fig. 29B. As depicted in fig. 29B, a set of slots can be positioned on the service bundle housing bottom side 2404 (set I), the service bundle housing first side 2406 (set II), and the service bundle housing second side 2408 (set III). Further, as depicted in fig. 29C, while slots can be one type of opening for facilitating uniform distribution of a constant exhaust flow to effectively sweep the volume of the service bundle housing, openings having various shapes, aspect ratios, and locations can be used. As shown in fig. 29C, substantially circular openings, such as the first and second service

bundle housing openings

2411 and 2413 depicted as being formed in the service bundle housing top side 2402, can be used to facilitate even distribution of the constant exhaust flow to effectively sweep the volume of the service bundle housing. As depicted in fig. 29C, an alternative placement of the substantially circular opening can be on the end of the service bundle housing. In fig. 29C, first and second service

bundle housing openings

2411 and 2413, depicted as being formed in the service bundle housing first and

second ends

2415 and 2417, respectively, can be used to facilitate even distribution of constant exhaust flow to effectively sweep the volume of the service bundle housing. In addition, various embodiments of the service bundle housing may also have a first service bundle carrier 2401 and a second service bundle carrier run line 2407. The service bundle housing top surface 2402 can have a first set of slots 2412 and a second set of slots 2414 proximate the first service bundle carrier 2401 and the second service bundle carrier travel line 2407, respectively, which can be used to facilitate even distribution of constant exhaust flow to effectively sweep the volume of the service bundle housing. Finally, as shown in fig. 27B, when the service bundle housing exhaust system includes a housing that is a single piece, uniform distribution of a constant exhaust flow can be promoted in view of effective exhaust gas flow.

Various embodiments of a gas enclosure system of the present teachings as depicted in fig. 30A/30B-32A/32B can have features as previously discussed herein with respect to fig. 22, 23, and 24 for a gas circulation and filtration system that can promote laminar flow and complete turnaround of the atmosphere in the enclosure, thereby ensuring that a substantially low-particle environment of airborne particulate matter can be maintained. As previously discussed herein, the circulation and filtration system used to maintain low particulate airborne specifications is part of the particulate control system for the various embodiments of the gas enclosure system of the present teachings. The particle control system of the present teachings can also include a low particle generation X-axis motion system that utilizes air bearings and utilizes a service beam housing exhaust system. Various embodiments of the low particle generation X-axis motion system utilizing air bearings can substantially eliminate the generation of particulate matter. In addition, various embodiments of the service bundle housing exhaust system can be used to ensure that particulate matter generated in close proximity to the substrate during the printing process can be contained and subsequently purged into the circulation and filtration system for removal. In addition, as depicted in fig. 30A/30B-32A/32B, various embodiments of the particulate control system of the present teachings can have a printhead assembly discharge system in order to control particulate matter formed by various devices, equipment, service beams, etc., that can be positioned proximate to the substrate during the printing process.

Fig. 30A/30B depict a gas enclosure system 509, while fig. 31A/31B depict a gas enclosure system 510, and fig. 32A/32B depict a gas enclosure system 511, all of which can have features as previously described with respect to fig. 22 and 23, as shown. The gas enclosure systems 509-511 can have a circulation and filtration system 1500, a gas purification system 3130, and a thermal regulation system 3140. The circulation and filtration system 1500 can include a ductwork assembly 1501 and a fan filter unit assembly 1502. The ductwork assembly 1501 can separate inert gases internally recirculated through the fan filter unit assembly 1502 and externally recirculated to the gas purification system 3130 by effectively defining a space 1580, which space 1580 is effectively a conduit in fluid communication with the gas purification system 3130. Space 1580 is capable of fluid communication with gas purification system 3130 via gas purification outlet line 3131 and gas purification inlet line 3133 (fig. 12 and 13). Such a circulation system, including various embodiments of a piping system as described with respect to fig. 16-18, provides substantially laminar flow, minimizes turbulence, promotes circulation, turnover, and filtration of particulate matter of the atmosphere within the interior of the gas enclosure, and provides circulation through a gas purification system external to the gas enclosure assembly.

In addition, gas enclosure systems 509-511 as depicted in fig. 30A/30B-32A/32B can also have a printhead assembly discharge system 2600 that can be used to contain and discharge particles formed by various components associated with printing system 2003. For various embodiments of

gas enclosure systems

509, 510, and 511, printhead assembly exhaust system 2600 can house, for example and without limitation, a carriage assembly 2300 to which printhead assembly 2500 can be secured, as depicted in fig. 30A/30B, 31A/31B, and 32A/32B, respectively. Such moving plates can utilize friction bearings, as previously discussed herein, which can generate particles during operation of the OLED printing system. Further, as previously discussed herein, the carriage assembly can be used to mount equipment, such as an ultraviolet lamp assembly or a heat source assembly for curing the encapsulation layer. The ultraviolet lamp or heat source may require the use of a fan for cooling.

Accordingly, printhead assembly exhaust system 2600 of

gas enclosure systems

509, 510, and 511 can be part of a particle control system for containing and exhausting particulate matter formed by various devices, equipment, service beams, etc., that can be positioned proximate to a substrate during a printing process. Various embodiments of printhead assembly exhaust systems, such as printhead assembly exhaust system 2600 of

gas enclosure systems

509, 510, and 511, can ensure that a positive pressure differential can be maintained between the inlet and outlet portions of the printhead assembly exhaust housing in order to discharge particles generated by various components of the printhead assembly into the gas circulation and filtration system. For various embodiments of a printhead assembly discharge system, a positive pressure differential can be maintained between an inlet portion and an outlet portion of a printhead assembly discharge housing to discharge particles generated by various components of the printhead assembly into a dead space. As will be discussed in greater detail subsequently herein, a positive pressure differential for discharging particles generated by various components of the printhead assembly can be generated by using a fan and other system components that provide fluid communication between, for example, but not limited to, the printhead assembly discharge housing and the circulation and filtration system.

For various embodiments of a printhead assembly discharge system, in addition to maintaining a positive pressure differential between the inlet portion and the outlet portion of the printhead discharge assembly, a relatively neutral or negative pressure differential can be further maintained between the interior of the printhead discharge assembly and the ambient environment. Such a relatively neutral or negative pressure differential that can be maintained between the interior of the printhead discharge assembly and the ambient environment can prevent particles from leaking from the printhead discharge assembly through cracks, seams, etc. Leakage of particles immediately adjacent to the substrate through cracks, seams, etc. has a considerable potential to contaminate the surface of the substrate before being swept away into the circulation and filtration system.

As depicted in fig. 30A and 30B, the service bundle housing 2410 can be supported on beams 2130 of the printing system 2003. As previously discussed herein with reference to printing system 2000 of fig. 10B, carriage assembly 2300 can have components for controlling X-Z axis movement, including a Z axis moving plate to which printhead assembly 2500 can be fixed. The printhead assembly discharge system housing 2610 can be in fluid communication with a service bundle housing 2410, such as, but not limited to, a printhead assembly discharge system first conduit 2612. The service bundle housing 2410 can be in fluid communication with the plumbing assembly 1501 via, for example and without limitation, a printhead assembly exhaust system second conduit 2614, which printhead assembly exhaust system second conduit 2614 can be in fluid communication with a second plumbing conduit 1574. Printhead assembly exhaust system 2600 of fig. 30A and 30B, which can contain components, such as moving plates, that risk generating particles, can have at least one fan, such as fan 2620, for facilitating movement of gas through printhead assembly exhaust system 2600 and into service beam housing 2410. In this regard, the entirety of the air contained in printhead assembly exhaust system 2600 and service bundle housing 2410 can be effectively filtered by circulation and filtration system 1500, as depicted in fig. 30A.

According to the present teachings, particulate matter collected in dead space regions remote from a substrate mounted on a substrate support apparatus cannot be recirculated within the gas enclosure system. In this regard, the various embodiments of the gas enclosure systems depicted in fig. 31A/31B and 32A/32B may utilize directing particulate matter into the ductwork as well as into the dead space. Such particulate matter can be removed from the dead space during periodic gas enclosure system maintenance.

In this regard, for various embodiments of a gas enclosure system, such as the gas enclosure system 510 of fig. 31A and 31B, the service bundle housing 2410 can be in fluid communication with the circulation and filtration system 1500. As depicted in fig. 31B, the printhead assembly discharge system housing 2610 can be in fluid communication with a service bundle housing 2410, such as, but not limited to, a printhead assembly discharge system first conduit 2612. The service bundle housing 2410 can be in fluid communication with a printhead assembly exhaust system second conduit 2614, which printhead assembly exhaust system second conduit 2614 can have an outlet end proximate to a second conduit system inlet 1572 of the conduit system assembly 1501. In this regard, the printhead assembly exhaust system second conduit 2614 can be in fluid communication with the piping system assembly via the second piping system conduit 1574. The printhead assembly exhaust system first conduit 2612 can have a fan, such as fan 2620, for facilitating movement of gas through the printhead assembly exhaust system first conduit 2612. Additionally, printhead assembly exhaust system second conduit 2614 can have a fan 2622 for facilitating movement of gas through printhead assembly exhaust system 2614 such that particulates contained by printhead assembly exhaust system 2600 and service beam housing 2410 can be effectively filtered by circulation and filtration system 1500, as depicted in fig. 31A. For various embodiments of gas enclosure systems, such as the gas enclosure system 510 of fig. 31A and 31B, any particulate matter that does not flow into the second ductwork inlet 1572 will have a trajectory toward the dead space 1590.

As depicted for the gas enclosure system 511 of fig. 32A and 32B, the service bundle housing 2410 can be in fluid communication with the circulation and filtration system 1500. As depicted in fig. 32B, the printhead assembly exhaust system housing 2610 can be in fluid communication with a service bundle housing 2410, such as, but not limited to, a printhead assembly exhaust system first conduit 2612, which printhead assembly exhaust system first conduit 2612 can have a fan, such as fan 2620, for facilitating movement of gas through the printhead assembly exhaust system first conduit 2612. The service bundle housing 2410 can be in fluid communication with a printhead assembly discharge system second conduit 2614, which printhead assembly discharge system second conduit 2614 can have a filter head 2616. The filter head 2616 is capable of filtering particulate matter originating from the printhead assembly exhaust system 2600 and entering the service bundle housing 2410, and directing a low particulate gas stream flowing from the filter head 2616 directly into the gas enclosure system 511. In this regard, the print head assembly exhaust system second conduit 2614 is capable of exhausting low-particle gas into the gas enclosure system 511, which can then be circulated through the circulation and filtration system 1500 of the gas enclosure system 511, as depicted in fig. 32A.

Various gas enclosure systems of the present teachings, such as gas enclosure system 501 of fig. 12 and gas enclosure system 502 of fig. 13, can utilize various gas enclosures, such as, but not limited to, gas enclosure 100 of fig. 1A and gas enclosure 1000 of fig. 9. Further, various gas closures, such as gas closure 100 of fig. 1A and gas closure 1000 of fig. 9, can house various printing systems, such as printing system 2000 of fig. 10B, printing system 2002 of fig. 26, and printing system 2003 of fig. 28A. For the gas enclosure systems and methods of the present teachings, monitoring the controlled environment of the gas enclosure is an important aspect of maintaining the controlled environment of the gas enclosure.

One parameter of the controlled environment that can be monitored is the effectiveness of particulate matter control. System verification and continuous in-situ system monitoring can be performed for both airborne and on-substrate particle monitoring.

The determination of airborne particulate matter can be performed for various embodiments of the gas enclosure system prior to the printing process using, for example, a portable particle counting device for system verification. In various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed in situ as a continuous quality check while printing the substrate. For various embodiments of the gas enclosure system, the determination of airborne particulate matter can be performed prior to printing the substrate and additionally in situ while printing the substrate for system verification.

FIG. 33 depicts an apparatus for measuring airborne particulate matter. Various embodiments of the particle counter 800 of fig. 33 can be hand-held or otherwise portable in accordance with the present teachings. As depicted in fig. 33, the particle counter 800 can have: a power button 810; and a display 812 for visually monitoring in real time various parameters, such as the size of the particles being monitored, etc., and the current count of particulate matter of that size. The portable particle counter of the present teachings can have multiple channels for monitoring several particle size ranges during analysis. As a non-limiting example, display 812 of particle counter 800 is depicted as monitoring three different particle size ranges. For various embodiments of the systems and methods of the present teachings, monitoring particles in a size range of approximately ≧ 0.3 μm can be useful for monitoring system quality, as a sudden surge of particles in that size range can be an early indication of a failure in a filtration system, such as a gas enclosure system. Various embodiments of particle counters according to the present teachings can have a cable or wireless connection (not shown) from the particle counter to a computer, as non-limiting examples, which can provide for the continuous collection and storage of data from the particle counter. The particle counter 800 can have an inlet nozzle 814 for introducing an air sample into the particle counter 800. Various embodiments of particle counters for measuring airborne particulate matter can have an isokinetic sampling probe, such as sampling probe 816 of fig. 33, that can reduce counting errors associated with sample flow rates and aerodynamics of particles, particularly small particles. To obtain accurate results on the particulate matter in the stream, the sample stream through the sampling system should be such that the velocity at the inlet of the sampling point is the same as the flow velocity of the gas at that point. The constant velocity sampling probe can have an inlet probe 815 that can be attached to the inlet nozzle 814 using a sampling probe connector 817. For various embodiments of the sampling probe 816, the sampling probe connector 817 can be a section of flexible tubing. For sampling in various embodiments of the gas enclosure system of the present teachings, the inlet probe 815 of the sampling probe 816 can be directly facing the gas flow.

While various commercial particle counters can be based on various measurement principles that can include light blocking, direct imaging, light scattering, and the like, measurements based on light scattering from particles are well suited to producing information of interest, including particle size. In principle, particle sizes as low as about 1nm can be determined using light scattering.

FIG. 34 is a schematic diagram of a particle counter detector 830 based on light scattering. Particle counter detectors based on light scattering can have a source of electromagnetic radiation of a known wavelength range of a known wavelength, such as light source 820. For various embodiments of the particle counter detector 830, the light source 820 can be a laser source that emits light at a known wavelength. For various embodiments of particle counters, particularly but not exclusively for handheld and portable particle counting devices, the light source 820 can be a Light Emitting Diode (LED) emitting light of a known wavelength between about 600nm and about 850 nm. The emitted source light 821 can be focused at a detection area 822 of the flow path 824, which detection area 822 is depicted in fig. 34 as a top cut-away view. Any particle in the detection region 822 can scatter light, producing forward scattered light 823 or light scattered in several angular directions, including light in a direction orthogonal to the emitted source light 821, as depicted by light path 825. Light orthogonally scattered by particles in the detected region 822 can be focused using a focusing lens 826 and filtered using at least one optical filter before detection by a detector 828, which detector 828 can be various types of photometric detectors, e.g., based on photodiode technology, such as spatial or optical bandpass filters or combinations thereof. Various embodiments of particle counters can be calibrated using a calibration standard, such as an aerosol of particulate matter having a defined distribution of particles in various size ranges, where each size range has a defined concentration.

For example, various commercial particle counters based on light scattering are capable of detecting airborne particle sizes in the range of about ≧ 0.3 μm to about ≧ 10 μm, and reporting the number of particles of a specified size per volume of air, which is typically a cubic foot or meter. Various commercial particle counters are capable of counting particles of a given size up to between about 1 million and about 3 million. In this regard, various commercial calibration standards can have a distribution of particle coverage ranges of about ≧ 0.3 μm to about ≧ 10 μm, such as a bimodal or trimodal distribution of species covering that range, wherein each population of particles has a defined concentration that can reach the detection limit of about 1 million to about 3 million particles. As previously discussed herein, various particle counters for determining airborne particulate matter can have multiple channels for monitoring several particle size ranges. Although shown as having one light source and one detector, various embodiments of a particle counter for determining airborne particulate matter can have more than one light source and multiple detectors at various locations for monitoring light scattered at various angles. Such airborne particle counters are capable of monitoring and reporting a large dynamic particle size range of airborne particulate matter of about 0.1 μm or more to about 10.0 μm or more.

Fig. 35 is a schematic diagram using particle counter icons 800A-800D and is intended to convey where various embodiments of a particle counting device can be positioned relative to a low particle region of a printing system proximate to a substrate. The gas enclosure system 512 of fig. 35 can have components as previously described herein with respect to gas enclosure systems 500-511, including, but not limited to, a gas enclosure assembly 1100, a thermal conditioning system 3140 that can be integrated with a circulation and filtration system, as indicated by fan filter unit 1552 proximate to heat exchanger 1562. Gas enclosure system 512 of fig. 35 can have an outlet line 3131 and an inlet line 3133 to a gas purification system (not shown), as well as housing printing system 2004. The printing system 2004 can have a base 2101 on which a substrate support apparatus 2200 can be mounted. The printing system 2004 can additionally have a beam 2130 that can have a first carriage assembly 2300A and a second carriage assembly 2300B mounted thereon. The printing system 2004 can also have a service cable housing 2410 for housing a service cable (not shown).

With respect to fig. 35, at least one particle counter can be positioned or mounted on, for example, the service bundle housing 2410, as indicated by particle counter icon 800A, which particle counter icon 800A is depicted in the laminar flow of the fan filter unit 1552. Such a particle counter positioned in the laminar flow of gas from the fan filter unit can allow monitoring of the effectiveness of the filtration system of the gas enclosure system. Additionally, beams 2130 of printing system 2004 can also support a first X, Z shaft carriage assembly 2300A to which printhead assembly 2500 can be mounted X, Z. The second X, Z axle carriage assembly 2300B can have at least one particle counter mounted thereon, as shown by the particle counter icon 800B. Monitoring at locations close to various printing devices and equipment, such as carriage assemblies, may be used to monitor various particle generating sources, such as service beams and the like. A particle counter installed as depicted by particle counter icon 800C can be useful for process development (process development) and verification runs of gas containment systems. A particle counter installed as depicted by particle counter icon 800D can be useful for process development and verification operations of the gas containment system as well as in-situ monitoring of airborne particulate matter during the printing process.

According to various systems and methods of the present teachings, a particle counting device can be mounted or placed on a substrate support apparatus to measure particles in a vicinity where a substrate can be located during printing under defined conditions. For example, as depicted in fig. 35, a particle counter can be placed or mounted over the substrate support apparatus 2200, as indicated by the position of the particle counter icon 800C. In various embodiments of the systems and methods of the present teachings, monitoring particulate matter using a particle counter placed or mounted on a substrate support apparatus can be conducted for various types of process development or validation run studies of gas enclosure systems. As another non-limiting example, a particle counter can be mounted on a side of the substrate support apparatus 2200, as indicated by the position of the particle counter icon 800D. By using a particle counter with a sampling probe having a flexible connector, such as particle counter 800 of fig. 33 with sampling probe 816, a particle counter mounted to one side of a substrate support apparatus can have a sampling probe placed exactly at the height of the substrate.

A particle counter mounted on one side of the substrate support apparatus as shown by particle counter icon 800D can be useful for process development and verification operations of the gas enclosure system, as well as in-situ monitoring of airborne particulate matter during the printing process. For example, in fig. 36, a printing system 2003 as previously described with respect to fig. 26 and 28A can have an X-axis carriage assembly 2300 mounted on a beam 2130, the X-axis carriage assembly 2300 can also include a Z-axis moving plate 2310 for Z-axis positioning of a print head assembly 2500. In this regard, various embodiments of the carriage assembly 2300 can provide precise X, Z positioning of the printhead assembly 2500 relative to the substrate 2050. Having the X-axis carriage assembly 2300 enables utilization of an inherently low particle generation linear air bearing motion system for various embodiments of the printing system 2003. The printing system 2003 of fig. 36 can have a service bundle housing exhaust system 2400 for containing and exhausting particles produced by a service bundle, the service bundle housing exhaust system 2400 can include a service bundle housing 2410 for housing a service bundle. In accordance with the present teachings, the service bundle can be operatively connected to a printing system to provide the various optical, electrical, mechanical, and fluidic connections required to operate the various devices and equipment in the gas enclosure system, such as, but not limited to, the various devices and equipment associated with the printing system. The printing system 2003 of fig. 36 can have a substrate support apparatus 2250 for supporting a substrate 2050, which substrate support apparatus 2250 can be precisely positioned in the Y-axis direction using a Y-axis positioning system 2355. Both the substrate support apparatus 2250 and the Y-axis positioning system 2355 are supported by the printing system base 2101.

For the printing system 2003 of fig. 36, the precision XYZ motion system can have various components for positioning a substrate mounted on the substrate support device 2250 relative to the printhead assembly 2500, which can include a Y-axis motion assembly 2355 and an X-axis carriage assembly 2300. The substrate support apparatus 2250 may be mounted on the Y-axis motion assembly 2355 and may be movable on a rail system 2360 using a linear bearing system such as, but not limited to, utilizing mechanical bearings or air bearings. For various embodiments of the gas enclosure system, the air bearing motion system helps to facilitate frictionless transport of a substrate placed on the substrate support apparatus 2250 in the Y-axis direction. Y-axis motion system 2355 can also optionally use dual rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system. Other accurate XYZ motion systems can also be used in accordance with the present teachings, such as, but not limited to, various embodiments of a 3-axis gantry system. For example, various embodiments of a 3-axis gantry system can have a X, Z carriage assembly mounted on the gantry beam for precision X, Z axis movement, wherein the gantry can be moved precisely in the Y-axis direction.

In accordance with various systems and methods of the present teachings, the printing system 2003 of fig. 36 can have the particle counter 800 mounted to one side of the substrate support apparatus 2250 such that the isovelocity sampling probe 816 is at about the same height as the substrate 2050. Although fig. 36 depicts the particle counter 800 on the front side of the substrate support apparatus, one or more particle counters may be mounted at various locations of the substrate support apparatus to effectively monitor airborne particulate matter proximate to the substrate. Further, for various embodiments of the systems and methods, additional particle counters can be installed or placed in other locations, as described with respect to fig. 35.

According to various embodiments of the gas circulation and filtration system included in various embodiments of the gas enclosure system of the present teachings, continuous measurement of airborne particles can be performed in the gas enclosure system. In various embodiments of the gas enclosure system of the present teachings, such measurements can be performed in a fully automated mode and continuously reported to an end user, for example, through a Graphical User Interface (GUI). In various embodiments of the gas enclosure system of the present teachings, measurements of airborne particulate matter can be made at a target location of interest, as depicted in fig. 35. The output from each particle counter located in the gas enclosure can be reported to the end user, for example, through a GUI. For example, one target area of interest can be airborne particulate matter of a substrate immediately above a substrate support apparatus, such as a chuck or flotation stage, as depicted in fig. 36.

In this regard, continuous monitoring of various embodiments of the gas enclosure system of the present teachings has confirmed that particles having a size of about ≧ 2 μm can be maintained for less than about 1 particle of that size range during a print cycle. For various embodiments of the gas enclosure system of the present teachings, particles having a size of about ≧ 2 μm can be maintained for a period of at least about 24 hours less than about 1 particle of that size range. For various embodiments of the gas enclosure system of the present teachings, particles having a size of about ≧ 0.3 μm can be maintained for less than about 3 particles of that size range during a print cycle. For various embodiments of the gas enclosure system of the present teachings, particles having a size of about ≧ 0,3 μm can be maintained for a period of at least about 24 hours less than about 3 particles of that size range. According to the present teachings, measurements of particulate matter taken from different locations in various embodiments of the gas enclosure system of the present teachings over a duration of at least about a 24 hour period are reported as an average of 0.001 ≧ 2 μm particles and 0.02 ≧ 0.5 μm particles.

For example, fig. 37A and 37B depict the results of long-term measurements made in various embodiments of gas enclosure systems of the present teachings. In fig. 37A, two tests performed on different days are depicted. Such testing was performed in gas enclosure systems, such as those shown in fig. 12 and 13, which were maintained in an inert nitrogen environment. The measurements are performed close to a substrate support apparatus, such as a chuck or a flotation stage, as depicted in fig. 36. During the test period, the gas enclosure system is under continuous use for a sequence including printing, maintenance and idle. In test 1, the duration of the real-time measurement was about 16 hours. During this period, a total of 2 particles having a size of about ≧ 2 μm were measured, 1 at about 5 hours and 1 near the end of the test period. For test 2, which has a duration of about 10 hours, no particles in this size range were measured. In FIG. 37B, the measurements of test 3 for particles of size approximately ≧ 0.5 μm are depicted, which were performed on the system over a period of more than 8 hours on another day. During this test period, a gas enclosure assembly window, such as window 130 of fig. 1A, was opened periodically at about 2 hours (reference I), about 6.5 hours (reference II), and about 7 hours (reference III). During these periods of brief exposure of the gas enclosure system to the ambient environment, a surge in the measurement of particulate matter can be observed, and subsequently, the measurement quickly reverts to approximately ≦ 1 baseline value for the particles in this size range.

For various implementations of the systems and methods of the present teachingsFor example, airborne particulate matter measured in a gas enclosure system can be less than about 3 particles/ft for particles of about ≧ 0.3 μm³Less than about 1 particle/ft for particles of about ≧ 0.5 μm³And less than about 0 particles/ft for particles of about ≧ 1.0 μm³. In this regard, various embodiments of the gas circulation and filtration system can be designed to provide a low particulate inert gas environment for airborne particles that meets the standards as specified in Class 1 through Class 5 of International organization for standardization (ISO) 14644-1:1999, "Cleanroods and associated controlled environments-Part 1: Classification of airfeliness," and may even meet or exceed the standards set by Class 1.

Such rapid system recovery by various embodiments of the circulation and filtering system of the present teachings as illustrated in the data presented for fig. 37B is additionally depicted in the diagram of fig. 38. In FIG. 38, particles having a size of approximately ≧ 2 μm are monitored proximate a substrate supporting apparatus such as a chuck or a flotation stage. As can be seen in the graph of FIG. 38, the return to a baseline level of approximately ≦ 1 particle in this size range occurs in less than 3 minutes.

The determination of the on-substrate distribution of particulate matter on the substrate can be performed for various embodiments of the gas enclosure system using, for example, a test substrate prior to printing the substrate for system verification. In various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed in situ as a continuous quality check while printing the substrate. For various embodiments of the gas enclosure system, the determination of the distribution of particulate matter on the substrate can be performed prior to printing the substrate and additionally in situ while printing the substrate for system verification.

Fig. 39 depicts a light scattering based on-substrate detection scheme that can have substantially the same components as previously described for the particle counter detector 830 of fig. 34 with respect to the detection system for airborne particulate matter.

In fig. 39, an on-substrate particle counter detection system 860 based on light scattering can have a source of electromagnetic radiation of a known wavelength range of a known wavelength, such as light source 850. For various embodiments of the on-substrate particle counter detection system 860, the light source 850 can be a laser source that emits light of a known wavelength between about 600nm and about 850 nm. The emitted source light 851 is depicted by a ray trace, which interacts with the particles 852 on the substrate 854. For various embodiments of the systems and methods of the present teachings, the substrate can be a test substrate, such as a silicon wafer. Particle determination on silicon wafers is a widely accepted test method in view of the history of particle determination on substrates evolving from the semiconductor industry. Furthermore, the silicon wafer can also have properties such as having a reflective surface, which is preferred for on-substrate detection systems based on light scattering. Furthermore, the silicon wafer is a substantially conductive material so that it can be grounded. Having a substrate surface that is electrically neutral is important to obtain an unbiased sampling of particle deposition on the substrate. Since it is not uncommon for particulate matter to carry a charge, the charged surface may thus exhibit false positive or false negative results, depending on whether the interaction between the charged particle and the charged surface is attractive or repulsive.

For a substrate having a reflective surface, such as a silicon wafer test substrate, the emitted source light 851 can be reflected, as shown by reflected light rays 853, and it can also interact with particles 852 on the substrate surface 854 to produce scattered light, as depicted by scattered light 855. As previously discussed herein for the case of light scattering-based airborne particle detection, such as particle counter detector 830 of fig. 34, the light can scatter in several angular directions, including a direction orthogonal to the emitted source light 851, as depicted for scattered light 855 falling within the optical path I. The focusing lens 856 is capable of focusing light scattered by the particles 852 in a direction orthogonal to the emitted source light 851 as depicted by optical path II towards at least one optical filter, e.g. filter 857. The optical filter 857 can be, for example, a spatial or optical bandpass filter, or additional filters can be added to provide a combination thereof. Finally, light scattered in a direction orthogonal to the emitted source light 851 can be detected by a detector 858, which detector 858 can be a various type of photometric detector, e.g. based on photodiode technology. According to various embodiments of the systems and methods of the present teachings, using an on-substrate particle counter detection system, such as on-substrate particle counter detection system 860 of fig. 39, an end user can be provided with a report including the number of particles of a particle size and the location of each particle detected on the surface.

For a test protocol determined for particles on a substrate, for example, but not limited to, for system verification, a report can be obtained of silicon test wafers that have been analyzed and subsequently encapsulated, as well as the size and location of the particles determined for each test wafer. Test wafers can be obtained either individually sealed or in cassettes. In accordance with various systems and methods of the present teachings, it has been demonstrated that a pod of wafers (wireless wafers) can be sealed within a pod housing, and that subsequently, the pod housing can be sealed with a removable sealing material, such as a sealed polymeric bag. For various test protocols for particle determination on substrates for gas enclosure system verification, it is demonstrated that cassettes of wafers can be placed into the gas enclosure system by an end user or robot. For example, the cartridge can be placed in the auxiliary enclosure by an end user or robot, as previously described herein, and the auxiliary enclosure can be placed through a recovery process until the gas environment is brought into specification with respect to the reactive gas. The cartridge can be transferred into the printing system enclosure by an end user or a robot. Once the sealed cassette is within the gas enclosure system, the cassette evidencing the wafers can be unsealed and the cassette housing can be opened for easy access to the wafers.

Referring to fig. 40, a printing system 2003 depicted with a test wafer 854 can have all of the elements previously described for the printing system 2002 of fig. 26 and the printing systems 2003 of fig. 28A and 36. For example, but not limiting of, in fig. 40, as previously described with respect to fig. 26, 28A, and 36, the printing system 2003 can have an X-axis carriage assembly 2300 mounted on a beam 2130, the X-axis carriage assembly 2300 can also include a Z-axis moving plate 2310 for Z-axis positioning of the print head assembly 2500. In this regard, various embodiments of the carriage assembly 2300 can provide precise X, Z positioning of the printhead assembly 2500 relative to a substrate positioned on the substrate support 2250. For various embodiments of the printing system 2003, the X-axis carriage assembly 2300 can utilize a linear air bearing motion system, which is inherently low particle generation. The printing system 2003 of fig. 40 can have a service bundle housing exhaust system 2400 for containing and exhausting particles produced by a service bundle, the service bundle housing exhaust system 2400 can include a service bundle housing 2410 for housing a service bundle. The printing system 2003 of fig. 40 can have a substrate support apparatus 2250 for supporting a substrate, the substrate support apparatus 2250 can be precisely positioned in the Y-axis direction using a Y-axis positioning system 2355. Both the substrate support apparatus 2250 and the Y-axis positioning system 2355 are supported by the printing system base 2101. The substrate support apparatus 2250 may be mounted on the Y-axis motion assembly 2355 and may be movable on a rail system 2360 using a linear bearing system such as, but not limited to, utilizing mechanical bearings or air bearings. For various embodiments of the gas enclosure system, the air bearing motion system helps to facilitate frictionless transport of a substrate placed on the substrate support apparatus 2250 in the Y-axis direction. Y-axis motion system 2355 can also optionally use dual rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system.

The test wafer 854 of figure 40 can be placed on a substrate support apparatus 2250 of the printing system 2003. The substrate support apparatus 2250 can be positioned proximate to the beam 2130 in a variety of locations that can simulate the locations where a substrate can be located during a printing process. The test wafer can have an edge exclusion zone where no particle determination is performed after testing because the edge exclusion zone is the area where handling is performed, which can introduce contamination at the wafer edge. The edge exclusion zone can be between about 1cm and about 2cm in width measured around the perimeter of the wafer and from the wafer edge according to various test protocols for on-substrate particle determination for gas enclosure system verification. For various test protocols for on-substrate particle determination for gas enclosure system verification, a series of on-substrate particle determinations can be made to assess the state of a gas enclosure system housing a printing system. First, a background test can be performed in which a statistical number of test wafers can be taken out by handling the test substrates only at the edge exclusion zone and then put back into the cassette. In the next static test, a statistical number of test wafers can be retrieved by manipulating the test substrate only at the edge exclusion zone and then exposed to the tool environment for a set duration, e.g., for the duration of the printing process, without actuating any equipment or devices within the gas enclosure system. In this regard, the test wafer is in a static printing environment during static testing of the test wafer. A group of test wafers for static testing can then be moved back into the cassette housing. In print testing, a statistical number of test wafers can be retrieved by manipulating the test substrate only at the edge exclusion zone and then exposed to the tool environment for the duration of the printing process without actuating ink jets, but with full actuation of the equipment or devices within the gas enclosure system. For example, the print head assembly 2500 mounted on the carriage assembly 2300 is capable of moving relative to a test wafer 854, the test wafer 854 being mounted on a substrate support apparatus of the printing system 2003 depicted in fig. 40, thereby simulating a real print cycle. In this regard, the test wafers in the printed set of test wafers are in a static printing environment. A group of test wafers for print testing can then be moved back into the cassette housing.

Once the test protocol, including background, static, and print tests, is completed, the cartridge housing can be resealed and the cartridge can be removed from the printing system enclosure for testing. For example, a sealed cassette with a series of test wafers can be placed in the auxiliary enclosure. When the printing system enclosure is sealably isolated from the auxiliary enclosure as previously described herein, the auxiliary enclosure can be open to the ambient environment and the sealed cassette with the test wafers can be retrieved and sent for analysis. All of the process steps of the various embodiments for the particle-on-substrate determination test protocol of the present teachings can be performed by the end user or a robot or a combination thereof. Finally, the auxiliary enclosure is closed and can be placed through a recovery process until the gaseous environment is brought to specification with respect to the reactive gas.

Various imaging systems and methods of the present teachings can be used for in-situ substrate particulate matter determination, as well as for performing system verification procedures. Referring to fig. 41, printing system 2004 can have all of the elements previously described for printing system 2002 of fig. 26 and printing system 2003 of fig. 28A, 36, and 40. For example, but not limiting of, printing system 2004 of fig. 41 can have a service bundle housing discharge system 2400 for containing and discharging particles produced by a service bundle. The service bundle housing drainage system 2400 of the printing system 2004 can include a service bundle housing 2410 that can house a service bundle. In accordance with the present teachings, the service bundle can be operatively connected to a printing system to provide the various optical, electrical, mechanical, and fluidic connections required to operate the various devices and equipment in the gas enclosure system, such as, but not limited to, the various devices and equipment associated with the printing system. The printing system 2004 of fig. 41 can have a substrate support apparatus 2250 for supporting a substrate 2050, which substrate support apparatus 2250 can be precisely positioned in the Y-axis direction using a Y-axis positioning system 2355. Both the substrate support apparatus 2250 and the Y-axis positioning system 2355 are supported by the printing system base 2101. The substrate support apparatus 2250 may be mounted on the Y-axis motion assembly 2355 and may be movable on a rail system 2360 using a linear bearing system such as, but not limited to, utilizing mechanical bearings or air bearings. For various embodiments of the gas enclosure system, the air bearing motion system helps to facilitate frictionless transport of a substrate placed on the substrate support apparatus 2250 in the Y-axis direction. Y-axis motion system 2355 can also optionally use dual rail motion, again provided by a linear air bearing motion system or a linear mechanical bearing motion system.

With respect to the motion system supporting the various carriage assemblies, the printing system 2004 of fig. 41 can have: a first X-axis carriage assembly 2300A depicted with a printhead assembly 2500 mounted thereon; and a second X-axis carriage assembly 2300B depicted as having a camera assembly 2550 mounted thereon. For example, a substrate 2050 resting on the substrate support apparatus 2250 can be positioned at various locations near the beams 2130 during a printing process. The substrate support apparatus 2250 can be mounted on the printing system base 2101. In fig. 41, the printing system 2004 can have a first X-axis carriage assembly 2300A and a second X-axis carriage assembly 2300B mounted on a beam 2130. The first X-axis carriage assembly 2300A can also include a first Z-axis moving plate 2310A for Z-axis positioning of the print head assembly 2500, while the second X-axis carriage assembly 2300B can have a second Z-axis moving plate 2310B for Z-axis positioning of the camera assembly 2550. In this regard, various embodiments of the

carriage assemblies

2300A and 2300B can provide precise X, Z positioning of the printhead assembly 2500 and the camera assembly 2550, respectively, relative to a substrate positioned on the substrate support 2250. For various embodiments of the printing system 2004, the first X-axis carriage assembly 2300A and the second X-axis carriage assembly 2300B can utilize an inherently low particle generation linear air bearing motion system.

The camera assembly 2550 of fig. 41 can be a high speed, high resolution camera. The camera assembly 2550 can include a camera 2552, a camera head assembly 2554, and a lens assembly 2556. The camera assembly 2550 can be mounted to the motion system 2300B on the Z-axis moving plate 2310B via a camera carriage assembly 2556. The camera 2552 can be any image sensor device that converts optical images into electrical signals, such as, by way of non-limiting example, a Charge Coupled Device (CCD), a Complementary Metal Oxide Semiconductor (CMOS) device, or an N-type metal oxide semiconductor (NMOS) device. Various image sensor devices can be configured as a sensor array for an area scan camera or as a single column of sensors for a line scan camera. The camera assembly 2550 can be connected to an image processing system, which can include, for example, a computer for storing, processing, and providing results. As previously discussed herein with respect to the printing system 2004 of fig. 41, the Z-axis moving plate 2310B can controllably adjust the Z-axis position of the camera assembly 2550 relative to the base plate 2050. The substrate 2050 can be controllably positioned relative to the camera assembly 2550 during various processes such as printing and data collection using the X-axis motion system 2300B and the Y-axis motion system 2355.

Thus, the split-axis motion system of fig. 41 can provide precise positioning of the camera assembly 2550 and the substrate 2050 relative to each other in three dimensions in order to acquire image data about any portion of the substrate 2050 at any desired focus and/or height. Furthermore, precise XYZ movements of the camera relative to the substrate can be performed for an area scan or line scan process. As previously discussed herein, other motion systems, such as gantry motion systems, can also be used to provide precise movement in three dimensions relative to the substrate between, for example, a print head assembly and/or a camera assembly. Further, the illumination device can be mounted in various locations, i.e., on the X-axis motion system or on the substrate support apparatus near the substrate and combinations thereof. In this regard, the illumination device can be positioned in accordance with performing various light field and dark field analyses and combinations thereof. Various embodiments of the motion system can position the camera assembly 2550 relative to the substrate 2050 using continuous or stepped motion, or a combination thereof, to capture a series of one or more images of the surface of the substrate 2050. Each image can contain areas associated with one or more pixel wells (pixelwells), associated electronic circuit components, vias, and connections of the OLED substrate. By using image processing, it is possible to obtain an image of the particles and determine the size and number of particles of a particular size. In various embodiments of the systems and methods of the present teachings, a line scan camera having approximately 8192 pixels, having a working height of approximately 190mm, and capable of scanning at approximately 34kHz can be used. Further, for various embodiments of the printing system substrate camera assembly, more than one camera can be mounted on the X-axis carriage assembly, wherein each camera can have different specifications with respect to field of view and resolution. For example, one camera can be a line scan camera for in situ particle inspection, while a second camera can be used for periodic navigation of the substrate in the gas enclosure system. Such cameras useful for periodic navigation can be area scan cameras having a field of view in a range of about 5.4mm X4 mm, about 0.9X magnification to about 10.6mm X8 mm, about 0.45X magnification. In yet further embodiments, one camera can be a line scan camera for in situ particle inspection, while a second camera can be used for precise navigation of the substrate in the gas enclosure system, such as substrate alignment. Such a camera that can be used for precise navigation can be an area scan camera having a field of view of about 0.7mm X0.5 mm, about 7.2X magnification.

For in-situ inspection of OLED substrates, various embodiments of a printing system substrate camera assembly, such as the camera assembly 2550 of the printing system 2004 depicted in fig. 41, can be used to inspect the panel without significantly affecting the Total Average Cycle Time (TACT). For example, Gen 8.5 substrates can be scanned for particulate matter on the substrate in less than 70 seconds. In addition to in-situ inspection of the OLED substrate, the printing system substrate camera assembly can be used for system verification studies using the test substrate to determine whether a substantially low-particle environment for the gas enclosure system can be verified prior to using the gas enclosure system in a printing process.

For airborne particulate matter and particle deposition within a system, a significant number of variables can influence the development of a general model that can properly calculate an approximation of the particle settling rate on a surface, such as a substrate, for any particular manufacturing system. Variables such as the size of the particles, the distribution of particles of a particular size, the surface area of the substrate, and the exposure time of the substrate within the system can vary depending on the various manufacturing systems. For example, the source and location of particle generating components in various manufacturing systems can greatly affect the size of particles and the distribution of particles of a particular size. Calculations based on various embodiments of the gas enclosure system of the present teachings indicate that without the various particle control systems of the present teachings, deposition on a substrate per print cycle of more than about 1 million to more than about 1 million particles per square meter of substrate can be between more than about 1 million and more than about 1 million particles for particles in the size range of 0.1 μm and greater. Such calculations indicate that without the various particle control systems of the present teachings, the deposition on the substrate per print cycle per square meter of substrate can be between more than about 1000 to more than about 10,000 particles for particles in the size range of about 2 μm and greater.

Using a test protocol as described for various embodiments of the on-substrate particle determination test protocol of the present teachings, various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 10 μm in size. Various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 5 μm in size. In various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 2 μm in size. In various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 100 particles per square meter of substrate per minute for particles greater than or equal to 1 μm in size. Various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 1000 particles per square meter of substrate per minute for particles greater than or equal to 0.5 μm in size. For various embodiments of the gas enclosure system of the present teachings, a low-particle environment can be maintained that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 1000 particles per square meter of substrate per minute for particles greater than or equal to 0.3 μm in size. Various embodiments of the low-particle gas enclosure system of the present teachings are capable of maintaining a low-particle environment that provides an average on-substrate particle distribution that meets an on-substrate deposition rate specification of less than or equal to about 1000 particles per square meter of substrate per minute for particles greater than or equal to 0.1 μm in size.

All publications, patents and patent applications mentioned in this specification are herein incorporated by reference to the same extent as if each individual publication, patent or patent application was specifically and individually indicated to be incorporated by reference.

While embodiments of the present disclosure have been shown and described herein, it will be obvious to those skilled in the art that such embodiments are provided by way of example only. Numerous variations, changes, and substitutions will now occur to those skilled in the art without departing from the disclosure. It should be understood that various alternatives to the embodiments of the disclosure described herein may be employed in practicing the disclosure. For example, many different fields such as chemistry, biotechnology, high technology, and pharmaceutical technology may benefit from the present teachings. OLED printing is used to illustrate the utility of various embodiments of gas enclosure systems according to the present teachings. Various embodiments of a gas enclosure system that can house an OLED printing system can provide features such as, but not limited to, sealing that provides a hermetically sealed enclosure through build and deconstruction cycles, minimizing enclosure volume, and providing convenient access to the interior from the exterior during processing and during maintenance. These features of various embodiments of the gas enclosure system may have an impact on functionality, such as, but not limited to: structural integrity, which provides the convenience of maintaining low levels of reactive species during processing; and rapid closure volume turnaround, which minimizes down time during maintenance cycles. Thus, various features and specifications that provide utility for OLED panel printing may also provide benefits to a number of technology areas. It is intended that the following claims define the scope of the disclosure and that methods and structures within the scope of these claims and their equivalents be covered thereby.

Claims

1. A gas enclosure system, comprising:

a gas enclosure defining an interior containing a gas;

a printing system positioned in an interior of the gas enclosure, the printing system comprising a printhead assembly; and

a particle counting device disposed within the interior of the gas enclosure and configured to monitor an amount of airborne particulate matter in the gas.

2. The gas enclosure system of claim 1, wherein the particle counting device is positioned proximate to at least one of: a service bundle housing, a printhead assembly carriage, and a substrate support apparatus.

3. A gas enclosure system, comprising:

a gas enclosure defining an interior;

a printing system positioned in an interior of the gas enclosure, the printing system comprising a printhead assembly;

a substrate support device positioned in the interior of the gas enclosure, the substrate support device for supporting a substrate to be printed;

a motion system operably coupled to the printing system and substrate support apparatus to move the printhead assembly and substrate relative to each other;

a service bundle housing positioned in an interior of the gas enclosure;

a service bundle routed through the service bundle housing, the service bundle held by a carrier and movable in response to positioning of the print head; and

a service bundle housing exhaust system in fluid communication with the service bundle housing.

4. The gas enclosure system of claim 3, wherein the service bundle housing comprises a plurality of openings on at least one surface arranged to facilitate uniform distribution of gas flow between an interior of the service bundle housing and an exterior of the service bundle housing.

5. The gas enclosure system of claim 3, wherein the carrier is selected from the group consisting of a flexible chain, a sheath, and a cable tie.

6. A method for controlling an environment during processing of a substrate, the method comprising:

circulating a gas along a circulation path during processing of a substrate to form a thin film on the substrate;

discharging the circulated gas through a housing containing a service bundle, the service bundle being connected to a printing system;

flowing the vented gases out of the housing; and

collecting particulate matter from the vented gases.

7. The method of claim 6, wherein flowing the exhausted gas out of the housing to a location to collect particulate matter from the exhausted gas comprises: flowing the gas to a dead space.

8. The method of claim 6, wherein flowing the exhausted gas out of the housing to a location to collect particulate matter from the exhausted gas comprises: flowing the gas through a filter.

9. The method of claim 6, wherein circulating gas along a circulation path comprises: circulating the gas through a gas purification system external to the gas enclosure.

10. The method of claim 6, wherein circulating the gas comprises: flowing gas from adjacent the substrate support apparatus positioned in the gas enclosure into a housing containing the service bundle.

11. The method of claim 6, wherein forming a thin film on the substrate comprises: depositing ink on the substrate with the printing system.

12. The method of claim 11, wherein the ink is an OLED material ink.

13. The method of claim 11, wherein the ink is a curable encapsulant material.

14. The method of claim 11, wherein forming the thin film on the substrate further comprises: curing the ink deposited on the substrate.

15. A gas enclosure system, comprising:

a gas enclosure defining an interior, the gas enclosure configured to maintain a controlled gas environment in the interior;

a printing system disposed in an interior of the gas enclosure;

a substrate support apparatus disposed within an interior of the gas enclosure; and

a gas circulation system operably coupled to the gas enclosure, the gas circulation system comprising:

a gas moving device configured to flow gas along a path from above the printing system down towards the substrate support apparatus; and

a conduit system in fluid communication with the gas moving device, the conduit system positioned to direct the gas along a perimeter of the gas enclosure away from a vicinity of the substrate support apparatus and back to the gas moving device.

16. The gas enclosure system of claim 15, further comprising: a particulate filter device downstream of the gas moving device.

17. The gas enclosure system of claim 15, further comprising: a gas purification system disposed outside the gas enclosure, the gas purification system in fluid communication to provide purified gas to the interior of the gas enclosure.

18. The gas enclosure system of claim 15, further comprising: a thermal conditioning system in thermal communication with the gas circulation system.

19. The gas enclosure system of claim 18, wherein the thermal conditioning system comprises: at least one of a heat exchanger and a fluid cooler.

20. The gas enclosure system of claim 15, wherein the gas circulation system is configured to provide laminar flow of gas in the enclosure.

21. The gas enclosure system of claim 15, wherein the gas moving device is selected from a fan and a blower.

22. A method for controlling an environment during processing of a substrate, the method comprising:

circulating gas along a circulation path through a gas enclosure housing a printing system, the circulating gas occurring during a process of forming a thin film on a substrate in the gas enclosure, the circulating gas comprising:

flowing gas from a gas moving device above the printing system downward toward a substrate support apparatus; and

flowing a gas through a piping system in fluid communication with a gas moving device, the piping system directing the gas along a perimeter of the gas enclosure away from a vicinity of the substrate support apparatus and back to the gas moving device.

23. The method of claim 22, wherein circulating the gas comprises: circulating the gas through a gas purification system external to the gas enclosure.

24. The method of claim 22, further comprising: controlling the temperature of the gas circulating through the gas enclosure.

25. The method of claim 22, wherein forming a thin film on the substrate comprises: depositing ink on the substrate with the printing system.

26. The method of claim 25, wherein the ink is an OLED material ink.

27. The method of claim 25, wherein the ink is a curable encapsulant material.

28. The method of claim 25, wherein forming the thin film on the substrate further comprises: curing the ink deposited on the substrate.

29. A gas enclosure system, comprising:

a substrate support apparatus disposed in an interior of the gas enclosure;

a printing system disposed in an interior of the gas enclosure, the printing system comprising:

a beam extending across the substrate support apparatus;

a carriage assembly movably mounted to the beam, the carriage assembly being movable along the beam in an X-axis direction;

a plurality of air bearings providing a bearing surface between the carriage assembly and the beam; and

a print head coupled to the carriage assembly.

30. The gas enclosure system of claim 29, further comprising: a Z-axis moving plate coupled to the carriage assembly, the print head being mounted to the Z-axis moving plate.

31. The gas enclosure system of claim 29, further comprising: a brushless linear motor operably coupled to the carriage assembly to move the carriage assembly along the beam.

32. The gas enclosure system of claim 29, further comprising: a Y-axis motion system configured to move the substrate support apparatus in a Y-axis direction.

33. A method of depositing ink on a substrate, the method comprising:

forming an air bearing between a printhead carriage assembly and a printing system beam during movement of the printhead carriage assembly along the printing system beam; and

printing on a substrate by depositing ink from a printhead mounted to a printhead carriage assembly onto the substrate as the printhead carriage assembly moves along the beam.

34. The method of claim 33, further comprising: applying motion to the printhead carriage assembly along the beam using a linear brushless motor operatively coupled to the printhead carriage assembly.

35. The method of claim 33, wherein depositing ink on a substrate comprises: depositing an OLED material on the substrate.

36. The method of claim 33, wherein depositing ink on a substrate comprises: depositing a curable encapsulation material on the substrate.

37. The method of claim 33, further comprising: curing the ink deposited on the substrate.

38. A gas enclosure system, comprising:

a printing system disposed in the interior of the gas enclosure, the printing system comprising a printhead assembly;

a gas circulation and filtration system operably coupled to the gas enclosure, the gas circulation system comprising:

a printhead assembly exhaust system, comprising:

a discharge housing enclosing the printhead assembly; and

a filter in fluid communication with the drain housing.

39. The gas enclosure system of claim 38, further comprising: an air moving device positioned to move gas from the exhaust housing to a service bundle housing, and a service bundle operatively connected to the printing system, routed through the service bundle housing.

40. The gas enclosure system of claim 38, further comprising: a gas purification system operably coupled to the gas enclosure.

41. A method for controlling an environment during processing of a substrate, the method comprising:

circulating gas along a circulation path through a gas enclosure housing the printing system, the circulating gas occurring during a process of forming a film on a substrate in the gas enclosure, the circulating gas comprising:

flowing gas through a discharge housing enclosing a printhead assembly of the printing system; and

filtering the gas flowing from the discharge housing downstream of the printhead assembly.

42. The method of claim 41, wherein circulating the gas comprises: circulating the gas through a gas purification system external to the gas enclosure.

43. The method of claim 41, wherein forming a thin film on the substrate comprises: depositing ink on the substrate with the printing system.

44. The method of claim 43, wherein the ink is an OLED material ink.

45. The method of claim 43, wherein the ink is a curable encapsulant material.

46. The method of claim 43, wherein forming the thin film on the substrate further comprises: curing the ink deposited on the substrate.

47. A gas enclosure system, comprising:

a gas enclosure defining an interior containing a gas;

a substrate support apparatus positioned in an interior of the gas enclosure;

an on-substrate particulate matter detection system positioned to detect an amount of particulate matter on a surface of a substrate supported by the substrate support apparatus.

48. The gas enclosure system of claim 47, wherein the on-substrate particulate matter detection system comprises: an imaging system.

49. The gas enclosure system of claim 48, wherein the imaging system comprises: a camera mounted for movement with the print head assembly.

50. A method for providing a controlled environment during processing of a substrate, the method comprising:

during a process of forming a thin film on a substrate in a gas enclosure housing a controlled gas environment and housing a printing system:

circulating and filtering the gas contained within the gas enclosure; and

monitoring an amount of particulate matter within an interior of the gas enclosure.

51. The method of claim 50, wherein monitoring the amount of particulate matter comprises: counting particles near at least one of: a service bundle housing, a printhead assembly carriage, and a substrate support apparatus positioned within an interior of the gas enclosure.

52. The method of claim 50, wherein monitoring the amount of particulate matter comprises: detecting particulate matter on the surface of the substrate.

53. The method of claim 50, further comprising: reporting information regarding the monitoring of the amount of particulate matter.

54. The method of claim 50, further comprising: performing quality control for printing on the substrate based on the monitoring of the amount of particulate matter.

55. The method of claim 50, wherein forming a thin film on the substrate comprises: depositing ink on the substrate with the printing system.

56. The method of claim 55, wherein the ink is an OLED material ink.

57. The method of claim 55, wherein the ink is a curable encapsulant material.

58. The method of claim 55, wherein forming the thin film on the substrate further comprises: curing the ink deposited on the substrate.