CN110815663A - Preparation method of hollow microneedle mould - Google Patents
Preparation method of hollow microneedle mould Download PDFInfo
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- CN110815663A CN110815663A CN201911124391.7A CN201911124391A CN110815663A CN 110815663 A CN110815663 A CN 110815663A CN 201911124391 A CN201911124391 A CN 201911124391A CN 110815663 A CN110815663 A CN 110815663A
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- die
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
- C23C28/023—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material only coatings of metal elements only
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/718—Cosmetic equipment, e.g. hair dressing, shaving equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/753—Medical equipment; Accessories therefor
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Media Introduction/Drainage Providing Device (AREA)
Abstract
The invention discloses a preparation method of a hollow microneedle mould, which comprises the following steps of connecting the lower end of a male mould with the inner wall of a substrate container; injecting a molten or solution-state female mold substrate into a substrate container, wherein the liquid level of the female mold substrate is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold substrate; forming a female die after the matrix of the female die is cured, separating the female die from the male die, and forming die holes with openings at two ends on the female die; coating a conductive layer on the inner wall of the die hole; covering a metal layer on the outer side of the conductive layer; and removing the female die to obtain the hollow microneedle die consisting of the conductive layer and the metal layer. The requirement on the dimensional accuracy of the used male die is low, the dependence on a micro-machining technology is eliminated, and the inner diameter of the microneedle die is mainly controlled and adjusted through the coating thickness of the metal layer, so that microneedles with different sizes can be obtained conveniently; the size of the microneedle mould is changed by reprocessing the mould, so that the diversification of the mould size can be met within a certain size range.
Description
Technical Field
The invention relates to the technical field of microneedle moulds, in particular to a preparation method of a hollow microneedle mould.
Background
In recent years, microneedles have attracted much attention as a physical permeation-promoting means for transdermal drug delivery and cosmetic skin care, or as microneedle therapy electrodes for disease treatment. The micro-needle has small size and does not touch the nerves of the dermis layer, so that the micro-needle does not cause pain; in addition, the transdermal patch has unique advantages in the aspect of transdermal absorption of the medicine, can replace a transdermal patch, realizes continuous painless administration, avoids or reduces the physiological discomfort of patients and improves the utilization effect of the medicine. The demand for microneedles is also increasing dramatically with the increasing demand for quality of life.
At present, the processing of the micro-needle is mainly divided into two types, one is a mould method, and the other is micro-processing direct forming; the micro-processing direct forming method is mainly formed by processing the surface of a substrate such as metal, polymer, glass, silicon chip and the like by adopting laser, X-ray and the like, and is limited by a micro-processing technology, so that the difficulty is high, the precision control requirement is high, and the cost is high; compared with direct micro-machining molding, the mold method can manufacture the micro-needles in batches and has relatively low cost. The existing mold method mainly comprises the steps of casting or plating a female mold on the outer side of a male mold, determining the size of an inner cavity of a microneedle mold according to the size of the male mold, wherein the determination of the size of the male mold mainly depends on a micro-machining technology, the requirements on the surface smoothness and the size precision of the male mold in machining are very high, the manufacturing difficulty is high, and the production cost is high.
Disclosure of Invention
Aiming at the defects in the prior art, the invention provides a preparation method of a hollow microneedle mould, which solves the problem that the size processing of the existing mould depends on the micro-processing technology, and reduces the requirement on the manufacturing precision of a male mould and the production cost.
In order to realize the purpose, the invention provides the following technical scheme:
a preparation method of a hollow microneedle mould comprises the following steps,
step one, connecting the lower end of a male die with the inner wall of a substrate container;
injecting a molten or solution-state female mold substrate into a substrate container, wherein the liquid level of the female mold substrate is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold substrate;
step three, forming a female die after the female die substrate is cured, separating the female die from the male die, and forming die holes with openings at two ends on the female die;
coating a conductive layer on the inner wall of the die hole;
covering a metal layer on the outer side of the conductive layer;
and sixthly, removing the female die to obtain the hollow microneedle die consisting of the conductive layer and the metal layer.
Preferably, the male mould is of prismatic or cylindrical configuration.
Preferably, the male mould is of a solid or hollow construction.
Preferably, the male die is made of metal.
Preferably, the female mold substrate is one of polydimethylsiloxane, polymethyl methacrylate, polyimide, polystyrene, polyvinyl alcohol and photoresist.
Preferably, the conductive layer is applied by sputtering or spin coating.
Preferably, the conductive layer is one or more of nickel, copper, chromium, tungsten, platinum, gold and silver.
Preferably, the metal layer is covered by electroplating, electroforming or chemical plating.
Preferably, the removal mode of the female die is calcination or solvent dissolution.
Preferably, the substrate container is of an open-topped structure.
Compared with the prior art, the invention has the beneficial effects that:
the invention relates to a preparation method of a hollow metal microneedle mould, which is characterized in that a female mould is obtained by utilizing a male mould to perform reverse mould, and then a hollow microneedle mould is prepared on the inner wall of the female mould by plating; the micro-needle mold is characterized in that the requirement on the dimensional accuracy of a used male mold is low, the dependence on a micro-machining technology is removed, and the inner diameter of the micro-needle mold is mainly controlled and adjusted through the coating thickness of a metal layer, so that micro-needles with different sizes can be obtained conveniently; the size of the microneedle mould is changed by reprocessing the mould (thinning or thickening the metal layer), so that the diversification of the mould size can be met within a certain size range.
Drawings
FIG. 1 is a schematic view of the male mold mated with the substrate container; (ii) a
FIG. 2 is a schematic illustration of the mating of the female mold with the substrate container;
FIG. 3 is a schematic diagram of the structure of the negative mold after coating with the conductive layer;
FIG. 4 is a schematic view of the structure after the female mold is covered with a metal layer;
fig. 5 is a schematic structural view of a microneedle mold.
In the figure: 1-a substrate container; 2-a male die; 3-female die; 301-a die hole; 4-a conductive layer; 5-metal layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the first embodiment, the first step is,
a preparation method of a hollow microneedle mould comprises the following steps,
connecting the lower end of a male die with the inner wall of a substrate container, wherein the male die is vertically arranged in the substrate container which is of an upper end opening structure; wherein the male die is cylindrical, the outer diameter of the male die is 500 μm, and the height of the male die is 2000 μm, as shown in figure 1;
injecting polydimethylsiloxane in a molten state into a matrix container, wherein the liquid level of the female mold matrix is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold matrix;
standing, vacuum degassing, curing, and removing the positive mold to obtain a polydimethylsiloxane female mold, wherein mold holes with openings at two ends are formed in the female mold, as shown in fig. 2;
step four, sputtering a layer of chromium on the inner wall of the die hole, wherein the thickness of the chromium is 5 mu m, and the chromium is shown in figure 3;
step five, connecting the female die with the electrode for electroplating for 12 hours to obtain a metal layer with the thickness of 200 mu m, as shown in figure 4;
and step six, calcining the female die at 500 ℃ for 2h, removing the polydimethylsiloxane female die, and obtaining a hollow metal microneedle die with the inner diameter of 100 microns, as shown in fig. 5.
In the second embodiment, the first embodiment of the method,
a preparation method of a hollow microneedle mould comprises the following steps,
connecting the lower end of a male die with the inner wall of a substrate container, wherein the male die is vertically arranged in the substrate container which is of an upper end opening structure; wherein the male die is cylindrical, the outer diameter of the male die is 300 mu m, and the height of the male die is 3000 mu m;
injecting the polymethyl methacrylate in a molten state into a matrix container, wherein the liquid level of the female mold matrix is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold matrix;
standing, vacuum degassing, curing, and removing the positive mold to obtain a polymethyl methacrylate female mold, wherein mold holes with openings at two ends are formed in the female mold;
sputtering a layer of copper on the inner wall of the die hole, wherein the thickness of the copper is 5 mu m;
step five, chemically plating the female die coated with the conductive layer copper for 4 hours to obtain a metal layer with the thickness of 50 microns;
and sixthly, ultrasonically cleaning the female die in ethyl acetate for 3 hours, and removing the polymethyl methacrylate to obtain the hollow metal microneedle die with the inner diameter of 190 microns.
In the third embodiment, the first step is that,
a preparation method of a hollow microneedle mould comprises the following steps,
connecting the lower end of a male die with the inner wall of a substrate container, wherein the male die is vertically arranged in the substrate container which is of an upper end opening structure; wherein the male die is cylindrical, the outer diameter of the male die is 710 mu m, and the height of a needle head of the groove section is 3000 mu m;
injecting polyvinyl alcohol in a molten state into a matrix container, wherein the liquid level of the female mold matrix is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold matrix;
standing, vacuum degassing, curing, and removing the positive mold to obtain a polyvinyl alcohol female mold, wherein mold holes with openings at two ends are formed in the female mold;
sputtering a layer of nickel on the inner wall of the die hole, wherein the thickness of the nickel is 10 mu m;
electroplating the female die coated with the conductive layer nickel for 20 hours to obtain a metal layer with the thickness of 250 micrometers;
and sixthly, calcining the female die for 0.5h at 500 ℃ to obtain the hollow metal microneedle die with the inner diameter of 200 mu m.
It should be further noted that, in addition,
the male die can also be in a prism structure, the male die is in a solid or hollow structure, the cost is further saved by adopting a hollow structure, and the male die is made of metal materials such as stainless steel or iron.
The negative mold substrate may be one of polydimethylsiloxane, polymethyl methacrylate, polyimide, polystyrene, polyvinyl alcohol, and photoresist.
The conductive layer is applied by sputtering or spin coating.
The conductive layer is one or more of nickel, copper, chromium, tungsten, platinum, gold and silver.
The metal layer is covered by electroplating, electroforming or chemical plating.
A preparation method of a hollow metal microneedle mould comprises the steps of obtaining a female mould by utilizing a male mould to perform mould inversion, and then coating the inner wall of the female mould to prepare the hollow microneedle mould, wherein the method is simple to operate and low in cost; the requirement on the dimensional accuracy of the used male die is low, the inner diameter of the microneedle mould is mainly controlled and adjusted through the coating thickness of the metal layer, microneedles with different sizes can be conveniently obtained, the batch manufacturing cost is low, the mould is reprocessed (the metal layer is thinned or thickened) under the necessary condition, the size of the microneedle mould is changed, and the diversification of the mould size can be met within a certain size range.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (10)
1. A method for preparing a hollow microneedle mould is characterized by comprising the following steps: comprises the following steps of (a) carrying out,
step one, connecting the lower end of a male die with the inner wall of a substrate container;
injecting a molten or solution-state female mold substrate into a substrate container, wherein the liquid level of the female mold substrate is lower than the upper end of a male mold, and the melting point of the male mold is higher than the melting point temperature of the female mold substrate;
step three, forming a female die after the female die substrate is cured, separating the female die from the male die, and forming die holes with openings at two ends on the female die;
coating a conductive layer on the inner wall of the die hole;
covering a metal layer on the outer side of the conductive layer;
and sixthly, removing the female die to obtain the hollow microneedle die consisting of the conductive layer and the metal layer.
2. The method of claim 1, wherein the method comprises: the male die is of a prism or cylindrical structure.
3. The method of claim 2, wherein the step of preparing a hollow microneedle mold comprises: the male die is of a solid or hollow structure.
4. The method of claim 3, wherein the step of preparing a hollow microneedle mold comprises: the male die is made of metal.
5. The method of claim 1, wherein the method comprises: the female mold substrate is one of polydimethylsiloxane, polymethyl methacrylate, polyimide, polystyrene, polyvinyl alcohol and photoresist.
6. The method of claim 1, wherein the method comprises: the conducting layer is coated in a sputtering or spin coating mode.
7. The method of claim 1, wherein the method comprises: the conducting layer is one or more of nickel, copper, chromium, tungsten, platinum, gold and silver.
8. The method of claim 1, wherein the method comprises: the metal layer is covered by electroplating, electroforming or chemical plating.
9. The method of claim 1, wherein the method comprises: the removal mode of the female die is calcination or solvent dissolution.
10. The method of claim 1, wherein the method comprises: the substrate container is of an upper end opening structure.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911124391.7A CN110815663A (en) | 2019-11-15 | 2019-11-15 | Preparation method of hollow microneedle mould |
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| CN201911124391.7A CN110815663A (en) | 2019-11-15 | 2019-11-15 | Preparation method of hollow microneedle mould |
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050011858A1 (en) * | 2003-07-16 | 2005-01-20 | Industrial Technology Research Institute | Method for fabricating a hollow micro-needle array |
| WO2005087305A1 (en) * | 2004-03-12 | 2005-09-22 | Agency For Science, Technology And Research | Methods and moulds for use in fabricating side-ported microneedles |
| US20110011827A1 (en) * | 2009-07-17 | 2011-01-20 | Electronics And Telecommunications Research Institute | Method of manufacturing hollow microneedle structures |
| KR20110086248A (en) * | 2010-01-22 | 2011-07-28 | 오형훈 | Fabrication method of microneedle |
| CN104874098A (en) * | 2015-04-08 | 2015-09-02 | 上海交通大学 | Hollow metal micro-needle and method for manufacturing same on large scale |
| CN109693323A (en) * | 2019-01-11 | 2019-04-30 | 江苏熙美生物科技有限公司 | The forming method of micropin mold, mold and micropin mold |
| US20190201675A1 (en) * | 2015-08-17 | 2019-07-04 | National Technology & Engineering Solutions Of Sandia, Llc | Electromolded microneedles and fabrication methods thereof |
| CN110015637A (en) * | 2019-04-22 | 2019-07-16 | 苏州应汝电子科技有限公司 | A kind of super-strength microneedle array manufacturing method |
-
2019
- 2019-11-15 CN CN201911124391.7A patent/CN110815663A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050011858A1 (en) * | 2003-07-16 | 2005-01-20 | Industrial Technology Research Institute | Method for fabricating a hollow micro-needle array |
| WO2005087305A1 (en) * | 2004-03-12 | 2005-09-22 | Agency For Science, Technology And Research | Methods and moulds for use in fabricating side-ported microneedles |
| US20110011827A1 (en) * | 2009-07-17 | 2011-01-20 | Electronics And Telecommunications Research Institute | Method of manufacturing hollow microneedle structures |
| KR20110086248A (en) * | 2010-01-22 | 2011-07-28 | 오형훈 | Fabrication method of microneedle |
| CN104874098A (en) * | 2015-04-08 | 2015-09-02 | 上海交通大学 | Hollow metal micro-needle and method for manufacturing same on large scale |
| US20190201675A1 (en) * | 2015-08-17 | 2019-07-04 | National Technology & Engineering Solutions Of Sandia, Llc | Electromolded microneedles and fabrication methods thereof |
| CN109693323A (en) * | 2019-01-11 | 2019-04-30 | 江苏熙美生物科技有限公司 | The forming method of micropin mold, mold and micropin mold |
| CN110015637A (en) * | 2019-04-22 | 2019-07-16 | 苏州应汝电子科技有限公司 | A kind of super-strength microneedle array manufacturing method |
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Application publication date: 20200221 |